CN116437618A - Circuit board module - Google Patents

Abstract

The disclosure provides a circuit board module, relates to the technical field of computer equipment, and particularly relates to a hardware structure technology. The circuit board module includes: a circuit board; a heat dissipation plate; a housing; at least one protection member disposed between the circuit board and the heat dissipation plate, and limiting the circuit board to limit deformation of the circuit board in a normal direction of the circuit board.

Description

Circuit board module

Technical Field

The present disclosure relates to the field of computing devices, and more particularly to hardware architecture techniques, and in particular to a circuit board module, a method for a circuit board module, and an autonomous vehicle.

Background

Computing systems for autopilot require safety and reliability that meet automotive-level standards to be able to cope with a variety of shocks and impacts. For autonomous vehicles, there is a constant need for maintenance of computing systems in order to improve vehicle performance.

The approaches described in this section are not necessarily approaches that have been previously conceived or pursued. Unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section. Similarly, the problems mentioned in this section should not be considered as having been recognized in any prior art unless otherwise indicated.

Disclosure of Invention

The present disclosure provides a circuit board module, a method for a circuit board module, and an autonomous vehicle.

According to an aspect of the present disclosure, there is provided a circuit board module including: a circuit board; a heat dissipation plate; a housing; at least one protection member disposed between the circuit board and the heat dissipation plate, and limiting the circuit board to limit deformation of the circuit board in a normal direction of the circuit board.

According to another aspect of the present disclosure, there is provided a method for a circuit board module, wherein the circuit board module is a circuit board module according to an embodiment of the present disclosure, comprising: removing a top cover of the circuit board module; fixing the bottom plate of the circuit board module on a fixed tool; fixing a fixing member coupled to a lifting device on the fixing opening of the heat dissipation plate; and controlling the lifting device to lift so that the heat dissipation plate is separated from the circuit board.

According to another aspect of the present disclosure, there is provided an autonomous vehicle, the calculation unit of which comprises a circuit board module as described above.

According to one or more embodiments of the present disclosure, stability of the circuit board module during the disassembly process can be improved, and damage to the circuit board during the disassembly process is avoided.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the disclosure, nor is it intended to be used to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following specification.

Drawings

The accompanying drawings illustrate exemplary embodiments and, together with the description, serve to explain exemplary implementations of the embodiments. The illustrated embodiments are for exemplary purposes only and do not limit the scope of the claims. Throughout the drawings, identical reference numerals designate similar, but not necessarily identical, elements.

FIGS. 1A and 1B show a schematic view of a PCB and a heat sink removed;

fig. 2A illustrates a cross-sectional side view of an exemplary structure of a circuit board module according to an embodiment of the present disclosure;

FIG. 2B shows a top view of the circuit board module shown in FIG. 2A;

fig. 3 illustrates another exemplary structure of a circuit board module according to an embodiment of the present disclosure;

fig. 4A-4B illustrate another exemplary structure of a circuit board module according to an embodiment of the present disclosure;

5A-5C illustrate overall schematic diagrams of a circuit board module according to embodiments of the present disclosure;

fig. 6A illustrates another exemplary structure of a circuit board module according to an embodiment of the present disclosure;

fig. 6B illustrates another exemplary structure of a circuit board module according to an embodiment of the present disclosure;

fig. 7 illustrates a method for a circuit board module according to an embodiment of the present disclosure;

fig. 8 shows a tooling schematic for disassembling a circuit board module according to an embodiment of the disclosure;

examples of the fixing member for fixing the lifting device are shown in fig. 9A, 9B.

Detailed Description

Exemplary embodiments of the present disclosure are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present disclosure to facilitate understanding, and should be considered as merely exemplary. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

In the present disclosure, the use of the terms "first," "second," and the like to describe various elements is not intended to limit the positional relationship, timing relationship, or importance relationship of the elements, unless otherwise indicated, and such terms are merely used to distinguish one element from another element. In some examples, a first element and a second element may refer to the same instance of the element, and in some cases, they may also refer to different instances based on the description of the context.

The terminology used in the description of the various illustrated examples in this disclosure is for the purpose of describing particular examples only and is not intended to be limiting. Unless the context clearly indicates otherwise, the elements may be one or more if the number of the elements is not specifically limited. Furthermore, the term "and/or" as used in this disclosure encompasses any and all possible combinations of the listed items.

In order to meet reliability standards for autonomous vehicles, computing systems installed in autonomous vehicles typically require a large number of installation, fixed components, and bulky structural components. To meet the performance requirements of an autonomous vehicle, it is often necessary to integrate multiple electronic components on the same Printed Circuit Board (PCB). This results in a single PCB having a large size (up to hundreds of millimeters on a side), thereby increasing the difficulty of mounting and dismounting the printed circuit board. Further, the introduction of a heat sink for cooling and dissipating heat from the integrated circuit also increases the complexity of integration for the computing system of the autonomous vehicle. The common liquid cooling adopts a heat radiation plate to contact with heating elements with different heights on the PCB, and the heat radiation is realized in a contact area by arranging a viscous heat conduction paste. The tackiness of the thermally conductive paste will make it more difficult to remove the heat sink from the PCB assembly.

Fig. 1A and 1B show schematic views of the PCB and the heat dissipation plate detached.

Fig. 1A shows a structure between a PCB and a heat dissipation plate in the related art. As shown in FIG. 1A, the PCB 102 has the sub-boards 103-1 and 103-2 arranged thereon, wherein the sub-board 103-1 has the heating element 104-1 mounted thereon and the sub-board 103-2 has the heating element 104-2 mounted thereon. The heating element referred to herein may be any electronic element used for achieving a function. Wherein the daughter boards 103-1 and 103-2 are connected to the PCB 102 by solder joints 105. The heat dissipation plate 101 is disposed to cover the heat generating elements on the PCB 102 and closely adhere to the heat generating elements 104-1 and 104-2, respectively, which are different in height. As previously described, an adhesive heat-conducting paste may be provided between the heat-radiating plate 101 and the heat-generating elements 104-1, 104-2.

Fig. 1B shows a schematic view when the heat dissipation plate 101 and the PCB 102 are separated. As shown in fig. 1B, forces in different directions are applied to the heat dissipation plate 101 and the PCB 102, respectively, so that the heat dissipation plate 101 and the PCB 102 are separated. As previously mentioned, because the PCB 102 has a large size, and further because of the performance requirements and size constraints of autopilot, there are dense components on the PCB 102, such that the distribution of the fixation elements of the PCB 102 to the backplane (not shown in fig. 1A, 1B) of the circuit board module is thin, there may be areas of large area where fixation points cannot be provided. This results in the pulling of the adhesive heat-conducting patch during separation of the heat spreader plate causing deformation of the PCB area without the anchor points and possibly further causing separation of the solder joints 105 from the PCB chassis resulting in PCB damage.

In addition, to achieve good heat dissipation, the heat spreader plate has customized internal fluid paths to meet different cooling requirements. In addition, the heat sink also needs to make good contact with components on the PCB, which increases the difficulty and cost of manufacturing the heat sink.

In order to solve the above-described problems, the present disclosure provides a new circuit board module. The principles of the present disclosure will be described in detail below.

Fig. 2A illustrates a cross-sectional side view of an exemplary structure of a circuit board module according to an embodiment of the present disclosure. Fig. 2B shows a top view of the circuit board module shown in fig. 2A.

As can be seen from fig. 1A, there is some gap between the heat dissipating plate 101 and the PCB 102 due to various elements having different heights on the PCB. Although there may not be enough space on the bottom plate of the PCB 102 to provide a securing element (e.g., a screw), the above-described clearance may be utilized to provide a guard for the PCB.

As shown in fig. 2A, the circuit board module 200 may include a heat dissipation plate 201, a circuit board 202, a housing 205, and a protector 206. Wherein the protector 206 may be disposed between the circuit board 202 and the heat dissipation plate 201, and the protector 206 may limit the deformation of the circuit board 202 in the normal direction by limiting the circuit board 202. By means of the method, damage to components on the circuit board caused by deformation of the circuit board in the normal direction in the disassembling process can be avoided.

As shown in fig. 2A, the circuit board 202 and the housing 205 are fixed by screws. The protector 206 may be fixed to the housing 205 along with the circuit board 202. In the case shown in fig. 2A, the housing 205 may include a bottom plate and a top cover (not shown) located below the circuit board 202. The protector 206 may be fixed to the chassis along with the circuit board 202. The circuit board and the protection piece can be conveniently and simultaneously fixed by the mode. It is to be understood that the present disclosure is not limited to a particular type of fixation element. Other forms of securing elements may be used by those skilled in the art to effect the connection between the circuit board and the housing.

The circuit board 202 has heating elements 204-1, 204-2 disposed thereon. Due to the limited location of the components on the circuit board, no fixing elements are provided between the heat generating components 204-1, 204-2. In this case, the protector 206 may be disposed between the heat generating elements 204-1, 204-2, and the space between the heat dissipating plate 201 and the circuit board 202. With the above method, the arrangement of the protector can be increased using existing conditions without changing the design of the heat dissipation plate and/or the circuit board. The protector 206 may be generally flat-plate shaped. The surface of the protection piece can be processed to meet the requirements of functions such as limiting, heat dissipation, fixing and the like.

Fig. 2B shows a top view of the circuit board module of fig. 2A. In FIG. 2B, the protector is shaped with a cavity to accommodate the heating elements 204-1, 204-2 and their base plates. Although no further examples are shown in fig. 2B, those skilled in the art will appreciate that the shape of the protector may be designed based on the distribution of the heat generating elements on the circuit board 202 and the distribution of the voids existing between the circuit board 202 and the heat dissipating plate 201. Further, since the elements on the circuit board are densely distributed, the protection member can be divided into a plurality of pieces to realize flexible arrangement of the protection plate. The number of protection pieces that need to be mounted over the circuit board may be determined based on the distribution of the heat generating elements on the circuit board 202 and the distribution of the existence of the gap between the circuit board 202 and the heat dissipation plate 201. For example, the protector may be provided only at a position having a large space between the circuit board 202 and the heat dissipation plate 201. For another example, a protector may be provided where shape protection is critical. Since the type, number and location of the components on the circuit board 202 are designed based on the actual application requirements, the location, size and shape of the protector are also determined based on the design of the circuit board. The protector has a relatively smaller area than the circuit board 202, and thus the protector has a lower difficulty in processing.

Upon removal of the heat sink 201, the heat conductive paste between the heat sink 201 and the heat generating element will exert a normal force on the circuit board 202, similar to the case shown in fig. 1B. However, unlike the case of the prior art, due to the presence of the protector 206, when the plate surface between the two fixing points of the circuit board 202 is forced in the normal direction, the protector present between the heat generating elements 204-1, 204-2 will contact the circuit board 202 and generate a reverse force, thereby preventing the deformation of the circuit board 202 shown in fig. 1B and further preventing the damage of the components on the circuit board due to the deformation of the circuit board.

The protector 206 and the circuit board 202 may be electrically insulated to prevent electrical shorting. In some implementations, a protective member 206 made of a dielectric material may be employed. In some implementations, the function of preventing electrical shorting may also be achieved by coating a dielectric film 207 between the protective member 206 and the circuit board 202, which are made of a metallic material.

Fig. 3 illustrates another exemplary structure of a circuit board module according to an embodiment of the present disclosure.

As shown in fig. 3, the circuit board module 300 includes a heat dissipation plate 301, a circuit board 302, components 304-1, 304-2 arranged on the circuit board 302, a housing 305, and a protector 306.

In the exemplary configuration shown in FIG. 3, the protector 306 is secured to the housing 305 along with the circuit board 302 and covers the components 304-1, 304-2.

In some examples, a plurality of protectors may be provided between the heat dissipation plates 301. At least one of the plurality of protection members may be provided to cover the element of the circuit board 302, and another portion is located between the circuit board 302 and the space of the heat dissipation plate 301. All of the protectors may also be provided to cover the components of the circuit board 302.

With the structure shown in fig. 3, the protector can function as a heat spreading plate at the same time as having the function of preventing the deformation of the circuit board in the normal direction described in connection with fig. 2A, 2B. Thereby improving the heat dissipation of the circuit board.

In this case, the heat dissipation plate 301 does not need to directly contact the elements 304-1, 304-2 on the circuit board 302, but heat dissipation is achieved by the protector having one side contacting the elements 304-1, 304-2 and the other side contacting the heat dissipation plate 301. The protector 306 may be made of a metal material to achieve a good heat dissipation effect. For example, the protective member may be aluminum, copper or other metal having good heat dissipation properties. The specific material of the protector may be determined according to parameters such as power of the electrical components on the circuit board. The electrical insulation may be achieved by providing a dielectric film between the protector and the circuit board. The protective member covering the elements 304-1, 304-2 may be closely adhered to the elements and further enhance the heat dissipation effect by disposing a thermally conductive paste between the protective member and the elements. In this way, a close fit between the heat-radiating member and the heat-generating element can be achieved by machining a structural member that is small in size and simple in structure, without having to machine a heat-radiating plate having a more complex structure to accommodate different heights of the elements at different positions on the circuit board. To facilitate the fixing of the protector, openings 308 may be provided in the heat dissipation plate 301 to accommodate the fixing elements of the protector. Although the opening 308 shown in fig. 3 is non-penetrating in the thickness direction of the heat dissipation plate, the opening 308 may be provided in the form of a through hole penetrating in the thickness direction of the heat dissipation plate.

Fig. 4A-4B illustrate another exemplary structure of a circuit board module according to an embodiment of the present disclosure.

As shown in fig. 4A, the circuit board module 400 includes a heat dissipation plate 401, a circuit board 402, a housing 405, an add-on card connector 409 and a component 410 arranged on the circuit board 402, and a protector 406 covering the component 410. The protector 406 is fixed to the housing 405 together with the circuit board 402. Wherein the element 410 may be an add-on card.

It is understood that the add-on card connector 409 may be a component that is secured to the circuit board 402. The add-on card 410 is a component that may be mounted to the circuit board 402 or removed from the circuit board 402 as desired. The additional card 410 may have a weaker structural stability due to the removability of the additional card 410. Furthermore, the add-on card 410 may not have a heat sink thereon. Therefore, by covering the area where the additional card 410 is mounted with the protector provided by the embodiment of the present disclosure, it is possible to provide the additional card 410 with a stronger structural stability when the heat dissipation plate 401 is detached, and to provide the additional card 410 with heat dissipation.

In the example shown in fig. 4B, the add-on card 410 has a self-contained heat sink 411. Heat dissipation can be achieved by attaching the heat dissipation plate 401 to the heat dissipation member 411. In this case, the protection member 406 does not entirely cover the additional card 410, but the additional card may be restrained by the protection member to restrict movement of the additional card in the normal direction of the circuit board, thereby increasing structural stability of the additional card. The limit can be achieved by machining the protector based on the shape of the add-on card.

Fig. 5A-5C illustrate overall schematic diagrams of circuit board modules according to embodiments of the present disclosure.

As shown in fig. 5A, the circuit board module 500 may include a base plate 501, a circuit board 502, a heat dissipation plate 503, a top cover 504, and a connector 505. Wherein the bottom plate 501 and top cover 504 together comprise the housing of the circuit board module. Sealing is achieved between the base plate 501 and the top cover 504 by a groove structure and a sealing ring, and electromagnetic interference EMI can be prevented by continuous metal contacts on the contact surface between the top cover and the floor and electrical connection with the ground line of the circuit board. The connector 505 may be used to connect the circuit board module 500 to other components of the environment. A heat dissipation plate 503 and a circuit board 502 are disposed in this order between the top cover 504 and the bottom plate 501. As described above, a protector may be disposed between the heat dissipation plate 503 and the circuit board 502 to prevent deformation of the circuit board in the normal direction when the heat dissipation plate is detached.

Fig. 5B is a top view of the circuit board module 500 with the top cover removed. Fig. 5B shows an exemplary structure of the heat dissipation plate.

As shown in fig. 5B, a plurality of openings may be provided on the heat dissipation plate 502. Unlike the structure in which the heat dissipation plate and the top cover are designed as one integrated circuit board module, since the circuit board module 500 provided by the present disclosure can perform the functions of sealing and electromagnetic shielding by using the structures of the bottom plate and the top cover, various openings can be provided on the heat dissipation plate 502 to realize more functions.

In some examples, the opening on the heat spreader plate 502 may include a plurality of through holes 506. The through hole 506 may be used to accommodate a limiting unit that limits the heat dissipation plate. The same through holes can also be provided in the circuit board module in corresponding positions of the base plate and the circuit board mountain below the heat dissipation plate. During the mounting and dismounting of the circuit board module, the translation and rotation of the heat dissipation plate in other directions than the normal direction can be restricted by mounting the limit lever in the through hole.

In some examples, the opening in the heat spreader plate 502 may include a securing hole 508. The securing apertures 508 may be used to receive securing elements. For example, a fixing element for fixing the protector as shown in fig. 3, 4A, 4B may be accommodated. For another example, the fixation holes 508 may include structure for mounting fixation elements, such as threads for mounting screws. Other components may be mounted on the heat dissipation plate using the fixing holes 508. For example, the fixing hole may be a fixing opening for fixing the jig to perform removal of the heat dissipation plate.

In some examples, the opening in the heat spreader plate 502 may include a connection hole 507. The attachment holes 507 may be used to receive attachment members of an add-on card. The connector of the additional card may be passed through the connection hole 507 and connected with the connector on the circuit board below the heat dissipation plate, so that more additional cards can be prevented above the heat dissipation plate (e.g., in the space between the heat dissipation plate and the top cover).

Fig. 5C illustrates an exemplary fixture between the bottom plate and top cover of the circuit board module 500. For example, a latch may be utilized to lock the housing to achieve quick locking/unlocking. In some other examples, the locking and unlocking of the housing may also be achieved by a screwless fixation such as a fixed rod.

Fig. 6A illustrates another exemplary structure of a circuit board module according to an embodiment of the present disclosure.

As shown, the circuit board module 600 may include a heat sink 601, a circuit board 602, a backplane 605, components 610 on the circuit board, and a protector 606. Wherein the protector 606 is fixed to the base plate together with the circuit board 602. In the example shown in fig. 6, the protector and the circuit board are fixed to the base plate with screws, and the heat dissipation plate 601 is provided with openings for receiving the screws. Further, the heat radiation plate 601 further has a prying groove 620. When dismantling the heating panel, can utilize the instrument to pry the groove through prying to the heating panel. Some air may enter the interface between the heat spreader plate and the underlying component (e.g., the protector, the heating element, etc.) upon prying, which may facilitate disengagement of the heat spreader plate from the underlying component. The prying groove can be arranged on the heat dissipation plate where the structural support is strongest.

Fig. 6B illustrates another exemplary structure of a circuit board module according to an embodiment of the present disclosure. In order to facilitate separation of the heat sink from the circuit board during disassembly, a resilient element may be provided between the heat sink and the circuit board to assist in separating the heat sink from the circuit board. In the example shown in fig. 6B, an elastic member (e.g., a spring) may be provided in a hole on the heat dissipation plate for receiving a fixing member for fixing the circuit board. The person skilled in the art can also arrange the elastic element in other positions between the heat-dissipating plate and the circuit board according to the actual situation.

Fig. 7 illustrates a method for a circuit board module according to an embodiment of the present disclosure. The circuit board module provided by embodiments of the present disclosure may be disassembled for necessary maintenance using the method illustrated in fig. 7.

In step S701, the top cover of the circuit board module may be removed. The components mounted within the circuit board module housing may be exposed by removing the top cover.

In step S702, the bottom plate of the circuit board module may be fixed to a fixing tool, thereby enabling the circuit board module to have stability during the disassembly process.

In step S703, a fixing member coupled to the elevating device may be fixed on the fixing opening of the heat dissipation plate. The lifting device may be moved up or down at a controlled speed. The lifting device can comprise a combination of rack gears and can also be composed of any other structure capable of achieving lifting effect. The fixing member for coupling the lifting device and the heat dissipation plate may be a spring type or a pneumatic type.

In step S704, the lifting device may be controlled to be lifted so that the heat dissipation plate is separated from the circuit board.

Fig. 8 shows a tooling schematic for disassembling a circuit board module according to an embodiment of the disclosure. As shown, the circuit board module has the top cover removed. The drawing shows a heat dissipation plate 801, a circuit board 802, and a case bottom plate 805. Wherein, the casing bottom plate is connected with a fixed frock 850 of pedal on the bottom plate. The tooling 850 is provided with guide holes that are aligned with the guide holes on the heat spreader plate, the circuit board, and/or the bottom plate, respectively. The rotation of the assembly during the disassembly can be restricted by the guide bar 830 installed in the guide hole. The elevating device 840 may be fixed to the heat radiating plate by a fixing member so as to be capable of grasping the heat radiating plate to move upward so as to be separated from the circuit board.

Examples of the fixing member for fixing the lifting device are shown in fig. 9A, 9B. In fig. 9A, the fixing member is connected to the heat dissipation plate by screws. In fig. 9B, the fixing member is connected to the heat dissipation plate by means of the grip opening. The example in fig. 9A is suitable for field service requiring manual operation, while the example in fig. 9B is suitable for mass production using robotic operation. It will be appreciated that other securing means for attaching the heat sink of the lifting device he may be used in addition to the examples shown in figures 9A, 9B

The method for disassembling the circuit board module can provide structural stability for the circuit board module during disassembly. Through utilizing the opening on the heating panel to fix elevating gear to the heating panel, can provide stable application of force and mode of movement for the circuit board module, prevent that the circuit board module from appearing empting and/or receiving unsuitable external force interference in the dismantlement process.

According to one aspect of the present disclosure, there is also provided an autonomous vehicle, wherein the computing unit of the autonomous vehicle comprises a circuit board module according to an embodiment of the present disclosure. By arranging the circuit board module according to the embodiment of the disclosure in an autonomous vehicle, the stability of the circuit board module in the disassembly process can be improved, and the circuit board is prevented from being damaged in the disassembly process.

It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps recited in the present disclosure may be performed in parallel, sequentially or in a different order, provided that the desired results of the disclosed aspects are achieved, and are not limited herein.

Although embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it is to be understood that the foregoing methods, systems, and apparatus are merely exemplary embodiments or examples, and that the scope of the present invention is not limited by these embodiments or examples but only by the claims following the grant and their equivalents. Various elements of the embodiments or examples may be omitted or replaced with equivalent elements thereof. Furthermore, the steps may be performed in a different order than described in the present disclosure. Further, various elements of the embodiments or examples may be combined in various ways. It is important that as technology evolves, many of the elements described herein may be replaced by equivalent elements that appear after the disclosure.

Claims (18)

1. A circuit board module, comprising:

a circuit board;

a heat dissipation plate;

a housing; and

at least one protection member disposed between the circuit board and the heat dissipation plate, and limiting the circuit board to limit deformation of the circuit board in a normal direction of the circuit board.

2. The circuit board module of claim 1, wherein the housing comprises a base plate and a top cover, the protector being secured to the base plate along with the circuit board.

3. The circuit board module of claim 1, wherein the protector is disposed in a gap between the circuit board and the heat dissipation plate.

4. The circuit board module of claim 3, wherein the protector is electrically isolated from the circuit board.

5. The circuit board module of claim 1, wherein at least one of the protectors covers a component on the circuit board.

6. The circuit board module of claim 5, wherein the protective member is a metallic material.

7. The circuit board module of claim 5, wherein the at least one protector is in close proximity to a component on the circuit board.

8. The circuit board module of claim 5, wherein the component on the circuit board is an add-on card.

9. The circuit board module of claim 8, wherein the at least one guard limits movement of the add-on card in a direction normal to the circuit board.

10. The circuit board module of any of claims 1-9, wherein the heat spreader plate has an opening therein.

11. The circuit board module of claim 10, wherein the opening is to receive a securing element.

12. The circuit board module of claim 10, wherein the opening is a through hole for receiving a limiting unit for limiting the heat dissipation plate.

13. The circuit board module of claim 10, wherein the opening is to receive a connector of an add-on card.

14. The circuit board module of any of claims 1-9, wherein the heat spreader plate has prying grooves thereon.

15. The circuit board module according to any one of claims 1 to 9, wherein a resilient member is provided between the heat dissipation plate and the circuit board.

16. The circuit board module of any one of claims 1-9, wherein the heat dissipation plate has a fixing opening thereon for a fixing jig.

17. A method for a circuit board module, wherein the circuit board module is a circuit board module according to any one of claims 1-16, comprising:

removing a top cover of the circuit board module;

fixing the bottom plate of the circuit board module on a fixed tool;

fixing a fixing member coupled to a lifting device on the fixing opening of the heat dissipation plate; and

and controlling the lifting device to lift so that the heat dissipation plate is separated from the circuit board.

18. An autonomous vehicle, a computing unit of the autonomous vehicle comprising the circuit board module of any of claims 1-16.

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