CN116436371B - Frequency converter with heat radiation structure - Google Patents
Frequency converter with heat radiation structure Download PDFInfo
- Publication number
- CN116436371B CN116436371B CN202310532042.9A CN202310532042A CN116436371B CN 116436371 B CN116436371 B CN 116436371B CN 202310532042 A CN202310532042 A CN 202310532042A CN 116436371 B CN116436371 B CN 116436371B
- Authority
- CN
- China
- Prior art keywords
- frame
- mounting frame
- heat dissipation
- circuit main
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005855 radiation Effects 0.000 title claims description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims description 47
- 238000000926 separation method Methods 0.000 claims description 14
- 239000012466 permeate Substances 0.000 claims 1
- 238000005192 partition Methods 0.000 abstract description 25
- 238000003756 stirring Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 8
- 238000007664 blowing Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
- H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to heat dissipation of a frequency converter, in particular to a frequency converter with a heat dissipation structure. The air conditioner comprises a mounting shell, wherein a partition piece is arranged in the mounting shell, a heat dissipation outer frame is sleeved outside the mounting shell, the mounting shell comprises a mounting frame and a circuit main board arranged inside the mounting frame, fans are arranged on the upper side and the lower side of the mounting frame, the fans stir air inside the mounting frame, the stirred air in the mounting frame drives heat generated by working on the circuit main board to leave the mounting frame, and the partition piece partitions and guides flowing air in the flowing process. According to the invention, the air flow blown by the fan is guided by the separating piece, so that the air flow is blown onto the circuit main board, the heat dissipation dead angle on the circuit main board is avoided, meanwhile, the air flow absorbing the hot air is guided away from the circuit main board by the separating piece, the heat dissipation of the circuit main board is accelerated, the air flow absorbing the hot air is guided by the heat dissipation outer frame, and the rapid air discharge device with the hot air is accelerated.
Description
Technical Field
The invention relates to heat dissipation of a frequency converter, in particular to a frequency converter with a heat dissipation structure.
Background
The frequency converter is the electric power control equipment that uses frequency conversion technique and microelectronics, controls alternating current motor through changing motor working power frequency mode, and at the in-process of converter work, the inside of frequency converter can produce heat, in order to guarantee the normal use of frequency converter, can be provided with the fan in the inside of frequency converter, blows the inside of frequency converter through the fan, accomplishes the cooling of frequency converter like this, ensures the normal use of frequency converter.
When the fan in the frequency converter blows the inside of the frequency converter, because the electronic element arranged in the frequency converter is not flat, a heat dissipation dead angle exists in the frequency converter, and the fan cannot cool the position of the dead angle when blowing, so that the heat in the frequency converter is continuously gathered, the temperature in the frequency converter is further increased, the frequency converter cannot be normally used due to overhigh temperature, and in order to improve the heat dissipation effect of the fan on the frequency converter, the frequency converter with the heat dissipation structure is provided for assisting the fan to cool the whole frequency converter.
Disclosure of Invention
The present invention is directed to a frequency converter with a heat dissipation structure, so as to solve the problems set forth in the background art.
In order to achieve the above-mentioned purpose, a frequency converter with heat radiation structure is provided, including the installation shell, the inside of installation shell is provided with the separator, the outside cover of installation shell is equipped with the heat dissipation outer frame, the heat dissipation outer frame is used for with the inside, outside air intercommunication of installation shell, the separator separates the inside space of installation shell, the installation shell includes the installing frame and sets up at the inside circuit board of installing frame, the fan is all installed to the upper and lower both sides of installing frame, the fan stirs the inside gas flow of installing frame, the heat that work produced on the gas drive circuit board that is stirred in the installing frame leaves the installing frame, and at the in-process that the air current flows, the separator separates the guide to the gas that flows, makes the gas in the installing frame gather towards the space that sets up the circuit board, and the gas that flows discharges the installing frame through the guide of heat dissipation outer frame.
As a further improvement of the technical scheme, the convex frame is arranged on one side of the circuit main board and fixed on the inner side wall of the mounting frame, and the convex frame supports the circuit main board, so that a gap is reserved between the circuit main board and the side wall of the mounting frame, and part of air flow generated by the fan is conducted into the gap.
As a further improvement of the technical scheme, two opposite side walls of the mounting frame are communicated with the outside, the heat dissipation outer frame comprises an end frame arranged at the communication position of the mounting frame and the outside, and the air inside the mounting frame and the air outside the mounting frame circulate through the end frame.
As a further improvement of the technical scheme, the upper half part of the end frame extends upwards and outwards continuously from the middle part, a plurality of inverted V-shaped outer guide plates are fixed on the outwards extending part of the end frame, one end of each outer guide plate extends into the installation frame to guide gas flowing in the installation frame, and the gas is led to leave the installation frame through the outer guide plates.
As a further improvement of the technical scheme, a plurality of upper guide plates inclined towards the mounting frame are fixed at the position of the upper side of the lower half part of the end frame, and a plurality of lower guide plates inclined towards the lower direction away from the mounting frame are fixed at the position of the lower side of the lower half part of the end frame.
As a further improvement of the technical scheme, the upper ends of the two end frames are fixedly provided with top plates, and the top plates are arranged at the top of the mounting frame and leave a space with the mounting frame.
As a further improvement of this technical scheme, the separator includes bottom division board and sets up the top division board in the oblique top of bottom division board, connect through an curved guide board between bottom division board and the top division board, the inside at the installing frame is fixed through the connecting strip to bottom division board and the one end of top division board, when the fan that is located the bottom upwards blows the air current, the top division board is with the direction guide of air current to circuit motherboard.
As a further improvement of the technical scheme, a plurality of guide inclined pipes are fixed on one side of the upper separation plate, which is close to the circuit main plate, and are inclined towards the inclined upper side, which is far away from the circuit main plate, when the air flow in the installation frame moves upwards, the air flow absorbs heat generated on the circuit main plate and moves to the other side of the guide plate through the guide inclined pipes, a plurality of inclined guide plates are symmetrically fixed on one side of the upper separation plate, which is far away from the circuit main plate, and are inclined towards the inclined lower side of the bilateral symmetry position of the upper separation plate, and air blown from the lower direction is guided by the inclined guide plates to the two sides of the upper separation plate, and air blown from the upper side to the lower side is guided by the inclined guide plates and is blown to the circuit main plate through the inclined guide plates.
As a further development of the solution, both of the fans direct the air flow upwards.
As a further development of the present solution, both of the fans direct the air flow towards the inside of the mounting frame.
Compared with the prior art, the invention has the beneficial effects that:
1. in this converter with heat radiation structure, guide the air current that blows to the fan through the separator, make the air current blow towards circuit motherboard, avoid having the heat dissipation dead angle on the circuit motherboard, the circuit motherboard is kept away from to the air current guide of separator to absorbing steam simultaneously for circuit motherboard's heat dissipation, the rethread heat dissipation outer frame is directed the air current of absorbing steam, the quick exhaust device of air with steam, accomplish the holistic radiating effect of device, guarantee the normal use of device.
2. In the frequency converter with the heat radiation structure, when the air flow of the fan is blown upwards, the guide plate guides the part of the upward air flow to the position of the circuit main board, so that the air flow blows the electronic element on the circuit main board, the temperature on the electronic element is reduced, meanwhile, the part of air absorbing heat is guided to the other side of the upper partition plate through the guide inclined pipe, and then the inclined guide plate guides the part of air to the direction of the end frame, so that the speed of the air flow leaving the installation frame is accelerated, and the time of the hot air in the installation frame is shortened.
3. In this converter with heat radiation structure, when two fans blow the air current to the inside of installing frame, the air current that moves up is guided by the guide board and blows the circuit motherboard, and the air current that moves down carries out the blowing to the circuit motherboard, and the inclined guide board guides the air current simultaneously, makes the air current gather at the middle part of upper division board to blow the circuit motherboard through guiding the inclined tube, strengthens the cooling effect to the circuit motherboard, and the air current that moves up and air current that moves down after gathering in the installing frame moves to the both sides of installing frame, makes the gas diffuse outside through the heat dissipation outer frame, further quickens the radiating rate of device, guarantees the normal use of device.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the whole device of the present invention;
FIG. 3 is a second schematic cross-sectional view of the overall apparatus of the present invention;
FIG. 4 is a schematic view of the mounting shell structure of the present invention;
FIG. 5 is a schematic view of a heat dissipating outer frame according to the present invention;
FIG. 6 is a schematic view of a separator according to the present invention;
FIG. 7 is a second schematic view of a separator according to the present invention;
FIG. 8 is one of the schematic upward flow diagrams of the internal air flow of the device of the present invention;
FIG. 9 is a second schematic view of the upward flow of air in the device of the present invention;
FIG. 10 is one of the schematic diagrams of the flow of air inside the device toward the inside of the mounting frame of the present invention;
FIG. 11 is a second schematic view showing the collection of the air flow inside the device toward the inside of the mounting frame according to the present invention.
The meaning of each reference sign in the figure is:
1. a mounting shell; 11. a mounting frame; 12. a convex frame; 13. a circuit motherboard; 14. a fan; 15. a buckling strip;
2. a heat dissipation outer frame; 21. an end frame; 22. a top plate; 23. an outer guide plate; 24. an upper guide plate; 25. a lower guide plate;
3. a partition; 31. a bottom separation plate; 32. an upper partition plate; 33. a guide plate; 34. a guiding inclined tube; 35. and an inclined guide plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
When the fan in the frequency converter blows to the inside of the frequency converter, because the electronic element arranged in the frequency converter is not smooth, a heat dissipation dead angle exists in the frequency converter, and the fan cannot cool the position of the dead angle when blowing, so that heat in the frequency converter is continuously gathered, the internal temperature of the frequency converter is further increased, and the frequency converter cannot be normally used due to overhigh temperature.
In order to solve the above-mentioned problem, please refer to fig. 1-4, a frequency converter with heat dissipation structure is provided, including installation shell 1, the inside of installation shell 1 is provided with partition piece 3, the outside cover of installation shell 1 is equipped with heat dissipation outer frame 2, heat dissipation outer frame 2 is used for the inside, outside air intercommunication of installation shell 1, partition piece 3 separates the space inside installation shell 1, wherein, installation shell 1 includes installation frame 11 and the circuit motherboard 13 of setting in installation frame 11, partition piece 3 separates installation frame 11 into two spaces, circuit motherboard 13 sets up in one of them space, fan 14 is installed to the upper and lower both sides of installation frame 11, fan 14 stirs the inside gas flow of installation frame 11, the heat that is produced by the work on the gas that stirs in the installation frame 11 drives circuit motherboard 13 and leaves installation frame 11, in the in-process that the air flow, partition piece 3 separates the guide to the gas that flows, make the gas in the installation frame 11 gather towards the space that sets up circuit motherboard 13, increase the dead angle on circuit motherboard 13, avoid blowing to appear on circuit motherboard 13, simultaneously the gas that flows is discharged through the guide frame 2 that the heat dissipation is done in the quick heat dissipation frame 11, accomplish in the installation frame 13.
Referring to fig. 4, a convex frame 12 is installed on one side of a circuit board 13, the convex frame 12 is fixed on the inner side wall of a mounting frame 11, and the convex frame 12 supports the circuit board 13, so that a gap is reserved between the circuit board 13 and the side wall of the mounting frame 11, part of air flow generated by a fan 14 is carried into the gap, heat generated at the back of the circuit board 13 is taken away, the overall heat dissipation of the circuit board 13 is achieved, and the heat dissipation speed of the circuit board 13 is accelerated.
Referring to fig. 1 to 5, the two opposite side walls of the mounting frame 11 are communicated with the outside, the heat dissipation outer frame 2 comprises an end frame 21 arranged at the communication position between the mounting frame 11 and the outside, the air inside the mounting frame 11 and the air outside the mounting frame 11 are circulated through the end frame 21, the upper half part of the end frame 21 is continuously extended outwards from the middle part, and when dust exists, the outwards inclined part of the end frame 21 can be shielded below the end frame 21, so that the effect of shielding the dust is achieved.
A plurality of inverted V-shaped outer guide plates 23 are fixed at the outwards extending part of the end frame 21, one end of each outer guide plate 23 extends into the installation frame 11 to guide the air flowing in the installation frame 11, a plurality of upper guide plates 24 inclined towards the installation frame 11 are fixed at the upper side of the lower half part of the end frame 21, a plurality of lower guide plates 25 inclined towards the inclined lower side far away from the installation frame 11 are fixed at the lower side of the lower half part of the end frame 21, and when the air flow is discharged outwards through the end frame 21, the upper guide plates 24 and the lower guide plates 25 disperse and guide the air flow flowing outwards to enlarge the air diffusion area, so that the air flow with hot air is prevented from gathering near the device, and the effect of fast diffusion of the hot air is achieved.
In order to prevent dust from entering the inside of the device through the fan 14 located at the upper side, a top plate 22 is fixed to the upper ends of the two end frames 21, the top plate 22 is provided at the top of the mounting frame 11 and leaves a space with the mounting frame 11, the top plate 22 shields the upper side of the mounting frame 11, and when the fan 14 sends air to the inside of the mounting frame 11 or the fan 14 sends air to the outside of the mounting frame 11, air flows from the space between the top plate 22 and the mounting frame 11.
Meanwhile, the upper side screw of the end frame 21 is connected to the top of the installation frame 11, the bottom of the end frame 21 is inserted with a buckling strip 15, one end of the buckling strip 15 is fixed on the installation frame 11, and the position of the end frame 21 on one side of the installation frame 11 is fixed by limiting the position of the bottom of the end frame 21 through the buckling strip 15.
Referring to fig. 2-3 and 6-7, the partition member 3 includes a bottom partition plate 31 and an upper partition plate 32 disposed obliquely above the bottom partition plate 31, the bottom partition plate 31 is disposed far away from the circuit board 13, the guide plate 33 is disposed close to the circuit board 13, the bottom partition plate 31 and the upper partition plate 32 are connected by an arc guide plate 33, one ends of the bottom partition plate 31 and the upper partition plate 32 are fixed in the mounting frame 11 by connecting strips, when the fan 14 at the bottom blows air flow upwards, the upper partition plate 32 guides the air flow to the direction of the circuit board 13, the amount of air flow passing through the circuit board 13 is increased, the temperature reduction of the air flow to the circuit board 13 is accelerated, meanwhile, the blowing of the air flow to the circuit board 13 is increased, the heat dissipation dead angle on the circuit board 13 is reduced, and the effective heat dissipation to the circuit board 13 is achieved.
In order to enhance the heat dissipation effect on the circuit board 13, a plurality of guiding inclined pipes 34 are fixed on one side of the upper partition plate 32 close to the circuit board 13, the guiding inclined pipes 34 incline obliquely upwards away from the circuit board 13, and when the air flow in the installation frame 11 moves upwards, the air flow absorbs heat generated on the circuit board 13, and moves to the other side of the guiding plate 33 through the guiding inclined pipes 34, so that the heat on one side of the circuit board 13 is reduced, the heat is quickly guided, and the heat diffusion is quickened.
Meanwhile, a plurality of inclined guide plates 35 are symmetrically fixed on one side of the upper separation plate 32 far from the circuit main plate 13 in a left-right symmetry way, the inclined guide plates 35 incline towards the inclined lower parts of the left-right symmetry positions of the upper separation plate 32, air blown in the lower direction is guided by the inclined guide plates 35 to be guided to two sides of the upper separation plate 32, the guided air flow leaves the device through the space between the outer guide plates 23, the heat dissipation speed of the device is accelerated, the air blown in the upper direction is gathered at the middle position of the upper separation plate 32 through the guiding of the inclined guide plates 35, the circuit main plate 13 is blown through the guiding inclined pipes 34, the air flow flowing on the circuit main plate 13 is increased, and the heat dissipation speed on the circuit main plate 13 is accelerated.
Example 1
Referring to fig. 1 to 9, the present embodiment limits the blowing direction of the two fans 14 such that the two fans 14 both guide the air flow upward and the two fans 14 rotate at the same speed, when the two fans 14 both blow the air upward, the fan 14 located at the upper side of the mounting frame 11 collects the air flow inside the mounting frame 11, and conveys the air flow to the outside of the mounting frame 11, the conveyed air flow leaves the apparatus through the space between the mounting frame 11 and the top plate 22, the air generated in the mounting frame 11 is absorbed, the fan 14 located at the bottom of the mounting frame 11 captures the air at the bottom of the mounting frame 11, and conveys the captured air to the inside of the mounting frame 11, the air conveyed to the mounting frame 11 is first separated by the bottom separation plate 31, and then most of the air conveyed to the mounting frame 11 by the fan 14 is flowed toward the circuit main board 13 by the guide of the guide plate 33, part of the air flow blows the electronic components on the circuit board 13, part of the air flow flows away from the gap between the circuit board 13 and the mounting frame 11, part of the air taking away the heat of the circuit board 13 moves to one side of the upper partition plate 32 away from the circuit board 13 through the guide inclined tube 34, the air flow moving upwards from the lower side of the partition member 3 blows the air passing through the guide inclined tube 34 upwards, the inclined guide plate 35 blocks the moving upwards air flow and guides the air flow to two sides, so that the air with the heat moves towards the outer guide plates 23, the air close to the outer guide plates 23 leaves the device through the spaces among the outer guide plates 23, part of the air in the mounting frame 11 leaves the mounting frame 11 through the lower half part of the end frame 21, and the upper guide plate 24 and the lower guide plate 25 guide the air flow to different directions to accelerate the diffusion of the air with the heat.
Example 2
In embodiment 1, the rotation speed of the two fans 14 is limited, the rotation speed of the lower fan 14 is higher than the rotation speed of the upper fan 14, so that the speed of the air captured by the upper fan 14 from the mounting frame 11 is slow and the air flow of the air is conveyed to the mounting frame 11 by the lower fan 14, the air in the mounting frame 11 is gathered, the air in the mounting frame 11 expands to two sides and leaves the mounting frame 11 from the end frame 21, the heat dissipation effect of the device can be increased, and the heat dissipation speed of the circuit main board 13 is improved.
Example 3
Referring to fig. 1 to 7 and fig. 10 to 11, the blowing direction of the fans 14 in embodiment 1 is changed, both fans 14 guide the air flow toward the inside of the installation frame 11, at this time, the fan 14 located at the top of the installation frame 11 conveys the air flow on the upper side of the installation frame 11 toward the installation frame 11, part of the air flow entering into the installation frame 11 directly blows the circuit board 13, part of the air flow is guided by the inclined guide plate 35 toward the middle position of the upper partition plate 32 and is gathered, during the movement of the air flow, the air enters into the other side of the upper partition plate 32 through the guide inclined pipe 34, the air coming out of the guide inclined pipe 34 blows the circuit board 13, the heat dissipation effect on the circuit board 13 is improved, and the air flow moving from top to bottom and the air flow moving from bottom to top are impacted together in the installation frame 11 and then spread to the outside through the end frame 21.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a converter with heat radiation structure, includes installation shell (1), the inside of installation shell (1) is provided with separating piece (3), the outside cover of installation shell (1) is equipped with heat dissipation outer frame (2), heat dissipation outer frame (2) are used for with installation shell (1) inside, outside air intercommunication, separating piece (3) separates installation shell (1) inside space, its characterized in that: the mounting shell (1) comprises a mounting frame (11) and a circuit main board (13) arranged in the mounting frame (11), fans (14) are arranged on the upper side and the lower side of the mounting frame (11), the fans (14) agitate the gas flow in the mounting frame (11), the agitated gas in the mounting frame (11) drives heat generated by working on the circuit main board (13) to leave the mounting frame (11), in the process of flowing the gas, the flowing gas is separated and guided by the separating piece (3), so that the gas in the mounting frame (11) gathers towards the space where the circuit main board (13) is arranged, and the flowing gas is discharged out of the mounting frame (11) through the guide of the heat dissipation outer frame (2);
the separating piece (3) comprises a bottom separating plate (31) and an upper separating plate (32) which is arranged obliquely above the bottom separating plate (31), wherein the bottom separating plate (31) and the upper separating plate (32) are connected through an arc-shaped guide plate (33), one ends of the bottom separating plate (31) and the upper separating plate (32) are fixed in the mounting frame (11) through connecting strips, and when a fan (14) positioned at the bottom blows air flow upwards, the upper separating plate (32) guides the air flow to the direction of the circuit main board (13);
the upper separation plate (32) is close to one side of the circuit main plate (13) and is fixedly provided with a plurality of guide inclined pipes (34), the guide inclined pipes (34) incline towards the inclined upper side far away from the circuit main plate (13), when the air flow in the installation frame (11) moves upwards, the air flow absorbs heat generated on the circuit main plate (13) and moves to the other side of the guide plate (33) through the guide inclined pipes (34), one side of the upper separation plate (32) far away from the circuit main plate (13) is symmetrically fixed with a plurality of inclined guide plates (35), the inclined guide plates (35) incline towards the inclined lower side of the left-right symmetrical position of the upper separation plate (32), air blown from the lower side is guided to the two sides of the upper separation plate (32) through the inclined guide plates (35), and air blown from the upper side to the lower side is guided through the inclined guide plates (35) and blown to the circuit main plate (13) through the inclined guide plates (34).
2. The frequency converter with heat dissipation structure according to claim 1, wherein: a convex frame (12) is arranged on one side of the circuit main board (13), the convex frame (12) is fixed on the inner side wall of the mounting frame (11), the convex frame (12) supports the circuit main board (13), a gap is reserved between the circuit main board (13) and the side wall of the mounting frame (11), and partial air flow generated by the fan (14) is conducted into the gap.
3. The frequency converter with heat dissipation structure according to claim 1, wherein: opposite two side walls and the outside of installing frame (11) are linked together, heat dissipation outer frame (2) are including setting up end frame (21) in installing frame (11) and outside intercommunication position, the circulation that the inside gas of installing frame (11) and the outside gas of installing frame (11) permeate end frame (21) to go on.
4. A transducer with heat dissipation structure as defined in claim 3, wherein: the upper half part of the end frame (21) continuously extends outwards from the middle part, a plurality of inverted V-shaped outer guide plates (23) are fixed on the outwards extending part of the end frame (21), one end of each outer guide plate (23) extends into the mounting frame (11), and gas flowing in the mounting frame (11) is guided to leave the mounting frame (11) through the guiding of each outer guide plate (23).
5. The frequency converter with heat dissipation structure as recited in claim 4, wherein: the lower half part of the end frame (21) is fixed with a plurality of upper guide plates (24) inclined towards the mounting frame (11) at the upper side, and the lower half part of the end frame (21) is fixed with a plurality of lower guide plates (25) inclined towards the inclined lower side far away from the mounting frame (11) at the lower side.
6. The frequency converter with heat dissipation structure as recited in claim 5, wherein: the upper ends of the two end frames (21) are fixedly provided with top plates (22), and the top plates (22) are arranged at the top of the mounting frame (11) and a space is reserved between the top plates and the mounting frame (11).
7. The frequency converter with heat dissipation structure according to claim 1, wherein: both fans (14) direct the air flow upwards.
8. The frequency converter with heat dissipation structure according to claim 1, wherein: both fans (14) direct the air flow towards the inside of the mounting frame (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310532042.9A CN116436371B (en) | 2023-05-11 | 2023-05-11 | Frequency converter with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310532042.9A CN116436371B (en) | 2023-05-11 | 2023-05-11 | Frequency converter with heat radiation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116436371A CN116436371A (en) | 2023-07-14 |
| CN116436371B true CN116436371B (en) | 2024-01-23 |
Family
ID=87085616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310532042.9A Active CN116436371B (en) | 2023-05-11 | 2023-05-11 | Frequency converter with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116436371B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2687771Y (en) * | 2003-10-23 | 2005-03-23 | 新巨企业股份有限公司 | Radiating structure for disfplay device |
| CN101674021A (en) * | 2009-08-28 | 2010-03-17 | 永济新时速电机电器有限责任公司 | Heat pipe type power module of high-efficient wind power frequency converter |
| CN206180826U (en) * | 2016-11-16 | 2017-05-17 | 重庆科川电气有限公司 | Controllable converter dispels heat |
| CN209982326U (en) * | 2019-08-13 | 2020-01-21 | 浙江金龙电机股份有限公司 | High-protection high-power general frequency converter |
| CN110784093A (en) * | 2019-10-26 | 2020-02-11 | 安徽海尚变频技术有限公司 | High-performance heat dissipation device for frequency converter |
| CN210898900U (en) * | 2019-11-04 | 2020-06-30 | 珠海格力电器股份有限公司 | Frequency converter and air conditioner |
| CN211481801U (en) * | 2019-12-31 | 2020-09-11 | 上海长江智能科技股份有限公司 | Computer network equipment is with storing cabinet |
| CN218483116U (en) * | 2021-08-31 | 2023-02-14 | 深圳市雷赛智能控制股份有限公司 | Heat radiation structure, driver and driving system |
| CN218941600U (en) * | 2022-08-31 | 2023-04-28 | 无锡信捷电气股份有限公司 | Heat abstractor based on servo driver |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100464278C (en) * | 2005-11-02 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Heat sink |
| US10197052B2 (en) * | 2015-05-11 | 2019-02-05 | Littelfuse, Inc. | Variable frequency drive apparatus |
-
2023
- 2023-05-11 CN CN202310532042.9A patent/CN116436371B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2687771Y (en) * | 2003-10-23 | 2005-03-23 | 新巨企业股份有限公司 | Radiating structure for disfplay device |
| CN101674021A (en) * | 2009-08-28 | 2010-03-17 | 永济新时速电机电器有限责任公司 | Heat pipe type power module of high-efficient wind power frequency converter |
| CN206180826U (en) * | 2016-11-16 | 2017-05-17 | 重庆科川电气有限公司 | Controllable converter dispels heat |
| CN209982326U (en) * | 2019-08-13 | 2020-01-21 | 浙江金龙电机股份有限公司 | High-protection high-power general frequency converter |
| CN110784093A (en) * | 2019-10-26 | 2020-02-11 | 安徽海尚变频技术有限公司 | High-performance heat dissipation device for frequency converter |
| CN210898900U (en) * | 2019-11-04 | 2020-06-30 | 珠海格力电器股份有限公司 | Frequency converter and air conditioner |
| CN211481801U (en) * | 2019-12-31 | 2020-09-11 | 上海长江智能科技股份有限公司 | Computer network equipment is with storing cabinet |
| CN218483116U (en) * | 2021-08-31 | 2023-02-14 | 深圳市雷赛智能控制股份有限公司 | Heat radiation structure, driver and driving system |
| CN218941600U (en) * | 2022-08-31 | 2023-04-28 | 无锡信捷电气股份有限公司 | Heat abstractor based on servo driver |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116436371A (en) | 2023-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3017255B1 (en) | Air conditioner | |
| CN116436371B (en) | Frequency converter with heat radiation structure | |
| CN213126970U (en) | Air-cooled heat dissipation system of VPX framework case | |
| CN1157566C (en) | Air conditioner | |
| CN116232013B (en) | Inverter and electrical equipment | |
| CN109548358A (en) | Wind circulator, heat dissipation equipment and cabinet | |
| CN213135395U (en) | Welding power supply case and welding power supply | |
| CN112423562A (en) | Frequency conversion cabinet for electric fracturing truck pump | |
| CN220798917U (en) | Frequency converter with heat dissipation function | |
| CN117569908B (en) | Diesel generating set cooling system with air pretreatment structure | |
| CN220776229U (en) | Power converter | |
| CN214507757U (en) | VVVF heat dissipation system | |
| CN116997168B (en) | Converter ventilation structure and working method thereof | |
| CN116682639B (en) | Heat radiation structure of isolation transformer | |
| CN215935431U (en) | Heat radiator and high-voltage frequency conversion device | |
| CN217846872U (en) | High-efficiency radiator | |
| CN220124567U (en) | Food processor with good heat dissipation effect | |
| CN218820689U (en) | Top air-out outdoor machine | |
| CN212850292U (en) | Precision inverter welding power supply with double cooling systems | |
| CN218274178U (en) | Perforated ventilated radiator fin for transformer | |
| CN220208075U (en) | Heat exchange structure applied to LCD projector | |
| CN220586696U (en) | 45KW chassis structure | |
| CN215421464U (en) | Photoelectric communication box with multiple heat radiation structures | |
| CN213339997U (en) | Radiator and transformer | |
| CN219995440U (en) | Air inlet and outlet structure of portable air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20231229 Address after: 518100, Building 109, Dalshan Sanlian Industrial Zone, Tangtou Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN YUANXIN ELECTRIC TECHNOLOGY CO.,LTD. Address before: 528300 Building B, 1st Floor, Building 103, Outer Ring Road, Shunde High tech Zone (Ronggui), Ronggui Huakou Neighborhood Committee, Shunde District, Foshan City, Guangdong Province Applicant before: Foshan Shunde Huitian Hardware Electric Manufacturing Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |