CN116437569A - Lead, lead fixing structure and lead reinforcing method - Google Patents

Lead, lead fixing structure and lead reinforcing method Download PDF

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Publication number
CN116437569A
CN116437569A CN202210003127.3A CN202210003127A CN116437569A CN 116437569 A CN116437569 A CN 116437569A CN 202210003127 A CN202210003127 A CN 202210003127A CN 116437569 A CN116437569 A CN 116437569A
Authority
CN
China
Prior art keywords
lead
circuit board
groove
hole
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210003127.3A
Other languages
Chinese (zh)
Inventor
刘欣
石豪天
高少勇
吴文彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Zhenhua Microelectronics Co Ltd
Original Assignee
Shenzhen Zhenhua Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Zhenhua Microelectronics Co Ltd filed Critical Shenzhen Zhenhua Microelectronics Co Ltd
Priority to CN202210003127.3A priority Critical patent/CN116437569A/en
Publication of CN116437569A publication Critical patent/CN116437569A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10795—Details of lead tips, e.g. pointed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The invention provides a lead, a lead fixing structure and a lead reinforcing method. The lead comprises a lead body, and a splicing groove is formed in one end of the lead body. The lead fixing structure comprises a lead and a circuit board, wherein a lead hole is formed in the circuit board, one end of the lead body, provided with a plugging groove, penetrates through the lead hole and extends partially beyond the lead hole, the lead is electrically connected with the circuit board, and the plugging groove beyond the groove wall of the lead hole can be cracked and abutted to the circuit board after being stressed, so that the lead is fixedly connected to the circuit board. The lead reinforcement method comprises the following steps: connecting one end of the plugging groove to a circuit board through expansion riveting; soldering the lead wire after expansion riveting to a bonding pad of the circuit board. The lead and the circuit board bonding pad Kong Xian are mechanically fixed in a physical expansion riveting mode, and then better electric connection and fixing effect are achieved in a soldering tin mode, so that the reliability is better.

Description

Lead, lead fixing structure and lead reinforcing method
Technical Field
The invention belongs to the technical field of integrated circuits, and particularly relates to a lead, a lead fixing structure and a lead reinforcing method.
Background
In conventional integrated circuit module products, the circuit board typically acquires the input-output terminals by way of via pad solder connection leads. The lead is fixed on the printed board in a soldering manner, and then the whole module is fixed and welded on the whole printed board through the lead. In the case of military products, where the requirement of a part of vibration environment is high, the lead wire fixed only by welding is easily affected by mechanical fatigue vibration, so that solder cracks and even falls off, and therefore, the fixing mode has a great risk in a high vibration environment.
Disclosure of Invention
In view of the above, the present invention provides a lead and a lead fixing structure and a lead reinforcing method.
The invention provides a lead, which comprises a lead body, wherein an inserting groove is formed in one end of the lead body.
In an embodiment of the invention, the lead body includes a bamboo joint portion and a supporting portion, and the inserting groove is opened at the bamboo joint portion.
In an embodiment of the invention, the plugging groove is a blind hole formed on one end of the lead body along the axial direction of the lead body.
In an embodiment of the invention, the bamboo joint part comprises a limiting end and a connecting end, the inserting groove is arranged at the connecting end, the connecting end is arranged in a lead hole of the circuit board in a penetrating manner, the limiting end and the connecting end form a limiting plane, and the limiting plane is abutted with the circuit board to limit the limiting end to move into the lead hole.
The present invention also provides a lead fixing structure including:
a lead wire;
the circuit board is provided with a lead hole, one end of the lead body provided with a plugging groove penetrates through the lead hole and extends partially beyond the lead hole, the lead is electrically connected with the circuit board, and the plugging groove beyond the groove wall of the lead hole can be cracked and abutted to the circuit board after being stressed, so that the lead is fixedly connected to the circuit board.
In an embodiment of the invention, the lead fixing structure further includes a fixing member, and the fixing member includes a supporting portion and an extending portion, and the extending portion is inserted into the insertion groove, so that the connection end is fixed on the circuit board.
In an embodiment of the invention, the fixing piece is a rivet nut, and the rivet nut is inserted into the insertion groove, so that the lead is riveted on the circuit board.
The invention also provides a lead reinforcement method, wherein the lead comprises a lead body, one end of the lead body is provided with a splicing groove, and the lead reinforcement method comprises the following steps:
connecting one end of the plugging groove to a circuit board through expansion riveting;
soldering the lead wire after expansion riveting to a bonding pad of the circuit board.
In an embodiment of the present invention, the step of connecting the one end of the plugging slot to the circuit board through rivet further includes the following steps:
placing the lead wire on a base of the riveting tool, and exposing one end of the lead wire provided with the inserting groove;
mounting the lead body on a circuit board provided with a lead hole, and enabling one end of the lead body provided with a splicing groove to penetrate through the lead hole;
mounting a supporting part of the fixing piece to the output end of the lead wire expansion riveting pressure head, and enabling an extending part of the fixing piece to be aligned with the lead wire inserting groove;
the lead wire expansion riveting pressure head is pressed down until the extension part of the fixing piece stretches into the lead wire inserting hole, so that the lead wire is connected to the circuit board through expansion riveting.
In an embodiment of the invention, the riveting tool base is provided with four accommodating grooves, the lead wires comprise four groups, and each group of lead wires is respectively arranged in each accommodating groove.
The implementation of the embodiment of the invention has at least the following beneficial effects:
the circuit board and the lead are combined through a tool, the expansion riveting fixation of the lead is completed through a riveting press and a special riveting head, and then the expansion riveting lead is soldered corresponding to a printed board bonding pad to ensure the electrical connection performance and fixation again. The lead and the circuit board bonding pad Kong Xian are mechanically fixed in a physical expansion riveting mode, and then better electric connection and fixing effect are achieved in a soldering tin mode, so that the reliability is better.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of an overall structure of a lead and a lead fixing structure in an embodiment.
Fig. 2 is a flow chart of a method of wire fixing in an embodiment.
Fig. 3 is a flowchart illustrating a specific step of a wire fixing method according to an embodiment.
Fig. 4 is a schematic overall structure of a lead fixing method in an embodiment.
In the figure: 1. a lead fixing structure; 100. a lead body; 101. a plug-in groove; 102. a blind hole; 110. bamboo joint parts; 111. a limiting end; 112. a connection end; 113. a limit plane; 120. a support section; 200. a circuit board; 201. a lead hole; 300. a fixing member; 310. a support part; 320. an extension; 400. a pedestal of the riveting tool; 401. a receiving groove; 500. and (5) a lead wire expansion riveting press head.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are correspondingly changed.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Example 1
Referring to fig. 1, the present invention provides a lead, which includes a lead body 100, and a socket 101 is formed at one end of the lead body 100. In some embodiments, the lead body 100 is a bamboo-joint lead, including a bamboo-joint portion 110 and a supporting portion 120, the inserting groove 101 is opened on the bamboo-joint portion 110, and the inserting groove 101 can be broken and fixed on other structures under the action of external force during fixing. In other embodiments, the lead body 100 is a nail head lead, and the insertion groove 101 is axially formed at a nail head end of the nail head lead.
Further, in some embodiments, the plugging slot 101 is a blind hole 102 formed on one end of the lead body along the axial direction of the lead body 100. In other embodiments, the mating groove 101 opens radially through one end of the lead body 100.
Further, the bamboo joint portion 110 includes a limiting end 111 and a connecting end 112, and in some embodiments, the limiting end 111 and the connecting end 112 are generally cylindrical structures, and the diameter of the connecting end 112 is smaller than the diameter of the limiting end 111. In other embodiments, the limiting end 111 and the connecting end 112 are substantially prismatic structures with square cross sections, and the side length of the connecting end 112 is smaller than that of the limiting end 111, so that a limiting plane 113 is formed between the limiting end 111 and the connecting end 112, and the bamboo joint portion 110 is clamped on the circuit board 200.
Further, in some embodiments, the plugging slot 101 is formed in the center of the connection end 112, the connection end 112 is disposed in the lead hole 201 of the circuit board 200 in a penetrating manner, and the limiting plane 113 abuts against the circuit board 200 to limit the movement of the limiting end 111 into the lead hole 201. When an external force is applied, the connection end 112 can be deformed and fixed on the circuit board 200, so that the stability of fixing the lead is improved. In other embodiments, the socket 101 may be formed on one side of the connection end 112.
Example two
Referring to fig. 1, the present invention further provides a lead fixing structure 1 including a lead. The lead includes a lead body 100, and a socket 101 is formed at one end of the lead body 100. In some embodiments, the lead body 100 is a bamboo-joint lead, including a bamboo-joint portion 110 and a supporting portion 120, the inserting groove 101 is opened on the bamboo-joint portion 110, and the inserting groove 101 can be broken and fixed on other structures under the action of external force during fixing. In other embodiments, the lead body 100 is a nail head lead, and the insertion groove 101 is axially formed at a nail head end of the nail head lead.
The lead fixing structure 1 further includes a circuit board 200, the circuit board 200 is provided with a lead hole 201, in some embodiments, one end of the lead body 100 provided with the socket 101 is disposed in the lead hole 201 in a penetrating manner and extends partially beyond the lead hole 201, and when the lead is disposed in the lead hole 201 in a penetrating manner, the lead and the circuit board 200 can be electrically connected. In some embodiments, two sets of lead holes 201 are formed in the circuit board 200 for fixing leads, and in other embodiments, four sets of lead holes 201 are formed in the circuit board 200 for fixing leads.
Preferably, the lead holes 201 are pads of the circuit board 200.
Further, when an external force is applied, the plugging groove 101 is cracked outwards beyond the groove wall of the lead hole 201, and the outwards cracked groove wall can be abutted against the circuit board 200, and at the moment, the width of the cracked groove wall is larger than the inner diameter of the lead hole 201, so that the lead is fixedly connected to the circuit board 200.
Referring to fig. 1, the lead fixing structure 1 further includes a fixing member 300, and in some embodiments, the fixing member 300 includes a supporting portion 310 and an extending portion 320, when the extending portion 320 is inserted into the insertion groove 101, the extending portion 320 can crack and deform a portion of the lead beyond the lead hole 201 outwards, and fix the connection end 112 on the circuit board 200. In other embodiments, the fixing member 300 is a rivet nut, and in use, the rivet nut is inserted into the insertion groove 101, and after the rivet nut is deformed, the connection position of the lead connecting portion and the limiting portion is deformed, so that the lead is riveted on the circuit board 200 to achieve fixing.
Example III
Referring to fig. 2, the present invention further provides a method for reinforcing a lead, which includes the following steps:
s110: connecting one end of the lead provided with the inserting groove 101 to the circuit board 200 through expansion riveting;
s120: soldering the lead wire after the expansion riveting to a bonding pad of the circuit board 200.
The lead is connected to the circuit board 200 by physical expansion riveting, at this time, the lead is electrically connected with the circuit board 200, and the stability of connection between the lead and the circuit board 200 can be increased, when the lead is in a high vibration environment, the soldering points may fall off, and at this time, the lead which is subjected to physical fixed connection is not easy to fall off.
Referring to fig. 3-4, step S110 further includes the following steps:
s111: placing the lead wire on the tensioning tool base 400, and exposing one end of the lead wire provided with the inserting groove 101;
s112: mounting the lead body 100 onto the circuit board 200 provided with the lead hole 201, and enabling one end of the lead body 100 provided with the inserting groove 101 to penetrate through the lead hole 201;
s113: mounting the support portion 310 of the fixture 300 to the output end of the wire tensioning rivet head 500, and aligning the extension portion 320 of the fixture 300 to the wire inserting groove 101;
s114: the wire tension rivet ram 500 is pressed down to extend into the wire insertion hole through the extension 320 of the fixture 300 to allow the wire tension rivet to be connected to the circuit board 200.
In the fixation, the structure of the lead connection part is subjected to plastic deformation, so that one end of the lead can be clamped in the lead hole 201, and meanwhile, the position of the lead bamboo joint part 110 can be fixed by the limiting part of the lead, therefore, only the part exceeding the lead hole 201 of the lead can be deformed in the expansion riveting process, the remaining length of the lead can be prolonged as much as possible while the stability of the fixation structure is ensured, and the connection of the lead and other structures is facilitated.
In some embodiments, the rivet tool base 400 is provided with a receiving groove 401, and the lead support portion 120 may be disposed in the receiving groove 401, so as to facilitate fixing and mounting between the lead and the circuit board 200. In other embodiments, the riveting tool base 400 is provided with four accommodating grooves 401, and the leads include four groups, and each group of leads is respectively disposed in each accommodating groove 401.
In the application, the circuit board 200 and the lead are combined through the fixture, the rivet expansion fixation of the lead is completed through the rivet pressing machine and the special rivet pressing head, and then the rivet expansion lead corresponds to the printed board bonding pad and is soldered again to ensure the electrical connection performance and fixation again. The lead and the bonding pad Kong Xian of the circuit board 200 are mechanically fixed in a physical expansion riveting mode, and then better electric connection and fixing effect are realized in a soldering tin mode, so that the reliability is better.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing disclosure is illustrative of the present invention and is not to be construed as limiting the scope of the invention, which is defined by the appended claims.

Claims (10)

1. The lead is characterized by comprising a lead body, wherein an inserting groove is formed in one end of the lead body.
2. A lead as defined in claim 1, wherein: the lead body comprises a bamboo joint part and a supporting part, and the inserting groove is formed in the bamboo joint part.
3. A lead as defined in claim 1, wherein: the inserting groove is a blind hole axially formed in one end of the lead body along the lead body.
4. A lead as defined in claim 1, wherein: the bamboo joint portion comprises a limiting end and a connecting end, the inserting groove is formed in the connecting end, the connecting end penetrates through a lead hole of the circuit board, the limiting end and the connecting end form a limiting plane, and the limiting plane is in butt joint with the circuit board to limit the limiting end to move into the lead hole.
5. A lead fixing structure, characterized by comprising:
the lead of any one of claims 1-4;
the circuit board is provided with a lead hole, one end of the lead body provided with a plugging groove penetrates through the lead hole and extends partially beyond the lead hole, the lead is electrically connected with the circuit board, and the plugging groove beyond the groove wall of the lead hole can be cracked and abutted to the circuit board after being stressed, so that the lead is fixedly connected to the circuit board.
6. The lead fixing structure according to claim 5, wherein: the lead fixing structure further comprises a fixing piece, wherein the fixing piece comprises a supporting part and an extending part, and the extending part is inserted into the inserting groove so that the connecting end is fixed on the circuit board.
7. The lead fixing structure according to claim 6, wherein: the fixing piece is a rivet nut which is inserted into the insertion groove so that the lead is riveted on the circuit board.
8. The lead reinforcement method is characterized in that the lead comprises a lead body, one end of the lead body is provided with a splicing groove, and the method comprises the following steps:
connecting one end of the plugging groove to a circuit board through expansion riveting;
soldering the lead wire after expansion riveting to a bonding pad of the circuit board.
9. The method of wire bonding of claim 8 wherein: the step of connecting one end of the plugging groove to the circuit board through rivet expansion further comprises the following steps:
placing the lead wire on a base of the riveting tool, and exposing one end of the lead wire provided with the inserting groove;
mounting the lead body on a circuit board provided with a lead hole, and enabling one end of the lead body provided with a splicing groove to penetrate through the lead hole;
mounting a supporting part of the fixing piece to the output end of the lead wire expansion riveting pressure head, and enabling an extending part of the fixing piece to be aligned with the lead wire inserting groove;
the lead wire expansion riveting pressure head is pressed down until the extension part of the fixing piece stretches into the lead wire inserting groove, so that the lead wire is connected to the circuit board through expansion riveting.
10. The method of wire bonding of claim 9 wherein: the riveting tool base is provided with four accommodating grooves, the lead wires comprise four groups, and each group of lead wires are respectively arranged in each accommodating groove.
CN202210003127.3A 2022-01-04 2022-01-04 Lead, lead fixing structure and lead reinforcing method Pending CN116437569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210003127.3A CN116437569A (en) 2022-01-04 2022-01-04 Lead, lead fixing structure and lead reinforcing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210003127.3A CN116437569A (en) 2022-01-04 2022-01-04 Lead, lead fixing structure and lead reinforcing method

Publications (1)

Publication Number Publication Date
CN116437569A true CN116437569A (en) 2023-07-14

Family

ID=87081968

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210003127.3A Pending CN116437569A (en) 2022-01-04 2022-01-04 Lead, lead fixing structure and lead reinforcing method

Country Status (1)

Country Link
CN (1) CN116437569A (en)

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