CN116488735A - Silicon optical array receiving chip based on optical domain equalization and application system thereof - Google Patents
Silicon optical array receiving chip based on optical domain equalization and application system thereof Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
- H04B10/66—Non-coherent receivers, e.g. using direct detection
- H04B10/69—Electrical arrangements in the receiver
- H04B10/697—Arrangements for reducing noise and distortion
- H04B10/6971—Arrangements for reducing noise and distortion using equalisation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J14/00—Optical multiplex systems
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Abstract
The invention discloses a silicon optical array receiving chip based on optical domain equalization and an application system thereof, which are suitable for receiving ends of optical interconnection links. According to the invention, a photon equalization unit, a wavelength division demultiplexer and a photoelectric detector array which complete the optical domain equalization function are integrated on a chip main body through a photon integration technology; the spectrum periodic response based on the photon equalization unit realizes spectrum regulation and control on the wavelength division multiplexing optical signals in the optical domain at the same time, realizes integrated equalization of the multichannel optical signals, and after the optical domain equalization, the wavelength division multiplexing optical signals are respectively sent to each photoelectric detector in the photoelectric detector array to complete photoelectric conversion after the wavelength division multiplexing optical signals are demultiplexed by the demultiplexer, so that the optical domain equalization can be mapped onto the electric signals. The invention uses the optical domain multiplexing equalization technology to equalize the multiple channels simultaneously, thereby reducing the requirement for electric domain equalization.
Description
Technical Field
The invention belongs to the technical field of photon integration, and particularly relates to a silicon optical array receiving chip based on optical domain equalization and an application system thereof.
Background
The skin effect of high-speed signals and the dielectric loss of transmission lines greatly damage the signals during transmission as the signal rate increases, and in addition, when the signals pass through a passive link, signal integrity is damaged and signal-to-noise ratio is reduced due to channel loss, discontinuous impedance (such as reflection and return loss), interference of other channels (such as crosstalk) and the like, so that error codes can occur in signal transmission. In order to obtain a better waveform at the receiving terminal, the corrupted signal needs to be equalized by an equalizer.
The equalizer is actually a high-pass filter, and can be implemented by a digital finite impulse response filter model or an analog finite impulse response filter model, but is limited by the speed of the analog-to-digital converter and the bandwidth of the electronic delay line, and the signal rate of implementing the equalizer based on the electronic technology is limited in boosting. The photon technology provides a technology choice for photon auxiliary electronic signal processing due to the advantages of large bandwidth, low loss, electromagnetic interference resistance and the like, particularly a photon integration technology, and can realize small-size integration while having the advantages of the photon technology. The equalization technology for realizing the signal based on the photon technology has been reported in related research at present, but specific photon equalization chip schemes, especially photon equalization chips capable of simultaneously supporting the reception of wavelength division multiplexing multichannel signals, have been studied less.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a silicon optical array receiving chip based on optical domain equalization and an application system thereof.
The aim of the invention is realized by the following technical scheme: a first aspect of an embodiment of the present invention provides a silicon optical array receiving chip based on optical domain equalization, including:
a chip main body;
the photon equalization unit comprises 3 1 multiplied by 2 adjustable couplers, 3 phase shifters and 1 combiner; the two optical output ends of the first 1×2 adjustable coupler are respectively connected with the optical input end of the first phase shifter and the optical input end of the second 1×2 adjustable coupler, the two optical output ends of the second 1×2 adjustable coupler are respectively connected with the optical input end of the second phase shifter and the optical input end of the third 1×2 adjustable coupler, one optical output end of the third 1×2 adjustable coupler is connected with the optical input end of the third phase shifter, the other optical output end is not connected, and the optical output ends of the 3 phase shifters are connected with the optical input end of the combiner; the photon equalization unit comprises 1 optical input end, 1 optical output end and 1 group of electric input ends, wherein the optical input end of the first 1 multiplied by 2 adjustable coupler is the optical input end of the photon equalization unit, the optical input end of the photon equalization unit is the optical input end of the silicon optical array receiving chip, the optical output end of the combiner is the optical output end of the photon equalization unit, and the electric input end of the photon equalization unit receives an external control signal;
the optical input end of the demultiplexer is connected with the optical output end of the combiner; and
the photoelectric detector array comprises M photoelectric detectors, and the M photoelectric detectors are connected with M light output ends of the wavelength division demultiplexer in a one-to-one correspondence manner;
wherein the photon equalization unit, the wavelength division demultiplexer and the photodetector array are integrally integrated on the chip body.
Further, the silicon light array receiving chip is integrated based on a silicon-based integration process.
Further, the 1×2 tunable coupler is implemented based on a mach-zehnder interference structure, a directional coupler structure, or a 1×2 optocoupler cascade optical attenuator structure;
the phase shifter is a thermal control phase shifter or an electric control phase shifter;
the wavelength division demultiplexer is in a grid filter structure or an array waveguide grating structure.
Further, the 1×2 tunable coupler is implemented based on a mach-zehnder interference structure;
the wavelength division demultiplexer is an arrayed waveguide grating structure.
Further, the connecting waveguides among the 3 1×2 adjustable couplers in the photon equalization unit are a section of length delta L=cΔt/n w Wherein c is the speed of light in vacuum, n w Δt=1/S, the effective refractive index of the waveguide delay line M Or Δt=1/2S M ，S M Is the symbol rate of the signal to be convolved.
Further, the periodic spectral response free spectrum of the photon equalization unit is S M Or 2S M The method comprises the steps of carrying out a first treatment on the surface of the And controlling the coupling coefficient of the 1 multiplied by 2 adjustable coupler and the phase of the phase shifter by the control signal so as to change the spectral response property and the response wavelength of the photon equalization unit.
A second aspect of the present invention provides an application system of a silicon optical array receiving chip based on optical domain equalization, where the application system includes:
the silicon optical array receiving chip based on optical domain equalization comprises a photon equalization unit, a wavelength division demultiplexer and a photoelectric detector array; the photon equalization unit controls the periodic frequency spectrum response characteristic of the photon equalization unit through a control signal received by an electric input end of the photon equalization unit to realize optical domain frequency spectrum regulation and control of the wavelength division multiplexing optical signal so as to obtain the wavelength division multiplexing optical signal after optical domain equalization; the wavelength division demultiplexer is used for demultiplexing the wavelength division multiplexing optical signals subjected to optical domain equalization into M paths of optical domain equalization optical signals; the photoelectric detector array is used for realizing photoelectric conversion on M paths of optical domain balanced optical signals output by the wavelength division demultiplexer respectively so as to obtain balanced electric signals;
the optical signal source is connected with the optical input end of the photon equalization unit of the silicon optical array receiving chip;
the balance control unit is used for controlling the coupling coefficient of the 1 multiplied by 2 adjustable coupler of the photon balance unit and the phase of the phase shifter according to the balance parameters, and is connected with 1 group of electric input ends of the photon balance unit of the silicon optical array receiving chip;
the electric input ends of the M transimpedance amplifiers are connected with the output ends of the M photoelectric detectors of the photoelectric detector array of the silicon optical array receiving chip; and
the acquisition processing unit is used for carrying out acquisition processing on the amplified electric signals and is connected with the electric output ends of the M transimpedance amplifiers.
Further, the signal modulation format of the wavelength division multiplexing optical signal for providing the bearing information by the optical signal source to be equalized is a direct modulation format, which comprises NRZ, PAM4 and PAM8.
Further, the wavelength difference of the carrier corresponding to the optical signals of the adjacent channels of the wavelength division multiplexing optical signals is an integral multiple of the free spectrum range of the periodic spectrum response of the photon equalization unit; the wavelengths of the carriers corresponding to the optical signals of different channels of the wavelength division multiplexing optical signals are located at the position of the trough corresponding to the periodic frequency spectrum response of the photon equalization unit.
Further, the center wavelengths of different channels of the wavelength division multiplexer are in one-to-one correspondence with corresponding wavelengths in the wavelength division multiplexing optical signals.
The invention has the beneficial effects that the invention realizes the photon equalizer based on the cascade delay waveguide of the adjustable coupler, realizes the equalization of broadband receiving signals in the optical domain, and can support the equalization of high-speed optical signals based on the large bandwidth characteristic of photon technology; the invention is based on the periodic frequency spectrum response of the photon equalizer, can realize the simultaneous equalization of multi-channel signals based on the wavelength division multiplexing technology, does not need the single-channel individual equalization of the electric domain, and can effectively reduce the system equalization cost; the invention integrates the photon equalizer and the detection array through a single chip, does not need electric domain equalization, can effectively reduce the signal processing requirement of a receiving unit, and has dynamically adjustable photon equalizer.
Drawings
FIG. 1 is a schematic diagram of a silicon optical array receiving chip based on optical domain equalization according to the present invention;
FIG. 2 is a schematic diagram of a silicon optical array receiving chip based on optical domain equalization according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the tunable coupler in a silicon optical array receiving chip based on optical domain equalization according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a photon equalization unit time domain parameter model (A) and a corresponding frequency domain response (B) in a silicon optical array receiving chip based on optical domain equalization according to an embodiment of the present invention;
fig. 5 is a schematic diagram of optical domain equalization of a photon equalization unit in a silicon optical array receiving chip based on optical domain equalization according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the invention. Rather, they are merely examples of apparatus and methods consistent with aspects of the invention as detailed in the accompanying claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the invention. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "responsive to a determination", depending on the context.
The present invention will be described in detail with reference to the accompanying drawings. The features of the examples and embodiments described below may be combined with each other without conflict.
The silicon optical array receiving chip based on optical domain equalization is based on a photon integration technology, realizes the simultaneous optical domain equalization of multichannel received optical signals by utilizing a photon equalization unit comprising an adjustable coupler and a cascade delay waveguide, and does not need to realize equalization on each channel in an electric domain.
Referring to fig. 1, the silicon optical array receiving chip based on optical domain equalization of the invention comprises a chip main body, a photon equalization unit, a wavelength division demultiplexer, a Photoelectric Detector (PD) array, and core photon components such as the photon equalization unit, the wavelength division demultiplexer, the photoelectric detector array, etc. are integrated on the chip main body, and the whole silicon optical array receiving chip is compact and simple, small in volume, low in cost and flexible in equalization coefficient adjustment. The photon equalization unit and the wavelength division multiplexer are connected through an optical waveguide, the wavelength division multiplexer and the photoelectric detector array are connected through an optical waveguide, and the photon components are connected through an optical waveguide. It should be understood that the photonic components are connected by optical waveguides, that is, all the photonic components on the silicon optical array receiving chip are connected by optical waveguides, for example, two optical output ends of a first 1×2 tunable coupler (TO 1) of the photonic equalizing unit are connected by optical waveguides TO an input end of a first phase shifter (PS 1) and an optical input end of a second 1×2 tunable coupler (TO 2), and an optical output end of a combiner of the photonic equalizing unit is connected by optical waveguides TO a demultiplexer.
Preferably, the silicon light array receiving chip is integrated based on a silicon-based integration process.
In this embodiment, the photon equalization unit includes 1 optical input, 1 optical output, and 1 set of electrical inputs. The optical input end of the photon equalization unit is an optical input end of a silicon optical array receiving chip and is used for receiving an external wavelength division multiplexing optical signal carrying information; the optical output end of the photon equalization unit is connected with the optical input end of the wavelength division multiplexer; the electric input end of the photon equalization unit is used for receiving an external control signal, and the control signal realizes optical domain spectrum regulation and control on the wavelength division multiplexing optical signal by controlling the periodic spectrum response characteristic of the photon equalization unit so as to obtain the wavelength division multiplexing optical signal after optical domain equalization.
In this embodiment, the photon equalization unit includes 3 1×2 adjustable couplers, 3 phase shifters, and 1 combiner, where the optical input end of the first 1×2 adjustable coupler (TO 1) is the optical input end of the photon equalization unit, and the optical output end of the combiner is the optical output end of the photon equalization unit. Two optical output ends of the first 1×2 adjustable coupler (TO 1) are respectively connected with an optical input end of the first phase shifter (PS 1) and an optical input end of the second 1×2 adjustable coupler (TO 2), two optical output ends of the second 1×2 adjustable coupler (TO 2) are respectively connected with an optical input end of the second phase shifter (PS 2) and an optical input end of the third 1×2 adjustable coupler (TO 3), one optical output end of the third 1×2 adjustable coupler (TO 3) is connected with an optical input end of the third phase shifter (PS 3), and the other optical output end is not connected. The optical outputs of the 3 phase shifters are connected to the optical input of the combiner as shown in fig. 1.
It should be noted that the connecting waveguide between 3 1×2 tunable couplers in the photon equalization unit is a section with a length of Δl=cΔt/n w Wherein c is the speed of light in vacuum, n w Δt=1/S, the effective refractive index of the waveguide delay line M Or Δt=1/2S M ，S M Is the symbol rate of the signal to be convolved.
The free spectrum of the periodic spectrum response of the photon equalization unit is S M Or 2S M The coupling coefficient of the 1 multiplied by 2 adjustable coupler and the phase of the phase shifter are controlled by the control signal so as to change the spectral response property and the response wavelength of the photon equalization unit.
Further, the wavelength difference of the carrier corresponding to the optical signals of the adjacent channels of the wavelength division multiplexing optical signals is an integral multiple of the free spectrum range of the periodic spectrum response of the photon equalization unit. The wavelengths of the carriers corresponding to the optical signals of different channels of the wavelength division multiplexing optical signals are positioned at the position corresponding to the trough of the periodic frequency spectrum response of the photon equalization unit.
Further, the 1×2 tunable coupler is realized based on a mach-zehnder interference structure, a directional coupler structure, or a 1×2 optical coupler cascade optical attenuator structure. Preferably, the 1×2 tunable coupler is implemented based on a mach-zehnder interference structure, the structure of which is shown in fig. 3, and the 1×2 tunable coupler implemented based on the mach-zehnder interference structure includes 2 1×2 multimode interference couplers (MMIs) and 1 phase shifter.
Further, the phase shifter is a thermal control phase shifter or an electric control phase shifter.
Further, the combiner includes 3 optical input ends and 1 optical output end, and is used for combining the signals of the optical output ends of the 3 phase shifters into one signal.
In this embodiment, the wavelength division multiplexer includes 1 optical input end and M optical output ends, the optical input end of the wavelength division multiplexer is connected to the optical output end of the photon equalization unit, and the M optical output ends of the wavelength division multiplexer are respectively connected to the optical input ends of M photodetectors in the photodetector array; the wavelength division demultiplexer is used for demultiplexing the wavelength division multiplexed optical signals after optical domain equalization into M paths of optical domain equalization optical signals.
It should be noted that, the center wavelengths of different channels of the wavelength division multiplexer are in one-to-one correspondence with the corresponding wavelengths in the wavelength division multiplexing optical signal. It should be understood that the wavelength of the wavelength division multiplexed optical signal does not change before and after optical domain equalization.
Further, the wavelength division demultiplexer is a grating filter structure or an arrayed waveguide grating structure. Preferably, the demultiplexer is an arrayed waveguide grating structure.
In this embodiment, the photodetector array is composed of M photodetectors, and is configured to implement photoelectric conversion on M optical domain balanced optical signals output by the demultiplexer, so as to obtain balanced electrical signals.
It is worth mentioning that the invention also provides an application system of the silicon optical array receiving chip based on optical domain equalization.
Referring to fig. 2, the application system includes a silicon optical array receiving chip based on optical domain equalization, an equalization control unit, a light signal source to be equalized, M transimpedance amplifiers (TIAs), and an acquisition processing unit in the above embodiments.
In this embodiment, the optical signal source to be equalized is used to provide a wavelength division multiplexing optical signal carrying information, and the optical signal source to be equalized is connected to an optical input end of a photon equalization unit of the silicon optical array receiving chip; the balance control unit is used for controlling the coupling coefficient of the 1 multiplied by 2 adjustable coupler of the photon balance unit and the phase of the phase shifter according to the balance parameters, and is connected with 1 group of electric input ends of the photon balance unit of the silicon optical array receiving chip; the M transimpedance amplifiers are used for amplifying electric signals output by the M photodetectors of the photoelectric detector array, and the electric input ends of the M transimpedance amplifiers are connected with the output ends of the M photodetectors of the photoelectric detector array of the silicon optical array receiving chip; the acquisition processing unit is used for carrying out acquisition processing on the amplified electric signals and is connected with the electric output ends of the M transimpedance amplifiers.
Further, the signal modulation format of the wavelength division multiplexing optical signal for providing the bearing information by the optical signal source to be equalized is a direct modulation format, including NRZ, PAM4 and PAM8.
Further, the photon equalization unit is composed of 3 1×2 tunable couplers (MZI) realized based on a mach-zehnder interference structure, 3 phase shifters and 1 combiner, and the structure of the 1×2 tunable couplers (MZI) realized based on the mach-zehnder interference structure is shown in fig. 3. Two optical output ends of a first 1×2 adjustable coupler realized based on a Mach-Zehnder interference structure are respectively connected with an optical input end of a first phase shifter (PS 1) and an optical input end of a second 1×2 adjustable coupler realized based on the Mach-Zehnder interference structure, two optical output ends of the second 1×2 adjustable coupler are respectively connected with an optical input end of a second phase shifter (PS 2) and an optical input end of a third 1×2 adjustable coupler, one optical output end of the third 1×2 adjustable coupler is connected with an optical input end of a third phase shifter (PS 3), and the other optical output end is not connected; the optical outputs of the 3 phase shifters are connected to the optical input of the combiner as shown in fig. 2.
Specifically, first, the wavelength division multiplexing optical signals carrying information provided by the optical signal source to be equalized are sent to the optical input end of the photon equalization unit of the silicon optical array receiving chip, the equalization control unit controls the coupling coefficient of the 1×2 adjustable coupler of the photon equalization unit and the phase of the phase shifter according to the equalization parameters, and the optical output signals of the 3 phase shifters are combined into one path by the combiner, so that the optical domain equalization of the wavelength division multiplexing optical signals can be realized. And then the optical signals output by the combiner are sent into an array waveguide grating structure to realize the wavelength division multiplexing of the wavelength division multiplexing optical signals, and M paths of optical domain equalization optical signals after the wavelength division multiplexing are sent into M photoelectric detectors of a photoelectric detector array in a one-to-one correspondence manner. The output ends of the M photoelectric detectors are connected with the electric input ends of the M transimpedance amplifiers, and the M transimpedance amplifiers can amplify electric signals output by the M photoelectric detectors. The electric output ends of the M transimpedance amplifiers are connected with an acquisition processing unit, and the acquisition processing unit acquires and processes the amplified electric signals.
In addition, the foregoing examples show that: the wavelength difference of the carrier corresponding to the optical signals of the adjacent channels of the wavelength division multiplexing optical signals is an integral multiple of the free frequency spectrum range of the periodic frequency spectrum response of the photon equalization unit; the wavelengths of the carriers corresponding to the optical signals of different channels of the wavelength division multiplexing optical signals are positioned at the position corresponding to the trough of the periodic frequency spectrum response of the photon equalization unit. For easy understanding, the following further details the technical solution of the present invention by means of a specific embodiment:
referring to fig. 2, a to-be-equalized received optical signal source is connected to an optical input end of a silicon optical array receiving chip, where the to-be-equalized received optical signal source includes M wavelength information-bearing wavelength division multiplexing optical signals, and the information-bearing wavelength division multiplexing optical signals may be represented as S (t) = [ S ] 1 (t),s 2 (t),s 3 (t),...,s m (t),...s M (t)]Wherein s is m And (t) represents the mth wavelength division multiplexing optical signal at time t. The wavelength division multiplexing optical signal is sent to the optical input end of a photon equalization unit in a silicon optical array receiving chip, the photon equalization unit consists of 3 1X 2 adjustable couplers (MZIs) realized based on Mach-Zehnder interference structures, 3 phase shifters and 1 combiner, and the first two optical outputs of the 1X 2 adjustable couplers realized based on the Mach-Zehnder interference structuresThe output end is respectively connected with the optical input end of the first phase shifter (PS 1) and the optical input end of the second 1X 2 adjustable coupler realized based on the Mach-Zehnder interference structure, the two optical output ends of the second 1X 2 adjustable coupler are respectively connected with the optical input end of the second phase shifter (PS 2) and the optical input end of the third 1X 2 adjustable coupler, one optical output end of the third 1X 2 adjustable coupler is connected with the optical input end of the third phase shifter (PS 3), and the other optical output end is not connected; the optical output ends of the 3 phase shifters are connected with the optical input end of the combiner. The equalization control unit respectively controls the coupling coefficient of the 1 multiplied by 2 adjustable coupler and the phase of the phase shifter in the photon equalization unit according to the equalization parameters, and can realize the optical domain equalization of the wavelength division multiplexing optical signals carrying information.
Further, the equalization parameters of the photon equalization unit are expressed as:
wherein A is 1 、A 2 、A 3 Equalization amplitude parameters of the first, second and third 1 x 2 adjustable couplers respectively, the equalization phase parameters of the first, second and third 1 x 2 adjustable couplers, respectively.
Accordingly, the optical domain equalized wavelength division multiplexing optical signal output by the combiner of the photon equalization unit is expressed as:
S OE (t)＝[s 1OE (t),s 2OE (t),s 3OE (t),...,s mOE (t),...,s MOE (t)]
wherein, the liquid crystal display device comprises a liquid crystal display device,(m＝1,2,3…M)，s mOE (t) wavelength division multiplexing representing mth optical domain equalization at time tAn optical signal.
The time domain parametric model and corresponding frequency domain response of the photon equalization unit are shown in fig. 4. Because the frequency domain response of the photon equalization unit is periodic, when the carrier wavelength difference corresponding to the optical signals of adjacent channels of the wavelength division multiplexing optical signals is an integer multiple of the free frequency spectrum range of the periodic frequency spectrum response of the equalization unit, and the carrier wavelengths corresponding to the optical signals of different channels of the wavelength division multiplexing optical signals are located at the position corresponding to the trough of the periodic frequency spectrum response of the equalization unit, the simultaneous optical domain equalization of the wavelength division multiplexing optical signals containing M wavelengths can be realized, as shown in fig. 5.
The wave synthesizer of the photon equalization unit outputs the wave division multiplexing optical signal after the optical domain equalization, and sends the wave division multiplexing optical signal into the array waveguide grating structure to realize the wave division multiplexing of the wave division multiplexing optical signal, M paths of optical signals after the wave division multiplexing are respectively sent into M photoelectric detectors, and the M photoelectric detectors respectively complete the photoelectric conversion of the M paths of optical signals, so that the equalized electric signal can be obtained. The output ends of the M photoelectric detectors are connected with the electric input ends of the M transimpedance amplifiers, and the M transimpedance amplifiers amplify the electric signals output by the M photoelectric detectors and send the amplified electric signals to the acquisition processing unit for further signal processing. By means of optical domain equalization, an electric domain equalization algorithm can be omitted in the acquisition processing unit, and therefore performance requirements on the acquisition processing unit are greatly reduced.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A silicon optical array receiving chip based on optical domain equalization, comprising:
a chip main body;
the photon equalization unit comprises 3 1 multiplied by 2 adjustable couplers, 3 phase shifters and 1 combiner; the two optical output ends of the first 1×2 adjustable coupler are respectively connected with the optical input end of the first phase shifter and the optical input end of the second 1×2 adjustable coupler, the two optical output ends of the second 1×2 adjustable coupler are respectively connected with the optical input end of the second phase shifter and the optical input end of the third 1×2 adjustable coupler, one optical output end of the third 1×2 adjustable coupler is connected with the optical input end of the third phase shifter, the other optical output end is not connected, and the optical output ends of the 3 phase shifters are connected with the optical input end of the combiner; the photon equalization unit comprises 1 optical input end, 1 optical output end and 1 group of electric input ends, wherein the optical input end of the first 1 multiplied by 2 adjustable coupler is the optical input end of the photon equalization unit, the optical input end of the photon equalization unit is the optical input end of the silicon optical array receiving chip, the optical output end of the combiner is the optical output end of the photon equalization unit, and the electric input end of the photon equalization unit receives an external control signal;
the optical input end of the demultiplexer is connected with the optical output end of the combiner; and
the photoelectric detector array comprises M photoelectric detectors, and the M photoelectric detectors are connected with M light output ends of the wavelength division demultiplexer in a one-to-one correspondence manner;
wherein the photon equalization unit, the wavelength division demultiplexer and the photodetector array are integrally integrated on the chip body.
2. The optical domain equalization based silicon optical array receiving chip of claim 1, wherein the silicon optical array receiving chip is integrated based on a silicon-based integration process.
3. The optical domain equalization based silicon optical array receiving chip of claim 1, wherein the 1 x 2 tunable coupler is implemented based on a mach-zehnder interference structure, a directional coupler structure, or a 1 x 2 optocoupler cascaded optical attenuator structure;
the phase shifter is a thermal control phase shifter or an electric control phase shifter;
the wavelength division demultiplexer is in a grid filter structure or an array waveguide grating structure.
4. The optical domain equalization based silicon optical array receiving chip of claim 3, wherein said 1 x 2 tunable coupler is implemented based on a mach-zehnder interference structure;
the wavelength division demultiplexer is an arrayed waveguide grating structure.
5. The optical domain equalization-based silicon optical array receiving chip of claim 1, wherein the connecting waveguides between 3 1 x 2 tunable couplers in the photon equalization unit are a section of length Δl=cΔt/n w Wherein c is the speed of light in vacuum, n w Δt=1/S, the effective refractive index of the waveguide delay line M Or Δt=1/2S M ，S M Is the symbol rate of the signal to be convolved.
6. The optical domain equalization-based silicon optical array receiving chip of claim 5, wherein the periodic spectral response free spectrum of said photon equalization unit is S M Or 2S M The method comprises the steps of carrying out a first treatment on the surface of the And controlling the coupling coefficient of the 1 multiplied by 2 adjustable coupler and the phase of the phase shifter by the control signal so as to change the spectral response property and the response wavelength of the photon equalization unit.
7. An application system of a silicon optical array receiving chip based on optical domain equalization, which is characterized by comprising:
the optical domain equalization based silicon optical array receiving chip of any of claims 1-6, comprising a photon equalization unit, a wavelength division demultiplexer, and a photodetector array; the photon equalization unit controls the periodic frequency spectrum response characteristic of the photon equalization unit through a control signal received by an electric input end of the photon equalization unit to realize optical domain frequency spectrum regulation and control of the wavelength division multiplexing optical signal so as to obtain the wavelength division multiplexing optical signal after optical domain equalization; the wavelength division demultiplexer is used for demultiplexing the wavelength division multiplexing optical signals subjected to optical domain equalization into M paths of optical domain equalization optical signals; the photoelectric detector array is used for realizing photoelectric conversion on M paths of optical domain balanced optical signals output by the wavelength division demultiplexer respectively so as to obtain balanced electric signals;
the optical signal source is connected with the optical input end of the photon equalization unit of the silicon optical array receiving chip;
the balance control unit is used for controlling the coupling coefficient of the 1 multiplied by 2 adjustable coupler of the photon balance unit and the phase of the phase shifter according to the balance parameters, and is connected with 1 group of electric input ends of the photon balance unit of the silicon optical array receiving chip;
the electric input ends of the M transimpedance amplifiers are connected with the output ends of the M photoelectric detectors of the photoelectric detector array of the silicon optical array receiving chip; and
the acquisition processing unit is used for carrying out acquisition processing on the amplified electric signals and is connected with the electric output ends of the M transimpedance amplifiers.
8. The application system of the silicon optical array receiving chip based on optical domain equalization according to claim 7, wherein the signal modulation format of the wavelength division multiplexing optical signal carrying information provided by the optical signal source to be equalized is a direct modulation format, including NRZ, PAM4 and PAM8.
9. The application system of the silicon optical array receiving chip based on optical domain equalization as set forth in claim 7, wherein the wavelength difference of the carrier corresponding to the optical signals of the adjacent channels of the wavelength division multiplexing optical signals is an integer multiple of the free spectral range of the periodic spectral response of the photon equalization unit; the wavelengths of the carriers corresponding to the optical signals of different channels of the wavelength division multiplexing optical signals are located at the position of the trough corresponding to the periodic frequency spectrum response of the photon equalization unit.
10. The application system of the silicon optical array receiving chip based on the optical domain equalization of claim 7, wherein the center wavelengths of different channels of the demultiplexer are in one-to-one correspondence with the corresponding wavelengths in the wavelength division multiplexed optical signal.
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| CN117706692B (en) * | 2024-02-05 | 2024-05-24 | 之江实验室 | Silicon optical array transmitting chip based on optical domain equalization and application system thereof |
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