CN116500829A - Backlight module manufacturing method, backlight module and display module - Google Patents
Backlight module manufacturing method, backlight module and display module Download PDFInfo
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- CN116500829A CN116500829A CN202310484855.5A CN202310484855A CN116500829A CN 116500829 A CN116500829 A CN 116500829A CN 202310484855 A CN202310484855 A CN 202310484855A CN 116500829 A CN116500829 A CN 116500829A
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- light
- emitting substrate
- flexible circuit
- circuit board
- fixing
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
Abstract
In the method for manufacturing the backlight module, the surface of one side of the first fixing structure, which is far away from the light-emitting substrate, is separated from the light-emitting substrate by a set distance which is larger than the height of the side wall of the backboard, so that when the backboard moves between the first fixing part and the second fixing part, the side wall is not contacted with the light-emitting substrate, and whether interference occurs between the side wall and the light-emitting substrate can be determined in advance. When the interference between the side wall and the light-emitting substrate is not generated, the backboard is continuously moved to one side of the light-emitting substrate until the backboard is attached to the light-emitting substrate, so that the interference probability of the side wall of the backboard and the light-emitting substrate can be reduced, the risk of breakage of the light-emitting substrate is reduced, and the yield is improved.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a method for manufacturing a backlight module, and a display module.
Background
In the display device, a light emitting module may be used as a light source of the passive display panel, wherein a substrate of the light emitting module may be glass, however, in a process of production and transportation, glass is easy to break, and it is generally required to fixedly assemble the glass and the metal back plate to improve mechanical strength.
The display panel and the light emitting module are required to be connected to two different circuit boards, respectively, and then connected to the driving board through the circuit boards. At present, in order to meet the requirement of narrowing the frame of the display device, two flexible circuit boards (Flexible Printed Circuit, abbreviated as FPCs) are generally used to connect the display panel and the light emitting module respectively, and then the two FPCs are bent together to one side of the back plate away from the display panel and connected with the driving board. In the bending process, two FPCs are easy to interfere, which is not beneficial to subsequent connection and further narrowing of the frame.
Disclosure of Invention
The invention provides a manufacturing method of a backlight module, the backlight module and a display module, which are used for solving the problem of fragmentation caused by interference between the side wall of a backboard and a luminous substrate in the perforation process of a flexible circuit board.
In a first aspect of the present invention, a method for manufacturing a backlight module is provided, including:
providing a luminous substrate and placing the luminous substrate on a fixed machine; the light-emitting substrate is connected with a flexible circuit board structure; the flexible circuit board structure comprises a movable area opposite to the light-emitting substrate, wherein the movable area comprises a fixed end connected with the light-emitting substrate and a free end far away from the fixed end; the fixed end and the free end are also provided with a first fixed part and a second fixed part which are sequentially arranged along the direction from the fixed end to the free end;
Bending the free end to one side far away from the light-emitting substrate, and fixing the first fixing part through the first fixing structure; the surface of one side of the first fixing structure, which is far away from the light-emitting substrate, is separated from the light-emitting substrate by a set distance;
providing a backboard, moving the backboard from a starting position of one side of the first fixing structure, which is away from the light-emitting substrate, to one side, which is close to the light-emitting substrate, and enabling the free end to pass through a slot of the backboard; the backboard comprises a bottom board and a side wall vertically contacted with the bottom board; the slot is positioned above the bottom plate and penetrates through the bottom plate; the height of the side wall is smaller than the set distance;
when the backboard moves between the first fixing part and the second fixing part, if the side wall is not interfered with the light-emitting substrate, the second fixing part is fixed through the second fixing structure, and the first fixing structure is detached from the first fixing part, so that the backboard continues to move to one side close to the bottom plate until the backboard is attached to the light-emitting substrate.
In the method provided by the invention, the side wall is positioned on at least one side of the slot along the width direction of the slot; the width direction is perpendicular to the extending direction of the bending shaft when the free end is bent to the side far away from the light-emitting substrate;
along the width direction of the slot, the side walls positioned on either side of the slot and the slot satisfy the following relationship:
D 2 -H 2 <G 2 ；
Wherein D represents the length of the flexible circuit board structure between one end of the first fixing part far away from the fixing end and the fixing end; h represents the height of the side wall; g represents the distance between the edge of the luminous substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate is coincident with the groove wall of the groove close to the side wall.
In the method provided by the invention, the distance between the first fixing part and the second fixing part is larger than the thickness of the bottom plate.
In the method provided by the invention, the method further comprises the following steps:
when the backboard moves to the position between the first fixing part and the second fixing part, if the side wall interferes with the light-emitting substrate, the relative position between the backboard and the light-emitting substrate is adjusted so that the side wall does not interfere with the light-emitting substrate.
In a second aspect of the present invention, there is provided a backlight module, including:
a light-emitting substrate and a back plate; the luminous substrate is attached to the back plate;
the light-emitting substrate is connected with a flexible circuit board structure; the flexible circuit board structure comprises a movable area opposite to the light-emitting substrate; the movable region comprises a fixed end connected to one side of the light-emitting substrate facing the back plate and a free end far away from the fixed end; the fixed end and the free end are also provided with a first fixed part and a second fixed part which are sequentially arranged along the direction from the fixed end to the free end;
The backboard comprises a bottom board and a side wall vertically contacted with the bottom board; the side wall is positioned on one side of the bottom plate facing the light-emitting substrate; the length of the flexible circuit board structure between one end of the first fixing part far away from the fixing end and the fixing end is larger than the height of the side wall; the bottom plate is provided with a slot penetrating through the thickness direction of the bottom plate; the free end of the flexible circuit board structure passes through the slot to reach one side of the backboard away from the light-emitting substrate.
In the backlight module provided by the invention, the side wall is positioned on at least one side of the slot along the width direction of the slot; the width direction is perpendicular to the extending direction of the bending shaft when the free end is bent to the side far away from the light-emitting substrate;
along the width direction of the slot, the side walls positioned on either side of the slot and the slot satisfy the following relationship:
D 2 -H 2 <G 2 ；
wherein D represents the length of the flexible circuit board structure between one end of the first fixing part far away from the fixing end and the fixing end; h represents the height of the side wall; g represents the distance between the edge of the first substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate is coincident with the groove wall of the groove close to the side wall.
In the backlight module provided by the invention, the distance between the first fixing part and the second fixing part is larger than the thickness of the bottom plate.
In the backlight module provided by the invention, the flexible circuit board structure only comprises one flexible circuit board; or alternatively, the process may be performed,
the flexible circuit structure includes at least two electrically connected flexible circuit boards.
In the backlight module provided by the invention, the flexible circuit structure comprises a first flexible circuit board and a second flexible circuit board; one end of the first flexible circuit board is bound on one side of the driving substrate, on which the light emitting device is arranged, the other end of the first flexible circuit board is bent to one side of the driving substrate, which is away from the light emitting device, and is connected with one end of the second flexible circuit board through a connector, and the other end of the second flexible circuit board passes through the slot to reach one side of the backboard, which is away from the light emitting substrate;
the flexible circuit board structure comprises peripheral areas positioned at two sides of the connector in the extending direction of the flexible circuit board structure; the peripheral area is provided with a raised structure and/or an opening for connecting the connector; at least part of the peripheral region is fixed to a side of the drive substrate facing away from the light emitting device.
In a third aspect of the present invention, there is provided a display module, including:
the display panel and any backlight module are arranged on the light incident side of the display panel.
The invention has the following beneficial effects:
The invention provides a manufacturing method of a backlight module, the backlight module and a display module. When the interference between the side wall and the light-emitting substrate is not generated, the backboard is continuously moved to one side of the light-emitting substrate until the backboard is attached to the light-emitting substrate, so that the interference probability of the side wall of the backboard and the light-emitting substrate can be reduced, the risk of breakage of the light-emitting substrate is reduced, and the yield is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of a display device according to the related art;
FIG. 2 is a schematic diagram showing a cross-sectional structure of a display device according to the related art;
FIG. 3 is a schematic diagram of a process of perforating a FPC of a light-emitting substrate in the related art;
FIG. 4 is a flowchart of a method for manufacturing a backlight module according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a backlight module manufacturing process according to an embodiment of the invention;
FIG. 6 is a second schematic diagram of a backlight module manufacturing process according to an embodiment of the invention;
FIG. 7 is a third schematic diagram of a backlight module manufacturing process according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a backlight module according to an embodiment of the present invention;
FIG. 9 is a schematic diagram illustrating bending of a flexible circuit board structure according to an embodiment of the present invention;
FIG. 10 is a second bending diagram of a flexible circuit board structure according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of a backlight module manufacturing process according to an embodiment of the invention;
fig. 12 is a schematic cross-sectional structure of a backlight module according to an embodiment of the present invention;
FIG. 13 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the present invention;
FIG. 14 is a schematic diagram of a cross-sectional structure of a flexible circuit board structure according to an embodiment of the present invention;
FIG. 15 is a schematic top view of a related art flexible circuit board structure;
fig. 16 is a schematic top view of a flexible circuit board structure according to an embodiment of the present invention;
fig. 17 is a schematic cross-sectional structure of a display module according to an embodiment of the invention.
The backlight module comprises a 100-backlight module, a 1-light-emitting substrate, a 11-driving substrate, a 12-light-emitting device, a 2-back plate, a 21-bottom plate, a 22-side wall, a 3-diffusion plate, a 4-optical sheet, a 5-reflection sheet, F1, F2-flexible circuit boards, K-grooves, F11-bending parts, 300-fixing machine tables, 6-flexible circuit board structures, 61-movable areas, 611-fixing ends, 612-free ends, 613-first fixing parts, 614-second fixing parts, 62-fixing areas, T1-first fixing structures, T2-second fixing structures, W-groove width directions, 13-buffer layers, 610-first flexible circuit boards, 620-second flexible circuit boards, 630-connectors, S1-first peripheral areas, S2-second peripheral areas and S3-bonding areas.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a further description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a repetitive description thereof will be omitted. The words expressing the positions and directions described in the present invention are described by taking the drawings as an example, but can be changed according to the needs, and all the changes are included in the protection scope of the present invention. The drawings of the present invention are merely schematic representations of relative positional relationships and are not intended to represent true proportions.
FIG. 1 is a schematic cross-sectional view of a display device according to the related art; FIG. 2 is a schematic diagram showing a cross-sectional structure of a display device according to the related art.
In the related art, as shown in fig. 1 and 2, a liquid crystal display device generally includes a display panel 100 and a backlight module 200.
The display panel 200 is a liquid crystal display panel. The liquid crystal display panel includes an array substrate and a counter substrate disposed opposite to each other, and a liquid crystal layer (not shown) between the array substrate and the target substrate. And applying voltage through the pixel electrodes in the array substrate so as to drive liquid crystal molecules in the liquid crystal layer to deflect, and modulating incident light rays, thereby realizing image display. If a color filter is added, a color image can be displayed.
The backlight module 200 is located at the light incident side of the display panel 100. The backlight module generally includes a light-emitting substrate 1, a back plate 2, a diffusion plate 3, an optical film 4, and a reflective sheet 5.
The light-emitting substrate 1 is used for providing backlight light, and as shown in fig. 1, the light-emitting substrate 1 is generally fixed on the back plate 2 to improve mechanical strength. The light emitting substrate 1 includes a driving substrate 11 and a light emitting device 12 located above the driving substrate. The light emitting device 12 is electrically connected to the driving substrate 11, and the driving substrate 11 may provide a driving signal to the light emitting device 12 to drive the light emitting device 11 to emit light as a light source of the backlight. The light emitting device 12 may be a light emitting diode (Light Emititng Diode, LED for short), a micro light emitting diode (Mini Light Emititng Diode, mini LED for short), or the like. The Mini LED refers to a miniature light-emitting diode chip with the size within 500 mu m, and the Mini LED has smaller size, which means that more light-emitting devices can be arranged on the driving substrate with the same area, thereby providing a higher brightness range, being beneficial to realizing the brightness control of the subareas and improving the dynamic contrast of the display picture. The drive substrate may be a printed circuit board (Printed Circuit Board, abbreviated as PCB) or a glass-based thin film transistor (Thin Film Transistor, abbreviated as TFT) substrate, or the like.
The backboard 2 is positioned on one side of the light-emitting substrate 1 away from the display panel, and has supporting and bearing functions. The shape of the back plate 2 is adapted to the shape of the backlight module. The material of the back plate 2 may be aluminum, iron, aluminum alloy, iron alloy, or the like. The back plate 2 also plays a role in heat dissipation to the light-emitting substrate 1.
The diffusion plate 3 is located on the light emitting side of the light emitting substrate 1 and is spaced apart from the light emitting substrate 1 by a certain distance. The distance is set so that light sources on the light-emitting substrate can be sufficiently mixed. The diffusion plate 3 is used for scattering incident light, so that the light passing through the diffusion plate 3 is more uniform.
The diffusion plate 3 is provided with scattering particle materials, and light rays are incident on the scattering particle materials and are continuously refracted and reflected, so that the effect of scattering the light rays is achieved, and the effect of homogenizing the light is achieved. The thickness of the diffusion plate is generally set to 1.5mm-3mm, and the larger the thickness of the diffusion plate is, the larger the haze is, and the better the uniformity effect is.
The diffusion plate 3 may be generally manufactured by an extrusion process, and the diffusion plate 3 is made of at least one material selected from polymethyl methacrylate PMMA, polycarbonate PC, polystyrene PS, and polypropylene PP.
The optical film 4 is located on the side of the diffusion plate 3 facing away from the light-emitting substrate 1. In specific implementations, the optical film 4 includes one or a combination of several of a prism sheet and a brightness enhancing film, etc., and is set according to specific needs, without limitation. In the case where the light emitting device emits blue light, the optical film 4 may further include a quantum dot film that emits green light and red light upon excitation of the blue light, thereby mixing into white light for backlight.
The reflective sheet 5 is located on the side of the luminescent substrate 1 facing away from the back plate 2. The reflective sheet 5 includes a plurality of openings for exposing the light emitting devices 12. The reflecting sheet 5 is used for reflecting the light incident on the back plate 2 side to the diffusion plate 3 side, thereby improving the light utilization rate. The reflecting sheet 5 may be a reflecting layer, and the reflecting layer may be made of white oil.
As shown in fig. 1, support columns may be further disposed between the light-emitting substrate 1 and the diffusion plate 3, and the support columns are used for supporting the diffusion plate 3 and the optical film 4. The support columns also form a light mixing distance between the diffusion plate 3 and the light emitting substrate 1 so that light sources on the light emitting substrate can be fully mixed.
In practice, the display panel 200 and the light emitting substrate 1 need to be connected to two different circuit boards, respectively, and then connected to a driving board through a flexible circuit board to provide driving signals through the driving board. As shown in fig. 1, in order to meet the requirement of narrowing the frame of the display device, two flexible circuit boards (Flexible Printed Circuit, abbreviated as FPCs) F1 and F2 are generally used to connect the display panel 200 and the light-emitting substrate 100 respectively, and then the two FPCs are bent together to the side of the back plate 2 facing away from the display panel 200 and connected with the driving board. In the bending process, two FPCs are easy to interfere, which is not beneficial to the follow-up connection of the driving plate and the further narrowing of the frame.
In order to solve the above-mentioned problems, as shown in fig. 2, a slot H is formed in the back plate 2 in the related art, and the flexible circuit board F1 connected to the light-emitting substrate 1 passes through the slot to reach a side of the back plate 2 away from the light-emitting substrate 1, so as to avoid interference between the flexible circuit board F2 connected to the light-emitting substrate 1 and the flexible circuit board F1 connected to the display panel 200, and further reduce the frame width.
Fig. 3 is a schematic diagram of a perforation process of a light emitting substrate FPC in the related art.
In the related art, when the flexible circuit board F1 to which the light-emitting substrate 1 is bound passes through the slot of the back plate 2, the light-emitting substrate 1 is usually placed on the fixing machine 300, it should be understood that, because the surface of the light-emitting substrate 1 on which the light-emitting devices 12 are disposed is opposite to the fixing machine 300, in order to avoid that the light-emitting devices 12 are scratched or bumped in the process to affect the yield of the product, a protection structure may be disposed on a side of the light-emitting devices 12 away from the driving substrate 11, for example, a transparent silica gel is used to make a protection film with a flat surface, so as to cover all the light-emitting devices 12; or a separate arc protection structure is provided for each light emitting device 12, which is not limited herein; next, the flexible circuit board F1 is bent to a side away from the light emitting substrate 1, and the bent portion F11 of the flexible circuit board F1 is fixed by a fixing mechanism so that the bent portion F11 of the flexible circuit board F1 is perpendicular to the light emitting substrate. Then, the back plate 2 is clamped to the upper side of the light-emitting substrate 1 through the mechanical arm, the back plate moves from the upper side of the light-emitting substrate 1 to the direction close to the light-emitting substrate 1, one end, far away from the light-emitting substrate 1, of the flexible circuit board F1 penetrates through the groove in the moving process, and finally the back plate 2 moves to be attached to the light-emitting substrate 1.
As shown in fig. 3, a sidewall 21 protruding to one side of the light-emitting substrate 1 is provided around some of the back plates 2, and the sidewall 21 is generally used for fixing and assembling a subsequent film layer, for example, a film layer such as a diffusion plate on the light-emitting side of the light-emitting substrate after the light-emitting substrate 1 is attached to the back plates 2. In particular, the side wall 21 may be configured as a continuous structure disposed around the periphery of the back plate 2, or the side wall 21 may be configured as a plurality of discontinuous structures disposed around the periphery of the back plate 2 at intervals, which is not limited herein. The region surrounded by the side walls 21 may form a mounting space for mounting the light emitting substrate.
Although a designer usually intentionally reserves a certain gap between the side wall 21 and the light-emitting substrate 1 at the time of design for avoiding interference between the light-emitting substrate 1 and the side wall 21, the reserved gap is not too large, typically about 0.9mm, in consideration of the effect of narrowing the frame. In the process of actually bonding the light-emitting substrate 1 and the back plate 2, as shown in fig. 3, when the flexible circuit board F1 is bent to a side far from the light-emitting substrate 1, an included angle formed between the bent portion F11 and the light-emitting substrate 1 is too large or too small, or when the back plate moves to a side close to the light-emitting substrate, the mechanical arm shakes, and the like, which may cause the relative position between the back plate and the light-emitting substrate to deviate from the design position, so that the side wall 21 interferes with the light-emitting substrate 1, and the light-emitting substrate 1 is collided by the side wall 21 to break. When the light-emitting substrate 1 employs a glass-based TFT substrate as a driving substrate, the defective rate due to the crush fragments caused by the interference of the side walls with the light-emitting substrate exceeds 10% in the actual operation process.
In view of the above, the present application provides a method for manufacturing a backlight module, which can solve the above-mentioned problems.
FIG. 4 is a flowchart of a method for manufacturing a backlight module according to an embodiment of the present invention; FIG. 5 is a schematic diagram of a backlight module manufacturing process according to an embodiment of the invention; FIG. 6 is a second schematic diagram of a backlight module manufacturing process according to an embodiment of the invention; FIG. 7 is a third schematic diagram of a backlight module manufacturing process according to an embodiment of the invention; fig. 8 is a schematic diagram of a manufacturing process of a backlight module according to an embodiment of the invention.
As shown in fig. 4, the method for manufacturing a backlight module according to the embodiment of the invention includes the following steps:
s410: providing a luminous substrate and placing the luminous substrate on a fixed machine; the light-emitting substrate is connected with a flexible circuit board structure; the flexible circuit board structure comprises a movable area opposite to the light-emitting substrate, wherein the movable area comprises a fixed end connected with the light-emitting substrate and a free end far away from the fixed end; the fixed end and the free end are also provided with a first fixed part and a second fixed part which are sequentially arranged along the direction from the fixed end to the free end;
s420: bending the free end to one side far away from the light-emitting substrate, and fixing the first fixing part through the first fixing structure; the surface of one side of the first fixing structure, which is far away from the light-emitting substrate, is separated from the light-emitting substrate by a set distance;
S430: providing a backboard, moving the backboard from a starting position of one side of the first fixing structure, which is away from the light-emitting substrate, to one side, which is close to the light-emitting substrate, and enabling the free end to pass through a slot of the backboard; the backboard comprises a bottom board and a side wall vertically contacted with the bottom board; the slot is positioned above the bottom plate and penetrates through the bottom plate; the height of the side wall is smaller than the set distance;
s440: when the backboard moves between the first fixing part and the second fixing part, if the side wall is not interfered with the light-emitting substrate, the second fixing part is fixed through the second fixing structure, and the first fixing structure is detached from the first fixing part, so that the backboard continues to move to one side close to the bottom plate until the backboard is attached to the light-emitting substrate.
As shown in fig. 5, a light emitting substrate is first provided and placed on a stationary machine.
In the embodiment of the present invention, the flexible circuit board structure 6 is connected to the light emitting substrate 1. On the side of the light-emitting substrate 1 facing away from the stationary machine 300, the flexible circuit board structure 6 comprises a movable area 61 with respect to the light-emitting substrate. The movable region 61 includes a fixed end 611 connected to the light emitting substrate 6 and a free end 612 remote from the fixed end 611. Also included between the fixed end 611 and the free end 612 are a first fixing portion 613 and a second fixing portion 614 which are sequentially disposed in a direction from the fixed end to the free end.
Wherein the fixed end 611 is fixed on the light emitting substrate, and the movable region 61 can be bent relative to the light emitting substrate 1, so that the free end 612 is bent to a side far from the light emitting substrate 1. The first fixing portion 613 and the second fixing portion 614 are used for fixing the movable area 61 by being connected with a fixing structure after the movable area 61 is bent.
In particular, a reinforcing layer may be formed on the surface of the active area 61 of the flexible circuit board structure 6 to increase the strength of the active area 61 after bending, so that the active area 61 can maintain its shape after bending. The reinforcing layer may be a flexible film layer such as a metal layer, and is not limited herein.
In the embodiment of the present invention, the light emitting substrate 1 includes a driving substrate 11 and a light emitting device 12. In practice, the light emitting device 12 is placed facing the fixing machine 300, and the fixing end 611 of the movable region 61 is fixed to the side of the driving substrate 11 facing away from the light emitting device 12. The driving substrate 11 is used to drive the light emitting device 12 to emit light, and may be a circuit board having a driving function, such as a PCB board or a glass-based TFT substrate, and is not limited herein.
One end of the flexible circuit board structure 6 is bound on the light emitting substrate 1, electrically connected with the driving substrate 11, and the other end is connected to a control board of the display device for providing control signals.
In particular, as shown in fig. 5, one end of the flexible circuit board structure 6 is bound to the side of the driving substrate 11 where the light emitting device 12 is disposed, and the other end is bent to the side of the driving substrate 11 away from the light emitting device 12. At the side of the drive substrate 11 facing away from the light emitting device 12, at least part of the area of the flexible circuit board structure 6 is connected to the drive substrate 11 by means of an adhesive layer, forming a fixed area 62, the rest of the flexible circuit board structure 6 forming a movable area 61.
The flexible circuit board structure 6 may be a single flexible circuit board or an extension structure formed by connecting at least two flexible circuit boards end to end. When the flexible circuit board structure 6 is connected through at least two flexible circuit boards, the length of the flexible circuit board structure 6 can be prolonged, the influence on the subsequent perforation process caused by insufficient length of a single flexible circuit board is avoided, and the connection distance with the control board connection of the display device can be prolonged.
As shown in fig. 6, after the light emitting substrate is placed on the fixing machine, the free end 612 is bent toward a side away from the light emitting substrate, and the first fixing portion 613 is fixed by the first fixing structure T1. Wherein the surface of the first fixing structure T1 facing away from the light-emitting substrate 11 is spaced apart from the light-emitting substrate by a set distance h 1 . For the backlight module of the same product, a first fixing partThe distance between the fixed structure and the light-emitting substrate is usually fixed, and for backlight modules of different products, the size of the set distance h1 can be adjusted by adjusting the position of the first fixed structure relative to the light-emitting substrate so as to meet the requirements of different products. Because the first fixed knot constructs through being connected with first fixed part in order to fix the activity region, the length of flexible circuit board structure between the one end that the stiff end was kept away from to first fixed part and the stiff end needs to be greater than and presumes distance h1 to make the length of this section flexible circuit board structure satisfy fixed demand. In particular, the first fixing structure T1 may be a magnetic attraction device or a vacuum adsorption device, so as to facilitate the adsorption and fixation of the first fixing portion 613, and facilitate the subsequent removal of the first fixing structure T1 from the flexible circuit structure 6.
As shown in fig. 7, after the active area is bent and fixed by the first fixing structure T1, the back plate 2 is moved from the starting position of the first fixing structure on the side away from the light emitting substrate, the back plate 2 is moved to the side close to the light emitting substrate, and the free end 612 is passed through the slot K of the back plate 2. In specific implementation, the backboard 2 may be picked up by a clamping device such as a mechanical arm or a fixing device, the backboard 2 is transferred to one side of the first fixing structure, which is away from the light-emitting substrate, and the backboard 2 starts to be moved to one side, which is close to the light-emitting substrate, at a preset starting position of a control program of the mechanical arm, so that a free end may pass through the slot K of the backboard 2. The initial position may be the position of the back plate 2 when the free end 612 can pass through the slot K of the back plate 2 after the relative position between the slot K and the free end is adjusted by the alignment mechanism.
Wherein the back plate 2 comprises a bottom plate 22 and side walls 21 in vertical contact with the bottom plate. The slot K is located above the bottom plate 22 and extends through the bottom plate 22. The height H of the side wall 21 is smaller than the set distance H 1 。
As shown in fig. 8, when the back plate moves between the first fixing portion 613 and the second fixing portion 614, if it is determined that the side wall does not interfere with the light emitting substrate, the second fixing portion 614 is fixed by the second fixing structure T2, and the first fixing structure T1 is detached from the first fixing portion 613, so that the back plate continues to move to a side close to the bottom plate until the back plate is attached to the light emitting substrate. After the backboard is attached to the light-emitting substrate, the second fixing structure T2 is detached from the second fixing portion. In particular, the second fixing structure may be a magnetic attraction device or a vacuum adsorption device, so as to facilitate the adsorption and fixation of the second fixing portion 614, and facilitate the subsequent removal of the second fixing structure 613 from the flexible circuit structure 6.
In the embodiment of the invention, the surface of the first fixing structure T1 facing away from the light-emitting substrate 11 is separated from the light-emitting substrate 1 by a set distance h 1 The height H of the sidewall 21 of the back plate is greater than the height H of the sidewall 21 of the back plate, so that when the back plate moves between the first fixing portion 613 and the second fixing portion 614, the sidewall 21 is not in contact with the light emitting substrate 1, and at this time, whether interference between the sidewall and the light emitting substrate occurs is determined in advance by manual judgment by an operator or automatic judgment by combining an industrial camera with image analysis software. When the interference between the side wall and the light-emitting substrate is not generated, the backboard is continuously moved to one side of the light-emitting substrate until the backboard is attached to the light-emitting substrate, so that the interference probability of the side wall of the backboard and the light-emitting substrate can be reduced, the risk of breakage of the light-emitting substrate is reduced, and the yield is improved.
In practice, the slot K in the base plate is typically sized such that the active area of the flexible circuit board structure can pass through the slot K, while the first fixed structure T1 cannot pass through the slot K. Therefore, in the process that the backboard moves to the side close to the light-emitting substrate so that the backboard is attached to the light-emitting substrate, when the backboard moves to the position contacting with the first fixing structure, the backboard cannot move downwards continuously due to the blocking of the first fixing structure. The blocking effect of the first fixing structure can be utilized, and the risk that the luminescent substrate is broken due to the fact that the luminescent substrate is extruded due to the fact that the back plate continuously moves downwards under the condition that interference exists between the side wall of the back plate and the luminescent substrate is avoided.
In some embodiments, when the back plate moves between the first fixing portion and the second fixing portion, if the risk of interference between the side wall and the light-emitting substrate is determined by judgment, the relative position between the back plate and the light-emitting substrate can be adjusted by the mechanical arm, so that the back plate reaches the position where the side wall and the light-emitting substrate do not interfere, and then the lamination between the back plate and the light-emitting substrate is continued, so that the breaking risk is reduced.
FIG. 9 is a schematic diagram illustrating bending of a flexible circuit board structure according to an embodiment of the present invention; fig. 10 is a second bending schematic diagram of a flexible circuit board structure according to an embodiment of the invention.
In some embodiments, as shown in fig. 9 and 10, the side wall 21 is located on at least one side of the slot K in the width direction W of the slot K. The width direction W is perpendicular to the extending direction of the bending axis when the free end is bent to a side away from the light-emitting substrate, and as shown in fig. 9, the extending direction of the bending axis is perpendicular to the paper surface (cross section).
Along the width direction W of the slot, the following relationship is satisfied between the side wall 21 located on either side of the slot K and the slot K:
D 2 -H 2 <G 2 ；
wherein D represents the length of the flexible circuit board structure between one end of the first fixing part far away from the fixing end and the fixing end; h represents the height of the side wall; g represents the distance between the edge of the first substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate is coincident with the groove wall of the groove close to the side wall.
Specifically, as shown in fig. 9, taking the case of having the side wall 21 on the left side of the slot K in the width direction W of the slot, when the orthographic projection of the fixed end 611 on the bottom plate 22 coincides with the wall of the slot K on the side close to the left side wall, the distance G between the edge of the light-emitting substrate 1 close to the left side wall 21 and the side wall can be used to define the maximum distance that the light-emitting substrate 1 can theoretically move to the left in the width direction W of the slot when the orthographic projection of the fixed end 611 on the bottom plate 22 coincides with the wall of the slot K on the side close to the left side wall, and when the distance that the light-emitting substrate moves to the left side is greater than G, the side wall 21 interferes with the light-emitting substrate.
As shown in fig. 7 and 10, since the first fixing portion 613 is fixed by the first fixing structure T1, a distance between the first fixing structure T1 and the light emitting substrate is a fixed value h 1 At this time, the first fixing portion 613 is away from the distance H between the end of the fixing portion 611 and the light-emitting substrate 1 1 Is also a fixed value, andand the first fixing portion 613 is fixed by the first fixing structure T1, and when one end of the first fixing portion 613 far away from the light emitting substrate is just leveled with one side of the first fixing structure T1 far away from the light emitting substrate, H 1 ＝h 1 . Then, when the length of the flexible circuit board structure between the end of the first fixing portion 613 far from the fixing end 611 and the fixing end 611 is D, the maximum distance actually moved when the light emitting substrate 1 moves to the left side (or the right side, not shown) in the width direction W of the slot K is G 1 (the distance by which the position of the fixed end 611 in fig. 10 moves in the width direction W of the slot K relative to the position of the fixed end 611 in fig. 9),since the first fixing portion 613 is fixed by the first fixing structure T1, H 1 Is of fixed value, G 1 Depending on the length of D (G when the flexible circuit board structure between the end of the first fixing portion 613 away from the fixing end 611 and the fixing end 611 is completely straightened 1 Maximum).
As shown in fig. 7, when the back plate and the light-emitting substrate are bonded, the surface of the first fixing structure 613 facing away from the light-emitting substrate 1 is spaced from the light-emitting substrate by a set distance h 1 Greater than the height H of the side wall 21, H is fixed by the first fixing portion T1 due to the first fixing structure 613 1 ＝h 1 Then the distance H between the end of the first fixing portion 613 away from the fixing end 611 and the light emitting substrate 1 1 Also greater than H, it is possible to obtain: g 1 2 <D 2 -H 2 。
Then G should be ensured when the orthographic projection of the fixed end 611 on the bottom plate 22 coincides with the groove wall of the groove K on the side close to the left side wall 2 >G 1 2 G, i.e 2 >D 2 -H 2 In this case, that is, the maximum distance G that the light-emitting substrate can theoretically move to the left in the width direction W of the slot is larger than the maximum distance G that the light-emitting substrate actually moves in the width direction W of the slot 1 The interference between the light-emitting substrate and the side wall of the backboard due to the overlarge offset distance of the light-emitting substrate in the width direction W of the slot can be avoided.
Since when the orthographic projection of the fixed end 611 on the bottom plate 22 is located between the left side wall and the right side wall of the slot K, the distance between the edge of the light-emitting substrate 1 near the left side wall 21 and the side wall is G ′ ，G ′ Can be used to define the maximum distance that the light-emitting substrate 1 can theoretically move to the left in the width direction W of the slot at this time, due to G ′ >G, i.e. the maximum distance G at which the luminescent substrate can theoretically move to the left in the width direction W of the slot ′ The distance between the light-emitting substrate and the back plate is larger than the maximum distance of the light-emitting substrate in the width direction W of the slot, so that the light-emitting substrate can be prevented from being offset too far in the width direction W of the slot to interfere with the side wall of the back plate.
Thus, when the width direction W of the slot is in the slot, D is satisfied between the side wall 21 located on either side of the slot K and the slot K 2 -H 2 <G 2 When the back plate is attached to the light-emitting substrate, the probability of interference between the side wall of the back plate and the light-emitting substrate can be greatly reduced, the frequency of adjusting the relative position between the back plate and the light-emitting substrate is reduced, and the manufacturing efficiency and the yield of the backlight module are improved.
In the embodiment of the invention, the distance between the first fixing part and the second fixing part is larger than the thickness of the bottom plate, so that the second fixing part can completely penetrate through the slot K in the process of penetrating the flexible circuit board structure through the slot K to be effectively connected with the second fixing structure.
Fig. 11 is a schematic diagram of a manufacturing process of a backlight module according to an embodiment of the invention.
In the embodiment of the invention, a buffer layer may be further disposed on a side of the light-emitting substrate facing the back plate, or on a side of the bottom plate of the back plate facing the light-emitting substrate. The buffer layer is used for playing a role in buffering when the backboard is in contact with the light-emitting substrate, so that impact force of the backboard on the light-emitting substrate is reduced, and the risk of breakage of the light-emitting substrate is reduced.
For example, as shown in fig. 11, the buffer layer 13 may be disposed at a side of the driving substrate facing away from the light emitting device. The buffer layer 13 may be disposed in an area of the fixed area of the flexible circuit board structure other than the orthographic projection on the driving substrate, and a surface of the buffer layer 13 on a side facing away from the driving substrate is flush with a surface of the fixed area of the flexible circuit board structure on a side facing away from the driving substrate. The buffer layer 13 may be a continuous film layer as shown in fig. 11, or may be a plurality of layers arranged at intervals, and is not limited thereto.
In the embodiment, the buffer layer 13 is not limited to the arrangement method shown in fig. 11, as long as it can play a role of buffering when the back plate contacts with the light-emitting substrate, and detailed description is omitted herein.
Fig. 12 is a schematic cross-sectional structure of a backlight module according to an embodiment of the invention.
In a second aspect of the embodiments of the present invention, a backlight module is provided.
In an embodiment of the present invention, a backlight module includes: a light-emitting substrate 1 and a back plate 2.
In the embodiment of the invention, the light-emitting substrate is connected with a flexible circuit board structure. The flexible circuit board structure comprises a movable area relative to the light-emitting substrate, wherein the movable area comprises a fixed end connected to one side of the light-emitting substrate facing the back plate and a free end far away from the fixed end. The fixed end and the free end are connected through a connecting rod, and the connecting rod is connected with the free end through a connecting rod. The specific structure of the light-emitting substrate may refer to the description in the above method embodiments, and will not be described herein.
The backboard comprises a bottom board and a side wall vertically contacted with the bottom board; the side wall is positioned on one side of the bottom plate facing the light-emitting substrate; the length of the flexible circuit board structure between one end of the first fixing part far away from the fixing end and the fixing end is larger than the height of the side wall; the bottom plate is provided with a slot penetrating through the thickness direction of the bottom plate; the free end of the flexible circuit board structure passes through the slot to reach one side of the backboard away from the light-emitting substrate. The specific structure of the back plate may refer to the description in the above method embodiments, and will not be described herein.
In the specific implementation, the light-emitting substrate and the back plate can be bonded by adopting any method, so that the risk of interference between the side wall of the back plate and the light-emitting substrate in the bonding process of the light-emitting substrate and the back plate can be avoided, the probability of fragments of the light-emitting substrate is reduced, and the yield of the backlight module is improved.
In some embodiments, the sidewalls are located on at least one side of the slot along the width of the slot; the width direction is perpendicular to the extending direction of the bending shaft when the free end is bent to the side far away from the light-emitting substrate;
along the width direction of the slot, the side walls positioned on either side of the slot and the slot satisfy the following relationship:
D 2 -H 2 <G 2 ；
wherein D represents the length of the flexible circuit board structure between one end of the first fixing part far away from the fixing end and the fixing end; h represents the height of the side wall; g represents the distance between the edge of the first substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate is coincident with the groove wall of the groove close to the side wall.
When the side wall 21 located on either side of the slot K in the width direction W of the slot meets D with the slot K 2 -H 2 <G 2 When the back plate is attached to the light-emitting substrate, the probability of interference between the side wall of the back plate and the light-emitting substrate can be greatly reduced, the frequency of adjusting the relative position between the back plate and the light-emitting substrate is reduced, and the manufacturing efficiency and the yield of the backlight module are improved.
In some embodiments, the distance between the first and second fixing portions is greater than the thickness of the base plate, so that it can be ensured that the second fixing portion can pass completely through the slot to be effectively connected with the second fixing structure during the process of passing the flexible circuit board structure through the slot.
In some embodiments, the flexible circuit board structure includes only one flexible circuit board.
In some embodiments, the flexible circuit structure includes at least two electrically connected flexible circuit boards. When the flexible circuit board structure is connected through at least two flexible circuit boards, the length of the flexible circuit board structure can be prolonged, the influence on the subsequent perforation process caused by insufficient length of a single flexible circuit board is avoided, and the connection distance with the control board connection of the display device can be prolonged.
FIG. 13 is a schematic cross-sectional view of a flexible circuit board structure according to an embodiment of the present invention; FIG. 14 is a schematic diagram of a cross-sectional structure of a flexible circuit board structure according to an embodiment of the present invention; FIG. 15 is a schematic top view of a related art flexible circuit board structure; fig. 16 is a schematic top view of a flexible circuit board structure according to an embodiment of the present invention.
In some embodiments, the flex circuit structure includes a first flex circuit board 610 and a second flex circuit board 620. In particular, as shown in fig. 13, one end of the first flexible circuit board 610 is bound to a side of the driving substrate where the light emitting device is disposed, and the other end of the first flexible circuit board 610 is bent to a side of the driving substrate facing away from the light emitting device and is connected to one end of the second flexible circuit board 620 through a connector 630. The other end of the second flexible circuit board 620 is used to pass through the slot of the back plate to reach the side of the back plate away from the light-emitting substrate, and is connected with the control board of the display device.
In some embodiments, the flexible circuit board structure includes peripheral regions on either side of the connector in the direction of extension of the flexible circuit board structure. In particular, as shown in fig. 14, the flexible circuit board structure includes a first peripheral area S1 disposed on a side of the connector 630 adjacent to the first flexible circuit board 610, and a second peripheral area S2 disposed on a side of the connector 630 adjacent to the second flexible circuit board 620. The first peripheral region S1 and the second peripheral region S2 are provided with a bump structure for connecting the connector, for example, a circuit element such as a resistor, a capacitor, a pad, or the like, or an opening for mounting the connector, or the like.
In the related art, as shown in fig. 15, after bending the flexible circuit board structure to the side of the driving substrate facing away from the light emitting device, only the bonding region S3, which is not overlapped with the first peripheral region S1, is typically bonded and fixed to the driving substrate by the adhesive layer to form a fixed region, resulting in a longer length D of the flexible circuit board structure between the fixed end of the movable region and the first fixed portion, and failing to satisfy D when bonding the back plate and the light emitting substrate 2 -H 2 <G 2 And causes interference between the back plate side wall and the light-emitting substrate.
In view of this, in the embodiment of the invention, at least a part of the peripheral area is fixed on the side of the driving substrate facing away from the light emitting device through the adhesive layer according to the length requirement of the flexible circuit board structure between the fixed end of the movable area and the first fixed portion.
For example, in the embodiment shown in fig. 16, the bonding region S3 at least partially coincides with the first peripheral region S1, and the adhesive layer at the overlapping portion of the bonding region S3 and the first peripheral region S1 is shaped to avoid the bump structure and the opening hole in the first peripheral region S1, so that the length of the fixed region can be increased, the length D of the flexible circuit board structure between the fixed end of the movable region and the first fixed portion can be reduced, and the requirement D when the back plate and the light-emitting substrate are bonded without interference is ensured 2 -H 2 <G 2 So as to avoid the breakage caused by the interference between the side wall of the backboard and the light-emitting substrate.
In the embodiment shown in fig. 16, only the bonding region S3 partially coincides with the first peripheral region S1, so that a partial region of the first peripheral region S1 is fixed on the side of the driving substrate facing away from the light emitting device by an adhesive layer for illustration. During specific implementation, the adhesive layer can be specially designed according to actual demands so as to avoid a convex structure or an opening and the like of the connector, which are used for installing the connector, so that the length D of the flexible circuit board structure between the fixed end of the movable area and the first fixed part is further reduced, and fragments caused by interference between the side wall of the backboard and the light-emitting substrate are avoided, and are not repeated herein.
The backlight module provided by the embodiment of the invention further comprises a diffusion plate, an optical film, a reflecting sheet and other film structures, and the description in the related art can be referred to specifically, and the details are not repeated here.
In some embodiments, the film layers such as the diffusion plate and the optical film can be supported by the side wall of the back plate, so that the use of support columns can be reduced or avoided during implementation, and the structure of the backlight module is simplified.
Fig. 17 is a schematic cross-sectional structure of a display module according to an embodiment of the invention.
In a third aspect of the embodiments of the present invention, a display module is provided.
As shown in fig. 17, the display module includes: the display panel 200 and the backlight module 100 provided in any of the above embodiments. The backlight module 100 is located on the light incident surface of the display panel 200. The display module may be a liquid crystal display module. In practical implementation, the display module has the same technical effects as the backlight module in any of the foregoing embodiments, and will not be described herein.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. The manufacturing method of the backlight module is characterized by comprising the following steps:
providing a light-emitting substrate, and placing the light-emitting substrate on a fixed machine; the light-emitting substrate is connected with a flexible circuit board structure; the flexible circuit board structure comprises an active area relative to the light-emitting substrate, wherein the active area comprises a fixed end connected with the light-emitting substrate and a free end far away from the fixed end; the fixed end and the free end also comprise a first fixed part and a second fixed part which are sequentially arranged along the direction from the fixed end to the free end;
bending the free end to a side far away from the light-emitting substrate, and fixing the first fixing part through a first fixing structure; the surface of one side of the first fixing structure, which is away from the light-emitting substrate, is separated from the light-emitting substrate by a set distance;
Providing a backboard, moving the backboard from a starting position of one side of the first fixing structure, which is away from the light-emitting substrate, to one side, which is close to the light-emitting substrate, and enabling the free end to pass through a slot of the backboard; the backboard comprises a bottom plate and a side wall vertically contacted with the bottom plate; the slot is positioned above the bottom plate and penetrates through the bottom plate; the height of the side wall is smaller than the set distance;
when the backboard moves between the first fixing part and the second fixing part, if the side wall and the light-emitting substrate are not interfered, the second fixing part is fixed through the second fixing structure, and the first fixing structure is detached from the first fixing part, so that the backboard continues to move to one side close to the bottom plate until the backboard is attached to the light-emitting substrate.
2. The method of claim 1, wherein the sidewall is located on at least one side of the slot along a width direction of the slot; the width direction is perpendicular to the extending direction of the bending shaft when the free end is bent to the side far away from the light-emitting substrate;
along the width direction of the slot, the side walls located on either side of the slot and the slot satisfy the following relationship:
D 2 -H 2 <G 2 ；
Wherein D represents a length of the flexible circuit board structure between an end of the first fixing portion away from the fixing end and the fixing end; h represents the height of the side wall; g represents the distance between the edge of the luminous substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate is overlapped with the groove wall of the groove close to the side wall.
3. The method of claim 1, wherein a distance between the first and second securing portions is greater than a thickness of the base plate.
4. A method according to any one of claims 1 to 3, further comprising:
when the backboard moves to the position between the first fixing part and the second fixing part, if the side wall interferes with the light-emitting substrate, the relative position between the backboard and the light-emitting substrate is adjusted so that the side wall does not interfere with the light-emitting substrate.
5. The utility model provides a backlight unit which characterized in that, backlight unit includes: a light-emitting substrate and a back plate; the luminous substrate is attached to the back plate;
the light-emitting substrate is connected with a flexible circuit board structure; the flexible circuit board structure comprises an active area relative to the light emitting substrate; the movable region comprises a fixed end connected to one side of the light-emitting substrate facing the back plate and a free end far away from the fixed end; the fixed end and the free end also comprise a first fixed part and a second fixed part which are sequentially arranged along the direction from the fixed end to the free end;
The backboard comprises a bottom plate and a side wall vertically contacted with the bottom plate; the side wall is positioned on one side of the bottom plate facing the light-emitting substrate; the length of the flexible circuit board structure between one end of the first fixing part far away from the fixing end and the fixing end is larger than the height of the side wall; the bottom plate is provided with a slot penetrating through the thickness direction of the bottom plate; the free end of the flexible circuit board structure penetrates through the slot to reach one side, away from the light-emitting substrate, of the back plate.
6. The backlight module according to claim 5, wherein the side wall is located at least one side of the slot along a width direction of the slot; the width direction is perpendicular to the extending direction of the bending shaft when the free end is bent to the side far away from the light-emitting substrate;
along the width direction of the slot, the side walls located on either side of the slot and the slot satisfy the following relationship:
D 2 -H 2 <G 2 ；
wherein D represents a length of the flexible circuit board structure between an end of the first fixing portion away from the fixing end and the fixing end; h represents the height of the side wall; g represents the distance between the edge of the first substrate close to the side wall and the side wall when the orthographic projection of the fixed end on the bottom plate is overlapped with the groove wall of the groove close to the side wall.
7. The backlight module according to claim 5, wherein a distance between the first fixing portion and the second fixing portion is greater than a thickness of the bottom plate.
8. The backlight module of claim 7, wherein the flexible circuit board structure comprises only one flexible circuit board; or alternatively, the process may be performed,
the flexible circuit structure includes at least two electrically connected flexible circuit boards.
9. The backlight module of claim 8, wherein the flexible circuit structure comprises a first flexible circuit board and a second flexible circuit board; one end of the first flexible circuit board is bound to one side of the driving substrate, on which the light emitting device is arranged, the other end of the first flexible circuit board is bent to one side of the driving substrate, which is away from the light emitting device, and is connected with one end of the second flexible circuit board through a connector, and the other end of the second flexible circuit board passes through the slot to reach one side of the backboard, which is away from the light emitting substrate;
the flexible circuit board structure comprises peripheral areas positioned at two sides of the connector in the extending direction of the flexible circuit board structure; the peripheral region is provided with a raised structure and/or an opening for connecting the connector; at least part of the peripheral area is fixed on one side of the driving substrate, which is away from the light emitting device.
10. A display module, comprising:
a display panel;
a backlight module according to any one of claims 5 to 9, located on the light entry side of the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310484855.5A CN116500829A (en) | 2023-04-27 | 2023-04-27 | Backlight module manufacturing method, backlight module and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310484855.5A CN116500829A (en) | 2023-04-27 | 2023-04-27 | Backlight module manufacturing method, backlight module and display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116500829A true CN116500829A (en) | 2023-07-28 |
Family
ID=87324446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310484855.5A Pending CN116500829A (en) | 2023-04-27 | 2023-04-27 | Backlight module manufacturing method, backlight module and display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116500829A (en) |
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2023
- 2023-04-27 CN CN202310484855.5A patent/CN116500829A/en active Pending
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