CN116437616A - Isolation dust-proof device and dust-proof method for circuit board - Google Patents
Isolation dust-proof device and dust-proof method for circuit board Download PDFInfo
- Publication number
- CN116437616A CN116437616A CN202310527434.6A CN202310527434A CN116437616A CN 116437616 A CN116437616 A CN 116437616A CN 202310527434 A CN202310527434 A CN 202310527434A CN 116437616 A CN116437616 A CN 116437616A
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- circuit board
- plate
- cavity
- sliding
- fixedly connected
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000002955 isolation Methods 0.000 title claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 58
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 239000000428 dust Substances 0.000 claims abstract description 26
- 238000010521 absorption reaction Methods 0.000 claims abstract description 15
- 238000004891 communication Methods 0.000 claims description 16
- 238000005086 pumping Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 238000007790 scraping Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 8
- 230000002265 prevention Effects 0.000 abstract description 6
- 230000006872 improvement Effects 0.000 description 8
- 238000000926 separation method Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of circuit board dust prevention, in particular to an isolation dust prevention device and a dust prevention method for a circuit board. The fixing device comprises a fixing device and a closing device arranged at the top of the fixing device, the fixing device comprises a fixing mechanism, the fixing mechanism comprises a vertical plate, one side of the vertical plate is fixedly connected with a base, one side of the base is provided with a positioning mechanism, and the positioning mechanism comprises a baffle plate. According to the invention, through the cooperation among the rotating plate, the cover plate and the sliding plate, the circuit board can be freely disassembled and replaced, and when the circuit board works normally, a closed space is formed on the upper surface of the circuit board, external dust cannot be gathered on the surface of the circuit board, heat cannot be emitted due to dust gathering on the surface of the circuit board, and meanwhile, when the circuit board works, the heat absorption structure absorbs the heat of the circuit board in a water flow circulation mode, compared with air cooling heat dissipation, the heat dissipation effect is better, and the working environment of the circuit board is ensured to be kept in a good range.
Description
Technical Field
The invention relates to the technical field of circuit board dust prevention, in particular to an isolation dust prevention device and a dust prevention method for a circuit board.
Background
The heat generated during the operation of the electronic equipment is quickly increased, if the heat is not timely emitted, the equipment is continuously heated, the reliability of the electronic equipment is reduced due to overheat failure, therefore, the heat dissipation treatment of the circuit board is very important, the common heat dissipation method is to set a fan beside the circuit board for cooling, and the working environment of the circuit board is communicated with the outside, so that dust is attached to the surfaces of the fan and the circuit board after the heat dissipation method is used for a long time, the heat dissipation effect is greatly reduced, and the reliability of the electronic equipment is reduced.
Disclosure of Invention
The invention aims to provide an isolation dustproof device and a dustproof method for a circuit board, which are used for solving the problems in the background technology.
In order to achieve the above object, one of the purposes of the present invention is to provide an isolation dust-proof device for a circuit board, which comprises a fixing device and a closing device arranged at the top of the fixing device, wherein the fixing device comprises a fixing mechanism, the fixing mechanism comprises a vertical plate, one side of the vertical plate is fixedly connected with a base, one side of the base is provided with a positioning mechanism, the positioning mechanism comprises a baffle plate, the baffle plate is fixedly connected with the base, the closing device is matched with the vertical plate, the base and the baffle plate to isolate the upper surface of the circuit board when being fixed, the closing device cleans the upper surface of the circuit board when moving, and a heat absorbing structure is arranged in the closing device and is used for cooling the circuit board.
As a further improvement of the technical scheme, the sealing device comprises a rotating mechanism, the rotating mechanism comprises an L-shaped rotating plate, the bottom end of the rotating plate is hinged to the base, a matching mechanism is arranged at the other end of the rotating plate and comprises a cover plate, the cover plate is hinged to the rotating plate, a cleaning mechanism is arranged at one end of the cover plate and comprises a sliding plate, and the sliding plate is hinged to the cover plate.
As a further improvement of the technical scheme, the bottom of the sliding plate is in plug-in fit with a separation plate, wedge blocks are fixedly connected to the two ends of the separation plate, a stop lever is fixedly connected to one end of the vertical plate and one end of the baffle plate, and a lifting spring is fixedly connected to the top end of the separation plate.
As a further improvement of the technical scheme, the two ends of the sliding plate are fixedly connected with positioning blocks, and the two positioning blocks are respectively arranged in the vertical plate and the baffle in a sliding manner.
As the further improvement of this technical scheme, the heat absorption structure includes the cooling chamber, the cooling chamber is offered in the inside of rotor plate, one side in cooling chamber is equipped with the spliced groove, the bottom in spliced groove is equipped with the cooperation chamber, spliced groove and cooling chamber pass through the cooperation chamber intercommunication, the inside sliding connection in spliced groove has the closure plate, one side fixedly connected with closure spring of closure plate.
As a further improvement of the technical scheme, one side of the vertical plate is slidably connected with a communication block, and when the heat of the circuit board is absorbed, the communication block is in plug-in connection with the plug-in groove.
As the further improvement of this technical scheme, the heat absorption structure still includes the heat absorption chamber, the heat absorption chamber is seted up in the inside of rotor plate, and the heat absorption chamber is linked together with the cooling chamber, one side sliding connection of apron has the intercommunication board, the one end fixedly connected with pulling spring of intercommunication board, the spout has been seted up to one side of baffle, intercommunication board and spout grafting cooperation.
As a further improvement of the technical scheme, a reservoir is arranged in the base, and a pumping pressure cavity is arranged on one side of the reservoir.
As a further improvement of the technical scheme, one side of the vertical plate is slidably connected with a limiting strip, the other side of the cover plate is provided with a positioning groove, the positioning groove is in plug-in connection with the limiting strip, one side of the limiting strip is fixedly connected with a tension spring, a connecting cavity is formed in the vertical plate, and the connecting cavity is used for guiding water flow on one side of the communicating block to one side of the limiting strip.
The second object of the present invention is to provide a method for isolating and dust-proof a circuit board, comprising any one of the above-mentioned steps of:
s1, after a circuit board is installed, a motor drives a rotating plate to rotate, the rotating plate drives a cover plate to move, the cover plate drives a sliding plate to move, and the sliding plate drives a scraping sheet to clean the surface of the circuit board;
s2, the water pump drives water flow in the reservoir to flow, the water flow flows to one side of the communicating block through the pumping pressure cavity, the communicating block is pushed to move, the water flow flows to the inside of the matching cavity and the cooling cavity through the communicating block, then flows to the inside of the heat absorption cavity through the cooling cavity, the communicating plate is pushed to move, the water flow flows to the inside of the communicating cavity through the communicating plate, and thereafter the water flow pushes the limiting strip to move through the communicating cavity and returns to the reservoir through the circulating cavity.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the isolation dustproof device and the dustproof method of the circuit board, the circuit board can be freely disassembled and replaced through the cooperation among the rotating plate, the cover plate and the sliding plate, and when the circuit board works normally, a closed space is formed on the upper surface of the circuit board, external dust cannot be gathered on the surface of the circuit board, heat cannot be emitted due to dust gathering on the surface of the circuit board is avoided, meanwhile, when the circuit board works, the heat absorbing structure absorbs the heat of the circuit board in a water flow circulation mode, compared with air cooling heat dissipation, the heat dissipation effect is better, and the working environment of the circuit board is kept in a good range.
2. In the isolation dust-proof device and the dust-proof method of the circuit board, when the circuit board is disassembled and assembled, the scraping sheet scrapes the dust on the surface of the circuit board through the cooperation among the rotating plate, the cover plate and the sliding plate, and the dust on the surface of the circuit board is scraped, so that the dust on the upper surface is less when the circuit board works, and the heat dissipation effect is further improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the fixing device of the present invention;
FIG. 3 is a schematic view of the structure of the riser of the present invention;
FIG. 4 is a schematic cross-sectional view of a riser of the present invention;
FIG. 5 is a schematic view of the structure of the communicating block of the present invention;
FIG. 6 is a schematic view of a positioning mechanism according to the present invention;
FIG. 7 is a schematic view of the structure of the closure device of the present invention;
FIG. 8 is a schematic view of a rotating mechanism according to the present invention;
FIG. 9 is a schematic view of the engaging mechanism of the present invention;
FIG. 10 is a schematic cross-sectional view of a communication plate according to the present invention;
fig. 11 is a schematic structural view of the cleaning mechanism of the present invention.
The meaning of each reference sign in the figure is:
1. a fixing device;
11. a fixing mechanism; 111. a vertical plate; 112. a base; 113. a reservoir; 114. a communicating block; 115. defining a strip; 116. a tension spring; 117. a pumping chamber; 118. a stop lever; 119. a connecting cavity; 12. a positioning mechanism; 121. a baffle; 122. a chute; 124. a communication chamber; 125. an auxiliary spring; 126. a limit bar; 127. a circulation chamber;
2. a closing device;
21. a rotating mechanism; 211. a rotating plate; 212. a plug-in groove; 213. a mating cavity; 214. a cooling cavity; 215. a slot; 216. a closing plate; 217. a closing spring; 22. a mating mechanism; 221. a cover plate; 222. a heat absorption chamber; 223. a positioning groove; 224. pulling the spring; 225. a communication plate; 23. a cleaning mechanism; 231. a sliding plate; 232. a positioning block; 233. a scraping sheet; 234. a partition plate; 235. a lifting spring; 236. wedge blocks.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Examples
Referring to fig. 1-11, one of the purposes of this embodiment is that during the operation of the circuit board, the components of the circuit board generate a lot of heat, the circuit board is generally exposed in the external environment, dust falls on the surface of the circuit board, the heat dissipation effect of the circuit board is seriously affected after a long time, the operation efficiency of the circuit board is reduced after the heat reaches a certain degree, therefore, an isolation dustproof device of the circuit board is provided, the isolation dustproof device comprises a fixing device 1 and a closing device 2 arranged on the top of the fixing device 1, the fixing device 1 comprises a fixing mechanism 11, the fixing mechanism 11 comprises a vertical plate 111, one side of the vertical plate 111 is fixedly connected with a base 112, one side of the base 112 is provided with a positioning mechanism 12, the positioning mechanism 12 comprises a baffle 121, the baffle 121 is fixedly connected with the base 112, the vertical plate 111, the base 112 and the baffle 121 cooperate to limit the position of the circuit board, and enclose the side edges of the circuit board, the closing device 2 cooperates with the vertical plate 111, the base 112 and the baffle 121 to isolate the upper surface of the circuit board when fixing, and clean the upper surface of the circuit board when the closing device 2 moves.
In order to isolate the circuit board and prevent dust, closing means 2 includes slewing mechanism 21, slewing mechanism 21 is including being the pivoted board 211 of L shape, the bottom and the base 112 of pivoted board 211 are articulated, the position of the other end of pivoted board 211 is equipped with cooperation mechanism 22, cooperation mechanism 22 includes apron 221, pivoted board 211 is used for driving apron 221 and moves, apron 221 is articulated with pivoted board 211, the one end position of apron 221 is equipped with cleans mechanism 23, it includes slide plate 231 to clean mechanism 23, apron 221 is used for driving slide plate 231 and moves, slide plate 231 is articulated with apron 221, one side of riser 111 is fixed and is provided with the motor, the output shaft of motor and the synchronous rotation of pivoted board 211.
The bottom grafting cooperation of sliding plate 231 has division board 234, division board 234 is used for cooperating the upper surface of sliding plate 231 with the circuit board to keep apart, division board 234's both ends fixedly connected with wedge 236, wedge 236 is used for driving division board 234 and removes, division board 234's one end runs through sliding plate 231, the one end fixedly connected with pin 118 of riser 111 and baffle 121, make wedge 236 downwardly moving when one side of wedge 236 and pin 118 laminating, division board 234's top fixedly connected with lifting spring 235, lifting spring 235 is used for giving division board 234 an ascending pulling force, in order to be convenient for later stage clear up the surface of circuit board, so be provided with the breach in the bottom of sliding plate 231.
The two ends of the sliding plate 231 are fixedly connected with positioning blocks 232, the positioning blocks 232 are used for determining the moving track of the sliding plate 231, and the two positioning blocks 232 are respectively arranged in the vertical plate 111 and the baffle 121 in a sliding manner.
When isolating the upper surface of the circuit board, the motor drives the rotating plate 211 to rotate, the rotating plate 211 drives the cover plate 221 to move, the cover plate 221 drives the sliding plate 231 to move, under the limitation of the positioning block 232, the sliding plate 231 horizontally moves on the surface of the circuit board, when the cover plate 221 is in a horizontal state, the sliding plate 231 drives the isolating plate 234 and the wedge block 236 to move to the limit position, at the moment, the wedge block 236 and the stop lever 118 cooperate to enable the wedge block 236 to drive the isolating plate 234 to downwards move against the pulling force of the lifting spring 235, the notch position of the sliding plate 231 is closed, the isolating and dust-proof effect on the upper surface of the circuit board is achieved, and dust is prevented from falling to the surface of the circuit board in the working process of the circuit board, and heat dissipation of the circuit board is influenced.
In order to clean the upper surface of the circuit board when the sliding plate 231 is adjusted, one side of the partition plate 234 is provided with a scraping blade 233, and the scraping blade 233 cleans the upper surface of the circuit board when the sliding plate 231 passes over the surface of the circuit board.
The inside of the sealing device 2 is provided with a heat absorbing structure which is used for cooling the circuit board.
After the isolated protection is carried out to the circuit board, heat emitted by the circuit board can be gathered in the closed space, in order to improve the radiating effect to the circuit board, the heat absorbing structure comprises a cooling cavity 214, the cooling cavity 214 is arranged in the rotating plate 211, the cooling cavity 214 is used for storing water to absorb the heat of the circuit board, one side of the cooling cavity 214 is provided with a plug-in groove 212, the bottom of the plug-in groove 212 is provided with a matching cavity 213, and the plug-in groove 212 and the cooling cavity 214 are communicated through the matching cavity 213.
One side sliding connection of riser 111 has communication piece 114, and when adsorbing the heat of circuit board, communication piece 114 and grafting groove 212 grafting cooperation, and when the water pressure of communication piece 114 one side was big, communication piece 114 was used for leading the rivers of communication piece 114 one side to the inside of grafting groove 212, and when the water pressure of communication piece 114 one side was little, communication piece 114 was used for avoiding the water of communication piece 114 one side to spill over.
The inside sliding connection of grafting groove 212 has closure plate 216, and one side fixedly connected with of closure plate 216 seals spring 217, and closure spring 217 is used for giving closure plate 216 a thrust, and when the rotation board 211 rotated, the closure plate 216 was used for sealing the inside water of rotation board 211 in the inside of rotation board 211, avoids spilling over.
The heat absorbing structure further comprises a heat absorbing cavity 222, the heat absorbing cavity 222 is formed in the rotating plate 211, the heat absorbing cavity 222 is used for containing water to flow through for absorbing heat, the heat absorbing cavity 222 is communicated with the cooling cavity 214, one side of the cover plate 221 is slidably connected with a communicating plate 225, when the water pressure in the heat absorbing cavity 222 is high, the communicating plate 225 is used for guiding water to the inside of the baffle 121, when the water pressure in the heat absorbing cavity 222 is low, the communicating plate 225 is used for preventing water in the heat absorbing cavity 222 from flowing out, one end of the communicating plate 225 is fixedly connected with a pulling spring 224, the pulling spring 224 is used for providing a pulling force for the communicating plate 225, one side of the baffle 121 is provided with a sliding groove 122, and the communicating plate 225 is in plug-in connection with the sliding groove 122.
In order to circulate water in the heat absorbing structure, a water storage tank 113 is arranged in the base 112, the water storage tank 113 is used for storing water, a pumping pressure cavity 117 is arranged on one side of the water storage tank 113, the pumping pressure cavity 117 is used for guiding water of the water storage tank 113 to one side of the communicating block 114, a water pump is arranged in the pumping pressure cavity 117, and the water pump is used for pumping water in the water storage tank 113.
When the circuit board is isolated and protected, in order to increase the isolating effect and avoid shaking of the rotating plate 211 and the cover plate 221, one side of the vertical plate 111 is slidably connected with the limiting strip 115, the other side of the cover plate 221 is provided with the positioning groove 223, the positioning groove 223 is in plug-in fit with the limiting strip 115, one side of the limiting strip 115 is fixedly connected with the tension spring 116, the tension spring 116 is used for pulling the limiting strip 115, the inside of the vertical plate 111 is provided with the connecting cavity 119, and the connecting cavity 119 is used for guiding water flow at one side of the communicating block 114 to one side of the limiting strip 115.
One side of the baffle 121 is slidably provided with a limit bar 126, the other end of the rotating plate 211 is provided with a slot 215, the limit bar 126 is in plug-in fit with the sealing plate 216, one side of the limit bar 126 is fixedly connected with an auxiliary spring 125, the auxiliary spring 125 is used for applying a pulling force to the limit bar 126, the auxiliary spring 125 is used for guiding water flow to one side of the limit bar 126, and the bottom of the limit bar 126 is provided with a circulating cavity 127.
When the circuit board works normally, the water pump drives water in the reservoir 113 to flow from the pumping cavity 117, the pumping cavity 117 guides the water flow to one side of the communicating block 114, at the moment, the water flow pushes the communicating block 114 to move and the inserting groove 212 to be clamped and matched, the communicating block 114 pushes the matching cavity 213 to overcome the pushing force of the closing spring 217 to move, the matching cavity 213 is released from closing the matching cavity 213, meanwhile, the water flow pushes the limiting strip 115 to slide against the elastic force of the tension spring 116 through the connecting cavity 119, the limiting strip 115 and the positioning groove 223 are inserted and matched, the limitation of the cover plate 221 is completed, at the moment, the water flow flows to the inside of the matching cavity 213 through the inside of the communicating block 114 and then flows to the inside of the cooling cavity 214, and then the water flow flows to the inside of the heat absorbing cavity 222 through the cooling cavity 214, then, the water flow applies a pushing force to the communicating plate 225, so that the communicating plate 225 moves against the pulling force of the pulling spring 224, the communicating plate 225 is inserted into the sliding groove 122, at this time, the water flow flows to the inside of the communicating cavity 124 through the communicating plate 225, then flows to one side of the limiting strip 126 through the communicating cavity 124 and the auxiliary spring 125, so that the limiting strip 126 moves against the pulling force of the auxiliary spring 125, at this time, the limiting strip 126 is inserted into the inserting groove 215, the inserting groove 212 cannot rotate, the limitation of the rotating plate 211 is completed, then the water flow flows to the inside of the reservoir 113 through one side of the limiting strip 126 and the circulating cavity 127, the circulation of the water flow is completed, and the heat generated by the circuit board is absorbed in the water flow circulation process.
A second object of the present embodiment is to provide a method for isolating and dust-proof a circuit board, including any one of the above-mentioned circuit boards, including the following method steps:
s1, after a circuit board is installed, a motor drives a rotating plate 211 to rotate, the rotating plate 211 drives a cover plate 221 to move, the cover plate 221 drives a sliding plate 231 to move, and the sliding plate 231 drives a scraping sheet 233 to clean the surface of the circuit board;
s2, the water pump drives water flow in the reservoir 113 to flow, the water flow flows to one side of the communicating block 114 through the pumping pressure cavity 117, the communicating block 114 is pushed to move, the water flow flows to the inside of the matching cavity 213 and the cooling cavity 214 through the communicating block 114, then flows to the inside of the heat absorbing cavity 222 through the cooling cavity 214, the communicating plate 225 is pushed to move, the water flow flows to the inside of the communicating cavity 124 through the communicating plate 225, then the water flow pushes the limit bar 126 to move through the communicating cavity 124, and the water flow returns to the reservoir 113 through the circulating cavity 127.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. An isolation dust keeper of circuit board, its characterized in that: including fixing device (1) and set up in closing device (2) at fixing device (1) top, fixing device (1) includes fixed establishment (11), fixed establishment (11) are including riser (111), one side fixedly connected with base (112) of riser (111), one side of base (112) is equipped with positioning mechanism (12), positioning mechanism (12) include baffle (121), baffle (121) and base (112) fixed connection, closing device (2) cooperate riser (111), base (112) and baffle (121) to keep apart the upper surface of circuit board when fixed, closing device (2) clear up the upper surface of circuit board when removing, the inside of closing device (2) is equipped with heat absorption structure, heat absorption structure is used for cooling down the circuit board.
2. The isolated dust guard of a circuit board of claim 1, wherein: the sealing device (2) comprises a rotating mechanism (21), the rotating mechanism (21) comprises a rotating plate (211) which is L-shaped, the bottom end of the rotating plate (211) is hinged to a base (112), a matching mechanism (22) is arranged at the other end of the rotating plate (211), the matching mechanism (22) comprises a cover plate (221), the cover plate (221) is hinged to the rotating plate (211), a cleaning mechanism (23) is arranged at one end of the cover plate (221), the cleaning mechanism (23) comprises a sliding plate (231), and the sliding plate (231) is hinged to the cover plate (221).
3. The isolated dust guard of a circuit board of claim 2, wherein: the bottom of sliding plate (231) is pegged graft and is cooperated with division board (234), the both ends fixedly connected with wedge (236) of division board (234), the one end fixedly connected with pin (118) of riser (111) and baffle (121), the top fixedly connected with lift spring (235) of division board (234).
4. The isolated dust guard of a circuit board of claim 2, wherein: the two ends of the sliding plate (231) are fixedly connected with positioning blocks (232), and the two positioning blocks (232) are respectively arranged in the vertical plate (111) and the baffle plate (121) in a sliding mode.
5. The isolated dust guard of a circuit board of claim 2, wherein: the heat absorption structure comprises a cooling cavity (214), the cooling cavity (214) is formed in the rotating plate (211), one side of the cooling cavity (214) is provided with a plug-in groove (212), the bottom of the plug-in groove (212) is provided with a matching cavity (213), the plug-in groove (212) and the cooling cavity (214) are communicated through the matching cavity (213), a sealing plate (216) is connected to the interior of the plug-in groove (212) in a sliding manner, and a sealing spring (217) is fixedly connected to one side of the sealing plate (216).
6. The isolated dust guard of a circuit board of claim 5, wherein: one side of the vertical plate (111) is connected with a communicating block (114) in a sliding manner, and when heat of the circuit board is absorbed, the communicating block (114) is in plug-in fit with the plug-in groove (212).
7. The isolated dust guard of a circuit board of claim 6, wherein: the heat absorption structure further comprises a heat absorption cavity (222), the heat absorption cavity (222) is formed in the rotating plate (211), the heat absorption cavity (222) is communicated with the cooling cavity (214), one side of the cover plate (221) is connected with a communication plate (225) in a sliding mode, one end of the communication plate (225) is fixedly connected with a pulling spring (224), one side of the baffle plate (121) is provided with a sliding groove (122), and the communication plate (225) is matched with the sliding groove (122) in an inserting mode.
8. The isolated dust guard of a circuit board of claim 7, wherein: the inside of base (112) has seted up cistern (113), pumping pressure chamber (117) have been seted up to one side of cistern (113).
9. The isolated dust guard of a circuit board of claim 8, wherein: one side sliding connection of riser (111) has and prescribes a limit to strip (115), constant head tank (223) have been seted up to the opposite side of apron (221), constant head tank (223) and prescribe a limit to strip (115) grafting cooperation, one side fixedly connected with tension spring (116) of prescribing a limit to strip (115), connecting chamber (119) have been seted up to the inside of riser (111), connecting chamber (119) are used for leading the rivers of intercommunication piece (114) one side to prescribing a limit to strip (115).
10. An isolation and dust-proof method for a circuit board, comprising the isolation and dust-proof device for a circuit board according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:
s1, after a circuit board is installed, a motor drives a rotating plate (211) to rotate, the rotating plate (211) drives a cover plate (221) to move, the cover plate (221) drives a sliding plate (231) to move, and the sliding plate (231) drives a scraping sheet (233) to clean the surface of the circuit board;
s2, the water pump drives water flow in the reservoir (113) to flow, the water flow flows to one side of the communicating block (114) through the pumping pressure cavity (117), the communicating block (114) is pushed to move, the water flow flows to the inside of the matching cavity (213) and the cooling cavity (214) through the communicating block (114), then flows to the inside of the heat absorbing cavity (222) through the cooling cavity (214), the communicating plate (225) is pushed to move, the water flow flows to the inside of the communicating cavity (124) through the communicating plate (225), and then the water flow pushes the limiting strip (126) to move through the communicating cavity (124), and the water flow returns to the reservoir (113) through the circulating cavity (127).
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