CN116457609A - High-spacing luminaire thermal management - Google Patents

Abstract

A high-spacing luminaire (100), comprising: a plurality of heat sink structures (102, 104, 106, 108) attached to the electronics housing (110); and a light source (132, 134, 136, 138) attached to the plurality of heat sink structures (102, 104, 106, 108). Each heat sink structure (102, 104, 106, 108) includes a bottom wall (202) and side walls (204, 206, 208, 210) extending upwardly from the bottom wall (202). Each light source (132, 134, 136, 138) is attached to the bottom wall (202) of the respective heat sink structure (102, 104, 106, 108) on a surface of the bottom wall (202) facing away from the electronics housing (110). Each heat sink structure (102, 104, 106, 108) is spaced apart from other heat sink structures of the plurality of heat sink structures (102, 104, 106, 108) adjacent to the heat sink structure (102, 104, 106, 108).

Description

High-spacing luminaire thermal management

Technical Field

The present disclosure relates generally to light fixtures, and more particularly to light fixtures having thermal management structures.

Background

Conventional high-spacing light fixtures include a light source and associated structure and an electronics housing that encloses one or more components that control the light source. Dissipation of the heat generated by the light source is important for proper operation and service life of the high-spaced luminaire. In some cases, minimizing the cost of achieving effective dissipation of heat is important to the overall cost of Gao Jiange fixtures. Accordingly, there is a need for a cost-effective solution that facilitates efficient dissipation of heat generated by the light sources of highly spaced light fixtures.

GB 2574138A relates to a luminaire comprising an electrical housing assembly and a light module assembly. The optical module assembly is connected to the electrical housing assembly such that an air gap is defined between the optical module assembly and the electrical housing assembly. The electrical housing assembly has a variable length such that the length of the electrical housing is proportional to the number of light module assemblies connected to the electrical housing assembly. The optical module assembly and the electrical housing assembly are connected by at least one module attachment arm.

US 2013/301275Al relates to a light emitting diode bulb comprising: a socket base configured to be inserted into a luminaire; a plurality of separate heat sinks attached to the socket base; a light emitting diode element mounted on the plurality of separate heat sinks; and an optical element covering one of the light emitting diode elements.

US 2018/149949 Al relates to a device for developing LED systems with high heat dissipation power relative to the weight of the system by containing open areas. The open area reduces the weight of the optical system while improving airflow. Associated optics are described to efficiently and uniformly distribute light from an LED by adjusting the optical distribution. Further, circuits and methods are described to allow an LED system to operate with an existing power source (such as a ballast or an offline AC voltage source, or both).

US 2020/200378Al relates to a high-space luminaire comprising an electronics housing and a light module comprising a light source emitting light. The high-spacing luminaire further comprises a tubular connector. The electronics housing is attached to the tubular connector at a first end of the tubular connector and the optical module is attached to the tubular connector at a second end of the tubular connector, the second end of the tubular connector being separated from the electronics housing by the tubular connector. The tubular connector provides a line for routing wires between the electronics housing and the light module.

Disclosure of Invention

The present disclosure relates generally to light fixtures, and more particularly to light fixtures having auxiliary device attachment structures. In an exemplary embodiment, a high-spacing luminaire includes an electronics housing, a plurality of heat sink structures attached to the electronics housing, and a light source attached to the plurality of heat sink structures. Each heat sink structure includes a bottom wall and a side wall extending upwardly from the bottom wall. Each light source is attached to the bottom wall of a respective one of the plurality of heat sink structures on a surface of the bottom wall facing away from the electronics housing. Each radiator structure is spaced apart from other radiator structures of the plurality of radiator structures that are adjacent to the radiator structure.

These and other aspects, objects, features and embodiments will be apparent from the following description and appended claims.

Drawings

Reference will now be made to the accompanying drawings in which:

FIG. 1A illustrates a bottom perspective view of a high-spacing luminaire according to an example embodiment;

FIG. 1B illustrates a bottom perspective view of the high-spacing luminaire of FIG. 1A with the lens removed, according to an example embodiment;

2A-2C illustrate different views of a heat sink structure corresponding to the heat sink structure of the luminaire of FIG. 1A, according to an example embodiment;

fig. 3 illustrates a side perspective view of the high-spacing luminaire of fig. 1A, according to an exemplary embodiment. The method comprises the steps of carrying out a first treatment on the surface of the

FIG. 4 illustrates a perspective view of the high-spacing luminaire of FIG. 1A, according to an exemplary embodiment;

FIG. 5 illustrates a side perspective view of the high-spacing luminaire of FIG. 1A, showing a driver of the luminaire, according to an example embodiment;

FIG. 6 illustrates an assembly of a heat sink structure of the high-spacing luminaire of FIG. 1A, according to an exemplary embodiment;

FIG. 7 illustrates an assembly of a retaining structure and a heat sink structure of the high-spacing luminaire of FIG. 1A, according to an exemplary embodiment;

fig. 8 illustrates a bottom perspective view of a receiving unit of an electronics housing of the high-clearance luminaire of fig. 1A, according to an exemplary embodiment;

FIG. 9A illustrates a top perspective view of a retaining structure of the luminaire of FIG. 1A, according to another exemplary embodiment;

FIG. 9B illustrates a bottom perspective view of a retaining structure of the luminaire of FIG. 1A, according to another exemplary embodiment; and

fig. 10A and 10B illustrate different views of a high-spacing luminaire according to another exemplary embodiment.

The drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of scope. The elements and features illustrated in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the exemplary embodiments. In addition, certain dimensions or arrangements may be exaggerated to help visually convey such principles. In the drawings, the same reference numerals used in different drawings denote similar or corresponding elements, but do not necessarily denote the same elements.

Detailed Description

In the following paragraphs, specific embodiments will be described in further detail by way of example with reference to the accompanying drawings. In the description, well-known components, methods and/or processing techniques will be omitted or briefly described. Furthermore, references to various features of an embodiment do not indicate that all of the embodiments must include the referenced features.

Fig. 1A illustrates a bottom perspective view of a high-spacing luminaire 100 according to an exemplary embodiment, and fig. 1B illustrates a bottom perspective view of the high-spacing luminaire 100 of fig. 1A with lenses removed according to an exemplary embodiment. In some exemplary embodiments, the luminaire 100 includes the heat sink structures 102, 104, 106, 108. The heat sink structures 102, 104, 106, 108 may be configured such that the assembly of the heat sink structures 102, 104, 106, 108 has a circular outer perimeter as shown in fig. 1A and 1B. The luminaire 100 may also include an electronics housing 110 containing components such as a driver. The luminaire 100 may further comprise light sources 132, 134, 136, 138 attached to the heat sinks 102, 104, 106, 108, respectively. For example, each light source 132, 134, 136, 138 may include a Light Emitting Diode (LED) disposed on a circuit board. As one of ordinary skill in the art will readily appreciate having the benefit of the present disclosure, for purposes of illustration, the light source 136 may include an LED, such as LED1 30, that is attached to the circuit board in a desired configuration.

In some exemplary embodiments, each light source 132, 134, 136, 138 may be attached to a respective one of the heat sink structures 102, 104, 106, 108 using a thermal adhesive tape, as would be readily understood by one of ordinary skill in the art having the benefit of the present disclosure. Heat generated by the light sources 132, 134, 136, 138 is transferred to the heat sink structures 102, 104, 106, 108 to dissipate away from the light sources 132, 134, 136, 138. To illustrate, heat generated by light source 132 is transferred to heat sink structure 102, heat generated by light source 134 is transferred to heat sink structure 104, heat generated by light source 136 is transferred to heat sink structure 106, and heat generated by light source 138 is transferred to heat sink structure 108.

In some exemplary embodiments, the luminaire 100 includes lenses 112, 114, 116, 118, the lenses 112, 114, 116, 118 being attached to respective ones of the heat sink structures 102, 104, 106, 108. To illustrate, lens 112 is attached to heat sink structure 102 and covers light source 132, lens 114 is attached to heat sink structure 104 and covers light source 134, lens 116 is attached to heat sink structure 106 and covers light source 136, and lens 118 is attached to heat sink structure 108 and covers light source 138. For example, the lenses 112, 114, 116, 118 may be attached to the heat sink structures 102, 104, 106, 108 using fasteners, such as fasteners 148 extending through corresponding holes in the heat sink structure 104 and used to attach the lenses 114 to the heat sink structure 104. Because the light sources 132, 134, 136, 138 are positioned between the lenses 112, 114, 116, 118 and the heat sink structures 102, 104, 106, 108, attaching the lenses 112, 114, 116, 118 to the heat sink structures 102, 104, 106, 108 using the fasteners 148 may also remain attached to the light sources 132, 134, 136, 138 of the heat sink structures 102, 104, 106, 108.

In some exemplary embodiments, each of the heat sink structures 102, 104, 106, 108 is spaced apart from each other by respective convective channels on both sides of the heat sink structures 102, 104, 106, 108. For example, the radiator structure 102 is spaced apart from the radiator structure 104 by the convection channel 140, and the radiator structure 102 is spaced apart from the radiator structure 108 by the convection channel 146. The radiator structure 104 is spaced apart from the radiator structure 102 by the convection channel 140 and the radiator structure 104 is spaced apart from the radiator structure 106 by the convection channel 142. The radiator structure 106 is spaced apart from the radiator structure 104 by convection channels 142 and the radiator structure 106 is spaced apart from the radiator structure 108 by convection channels 144. The radiator structure 108 is spaced apart from the radiator structure 106 by convection channels 144 and the radiator structure 108 is spaced apart from the radiator structure 102 by convection channels 146.

In some exemplary embodiments, the luminaire 100 includes a cover 120 and gap covers 122, 124, 126, 128. The cover 120 may be a spatial covering located at the center of the assembly of the heat sink structures 102, 104, 106, 108. The gap covers 122, 124, 126, 128 may cover the convective channels 140, 142, 144, 146 at the outer perimeter of the heat sink structures 102, 104, 106, 108. The convective pathway 140, 142, 144, 146 allows for an upward flow of air between adjacent ones of the radiator structures 102, 104, 106, 108. For example, the upward flowing air flow through the convective pathway 140, 142, 144, 146 may carry heat generated by the light sources 132, 134, 136, 138 away from the heat sink structure 102, 104, 106, 108.

In some exemplary embodiments, the heat sink structures 102, 104, 106, 108 are made of aluminum sheet metal using methods such as stamping, as one of ordinary skill in the art would readily understand, given the benefit of this disclosure. In some exemplary embodiments, the gap covers 122, 124, 126, 128 may be made of plastic and may be snapped onto the heat sink structures 102, 104, 106, 108, for example. In some exemplary embodiments, the electronics housing 110 may be made of aluminum using a method such as die casting.

The use of aluminum sheet metal to fabricate the heat sink structures 102, 104, 106, 108 may result in efficient transfer and dissipation of heat generated by the light sources 132, 134, 136, 138. Furthermore, in some cases, the use of aluminum metal plates may result in reduced costs of manufacturing the luminaire 100 as compared to heat sink structures that may be manufactured using die casting. For example, the metal plate may have a thickness that is less than a typical minimum thickness of a die-cast heat sink structure, which may result in reduced material costs.

In some alternative embodiments, luminaire 100 may include more or fewer heat sink structures than shown in fig. 1A and 1B without departing from the scope of the present disclosure. In some alternative embodiments, the convection channel may be wider or narrower than shown without departing from the scope of the present disclosure. In some alternative embodiments, the lenses and light sources of luminaire 100 may have different configurations and/or shapes than shown without departing from the scope of the present disclosure. In some alternative embodiments, the heat sink structure may have a shape different from that shown without departing from the scope of the present disclosure. For example, the heat sink structure may be formed into a non-circular shape without departing from the scope of the present disclosure.

Fig. 2A-2C illustrate different views of the heat sink structure 200 in the heat sink structures 102, 104, 106, 108 corresponding to the luminaire 100 of fig. 1A, according to an example embodiment. The heat sink structure 200 and references to elements of the heat sink structure 200 described below are applicable to the heat sink structures 102, 104, 106, 108. Referring to fig. 1A-2C, in some exemplary embodiments, the heat sink structure 200 includes a bottom wall 202 and sidewalls 204, 206, 208, 210 extending upwardly from the bottom wall 202. For example, the side walls 204, 206, 208, 210 may extend upwardly at the outer periphery of the bottom wall 202. Bottom wall 202 may be wider at sidewall 208 than at sidewall 210 such that sidewalls 204 and 206 are closer to each other at sidewall 210 than at sidewall 208.

In some exemplary embodiments, the sidewalls 204, 206 may extend upward at a 90 degree angle relative to the bottom wall 202. Alternatively, the sidewalls 204, 206 may be inclined relative to the bottom wall 202. For example, each of the sidewalls 204, 206 may be inclined outwardly (i.e., away from each other) at an angle of about 91 degrees to 95 degrees (e.g., 91 degrees, 92 degrees, etc.) relative to the bottom wall 202. In some exemplary embodiments, the side walls 208, 210 may also extend vertically or obliquely upward from the bottom wall 202.

In some exemplary embodiments, the sidewall 210 may be longer than the other sidewalls 204, 206, 208. For example, the heat sink structure 200 may include a flange 212 extending from the sidewall 210. Flange 212 may include attachment holes 216, and fasteners (e.g., screws) may extend through the attachment holes to attach flange 212 to electronics housing 110 of luminaire 100. The attachment of flange 212 to electronics housing 110 effectively attaches heat sink structure 200 to electronics housing 110. The attachment of flange 212 to electronics housing 110 also results in bottom wall 202 of heat spreader structure 200 being spaced apart from electronics housing 110 by at least height H of side wall 210. For example, the flange 212 may extend horizontally or in an obliquely upward direction from the sidewall 210.

In some exemplary embodiments, the side wall 210 includes wiring holes 218 and the flange 212 includes wiring slots 214. The cable may be routed between the electronics housing 110 and the light source through the routing slot 214 and the routing hole 218. For example, the light source may be attached to the surface 242 of the bottom wall 202 of the heat sink structure 200. To illustrate, the heat sink structure 200 may correspond to the heat sink structure 102 shown in fig. 1A and 1B, and the light source 132 may be attached to a surface of a bottom wall of the heat sink structure 102.

In some exemplary embodiments, the heat sink structure 200 has a hole formed in the bottom wall 202. For example, the hole 220 in the bottom wall 202 may be used to extend a cable routed through the routing hole 218 to the light source. Holes in the bottom wall 202 proximate the side walls 204, 206 (such as holes 238, 240) may be used to attach a lens (such as lens 112) to the bottom wall 202 of the heat sink structure 200 using fasteners 222 (e.g., screws). For example, the fastener 222 may correspond to the fastener 148 shown in fig. 1. The heat sink structure 200 may also include holes 228, 230, 232, 234, 236, the holes 228, 230, 232, 234, 236 may be used to securely attach a retaining structure (e.g., retaining structure 402 shown in fig. 4) to the bottom wall 202 of the heat sink structure 200. The fastener 224 extending through the aperture 236 may be one of several fasteners or structures that may be used to securely attach the retaining structure to the heat sink structure 200. The attachment structures of the retaining structures may also be inserted into the holes 228, 230, 232, 234. The fasteners 222 may also be inserted into corresponding holes in the retaining structure to securely attach the retaining structure to the heat sink structure 200. Alternatively or additionally, a corresponding nut may be attached to the respective fastener 222.

In some exemplary embodiments, sidewall 208 may be curved as sidewall 208 extends between sidewall 204 and sidewall 206. The sidewall 208 may be curved such that the sidewall 208 is a segment of a circular perimeter formed by an assembly of multiple sidewalls of the heat sink structure 200. To illustrate, the side walls of each heat sink structure 102, 104, 106, 108 of the luminaire 100 corresponding to the side walls 208 of the heat sink structure 200 may be a circumferential section of a circular shape formed by the assembly of heat sink structures 102, 104, 106, 108 as shown in fig. 1A.

In some exemplary embodiments, the sidewall 208 and the sidewall 204 may be separated by a gap at one end of the sidewall 208, and the sidewall 208 and the sidewall 206 may be separated by another gap at the other end of the sidewall 208. Sidewall 204 may also be separated from sidewall 210 by a gap 244 at an end opposite sidewall 208, and sidewall 206 may be separated from sidewall 210 by a gap 246 at an end opposite sidewall 208. The gaps 244, 246 may allow a retaining structure (such as retaining structure 402 shown in fig. 4) to be placed on the bottom wall 202 and around the wide wall 210 in a similar manner as shown in fig. 4 and 7 with respect to the heat sink structures 102, 104, 106, 108.

In some alternative embodiments, the heat sink structure 200 may have a shape different from that shown without departing from the scope of the present disclosure. For example, each of the walls of the heat sink structure 200 may have a different shape than shown. In some alternative embodiments, one or more apertures in the bottom wall 202, in the side wall 210, and/or in the flange 212 may be in different locations than shown without departing from the scope of the present disclosure. In some alternative embodiments, one or more holes in the bottom wall 202, in the side wall 210, and/or in the flange 212 may be omitted without departing from the scope of the present disclosure. In some alternative embodiments, flange 212 may be omitted and sidewall 210 may be attached to electronics housing 110 using other means, as persons of ordinary skill in the art having the benefit of the present disclosure readily understand.

Fig. 3 illustrates a side perspective view of the high-spacing luminaire 100 of fig. 1A, according to an exemplary embodiment. Referring to fig. 1A-3, in some exemplary embodiments, the heat sink structure 102 includes a sidewall 302 corresponding to the sidewall 210 of the heat sink structure 200 shown in fig. 2, the heat sink structure 104 includes a sidewall 304 corresponding to the sidewall 210 of the heat sink structure 200 shown in the figures, the heat sink structure 106 includes a sidewall 306 corresponding to the sidewall 210 of the heat sink structure 200 shown in fig. 2, and the heat sink structure 108 includes a sidewall 308 corresponding to the sidewall 210 of the heat sink structure 200 shown in fig. 2.

In some example embodiments, the flange of each sidewall of the heat sink structure 102, 104, 106, 108 corresponding to the flange 212 of the heat sink structure 200 may be attached to the electronics housing 110 using fasteners such as the fastener 312 shown in fig. 3. The bottom wall of each heat spreader structure 102, 104, 106, 108 corresponding to the bottom wall 202 of the heat spreader structure 200 may be spaced apart from the electronics housing 110 by a height H of the corresponding side wall 302, 304, 306, 308. Since the sidewalls 302, 304, 306, 308 of the heat spreader structures 102, 104, 106, 108 are longer than the other sidewalls of the heat spreader structures 102, 104, 106, 108, the impact of heat dissipated from the surfaces of the other sidewalls of the heat spreader structures 102, 104, 106, 108 on components within the electronics housing 110 is reduced.

Fig. 4 illustrates a top perspective view of the high-spacing luminaire 100 of fig. 1A, according to an example embodiment. Referring to fig. 1A-4, in some exemplary embodiments, the heat sink structure 102 includes a retaining structure 402 positioned on a bottom wall of each heat sink structure 102, 104, 106, 108 corresponding to the bottom wall 202 of the heat sink structure 200 of fig. 2. The retaining structure 402 is also positioned around the side walls 302, 304, 306, 308 of the heat spreader structures 102, 104, 106, 108. For example, the retaining structure 402 may be used to reduce movement of the respective heat sink structures 102, 104, 106, 108 to minimize variation in the relative positions of the heat sink structures 102, 104, 106, 108 with respect to one another. As one of ordinary skill in the art, with the benefit of this disclosure, will readily appreciate that the retaining structure 402 may be made of aluminum and/or another suitable material using a method such as die casting.

In some example embodiments, the retention structure 402 may include holes for routing cables between the electronics housing 110 and the light sources of the respective heat sink structures 102, 104, 106, 108. For example, the cable 404 may be routed between the electronics housing 110 and the light source 132 attached to the bottom wall of the heat sink structure 102 through a hole in the retaining structure 402. As shown in fig. 1B, the light source 132 is attached to a surface of the bottom wall of the heat sink structure 102 facing away from the electronics housing 110. As another example, the cable 406 may be routed between the electronics housing 110 and the light source 134 attached to the bottom wall of the heat sink structure 104 through another hole in the retention structure 402. As shown in fig. 1B, the light source 134 is attached to a surface of the bottom wall of the heat sink structure 104 facing away from the electronics housing 110. As another example, the cable 408 may be routed between the electronics housing 110 and the light source 138 attached to the bottom wall of the heat sink structure 108 through another hole in the retention structure 402. As shown in fig. 1B, the light source 138 is attached to a surface of the bottom wall of the heat sink structure 108 facing away from the electronics housing 110. Another cable may similarly be routed between electronics housing 110 and light source 136 attached to the bottom wall of heat sink structure 106 through another hole in retaining structure 402.

In some exemplary embodiments, the luminaire 100 may be suspended from a ceiling structure, for example. For example, one or more cables (not shown) that may be used to suspend the luminaire 100 from a ceiling structure may be attached to the attachment structure 410 of the electronics housing 110. One of ordinary skill in the art, with the benefit of this disclosure, will readily appreciate that one or more wires may also be routed into the cavity of the electronics housing 110 via a channel in the attachment structure.

In some alternative embodiments, the cables may be routed between the electronics housing 110 and the light sources of the heat sink structures 102, 104, 106, 108 in a different manner than shown without departing from the scope of the present disclosure. In some alternative embodiments, the retention structure 402 may be omitted or the retention structure 402 replaced with one or more other structures without departing from the scope of this disclosure. In some exemplary embodiments, electronics housing 110 may have a different shape and/or components/structures than shown without departing from the scope of the present disclosure.

Fig. 5 illustrates a side perspective view of the high-spacing luminaire of fig. 1A, showing a driver of the luminaire, according to an example embodiment. Referring to fig. 1A-5, in some exemplary embodiments, a driver 502 of the luminaire 100 is positioned in a cavity 504 of the electronics housing 110. The driver 502 provides power to the light sources 132, 134, 136, 138 attached to the heat sink structures 102, 104, 106, 108. For example, the driver 502 may provide power to the light source 132 via the cable 404. As another example, driver 502 may provide power to light source 134 via cable 406.

In some alternative embodiments, the gap covers 122, 124, 126, 128 shown in fig. 1A may be omitted as shown in fig. 5, and in some alternative embodiments, other electronic components may be positioned in the cavity 504 of the electronics housing 110. In some alternative embodiments, the driver 502 may have a different shape or may be in a different location than shown without departing from the scope of the invention.

Fig. 6 illustrates an assembly of the heat sink structures 102, 104, 106, 108 of the high-spacing luminaire of fig. 1A, according to an example embodiment. As described above, in some exemplary embodiments, each of the heat sink structures 102, 104, 106, 108 may correspond to the heat sink structure 200 shown in fig. 2. Referring to fig. 1A-6, in some exemplary embodiments, the heat sink structure 102 includes a bottom wall 602 and sidewalls 604, 606, 608, 302 extending upwardly from the bottom wall 602. The heat sink structure 104 may include a bottom wall 610 and sidewalls 612, 614, 616, 304 extending upwardly from the bottom wall 610. The heat spreader structure 106 may include a bottom wall 618 and sidewalls 620, 622, 624, 306 extending upwardly from the bottom wall 618. The heat sink structure 108 may include a bottom wall 628 and sidewalls 630, 632, 634, 308 extending upwardly from the bottom wall 628.

In some exemplary embodiments, the side wall 606 is adjacent to the side wall 612 and is spaced apart from the side wall 612 by the convection channel 140, the convection channel 140 providing a path for air to flow upward between the side wall 606 and the side wall 612. For example, side wall 606 may be at 90 degrees relative to bottom wall 602 and side wall 612 may be at 90 degrees relative to bottom wall 610. Alternatively, the sidewalls 606 and 612 may be inclined toward each other, which may create a Bernoulli effect and thus promote heat dissipation of the heat sink structures 102, 104. For example, side walls 606 and 612 may extend upward at an angle of 91 to 95 degrees or more relative to bottom wall 602 and bottom wall 610, respectively. The convective pathway 140 may extend the entire length of the sidewalls 606, 612.

In some exemplary embodiments, the side wall 614 is adjacent to the side wall 620 and is spaced apart from the side wall 620 by the convection channel 142, the convection channel 142 providing a path for air to flow upward between the side wall 614 and the side wall 620. For example, sidewall 614 may be at a 90 degree angle relative to bottom wall 610 and sidewall 620 may be at a 90 degree angle relative to bottom wall 618. Alternatively, the sidewalls 614 and 620 may be sloped toward each other, which may create a bernoulli effect and thus facilitate heat dissipation by the heat sink structures 104, 106. For example, side walls 614 and 620 may extend upwardly at an angle of 91 to 95 degrees or more relative to bottom wall 610 and 618, respectively. The convective pathway 142 may extend the entire length of the sidewalls 618, 620.

In some exemplary embodiments, the side wall 622 is adjacent to the side wall 632 and is spaced apart from the side wall 632 by the convection channel 144, the convection channel 144 providing a path for air to flow upward between the side wall 622 and the side wall 632. For example, side wall 622 may be at a 90 degree angle relative to bottom wall 618, and side wall 632 may be at a 90 degree angle relative to bottom wall 628. Alternatively, the side walls 622 and 632 may be inclined toward each other, which may create a bernoulli effect and thus promote heat dissipation of the heat sink structures 106, 108. For example, side wall 622 and side wall 632 may extend upwardly at an angle of 91 to 95 degrees or more relative to bottom wall 618 and bottom wall 628, respectively. The convection channel 144 may extend the entire length of the side walls 622, 632.

In some exemplary embodiments, the side wall 630 is adjacent to the side wall 604 and is spaced apart from the side wall 604 by the convection channel 146, the convection channel 146 providing a path for air to flow upward between the side wall 630 and the side wall 604. For example, side wall 630 may be at a 90 degree angle relative to bottom wall 628 and side wall 604 may be at a 90 degree angle relative to bottom wall 602. Alternatively, the sidewalls 630 and 604 may be sloped toward each other, which may create a bernoulli effect and thus promote heat dissipation of the heat sink structures 108, 102. For example, side wall 630 and side wall 604 may extend upward at an angle of 91 to 95 degrees or more relative to bottom wall 628 and bottom wall 602, respectively. The convection channel 146 may extend the entire length of the side walls 630, 604.

In some example embodiments, the sidewalls 608, 616, 624, 634 corresponding to the sidewalls 208 of the heat sink structure 200 may be curved such that the sidewalls 608, 616, 624, 634 are sections of a circular perimeter formed by an assembly of multiple sidewalls of the heat sink structure 200. In general, the heat sink structures 102, 104, 106, 108 may be arranged in a circular configuration as shown in fig. 6.

Fig. 7 illustrates an assembly of a retaining structure and a heat sink structure of the high-spacing luminaire of fig. 1A, according to an exemplary embodiment. Referring to fig. 1A-7, in some exemplary embodiments, the retaining structure 402 is positioned on the bottom wall of the heat sink structure 102, 104, 106, 108. To illustrate, the section 706 of the retention structure 402 may be positioned on a portion of the bottom wall 610 of the heat sink structure 104, as shown in fig. 7. For example, section 706 may include protruding structures 702 and 704 proximate sidewalls 612 and 614, respectively, of heat spreader structure 104. For example, the protruding structures 704, 704 may each provide structural support to the respective side wall 612, 614. The section 706 of the retaining structure 402 may also include an aperture 708, which aperture 708 may be used to guide the cable 406 (shown in fig. 4-5) to the light source 134, the light source 134 being attached to the bottom wall 610 on a side of the bottom wall 610 opposite the section 706. Other sections of the retaining structure 402 may be similarly positioned on the bottom walls of the other heat sink structures 102, 106, 108. Other protruding structures of the retaining structure 402, similar to the protruding structures 702, 704, may be positioned on the bottom wall of a respective one of the other heat sink structures 102, 106, 108 and may similarly provide structural support to each side wall of the heat sink structures 102, 106, 108.

In some example embodiments, the sidewalls 302, 304, 306, 308 of the heat spreader structures 102, 104, 106, 108 may extend through the opening 710 of the retention structure 402 such that the retention structure 402 is positioned around the sidewalls 302, 304, 306, 308. The retaining structure 402 may be used to reduce movement of the respective heat sink structures 102, 104, 106, 108.

In some exemplary embodiments, the flange extending from each sidewall 302, 304, 306, 308 may correspond to the flange 212 of the heat sink structure 200. For example, the flange 714 extending from the sidewall 304 may correspond to the flange 212 of the heat sink structure 200 and may be attached to the electronics housing 110 using one or more fasteners (e.g., the fasteners 312 shown in fig. 3). The attachment of the flange 714 to the electronics housing 110 (e.g., bottom wall of the electronics housing 110) effectively attaches the heat sink structure 104 to the electronics housing 110. The flanges of the other sidewalls 302, 306, 308 may be similarly attached to the electronics housing 110 using fasteners (e.g., fasteners 312 shown in fig. 3) that extend through holes in the flanges. The heat sink structures 102, 106, 108 may be operatively attached to the electronics housing 110 by attaching flanges of the respective heat sink structures 102, 106, 108 to the electronics housing 110.

In some alternative embodiments, the retention structure 402 may be omitted without departing from the scope of this disclosure. In some alternative embodiments, the retaining structure 402 may have a different shape than shown without departing from the scope of the present disclosure. In some alternative embodiments, one or more protruding structures of retaining structure 402 may be omitted without departing from the scope of this disclosure. In some alternative embodiments, the flanges of the heat sink structures 102, 104, 106, 108 may have different shapes than shown without departing from the scope of the present disclosure.

Fig. 8 illustrates a bottom perspective view of a receiving unit 800 of the electronics housing 110 of the high-spacing luminaire 100 of fig. 1A, according to an exemplary embodiment. Referring to fig. 1A-8, in some exemplary embodiments, the electronics housing 110 includes a receiving unit 800. The receiving unit 800 may comprise a base 810, the base 810 having holes 802, 804 for attachment to the receiving unit 800 (the flange of the heat sink structure 102, 104, 106, 108 corresponds to the flange 212 of the heat sink structure 200). The fasteners (fastener 312 as shown in fig. 3) may extend through holes in the flanges of the heat sink structures 102, 104, 106, 108 that correspond to the holes 216 in the flange 212 of the heat sink structure 200 to attach the flange to the receiving unit 800 of the electronics housing 110. For example, the holes in the flange 714 of the heat sink structure 104 shown in fig. 7 may be aligned with the holes 802, 804 of the receiving base 800 such that fasteners (e.g., screws) may extend through the holes to attach the flange 714 to the receiving unit 800 of the electronics housing 110. The flanges of the other heat sink structures 102, 106, 108 may be attached to the receiving unit 800 in a similar manner using fasteners extending through aligned holes in the flanges and the receiving unit 800.

In some exemplary embodiments, the base 810 of the receiving unit 800 includes a hole (such as hole 806) for routing cables between the driver 502 in the cavity 504 of the electronics housing 110 and the light source attached to the heat sink structure 102, 104, 106, 108. For example, a cable 406 (shown in fig. 4) extending between driver 502 and light source 134 (shown in fig. 1B) may be routed through aperture 806 (shown in fig. 8). Other cables for providing power to the light sources of the other heat sink structures 102, 106, 108 may be routed through similar holes in the base 810 of the receiving unit 800.

In some alternative embodiments, the receiving unit 800 may have more or fewer apertures than shown without departing from the scope of the present disclosure. In some alternative embodiments, the holes in the base 810 of the receiving unit 800 may be at different locations than shown without departing from the scope of the present disclosure. In some alternative embodiments, the receiving unit 800 may have a different shape than shown without departing from the scope of the present disclosure.

Fig. 9A illustrates a top perspective view of the retaining structure 402 of the luminaire of fig. 1A according to another exemplary embodiment, and fig. 9B illustrates a bottom perspective view of the retaining structure 402 of the luminaire 100 of fig. 1A according to another exemplary embodiment. Referring to fig. 1A-9B, in some exemplary embodiments, the retention structure 402 includes a plurality of protruding structures, such as protruding structures 702, 704. As described above with respect to the protruding structures 702, 704, the protruding structures may be positioned proximate to and provide structural support for the sidewalls of the heat spreader structures 102, 104, 106, 108. As an example, the protruding structure 902 may be positioned on the bottom wall 602 of the heat sink structure 102 and may provide structural support to the side walls 606 of the heat sink structure 102.

In some exemplary embodiments, the retaining structure 402 has an opening 710, and the sidewalls 302, 304, 306, 308 corresponding to the sidewalls 210 of the heat spreader structure 200 may extend through the opening 710 (as shown in fig. 7). The retaining structure 402 may also include holes 708 and holes 906, 908, 910, the holes 708 and holes 906, 908, 910 being used to guide the cables to the light sources of the heat sink structures 102, 104, 106, 108 (as described with respect to the holes 708). The holes 708, 906, 908, 910 are located in respective sections of the retaining structure 402 located on the bottom wall of the heat sink structure 102, 104, 106, 108.

In some exemplary embodiments, the retaining structure 402 includes an attachment structure that protrudes on a side of the bottom wall of the retaining structure 402 that faces the heat sink structure 102, 104, 106, 108. For example, the retaining structure 402 may include attachment structures 914, 916, 918, 920, the side of the retaining structure 402 facing the bottom wall 610 of the heat sink structure 104 protruding from the attachment structures 914, 916, 918, 920. The attachment structures may be inserted into corresponding holes in the bottom walls of the heat sink structures 102, 104, 106, 108. For purposes of illustration with respect to the heat sink structure 200 shown in fig. 2 (which represents the heat sink structures 102, 104, 106, 108), attachment structures 914 and 916 may be inserted into holes 228 and 230, respectively, and attachment structures 918 and 920 may be inserted into holes 232 and 234, respectively.

In some example embodiments, the retaining structure 402 may include holes for securely attaching the heat sink structures 102, 104, 106, 108 to the retaining structure 402 using fasteners. To illustrate with respect to the heat sink structure 200 shown in fig. 2, the retaining structure 402 may include holes 922, and fasteners 224 extending through holes 236 in the bottom wall 202 of the heat sink structure 200 may be inserted into the holes 922 to securely attach the heat sink structure 200 to the retaining structure 402. As shown in fig. 9B, the retaining structure 402 may include a plurality of holes located at different sections of the retaining structure 402.

In some exemplary embodiments, fasteners for attaching lenses to the heat sink structure 200 may also be inserted into holes in the protruding structures of the retaining structure 402 to more securely attach the heat sink structure 200 to the retaining structure 402. For example, the fastener 222 shown in fig. 2 may be inserted into a hole (such as hole 904) in the protruding structure 702 of the retaining structure 402.

In some alternative embodiments, the retaining structure 402 may have a different shape than shown without departing from the scope of the present disclosure. In some alternative embodiments, one or more holes of retaining structure 402 may be omitted without departing from the scope of this disclosure. In some alternative embodiments, some of the holes of the retaining structure 402 may be at different locations than shown without departing from the scope of the present disclosure. In some alternative embodiments, the opening 710 may have a different shape than shown without departing from the scope of the present disclosure.

Fig. 10A and 10B illustrate different views of a high-spacing luminaire 1000 according to another exemplary embodiment. In some exemplary embodiments, luminaire 1000 is similar to luminaire 100 of fig. 1A. In contrast to luminaire 100, luminaire 1000 includes six heat sink structures instead of four. To illustrate, the luminaire 1000 can include a heat sink structure 1002, 1004, 1006, 1008, 1010, 1012, each of the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 having bottom walls and sidewalls corresponding to the bottom walls and sidewalls of the heat sink structure 200 of fig. 2. In general, the heat spreader structures 1002, 1004, 1006, 1008, 1010, 1012 are similar to the heat spreader structures 102, 104, 106, 108, with the primary differences being related to size. For example, the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 may be sized such that the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 may be arranged in a circular configuration in a similar manner as described with respect to the heat sink structures 102, 104, 106, 108 of the luminaire 100.

The light sources are attached to the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 in a similar manner as described with respect to the luminaire 100. Lenses (e.g., lenses 1022) are also attached to respective ones of the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 in a similar manner as described with respect to the luminaire 100.

The heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 are also arranged such that a convection channel (such as convection channel 1020) exists between adjacent ones of the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 in a similar manner as described with respect to the luminaire 100. A gap cover (such as gap cover 1018) may cover the convective pathway between adjacent heat sink structures in a similar manner as described with respect to luminaire 100.

In some exemplary embodiments, the luminaire 1000 includes an electronics housing 1014, and the electronics housing 1014 can contain a driver (e.g., an LED driver) similar to the driver 502 shown in fig. 5. The side walls of the heat spreader structures 1002, 1004, 1006, 1008, 1010, 1012 corresponding to the side walls 210 of the heat spreader structure 200 of fig. 2 may be attached to the electronics housing 1014 in a similar manner as described with respect to the heat spreader structures 102, 104, 106, 108. The driver may provide power to the light sources attached to the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 in a similar manner as described with respect to the luminaire 100. The luminaire 1000 may also include a retaining structure 1016 that attaches to the heat sink structure 1002, 1004, 1006, 1008, 1010, 1012 in a similar manner as described with respect to the retaining structure 402 of the luminaire 100.

In some exemplary embodiments, the heat sink structures 1002, 1004, 1006, 1008, 1010, 1012 may be made from sheet metal (e.g., aluminum sheet metal) using methods such as stamping, etc., as would be readily understood by one of ordinary skill in the art having the benefit of the present disclosure. The retaining structure 1016 and electronics housing 1014 can be made of metal such as aluminum using such methods as die casting, etc., as would be readily understood by one of ordinary skill in the art having the benefit of this disclosure.

In some alternative embodiments, the luminaire 1000 may include more or fewer heat sink structures than shown without departing from the scope of the disclosure. In some alternative embodiments, the heat sink structure of the luminaire 100 may be arranged in a different configuration than shown without departing from the scope of the present disclosure. In some alternative embodiments, the luminaire 1000 may include components other than those shown without departing from the scope of the invention. In some alternative embodiments, one or more components of the luminaire 1000 (e.g., the retaining structure 1016) may be omitted without departing from the scope of this disclosure.

Although specific embodiments have been described in detail herein, the description is by way of example. Features of the embodiments described herein are representative, and in alternative embodiments, certain features, elements, and/or steps may be added or omitted. Furthermore, various aspects of the embodiments described herein may be modified by those skilled in the art without departing from the scope of the appended claims, which scope is to be accorded the broadest interpretation so as to encompass modifications and equivalent structures.

Claims (12)

1. A high-spacing luminaire (100), comprising:

an electronics housing (110);

a plurality of heat spreader structures (102, 104, 106, 108) (200) attached to the electronics housing; and

a light source (132, 134, 136, 138) attached to the plurality of heat sink structures, wherein each heat sink structure comprises a bottom wall (202) and side walls (204, 206, 208, 210) extending upwardly from the bottom wall, wherein each light source is attached to the bottom wall (202) of a respective heat sink structure of the plurality of heat sink structures on a surface (240) of the bottom wall (202) facing away from the electronics housing (110),

wherein each heat spreader structure is spaced apart from other heat spreader structures of the plurality of heat spreader structures adjacent to the heat spreader structure, wherein a bottom wall (202) of each heat spreader structure is spaced apart from the electronics housing by at least a height of one of the side walls (210) of each heat spreader structure, wherein:

(a) The one of the side walls (210) of each heat sink structure includes an aperture (218) for routing a cable between the electronics housing and a light source attached to the heat sink structure; or (b)

(b) The plurality of heat sink structures are made of aluminum sheet metal.

2. The luminaire of claim 2 wherein a flange (212) extends from the one of the side walls (210) of each heat sink structure, and wherein the flange is attached to the electronics housing.

3. The luminaire of claim 1 further comprising a retaining structure (402) positioned on the bottom wall of each heat sink structure, wherein the one of the side walls (210) of each heat sink structure extends through the opening of the retaining structure.

4. The luminaire of claim 1, wherein a first sidewall (606) of a first heatsink structure (102) of the plurality of heatsink structures is spaced apart (140) from a sidewall (612) of a second heatsink structure (104) of the plurality of heatsink structures adjacent the first heatsink structure (102), and wherein a second sidewall (604) of the first heatsink structure (102) of the plurality of heatsink structures is spaced apart (146) from a sidewall (630) of a third heatsink structure (108) of the plurality of heatsink structures adjacent the first heatsink structure (102).

5. The luminaire of claim 4 wherein the first side wall (606) of the first heat sink structure (102) of the plurality of heat sink structures is inclined towards the side wall (612) of the second heat sink structure (104) of the plurality of heat sink structures, and wherein the side wall (612) of the second heat sink structure (104) of the plurality of heat sink structures is inclined towards the first side wall (606) of the first heat sink structure (102) of the plurality of heat sink structures.

6. The luminaire of claim 5 wherein the second sidewall (604) of the first heat sink structure (102) of the plurality of heat sink structures is sloped toward the sidewall (630) of the third heat sink structure (108) of the plurality of heat sink structures.

7. The luminaire of claim 1 wherein each of the plurality of heat sink structures is adjacent to two of the plurality of heat sink structures.

8. The luminaire of claim 1 wherein one of the sidewalls (208) of each of the plurality of heat sink structures is curved such that the second sidewall (208) of each sidewall is a segment of a circular shape.

9. The luminaire of claim 1, further comprising lenses (112, 114, 116, 118), wherein each lens is attached to the bottom wall (202) of a respective heat sink structure of the plurality of heat sink structures and covers the light source attached to the bottom wall (202) of the respective heat sink structure.

10. The luminaire of claim 1 wherein the plurality of heat sink structures comprises at least four heat sink structures.

11. The luminaire of claim 1 wherein the plurality of heat sink structures comprises at least six heat sink structures.

12. The luminaire of claim 1, further comprising a driver (502), the driver (502) positioned in the electronics housing and configured to provide power to the light source.