CN116497325A - Surface protection modification method for neodymium-iron-boron magnet for magnetic squeezing - Google Patents

Surface protection modification method for neodymium-iron-boron magnet for magnetic squeezing Download PDF

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Publication number
CN116497325A
CN116497325A CN202310322019.7A CN202310322019A CN116497325A CN 116497325 A CN116497325 A CN 116497325A CN 202310322019 A CN202310322019 A CN 202310322019A CN 116497325 A CN116497325 A CN 116497325A
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magnetic
magnet
magnetron sputtering
transition layer
prepared
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周庆
廖雪峰
何潇
曾炜炜
唐永利
卢其云
卢赐福
唐仁衡
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Guangdong Shengyuan Permanent Magnet Material Co ltd
Institute of Resource Utilization and Rare Earth Development of Guangdong Academy of Sciences
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Guangdong Shengyuan Permanent Magnet Material Co ltd
Institute of Resource Utilization and Rare Earth Development of Guangdong Academy of Sciences
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Priority to CN202310322019.7A priority Critical patent/CN116497325A/en
Publication of CN116497325A publication Critical patent/CN116497325A/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • C23C14/0036Reactive sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0688Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3435Applying energy to the substrate during sputtering
    • C23C14/345Applying energy to the substrate during sputtering using substrate bias
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0253Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets
    • H01F41/026Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets protecting methods against environmental influences, e.g. oxygen, by surface treatment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/70Wind energy
    • Y02E10/72Wind turbines with rotation axis in wind direction

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Abstract

The invention discloses a method for protecting and modifying the surface of a neodymium-iron-boron magnet for magnetic pressing, which comprises the following steps: ti metal and Ti-Cu alloy are used as targets, a Ti metal transition layer is firstly prepared on the surface of a sintered NdFeB magnet matrix by magnetron sputtering, and then a TiN-Cu composite coating is prepared on the Ti metal transition layer, so that the NdFeB magnet for magnetic squeezing is prepared. Thicker coatings can be deposited on the magnet surface in a shorter period of time. The method is environment-friendly, accords with the environment-friendly development concept, and has good mechanical property, higher hardness, better toughness and good scratch resistance of the coating; the binding force between the plating layer and the magnet is good, and the plating layer is not easy to fall off. The plating layer has good chemical stability and good antibacterial property. Solves the problems of poor corrosion resistance and poor antibacterial property of the magnetic device for magnetic anastomosis in the prior art.

Description

Surface protection modification method for neodymium-iron-boron magnet for magnetic squeezing
Technical field:
the invention relates to the technical field of surface protection of neodymium-iron-boron permanent magnets for magnetic squeezing, in particular to a method for surface protection modification of a neodymium-iron-boron permanent magnet for magnetic squeezing.
The background technology is as follows:
magnetic squeezing techniques utilize the special properties of magnetic forces to accomplish certain specific operations in the clinic, such as connecting and recanalizing viscera, squeezing and closing tissues, restricting the contents of a lumen, etc. Magnetic anastomosis is an important branch of magnetic squeezing technology, and is essentially a technology for completing anastomosis or recanalization of tissue lumen by using magnetic force instead of pulling force of suture and titanium nails. At present, magnetic anastomosis is mainly applied to digestive tract cavity anastomosis, digestive tract occlusion or narrow recanalization and vascular anastomosis in clinic.
The neodymium-iron-boron rare earth permanent magnet material is an ideal material for magnetic pressing technology because of having excellent magnetic performance. However, since commercial sintered neodymium-iron-boron magnets have a multiphase structure and many voids exist on the surface, the commercial sintered neodymium-iron-boron magnets are easy to react with external media and corrode. In addition, if the magnetic device is not subjected to any surface treatment, it may disintegrate when implanted in the body, resulting in the attenuation of the magnetic force and failure to complete the corresponding anastomosis; in addition, the disintegration of the magnet may release harmful metal ions, jeopardizing the body. Therefore, the in vivo implantation harmless surface treatment of the magnetic device for magnetic anastomosis is a primary consideration for animal experiments and clinical application. Aiming at the problem of poor corrosion resistance of the NdFeB magnet, a common effective method is to deposit a corrosion-resistant metal coating on the surface of the magnet by a chemical or physical method, thereby improving the corrosion resistance of the magnet. Traditional nickel/copper/nickel (Ni-Cu-Ni), zinc (Zn) plating and nickel (Ni) plating processes are mature, but the biocompatibility is poor, and rejection reaction is easy to generate. In addition, the electroplating process is not friendly to the environment and does not accord with the green environment protection concept.
Therefore, how to prepare the neodymium-iron-boron magnet with good biocompatibility and corrosion resistance is one of the problems which need to be solved in the industrialization of the magnetic device for magnetic anastomosis at present.
The invention comprises the following steps:
the invention aims to provide a method for protecting and modifying the surface of a neodymium-iron-boron magnet for magnetic pressing, which solves the problems of poor corrosion resistance and poor antibacterial property of a magnetic device for magnetic anastomosis in the prior art.
The invention is realized by the following technical scheme:
a method for protecting and modifying the surface of a neodymium-iron-boron magnet for magnetic pressing comprises the following steps: ti metal and Ti-Cu alloy are used as targets, a Ti metal transition layer is firstly prepared on the surface of a sintered NdFeB magnet matrix by magnetron sputtering, and then a TiN-Cu composite coating is prepared on the Ti metal transition layer, so that the NdFeB magnet for magnetic squeezing is prepared.
Preferably, the Ti metal transition layer has a thickness of 50-200nm.
The thickness of the TiN-Cu composite coating is 2-7 mu m.
Preferably, the purity of the Ti metal and Ti-Cu alloy target is 99.99%.
Preferably, in the Ti-Cu alloy target, the content of Ti is 85-98 wt.% and the content of Cu is 2-15 wt.% based on 100% of the total mass percent.
More preferably, the Ti-Cu alloy target contains 88-95 wt.% Ti and 5-12 wt.% Cu, based on 100% total mass.
The sintered NdFeB magnet used in the present invention is not particularly limited in its source, and is preferably of the brand N38 to N48.
Preferably, the substrate is sputtered and cleaned for 10-20 min under the negative bias of Ar gas pressure of 1Pa, -800 to-1000V before the Ti metal transition layer is prepared by magnetron sputtering.
Preferably, the magnetron sputtering deposition of the Ti metal transition layer is performed under Ar atmosphere with pressure of 0.5-1.0 Pa.
Preferably, the temperature of the matrix during magnetron sputtering deposition of the Ti metal transition layer is 20-200 ℃.
Preferably, the power density of the Ti metal transition layer is 5.5-6.5W/cm during magnetron sputtering deposition 2
Preferably, the base bias voltage is 0 to-300V in the magnetron sputtering deposition of the Ti metal transition layer.
Preferably, the sputtering time of the Ti metal transition layer is 3-8 min during magnetron sputtering deposition.
Preferably, the magnetron sputtering deposition of the TiN-Cu composite coating is carried out on N with the pressure of 0.5Pa to 1.0Pa 2 and/Ar under a mixed atmosphere.
Preferably, N is N during magnetron sputtering deposition of the TiN-Cu composite coating 2 N in Ar mixing atmosphere 2 The partial pressure ratio of Ar is (0.1-0.4): 1.
Preferably, the temperature of the matrix is 20-200 ℃ during magnetron sputtering deposition of the TiN-Cu composite coating.
Preferably, the power density of the TiN-Cu composite coating is 5.5-6.5W/cm during magnetron sputtering deposition 2
Preferably, the base bias voltage is 0 to 300V in the magnetron sputtering deposition of the TiN-Cu composite coating.
Preferably, the sputtering time of the TiN-Cu composite coating is 30-180 min during magnetron sputtering deposition.
Compared with the existing magnetic pressing magnet surface protection technology, the invention has the following advantages:
(1) The plating layer has good mechanical property, higher hardness, better toughness and good scratch resistance; the binding force between the plating layer and the magnet is good, and the plating layer is not easy to fall off.
(2) The plating layer has good chemical stability and good antibacterial property.
(3) The sputtering rate of the plating layer is accelerated, and thicker plating layers can be deposited on the surface of the magnet in shorter time.
(4) The preparation method of the coating is environment-friendly and accords with the environment-friendly idea of green development.
The specific embodiment is as follows:
the following is a further illustration of the invention and is not a limitation of the invention.
Example 1:
in the embodiment, a Ti metal target and a Ti-Cu alloy target material with 6wt.% of Cu (Cu accounts for 6wt.% based on 100% of the total mass of the alloy target material) are adopted to prepare a surface coating of the neodymium-iron-boron magnet for magnetic squeezing through magnetron sputtering:
(1) Customizing a Ti metal target and a Ti-Cu alloy target containing 6wt.% Cu according to the size of the target of the magnetron sputtering system;
(2) Using an N42 sintered NdFeB magnet as a matrix, polishing the matrix to a mirror surface, ultrasonically cleaning the matrix in acetone and absolute ethyl alcohol for 15 minutes, and then placing the matrix in a 50 ℃ oven for drying;
(3) Mounting a Ti metal target and a Ti-Cu alloy sputtering target to two target positions connected with a direct current sputtering power supply, adjusting the distance between a matrix and the target to 80mm, placing a dried sample on a sample table, vacuumizing, starting infrared baking to 150 ℃, vacuumizing to the background vacuum degree, closing the vacuum baking, and cooling the matrix to the room temperature;
(4) Argon (Ar) is introduced into the vacuum chamber to 1Pa, negative bias of-900V is applied to the substrate, the direct current sputtering system is started, and the sample is sputtered and cleaned for 15min under the negative bias;
(5) Gradually reducing Ar gas flow, maintaining vacuum degree at 0.8Pa, adjusting negative bias to-80V, setting substrate temperature at 150deg.C, and using 6.0W/cm 2 The power density deposition of (2) is 5min, and a Ti transition layer with the thickness of 100nm can be deposited;
(6) Gradually reducing Ar gas flow, introducing N 2 N in mixed atmosphere 2 The partial pressure ratio of Ar was 0.3:1 to maintain the vacuum at 0.8Pa, the negative bias was adjusted to-80V, the substrate temperature was set at 150℃and 6.0W/cm was used 2 The power density deposition of (2) is 90min, and a TiN-Cu plating layer with the thickness of 5 mu m can be deposited;
(7) And after the deposition is finished, turning off a sputtering coating power supply, pumping to background vacuum, cooling the furnace to room temperature, and taking out the sample.
In the embodiment, after the surface coating process, the surface of the prepared Ti/TiN-Cu coating is compact and smooth, and the hardness is 6.3GPa; the binding force between the coating and the substrate is high, the critical load is 30N when the scratch test is completely dropped, the coating is not broken under the impact of the impact, the coating is not dropped, and the requirements of most scratch-resistant and corrosion-resistant coatings can be met. The magnetic properties of the magnet, such as coercive force, remanence and maximum magnetic energy product, are not significantly changed. The plating layer has good chemical stability, and the surface has no color change after being subjected to a salt spray test for 72 hours. The plating layer has good antibacterial property and can effectively inhibit the growth of escherichia coli, helicobacter pylori and staphylococcus.
Comparative example 1:
reference example 1 was different in that a Ti transition layer of 100nm thickness and a TiN-Cu plating layer of 5 μm were deposited by multi-arc ion plating instead of magnetron sputtering. It takes 30min to deposit a Ti transition layer with a thickness of 100nm and 180min to deposit a TiN-Cu plating layer with a thickness of 5 μm. The surface of the obtained Ti/TiN-Cu plating layer is compact and flat, and the hardness is 4.1GPa; the binding force between the coating and the substrate is high, and the critical load is 15N when the scratch test is completely dropped. The magnetic properties of the magnet, such as coercive force, remanence and maximum magnetic energy product, are not significantly changed. The plating layer has good chemical stability, and the surface has no color change after being subjected to a salt spray test for 72 hours. The plating layer has good antibacterial property and has a certain inhibition effect on the growth of escherichia coli, helicobacter pylori and staphylococcus.
Comparative example 2:
referring to example 1, a Ti metal transition layer was first prepared on the surface of a sintered neodymium-iron-boron magnet substrate by magnetron sputtering, except that an aluminum plating layer was then prepared on the Ti metal transition layer. The surface of the Ti/Al coating is compact and smooth, and the hardness is 3.4GPa; the binding force between the coating and the substrate is high, and the critical load is 15N when the scratch test is completely dropped. The magnetic properties of the magnet, such as coercive force, remanence and maximum magnetic energy product, are not significantly changed. The plating layer has good chemical stability, and the surface has no color change after being subjected to a salt spray test for 72 hours. The plating layer has good antibacterial property and has a certain inhibition effect on the growth of escherichia coli, helicobacter pylori and staphylococcus.
As can be seen from comparison between the example 1 and the comparative example 1, the magnetron sputtering rate is higher, the hardness of the obtained Ti/TiN-Cu plating layer is higher, the bonding force between the Ti/TiN-Cu plating layer and the magnet is good, and the Ti/TiN-Cu plating layer is not easy to fall off.
As can be seen from comparison between the example 1 and the comparative example 2, in the example 1, the Ti metal transition layer is first prepared on the surface of the sintered neodymium-iron-boron magnet matrix by magnetron sputtering, and then the TiN-Cu composite coating is prepared on the Ti metal transition layer, so that the TiN-Cu composite coating has higher hardness than the aluminum coating prepared on the Ti metal transition layer, has good binding force with the magnet, and is not easy to fall off.
Example 2:
in the embodiment, a Ti metal target and a Ti-Cu alloy target material with 2wt.% of Cu (Cu accounts for 2wt.% based on 100% of the total mass of the alloy target material) are adopted to prepare a surface coating of a neodymium-iron-boron magnet for magnetic squeezing through magnetron sputtering:
(1) Customizing a Ti metal target and a Ti-Cu alloy target containing 15wt.% Cu according to the size of the target of the magnetron sputtering system;
(2) Using an N48 sintered NdFeB magnet as a matrix, polishing the matrix to a mirror surface, ultrasonically cleaning the matrix in acetone and absolute ethyl alcohol for 15 minutes, and then placing the matrix in a 50 ℃ oven for drying;
(3) Mounting a Ti metal target and a Ti-Cu alloy sputtering target to two target positions connected with a direct current sputtering power supply, adjusting the distance between a matrix and the target to 80mm, placing a dried sample on a sample table, vacuumizing, starting infrared baking to 150 ℃, vacuumizing to the background vacuum degree, closing the vacuum baking, and cooling the matrix to the room temperature;
(4) Argon (Ar) is introduced into the vacuum chamber to 1Pa, negative bias of-800V is applied to the substrate, the direct current sputtering system is started, and the sample is sputtered and cleaned for 10min under the negative bias;
(5) Gradually reducing Ar gas flow, maintaining vacuum degree at 0.5Pa, adjusting negative bias to 0V, setting substrate temperature at 20deg.C, and using 5.5W/cm 2 The power density of the Ti transition layer is deposited for 3min, and the Ti transition layer with the thickness of about 50nm can be deposited;
(6) Gradually reducing Ar gas flow, introducing N 2 N in mixed atmosphere 2 Partial pressure of ArThe vacuum was maintained at 0.5Pa at a pressure ratio of 0.1:1, the negative bias was adjusted to 0V, the substrate temperature was set at 20deg.C, and the vacuum was maintained at 5.5W/cm 2 For 30min, can deposit TiN-Cu plating layer with the thickness of about 2 mu m;
(7) And after the deposition is finished, turning off a sputtering coating power supply, pumping to background vacuum, cooling the furnace to room temperature, and taking out the sample.
In the embodiment, after the surface coating process, the surface of the prepared Ti/TiN-Cu coating is compact and flat, and the hardness is 5.1GPa; the binding force between the coating and the substrate is high, the critical load is more than 27N when the scratch test is completely fallen, the coating is not broken under the impact of the impact, and the coating is not fallen, so that the coating can meet the requirements of most scratch-resistant and corrosion-resistant coatings. The magnetic properties of the magnet, such as coercive force, remanence and maximum magnetic energy product, are not significantly changed. The plating layer has good chemical stability, and the surface has no color change after being subjected to a salt spray test for 72 hours. The plating layer has good antibacterial property and can effectively inhibit the growth of escherichia coli, helicobacter pylori and staphylococcus.
Example 3:
in the embodiment, a Ti metal target and a Ti-Cu alloy target material with 2wt.% of Cu (Cu accounts for 2wt.% based on 100% of the total mass of the alloy target material) are adopted to prepare a surface coating of a neodymium-iron-boron magnet for magnetic squeezing through magnetron sputtering:
(1) Customizing a Ti metal target and a Ti-Cu alloy target containing 2wt.% Cu according to the size of the target of the magnetron sputtering system;
(2) Using an N38 sintered NdFeB magnet as a matrix, polishing the matrix to a mirror surface, ultrasonically cleaning the matrix in acetone and absolute ethyl alcohol for 15 minutes, and then placing the matrix in a 50 ℃ oven for drying;
(3) Mounting a Ti metal target and a Ti-Cu alloy sputtering target to two target positions connected with a direct current sputtering power supply, adjusting the distance between a matrix and the target to 80mm, placing a dried sample on a sample table, vacuumizing, starting infrared baking to 150 ℃, vacuumizing to the background vacuum degree, closing the vacuum baking, and cooling the matrix to the room temperature;
(4) Argon (Ar) is introduced into the vacuum chamber to 1Pa, negative bias of-1000V is applied to the substrate, the direct current sputtering system is started, and the sample is sputtered and cleaned for 20min under the negative bias;
(5) Gradually becomeReducing Ar gas flow, maintaining vacuum degree at 1.0Pa, adjusting negative bias to-300V, setting substrate temperature at 200deg.C, and using 6.5W/cm 2 For 8min, a Ti transition layer with a thickness of about 200nm can be deposited;
(6) Gradually reducing Ar gas flow, introducing N 2 N in mixed atmosphere 2 The partial pressure ratio of Ar was 0.4:1 to maintain the vacuum at 1.0Pa, the negative bias was adjusted to-300V, the substrate temperature was set at 200℃and 6.5W/cm was used 2 180min, can deposit TiN-Cu plating layer with the thickness of about 7 mu m;
(7) And after the deposition is finished, turning off a sputtering coating power supply, pumping to background vacuum, cooling the furnace to room temperature, and taking out the sample.
In the embodiment, after the surface coating process, the surface of the prepared Ti/TiN-Cu coating is compact and flat, and the hardness is 7.6GPa; the binding force between the coating and the substrate is high, the critical load is more than 32N when the scratch test is completely fallen, the coating is not broken under the impact of the impact, and the coating is not fallen, so that the requirements of most scratch-resistant and corrosion-resistant coatings can be met. The magnetic properties of the magnet, such as coercive force, remanence and maximum magnetic energy product, are not significantly changed. The plating layer has good chemical stability, and the surface has no color change after being subjected to a salt spray test for 72 hours. The plating layer has good antibacterial property and can effectively inhibit the growth of escherichia coli, helicobacter pylori and staphylococcus.

Claims (10)

1. The method for protecting and modifying the surface of the neodymium-iron-boron magnet for magnetic pressing is characterized by comprising the following steps of: ti metal and Ti-Cu alloy are used as targets, a Ti metal transition layer is firstly prepared on the surface of a sintered NdFeB magnet matrix by magnetron sputtering, and then a TiN-Cu composite coating is prepared on the Ti metal transition layer, so that the NdFeB magnet for magnetic squeezing is prepared.
2. The method according to claim 1, wherein the Ti metal transition layer has a thickness of 50-200nm; the thickness of the TiN-Cu composite coating is 2-7 mu m.
3. The method of claim 1, wherein the Ti metal and Ti-Cu alloy target has a purity of 99.99%.
4. The method according to claim 1, wherein the Ti-Cu alloy target has a Ti content of 85-98 wt.% and a Cu content of 2-15 wt.%, based on 100% by mass of the total.
5. The method according to claim 1, wherein the Ti-Cu alloy target has a Ti content of 88 to 95wt.% and a Cu content of 5 to 12wt.%, based on 100% by mass of the total.
6. The method according to claim 1, wherein the substrate is sputter cleaned for 10-20 min under a negative bias of Ar gas pressure of 1Pa, -800 to-1000V before the Ti metal transition layer is prepared by magnetron sputtering.
7. The method according to claim 1, wherein the magnetron sputter deposition of the Ti metal transition layer is performed under Ar atmosphere at a pressure of 0.5 to 1.0 Pa; the temperature of the matrix is 20-200 ℃ and the bias voltage of the matrix is 0-300V during magnetron sputtering deposition; the power density is 5.5-6.5W/cm during the magnetron sputtering deposition 2 The method comprises the steps of carrying out a first treatment on the surface of the The sputtering time is 3-8 min.
8. The method according to claim 1, wherein the TiN-Cu composite coating is deposited by magnetron sputtering at a pressure of 0.5 to 1.0Pa of N 2 and/Ar under a mixed atmosphere.
9. The method of claim 8, wherein N 2/ N in Ar Mixed atmosphere 2/ Ar has a partial pressure ratio of (0.1 to 0.4): 1.
10. The method according to claim 1, wherein the temperature of the substrate during the magnetron sputtering deposition of the TiN-Cu composite coating is 20-200 ℃; the substrate bias voltage is 0 to-300V, the sputtering time is 30 to 180min, and the power density is 5.5 to 6.5W/cm 2
CN202310322019.7A 2023-03-29 2023-03-29 Surface protection modification method for neodymium-iron-boron magnet for magnetic squeezing Pending CN116497325A (en)

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