CN116438065A - Low dielectric adhesive composition - Google Patents

Low dielectric adhesive composition Download PDF

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Publication number
CN116438065A
CN116438065A CN202180075484.4A CN202180075484A CN116438065A CN 116438065 A CN116438065 A CN 116438065A CN 202180075484 A CN202180075484 A CN 202180075484A CN 116438065 A CN116438065 A CN 116438065A
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styrene
adhesive composition
resin
alicyclic skeleton
films
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Inventor
冲村祐弥
鸟居雅弘
平川真
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Toagosei Co Ltd
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Toagosei Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J165/00—Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The present invention provides a low dielectric adhesive composition comprising a styrene-based elastomer (A), an alicyclic skeleton-containing resin (B) and an epoxy resin (C), wherein at least one of the styrene-based elastomer (A) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, and wherein the cured product of the adhesive composition has a dielectric constant of less than 2.5. Preferably, the resin (B) containing at least an alicyclic skeleton contains a carboxyl group and/or a derivative thereof. The adhesive composition has low dielectric properties and good adhesion, and also has excellent heat resistance and laser processability in wet-heat welding.

Description

Low dielectric adhesive composition
Technical Field
The present invention relates to a low dielectric adhesive composition which is low in dielectric properties and excellent in adhesion, and which is excellent in wet heat solder heat resistance (wet heat solder heat resistance) and laser processability. More specifically, the present invention relates to an adhesive composition suitable for use in bonding electronic components and the like, particularly for the production of related products of flexible printed wiring boards (hereinafter also referred to as "FPCs").
Background
With miniaturization, weight reduction, and the like of electronic devices, there is a growing demand for laminated bodies with adhesive layers for various applications such as bonding of electronic components. For example, as products related to FPC which are one of electronic components, there are flexible copper clad laminates in which copper foil is bonded to polyimide film, polyethylene naphthalate film, liquid Crystal Polymer (LCP) film, and the like, flexible printed wiring boards in which electronic circuits are formed on flexible copper clad laminates, flexible printed wiring boards with reinforcing plates in which flexible printed wiring boards and reinforcing plates are bonded, multilayer boards in which flexible copper clad laminates and flexible printed wiring boards are stacked and bonded together, flexible flat cables (hereinafter also referred to as "FFC") in which copper wiring is bonded to a base film, and the like, and laminates with adhesive layers are used in the production of these electronic components.
Specifically, in manufacturing the FPC, a laminate with an adhesive layer called a "coverlay film" is generally used in order to protect a wiring portion. The cover film includes an insulating resin layer and an adhesive layer formed on the surface thereof, and polyimide resin compositions are widely used for forming the insulating resin layer. Then, for example, a cover film is attached to the surface having the wiring portion through an adhesive layer by hot pressing or the like, thereby manufacturing a flexible printed wiring board. At this time, the adhesive layer of the cover film needs to have strong adhesion to both the wiring portion and the base film. In addition, mobile communication devices such as mobile phones (cellular phones) and information equipment terminals, which have been demanded to be rapidly expanded in recent years, are required to process a large amount of data at high speed, and thus, the frequency of signals has been increased. With the increase in signal speed and the increase in signal frequency, an adhesive for FPC-related products is required to have electrical characteristics (low dielectric constant and low dielectric loss tangent) in a high frequency region.
In order to meet such electrical characteristics, for example, patent document 1 discloses a cover film formed of a vinyl compound such as low polyphenylene ether, a polystyrene-poly (ethylene/butylene) block copolymer, an epoxy resin, and a curing catalyst. Patent document 2 discloses an adhesive composition containing a carboxyl group-containing styrene-based elastomer and an epoxy resin, wherein the content of the styrene-based elastomer and the epoxy resin is set within a predetermined range, and the dielectric constant of the cured adhesive is less than 3.0 as measured at a frequency of 1 GHz. Patent document 3 discloses an adhesive composition comprising a modified polyolefin resin obtained by graft-modifying an unmodified polyolefin resin with a modifier containing an α, β -unsaturated carboxylic acid or a derivative thereof, and an epoxy resin, wherein the contents of the modified polyolefin resin and the epoxy resin are set within a predetermined range, and the dielectric constant of the adhesive cured product measured at a frequency of 1GHz is less than 2.5.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2011-68713
Patent document 2: international publication No. 2016/017473
Patent document 3: international publication No. 2016/047289
Disclosure of Invention
Problems to be solved by the invention
However, the adhesive cover films described in patent documents 1 to 3 have problems of poor heat resistance and laser processability in wet-heat welding, although they have relatively good low dielectric properties and adhesion.
The present invention has been made in view of the above problems, and an object thereof is to provide a low dielectric adhesive composition which is low in dielectric properties, good in adhesion, and excellent in heat resistance in wet heat welding and laser processability.
Means for solving the problems
The present inventors have found that, in an adhesive composition containing a styrene-based elastomer (a), an alicyclic skeleton-containing resin (B) and an epoxy resin (C) as resin components, an adhesive composition having low dielectric properties, good adhesion and excellent heat resistance and laser processability can be obtained by using a substance containing a carboxyl group and/or a derivative thereof as at least one of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B), and have completed the present invention.
That is, according to aspects of the present invention, the following adhesive composition is provided.
1. An adhesive composition comprising a styrene-based elastomer (A), an alicyclic skeleton-containing resin (B) and an epoxy resin (C), wherein at least one of the styrene-based elastomer (A) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, and wherein the dielectric constant of the cured product of the adhesive composition is less than 2.5.
2. The adhesive composition according to the above 1, wherein the total content of the styrene-based elastomer (A) and the resin (B) having an alicyclic skeleton is 50 parts by mass or more based on 100 parts by mass of the solid content of the adhesive composition, and the content of the epoxy resin (C) is 1 to 20 parts by mass based on 100 parts by mass of the total content of the styrene-based elastomer (A) and the resin (B) having an alicyclic skeleton.
3. The adhesive composition according to 1 or 2 above, wherein the content ratio of the styrene-based elastomer (A) to the alicyclic skeleton-containing resin (B) is [ styrene-based elastomer (A) ], in terms of mass ratio: [ alicyclic skeleton-containing resin (B) ]=5: 95-95: 5.
4. the adhesive composition according to any one of the above 1 to 3, wherein the styrene-based elastomer (A) contains a carboxyl group and/or a derivative thereof, and the acid value of the styrene-based elastomer is 0.1 to 50mgKOH/g.
5. The adhesive composition according to any one of the above 1 to 4, wherein the styrene-based elastomer (A) is at least 1 selected from the group consisting of a styrene-butadiene block copolymer, a styrene-ethylene-propylene block copolymer, a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-ethylene-butylene-styrene block copolymer and a styrene-ethylene-propylene-styrene block copolymer.
6. The adhesive composition according to any one of the above 1 to 5, wherein the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, and the alicyclic skeleton-containing resin (B) has an acid value of 0.1 to 50mgKOH/g.
7. The adhesive composition according to any one of the above 1 to 6, wherein the alicyclic skeleton-containing resin (B) has an alicyclic skeleton in a side chain.
8. The adhesive composition according to any one of the above 1 to 7, wherein the epoxy resin (C) is a multi-functional epoxy resin having a dicyclopentadiene skeleton.
9. The adhesive composition according to any one of the above 1 to 8, wherein the cured product has a dielectric loss tangent of less than 0.01 as measured at a frequency of 1 GHz.
10. The adhesive composition according to any one of the above 1 to 9, wherein the solder heat resistance (also referred to as "solder heat resistance" or "solder heat resistance") after 12 hours of the humidification treatment at a temperature of 40 ℃ and a humidity of 90% is 260 ℃ or higher.
11. The adhesive composition according to any one of the above 1 to 10, further comprising an ultraviolet absorber.
12. The adhesive composition according to any one of the above 1 to 11, which is used for a flexible copper clad laminate.
13. The adhesive composition according to any one of the above 1 to 12, which is used for a flexible flat cable.
14. The adhesive layer obtained by using the adhesive composition according to any one of the above 1 to 13 is formed on at least one surface of 1 film selected from the group consisting of polyimide films, polyether ether ketone films, polyphenylene sulfide films, aramid films, polyethylene naphthalate films, liquid crystal polymer films, polyethylene terephthalate films, polyethylene films, polypropylene films, TPX films and fluorine-based resin films.
15. An adhesive sheet comprising the adhesive composition according to any one of 1 to 14, wherein the adhesive layer is formed on at least one side of a release film.
Effects of the invention
The adhesive composition of the present invention contains a styrene-based elastomer (a), an alicyclic skeleton-containing resin (B) and an epoxy resin (C) as resin components, and at least one of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, so that it is low in dielectric properties, good in adhesion, and excellent in heat resistance in wet heat welding and laser processability.
Detailed Description
An embodiment of the present invention will be described below, but the present invention is not limited thereto.
1. Adhesive composition
The adhesive composition of the present invention comprises a styrene-based elastomer (A), an alicyclic skeleton-containing resin (B) and an epoxy resin (C), and is characterized in that at least one of the styrene-based elastomer (A) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, and the dielectric constant of the cured product of the adhesive composition is less than 2.5. The matters specifying the present invention will be specifically described below.
1-1 styrenic elastomer (A)
The styrene-based elastomer (a) is one of the main components of the adhesive composition, and is a component that imparts electrical characteristics in addition to the adhesiveness and flexibility of the cured product of the adhesive composition. Examples of the styrene-based elastomer include a copolymer mainly composed of a block and random structure of a conjugated diene compound and an aromatic vinyl compound, and a hydrogenated product thereof. The styrene-based elastomer is preferably acid-modified to contain a carboxyl group and/or a derivative thereof. Here, the term "derivative thereof" includes not only the form of an acid anhydride in which water molecules are removed from 2 carboxyl groups and bonded to each other, but also other forms derived from carboxyl groups such as acid halide, amide, imide, and ester, and a preferred derivative is an acid anhydride. In the present specification, a styrene-based elastomer containing a carboxyl group and/or a derivative thereof is sometimes referred to as an "acid-modified styrene-based elastomer", "modified styrene-based elastomer" or "carboxyl group-containing styrene-based elastomer".
Examples of the aromatic vinyl compound include: styrene, t-butylstyrene, alpha-methylstyrene, p-methylstyrene, divinylbenzene, 1-diphenylstyrene, N-diethyl-p-aminoethylstyrene, vinyltoluene, p-t-butylstyrene, and the like. Examples of the conjugated diene compound include: butadiene, isoprene, 1, 3-pentadiene and 2, 3-dimethyl-1, 3-butadiene. The styrene-based elastomer (a) does not include the resin (B) having an alicyclic skeleton and the epoxy resin (C) described later.
The acid modification of the styrene-based elastomer (a) can be obtained, for example, by modifying the styrene-based elastomer with an unsaturated carboxylic acid. More specifically, the polymerization of the styrene-based elastomer can be performed by copolymerizing an unsaturated carboxylic acid. The heating and kneading of the styrene-based elastomer and the unsaturated carboxylic acid in the presence of the organic peroxide may be performed. Examples of the unsaturated carboxylic acid include: acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, maleic anhydride, itaconic anhydride, fumaric acid, and the like. The amount of the unsaturated carboxylic acid to be modified is preferably 0.1 to 20% by mass, more preferably 0.1 to 10% by mass, and still more preferably 0.3 to 5% by mass.
The acid value of the acid-modified styrene-based elastomer (A) is preferably 0.1 to 50mgKOH/g, more preferably 0.1 to 20mgKOH/g, still more preferably 5 to 20mgKOH/g, particularly preferably 7 to 15mgKOH/g. When the acid value is 0.1mgKOH/g or more, the adhesive composition is sufficiently cured, and good adhesion and weld heat resistance can be obtained. On the other hand, when the acid value is 50mgKOH/g or less, the adhesive strength and electrical characteristics are excellent.
The weight average molecular weight of the styrene-based elastomer (a) is preferably 1 to 50 ten thousand, more preferably 3 to 30 ten thousand, and even more preferably 5 to 20 ten thousand. When the weight average molecular weight is in the range of 1 to 50 ten thousand, excellent adhesion and electrical characteristics can be exhibited. In the present specification, the weight average molecular weight refers to a value obtained by converting a molecular weight measured by gel permeation chromatography (hereinafter also referred to as "GPC") into polystyrene.
Specific examples of the styrene-based elastomer (a) include: specific examples of the modified styrene-based elastomer (a) include styrene-butadiene block copolymers, styrene-ethylene-propylene block copolymers, styrene-butadiene-styrene block copolymers, styrene-isoprene-styrene block copolymers, styrene-ethylene butylene-styrene block copolymers, and styrene-ethylene propylene-styrene block copolymers: a modified styrene-based elastomer obtained by acid-modifying these block copolymers with an unsaturated carboxylic acid. These various styrene-based elastomers may be used in an amount of 1 or 2 or more. The modified styrene-based elastomer (A) and the unmodified styrene-based elastomer (A) may be used in combination. Among the above copolymers, styrene-ethylene butylene-styrene block copolymers and styrene-ethylene propylene-styrene block copolymers are preferable from the viewpoints of adhesion and electrical characteristics. The mass ratio of styrene/ethylene butene in the styrene-ethylene butene-styrene block copolymer and the mass ratio of styrene/ethylene propylene in the styrene-ethylene propylene-styrene block copolymer are preferably 10/90 to 50/50, more preferably 20/80 to 40/60. When the mass ratio is within this range, an adhesive composition having excellent adhesive properties can be produced.
The total content of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B) is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, based on 100 parts by mass of the solid content of the adhesive composition. When the content is 50 parts by mass or more, the pressure-sensitive adhesive layer becomes excellent in flexibility, and warpage of the laminate can be suppressed. The total content of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B) is preferably 99 parts by mass or less per 100 parts by mass of the solid content of the adhesive composition.
The content ratio of the styrene-based elastomer (a) to the alicyclic skeleton-containing resin (B) is preferably [ styrene-based elastomer (a) ]: [ alicyclic skeleton-containing resin (B) ]=5: 95-95: 5, more preferably [ styrene-based elastomer (a) ]: [ alicyclic skeleton-containing resin (B) ]=10: 90-90: 10. when the content ratio is within this range, an improvement effect of high heat resistance of wet heat welding can be obtained.
1-2 resin (B) containing alicyclic skeleton
Examples of the resin (B) containing an alicyclic skeleton include: a polymer comprising a compound (b) having an alicyclic skeleton as a monomer unit, in other words, a polymer comprising a structural unit derived from a compound (b) having a saturated or unsaturated cyclic hydrocarbon skeleton. The polymer may be a homopolymer or a copolymer. When the compound (B) is a compound (B) having an unsaturated cyclic hydrocarbon skeleton such as styrene or norbornene, the alicyclic skeleton of the alicyclic skeleton-containing resin (B) is produced by polymerization or hydrogenation of the compound (B). The alicyclic skeleton-containing resin (B) may have an alicyclic skeleton in at least one of a main chain and a side chain, and examples thereof include: resins having an alicyclic skeleton in the main chain and/or side chain of a chain hydrocarbon chain such as an olefin polymer and exhibiting thermoplastic and amorphous properties as a single resin. The resin (B) containing an alicyclic skeleton does not include an epoxy resin (C) described later.
Examples of the compound (b) having an alicyclic skeleton include: polycyclic cyclic olefins and monocyclic cyclic olefins. Examples of the polycyclic cyclic olefin include: norbornene, methylnorbornene, dimethylnorbornene, ethylnorbornene, ethylidenenorbornene, butylnorbornene, dicyclopentadiene, dihydrodicyclopentadiene, methyldicyclopentadiene, dimethyldicyclopentadiene, tetracyclododecene, methyltetracyclododecene, dimethylcyclotetradecene, tricyclopentadiene, tetracyclopentadiene and the like. Further, examples of the monocyclic cyclic olefin include: cyclobutene, cyclopentene, cyclooctene, cyclooctadiene, cyclooctatriene, cyclododecatriene, and the like.
Examples of the alicyclic skeleton-containing resin (B) having an alicyclic skeleton in its side chain include: a hydrogenated block copolymer comprising a hydrogenated vinyl aromatic polymer block A obtained by vinyl addition polymerization of a saturated alicyclic hydrocarbon compound (vinylcycloalkane) having a vinyl group such as vinylcyclohexane or 3-methylisopropylcyclohexane and an olefin polymer block B mainly composed of an olefin compound such as ethylene. The hydrogenated vinyl aromatic polymer block a may contain monomer components other than the hydrogenated vinyl aromatic compound in a proportion of 50 mass% or less based on the total weight of the block a, for example. The olefin polymer block B may contain monomer components other than olefin compounds in a proportion of 50 mass% or less based on the total weight of the block B, for example. The hydrogen atom bonded to the alicyclic skeleton such as the cyclohexane ring of the hydrogenated vinyl aromatic polymer block A may be substituted with a methyl group, a butyl group, a chlorine atom or the like. As the olefin compound, propylene, isobutylene, 1-butene, 1-pentene, 4-methyl-1-pentene and the like can be used in addition to ethylene.
Examples of the alicyclic skeleton-containing resin (B) having an alicyclic skeleton in its main chain include: a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) containing a "block mainly composed of a polymer of ethylene or an α -olefin" and a "block mainly composed of a polymer of a cyclic olefin such as norbornene or a derivative thereof" as shown in the following formula (1). Examples of the α -olefin include α -olefins having 3 to 12 carbon atoms.
[ chemical 1]
Figure BDA0004217784300000081
(wherein m is greater than or equal to 1, n is greater than or equal to 0, R 1 Is hydrogen or alkyl with 1-10 carbon atoms, R 2 And R is 3 Each independently represents hydrogen or an alkyl group having 1 to 6 carbon atoms. )
Specific examples of the alicyclic skeleton-containing resin (B) having an alicyclic skeleton in its main chain include: cycloolefin copolymers TOPAS (trade name, manufactured by Polymer Co., ltd.) and APEL (trade name, sanin chemical Co., ltd.), cycloolefin copolymers ARTON (trade name, manufactured by JSR Co., ltd.), ZEONEX (trade name, manufactured by Japanese Zeon Co., ltd.) and ZEONOR (trade name, manufactured by Japanese Zeon Co., ltd.) obtained by ring-opening metathesis polymerization of various cyclic monomers and hydrogenation.
In order to improve the adhesion and the heat resistance of wet heat welding, the alicyclic skeleton-containing resin (B) is preferably used by being acid-modified to contain a carboxyl group and/or a derivative thereof. In the present invention, at least one of the styrene-based elastomer (a) and the resin (B) having an alicyclic skeleton may contain a carboxyl group and/or a derivative thereof, but it is preferable that at least the resin (B) having an alicyclic skeleton contains a carboxyl group and/or a derivative thereof, and it is more preferable that both of the styrene-based elastomer (a) and the resin (B) having an alicyclic skeleton contain a carboxyl group and/or a derivative thereof. Here, the term "derivative thereof" includes not only the form of an acid anhydride in which water molecules are removed from 2 carboxyl groups and bonded to each other, but also other forms derived from carboxyl groups such as acid halide, amide, imide, and ester, and a preferred derivative is an acid anhydride. In the present specification, the resin containing an alicyclic skeleton which contains a carboxyl group and/or a derivative thereof is sometimes referred to as "acid-modified resin containing an alicyclic skeleton", "modified resin containing an alicyclic skeleton" or "resin containing an alicyclic skeleton containing a carboxyl group".
The acid-modified alicyclic skeleton-containing resin is a resin having "a portion derived from an unmodified alicyclic skeleton-containing resin" and "a grafted portion derived from a modifier", and is preferably obtained by graft polymerizing a modifier containing an α, β -unsaturated carboxylic acid or a derivative thereof in the presence of the unmodified alicyclic skeleton-containing resin. The modified alicyclic skeleton-containing resin produced by graft polymerization can be produced by a known method, and a radical initiator can be used in the production. Examples of the method for producing the modified alicyclic skeleton-containing resin include: a solution method in which an unmodified resin containing an alicyclic skeleton is dissolved in a solvent such as toluene by heating, and the modifier and a radical initiator are added; alternatively, a melt method in which an unmodified alicyclic skeleton-containing resin, a modifier and a radical initiator are melt kneaded using a Banbury mixer, a kneader, an extruder or the like. The method of using the unmodified alicyclic skeleton-containing resin, the modifier and the radical initiator is not particularly limited, and they may be added to the reaction system at once or sequentially. In the production of the modified alicyclic skeleton-containing resin, a modifying auxiliary agent for improving the grafting efficiency of the α, β -unsaturated carboxylic acid, a stabilizer for adjusting the stability of the resin, and the like may be used.
The modifier comprises an alpha, beta-unsaturated carboxylic acid and derivatives thereof. Examples of the α, β -unsaturated carboxylic acid include: maleic acid, fumaric acid, tetrahydrophthalic acid, itaconic acid, citraconic acid, crotonic acid, aconitic acid, norbornene dicarboxylic acid, and the like. Further, as the derivative of the unsaturated polycarboxylic acid, there may be mentioned: anhydrides, acid halides, amides, imides, esters, and the like. As the above-mentioned modifier, itaconic anhydride, maleic anhydride, aconitic anhydride and citraconic anhydride are preferable, and itaconic anhydride and maleic anhydride are particularly preferable from the viewpoint of adhesion. When the modifier is used, it is not limited to 1 or more selected from the group consisting of α, β -unsaturated carboxylic acids and derivatives thereof, and may be a combination of 1 or more of α, β -unsaturated carboxylic acids and derivatives thereof, a combination of 2 or more of α, β -unsaturated carboxylic acids, or a combination of 2 or more of derivatives of α, β -unsaturated carboxylic acids.
The modifier of the present invention may contain other compounds (other modifiers) in addition to the α, β -unsaturated carboxylic acid and the like according to the purpose. Examples of the other compound (other modifier) include: (meth) acrylic acid esters represented by the following formula (2), (meth) acrylic acid, other (meth) acrylic acid derivatives, aromatic vinyl compounds, cyclohexyl vinyl ethers, and the like. These other compounds may be used alone or in combination of 2 or more.
CH 2 ＝CR 1 COOR 2 (2)
(wherein R is 1 Is a hydrogen atom or methyl group, R 2 Is a hydrocarbon group. )
In the formula (2) representing the (meth) acrylic acid ester, R 1 Is a hydrogen atom or a methyl group, preferably a methyl group. R is R 2 The hydrocarbon group is preferably an alkyl group having 8 to 18 carbon atoms. The compound represented by the above formula (2) may be: methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, and the like. These compounds may be used alone or in combination of 2 or more. In the present invention, from the viewpoint of improving heat-resistant adhesion, a modifier containing a (meth) acrylic acid ester having an alkyl group having 8 to 18 carbon atoms is more preferably used, and a modifier containing octyl (meth) acrylate, lauryl (meth) acrylate is particularly preferably usedTridecyl (meth) acrylate or stearyl (meth) acrylate.
Examples of the (meth) acrylic acid derivative other than the (meth) acrylic acid ester include: hydroxyethyl (meth) acrylate, glycidyl (meth) acrylate, isocyanate-containing (meth) acrylic acid, and the like. Examples of the aromatic vinyl compound include: styrene, o-methylstyrene, p-methylstyrene, alpha-methylstyrene, and the like. The above-mentioned modifier may be used in combination with an α, β -unsaturated carboxylic acid or a derivative thereof and other modifiers to improve the grafting ratio of the modifier, to improve the solubility in a solvent, or to further improve the adhesion. When a modifier other than the (meth) acrylate represented by the above formula (2) is used, the amount thereof used is desirably not more than the sum of the amounts of the α, β -unsaturated carboxylic acid and its derivative and the (meth) acrylate.
The radical initiator used in the production of the modified alicyclic skeleton-containing resin may be appropriately selected from known radical initiators, and for example, organic peroxides such as benzoyl peroxide, dicumyl peroxide, lauroyl peroxide, di-t-butyl peroxide, 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane, and cumyl hydroperoxide are preferably used.
Examples of the modifying auxiliary agent which can be used for producing the modified alicyclic skeleton-containing resin include: divinylbenzene, hexadiene, dicyclopentadiene, and the like. Examples of the stabilizer include: hydroquinone, benzoquinone, nitrosobenzene hydroxyl compounds, and the like.
The weight average molecular weight (Mw) of the alicyclic skeleton-containing resin (B) is preferably 10,000 ～ 200,000, more preferably 20,000 ～ 150,000, and further preferably 30,000 ～ 100,000. By setting the weight average molecular weight (Mw) to 10,000 ～ 200,000, an adhesive composition having excellent solubility in a solvent and initial adhesion to an adherend and excellent solvent resistance of an adhered portion after adhesion can be produced.
The acid value of the acid-modified alicyclic skeleton-containing resin (B) is preferably 0.1 to 50mgKOH/g, more preferably 1 to 30mgKOH/g, still more preferably 2 to 20mgKOH/g. By setting the acid value to 0.1 to 50mgKOH/g, the adhesive composition is sufficiently cured, and good adhesion and heat resistance for wet heat welding are obtained.
The glass transition temperature of the alicyclic skeleton-containing resin (B) is preferably 60 to 180 ℃, more preferably 70 to 160 ℃, and even more preferably 80 to 150 ℃. When the glass transition temperature is within this range, the heat resistance of the wet heat welding is improved. When the resin (B) having an alicyclic skeleton modified with an acid having such a glass transition temperature is used, the adhesion and the heat resistance of wet heat welding are further improved, and thus are more preferable.
The content of the alicyclic skeleton-containing resin (B) of the present invention is as described above with respect to the styrene-based elastomer (a).
1-3 epoxy resin (C)
Next, an epoxy resin (C) as another component of the adhesive composition is described. The epoxy resin (C) is a component capable of reacting with the carboxyl groups in the carboxyl group-containing styrenic elastomer (a) and/or the carboxyl group-containing alicyclic skeleton-containing resin (B) to exhibit high adhesion to an adherend and heat resistance of the cured adhesive.
Examples of the epoxy resin (C) include: bisphenol a type epoxy resin, bisphenol F type epoxy resin or a hydride thereof; glycidyl ester-based epoxy resins such as diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, glycidyl parahydroxybenzoate, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipate, diglycidyl sebacate, and triglycidyl trimellitate; glycidyl ether-based epoxy resins such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, polyglycidyl ether of sorbitol, polyglycidyl ether of polyglycidyl, and the like; glycidyl amine-based epoxy resins such as triglycidyl isocyanurate and tetraglycidyl diaminodiphenylmethane; linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil, etc., but are not limited thereto. Further, a phenol type epoxy novolac resin, an o-cresol type epoxy novolac resin, a bisphenol a type epoxy novolac resin, or the like may be used.
Further, as an example of the epoxy resin (C), it is possible to use: brominated bisphenol a type epoxy resins, phosphorus-containing epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, naphthalene skeleton-containing epoxy resins, anthracene type epoxy resins, t-butylcatechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, bisphenol S type epoxy resins, and the like. Only 1 kind of these epoxy resins may be used, or 2 or more kinds may be used in combination.
Among the above epoxy resins, epoxy resins having no glycidylamino group are preferable. This is because the storage stability of the laminate with the adhesive layer is improved. In addition, from the viewpoint of obtaining an adhesive composition excellent in electric characteristics, an epoxy resin having an alicyclic skeleton is preferable, and an epoxy resin having a dicyclopentadiene skeleton is more preferable.
The epoxy resin used in the present invention is preferably a resin having 2 or more epoxy groups in 1 molecule. This is because: it can exhibit high heat resistance by forming a crosslinked structure by reaction with the carboxyl group-containing styrenic elastomer (A) and/or the carboxyl group-containing alicyclic skeleton-containing resin (B). In addition, when an epoxy resin having 2 or more epoxy groups is used, the degree of crosslinking with the carboxyl group-containing styrenic elastomer (a) and/or the carboxyl group-containing alicyclic skeleton-containing resin (B) is sufficient, and sufficient heat resistance can be obtained. Thus, a particularly preferred epoxy resin is a multifunctional epoxy resin having a dicyclopentadiene skeleton.
The content of the epoxy resin (C) is preferably 1 to 20 parts by mass based on 100 parts by mass of the total of the content of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B). The content of the epoxy resin (C) is more preferably 3 to 15 parts by mass. When the content is within the above range, sufficient adhesiveness and heat resistance can be obtained, and also the decrease in peel adhesion strength and electrical characteristics can be prevented.
1-4 Electrical Properties of the adhesive composition
The adhesive composition of the present invention is characterized by comprising a styrene elastomer (A), a resin (B) containing an alicyclic skeleton, and an epoxy resin (C), and by having a dielectric constant (epsilon) of the cured adhesive of less than 2.5, as measured at a frequency of 1 GHz. If the dielectric constant is less than 2.5, the method is suitable for FPC related products. The dielectric loss tangent (tan. Delta.) of the cured adhesive measured at a frequency of 1GHz is preferably less than 0.01. If the dielectric loss tangent is less than 0.01, an FPC-related product having excellent electrical characteristics can be produced. The dielectric constant and the dielectric loss tangent can be adjusted according to the proportions of the styrene-based elastomer (a), the alicyclic skeleton-containing resin (B) and the epoxy resin (C) in the adhesive composition, and thus the adhesive composition of various configurations can be set according to the application. The method for measuring the dielectric constant and the dielectric loss tangent will be described later.
1-5 Wet and Hot solder Heat resistance of adhesive composition
The adhesive composition of the present invention contains a styrene-based elastomer (a), an alicyclic skeleton-containing resin (B) and an epoxy resin (C), and at least one of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, and therefore can improve the temperature of the weld heat resistance after 12 hours of humidification treatment at a temperature of 40 ℃ and a humidity of 90%, and is preferably 240 ℃ or higher. When both the styrene-based elastomer (a) and the resin (B) having an alicyclic skeleton contain a carboxyl group and/or a derivative thereof, the temperature of the weld heat resistance can be further increased, particularly when the content ratio of the styrene-based elastomer (a) to the resin (B) having an alicyclic skeleton "[ styrene-based elastomer (a) ]: [ alicyclic skeleton-containing resin (B) ] "was 5: 95-95: 5, the temperature of the solder heat resistance can be 240 ℃ or higher.
1-6 other ingredients
The adhesive composition may contain, in addition to the styrene-based elastomer (a), the alicyclic skeleton-containing resin (B) and the epoxy resin (C), the adhesive composition to such an extent that the functions of the adhesive composition are not impaired: other thermoplastic resins than the styrene-based elastomer (A) and the alicyclic skeleton-containing resin (B), ultraviolet absorbers, tackifiers, flame retardants, curing agents, curing accelerators, coupling agents, heat aging resistant agents, leveling agents, antifoaming agents, inorganic fillers, pigments, solvents, and the like.
Examples of the other thermoplastic resin include: phenoxy resin, polyamide resin, polyester resin, polycarbonate resin, polyphenylene ether resin, polyurethane resin, polyacetal resin, polyethylene resin, polypropylene resin, polyethylene resin, and the like. These thermoplastic resins may be used alone or in combination of 2 or more.
Examples of the thickener include: coumarone-indene resins, terpene-phenolic resins, rosin resins, p-tert-butylphenol-acetylene resins, phenol-formaldehyde resins, xylene-formaldehyde resins, petroleum hydrocarbon resins, hydrogenated hydrocarbon resins, turpentine resins, and the like. These tackifiers may be used alone or in combination of 2 or more.
The flame retardant may be any of an organic flame retardant and an inorganic flame retardant. Examples of the organic flame retardant include: phosphorus flame retardants such as melamine phosphate, melamine polyphosphate, guanidine phosphate, guanidine polyphosphate, ammonium phosphate, ammonium polyphosphate, ammonium phosphoramidate, ammonium polyphosphate, aluminum tris (diethylphosphinate), aluminum tris (methylethylphosphinate), aluminum tris (diphenylphosphinate), zinc bis (diethylphosphinate), zinc bis (methylethylphosphinate), zinc bis (diphenylphosphinate), titanium bis (diethylphosphinate) oxide, titanium tetrakis (diethylphosphinate), titanium bis (methylethylphosphinate) oxide, titanium tetrakis (methylethylphosphinate) oxide, titanium bis (diphenylphosphinate) oxide, titanium tetrakis (diphenylphosphinate); triazine compounds such as melamine, melem, and melamine cyanurate; nitrogen-based flame retardants such as cyanuric acid compounds, isocyanuric acid compounds, triazole-based compounds, tetrazole compounds, diazo compounds, and urea; and silicon-based flame retardants such as organosilicon compounds and silane compounds. Further, examples of the inorganic flame retardant include: metal hydroxides such as aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, barium hydroxide, and calcium hydroxide; metal oxides such as tin oxide, aluminum oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, and nickel oxide; zinc carbonate, magnesium carbonate, barium carbonate, zinc borate, hydrated glass, and the like. These flame retardants may be used in combination of 2 or more.
Examples of the curing agent include: amine-based curing agents, acid anhydride-based curing agents, and the like, but are not limited thereto. Examples of the amine-based curing agent include: melamine resins such as methylated melamine resins, butylated melamine resins, benzoguanamine resins, dicyandiamide, 4' -diphenyldiamino sulfone, and the like. Further, examples of the acid anhydride include: aromatic acid anhydrides, and aliphatic acid anhydrides. These curing agents may be used alone or in combination of 2 or more.
The content of the curing agent is preferably 1 to 100 parts by mass, more preferably 5 to 70 parts by mass, based on 100 parts by mass of the epoxy resin (C).
The curing accelerator is used for accelerating the reaction between the carboxyl group-containing styrene elastomer (a) and/or the carboxyl group-containing alicyclic skeleton-containing resin (B) and the epoxy resin, and tertiary amine curing accelerators, tertiary amine salt curing accelerators, imidazole curing accelerators, and the like can be used.
The tertiary amine-based curing accelerator may be: benzyl dimethylamine, 2- (dimethylaminomethyl) phenol, 2,4, 6-tris (dimethylaminomethyl) phenol, tetramethylguanidine, triethanolamine, N' -dimethylpiperazine, triethylenediamine, 1, 8-diazabicyclo [5.4.0] undecene, and the like.
The tertiary amine salt-based curing accelerator includes: formate, octanoate, p-toluenesulfonate, phthalate, phenolate or phenolic novolac resin salts of 1, 8-diazabicyclo [5.4.0] undecene; or formate, octanoate, p-toluenesulfonate, phthalate, phenolate or phenol novolac resin salts of 1, 5-diazabicyclo [4.3.0] nonene, and the like.
Examples of the imidazole-based curing accelerator include: 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1, 2-dimethylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 2, 4-diamino-6- [2' -methylimidazole- (1 ') ] ethyl-s-triazine, 2, 4-diamino-6- [2' -undecylimidazole- (1 ') ] ethyl-s-triazine, 2, 4-diamino-6- [2' -ethyl-4 ' -methylimidazole- (1 ') ] ethyl-s-triazine, 2, 4-diamino-6- [2' -methylimidazole- (1 ') ] ethyl-s-triazine isocyanurate adduct, 2-phenylimidazole isocyanurate adduct, 2-phenyl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and the like. These curing accelerators may be used alone or in combination of 2 or more.
When the adhesive composition contains a curing accelerator, the content of the curing accelerator is preferably 0.5 to 10 parts by mass, more preferably 1 to 5 parts by mass, per 100 parts by mass of the epoxy resin (C). If the content of the curing accelerator is within the above range, excellent adhesion and heat resistance are exhibited.
The coupling agent may be: silane coupling agents such as vinyltrimethoxysilane, 3-glycidoxypropyl trimethoxysilane, p-styryl trimethoxysilane, 3-methacryloxypropyl methyl dimethoxy silane, 3-acryloxypropyl trimethoxysilane, N-2- (aminoethyl) -3-aminopropyl methyl dimethoxy silane, 3-ureidopropyl triethoxy silane, 3-mercaptopropyl methyl dimethoxy silane, bis (triethoxysilylpropyl) tetrasulfide, 3-isocyanatopropyl triethoxy silane, and imidazole silane; a titanate-based coupling agent; an aluminate coupling agent; zirconium-based coupling agents, and the like. These may be used alone or in combination of 2 or more.
Examples of the heat aging resistant agent include: phenolic antioxidants such as 2, 6-di-t-butyl-4-methylphenol, n-octadecyl-3- (3 ',5' -di-t-butyl-4 ' -hydroxyphenyl) propionate, tetrakis [ methylene-3- (3, 5-di-t-butyl-4-hydroxyphenyl) propionate ] methane, pentaerythritol tetrakis [3- (3, 5-di-t-butyl-4-hydroxyphenyl), triethylene glycol-bis [3- (3-t-butyl-5-methyl-4-hydroxyphenyl) propionate ], thio antioxidants such as dilauryl 3,3' -thiodipropionate and dimyristyl 3,3' -dithiopropionate, and phosphorus antioxidants such as tris (nonylphenyl) phosphite and tris (2, 4-di-t-butylphenyl) phosphite may be used singly or in combination of two or more.
The content of the heat aging resistant agent is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the total of the content of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B). By setting the content within the above range, electrical characteristics and heat resistance can be improved.
Examples of the inorganic filler include: powder composed of titanium oxide, aluminum oxide, zinc oxide, carbon black, silica, talc, copper, silver, and the like. These may be used alone or in combination of 2 or more.
The adhesive composition can be produced by mixing a styrene-based elastomer (a), an alicyclic skeleton-containing resin (B), and an epoxy resin (C) (wherein at least one of the styrene-based elastomer (a) and the alicyclic skeleton-containing resin (B) needs to be acid-modified to contain a carboxyl group and/or a derivative thereof) with other components. The mixing method is not particularly limited as long as the adhesive composition becomes uniform. The adhesive composition is preferably used in the state of a solution or dispersion, and thus a solvent is also generally used. Examples of the solvent include: alcohols such as methanol, ethanol, isopropanol, n-propanol, isobutanol, n-butanol, benzyl alcohol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, diacetone alcohol, and the like; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone, cyclohexanone, isophorone, etc.; aromatic hydrocarbons such as toluene, xylene, ethylbenzene and mesitylene; esters such as methyl acetate, ethyl acetate, ethylene glycol monomethyl ether acetate, and 3-methoxybutyl acetate; aliphatic hydrocarbons such as hexane, heptane, cyclohexane and methylcyclohexane. These solvents may be used alone or in combination of 2 or more. When the adhesive composition is a solvent-containing solution or dispersion (resin varnish), the application onto the substrate film and the formation of the adhesive layer can be smoothly performed, and an adhesive layer having a desired thickness can be easily obtained.
When the adhesive composition contains a solvent, the solid content concentration is preferably in the range of 3 to 80 mass%, more preferably 10 to 50 mass%, from the viewpoint of handleability including formation of an adhesive layer, and the like. When the solid content concentration is 80 mass% or less, the viscosity of the solution is moderate, and the solution is easily and uniformly applied.
2. Laminate with adhesive layer
According to the present invention, there is provided a laminate with an adhesive layer, comprising: an adhesive layer comprising the adhesive composition of the present invention and a substrate film in contact with at least one side of the adhesive layer, the adhesive layer preferably being in a "B-stage state". The "B-stage state" of the adhesive layer means a semi-cured state in which a part of the adhesive composition starts to cure, and means a state in which curing of the adhesive composition is further performed by heating or the like.
One embodiment of the laminate with an adhesive layer obtained by using the adhesive composition of the present invention is a cover film. The cover film is a laminate in which an adhesive layer is formed on at least one surface of a base film and peeling between the base film and the adhesive layer is difficult.
As the base film when the laminate with an adhesive layer is a cover film, there can be mentioned: polyimide films, polyetheretherketone films, polyphenylene sulfide films, aramid films, polyethylene naphthalate films, liquid crystal polymer films, polyethylene terephthalate films, polyethylene films, polypropylene films, TPX films, fluorine-based resin films, and the like. Among them, from the viewpoints of adhesion and electrical characteristics, polyimide films, polyethylene naphthalate films, and liquid crystal polymer films are preferable, and polyimide films and liquid crystal polymer films are more preferable.
Such a base film is commercially available, and as for the polyimide film, it is possible to use: "tap (registered trademark)", manufactured by Dupont, toli, inc.) zelock (registered trademark) manufactured by eastern spinning corporation and "yu yi yu (registered trademark) -S" manufactured by yu cheng (a product of the company of the division), and "yu yi (registered trademark)" manufactured by Kaneka corporation. Further, as the polyethylene naphthalate film, a coating made by emperor Du Bangmo (registered trademark) may be used. Further, as the liquid crystal polymer film, a "tap (registered trademark)" made by Kuraray corporation, a "tap (registered trademark)" made by Primatec corporation, or the like can be used. The base film may be used by forming a resin film of a desired thickness.
As a method for producing a cover film, for example, a resin varnish layer may be formed by applying a resin varnish containing the adhesive composition and a solvent to the surface of a base film such as a polyimide film, and then removing the solvent from the resin varnish layer to produce a cover film having an adhesive layer in a B-stage state.
The drying temperature at the time of removing the solvent is preferably 40 to 250 ℃, more preferably 70 to 170 ℃. When the drying temperature is 40 ℃ or higher, deterioration of electrical characteristics due to solvent residue can be easily prevented, and when the drying temperature is 250 ℃ or lower, a B-stage pressure-sensitive adhesive layer can be easily obtained. The drying is performed by passing the laminate coated with the adhesive composition through a furnace to which hot air drying, far infrared ray heating, high frequency induction heating, and the like are applied.
The release film may be laminated on the surface of the pressure-sensitive adhesive layer for storage or the like, if necessary. As the release film, use can be made of: known release films such as polyethylene terephthalate films, polyethylene films, polypropylene films, silicone release paper, polyolefin resin coated papers, polymethylpentene (TPX) films, and fluorine resin films.
As another mode of the laminate with an adhesive layer, an adhesive sheet is exemplified. The pressure-sensitive adhesive sheet is also formed with the pressure-sensitive adhesive layer on at least one surface of a base film, but a releasable film is used as the base film. The pressure-sensitive adhesive sheet may be one having a pressure-sensitive adhesive layer between 2 release films. When the pressure-sensitive adhesive sheet is used, the releasable film is peeled off and used. The same release film as described above can be used as the release film.
Such release films are also commercially available, and examples thereof include "ALL" manufactured by Tooli film processing (strain), "Toyo-spun ester (registered trademark) manufactured by Toyo textile (strain)", "Taku-Fu" manufactured by Asahi Kabushiki Kaisha (strain) ", and" Ting "manufactured by Sanjing chemical Toku-Liu Jiu Kogyo (strain)".
Examples of the method for producing the pressure-sensitive adhesive sheet include: a method of applying a resin varnish containing the adhesive composition and a solvent to the surface of the release film and drying the same as in the case of the cover film.
In order to thin the laminate with the pressure-sensitive adhesive layer, the thickness of the base film is preferably 5 to 100. Mu.m, more preferably 5 to 50. Mu.m, and still more preferably 5 to 30. Mu.m.
The thickness of the adhesive layer in the B-stage state is preferably 5 to 100. Mu.m, more preferably 10 to 70. Mu.m, still more preferably 10 to 50. Mu.m.
The thicknesses of the base film and the adhesive layer are selected according to the application, but the base film tends to be thinner in order to improve the electrical characteristics. In general, when the thickness of the base film is reduced and the thickness of the adhesive layer is increased, the laminate with the adhesive layer tends to warp, and workability is reduced, but even when the thickness of the base film is reduced and the thickness of the adhesive layer is increased, the laminate with the adhesive layer of the present invention hardly warps. In the laminate with an adhesive layer of the present invention, the ratio (a/B) of the thickness (a) of the adhesive layer to the thickness (B) of the base film is preferably 1 to 10, more preferably 1 to 5. Further, the thickness of the adhesive layer is preferably thicker than the thickness of the base film.
The warpage of the laminate with the adhesive layer affects the workability of the manufacturing process of the FPC-related product, and is therefore preferably as small as possible. Specifically, when the square laminated body with the adhesive layer is placed on a horizontal surface so that the adhesive layer is above, the ratio (H/L) of the height (H) of the end of the laminated body to the length (L) of one side of the laminated body is preferably less than 0.05. More preferably, the ratio is less than 0.04, still more preferably less than 0.03. When the ratio (H/L) is less than 0.05, warpage or curling of the laminate can be further suppressed, and thus workability is excellent.
When H is 0, the lower limit value of H/L is 0.
Preferably, the laminate with the adhesive layer has a dielectric constant (epsilon) of less than 3.0 and a dielectric loss tangent (tan delta) of less than 0.01, as measured at a frequency of 1GHz after curing the adhesive layer of the laminate. The dielectric constant is more preferably 2.9 or less, and the dielectric loss tangent is more preferably 0.005 or less. If the dielectric constant is less than 3.0 and the dielectric loss tangent is less than 0.01, the method can be applied to FPC-related products having strict requirements on electrical characteristics. The dielectric constant and the dielectric loss tangent can be adjusted according to the type and content of the binder component, the type of the base film, and the like, and thus a laminate of various structures can be set according to the application.
Further, it is preferable that the dielectric constant (. Epsilon.) of the laminate with an adhesive layer measured at a frequency of 1GHz after curing the adhesive layer of the laminate is 2.2 or more and the dielectric loss tangent (tan. Delta.) is 0 or more.
3. Flexible copper clad laminate
According to the present invention, a flexible copper-clad laminate is obtained by bonding a base film and a copper foil using the laminate with an adhesive layer. That is, the obtained flexible copper clad laminate was constituted by the base film, the adhesive layer and the copper foil in this order. The adhesive layer and the copper foil may be formed on both sides of the base film. The adhesive composition of the present invention has excellent adhesion to copper-containing articles, and therefore the flexible copper-clad laminate obtained by the present invention has excellent stability as an integrated product.
As a method for producing the flexible copper clad laminate, there are, for example, the following methods: the adhesive layer of the laminate is brought into contact with the copper foil surface, heat laminated at 80 to 150 ℃, and then the adhesive layer is cured by post-curing. The post-curing conditions may be, for example, 100℃to 200℃for 30 minutes to 4 hours. The copper foil is not particularly limited, and electrolytic copper foil, rolled copper foil, or the like may be used.
4. Flexible Flat Cable (FFC)
According to the present invention, a flexible flat cable can be obtained by bonding a base film and copper wiring using the laminate with an adhesive layer. That is, the obtained flexible flat cable was constituted by the base film, the adhesive layer and the copper wiring in this order. The adhesive layer and the copper wiring may be formed on both surfaces of the base film. The adhesive composition of the present invention has excellent adhesion to copper-containing articles, and therefore the flexible flat cable obtained by the present invention has excellent stability as an integrated product.
As a method for manufacturing the flexible flat cable, there are, for example, the following methods: the adhesive layer of the laminate is brought into contact with the copper wiring, heat laminated at 80 to 150 ℃, and then the adhesive layer is cured by post-curing. The post-curing conditions may be, for example, 100℃to 200℃for 30 minutes to 4 hours. The shape of the copper wiring is not particularly limited, and an appropriate shape or the like may be selected as desired.
Examples
The present invention will be described more specifically based on examples, but the present invention is not limited thereto. In the following, unless otherwise specified, parts and% are mass references.
1. Evaluation method
(1) Weight average molecular weight
GPC measurement was performed under the following conditions to obtain Mw of the styrene-based elastomer (A) and the alicyclic skeleton-containing resin (B). Mw is obtained by converting the retention time measured by GPC with the retention time of standard polystyrene as the standard.
The device comprises: alliance 2695 (Waters company)
Column: TSKgel SuperMultiporeHZ-H2 root, TSKgel SuperHZ2500 root (manufactured by Tosoh Co., ltd.)
Column temperature: 40 DEG C
Eluent: tetrahydrofuran 0.35 ml/min
A detector: RI (RI)
(2) Acid value
1g of the styrene-based elastomer (A) or the resin (B) having an alicyclic skeleton was dissolved in 30ml of toluene, and an automatic titration apparatus "AT-510" manufactured by Kyoto electronic industries, inc. was used as a titration tube. As a titration reagent, potential difference titration was performed using 0.01mol/L benzyl alcohol KOH solution, and the mg of KOH per 1g of resin was calculated.
(3) Glass transition temperature
A release polyethylene terephthalate film having a thickness of 38 μm was prepared, and an organic solvent solution of the resin (B) containing an alicyclic skeleton was roll-coated on one surface thereof. Then, the film with the coating film was left to stand in an oven and dried at 90℃for 3 minutes to form a coating film having a thickness of 25. Mu.m, thereby obtaining an adhesive sheet. Then, the PET film was peeled from the obtained laminate film, and the resultant was used as a test piece for measuring the glass transition temperature. The test piece was measured in a tensile mode using a dynamic viscoelasticity measuring apparatus "EXSTAR DMS6100" (manufactured by SII Nanotechnology Co.) at a temperature rising rate of 2 ℃/min and a frequency of 1 Hz. The maximum value of the loss tangent of the obtained curve was taken as the glass transition temperature (Tg).
(4) Peel adhesion strength
A release polyethylene terephthalate film having a thickness of 38 μm was prepared, and the liquid adhesive composition shown in Table 1 was roll-coated on one surface thereof. Subsequently, the film with the coating film was left to stand in an oven and dried at 90℃for 3 minutes to form a coating film (adhesive layer) having a thickness of 25. Mu.m, thereby obtaining an adhesive sheet. Next, a single-sided copper clad laminate (LCP film, rolled copper foil, 12 μm) having a thickness of 62 μm was prepared, the surface of the LCP was superposed on the adhesive layer of the adhesive sheet so as to be in surface contact therewith, and the laminate was laminated under conditions of a temperature of 150℃and a pressure of 0.4MPa and a speed of 0.5 m/min, to obtain a single-sided copper clad laminate with an adhesive layer. Then, a rolled copper foil having a thickness of 35 μm was laminated on the adhesive layer of the single-sided copper-clad laminate with an adhesive layer so as to be in surface contact with each other, and the laminate was laminated under conditions of a temperature of 150℃and a pressure of 0.4MPa and a speed of 0.5 m/min. Next, the laminate (single-sided copper-clad laminate/adhesive layer/copper foil) was heat-pressed at 180 ℃ and a pressure of 3MPa for 30 minutes to obtain a flexible copper-clad laminate a. The flexible copper clad laminate a was cut to prepare an adhesion test piece of a predetermined size.
In order to evaluate the adhesion, according to JIS C6481 "test method of copper-clad laminate for printed wiring board", 90℃peel adhesion strength (N/mm) at the time of peeling copper foil of each adhesion test piece from LCP film was measured under conditions of a temperature of 23℃and a stretching speed of 50 mm/min. The width of the adhesive test piece at the time of measurement was 10mm.
(5) Solder heat resistance
According to JIS C6481, "test method of copper clad laminate for printed wiring board", the test was performed under the following conditions. The flexible copper clad laminate A was cut into a square of 20mm to prepare a test piece. Then, the test piece was subjected to a wet heat load treatment at 40℃for 90% and for 12 hr. Then, the test piece was put into a reflow soldering simulator so that the surface of the single-sided copper-clad laminate was above, and the temperature at which foaming was observed on the surface of the adhesion test piece was observed.
< evaluation criterion >
O: 260 ℃ or higher
△：240～260℃
X: 240 ℃ below
(6) Laser processability
The flexible copper clad laminate a was subjected to via processing from the copper clad laminate to the boundary between the adhesive layer and the rolled copper foil using UV-YAG laser (model 5335) manufactured by ESI company. Then, the cross section of the through hole was observed with an optical microscope, and the scratch length of the adhesive layer was measured.
< evaluation criterion >
O: the scratch length is below 10 μm
X: the scratch length is more than 10 mu m
(7) Electric characteristics (dielectric constant and dielectric loss tangent)
A release polyethylene terephthalate film having a thickness of 38 μm was prepared, and the liquid adhesive composition shown in Table 1 was roll-coated on one surface thereof. Subsequently, the film with the coating film was left to stand in an oven and dried at 90℃for 3 minutes to form a film (adhesive layer) having a thickness of 50. Mu.m, thereby obtaining an adhesive sheet. Subsequently, the adhesive sheet was left in an oven and heat-treated at 180℃for 30 minutes. Then, the release film was peeled off to prepare a test piece (150X 120 mm). The dielectric constant (. Epsilon.) and the dielectric loss tangent (tan. Delta.) were measured by the post-splitting dielectric resonator method (SPDR method) using a network analyzer 85071E-300 (manufactured by Agilent corporation) at a temperature of 23℃and a frequency of 1 GHz.
2. Elastic body
(1) Styrene elastomer a1
A product name "Tuftec M1913" (maleic acid-modified styrene-ethylene butylene-styrene block copolymer) manufactured by Asahi chemical Co., ltd was used. The acid value of the copolymer was 10mgKOH/g, the styrene/ethylene butene ratio was 30/70, and the weight average molecular weight was 15 ten thousand.
(2) Styrene elastomer a2
A product name "Tuftec H1041" (styrene-ethylene butylene-styrene block copolymer) manufactured by Asahi chemical Co., ltd. The acid value of the copolymer was 0mgKOH/g, the styrene/ethylene butene ratio was 30/70, and the weight average molecular weight was 15 ten thousand.
(3) Olefin elastomer
100 parts by mass of a propylene-ethylene random copolymer comprising 97 mol% of propylene units and 3 mol% of ethylene units, which was produced using a metallocene catalyst as a polymerization catalyst, 1.0 part by mass of maleic anhydride, 0.5 part by mass of lauryl methacrylate, and 0.8 part by mass of di-t-butyl peroxide were kneaded using a twin screw extruder having a barrel portion at a maximum temperature of 170 ℃. Then, the mixture was degassed under reduced pressure in an extruder to remove the remaining unreacted product, thereby producing a modified olefin elastomer. The modified olefin elastomer had a weight average molecular weight of 15 ten thousand and an acid value of 10mgKOH/g.
3. Resin containing alicyclic skeleton
(1) Resin b1 containing alicyclic skeleton
A cyclic olefin resin (100 parts by mass of "Zeonor 1060R" manufactured by Japanese Zeon corporation was dissolved in 400 parts by mass of xylene under nitrogen atmosphere in a four-necked flask, then the temperature in the system was kept at 140℃and 8 parts by mass of maleic anhydride and 3 parts by mass of dicumyl peroxide as a radical initiator were added thereto with stirring, followed by reaction for 6 hours, after the completion of the reaction, the obtained reaction product was put into a large amount of acetone to precipitate the resin, the resin was washed with acetone several times to remove unreacted maleic anhydride, and then dried under reduced pressure to obtain a resin b1 containing an alicyclic skeleton, the acid value of the resin b1 containing an alicyclic skeleton was 10mgKOH/g, tg=100℃.
(2) Resin b2 containing alicyclic skeleton
After adding 400 parts by mass of cyclohexane to 100 parts by mass of "Tuftec H1041" (styrene-ethylene butylene-styrene block copolymer) manufactured by Asahi chemical Co., ltd, and further adding 7 parts by mass of a nickel-alumina catalyst (manufactured by Nisho chemical Co., ltd.) as a hydrogenation catalyst, the mixture was pressurized to 5MPa with hydrogen, and heated to a temperature of 200℃with stirring, hydrogenation was carried out for 4 hours. Then, the hydrogenation catalyst was removed, and 0.5 parts by mass of an antioxidant (IRGANOX 1010 produced by steam refining) was added to dissolve the catalyst. Then, cyclohexane and other volatile components as solvents were removed, and the mixture was extruded from an extruder in a molten state into strands, cooled, and pelletized to collect pellets. Then, 4 parts by mass of maleic anhydride, 2 parts by mass of dicumyl peroxide and 230 parts by mass of t-butylbenzene were blended with 100 parts by mass of the obtained hydrogenated product of the styrene-ethylene-butylene-styrene block copolymer, reacted in an autoclave at 135℃for 6 hours, and then poured into a large amount of isopropanol to precipitate, and the mixture was collected by filtration. The recovered resin was dried at 100℃and 1Torr or less for 48 hours to obtain a resin b2 having an alicyclic skeleton. The acid value of the alicyclic skeleton-containing resin b2 was 10mgKOH/mg, and Tg=70℃.
(3) Resin b3 containing alicyclic skeleton
A trade name "Zeonex 330R" manufactured by Zeon corporation of Japan was used. The acid value of the product is 0mgKOH/g, and Tg=120℃.
4. Raw materials for other adhesive compositions
4-1 epoxy resin
(1) Epoxy resin c1
A trade name "EPICLON HP-7200" (dicyclopentadiene skeleton-containing epoxy resin) manufactured by DIC was used.
(2) Epoxy resin c2
A "EPICLON N-655EXP" (cresol type novolac epoxy resin) manufactured by DIC was used.
4-2 additives
(1) Curing accelerator
A product name "Curezol C11-Z" (imidazole-based curing accelerator) manufactured by Sikoku chemical Co., ltd was used.
(2) Thermal aging resistant agent
A trade name "Adekastab AO-60" manufactured by ADEKA was used.
(3) Ultraviolet absorber
Trade name "Uvinul 3049" manufactured by BASF corporation was used.
4-3 organic solvent
250 parts by mass of methylcyclohexane, 250 parts by mass of toluene and 50 parts by mass of methyl ethyl ketone were mixed and used.
5. Production of adhesive composition
The above raw materials were added in the proportions shown in table 1 to a 1000ml flask equipped with a stirring device, and stirred at room temperature for 6 hours to dissolve them, thereby preparing a liquid adhesive composition and evaluating it. The results are shown in Table 1.
6. Production and evaluation of laminate with adhesive layer
Using the above adhesive composition, a laminate with an adhesive layer was produced and evaluated. The results are shown in Table 1.
Figure BDA0004217784300000261
From the results of table 1, it is clear that the adhesive compositions of examples 1 to 11 are excellent in adhesion, heat resistance for wet heat welding, and electrical characteristics. Further, as is clear from a comparison of example 1 and example 11, when the ultraviolet absorber was contained, the laser hole forming property was also excellent. On the other hand, when the adhesive composition does not contain the resin (B) containing an alicyclic skeleton as in comparative example 1, the heat resistance of wet heat welding is poor. In addition, in the case where the adhesive composition does not contain the styrene-based elastomer (a) as in comparative example 2, the adhesion and the heat resistance of wet heat welding are poor. In addition, when the adhesive composition does not contain the epoxy resin (C) as in comparative example 3, the heat resistance of wet heat welding is poor. In addition, when the styrene-based elastomer (a) and the resin (B) having an alicyclic skeleton contained in the adhesive composition do not contain a carboxyl group as in comparative example 4, the heat resistance of wet heat welding is poor. In addition, when the adhesive composition contains an olefin elastomer containing a carboxyl group instead of the "styrene elastomer (a) and the resin (B) containing an alicyclic skeleton" as in comparative example 5, the adhesion is improved, but the heat resistance of wet heat welding is poor.
Industrial applicability
The adhesive composition of the present invention is excellent in adhesion, heat resistance for hot and humid welding, electrical characteristics and the like. Accordingly, the adhesive composition of the present invention is suitable for manufacturing FPC-related products.
The present application claims priority based on japanese application publication No. 2020-187556, filed on even date 11/2, and the disclosure of which is incorporated herein in its entirety.

Claims (15)

1. An adhesive composition comprising a styrene-based elastomer (A), an alicyclic skeleton-containing resin (B) and an epoxy resin (C), wherein at least one of the styrene-based elastomer (A) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, and wherein the dielectric constant of the cured product of the adhesive composition is less than 2.5.
2. The adhesive composition according to claim 1, wherein the total content of the styrene-based elastomer (A) and the alicyclic skeleton-containing resin (B) is 50 parts by mass or more based on 100 parts by mass of the solid content of the adhesive composition,
the content of the epoxy resin (C) is 1 to 20 parts by mass relative to 100 parts by mass of the total content of the styrene-based elastomer (A) and the resin (B) containing an alicyclic skeleton.
3. The adhesive composition according to claim 1 or 2, wherein the content ratio of the styrene-based elastomer (a) to the alicyclic skeleton-containing resin (B) is [ styrene-based elastomer (a) ]: [ alicyclic skeleton-containing resin (B) ]=5: 95-95: 5.
4. The adhesive composition according to any one of claims 1 to 3, wherein the styrene-based elastomer (A) contains a carboxyl group and/or a derivative thereof, and the acid value of the styrene-based elastomer is 0.1 to 50mgKOH/g.
5. The adhesive composition according to any one of claims 1 to 4, wherein the styrene-based elastomer (A) is at least 1 selected from the group consisting of a styrene-butadiene block copolymer, a styrene-ethylene-propylene block copolymer, a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-ethylene butylene-styrene block copolymer and a styrene-ethylene propylene-styrene block copolymer.
6. The adhesive composition according to any one of claims 1 to 5, wherein the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof, and the alicyclic skeleton-containing resin (B) has an acid value of 0.1 to 50mgKOH/g.
7. The adhesive composition according to any one of claims 1 to 6, wherein the resin (B) having an alicyclic skeleton has an alicyclic skeleton in a side chain.
8. The adhesive composition according to any one of claims 1 to 7, wherein the epoxy resin (C) is a multi-functional epoxy resin having a dicyclopentadiene skeleton.
9. The adhesive composition according to any one of claims 1 to 8, wherein the cured product has a dielectric loss tangent of less than 0.01 as measured at a frequency of 1 GHz.
10. The adhesive composition according to any one of claims 1 to 9, wherein the temperature of the weld heat resistance after 12 hours of humidification treatment at a temperature of 40 ℃ and a humidity of 90% is 260 ℃ or higher.
11. The adhesive composition of any one of claims 1-10, further comprising an ultraviolet absorber.
12. The adhesive composition of any one of claims 1 to 11 for use in flexible copper clad laminates.
13. The adhesive composition according to any one of claims 1 to 12 for flexible flat cables.
14. A cover film comprising the adhesive composition of claim 1 to 13, wherein the adhesive layer is formed on at least one surface of 1 film selected from the group consisting of polyimide films, polyether-ether-ketone films, polyphenylene sulfide films, aromatic polyamide films, polyethylene naphthalate films, liquid crystal polymer films, polyethylene terephthalate films, polyethylene films, polypropylene films, TPX films and fluorine-based resin films.
15. An adhesive sheet comprising the adhesive composition according to any one of claims 1 to 14, wherein the adhesive layer is formed on at least one side of a release film.
CN202180075484.4A 2020-11-10 2021-11-04 Low dielectric adhesive composition Pending CN116438065A (en)

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