CN116494149B - Preparation process of ceramic resin bonding agent diamond grinding wheel - Google Patents
Preparation process of ceramic resin bonding agent diamond grinding wheel Download PDFInfo
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- CN116494149B CN116494149B CN202310609027.XA CN202310609027A CN116494149B CN 116494149 B CN116494149 B CN 116494149B CN 202310609027 A CN202310609027 A CN 202310609027A CN 116494149 B CN116494149 B CN 116494149B
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- benzoxazine
- polyimide
- ceramic resin
- grinding wheel
- benzoxazinyl
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- 239000011347 resin Substances 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 title claims abstract description 50
- 239000000919 ceramic Substances 0.000 title claims abstract description 42
- 238000000227 grinding Methods 0.000 title claims abstract description 40
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 31
- 239000010432 diamond Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000007767 bonding agent Substances 0.000 title claims description 10
- 229920001721 polyimide Polymers 0.000 claims abstract description 50
- 239000009719 polyimide resin Substances 0.000 claims abstract description 26
- 239000004642 Polyimide Substances 0.000 claims abstract description 24
- SNONAWYBSWWKSX-UHFFFAOYSA-N 2h-1,2-benzoxazin-3-ol Chemical compound C1=CC=C2ONC(O)=CC2=C1 SNONAWYBSWWKSX-UHFFFAOYSA-N 0.000 claims abstract description 22
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims abstract description 20
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 17
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims abstract description 14
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 14
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 13
- 239000004917 carbon fiber Substances 0.000 claims abstract description 13
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000008064 anhydrides Chemical group 0.000 claims abstract description 10
- 238000013007 heat curing Methods 0.000 claims abstract description 4
- 125000004622 benzoxazinyl group Chemical group O1NC(=CC2=C1C=CC=C2)* 0.000 claims description 32
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 24
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 8
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- 229940057995 liquid paraffin Drugs 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 238000004321 preservation Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000001723 curing Methods 0.000 claims description 5
- 239000008098 formaldehyde solution Substances 0.000 claims description 2
- 229920005575 poly(amic acid) Polymers 0.000 claims description 2
- 238000010992 reflux Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 abstract description 10
- 239000002253 acid Substances 0.000 abstract description 10
- 229920002647 polyamide Polymers 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005299 abrasion Methods 0.000 abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 12
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000013329 compounding Methods 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009837 dry grinding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention relates to the technical field of grinding wheels, and discloses a preparation process of a ceramic resin bond diamond grinding wheel, which is characterized in that the usage ratio of pyromellitic anhydride to 4, 4-diaminodiphenyl methane is controlled, a polyamide acid intermediate with an anhydride group is synthesized, and then the polyamide acid intermediate reacts with hydroxyl groups of phenolic hydroxyl benzoxazine to obtain benzoxazine polyimide resin, so that a benzoxazine structure is introduced into a molecular chain of polyimide, the benzoxazine structure is used as a main body of a resin bond, and is compounded with molybdenum disulfide, carbon fiber, silicon carbide and copper powder to obtain the benzoxazine polyimide ceramic resin bond, the benzoxazine group can form a phenolic resin structure in a heat curing process, the rigidity is high, the thermosetting property is good, and the obtained ceramic resin bond diamond grinding wheel has higher abrasion ratio and grinding efficiency.
Description
Technical Field
The invention relates to the technical field of grinding wheels, in particular to a preparation process of a ceramic resin bond diamond grinding wheel.
Background
The resin-based diamond grinding wheel has the advantages of high grinding efficiency, excellent self-sharpening property and the like, and is widely applied to grinding processing of materials such as glass, ceramics, alloys and the like, and the resin bonding agent mainly comprises phenolic resin, polyimide resin and the like.
The polyimide resin has good heat resistance, high strength and strong chemical stability, has wide application prospect in the grinding wheel resin bonding agent, and reports that the diamond resin grinding wheel obtained by adopting sodium hydroxide and silane coupling agent to carry out surface modification on the structural formula and compounding the structural formula with polyimide resin has excellent grinding ratio, sharpness and self-sharpening property, as in the literature 'influence of coupling agent treatment on the grinding performance of diamond resin grinding wheel'.
Patent CN115366013a, "bismaleimide resin grinding wheel for dry grinding", discloses a bismaleimide resin grinding wheel obtained by compounding modified bismaleimide resin, toughening agent polymethyl methacrylate and the like serving as raw materials with abrasive materials such as diamond and the like, silicon carbide, corundum, graphite, molybdenum disulfide, copper powder and the like, wherein toughness is improved, more uniform dispersion is achieved in the processing process, and compactness is improved.
Disclosure of Invention
(one) solving the technical problems
The invention provides a preparation process of a ceramic resin bond diamond grinding wheel with high abrasion ratio and high grinding efficiency.
(II) technical scheme
The preparation process of the ceramic resin bond diamond grinding wheel comprises the following steps: and uniformly mixing the diamond and the benzoxazine polyimide ceramic resin binder, performing heat preservation and pressure maintaining treatment in a hot press at 240-270 ℃ and at 100-130MPa, and then performing cold pressing in a cold press at 100-150MPa to obtain the ceramic resin binder diamond grinding wheel.
Preferably, the benzoxazine-based polyimide ceramic resin bonding agent comprises the following components in parts by weight: 25-35% of benzoxazinyl polyimide resin, 1-2% of molybdenum disulfide, 1-3% of carbon fiber, 3-8% of silicon carbide and the balance of copper powder.
Preferably, the preparation process of the benzoxazine-based polyimide ceramic resin bonding agent comprises the following steps:
(1) Adding pyromellitic anhydride and 4, 4-diaminodiphenyl methane into N, N-dimethylacetamide, reacting for 2-4 hours in nitrogen atmosphere to obtain a polyamic acid intermediate with an anhydride group, adding phenolic hydroxyl benzoxazine, reacting for 3-6 hours, heating and thermally curing the solution in an oven after the reaction, and grinding the thermally cured material into powder to obtain the benzoxazinyl polyimide resin.
(2) Adding benzoxazinyl polyimide resin, molybdenum disulfide, carbon fiber, silicon carbide and copper powder into liquid paraffin, and uniformly dispersing to obtain the benzoxazinyl polyimide ceramic resin binder.
Preferably, the molar ratio of the pyromellitic anhydride, the 4, 4-diaminodiphenylmethane and the phenolic hydroxy benzoxazine is 1.1-1.3:1:0.03-0.08.
Preferably, the heating program of the heating and heat curing is 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h in sequence.
Preferably, the preparation process of the phenolic hydroxyl benzoxazine comprises the following steps: adding triethylamine, formaldehyde solution, 4-diaminodiphenylmethane and bisphenol A into 1, 4-dioxane, controlling the molar ratio of formaldehyde to 4, 4-diaminodiphenylmethane to bisphenol A to be 4:1:2, heating and refluxing for 2-5 hours, concentrating under reduced pressure after the reaction, washing with deionized water and ethanol to obtain the phenolic hydroxy benzoxazine, wherein the structural formula is
(III) beneficial technical effects
According to the invention, the usage ratio of pyromellitic anhydride to 4, 4-diaminodiphenyl methane is controlled, a polyamide acid intermediate with an anhydride group is synthesized, and then the polyamide acid intermediate reacts with the hydroxyl of phenolic hydroxyl benzoxazine to obtain benzoxazinyl polyimide resin, so that a benzoxazinyl polyimide resin is introduced into a molecular chain of polyimide, and the benzoxazinyl polyimide resin is compounded with molybdenum disulfide, carbon fiber, silicon carbide and copper powder to obtain a benzoxazinyl polyimide ceramic resin bonding agent, wherein the benzoxazinyl polyimide resin bonding agent is compounded with molybdenum disulfide, carbon fiber, silicon carbide and copper powder, and the benzoxazinyl group can form a phenolic resin structure in the heat curing process.
Detailed Description
Example 1
(1) 7mmol of triethylamine, a solution containing 300mmol of formaldehyde, 75mmol of 4, 4-diaminodiphenyl methane and 150mmol of bisphenol A are added into 1, 4-dioxane, the mixture is heated and refluxed for 5 hours, and after the reaction, the mixture is concentrated under reduced pressure, and then washed by deionized water and ethanol to obtain the phenolic hydroxyl benzoxazine.
(2) Adding 33mmol of pyromellitic anhydride and 30mmol of 4, 4-diaminodiphenylmethane into N, N-dimethylacetamide, reacting for 4 hours in a nitrogen atmosphere to obtain a polyamide acid intermediate with an anhydride group, then adding 0.9mmol of phenolic hydroxy benzoxazine, reacting for 3 hours, heating and thermally curing the solution in an oven after the reaction, and grinding the thermally cured materials into powder at the temperature of 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h in sequence to obtain the benzoxazinyl polyimide resin.
(3) Adding 25% of benzoxazinyl polyimide resin, 2% of molybdenum disulfide, 2% of carbon fiber, 3% of silicon carbide and the balance of copper powder into liquid paraffin in weight ratio, and uniformly dispersing to obtain the benzoxazinyl polyimide ceramic resin binder.
(4) And uniformly mixing the diamond and the benzoxazine polyimide ceramic resin bond, performing heat preservation and pressure maintaining treatment in a hot press at 270 ℃ and 120MPa, and then performing cold pressing in a cold press at 100MPa to obtain the ceramic resin bond diamond grinding wheel.
Example 2
(1) 7mmol of triethylamine, a solution containing 300mmol of formaldehyde, 75mmol of 4, 4-diaminodiphenyl methane and 150mmol of bisphenol A are added into 1, 4-dioxane, the mixture is heated and refluxed for 2 hours, and after the reaction, the mixture is concentrated under reduced pressure, and then washed by deionized water and ethanol to obtain the phenolic hydroxyl benzoxazine.
(2) Adding 33mmol of pyromellitic anhydride and 30mmol of 4, 4-diaminodiphenylmethane into N, N-dimethylacetamide, reacting for 3 hours in a nitrogen atmosphere to obtain a polyamide acid intermediate with an anhydride group, then adding 2.4mmol of phenolic hydroxybenzooxazine, reacting for 6 hours, heating and thermally curing the solution in an oven after the reaction, and grinding the thermally cured materials into powder at the temperature of 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h in sequence to obtain the benzoxazinyl polyimide resin.
(3) Adding 30% of benzoxazinyl polyimide resin, 1% of molybdenum disulfide, 1% of carbon fiber, 8% of silicon carbide and the balance of copper powder into liquid paraffin in weight ratio, and uniformly dispersing to obtain the benzoxazinyl polyimide ceramic resin binder.
(4) And uniformly mixing the diamond and the benzoxazine polyimide ceramic resin bond, performing heat preservation and pressure maintaining treatment in a hot press at 270 ℃ and 120MPa, and then performing cold pressing in a cold press at 100MPa to obtain the ceramic resin bond diamond grinding wheel.
Example 3
(1) 7mmol of triethylamine, a solution containing 300mmol of formaldehyde, 75mmol of 4, 4-diaminodiphenyl methane and 150mmol of bisphenol A are added into 1, 4-dioxane, the mixture is heated and refluxed for 3 hours, and after the reaction, the mixture is concentrated under reduced pressure, and then washed by deionized water and ethanol to obtain the phenolic hydroxyl benzoxazine.
(2) 39mmol of pyromellitic anhydride and 30mmol of 4, 4-diaminodiphenylmethane are added into N, N-dimethylacetamide to react for 3 hours in a nitrogen atmosphere to obtain a polyamide acid intermediate with an anhydride group, then 2mmol of phenolic hydroxyl benzoxazine is added to react for 6 hours, the solution is heated and thermally cured in an oven after the reaction, the heating procedures are sequentially 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h, and the thermally cured material is ground into powder to obtain the benzoxazinyl polyimide resin.
(3) Adding 30% of benzoxazinyl polyimide resin, 2% of molybdenum disulfide, 2% of carbon fiber, 5% of silicon carbide and the balance of copper powder into liquid paraffin in weight ratio, and uniformly dispersing to obtain the benzoxazinyl polyimide ceramic resin binder.
(4) And uniformly mixing the diamond and the benzoxazine polyimide ceramic resin bond, performing heat preservation and pressure maintaining treatment in a hot press at 240 ℃ and 100MPa, and then performing cold pressing in a cold press at 150MPa to obtain the ceramic resin bond diamond grinding wheel.
Example 4
(1) 7mmol of triethylamine, a solution containing 300mmol of formaldehyde, 75mmol of 4, 4-diaminodiphenyl methane and 150mmol of bisphenol A are added into 1, 4-dioxane, the mixture is heated and refluxed for 5 hours, and after the reaction, the mixture is concentrated under reduced pressure, and then washed by deionized water and ethanol to obtain the phenolic hydroxyl benzoxazine.
(2) Adding 35mmol of pyromellitic anhydride and 30mmol of 4, 4-diaminodiphenylmethane into N, N-dimethylacetamide, reacting for 4 hours in a nitrogen atmosphere to obtain a polyamide acid intermediate with an anhydride group, then adding 1.5mmol of phenolic hydroxy benzoxazine, reacting for 4 hours, heating and thermally curing the solution in an oven after the reaction, and grinding the thermally cured materials into powder at the temperature of 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h in sequence to obtain the benzoxazinyl polyimide resin.
(3) Adding 35% of benzoxazinyl polyimide resin, 2% of molybdenum disulfide, 2% of carbon fiber, 3% of silicon carbide and the balance of copper powder into liquid paraffin in weight ratio, and uniformly dispersing to obtain the benzoxazinyl polyimide ceramic resin binder.
(4) And uniformly mixing the diamond and the benzoxazine polyimide ceramic resin bond, performing heat preservation and pressure maintaining treatment in a hot press at the temperature of 250 ℃ and the pressure of 120MPa, and then performing cold pressing in a cold press at the pressure of 140MPa to obtain the ceramic resin bond diamond grinding wheel.
Example 5
(1) 7mmol of triethylamine, a solution containing 300mmol of formaldehyde, 75mmol of 4, 4-diaminodiphenyl methane and 150mmol of bisphenol A are added into 1, 4-dioxane, the mixture is heated and refluxed for 5 hours, and after the reaction, the mixture is concentrated under reduced pressure, and then washed by deionized water and ethanol to obtain the phenolic hydroxyl benzoxazine.
(2) 39mmol of pyromellitic anhydride and 30mmol of 4, 4-diaminodiphenylmethane are added into N, N-dimethylacetamide to react for 3 hours in a nitrogen atmosphere to obtain a polyamide acid intermediate with an anhydride group, then 1.5mmol of phenolic hydroxy benzoxazine is added to react for 4 hours, the solution is heated and thermally cured in an oven after the reaction, the heating program is sequentially 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h, and the thermally cured material is ground into powder to obtain the benzoxazinyl polyimide resin.
(3) Adding 25% of benzoxazinyl polyimide resin, 1% of molybdenum disulfide, 2% of carbon fiber, 8% of silicon carbide and the balance of copper powder into liquid paraffin in weight ratio, and uniformly dispersing to obtain the benzoxazinyl polyimide ceramic resin binder.
(4) And uniformly mixing the diamond and the benzoxazine polyimide ceramic resin bond, performing heat preservation and pressure maintaining treatment in a hot press at 240 ℃ and 130MPa, and then performing cold pressing in a cold press at 100MPa to obtain the ceramic resin bond diamond grinding wheel.
Example 6
(1) 7mmol of triethylamine, a solution containing 300mmol of formaldehyde, 75mmol of 4, 4-diaminodiphenyl methane and 150mmol of bisphenol A are added into 1, 4-dioxane, the mixture is heated and refluxed for 2 hours, and after the reaction, the mixture is concentrated under reduced pressure, and then washed by deionized water and ethanol to obtain the phenolic hydroxyl benzoxazine.
(2) 39mmol of pyromellitic anhydride and 30mmol of 4, 4-diaminodiphenylmethane are added into N, N-dimethylacetamide to react for 4 hours in a nitrogen atmosphere to obtain a polyamide acid intermediate with an anhydride group, then 2.4mmol of phenolic hydroxy benzoxazine is added to react for 5 hours, the solution is heated and thermally cured in an oven after the reaction, the heating program is sequentially 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h, and the thermally cured material is ground into powder to obtain the benzoxazinyl polyimide resin.
(3) Adding 35% of benzoxazinyl polyimide resin, 1.5% of molybdenum disulfide, 1% of carbon fiber, 5% of silicon carbide and the balance of copper powder into liquid paraffin in weight ratio, and uniformly dispersing to obtain the benzoxazinyl polyimide ceramic resin binder.
(4) And uniformly mixing the diamond and the benzoxazine polyimide ceramic resin bond, performing heat preservation and pressure maintaining treatment in a hot press at 270 ℃ and under 100MPa, and then performing cold pressing in a cold press at 120MPa to obtain the ceramic resin bond diamond grinding wheel.
The grinding ratio of the ceramic resin bond diamond grinding wheel prepared in each example is maximum to obtain 348.6. The abrasion ratio is large, and the grinding efficiency is high.
Claims (3)
1. The preparation process of the ceramic resin bond diamond grinding wheel is characterized by comprising the following steps of: the preparation process comprises the following steps: uniformly mixing diamond and benzoxazine polyimide ceramic resin binder, carrying out heat preservation and pressure maintaining treatment in a hot press at 240-270 ℃ and 100-130MPa, and then carrying out cold pressing in a cold press at 100-150MPa to obtain a ceramic resin binder diamond grinding wheel;
the preparation process of the benzoxazine-based polyimide ceramic resin bonding agent comprises the following steps:
(1) Adding pyromellitic anhydride and 4, 4-diaminodiphenyl methane into N, N-dimethylacetamide, reacting for 2-4 hours in nitrogen atmosphere to obtain a polyamic acid intermediate with an anhydride group, and then adding phenolic hydroxy benzoxazine, wherein the molar ratio of the pyromellitic anhydride to the 4, 4-diaminodiphenyl methane to the phenolic hydroxy benzoxazine is 1.1-1.3:1:0.03-0.08; reacting for 3-6h, heating and thermally curing the solution in an oven after the reaction, and grinding the thermally cured material into powder to obtain the benzoxazinyl polyimide resin;
(2) Adding benzoxazinyl polyimide resin, molybdenum disulfide, carbon fiber, silicon carbide and copper powder into liquid paraffin, and uniformly dispersing to obtain a benzoxazinyl polyimide ceramic resin binder;
the preparation process of the phenolic hydroxyl benzoxazine comprises the following steps: adding triethylamine, formaldehyde solution, 4-diaminodiphenyl methane and bisphenol A into 1, 4-dioxane, controlling the molar ratio of formaldehyde to 4, 4-diaminodiphenyl methane to bisphenol A to be 4:1:2, heating and refluxing for 2-5 hours, concentrating under reduced pressure after the reaction, washing with deionized water and ethanol, and obtaining the phenolic hydroxy benzoxazine.
2. The process for preparing the ceramic resin bond diamond grinding wheel according to claim 1, which is characterized in that: the benzoxazine-based polyimide ceramic resin bonding agent comprises the following components in parts by weight: 25-35% of benzoxazinyl polyimide resin, 1-2% of molybdenum disulfide, 1-3% of carbon fiber, 3-8% of silicon carbide and the balance of copper powder.
3. The process for preparing the ceramic resin bond diamond grinding wheel according to claim 1, which is characterized in that: the heating program of the heating and heat curing is 100 ℃/1h, 180 ℃/3h, 240 ℃/3h and 280 ℃/2h in sequence.
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