CN116497313A - cBN/AlN nano-composite cutter coating based on template effect growth and preparation method thereof - Google Patents
cBN/AlN nano-composite cutter coating based on template effect growth and preparation method thereof Download PDFInfo
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- 238000000576 coating method Methods 0.000 title claims abstract description 130
- 239000011248 coating agent Substances 0.000 title claims abstract description 124
- 230000000694 effects Effects 0.000 title claims abstract description 17
- 239000002114 nanocomposite Substances 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 21
- 230000001427 coherent effect Effects 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 10
- 229910052582 BN Inorganic materials 0.000 claims abstract description 9
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 238000004544 sputter deposition Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 37
- 238000005477 sputtering target Methods 0.000 claims description 27
- 239000010408 film Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 14
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 7
- 229910000997 High-speed steel Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 239000002103 nanocoating Substances 0.000 claims description 2
- 239000013077 target material Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 230000009466 transformation Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 9
- 239000011247 coating layer Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 6
- 229910000831 Steel Inorganic materials 0.000 abstract description 3
- 229910001069 Ti alloy Inorganic materials 0.000 abstract description 3
- 239000010959 steel Substances 0.000 abstract description 3
- 238000010849 ion bombardment Methods 0.000 abstract description 2
- 230000035939 shock Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910000851 Alloy steel Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910000797 Ultra-high-strength steel Inorganic materials 0.000 description 1
- 238000000026 X-ray photoelectron spectrum Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0617—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
- C23C14/0647—Boron nitride
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
Abstract
A cubic boron nitride/aluminum nitride (cBN/AlN) nano-composite cutter coating based on template effect growth and a preparation method thereof are characterized in that the composite cutter coating structure sequentially comprises the following components from inside to outside: the base template material is AlN coating-cBN coating-AlN coating-cBN coating … …, wherein the cBN/AlN nano-composite tool coating is characterized in that the cBN coating is arranged on the outermost layer, the AlN coating alternately grows inside, and the thicknesses of the cBN coating and the AlN coating inside are within the critical coherent thickness range. The invention can effectively reduce the residual stress in the film caused by the ion bombardment effect. The cBN/AlN nano-composite tool coating grown based on the template effect reaches or exceeds the hardness of the cBN coating, and meanwhile, the toughness of the composite coating is increased by utilizing a heterogeneous interface in the coating, so that the wear resistance and the shock resistance of the coated tool are improved, and the coating is used for high-speed cutting processing of difficult-to-process materials such as titanium alloy, high-temperature alloy, high-strength steel, composite material and the like.
Description
Technical Field
The invention relates to a superhard coating preparation technology for tools, in particular to a cBN/AlN nanocomposite cutter coating based on template effect growth and a preparation method thereof, and specifically relates to a cBN/AlN nanocomposite cutter coating which is formed by introducing a template transition layer on a hard alloy/high-speed steel/ceramic cutter substrate through multi-target unbalanced magnetron sputtering on the cutter surface, growing a nano cubic aluminum nitride coating on the template transition layer surface, and then alternately growing the nano cubic aluminum nitride and the nano cubic boron nitride serving as templates.
Background
With the continuous progress of national economy and scientific technology, the development of novel materials is gradually changed day by day, and difficult-to-process materials such as titanium alloy, high-temperature alloy, ultra-high strength steel, composite material, engineering ceramics and the like are increasingly applied to the modern industry. However, the cutter bears harsh working conditions such as high temperature, high pressure and the like in the cutting process of difficult-to-machine materials, so that the cutter has serious abrasion and short service life. For example, in the milling of superalloy blades of an aeroengine, the cutter is severely worn, and the consumption of the cutter is 6-10 times that of common milling materials, so that the cutter becomes a main factor which seriously affects the processing quality and efficiency of workpieces. Traditional high-speed steel and hard alloy cutters are seriously worn in the cutting process, and the service life of the cutters is short. Although the ceramic tool has high hardness and wear resistance, the ceramic tool has low toughness, and chipping easily occurs in a high-speed cutting process, resulting in tool failure. Therefore, the development and the preparation of the high-quality cutter with the performances of high hardness, high bearing capacity, good toughness, good chemical stability, excellent friction and wear and the like meet the urgent demands of the manufacturing industry in China on the domestic high-performance cutter.
The cubic boron nitride (Cubic Nitride Boron, cBN) is a high-hardness material with hardness which is only inferior to that of diamond in the currently known materials, has extremely high wear resistance, stable chemical property, thermal conductivity reaching 13W/(cm multiplied by K), about 3-4 times of copper, and extremely stable chemical property when processing ferrous metal under high temperature conditions, and is an ideal cutter material for processing high-temperature alloy, titanium alloy, high-strength steel and the like. The cBN cutters on the market at present are mainly polycrystalline cubic boron nitride (PcBN) cutters, but the excellent wear resistance of cBN cannot be fully exerted due to the existence of a binder. The cBN coated tool is suitable for tool substrates with any complex shape, the expected cost is far lower than that of the PcBN tool after industrial production is realized, and the tool coated tool is one of the tool coated materials with the most development prospect for cutting and processing difficult-to-process materials such as high-temperature alloy, high-strength steel and the like. Through many years of efforts of researchers, the cBN coating preparation technology has significantly advanced, and the quality of the cBN coating is further improved. However, up to now, the high stress and high brittleness of the cBN coating have not been solved in a breakthrough manner, and the difference in physical properties between the cBN coating and the tool substrate and the large number of defects in the coating caused by the large ion bombardment energy necessary for cBN formation are the main causes of the large internal stress of the cBN coating, and the high stress causes the poor spalling resistance of the coating; in addition, the cBN coating belongs to a brittle material, so that the high brittleness is easy to cause the fracture of the tool coating, and the application of the cBN coated tool is greatly restricted.
The formation of high quality cBN coatings under low energy particle bombardment conditions and the increase in toughness of the tool coating without decreasing the coating strength are major problems that need to be addressed by cBN coated tool trend applications. According to the invention, the toughness of the cBN coating of the tool is improved, the stress of the coating is reduced, the cubic aluminum nitride (AlN) is selected as a modulation layer, and the cBN/AlN nano multi-layer composite coating is grown through the template effect of the modulation layer, so that the preparation technology of the cBN/AlN multi-layer structure coating tool with independent intellectual property rights is obtained, the technical bottleneck existing in the industrial application of the conventional cBN coating tool is broken through, and the requirements of modern manufacturing industry on the high-performance coating tool are met.
Disclosure of Invention
The invention aims to solve the problems of large internal stress and low toughness of a cBN tool coating, invents a cBN/AlN nano-composite tool coating based on template effect growth, and simultaneously provides a corresponding preparation method.
One of the technical schemes of the invention is as follows:
a cubic boron nitride/aluminum nitride (cBN/AlN) nano-composite cutter coating based on template effect growth is characterized in that: the coating structure of the composite cutter is as follows from inside to outside in sequence: the base template material is AlN coating-cBN coating-AlN coating-cBN coating … …, wherein the cBN/AlN nano-composite tool coating is characterized in that the cBN coating is arranged on the outermost layer, the AlN coating alternately grows inside, and the thicknesses of the cBN coating and the AlN coating inside are within the critical coherent thickness range.
The base die material comprises TiN or other thin film materials.
The second technical scheme of the invention is as follows:
a preparation method of a cBN/AlN nano-composite cutter coating based on template effect growth is characterized by comprising the following steps: it comprises the following steps:
1) Pre-sputtering the surface of a cutter;
placing the cutter matrix cleaned by the acetone solution into a vacuum deposition cavity, introducing Ar gas, opening an anode layer linear ion source, applying bias to the cutter substrate, and carrying out particle bombardment on the cutter matrix for 10-20 min; then N is introduced into 2 Ar and N 2 The mixed particles bombard the cutter substrate for 5-10 min.
2) Growing a template transition layer;
and opening a sputtering target 1 in the multi-target unbalanced magnetron sputtering system, and growing a template layer on the surface of the pretreated cutter substrate, wherein the thickness of the coating is kept between 400nm and 600 nm.
3) Co-growing c-AlN and cBN coatings;
c-AlN coating grows on the surface of the substrate template coating in a coherent manner by using a sputtering target 2 in a multi-target unbalanced magnetron sputtering system, and the thickness of the coating is controlled to be equal to or lower than the critical coherent thickness; and then c-AlN coating is used as a template material for cBN growth, and a sputtering target 3 in a multi-target unbalanced magnetron sputtering system is used for co-growing the cBN coating, wherein the thickness of the coating is controlled to be equal to or lower than the critical co-growing thickness.
4) Preparing a cBN/AlN nano multi-layer cutter coating;
and c-AlN and cBN nano-coatings are alternately grown on the surface of the cutter matrix by controlling technological parameters through alternate sputtering deposition of a sputtering target 2 and a sputtering target 3 in a multi-target unbalanced magnetron sputtering system. The total thickness of the adjacent cBN and AlN coating is a modulation period, the thickness ratio of the adjacent cBN and AlN coating is a modulation ratio, the modulation period and the modulation ratio are controllable and adjustable, but the thickness of each layer is below the critical coherent thickness of the coating, and the total thickness of the coating is controlled between 3 and 5 mu m.
The tool matrix comprises hard alloy, high-speed steel or ceramic tools.
The pre-sputtering of the surface of the cutter comprises a stage of Ar particle bombardment of the surface of a substrate (pure Ar=40 sccm) and Ar/N 2 The particle bombarding the surface of the substrate, the total flow of gas is 40 sccm, wherein Ar/N 2 =1:4; the working air pressure in the bombardment process is kept between 0.4Pa and 0.8Pa, the linear ion source power of the anode layer is between 50W and 300W, and the substrate is biased at-250V to-350V.
The template layer mainly comprises TiN, VC and other coatings.
The c-AlN and cBN coating grows in a coherent mode, namely c-AlN grows on the surface of the template layer in a sputtering mode, a sputtering target material is a metal Al target with purity of 99.99%, a direct-current sputtering power supply is adopted, and sputtering power is 100W; and c-AlN is sputtered on the surface to grow cBN, the sputtering target is an hBN target with hot-pressed purity of 99.99%, a radio frequency sputtering power supply is adopted, and the radio frequency power is 250W. Other process parameters include: background vacuum: 5.0X10 -4 Pa; substrate temperature: 500 ℃; anode source power 100W; the total flow of gas is 35sccm, where N 2 Ar=1:6; deposition air pressure: 0.8Pa. The critical total thickness c-AlN coating is 10nm, the cBN critical total thickness is 16 and nm, and substrate bias is not applied in the growth process.
In the preparation of the cBN/AlN nano multilayer coating cutter, the preparation process parameters of the cBN and AlN coating refer to the growth process parameters of two coatings in claim 3), and the specific coating thickness is adjusted by controlling the growth time.
The invention works by using at least three sputtering targets, wherein a first target is used for sputtering and growing a substrate template film, a second target is used for sputtering and growing an AlN film, and a third target is used for sputtering and growing a cBN film, wherein a bottom film is a template layer of the upper film, and stable phase-to-metastable phase transformation of the film is realized through interfacial coherent stress of the template film and a heterogeneous film, so that metastable phase c-AlN and cBN films are obtained.
According to the invention, the radio frequency magnetron sputtering equipment is adopted to grow cBN based on the template effect and alternately deposit the AlN coating and the cBN coating, so that the cBN/AlN composite tool coating with the nano multilayer composite structure is formed, and compared with the existing cubic boron nitride coating tool, the radio frequency magnetron sputtering equipment has the following remarkable advantages:
1) The cBN coating can be grown on the basis of the template effect, so that the particle bombardment energy in the cBN growth process can be obviously reduced, the internal defects of the coating are reduced, and the compactness of the coating is improved.
2) The bombardment energy in the cBN growth process is reduced, the internal stress of the coating can be obviously reduced, and the binding force between the coating and the cutter substrate is improved.
3) The cBN/AlN multilayer composite structure is adopted, so that a heterogeneous interface in the coating is increased, crack growth in the coating is prevented, the toughness of the coating is further improved, and the fatigue resistance of the coating is improved.
4) The process has low cost and high efficiency, and is beneficial to the large-scale production of the coated cutting tool.
Drawings
FIG. 1 is a schematic diagram of a coating structure of a cBN/AlN nanocomposite tool grown based on the template effect according to the present invention.
FIG. 2 shows XPS spectra of boron nitride coating surfaces.
FIG. 3 SEM topography of the cubic boron nitride coating surface.
Description of the embodiments
The invention is further illustrated by the following examples in conjunction with the accompanying drawings:
examples
The cBN/AlN nano-composite cutter coating based on template effect growth is prepared by the following steps:
1) Pre-sputtering the surface of a cutter;
placing the hard alloy or high-speed steel tool matrix cleaned by acetone solution into a vacuum deposition cavity, and adjusting the background vacuum degree of the cavity to be 5.0x10 -4 Pa; introducing Ar gas, wherein the total flow of the Ar gas is 40 sccm, opening an anode layer linear ion source, adjusting the power to 100W, applying bias voltage to a cutter substrate to 250V, and carrying out particle bombardment on a cutter substrate for 15min; then adjusting the flow control valve, and introducing N 2 Flow rate was 8 sccm, flowThe quantity control valve reduces the Ar flow to 32 sccm, ar and N 2 The mixed particles bombard the tool substrate for 5 min.
2) Template transition layer growth
Adjusting the background vacuum degree of the cavity: 5.0X10 -4 Pa; substrate temperature: 400 ℃; anode source power 100W; the total flow of gas is 35sccm, where N 2 Ar=1:6; deposition air pressure: 0.8Pa, substrate bias-50V. And (3) turning on a direct-current sputtering power supply (sputtering target 1), adjusting the sputtering power to 100W, sputtering a metal Ti target with the purity of 99.999%, and growing a TiN template layer on the surface of the cutter substrate for 20min.
3) Co-grown c-AlN and cBN coating
Adjusting the background vacuum degree of the cavity: 5.0X10 -4 Pa; substrate temperature: 500 ℃; anode source power 100W; the total flow of gas is 35sccm, where N 2 Ar=1:6; deposition air pressure: 0.8Pa. Sequentially turning off a bias power supply and the sputtering target 1, turning on a direct-current sputtering power supply (sputtering target 2), adjusting the sputtering power to 100W, and sputtering a metal Al target with the purity of 99.999 percent for 3min; then, the sputtering target 2 was turned off, the radio frequency sputtering power source (sputtering target 3) was turned on, the radio frequency power was 250W, and the hot-pressed hBN target having a purity of 99.999% was sputtered for a sputtering growth time of 10min.
4) Preparation of cBN/AlN nano multilayer coating cutter
And (3) repeating the step (3) by a multi-target unbalanced magnetron sputtering method to form the cBN/AlN nano multi-layer coating shown in the figure 1. The total thickness of the adjacent cBN and AlN coating is a modulation period, the thickness ratio of the adjacent cBN and AlN coating is a modulation ratio, the modulation period and the modulation ratio are controllable and adjustable, but the total thickness of the coating is controlled to be about 3 mu m. The cBN/AlN nano multilayer coating cutter with low stress and good toughness is prepared, and a surface topography chart is shown in figure 3.
Examples
The cBN/AlN nano-composite cutter coating based on template effect growth is prepared by the following steps:
1) Pre-sputtering the surface of a cutter;
placing the hard alloy or high-speed steel tool matrix washed by the acetone solution into a vacuumIntroducing Ar gas into the empty deposition cavity, wherein the total flow of the Ar gas is 40 sccm, opening an anode layer linear ion source, adjusting the power to 100W, applying bias voltage to a cutter substrate to 250V, and carrying out particle bombardment on a cutter substrate for 15min; then adjusting the flow control valve, and introducing N 2 The flow rate was 8 sccm, the flow control valve reduced the Ar flow rate to 32 sccm, ar and N 2 The mixed particles bombard the tool substrate for 5 min.
2) Growing a template transition layer;
adjusting the background vacuum degree of the cavity: 5.0X10 -4 Pa; substrate temperature: 400 ℃; anode source power 100W; the total flow of gas is 35sccm, where N 2 Ar=1:6; deposition air pressure: 0.8Pa, substrate bias-50V. And (3) turning on a direct-current sputtering power supply (sputtering target 1), adjusting the sputtering power to 100W, sputtering a metal V target with the purity of 99.999%, and growing a VN template layer on the surface of the cutter substrate for 20min.
3) Co-growing c-AlN and cBN coatings;
adjusting the background vacuum degree of the cavity: 5.0X10 -4 Pa; substrate temperature: 500 ℃; anode source power 100W; the total flow of gas is 35sccm, where N 2 Ar=1:6; deposition air pressure: 0.8Pa. Sequentially turning off a bias power supply and the sputtering target 1, turning on a direct-current sputtering power supply (sputtering target 2), adjusting the sputtering power to 100W, and sputtering a metal Al target with the purity of 99.999 percent for 3min; then, the sputtering target 2 was turned off, the radio frequency sputtering power source (sputtering target 3) was turned on, the radio frequency power was 250W, and the hot-pressed hBN target having a purity of 99.999% was sputtered for a sputtering growth time of 10min.
4) Preparing a cBN/AlN nano multilayer coating cutter;
and (3) repeating the step (3) by a multi-target unbalanced magnetron sputtering method to form the cBN/AlN nano multi-layer coating shown in the figure 1. The total thickness of the adjacent cBN and AlN coating is a modulation period, the thickness ratio of the adjacent cBN and AlN coating is a modulation ratio, the modulation period and the modulation ratio are controllable and adjustable, but the total thickness of the coating is controlled to be about 3 mu m. The cBN/AlN nano multilayer coating cutter with low stress and good toughness is prepared, and a surface topography chart is shown in figure 3.
Examples
The present embodiment differs from the first and second embodiments in that an insulating Si is used 3 N 4 The following conditions are satisfied when the insert is used as a base material: si is mixed with 3 N 4 Before TiN or VN is deposited on the surface of the blade, a layer of metal Ti or metal V is deposited on the surface of the blade, and the specific deposition technological parameters are as follows: adjusting the background vacuum degree of the cavity: 5.0X10 -4 Pa; anode source power 100W; the total flow rate of Ar gas is 35sccm; deposition air pressure: 0.8Pa, substrate bias-100V. And (3) turning on a direct-current sputtering power supply (sputtering target 1), adjusting the sputtering power to 100W, sputtering a metal Ti or V target with the purity of 99.99%, and growing a conductive transition layer on the surface of a cutter substrate, wherein the deposition time is 10min. The rest is the same as in the first and second embodiments.
The invention is not related in part to the same as or can be practiced with the prior art.
Claims (9)
1. A cubic boron nitride/aluminum nitride (cBN/AlN) nano-composite cutter coating based on template effect growth is characterized in that: the coating structure of the composite cutter is as follows from inside to outside in sequence: the base template material is AlN coating-cBN coating-AlN coating-cBN coating … …, wherein the cBN/AlN nano-composite tool coating is characterized in that the cBN coating is arranged on the outermost layer, the AlN coating alternately grows inside, and the thicknesses of the cBN coating and the AlN coating inside are within the critical coherent thickness range.
2. The composite tool coating according to claim 1, characterized in that: the base mold plate material comprises TiN or other thin film material.
3. A method for preparing a cBN/AlN nanocomposite cutter coating grown on the basis of the template effect as defined in claim 1, characterized by: the method comprises the following steps:
1) Pre-sputtering the surface of a cutter;
placing the cutter matrix cleaned by the acetone solution into a vacuum deposition cavity, introducing Ar gas, opening an anode layer linear ion source, applying bias to the cutter substrate, and carrying out particle bombardment on the cutter matrix for 10-20 min; then N is introduced into 2 Ar and N are used 2 Bombarding the cutter matrix with the mixed particles for 5-10 min;
2) Growing a template transition layer;
opening a first sputtering target in the multi-target unbalanced magnetron sputtering system, and growing a template layer on the surface of the cutter matrix after pre-sputtering, wherein the thickness of the coating is kept between 400nm and 600 nm;
3) Co-grown c-AlN and cBN coating
c-AlN coating grows on the surface of the substrate template coating in a coherent manner by using a second sputtering target in the multi-target unbalanced magnetron sputtering system, and the thickness of the c-AlN coating is controlled to be equal to or lower than the critical coherent thickness; then c-AlN coating is used as a template material for cBN growth, a third sputtering target in a multi-target unbalanced magnetron sputtering system is used for co-growing the cBN coating, and the thickness of the cBN coating is controlled to be equal to or lower than the critical co-operating thickness of the cBN coating;
4) Preparation of cBN/AlN nano-multilayer tool coating
c-AlN and cBN nano-coatings are alternately grown on the surface of the cutter matrix by controlling technological parameters through alternate sputtering deposition of a second sputtering target and a third sputtering target in a multi-target unbalanced magnetron sputtering system; the total thickness of the adjacent cBN and AlN coating is taken as a modulation period, the thickness ratio of the adjacent cBN and AlN coating is taken as a modulation ratio, the modulation period and the modulation ratio are controllable and adjustable, but the thickness of each layer is below the critical coherent thickness of the coating, and the total thickness of the coating is controlled between 3 and 5 mu m.
4. A method according to claim 3, characterized in that: the tool matrix comprises hard alloy, high-speed steel or ceramic tools.
5. A method according to claim 3, characterized in that: the pre-sputtering of the cutter surface comprises the stage of Ar particle bombardment of the cutter substrate surface and Ar/N 2 Particle co-bombarding the surface of the cutter matrix, wherein pure Ar=40 sccm, ar/N 2 The total flow of the gas was 40 sccm, ar/N 2 =1:4; the working air pressure in the bombardment process is maintained between 0.4Pa and 0.8Pa, the linear ion source power of the anode layer is between 50W and 300W, and the substrate is biased between-250V and-350V.
6. A method according to claim 3, characterized in that: the template layer comprises TiN and VC coating layers.
7. A method according to claim 3, characterized in that: the c-AlN and cBN coating grows in a coherent mode, namely c-AlN grows on the surface of the template layer by sputtering, a sputtering target material is a metal Al target with the purity of 99.999%, a direct-current sputtering power supply is adopted, and the sputtering power is 100W; the cBN is grown on the surface of the c-AlN by sputtering, the sputtering target is an hBN target with hot-pressed purity of 99.999%, a radio frequency sputtering power supply is adopted, and the radio frequency power is 250W; other process parameters include: background vacuum: 5.0X10 -4 Pa; substrate temperature: 500 ℃; anode source power 100W; the total flow of gas is 35sccm, where N 2 Ar=1:6; deposition air pressure: 0.8Pa; the critical total thickness c-AlN coating is 10nm, the cBN critical total thickness is 12 and nm, and substrate bias is not applied in the growth process.
8. The method according to claim 1, characterized in that: in the preparation of the cBN/AlN nano multilayer coating cutter, the preparation process parameters of the cBN and AlN coating refer to the growth process parameters of two coatings in claim 5, and the thickness of the coating is adjusted by controlling the growth time.
9. The method according to claim 1, characterized in that: at least three sputtering targets are used for working, wherein a first target is used for sputtering and growing a substrate template film, a second target is used for sputtering and growing an AlN film, and a third target is used for sputtering and growing a cBN film, wherein a bottom film is a template layer of the upper film, stable-phase to metastable-phase transformation of the film is realized through interfacial coherent stress between the template film and a heterogeneous film, and metastable-phase c-AlN and cBN films are obtained.
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