CN116448296A - Pressure measuring method based on temperature decoupling and flexible film pressure sensor - Google Patents
Pressure measuring method based on temperature decoupling and flexible film pressure sensor Download PDFInfo
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- 238000009530 blood pressure measurement Methods 0.000 claims description 10
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/26—Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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Abstract
The invention discloses a pressure measuring method based on temperature decoupling and a flexible film pressure sensor, wherein the pressure measuring method comprises the following steps: measuring pressure by using a flexible film pressure sensor, wherein the flexible film pressure sensor comprises a first matrix, a second matrix, a first electrode and a second electrode; at least one temperature measuring metal wire is embedded in the first matrix and the second matrix respectively; detecting the whole temperature of the first matrix and the second matrix in real time by using a temperature measuring metal wire to form a temperature value; and correcting the measured value of the flexible film pressure sensor by using the temperature value to form an actual pressure value. The temperature measuring metal wire can detect the temperature of the flexible film pressure sensor in real time, and correct the pressure value of the flexible film pressure sensor based on the temperature value, so that the decoupling of pressure and temperature is realized, and the accuracy of the pressure value of the flexible film pressure sensor is greatly improved.
Description
Technical Field
The invention relates to the technical field of flexible film pressure sensors, in particular to a pressure measuring method based on temperature decoupling and a flexible film pressure sensor.
Background
The wearable technology has potential application value in the aspects of health care, man-machine interaction, internet of things and the like, and the flexible film pressure sensor is an important component in the wearable device. The ideal flexible film pressure sensor has the characteristics of high sensitivity, high linearity, wide pressure response range, high measurement stability and the like. Constructing a certain surface microstructure can improve the sensitivity of the sensor, but the response of the sensor is gradually saturated due to the structural hardening problem of the soft material under the action of pressure, so that the device presents a narrower sensing range and remarkable nonlinear response.
The traditional objects are connected by adopting adhesives such as glue or a simple sucker structure, so that once the adhesive is placed in a humid environment or a more dust environment, the adhesive effect is greatly reduced, and the traditional adhesives are often influenced by factors such as temperature, shelf life and the like; the existing flexible film pressure sensor is affected by temperature and can deform, so that the pressure value detected by the pressure sensor is inaccurate.
For example, comparative document 1: chinese patent publication No. CN108784670B discloses a flexible adsorption device and a method for manufacturing the same, which is fixed on the body surface of a living body by adsorption through a plurality of suction cups, wherein the material of the plurality of suction cups, the plurality of supporting parts and the flexible substrate of the device is a flexible material. The flexible adsorption device manufactured by the manufacturing method has strong adsorptivity and good heat dissipation effect, can be used for multiple times, has wide application range, and is nontoxic and harmless to organisms. But the adsorption structure is exposed in the air, the adsorption force of the sucker structure is easily influenced by external environment factors, the sucker structure is not suitable for stable adsorption of any material, and the manufacturing process is relatively complex.
For example, comparison document 2: the Chinese patent with the publication number of CN112415856A discloses a flexible adsorption device and photoetching equipment, which comprises a mobile module and two flexible supporting pieces arranged at two opposite ends of the mobile module, wherein a vacuum adsorption cavity is arranged in the flexible supporting pieces so as to realize vacuum adsorption of the adsorbed pieces, the adsorbed pieces with rigidity larger than the flexible supporting pieces are still effective, the adsorption effect is influenced when the adsorbed pieces with smaller rigidity are adsorbed, and a vacuum pump is needed, so that the adsorption device is difficult to use on a micro device.
For example, comparison document 3: the Chinese patent with publication number of CN113752246A discloses a heavy-load precise flexible adsorption manipulator, but the structure shown by the manipulator realizes the function of heavy-load precise adsorption by matching a base-mounted cylinder with an adsorption plate and other structures, but the structure of the manipulator is large in space required by a micro device, complex in structure and high in manufacturing cost, and cannot meet the requirement of adsorption of the micro flexible device.
For example, comparison document 4: the university of Nanjing's energy and power engineering institute researches a mechanism of drag reduction through a concave structure, and the concave structure replaces the original solid bottom surface under subsonic speed, so that the formation position, shape and strength of a tail vortex street are changed, the bottom pressure is finally increased, and the resistance is reduced; under transonic velocity, the solid bottom surface and the fluid boundary surface have the same effect, so that the bottom recess does not have a drag reduction effect; under supersonic speed, the fluid in the concave structure adds mass to the bottom reflux zone so as to achieve the drag reduction effect. However, the method aims at the drag reduction effect of the concave cavity body in the movement process of the projectile and can not finish the adsorption function of the concave cavity body.
For example, comparison document 5: a flexible pressure temperature integrated film array sensor sensitive element and a preparation method thereof are proposed in Chinese patent publication No. CN201811073426.4, but pressure and temperature change are mutually influencing factors, and can be detected at the same time but decoupling is not realized.
For example, comparison document 6: a method for simultaneous detection of pressure and temperature based on gel is proposed in chinese patent publication No. CN202210300789.7, but independent changes of pressure and temperature cannot be distinguished.
For example, comparison document 7: in chinese patent publication No. CN202210827469.7, a metal-based pressure-temperature sensor for magnetron sputtering on an alumina-silica substrate is proposed, wherein the flexibility is for alumina inorganic materials, not for organic polymer materials, and mainly focused on the application of high temperature materials, and no coupling or decoupling of pressure and temperature is described.
In summary, since the existing flexible film pressure sensor is deformed due to the influence of temperature, so that the pressure value detected by the pressure sensor is inaccurate, a measurement optimization method of the pressure value, which is not influenced by the deformation or strain of the sensor when the flexible film pressure sensor works, is needed to improve the accuracy of the flexible film pressure sensor.
Disclosure of Invention
The invention mainly aims to provide a pressure measuring method based on temperature decoupling and a flexible film pressure sensor, and aims to solve the technical problem that in the prior art, the pressure value detected by the pressure sensor is inaccurate due to the fact that the flexible film pressure sensor is affected by temperature.
In order to achieve the above purpose, the pressure measurement method based on temperature decoupling provided by the invention uses a flexible film pressure sensor to measure pressure, wherein the flexible film pressure sensor comprises a first substrate, a second substrate, a first electrode and a second electrode; the plate surfaces of the first substrate and the second substrate are parallel to each other, a plurality of first arc-shaped protruding blocks are uniformly distributed at intervals on one side of the first substrate, which is close to the second substrate, a plurality of second arc-shaped protruding blocks are uniformly distributed at intervals on one side of the second substrate, which is close to the first substrate, and each second arc-shaped protruding block is positioned between two adjacent first arc-shaped protruding blocks; the first electrode covers one side of the first substrate, which faces away from the first arc-shaped convex block; the second electrode covers the outer wall of the second substrate and the outer wall of each second arc-shaped lug on one side provided with the second arc-shaped lug; the first substrate and the second substrate are connected in a sealing way, so that an accommodating space for accommodating the first arc-shaped protruding block and the second arc-shaped pushing block is formed between the first substrate and the second substrate in a matching way; at least one temperature measuring metal wire is embedded in the first matrix and the second matrix respectively;
the pressure measuring method comprises the following steps:
detecting the whole temperature of the first matrix and the second matrix in real time by using a temperature measuring metal wire to form a temperature value;
and correcting the measured value of the flexible film pressure sensor by using the temperature value to form an actual pressure value.
Preferably, the temperature measuring metal wire is used for detecting the whole temperature of the first matrix and the second matrix in real time to form a temperature value; the following procedure was followed:
T＝aX 4 +bX 3 +cX 2 +dX+f；
wherein T is a temperature value; x is the measured resistance value of the metal wire; a to f are respectively calibrated fitting coefficients, and the value ranges are [ -20,20] without dimension.
Preferably, the temperature value is used for correcting the measured value of the flexible film pressure sensor to form an actual pressure value; the following procedure was followed:
C x ＝kT/(2πEC)；
wherein C is x The actual measured value of the flexible film pressure sensor after the capacitance resistance is corrected; e is the frequency of the test signal, and the set range is [20Hz,50Hz]The method comprises the steps of carrying out a first treatment on the surface of the C is the real-time capacitance value between the first electrode and the second electrode, and the value range is 0.1 mu F,1 mu F]The method comprises the steps of carrying out a first treatment on the surface of the k is a correction coefficient, k=0.994 when T > 0 ℃, and k=1.07 when t.ltoreq.0 ℃.
In order to achieve the above object, the present invention also proposes a flexible film pressure sensor, applying the pressure measuring method as described in any one of the above; the flexible film pressure sensor comprises a first matrix, a second matrix, a first electrode and a second electrode; the plate surfaces of the first substrate and the second substrate are parallel to each other, a plurality of first arc-shaped protruding blocks are uniformly distributed at intervals on one side of the first substrate, which is close to the second substrate, a plurality of second arc-shaped protruding blocks are uniformly distributed at intervals on one side of the second substrate, which is close to the first substrate, and each second arc-shaped protruding block is positioned between two adjacent first arc-shaped protruding blocks; the first electrode covers one side of the first substrate, which faces away from the first arc-shaped convex block; the second electrode covers the outer wall of the second substrate and the outer wall of each second arc-shaped lug on one side provided with the second arc-shaped lug; the first substrate and the second substrate are connected in a sealing way, so that an accommodating space for accommodating the first arc-shaped protruding block and the second arc-shaped pushing block is formed between the first substrate and the second substrate in a matching way; at least one temperature measuring metal wire is embedded in the first matrix and the second matrix respectively.
Preferably, each of the first arc-shaped protruding blocks is provided with a plurality of upright posts at uniform intervals on one side, facing away from the first substrate, of each of the first arc-shaped protruding blocks, the extending direction of each of the upright posts is perpendicular to the first substrate, and the length of each of the upright posts is equal.
Preferably, a plurality of concave holes are formed in the second substrate, which faces away from the second arc-shaped protruding block, in a manner of being distributed at intervals.
Preferably, the aperture of each of the recesses is between [1 μm,100 μm ], and the pitch between every two adjacent recesses is between [1 μm,100 μm ].
Preferably, each temperature measuring metal wire in the first matrix is in a smooth curve and is parallel to the extending direction of the first matrix; and each temperature measuring metal wire positioned in the second matrix is in a smooth curve and is parallel to the extending direction of the first matrix.
Preferably, the diameter of a single temperature measuring metal wire in the first matrix is less than or equal to 1 millimeter, and the number of the single temperature measuring metal wire is less than or equal to 10 per square centimeter; the diameter of the single temperature measuring metal wire positioned in the second matrix is less than or equal to 1 millimeter, and the number of the single temperature measuring metal wire is less than or equal to 10 per square centimeter.
Preferably, the material of the temperature measuring metal wire is one of a platinum simple substance, a gold simple substance, a silver simple substance, an iron simple substance, a nickel simple substance, a palladium simple substance, a rhodium simple substance, an iridium simple substance, a platinum alloy, a gold-silver alloy, an iron-nickel alloy, a palladium-rhodium alloy, a rhodium-iridium alloy, a platinum-silver alloy, a platinum-iron alloy, a gold-palladium alloy, a silver-palladium alloy and a palladium-iridium alloy.
The technical scheme of the invention is as follows:
1. the structural design of the first arc-shaped convex block and the second arc-shaped convex block is adopted, so that the sensitivity and the dynamic range of the flexible film pressure sensor can be effectively increased, and meanwhile, the drift and the noise of capacitance values are reduced;
2. the design of the temperature measuring metal wire is adopted, so that the temperature monitoring and compensation of the flexible film pressure sensor can be realized, meanwhile, the temperature measuring metal wire can also be used as a connecting circuit between electrodes, and the manufacturing process and the connecting mode of the flexible film pressure sensor are simplified.
3. The temperature measuring metal wires arranged on the first substrate and the second substrate can detect the temperature of the flexible film pressure sensor in real time, form a temperature value, correct the actual pressure value of the flexible film pressure sensor based on the temperature value, further realize decoupling of pressure and temperature, avoid the accuracy of the pressure value of the flexible film pressure sensor affected by the temperature, and greatly improve the accuracy of the pressure value of the flexible film pressure sensor; overcomes the defects of the prior art, and is beneficial to the wide application of the measurement optimization method of the wearable flexible device for adsorption enhancement and temperature decoupling.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of a first substrate and a temperature measuring wire disposed on the first substrate according to the present invention;
FIG. 3 is a schematic view of a second substrate and a second arc-shaped bump according to the present invention;
FIG. 4 is a schematic diagram of a second substrate and a temperature measuring wire disposed on the second substrate according to the present invention.
Reference numerals illustrate:
1. a first substrate; 2. a second substrate; 3. a column; 4. concave holes; 5. a first arc-shaped bump; 6. a second arc-shaped bump; 7. a temperature measuring wire.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the following description, suffixes such as "module", "component", or "unit" for representing elements are used only for facilitating the description of the present invention, and have no specific meaning per se. Thus, "module," "component," or "unit" may be used in combination.
In addition, the technical solutions of the embodiments of the present invention may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present invention.
Referring to fig. 1 to 4, in order to achieve the above objective, in a first embodiment of a pressure measurement method based on temperature decoupling according to the present invention, a flexible film pressure sensor is used to measure pressure, wherein the flexible film pressure sensor includes a first substrate 1, a second substrate 2, a first electrode and a second electrode; the plate surfaces of the first substrate 1 and the second substrate 2 are parallel to each other, a plurality of first arc-shaped protruding blocks 5 are uniformly and alternately distributed on one side, close to the second substrate 2, of the first substrate 1, a plurality of second arc-shaped protruding blocks 6 are uniformly and alternately distributed on one side, close to the first substrate 1, of the second substrate 2, and each second arc-shaped protruding block 6 is located between two adjacent first arc-shaped protruding blocks 5; the first electrode covers one side of the first substrate 1, which faces away from the first arc-shaped convex block 5; the second electrode covers the outer wall of the second substrate 2 and the outer wall of each second arc-shaped lug 6 at one side provided with the second arc-shaped lug 6; the periphery of the first base body 1 is connected with the periphery of the second base body 2 in a sealing way, so that an accommodating space for accommodating the first arc-shaped protruding block 5 and the second arc-shaped pushing block is formed between the first base body 1 and the second base body 2 in a matching way; at least one temperature measuring metal wire 7 is embedded in the first substrate 1 and the second substrate 2 respectively;
the pressure measuring method comprises the following steps:
step S10, detecting the whole temperature of the first matrix 1 and the second matrix 2 in real time by using a temperature measuring metal wire 7 to form a temperature value;
and S20, correcting the measured value of the flexible film pressure sensor by using the temperature value to form an actual pressure value.
The technical scheme of the invention is as follows:
1. the structural design of the first arc-shaped convex block 5 and the second arc-shaped convex block 6 is adopted, so that the sensitivity and the dynamic range of the flexible film pressure sensor can be effectively increased, and meanwhile, the drift and the noise of capacitance values are reduced;
2. the design of the temperature measuring metal wire 7 is adopted, so that the temperature monitoring and compensation of the flexible film pressure sensor can be realized, and meanwhile, the temperature measuring metal wire can also be used as a connecting circuit between electrodes, and the manufacturing process and the connecting mode of the flexible film pressure sensor are simplified;
3. the temperature measuring metal wires 7 arranged on the first substrate 1 and the second substrate 2 can detect the temperature of the flexible film pressure sensor in real time, form a temperature value, correct the actual pressure value of the flexible film pressure sensor based on the temperature value, further realize decoupling of pressure and temperature, avoid the accuracy of the pressure value of the flexible film pressure sensor affected by the temperature, and greatly improve the accuracy of the pressure value of the flexible film pressure sensor; overcomes the defects of the prior art, and is beneficial to the wide application of the measurement optimization method of the wearable flexible device for adsorption enhancement and temperature decoupling.
Based on the first embodiment of the temperature decoupling-based pressure measurement method of the present invention, in the second embodiment of the temperature decoupling-based pressure measurement method of the present invention, the temperature measurement wire 7 is used to detect the overall temperature of the first substrate 1 and the second substrate 2 in real time, so as to form a temperature value, and the following manner is referred to as follows:
T＝aX 4 +bX 3 +cX 2 +dX+f；
wherein T is a temperature value; x is the measured resistance value of the metal wire; a to f are respectively calibrated fitting coefficients, and the value ranges are [ -20,20] without dimension.
Specifically, by substituting the measured wire resistance value into X; substituting the calibration fitting coefficients [ -20,20] into a to f respectively; the temperature T of the flexible film pressure sensor can be obtained, and further the temperature of the flexible film pressure sensor is detected.
Based on the second embodiment of the temperature decoupling-based pressure measurement method of the present invention, in a third embodiment of the temperature decoupling-based pressure measurement method of the present invention, the correcting the measured value of the flexible film pressure sensor with the temperature value to form the actual pressure value is performed with reference to the following manner:
C x ＝kT/(2πEC)；
wherein C is x The actual measured value of the flexible film pressure sensor after the capacitance resistance is corrected; e is the frequency of the test signal, and the set range is [20Hz,50Hz]The method comprises the steps of carrying out a first treatment on the surface of the C is the real-time capacitance value between the first electrode and the second electrode, and the value range is 0.1 mu F,1 mu F]The method comprises the steps of carrying out a first treatment on the surface of the k is a correction coefficient, k=0.994 when T > 0 ℃, and k=1.07 when t.ltoreq.0 ℃.
Specifically, the temperature value of the flexible film pressure sensor is substituted into T; substituting the frequency of the test signal into E within a set range [20Hz,50Hz ]; substituting the real-time capacitance value [0.1 muF, 1 muF ] between the first electrode and the second electrode into C; correction coefficient substituting k according to the T value; and further, the correction of the value of the flexible film pressure sensor is realized, and the actual pressure value of the flexible film pressure sensor is obtained.
Referring to fig. 1-4, to achieve the above object, the present invention further provides a flexible film pressure sensor, applying the pressure measuring method as described in any one of the above; the flexible film pressure sensor comprises a first matrix 1, a second matrix 2, a first electrode and a second electrode; the plate surfaces of the first substrate 1 and the second substrate 2 are parallel to each other, a plurality of first arc-shaped protruding blocks 5 are uniformly and alternately distributed on one side, close to the second substrate 2, of the first substrate 1, a plurality of second arc-shaped protruding blocks 6 are uniformly and alternately distributed on one side, close to the first substrate 1, of the second substrate 2, and each second arc-shaped protruding block 6 is located between two adjacent first arc-shaped protruding blocks 5; the first electrode covers one side of the first substrate 1, which faces away from the first arc-shaped convex block 5; the second electrode covers the outer wall of the second substrate 2 and the outer wall of each second arc-shaped lug 6 at one side provided with the second arc-shaped lug 6; the periphery of the first base body 1 is connected with the periphery of the second base body 2 in a sealing way, so that an accommodating space for accommodating the first arc-shaped protruding block 5 and the second arc-shaped pushing block is formed between the first base body 1 and the second base body 2 in a matching way; at least one temperature measuring metal wire 7 is embedded in the first matrix 1 and the second matrix 2 respectively.
Specifically, the first substrate 1, the second substrate 2, the first arc-shaped protruding block 5 and the second arc-shaped protruding block 6 are all made of flexible materials, and the first substrate 1, the second substrate 2, the first arc-shaped protruding block 5 and the second arc-shaped protruding block 6 are further made of PVA materials; the first electrode and the second electrode are Au or Cu.
Referring to fig. 1, a plurality of columns 3 are uniformly and alternately disposed on a side of each of the first arc-shaped protrusions 5 facing away from the first substrate 1, and an extending direction of each of the columns 3 is perpendicular to the first substrate 1, and a length of each of the columns 3 is equal. The first arc-shaped protruding blocks 5 are of micro-dome structures, the plurality of upright posts 3 are matched with the first arc-shaped protruding blocks 5, so that one sides of the plurality of upright posts 3, which deviate from the first arc-shaped protruding blocks 5, form a gradient matching structure, the upright posts 3 are made of flexible materials, when the first arc-shaped protruding blocks 5 are close to the second arc-shaped protruding blocks 6, the second arc-shaped protruding blocks 6 are gradually contacted with the upright posts 3 on the first arc-shaped protruding blocks 5 in sequence, the compressibility of the flexible film pressure sensor is effectively improved, the deconstructing hardening is obviously reduced, and the unification of high sensitivity, linear response and wide sensing range of flexible sensing is realized; the design of the upright post 3 structure can effectively enhance the elastic recovery capability and the wear resistance of the flexible film pressure sensor, and prolongs the service life of the flexible film pressure sensor.
Referring to fig. 1, a plurality of concave holes 4 are formed in a surface of the second substrate 2 facing away from the second arc-shaped bump 6 at intervals. The second arc-shaped protruding block 6 is a micro dome structure protruding towards one side away from the second substrate 2, when the flexible film pressure sensor is used, the second substrate 2 is placed on the mounting surface, the concave holes 4 deform simultaneously when the second substrate 2 is extruded to deform, partial air in the concave holes 4 is discharged, and a pressure difference exists between the inside and the outside of the concave holes 4, so that the adsorption force of the flexible film pressure sensor is greatly enhanced, and the sensitivity, the adsorption force and the stability of the flexible film pressure sensor are effectively improved.
Referring to fig. 1, the aperture of each concave hole 4 is between 1 μm and 100 μm, and the interval between every two adjacent concave holes 4 is between 1 μm and 100 μm. The aperture of the concave holes 4 and the interval between the concave holes 4 can improve the adsorptivity of the second substrate 2; the cross section of the concave hole 4 comprises a cylinder, a cuboid, a reverse cone, a round table, a prismatic table, a sphere and an ellipsoid.
Referring to fig. 1-2 and 4, each temperature measuring wire 7 in the first substrate 1 is in a smooth curve and parallel to the extending direction of the first substrate 1; each temperature measuring wire 7 positioned in the second matrix 2 is in a smooth curve and is parallel to the extending direction of the first matrix 1. The curved temperature measuring wire 7 can increase the setting length of the temperature measuring wire 7 in the first matrix 1 and the second matrix 2, thereby improving the temperature measuring precision of the temperature measuring wire 7.
Referring to fig. 1-2 and 4, the diameter of a single temperature measuring wire 7 positioned in the first matrix 1 is less than or equal to 1 millimeter, and the number of the wires is less than or equal to 10 per square centimeter; the diameter of a single temperature measuring metal wire 7 positioned in the second matrix 2 is less than or equal to 1 millimeter, and the number of the single temperature measuring metal wire is less than or equal to 10 per square centimeter. The temperature measuring metal wire 7 is used for temperature measurement which is not influenced by deformation or strain of the flexible film pressure sensor during the operation of the flexible film pressure sensor, so as to achieve more accurate pressure measurement.
Referring to fig. 1, the material of the temperature measuring wire 7 is one of a platinum simple substance, a gold simple substance, a silver simple substance, an iron simple substance, a nickel simple substance, a palladium simple substance, a rhodium simple substance, an iridium simple substance, a platinum alloy, a gold-silver alloy, an iron-nickel alloy, a palladium-rhodium alloy, a rhodium-iridium alloy, a platinum-silver alloy, a platinum-iron alloy, a gold-palladium alloy, a silver-palladium alloy and a palladium-iridium alloy.
In particular, these metals or alloys have high electrical and thermal conductivity, and are capable of rapidly reacting to temperature changes;
the metals or alloys have higher melting point and oxidation resistance, can stably work in high-temperature and corrosive environments, and improve the durability and reliability of the temperature measuring metal wire 7;
these metals or alloys have high strength and toughness, can maintain their shape and integrity under stress and vibration, and reduce damage and failure of the thermometric wire 7.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such an understanding, the solution of the invention may be embodied essentially or in part in the form of a software product that contributes to the state of the art.
In the description of the present specification, the descriptions of the terms "one embodiment," "another embodiment," "other embodiments," or "first through X-th embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, method steps or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (10)
1. The pressure measurement method based on temperature decoupling is characterized by utilizing a flexible film pressure sensor to measure pressure, wherein the flexible film pressure sensor comprises a first matrix, a second matrix, a first electrode and a second electrode; the plate surfaces of the first substrate and the second substrate are parallel to each other, a plurality of first arc-shaped protruding blocks are uniformly distributed at intervals on one side of the first substrate, which is close to the second substrate, a plurality of second arc-shaped protruding blocks are uniformly distributed at intervals on one side of the second substrate, which is close to the first substrate, and each second arc-shaped protruding block is positioned between two adjacent first arc-shaped protruding blocks; the first electrode covers one side of the first substrate, which faces away from the first arc-shaped convex block; the second electrode covers the outer wall of the second substrate and the outer wall of each second arc-shaped lug on one side provided with the second arc-shaped lug; the first substrate and the second substrate are connected in a sealing way, so that an accommodating space for accommodating the first arc-shaped protruding block and the second arc-shaped pushing block is formed between the first substrate and the second substrate in a matching way; at least one temperature measuring metal wire is embedded in the first matrix and the second matrix respectively;
the pressure measuring method comprises the following steps:
detecting the whole temperature of the first matrix and the second matrix in real time by using a temperature measuring metal wire to form a temperature value;
and correcting the measured value of the flexible film pressure sensor by using the temperature value to form an actual pressure value.
2. The pressure measurement method based on temperature decoupling as claimed in claim 1, wherein the temperature measurement wire is used to detect the overall temperature of the first substrate and the second substrate in real time to form a temperature value; the following procedure was followed:
T＝aX 4 +bX 3 +cX 2 +dX+f；
wherein T is a temperature value; x is the measured resistance value of the metal wire; a to f are respectively calibrated fitting coefficients, and the value ranges are [ -20,20] without dimension.
3. The pressure measurement method based on temperature decoupling as claimed in claim 2, wherein the measuring value of the flexible film pressure sensor is corrected by using the temperature value to form an actual pressure value; the following procedure was followed:
C x ＝kT/(2πEC)；
wherein C is x The actual measured value of the flexible film pressure sensor after the capacitance resistance is corrected; pi is the circumference ratio; e is the frequency of the test signal, and the set range is [20Hz,50Hz]The method comprises the steps of carrying out a first treatment on the surface of the C is the real-time capacitance value between the first electrode and the second electrode, and the value range is 0.1 mu F,1 mu F]The method comprises the steps of carrying out a first treatment on the surface of the k is a correction coefficient, k=0.994 when T > 0 ℃, and k=1.07 when t.ltoreq.0 ℃.
4. A flexible film pressure sensor, characterized in that a pressure measuring method according to any one of claims 1 to 3 is applied; the flexible film pressure sensor comprises a first matrix, a second matrix, a first electrode and a second electrode; the plate surfaces of the first substrate and the second substrate are parallel to each other, a plurality of first arc-shaped protruding blocks are uniformly distributed at intervals on one side of the first substrate, which is close to the second substrate, a plurality of second arc-shaped protruding blocks are uniformly distributed at intervals on one side of the second substrate, which is close to the first substrate, and each second arc-shaped protruding block is positioned between two adjacent first arc-shaped protruding blocks; the first electrode covers one side of the first substrate, which faces away from the first arc-shaped convex block; the second electrode covers the outer wall of the second substrate and the outer wall of each second arc-shaped lug on one side provided with the second arc-shaped lug; the first substrate and the second substrate are connected in a sealing way, so that an accommodating space for accommodating the first arc-shaped protruding block and the second arc-shaped pushing block is formed between the first substrate and the second substrate in a matching way; at least one temperature measuring metal wire is embedded in the first matrix and the second matrix respectively.
5. The flexible film pressure sensor of claim 4, wherein a plurality of columns are uniformly and alternately arranged on one side of each first arc-shaped protruding block facing away from the first substrate, the extending direction of each column is perpendicular to the first substrate, and the length of each column is equal.
6. The flexible thin film pressure sensor of claim 4, wherein a plurality of concave holes are formed in the second substrate at intervals on the surface facing away from the second arc-shaped protruding block.
7. The flexible thin film pressure sensor of claim 6, wherein the aperture of each of the wells is between [1 μm,100 μm ] and the spacing between each two adjacent wells is between [1 μm,100 μm ].
8. The flexible thin film pressure sensor of claim 4, wherein each of said thermometric wires located within the first base is a smoothly varying curve and parallel to the direction of extension of said first base; and each temperature measuring metal wire positioned in the second matrix is in a smooth curve and is parallel to the extending direction of the first matrix.
9. The flexible film pressure sensor of claim 8, wherein the individual wires of the thermometry wire within the first matrix have a diameter of less than or equal to 1 millimeter and a number of less than or equal to 10 wires per square centimeter; the diameter of the single temperature measuring metal wire positioned in the second matrix is less than or equal to 1 millimeter, and the number of the single temperature measuring metal wire is less than or equal to 10 per square centimeter.
10. The flexible thin film pressure sensor of claim 8, wherein the material of the thermometric wire is one of elemental platinum, elemental gold, elemental silver, elemental iron, elemental nickel, elemental palladium, elemental rhodium, elemental iridium, platinum alloy, gold-silver alloy, iron-nickel alloy, palladium-rhodium alloy, rhodium-iridium alloy, platinum-silver alloy, platinum-iron alloy, gold-palladium alloy, silver-palladium alloy, and palladium-iridium alloy.
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