CN116504440A - Ultrathin foam component capable of conducting electricity in Z-axis direction and preparation method thereof - Google Patents
Ultrathin foam component capable of conducting electricity in Z-axis direction and preparation method thereof Download PDFInfo
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- CN116504440A CN116504440A CN202310452058.9A CN202310452058A CN116504440A CN 116504440 A CN116504440 A CN 116504440A CN 202310452058 A CN202310452058 A CN 202310452058A CN 116504440 A CN116504440 A CN 116504440A
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- axis direction
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- 239000006260 foam Substances 0.000 title claims abstract description 135
- 230000005611 electricity Effects 0.000 title claims description 19
- 238000002360 preparation method Methods 0.000 title description 15
- 239000006261 foam material Substances 0.000 claims abstract description 74
- 229920000642 polymer Polymers 0.000 claims abstract description 47
- 239000011231 conductive filler Substances 0.000 claims abstract description 35
- 239000004005 microsphere Substances 0.000 claims abstract description 27
- 229920006254 polymer film Polymers 0.000 claims abstract description 17
- 239000000839 emulsion Substances 0.000 claims description 40
- 239000006185 dispersion Substances 0.000 claims description 35
- 239000007788 liquid Substances 0.000 claims description 28
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 28
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 28
- 238000003756 stirring Methods 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 238000002156 mixing Methods 0.000 claims description 18
- 239000000178 monomer Substances 0.000 claims description 18
- 230000009477 glass transition Effects 0.000 claims description 17
- 239000000835 fiber Substances 0.000 claims description 16
- -1 polyethylene Polymers 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 13
- 239000008367 deionised water Substances 0.000 claims description 13
- 229910021641 deionized water Inorganic materials 0.000 claims description 13
- 239000003999 initiator Substances 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 239000004698 Polyethylene Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 239000003365 glass fiber Substances 0.000 claims description 10
- 239000000080 wetting agent Substances 0.000 claims description 10
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 8
- 239000011258 core-shell material Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 8
- 229920000573 polyethylene Polymers 0.000 claims description 8
- 239000003995 emulsifying agent Substances 0.000 claims description 7
- 230000001804 emulsifying effect Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 5
- 229920002799 BoPET Polymers 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 239000012874 anionic emulsifier Substances 0.000 claims description 4
- 239000002518 antifoaming agent Substances 0.000 claims description 4
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 239000005025 cast polypropylene Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 239000013530 defoamer Substances 0.000 claims description 4
- 239000012153 distilled water Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 239000012875 nonionic emulsifier Substances 0.000 claims description 4
- 229920006284 nylon film Polymers 0.000 claims description 4
- 229920006289 polycarbonate film Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000010556 emulsion polymerization method Methods 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000002194 synthesizing effect Effects 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 65
- 238000010521 absorption reaction Methods 0.000 description 13
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 238000009472 formulation Methods 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000013016 damping Methods 0.000 description 6
- 229920001621 AMOLED Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F3/00—Spring units consisting of several springs, e.g. for obtaining a desired spring characteristic
- F16F3/08—Spring units consisting of several springs, e.g. for obtaining a desired spring characteristic with springs made of a material having high internal friction, e.g. rubber
- F16F3/087—Units comprising several springs made of plastics or the like material
- F16F3/0873—Units comprising several springs made of plastics or the like material of the same material or the material not being specified
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a Z-axis conductive ultrathin foam component, which comprises a Z-axis conductive foam material layer and a polymer film layer arranged on at least one side of the Z-axis conductive foam material layer, wherein the foam material layer comprises a film-forming polymer, expanded polymer microspheres and conductive fillers dispersed in the film-forming polymer, and the thickness of the foam material layer is 0.07-0.4mm. The ultrathin foam component provided by the invention contains the Z-direction conductive foam material layer, and meanwhile, the polymer microspheres and the conductive filler are added into the ultrathin foam component, so that a tighter conductive network is caused after the ultrathin foam component is dried, and a considerable part of fibrous conductive filler in the foam component forms conductive paths on the upper surface and the lower surface of the foam layer, so that the ultrathin foam component has more excellent Z-direction conductive performance.
Description
Technical Field
The invention relates to compressible ultrathin damping conductive foam, in particular to an ultrathin foam component capable of conducting electricity in the Z-axis direction and a preparation method thereof.
Background
With the development of technology, people cannot leave electronic display devices, such as mobile phones and computers. Because AMOLED has many advantages, the application range of AMOLED technology is wider than that of LCD technology, and the AMOLED technology can be extended to the fields of electronic products, business, transportation, industrial control and medical. Electronic devices are easy to collide and fall during use or transportation, so that a layer of buffer material foam (such as PE foam, EVA foam and PU foam) is required to be adhered below the AMOLED screen frame of the electronic devices to absorb the impact force of the outside on the electronic devices. However, conventional foam materials such as PU foam, PE foam, acryl foam, EVA foam, and the like are difficult to meet AMOLED requirements, such as higher energy absorption, shock absorption, and high impact resistance. Along with the development of the OLED screen, the requirements on the acrylic foam for the SCF component are higher, the shock absorption and buffering requirements are higher, meanwhile, the Z-axis direction conduction of the acrylic foam is required, and the conduction resistance is lower than 0.05 ohm. Currently, in electronic products, conductive foam such as conductive foam pads, conductive foam gaskets, and the like are widely used. Common conductive foam pads contain a conductive foam layer formed by plating metal onto an open cell polyurethane or polyester foam. The foam pad has a minimum thickness of about 0.5mm and can reach 0.3mm after hot pressing, with a minimum of about 0.10 to 0.15mm. The holes in such foam pads are open and therefore not leak tight.
Patent CN113651995 discloses an ultrathin closed cell ultrathin foam material. The thickness of the OLED screen is about 0.07 to 0.4mm, and the OLED screen can be used for an energy absorption and shock absorption liner of an OLED screen in electronic equipment. The closed cell foam pad has good sealing performance.
CN111072847a discloses a polyacrylate foam composition and a preparation method thereof. The embodiment of the method specifically mentions that the synthesized polyacrylate has better ball drop impact resistance after being made into foam compared with the low glass transition temperature under certain (relatively higher) glass transition temperature, but the polyacrylate foam composition contains an organic solvent, which is not beneficial to environmental protection. In addition, the polyacrylate foam composition adopted by the invention has higher glass transition temperature, and is not suitable for damping and vibration absorption application under the condition of lower temperature.
US5855818 discloses a conductive elastic foam composition. The composition is composed of carbon fiber filled thermoplastic foamable polyurethane, and the volume resistance of the material is less than 1X 106 ohm-cm, and is used in the environmental fields requiring antistatic and EMI/RFI shielding, such as antistatic shoes and the like.
CN110218524 discloses a UV light curing conductive foam adhesive film and tape. The invention provides a conductive film precursor composition comprising a (meth) acrylate monomer, a reactive (meth) acrylate polymer, and expanded polymeric core-shell particles dispersed therein, a conductive filler, and a photoinitiator. The glass transition temperature of the precursor composition material ranges from-60 ℃ to-20 ℃. The invention also provides foam-like conductive adhesive films and tapes made from the precursor composition. The thickness of the foam-shaped conductive adhesive film can be 50-1000 micrometers. The foam-like conductive adhesive film has good compressible property and conductive property.
In order to obtain a thin damping foam material with excellent Z-conductivity, the company intensively researches influencing factors and finds an optimized material formula and production process.
Disclosure of Invention
Therefore, the invention provides the ultrathin foam component which can conduct electricity in the Z-axis direction, and as the conductive particles in the Z-axis direction have a considerable part of fibrous conductive fillers to form conductive paths on the upper surface and the lower surface of the foam layer, the ultrathin foam layer has excellent Z-direction conductivity.
The invention also provides a Z-direction high-conductivity ultrathin damping foam material layer prepared by coating and drying the conductive foam material. The schematic cross section of the Z-direction conductive foam material layer after drying is shown in fig. 3, wherein the white dotted line indicates the electron conducting direction.
Further, the present invention provides an ultra-thin conductive foam layered (or film-like) material, which is manufactured by applying a conductive foam material layer to one surface of a polymer film.
In order to solve the technical problems, the invention adopts the following technical scheme:
an ultrathin conductive foam layered material comprises a conductive foam material layer and a polymer film layer on at least one side of the conductive foam material layer. The conductive foam material layer comprises a film-forming polymer, and expanded polymer microspheres and conductive fillers dispersed in the film-forming polymer, and the thickness of the conductive foam material layer is 0.07-0.4mm. The polymer film layer is selected from any one of biaxially oriented polyethylene terephthalate film, biaxially oriented or cast polypropylene film, polyethylene film, nylon film, polycarbonate film, polystyrene film, laminated fiber film, polyethylene terephthalate release film, polyethylene laminated release paper or other release material films.
An ultrathin foam component capable of conducting in the Z-axis direction comprises a foam material layer capable of conducting in the Z-axis direction and a polymer film layer arranged on at least one side of the foam material layer capable of conducting in the Z-axis direction. The foam material layer capable of conducting in the Z-axis direction comprises a film-forming polymer, expanded polymer microspheres and conductive fillers dispersed in the film-forming polymer, and the thickness of the foam material layer capable of conducting in the Z-axis direction is 0.07-0.4 mm;
the polymer film layer is selected from any one of biaxially oriented polyethylene terephthalate film, biaxially oriented or cast polypropylene film, polyethylene film, nylon film, polycarbonate film, polystyrene film, laminated fiber film, polyethylene terephthalate release film, polyethylene laminated release paper or other release material film;
the foam material layer capable of conducting in the Z-axis direction has a loss factor not lower than 0.4 in a temperature range of 10-30 ℃;
the volume resistance of the ultrathin conductive foam component is not higher than 100 ohms;
the surface resistivity of the ultrathin conductive foam component is not lower than 1 multiplied by 10 7 Ohm per square.
The conductive foam material has a loss factor of not less than 0.4 in a temperature range of 5-35 ℃; the density of the conductive foam material at normal temperature is 0.4-0.9 g/cc;
the volume resistance of the ultrathin conductive foam component is not higher than 10 ohms;
the surface resistivity of the ultrathin conductive foam component is not lower than 1 multiplied by 10 9 Ohm-meterPer square.
The film-forming polymer is a core-shell coating structure acrylate copolymer prepared by polymerizing a monomer mixture comprising two or more monomers of methyl (meth) acrylate, isobornyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, acrylonitrile, styrene, butadiene, and the like by an emulsion polymerization method in the presence of a persulfate initiator.
The glass transition temperature Tg of the film-forming polymer is (-10) -30 ℃; and the film-forming polymer is formed by copolymerizing at least two or more different monomers with Tg differences greater than 50 ℃.
The glass transition temperature of the film-forming polymer is 0-20 ℃; the expanded polymer microsphere is a closed cell structure with a hollow diameter of 5-200 micrometers; the total volume of the closed cell structure accounts for 20-50% of the total volume of the conductive foam material.
The expanded polymer microsphere is a closed cell structure with a hollow diameter of 20-80 micrometers; the total volume of the closed cell structure accounts for 25-40% of the total volume of the whole conductive foam material;
the addition amount of the conductive filler is 2-20 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
The conductive filler is a fiber conductive material with the diameter range of 10-20 micrometers and the average length-diameter ratio of 5-30, and the average length-diameter ratio refers to the ratio of the average length of the fiber to the average diameter of the fiber;
the addition amount of the conductive filler is 3-15 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
The conductive filler is selected from carbon fiber, metal-plated glass fiber, ceramic fiber, silver-plated or nickel-plated glass fiber;
the addition amount of the conductive filler is 4-10 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
The volume resistance of the ultrathin conductive foam component is not higher than 1 ohm;
the surface resistivity of the ultrathin conductive foam component is not lower than 1 multiplied by 10 11 Ohm per square.
The preparation method of the ultrathin foam component capable of conducting electricity in the ultrathin Z-axis direction comprises the following steps of:
s1, synthesizing acrylic ester copolymer seed emulsion:
adding unsaturated carbon-carbon double bond-containing monomer, a first emulsifier and deionized water into a reaction kettle, heating to 45-55 ℃ under the protection of nitrogen, continuously stirring and emulsifying for 25-35 minutes, keeping a reaction device under the protection of nitrogen, dissolving an initiator in distilled water, then dropwise adding the distilled water into a reaction solution, heating to 70-80 ℃, and continuously stirring and reacting for 3-4 hours to obtain a prepolymer emulsion A; the weight ratio of the unsaturated carbon-carbon double bond monomer, the first emulsifier, the initiator and the deionized water is 40-60 parts per 0.5-5 parts per 0.05-0.1 parts per 40-60 parts.
Then mixing 10-50 parts by mass of alkyl acrylate shown in formula (1), 0.05-0.1 part by mass of initiator, 0.5-5 parts by mass of emulsifier and 10-50 parts by mass of deionized water with prepolymer emulsion A uniformly, and reacting for 3-4 hours at 70-80 ℃ to obtain seed emulsion B, wherein the seed emulsion B is core emulsion in a core-shell coating structure;
s2, preparing film-forming polymer emulsion
Adding deionized water, a monomer containing unsaturated carbon-carbon double bonds, an anionic emulsifier and a nonionic emulsifier into a reactor, and stirring and pre-emulsifying to obtain a pre-emulsion C; the weight ratio of the unsaturated carbon-carbon double bond-containing monomer, the anionic emulsifier, the nonionic emulsifier and the deionized water is 40-60 parts per 0.3-3 parts per 40-60 parts;
then taking 100 parts by mass of emulsion B prepared in the step S1 as seed emulsion, synchronously dripping 10-50 parts by mass of emulsion C and 0.05-0.1 part by mass of initiator, reacting for 3-6 hours at 70-90 ℃, cooling and discharging to obtain film-forming polymer emulsion with a core-shell structure;
s3, preparing conductive foam material dispersion liquid:
adding the hollow polyacrylonitrile copolymer expanded microspheres, the film-forming polymer emulsion prepared in the step S2, the conductive filler, the color paste, the defoaming agent and the wetting agent into a mixing container, and stirring at a low speed for 10-30 minutes by using a stirring paddle until a uniform dispersion liquid is formed for standby, wherein the dispersion liquid is foam material dispersion liquid containing the conductive filler and the acrylic ester copolymer;
the weight portion ratio of the expansion microsphere, the film-forming polymer emulsion prepared in the step S1, the conductive filler, the color paste, the defoamer and the wetting agent is 0.5-2.5 parts per 95-99 parts per 6-30 parts per 0.3-0.7 parts per 0.05-0.2 parts per 0.5-2 parts.
S4, preparing foam materials:
and (3) uniformly stirring and mixing the dispersion liquid prepared in the step (S3), coating the mixture on a polymer film layer in a scraper coating mode, and then drying the polymer film coated with the wet glue in a 90 ℃ oven for 10 minutes, and taking out the polymer film to obtain the ultrathin foam component with the conductivity in the Z-axis direction.
Compared with the prior art, the invention has the following beneficial effects:
the conductive foam layered material provided by the invention contains a Z-direction conductive foam material layer, and the Z-direction conductivity is a technical effect which can be obtained only by a special formula and process. Particularly, the dispersion liquid of the conductive foam material is added with pre-expanded polymer microspheres with the hollow diameter of 20-80 microns and fiber conductive materials with the diameter of 10-20 microns and the length-diameter ratio of 5-30. In the coating process, fibrous conductive filler and pre-expansion microspheres are uniformly distributed in a wet adhesive layer, moisture (solvent) in the wet adhesive layer gradually volatilizes after the adhesive layer enters an oven, the whole drying process can lead to the thinning of a coating, the volume ratio of the pre-expansion microspheres and the fibrous conductive filler in a foam layer is gradually increased, so that a tighter conductive network is formed, the fibrous conductive filler is extruded by the existence of the pre-expansion microspheres to easily form a Z-direction conductive foam layer structure, and due to the fact that the fibrous conductive filler has proper diameter and length-diameter ratio, a considerable part of fibrous conductive filler forms conductive paths on the upper surface and the lower surface of the foam layer in the whole foam layer after being extruded by the expansion microspheres, so that the ultrathin foam layer has excellent Z-direction conductive performance.
In addition, the foam material provided by the invention is a foam material prepared from a film-forming polymer and internally provided with a cell structure, wherein cells of the cell structure are subjected to a physical or chemical foaming molding method and process to obtain a closed cell structure, and the pore diameter of the closed cell structure is 5-200 microns. The closed cell structure provides compressibility for the foam, and when the foam is extruded by external force, the cell can deform, and due to the closed cell structure, a part of energy can be absorbed in the process of deformation resistance of the cell, so that the foam is more beneficial to providing better damping and shock absorption effects than the foam with an open cell structure. The total volume of the cell structure is 10-60% of the total foam volume, preferably 20-50% of the total foam volume, more preferably 25-40% of the total foam volume. If the occupied volume of the foam holes is too small, the foam is difficult to compress, and the assembly of the OLED screen is not facilitated; if the occupied volume of the foam holes is too large, the damping and shock absorbing effects of the foam holes are obviously reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a Z-axis conductive ultra-thin foam assembly according to the present invention
FIG. 2 is a schematic cross-sectional view of a wet bond layer of foam material after coating and before drying
Fig. 3 is a schematic cross-sectional view of a z-direction conductive foam material layer after drying.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 3, the present invention provides a Z-axis conductive ultrathin foam assembly, which includes a Z-axis conductive foam material layer 1 and a polymer film layer 2 disposed on at least one side of the Z-axis conductive foam material layer 1; the foam material layer 1 capable of conducting in the Z-axis direction comprises a film-forming polymer 11, expanded polymer microspheres 12 and a conductive filler 13 dispersed in the film-forming polymer, and the thickness of the foam material layer capable of conducting in the Z-axis direction is 0.07-0.4 mm;
the polymer film layer 11 is selected from any one of biaxially oriented polyethylene terephthalate film, biaxially oriented or cast polypropylene film, polyethylene film, nylon film, polycarbonate film, polystyrene film, laminated fiber film, polyethylene terephthalate release film, polyethylene laminated release paper or other release material film;
the foam material layer 1 capable of conducting in the Z-axis direction has a loss factor not lower than 0.4 in a temperature range of 10-30 ℃;
the volume resistance of the ultrathin conductive foam component is not higher than 100 ohms;
the surface resistivity of the ultrathin conductive foam component is not lower than 1 multiplied by 10 7 Ohm per square.
The conductive foam material has a loss factor of not less than 0.4 in a temperature range of 5-35 ℃; the density of the conductive foam material at normal temperature is 0.4-0.9 g/cc;
the volume resistance of the ultrathin conductive foam component is not higher than 10 ohms;
the surface resistivity of the ultrathin conductive foam component is not lower than 1 multiplied by 10 9 Ohm per square.
The film-forming polymer 11 is a core-shell coated acrylate copolymer prepared by polymerizing a monomer mixture containing two or more monomers of methyl (meth) acrylate, isobornyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, acrylonitrile, styrene, butadiene, and the like by an emulsion polymerization method in the presence of a persulfate initiator.
The glass transition temperature Tg of the film-forming polymer is (-10) -30 ℃; and the film-forming polymer is formed by copolymerizing at least two or more different monomers with Tg differences greater than 50 ℃.
The glass transition temperature of the film-forming polymer is 0-20 ℃; the expanded polymer microsphere is a closed cell structure with a hollow diameter of 5-200 micrometers; the total volume of the closed cell structure accounts for 20-50% of the total volume of the conductive foam material.
The expanded polymeric microspheres 12 are closed cell structures with hollow diameters of 20-80 microns; the total volume of the closed cell structure accounts for 25-40% of the total volume of the whole conductive foam material;
the addition amount of the conductive filler is 2-20 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
The conductive filler is a fiber conductive material with the diameter range of 10-20 micrometers and the average length-diameter ratio of 5-30, and the average length-diameter ratio refers to the ratio of the average length of the fiber to the average diameter of the fiber;
the addition amount of the conductive filler is 3-15 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
The conductive filler is selected from carbon fiber, metal-plated glass fiber, ceramic fiber, silver-plated or nickel-plated glass fiber;
the addition amount of the conductive filler is 4-10 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
The volume resistance of the ultrathin conductive foam component is not higher than 1 ohm;
the surface resistivity of the ultrathin conductive foam component is not lower than 1 multiplied by 10 11 Ohm per square.
The preparation method of the ultrathin foam component capable of conducting electricity in the ultrathin Z-axis direction comprises the following steps:
s1, acrylic ester copolymer seed emulsionPreparation:
adding 20 g of butadiene, 110 g of styrene, 6 g of sodium dodecyl sulfate and 100 g of deionized water into a reaction kettle, heating to 50 ℃ under the protection of nitrogen, continuously stirring and emulsifying for 30 minutes, keeping a reaction device under the protection of nitrogen, dissolving 0.12 g of ammonium persulfate in 20 g of deionized water, then dropwise adding into a reaction solution, heating to 80 ℃, and continuously stirring and reacting for 3 hours to obtain a prepolymer emulsion A;
then, 70 g of n-butyl acrylate, 2 g of sodium dodecyl sulfate and 60 g of water are weighed and added into a glass flask, and slowly stirred and pre-emulsified for 20 minutes, meanwhile, 0.1 g of initiator ammonium persulfate and 20 g of water are weighed, mixed and poured into a dropping funnel, meanwhile, the n-butyl acrylate pre-emulsion and the ammonium persulfate aqueous solution are simultaneously added into a reaction kettle filled with the prepolymer emulsion A in a dropwise manner, and the mixture is reacted for 3 hours at 80 ℃ to obtain emulsion B;
s2, preparation of film-forming polymer emulsion
Adding 100 g of deionized water, 4 g of sodium dodecyl sulfate and 4 g of nonylphenol polyoxyethylene ether mixed emulsifier into a three-neck flask, adding 50 g of styrene and 50 g of acrylonitrile monomer, and stirring and pre-emulsifying to obtain a styrene/acrylonitrile pre-emulsion C;
then taking 200 g of emulsion B prepared in the step S1 as seed emulsion, synchronously dripping 20 g of emulsion C and 0.05 g of initiator ammonium persulfate, reacting for 4 hours at 80 ℃, cooling and discharging to obtain film-forming polymer emulsion;
the viscosity of the film-forming polymer emulsion was found to be 600mpa.s and the solids content was found to be 50%, and the glass transition temperature of the polymer after drying of the emulsion was found to be 6 ℃ by differential scanning calorimetry.
Example 1:
the ultrathin conductive foam layered material provided by the embodiment comprises an ultrathin foam material layer 1 capable of conducting electricity in the Z-axis direction and a polymer film layer 2 on at least one side of the conductive foam material layer. The thickness of the ultrathin conductive foam material layer is 0.07-0.4mm. The preparation method comprises the following steps:
1-S3, preparing conductive foam material dispersion liquid:
1 g of expanded hollow polyacrylonitrile copolymer microsphere FN80SDE from Japanese sonchifolia Co., ltd, 98 g of silver-plated glass fiber from Bode, 5 g of color paste KA100 from Clariant, 0.5 g of defoamer BYK023 from BYK and 1 g of wetting agent WE-3650 from BASF are weighed into a mixing container, and stirred at low speed for 15 minutes in a stirring paddle until a uniform dispersion is formed for later use;
1-S4, preparation of Z-conductive foam layered material:
and stirring and mixing the prepared dispersion liquid uniformly, coating the dispersion liquid on a PET release film in a scraper coating mode, and then drying the PET release film coated with wet glue in a 90 ℃ oven for 10 minutes, and taking out the PET release film to obtain the foam release film composite sample. By setting different doctor blade gaps, conductive foam laminar material samples with the thickness of 50 micrometers, 100 micrometers, 200 micrometers and 400 micrometers can be respectively obtained. The schematic cross section of the Z-direction conductive foam material layer after drying is shown in fig. 3, wherein the white dotted line indicates the electron conducting direction.
4 thicknesses were prepared using the formulation of example 1 and tested separately:
and (3) removing the dried foam layer from the PET release film, and testing the thickness, density, surface resistivity, volume resistance and foam impact absorption of the foam layer.
The total volume of the cell structure in this example is 35% of the volume of the ultra-thin foam layer, the pore size of the closed cell structure is 20-80 microns, and the glass transition temperature is 6 ℃.
Example 2:
2-S3, preparing conductive foam material dispersion liquid:
1 g of expanded hollow polyacrylonitrile copolymer microsphere FN80SDE from Japanese sonchifolia Co., ltd, 98 g of silver-plated glass fiber from Bode, U.S. Pat. No. 2 g of color paste KA100 from Clariant, 0.5 g of defoamer BYK023 from BYK and 1 g of wetting agent WE-3650 from BASF are weighed into a mixing container, and stirred at low speed for 15 minutes in a stirring paddle until a uniform dispersion is formed for later use;
2-S4, preparation of Z-conductive foam layered material:
and stirring and mixing the prepared dispersion liquid uniformly, coating the dispersion liquid on a PET release film in a scraper coating mode, and then drying the PET release film coated with wet glue in a 90 ℃ oven for 10 minutes, and taking out the PET release film to obtain the foam release film composite sample. By setting different doctor blade gaps, conductive foam laminar material samples with the thickness of 50 micrometers, 100 micrometers, 200 micrometers and 400 micrometers can be respectively obtained.
4 thicknesses were prepared using the formulation of example 2 and tested separately:
and (3) removing the dried foam layer from the PET release film, and testing the thickness, density, surface resistivity, volume resistance and foam impact absorption of the foam layer.
The total volume of the cell structure in this example is 35% of the volume of the ultra-thin foam layer, the pore size of the closed cell structure is 20-80 microns, and the glass transition temperature is 6 ℃.
Example 3:
2-S3, preparing conductive foam material dispersion liquid:
1 g of expanded hollow polyacrylonitrile copolymer microsphere FN80SDE from Japanese sonchifolia Co., ltd, 98 g of nickel-plated glass fiber from the Butt company in the U.S. and 0.5 g of color paste KA100,0.1 from the Clariant company, BYK023 from the BYK company and 1 g of wetting agent WE-3650 from the BASF are weighed, added into a mixing container, and stirred at a low speed for 15 minutes in a stirring paddle until a uniform dispersion is formed for later use;
2-S4, preparation of Z-conductive foam layered material:
and stirring and mixing the prepared dispersion liquid uniformly, coating the dispersion liquid on a PET release film in a scraper coating mode, and then drying the PET release film coated with wet glue in a 90 ℃ oven for 10 minutes, and taking out the PET release film to obtain the foam release film composite sample. By setting different doctor blade gaps, conductive foam laminar material samples with the thickness of 50 micrometers, 100 micrometers, 200 micrometers and 400 micrometers can be respectively obtained.
4 thicknesses were prepared using the formulation of example 3 and tested separately:
and (3) removing the dried foam layer from the PET release film, and testing the thickness, density, surface resistivity, volume resistance and foam impact absorption of the foam layer.
The total volume of the cell structure in this example is 35% of the volume of the ultra-thin foam layer, the pore size of the closed cell structure is 20-80 microns, and the glass transition temperature is 6 ℃.
Example 4:
2-S3, preparing conductive foam material dispersion liquid:
1 g of expanded hollow polyacrylonitrile copolymer microsphere FN80SDE from Japanese sonchifolia Co., ltd, 98 g of nickel-plated glass fiber from the Butt company in the U.S. and 5 g of color paste KA100,0.1 from the Clariant company, BYK023 from the BYK company and 1 g of wetting agent WE-3650 from the BASF are weighed into a mixing container, and the mixture is stirred at a low speed for 15 minutes until a uniform dispersion is formed for later use;
2-S4, preparation of Z-conductive foam layered material:
and stirring and mixing the prepared dispersion liquid uniformly, coating the dispersion liquid on a PET release film in a scraper coating mode, and then drying the PET release film coated with wet glue in a 90 ℃ oven for 10 minutes, and taking out the PET release film to obtain the foam release film composite sample. By setting different doctor blade gaps, conductive foam laminar material samples with the thickness of 50 micrometers, 100 micrometers, 200 micrometers and 400 micrometers can be respectively obtained.
4 thicknesses were prepared using the formulation of example 4 and tested separately:
and (3) removing the dried foam layer from the PET release film, and testing the thickness, density, surface resistivity, volume resistance and foam impact absorption of the foam layer.
The total volume of the cell structure in this example is 35% of the volume of the ultra-thin foam layer, the pore size of the closed cell structure is 20-80 microns, and the glass transition temperature is 6 ℃.
Comparative example 1:
2-S3, preparing conductive foam material dispersion liquid:
1 g of expanded hollow polyacrylonitrile copolymer microsphere FN80SDE from Japanese sonchifolia Co., ltd, 98 g of nickel powder from Bode Co., U.S.A., 0.5 g of color paste KA100,0.1 from Clariant Co., ltd, defoaming agent BYK023 from BYK company and 1 g of wetting agent WE-3650 from BASF are weighed into a mixing container, and stirred at low speed for 15 minutes in a stirring paddle until a uniform dispersion is formed for later use;
2-S4, preparation of Z-conductive foam layered material:
and stirring and mixing the prepared dispersion liquid uniformly, coating the dispersion liquid on a PET release film in a scraper coating mode, and then drying the PET release film coated with wet glue in a 90 ℃ oven for 10 minutes, and taking out the PET release film to obtain the foam release film composite sample. By setting different doctor blade gaps, conductive foam laminar material samples with the thickness of 50 micrometers, 100 micrometers, 200 micrometers and 400 micrometers can be respectively obtained.
4 thicknesses were prepared using the formulation of comparative example 1 and tested separately:
and (3) removing the dried foam layer from the PET release film, and testing the thickness, density, surface resistivity, volume resistance and foam impact absorption of the foam layer.
The total volume of the cell structure in this example is 35% of the volume of the ultra-thin foam layer, the pore size of the closed cell structure is 20-80 microns, and the glass transition temperature is 6 ℃.
Comparative example 2:
2-S3, preparation of conductive foam material dispersion：
1 g of expanded hollow polyacrylonitrile copolymer microsphere FN80SDE from Japanese sonchifolia Co., ltd, 98 g of nickel powder from Bode Co., U.S.A., 0.5 g of color paste KA100,0.1 from Clariant Co., ltd, defoaming agent BYK023 from BYK company and 1 g of wetting agent WE-3650 from BASF are weighed into a mixing container, and stirred at low speed for 15 minutes in a stirring paddle until a uniform dispersion is formed for later use;
2-S4, preparation of Z-conductive foam layered material:
and stirring and mixing the prepared dispersion liquid uniformly, coating the dispersion liquid on a PET release film in a scraper coating mode, and then drying the PET release film coated with wet glue in a 90 ℃ oven for 10 minutes, and taking out the PET release film to obtain the foam release film composite sample. By setting different doctor blade gaps, conductive foam laminar material samples with the thickness of 50 micrometers, 100 micrometers, 200 micrometers and 400 micrometers can be respectively obtained.
4 thicknesses were prepared using the formulation of comparative example 2 and tested separately:
and (3) removing the dried foam layer from the PET release film, and testing the thickness, density, surface resistivity, volume resistance and foam impact absorption of the foam layer.
The total volume of the cell structure in this example is 35% of the volume of the ultra-thin foam layer, the pore size of the closed cell structure is 20-80 microns, and the glass transition temperature is 6 ℃.
Test results of examples and comparative examples:
it is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (10)
1. An ultrathin foam component capable of conducting in the Z-axis direction, which comprises a foam material layer (1) capable of conducting in the Z-axis direction and a polymer film layer (2) arranged on at least one side of the foam material layer (1) capable of conducting in the Z-axis direction, and is characterized in that,
the foam material layer (1) capable of conducting in the Z-axis direction comprises a film-forming polymer (11), expanded polymer microspheres (12) and a conductive filler (13) which are dispersed in the film-forming polymer, and the thickness of the foam material layer capable of conducting in the Z-axis direction is 0.07-0.4 mm;
the polymer film layer (11) is selected from any one of biaxially oriented polyethylene terephthalate film, biaxially oriented or cast polypropylene film, polyethylene film, nylon film, polycarbonate film, polystyrene film, laminated fiber film, polyethylene terephthalate release film, polyethylene laminated release paper or other release material film;
the foam material layer (1) capable of conducting in the Z-axis direction has a loss factor not lower than 0.4 in a temperature range of 10-30 ℃;
the volume resistance of the ultrathin conductive foam component is not higher than 100 ohms;
the surface resistivity of the ultrathin conductive foam component is not less than 1 x 10 7 Ohm per square.
2. The Z-axis conductive ultra-thin foam assembly of claim 1, wherein the conductive foam material has a dissipation factor of no less than 0.4 over a temperature range of 5-35 ℃; the density of the conductive foam material at normal temperature is 0.4-0.9 g/cc;
the volume resistance of the ultrathin conductive foam component is not higher than 10 ohms;
the surface resistivity of the ultrathin conductive foam component is not less than 1 x 10 9 Ohm per square.
3. The ultra-thin foam component electrically conductive in the Z-axis direction according to claim 2, wherein the film-forming polymer (11) is a core-shell-coated acrylate copolymer prepared by polymerizing a monomer mixture containing two or more monomers of methyl (meth) acrylate, isobornyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, acrylonitrile, styrene, butadiene, and the like by an emulsion polymerization method in the presence of a persulfate initiator.
4. The Z-axis conductive ultra-thin foam assembly of claim 3, wherein the film-forming polymer has a glass transition temperature Tg of (-10) -30 ℃; and the film-forming polymer is formed by copolymerizing at least two or more different monomers with Tg differences greater than 50 ℃.
5. The Z-axis conductive ultra-thin foam assembly of claim 4, wherein the film-forming polymer has a glass transition temperature of 0-20 ℃; the expanded polymer microsphere is a closed cell structure with a hollow diameter of 5-200 micrometers; the total volume of the closed cell structure accounts for 20-50% of the total volume of the conductive foam material.
6. The ultrathin foam assembly capable of conducting electricity in the ultrathin Z-axis direction as recited in claim 5, wherein,
the expanded polymer microspheres (12) are closed cell structures with hollow diameters of 20-80 microns; the total volume of the closed cell structure accounts for 25-40% of the total volume of the whole conductive foam material;
the addition amount of the conductive filler is 2-20 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
7. The ultrathin foam component capable of conducting electricity in the Z-axis direction according to claim 1, wherein the conductive filler is a fibrous conductive material with a diameter ranging from 10 to 20 micrometers and an average length-diameter ratio ranging from 5 to 30, and the average length-diameter ratio is the ratio of the average length of the fiber to the average diameter of the fiber;
the addition amount of the conductive filler is 3-15 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
8. The ultrathin foam assembly of claim 7, wherein the conductive filler is selected from carbon fiber, metallized glass fiber, ceramic fiber, silver plated or nickel plated glass fiber;
the addition amount of the conductive filler is 4-10 wt% of the total weight of the foam material layer which can conduct electricity in the Z-axis direction.
9. The ultrathin foam assembly capable of conducting electricity in the ultrathin Z-axis direction as claimed in claim 1, wherein,
the volume resistance of the ultrathin conductive foam component is not higher than 1 ohm;
the surface resistivity of the ultrathin conductive foam component is not less than 1 x 10 11 Ohm per square.
10. A method of making an ultra-thin foam assembly according to any one of claims 1-9, wherein the ultra-thin foam assembly is electrically conductive in the Z-axis direction, comprising the steps of:
s1, synthesizing acrylic ester copolymer seed emulsion:
adding unsaturated carbon-carbon double bond-containing monomer, a first emulsifier and deionized water into a reaction kettle, heating to 45-55 ℃ under the protection of nitrogen, continuously stirring and emulsifying for 25-35 minutes, keeping a reaction device under the protection of nitrogen, dissolving an initiator in distilled water, then dropwise adding the distilled water into a reaction solution, heating to 70-80 ℃, and continuously stirring and reacting for 3-4 hours to obtain a prepolymer emulsion A; the weight ratio of the unsaturated carbon-carbon double bond monomer, the first emulsifier, the initiator and the deionized water is 40-60 parts per 0.5-5 parts per 0.05-0.1 parts per 40-60 parts.
Then mixing 10-50 parts by mass of alkyl acrylate shown in formula (1), 0.05-0.1 part by mass of initiator, 0.5-5 parts by mass of emulsifier and 10-50 parts by mass of deionized water with prepolymer emulsion A uniformly, and reacting for 3-4 hours at 70-80 ℃ to obtain seed emulsion B, wherein the seed emulsion B is core emulsion in a core-shell coating structure;
s2, preparing film-forming polymer emulsion
Adding deionized water, a monomer containing unsaturated carbon-carbon double bonds, an anionic emulsifier and a nonionic emulsifier into a reactor, and stirring and pre-emulsifying to obtain a pre-emulsion C; the weight ratio of the unsaturated carbon-carbon double bond-containing monomer, the anionic emulsifier, the nonionic emulsifier and the deionized water is 40-60 parts per 0.3-3 parts per 40-60 parts;
then taking 100 parts by mass of emulsion B prepared in the step S1 as seed emulsion, synchronously dripping 10-50 parts by mass of emulsion C and 0.05-0.1 part by mass of initiator, reacting for 3-6 hours at 70-90 ℃, cooling and discharging to obtain film-forming polymer emulsion with a core-shell structure;
s3, preparing conductive foam material dispersion liquid:
adding the hollow polyacrylonitrile copolymer expanded microspheres, the film-forming polymer emulsion prepared in the step S2, the conductive filler, the color paste, the defoaming agent and the wetting agent into a mixing container, and stirring at a low speed for 10-30 minutes by using a stirring paddle until a uniform dispersion liquid is formed for standby, wherein the dispersion liquid is foam material dispersion liquid containing the conductive filler and the acrylic ester copolymer;
the weight portion ratio of the expansion microsphere, the film-forming polymer emulsion prepared in the step S1, the conductive filler, the color paste, the defoamer and the wetting agent is 0.5-2.5 parts per 95-99 parts per 6-30 parts per 0.3-0.7 parts per 0.05-0.2 parts per 0.5-2 parts.
S4, preparing foam materials:
and (3) uniformly stirring and mixing the dispersion liquid prepared in the step (S3), coating the mixture on a polymer film layer in a scraper coating mode, and then drying the polymer film coated with the wet glue in a 90 ℃ oven for 10 minutes, and taking out the polymer film to obtain the ultrathin foam component with the conductivity in the Z-axis direction.
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