CN116483639A - eMMC information acquisition method and system, electronic device and storage medium - Google Patents

eMMC information acquisition method and system, electronic device and storage medium Download PDF

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Publication number
CN116483639A
CN116483639A CN202310465219.8A CN202310465219A CN116483639A CN 116483639 A CN116483639 A CN 116483639A CN 202310465219 A CN202310465219 A CN 202310465219A CN 116483639 A CN116483639 A CN 116483639A
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emmc
terminal
information
interface
module
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CN116483639B (en
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李伊君
宋魏杰
赖鼐
龚晖
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Zhuhai Miaocun Technology Co ltd
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Zhuhai Miaocun Technology Co ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
    • G06F11/2221—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested to test input/output devices or peripheral units
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2273—Test methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0481—Interaction techniques based on graphical user interfaces [GUI] based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Human Computer Interaction (AREA)
  • Debugging And Monitoring (AREA)

Abstract

The invention discloses a method and a system for acquiring eMMC information, electronic equipment and a storage medium, and relates to the technical field of eMMC. The eMMC information acquisition method comprises the following steps: the method comprises the steps that a first terminal obtains internal information of eMMC on a second terminal through APK application, and the first terminal displays a first interface; the first interface comprises a first module, a second module and a third module; responding to a first operation of the first module, and displaying a second interface by the first terminal; or, in response to a second operation on the second module, the first terminal displays a third interface; or, in response to a third operation on the third module, the first terminal displays a fourth interface. According to the method for acquiring the eMMC information, the first terminal can directly acquire the internal information of the eMMC through the APK application without detaching the eMMC from the second terminal, so that the data of the eMMC are prevented from being damaged in the detaching process.

Description

eMMC information acquisition method and system, electronic device and storage medium
Technical Field
The present invention relates to the technical field of eMMC, and in particular, to an eMMC information acquiring method and system, an electronic device, and a storage medium.
Background
eMMC (Embedded Multi Media Card ) is used as a storage device with excellent performance, and is increasingly used in applications such as tablet computers, television boxes, mobile phones, car navigation, etc.
In the use process of the eMMC product, if the eMMC is found to have a problem, the master manufacturer needs to send an FAE test engineer (FAE, field Application Engineer, field application engineer) to the field, detach the eMMC from the device (such as a tablet computer, a mobile phone, and other terminals) to which the eMMC belongs, and then acquire internal information of the eMMC by using a testing device of the master manufacturer, and test and verify the eMMC, thereby finding and handling the problem of the eMMC. By adopting the mode, on one hand, when the eMMC has problems, FAE test engineers are required to be dispatched to the site for testing, so that the efficiency is low and the labor cost is high; on the other hand, when dismantling the eMMC, need to heat the circuit board that eMMC is located, and in the heating process, the on-the-spot data of eMMC can be destroyed probably, when leading to follow-up testing and verifying the eMMC, the result of obtaining does not accord with the actual in-service use condition of eMMC.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an eMMC information acquiring method and system, an electronic device, and a storage medium, capable of directly acquiring internal information of an eMMC without removing the eMMC.
In one aspect, the eMMC information acquiring method according to the embodiment of the present invention includes the following steps:
the method comprises the steps that a first terminal obtains internal information of eMMC on a second terminal through APK application, and the first terminal displays a first interface; the first interface comprises a first module, a second module and a third module;
responding to a first operation of the first module, and displaying a second interface by the first terminal; the second interface is used for displaying the statistical information of the eMMC obtained according to the internal information; the statistical information at least comprises read data total amount, write data total amount and erasing times information; or alternatively, the process may be performed,
responding to a second operation of the second module, and displaying a third interface by the first terminal; the third interface is used for displaying a temperature curve of the eMMC drawn according to the internal information; or alternatively, the process may be performed,
and responding to a third operation of the third module, the first terminal displays a fourth interface, and the fourth interface is used for displaying a read-write curve of the eMMC drawn according to the internal information.
According to some embodiments of the invention, the erasing times information includes: the method comprises the steps of maximum erasing times of a first area, minimum erasing times of the first area, average erasing times of the first area, maximum erasing times of a second area, minimum erasing times of the second area and average erasing times of the second area.
According to some embodiments of the invention, the first interface further comprises a fourth module, and the eMMC information acquiring method further comprises the steps of:
and responding to a fourth operation of the fourth module, and uploading the internal information of the eMMC to a master control manufacturer by the first terminal.
According to some embodiments of the invention, the eMMC information acquiring method further includes the steps of:
and identifying the position of the eMMC with the abnormality according to the statistical information of the eMMC, and identifying the position with the abnormality on the second interface.
According to some embodiments of the invention, the eMMC information acquiring method further includes the steps of:
and evaluating the service life of the eMMC according to the erasing times information.
According to some embodiments of the invention, the statistical information further includes a number of unexpected power failures of the eMMC.
According to some embodiments of the invention, the eMMC information acquiring method further includes the steps of:
and obtaining the highest temperature and the lowest temperature of the eMMC according to the temperature curve.
On the other hand, the eMMC information acquiring system according to the embodiment of the present invention includes:
the first terminal comprises an APK application;
a second terminal including eMMC;
the first terminal can execute the eMMC information acquiring method described in the embodiment of the above aspect on the eMMC of the second terminal through the APK application.
On the other hand, the electronic device according to the embodiment of the invention includes:
a memory for storing program instructions;
and the processor is used for calling the program instructions stored in the memory and executing the eMMC information acquisition method according to the obtained program instructions.
On the other hand, according to the storage medium of the embodiment of the present invention, the storage medium stores computer-executable instructions for causing a computer to perform the eMMC information acquiring method of the above embodiment.
The eMMC information acquisition method, the eMMC information acquisition system, the electronic equipment and the storage medium have at least the following beneficial effects: after the first terminal is connected with the second terminal, the internal information of the eMMC can be directly obtained through the APK application without detaching the eMMC from the second terminal, so that the data of the eMMC are prevented from being damaged in the detaching process; moreover, an interactive interface (a first interface, a second interface, a third interface and the like) is arranged on the APK application of the first terminal, and a user can acquire and check the condition of each item of data of the eMMC only by executing simple selection operation and can upload the data to a master manufacturer, so that the master manufacturer does not need to send FAE test engineers to the site, thereby improving the efficiency and reducing the labor cost.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a flowchart illustrating steps of an eMMC information acquiring method according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an eMMC information acquiring system according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a first interface according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a second interface according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a temperature profile of an eMMC according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a read-write curve of eMMC according to an embodiment of the present invention;
the first terminal 100, the second terminal 200, the first module 300, the second module 400, the third module 500, and the fourth module 600.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. The step numbers in the following embodiments are set for convenience of illustration only, and the order between the steps is not limited in any way, and the execution order of the steps in the embodiments may be adaptively adjusted according to the understanding of those skilled in the art.
The terms "first," "second," "third," and "fourth" and the like in the description and in the claims and drawings are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
eMMC: embedded Multi Media Card, an embedded multimedia card, is an embedded memory standard specification defined by the MMC society and mainly aimed at products such as mobile phones or tablet computers. The eMMC is an embedded non-volatile memory system, mainly comprising a flash memory, a flash memory access system, an eMMC protocol interface and the like, defines the physical architecture and the access interface and the protocol of the memory system based on an embedded multimedia card, has the advantages of small volume, low power consumption, large capacity and the like, and is very suitable for being used as a memory medium of electronic equipment such as a smart phone, a tablet personal computer, mobile internet equipment and the like.
APK: android application package, an Android application package, is an application package file format used by the Android operating system for distributing and installing mobile applications and middleware. The code of an application program of an Android system is to be run on an Android device, and the code must be compiled first and then packaged into a file which can be identified by the Android system, and the file format which can be identified and run by the Android system is "APK". An APK file contains a compiled code file (.dex file), file resources (resources), native resource files (assets), certificates (certificates), and manifest files (manifest files).
The eMMC, as a storage device with excellent performance, is being increasingly used in applications such as tablet computers, television boxes, mobile phones, car navigation, and the like. In the use process of the eMMC product, if the eMMC is found to have a problem, a master manufacturer needs to send an FAE test engineer (FAE, field Application Engineer, field application engineer) to the field, detach the eMMC from the device (such as a tablet computer, a mobile phone, and other terminals) to which the eMMC belongs, and then acquire internal information of the eMMC by using a testing device of the master manufacturer, and test and verify the eMMC, thereby finding and handling the problem of the eMMC. By adopting the mode, on one hand, when the eMMC has problems, FAE test engineers are required to be dispatched to the site for testing, so that the efficiency is low and the labor cost is high; on the other hand, when dismantling the eMMC, need to heat the circuit board that eMMC is located, and in the heating process, the on-the-spot data of eMMC can be destroyed probably, when leading to follow-up testing and verifying the eMMC, the result of obtaining does not accord with the actual in-service use condition of eMMC.
To this end, an embodiment of the present invention proposes an eMMC information acquiring method, including the following steps:
the method comprises the steps that a first terminal obtains internal information of eMMC on a second terminal through APK application, and the first terminal displays a first interface; the first interface comprises a first module, a second module and a third module;
responding to a first operation of the first module, and displaying a second interface by the first terminal; the second interface is used for displaying the statistical information of the eMMC obtained according to the internal information; the statistical information at least comprises read data total amount, write data total amount and erasing times information; or alternatively, the process may be performed,
responding to a second operation of the second module, and displaying a third interface by the first terminal; the third interface is used for displaying a temperature curve of the eMMC drawn according to the internal information; or alternatively, the process may be performed,
and responding to a third operation of the third module, the first terminal displays a fourth interface, and the fourth interface is used for displaying a read-write curve of the eMMC drawn according to the internal information.
According to the eMMC information acquisition method provided by the embodiment of the invention, the APK for acquiring the internal information of the eMMC is specially developed, so that the eMMC is not required to be detached from the affiliated equipment (namely the second terminal), but the eMMC is directly connected with the second terminal through the first terminal, and then the internal information of the eMMC is acquired through APK application; after the internal information of the eMMC is obtained, the internal information is analyzed, so that statistical information (such as total read data, total write data and erasing times) of the eMMC is obtained, and a temperature curve and a read-write curve of the eMMC are drawn, so that a tester can analyze problems of the eMMC according to the statistical information, the temperature curve and the read-write curve, and the problems are processed correspondingly.
The method, system, electronic device and storage medium for obtaining eMMC information according to the embodiments of the present invention are described in detail below with reference to fig. 1 to 6.
In one aspect, as shown in fig. 1, an eMMC information acquiring method is provided in an embodiment of the present invention, and the method includes the following steps:
step S100: the first terminal 100 obtains internal information of the eMMC on the second terminal 200 through the APK application, and the first terminal 100 displays a first interface; the first interface includes a first module 300, a second module 400, and a third module 500;
specifically, the first terminal 100 and the second terminal 200 may be mobile phones, tablet computers, notebook computers, desktop computers, etc., but are not limited thereto. As shown in fig. 2, in order to directly obtain the internal information of the eMMC without detaching the eMMC from the device (i.e., the second terminal 200) to which the eMMC belongs, an APK application is specially developed, and the first terminal 100 can directly obtain the internal information of the eMMC through the APK application, so that the subsequent analysis of the eMMC according to the internal information of the eMMC is facilitated, thereby completing the verification and the test of the eMMC. As shown in fig. 3, in some embodiments of the present invention, after the APK application is opened by the first terminal 100, a first interface is displayed, where the first interface includes a first module 300 (i.e., smart information), a second module 400 (i.e., a temperature curve), and a third module 500 (i.e., a read-write curve). The first interface is an interface displayed after the first terminal 100 opens the APK application, so that a tester can conveniently interact with the first terminal 100 through the first interface.
Step S200: in response to the first operation of the first module 300, the first terminal 100 displays a second interface; the second interface is used for displaying the statistical information of the eMMC obtained according to the internal information; the statistical information at least comprises read data total amount, write data total amount and erasing times information;
the first operation may refer to clicking, long pressing, sliding or other common selection operation, and if the first operation is clicking, after clicking the first module 300, the APK application on the first terminal 100 displays a second interface. The second interface is shown in fig. 4, and in the second interface, statistical information (i.e., smart information) of eMMC, which is analyzed based on the acquired internal information of eMMC, can be displayed. In the embodiment of the invention, the statistical information comprises read data total amount, write data total amount and erasing times information. Further, in the present example, the number of erasures information includes a maximum number of erasures of the first area (i.e., a_space), a minimum number of erasures of the first area, an average number of erasures of the first area, a maximum number of erasures of the second area (i.e., b_space), a minimum number of erasures of the second area, and an average number of erasures of the second area. Wherein, A_space and B_space refer to SLC (SLC: single Level Cell, single layer Unit), MLC (Multi-Level Cell)/TLC (Triple-Level Cell); while a_space and b_space refer to either SLC or MLC/TLC, respectively, there is no specific specification, and different manufacturers may have different specifications.
Therefore, through the second interface, the tester can intuitively see the total read data amount, the total write data amount, the maximum erase count of A_space, the minimum erase count of A_space, the average erase count of A_space, the maximum erase count of B_space, the minimum erase count of B_space and the average erase count of B_space of the eMMC, so that the use condition of the eMMC is known and which abnormality may exist in the eMMC is judged according to the information. Through the total read data and the total write data, the read-write condition of the eMMC and the respective duty ratio of the read-write quantity can be known; by analyzing the information of the number of times of erasing and writing of the eMMC, we can evaluate the service life of the eMMC. For example, assuming that the total number of times of erasing of the MLC is 4000 times, if 400 times of erasing have been used at this time, it can be considered that the service life has reached 10%, and thus it is estimated how long the total service life is, and it can be estimated from 10% of the writing amount/reading amount, and when eMMC is used at the end, for example, 90%, it can be estimated how much data can be written/read in total. As shown in fig. 4, the second interface further includes buttons for "export data" and "return", and by clicking "export data", the data displayed on the second interface can be exported; by clicking "return", the first interface can be returned.
Step S300: in response to the second operation of the second module 400, the first terminal 100 displays a third interface; the third interface is used for displaying a temperature curve of the eMMC drawn according to the internal information;
the second operation may refer to clicking, long pressing, sliding or other common selection operation, and if the second operation is clicking, after clicking the second module 400, the APK application on the first terminal 100 displays a third interface. In the third interface, a temperature curve of eMMC plotted according to the obtained internal information of eMMC is displayed, the temperature curve is shown in fig. 5, the abscissa of the temperature curve is time (in hours H), and the ordinate of the temperature curve is temperature (in degrees c); as can be seen from the temperature profile, the eMMC temperature is between-20 ℃ and 120 ℃; through observing the temperature curve, can judge what the highest temperature and the minimum temperature of eMMC in the use are respectively to and whether the temperature of eMMC in the use is in normal range, thereby judge whether the operating temperature of eMMC is normal.
Step S400: in response to the third operation of the third module 500, the first terminal 100 displays a fourth interface for displaying a read-write curve of the eMMC drawn according to the internal information.
The third operation may refer to clicking, long pressing, sliding or other common selection operations, and if the third operation is clicking, after clicking the third module 500, the APK application on the first terminal 100 displays a fourth interface. In the fourth interface, a read-write curve of the eMMC drawn according to the obtained internal information of the eMMC is displayed, the read-write curve is shown in fig. 6, wherein gray is a write curve, black is a read curve, an abscissa of the read-write curve is time (in H), and an ordinate of the read-write curve is writing amount/reading amount (in sector); by observing the read-write curve, the read-write condition of the eMMC in the use process and the respective duty ratio of the read-write operation can be judged, and whether the read-write operation of the eMMC in the use process is normal or not is further judged.
It should be noted that, the above-mentioned reference numerals of step S100 to step S400 are merely provided for convenience of description, the order of steps is not limited in any way, and the execution order of each step in the embodiments may be adaptively adjusted according to the understanding of those skilled in the art. Also, the steps S200, S300 and S400 are not necessarily all steps to be performed, but corresponding steps are performed according to the operation of the user.
Further, as shown in fig. 3, in some embodiments of the present invention, the first interface further includes a fourth module 600 (i.e. upload data), and the eMMC information acquiring method of the embodiment of the present invention further includes the following steps:
in response to the fourth operation of the fourth module 600, the first terminal 100 uploads the internal information of the eMMC to the master vendor.
The fourth operation may refer to clicking, long pressing, sliding or other common selection operations, and if the fourth operation is clicking, after clicking the fourth module 600, the APK application on the first terminal 100 will upload the obtained internal information of the eMMC to the host manufacturer. The master control manufacturer refers to a manufacturer producing the eMMC, and the master control manufacturer is convenient to analyze the problems of the eMMC and give a corresponding solution by uploading data to the master control manufacturer; by the method, a master control manufacturer does not need to send FAE test engineers to the site for inspection, but the user obtains the internal information of the eMMC through the APK application and sends the internal information, so that the efficiency is improved, and the labor cost is reduced. The statistical information (Smart information) of the eMMC obtained by the APK application and the drawn temperature curve, the read-write curve, and the like may also be uploaded to the master manufacturer.
Further, the eMMC information acquiring method according to the embodiment of the present invention further includes the following steps:
and identifying the position of the eMMC with the abnormality according to the statistical information of the eMMC, and identifying the position with the abnormality on a second interface.
Specifically, as shown in fig. 4, assuming that after analysis, the maximum number of b_space erasures is found to be abnormal and does not conform to the normal use condition of eMMC, the APK application will identify the maximum number of b_space erasures on the second interface with different colors, so that the user can intuitively find the abnormal place.
Further, the statistical information (Smart information) of eMMC further includes the number of unexpected power failures of eMMC. Through obtaining the unexpected power down times of eMMC, see whether unexpected power down times exceeds normal scope to when finding the unexpected power down times of eMMC too much, take corresponding solution measure.
Therefore, according to the eMMC information acquiring method of the embodiment of the present invention, after the first terminal 100 is connected to the second terminal 200, the internal information of the eMMC can be directly acquired through the APK application without detaching the eMMC from the second terminal 200, so as to avoid damaging the data of the eMMC during the detachment process; moreover, an interactive interface is provided on the APK application of the first terminal 100, and a user only needs to perform a simple selection operation to obtain and view each item of data of the eMMC, and can upload the data to the master manufacturer, so that the master manufacturer does not need to send an FAE test engineer to the site, thereby improving efficiency and reducing labor cost.
On the other hand, the embodiment of the invention also provides an eMMC information acquiring system, which includes:
a first terminal 100 including an APK application;
a second terminal 200 including eMMC;
the first terminal 100 can perform the eMMC information acquiring method as described in the above aspect embodiments on the eMMC of the second terminal 200 through the APK application.
Specifically, the first terminal 100 and the second terminal 200 may be mobile phones, tablet computers, notebook computers, desktop computers, etc., but are not limited thereto. As shown in fig. 2, in order to directly obtain the internal information of the eMMC without detaching the eMMC from the device (i.e., the second terminal 200) to which the eMMC belongs, an APK application is specially developed, and the first terminal 100 can directly obtain the internal information of the eMMC through the APK application, so that the subsequent analysis of the eMMC according to the internal information of the eMMC is facilitated, thereby completing the verification and the test of the eMMC. As shown in fig. 3, in some embodiments of the present invention, after the APK application is opened by the first terminal 100, a first interface is displayed, where the first interface includes a first module 300 (i.e., smart information), a second module 400 (i.e., temperature curve), a third module 500 (i.e., read-write curve), and a fourth module 600 (i.e., upload data). The first interface is an interface displayed after the first terminal 100 opens the APK application, so that a tester can conveniently interact with the first terminal 100 through the first interface. After the user clicks the first module 300, the APK application on the first terminal 100 may display the statistical information/Smart information of the eMMC; after the user clicks the second module 400, the APK application on the first terminal 100 displays the temperature curve of eMMC; after the user clicks the third module 500, the APK application on the first terminal 100 displays the eMMC read-write curve; after the user clicks the fourth module 600, the APK application on the first terminal 100 uploads the obtained internal information of the eMMC to the master manufacturer, and the master manufacturer is facilitated to analyze the problems existing in the eMMC and provide a corresponding solution by uploading the data to the master manufacturer; by the method, a master control manufacturer does not need to send FAE test engineers to the site for inspection, but the user obtains the internal information of the eMMC through the APK application and sends the internal information, so that the efficiency is improved, and the labor cost is reduced. The statistical information (Smart information) of the eMMC obtained by the APK application and the drawn temperature curve, the read-write curve, and the like may also be uploaded to the master manufacturer.
According to the eMMC information acquisition system of the embodiment of the invention, after the first terminal 100 is connected with the second terminal 200, the internal information of the eMMC can be directly acquired through the APK application without detaching the eMMC from the second terminal 200, so that the data of the eMMC is prevented from being damaged in the detaching process; moreover, an interactive interface is provided on the APK application of the first terminal 100, and a user only needs to perform a simple selection operation to obtain and view each item of data of the eMMC, and can upload the data to the master manufacturer, so that the master manufacturer does not need to send an FAE test engineer to the site, thereby improving efficiency and reducing labor cost.
It should be noted that, the content in the above method embodiment is applicable to the system embodiment, and the functions specifically implemented by the system embodiment are the same as those of the above method embodiment, and the beneficial effects achieved by the method embodiment are the same as those achieved by the above method embodiment.
On the other hand, the embodiment of the invention also provides electronic equipment, which comprises:
a memory for storing program instructions;
and the processor is used for calling the program instructions stored in the memory and executing the eMMC information acquisition method according to the obtained program instructions.
It should be noted that, the content in the above method embodiment is applicable to the present electronic device embodiment, and the functions specifically implemented by the present electronic device embodiment are the same as those of the above method embodiment, and the achieved beneficial effects are the same as those of the above method embodiment.
Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any of the functions and/or processing capabilities described in connection with a particular device or component may be performed by any other device or component. In addition, while various exemplary implementations and architectures have been described in terms of embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.
Certain aspects of the present disclosure are described above with reference to block diagrams and flowchart illustrations of systems, methods, systems and/or computer program products according to example embodiments. It will be understood that one or more blocks of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, respectively, can be implemented by executing computer-executable program instructions. Also, some of the blocks in the block diagrams and flowcharts may not need to be performed in the order shown, or may not need to be performed in their entirety, according to some embodiments. In addition, additional components and/or operations beyond those shown in blocks of the block diagrams and flowcharts may be present in some embodiments.
Accordingly, blocks of the block diagrams and flowchart illustrations support combinations of means for performing the specified functions, combinations of elements or steps for performing the specified functions and program instruction means for performing the specified functions. It will also be understood that each block of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, can be implemented by special purpose hardware-based computer systems that perform the specified functions, elements or steps, or combinations of special purpose hardware and computer instructions.
Program modules, applications, etc. described herein may include one or more software components including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functions described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.
The software components may be encoded in any of a variety of programming languages. An exemplary programming language may be a low-level programming language, such as an assembly language associated with a particular hardware architecture and/or operating system platform. Software components including assembly language instructions may need to be converted into executable machine code by an assembler prior to execution by a hardware architecture and/or platform. Another exemplary programming language may be a higher level programming language that may be portable across a variety of architectures. Software components, including higher-level programming languages, may need to be converted to an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages include, but are not limited to, a macro language, a shell or command language, a job control language, a scripting language, a database query or search language, or a report writing language. In one or more exemplary embodiments, a software component containing instructions of one of the programming language examples described above may be executed directly by an operating system or other software component without first converting to another form.
The software components may be stored as files or other data storage constructs. Software components having similar types or related functionality may be stored together, such as in a particular directory, folder, or library. The software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.

Claims (10)

1. An eMMC information acquiring method, comprising the steps of:
the method comprises the steps that a first terminal obtains internal information of eMMC on a second terminal through APK application, and the first terminal displays a first interface; the first interface comprises a first module, a second module and a third module;
responding to a first operation of the first module, and displaying a second interface by the first terminal; the second interface is used for displaying the statistical information of the eMMC obtained according to the internal information; the statistical information at least comprises read data total amount, write data total amount and erasing times information; or alternatively, the process may be performed,
responding to a second operation of the second module, and displaying a third interface by the first terminal; the third interface is used for displaying a temperature curve of the eMMC drawn according to the internal information; or alternatively, the process may be performed,
and responding to a third operation of the third module, the first terminal displays a fourth interface, and the fourth interface is used for displaying a read-write curve of the eMMC drawn according to the internal information.
2. The eMMC information acquiring method according to claim 1, wherein the number of erasures information includes: the method comprises the steps of maximum erasing times of a first area, minimum erasing times of the first area, average erasing times of the first area, maximum erasing times of a second area, minimum erasing times of the second area and average erasing times of the second area.
3. The eMMC information acquisition method according to claim 1, wherein the first interface further includes a fourth module, the eMMC information acquisition method further comprising the steps of:
and responding to a fourth operation of the fourth module, and uploading the internal information of the eMMC to a master control manufacturer by the first terminal.
4. The eMMC information acquiring method according to claim 1, further comprising the steps of:
and identifying the position of the eMMC with the abnormality according to the statistical information of the eMMC, and identifying the position with the abnormality on the second interface.
5. The eMMC information acquiring method according to claim 1, further comprising the steps of:
and evaluating the service life of the eMMC according to the erasing times information.
6. The eMMC information acquiring method according to claim 1, wherein the statistical information further includes an unexpected number of power failures of the eMMC.
7. The eMMC information acquiring method according to claim 1, further comprising the steps of:
and obtaining the highest temperature and the lowest temperature of the eMMC according to the temperature curve.
8. An eMMC information acquisition system, comprising:
the first terminal comprises an APK application;
a second terminal including eMMC;
the first terminal is capable of executing the eMMC information acquiring method according to any one of claims 1-7 on the eMMC of the second terminal through the APK application.
9. An electronic device, comprising:
a memory for storing program instructions;
a processor for invoking program instructions stored in the memory and executing the eMMC information acquiring method according to any one of claims 1-7 according to the obtained program instructions.
10. A storage medium storing computer-executable instructions for causing a computer to perform the eMMC information acquiring method of any one of claims 1 to 7.
CN202310465219.8A 2023-04-26 2023-04-26 eMMC information acquisition method and system, electronic device and storage medium Active CN116483639B (en)

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