CN116430965A - Network sub-card module and module - Google Patents
Network sub-card module and module Download PDFInfo
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- CN116430965A CN116430965A CN202310693953.XA CN202310693953A CN116430965A CN 116430965 A CN116430965 A CN 116430965A CN 202310693953 A CN202310693953 A CN 202310693953A CN 116430965 A CN116430965 A CN 116430965A
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- 239000007787 solid Substances 0.000 claims abstract description 34
- 238000009434 installation Methods 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 6
- 238000004891 communication Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
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Abstract
The disclosure provides a network sub-card module and a module, and relates to the field of servers. The network sub-card module includes: a standard solid state memory card, a connector, an expansion daughter card, and a first connector; one port of the connector is connected with the standard solid-state memory card through a clamping connection, and the other port of the connector is connected with the expansion sub-card through a plugging connection to realize a signal connection, so that the standard solid-state memory card and the expansion sub-card are connected in a close way through the connector; the first connector is connected to one of the side surfaces of the standard solid state memory card, and the first connector is configured to extend in the thickness direction of the standard solid state memory card. The combined structure of the network sub-card module formed by the mode occupies small space and can adapt to the test requirements of different clients.
Description
Technical Field
The present disclosure relates to the field of servers, and in particular, to a network sub-card module and module.
Background
With the continuous alternation of computer technology, the functions of computer systems are increasing, the number of electronic components and storage media for realizing different system functions is also increasing, and because the space of the server casing is limited, when the test simulating the vibration state of the printed circuit board (PCB, printed Circuit Board) of the casing is performed, the existing standard solid state memory card and the expansion daughter card need to be preferentially installed on one side of the iron stand through the iron stand with larger size when being installed, and then the standard solid state memory card is installed in the internal installation space of the iron stand, namely, the standard solid state memory card cannot be directly connected with the expansion daughter card and is installed in the server casing, so that the server casing needs to reserve a larger space for installing the above-mentioned assembly structure, and the assembly structure can only adapt to a single brand of customer test and cannot adapt to a plurality of brands of customer tests.
Disclosure of Invention
The present disclosure provides a network sub-card module and a module, so as to at least solve the above technical problems existing in the prior art.
According to a first aspect of the present disclosure, there is provided a network sub-card module comprising: a standard solid state memory card, a connector, an expansion daughter card, and a first connector;
one port of the connector is connected with the standard solid-state memory card through a clamping connection, and the other port of the connector is connected with the expansion sub-card through a plugging connection to realize a signal connection, so that the standard solid-state memory card and the expansion sub-card are connected in a close way through the connector;
the first connector is connected to one of the side surfaces of the standard solid state memory card, and the first connector is configured to extend in the thickness direction of the standard solid state memory card.
In an embodiment, a first fastening portion extends from a side of the standard solid-state memory card, which is close to the expansion sub-card, and the connector is correspondingly provided with a first fastening portion that is matched and fastened with the first fastening portion.
In an embodiment, the first fastening portion is configured as one of a protrusion-like structure or a depression-like structure, and the first fastening portion is configured as the other of the protrusion-like structure or the depression-like structure.
In one embodiment, the first connector is constructed as a sheet metal structure having a first connection portion for detachable connection with the standard solid state memory card and a second connection portion for positioning installation with the chassis.
According to a second aspect of the present disclosure, there is provided a network sub-card module, including the network sub-card module described above and a positioning assembly for mounting the network sub-card module to a chassis, the positioning assembly being disposed on the chassis; at least part of the structure of the positioning assembly respectively limits the installation positions of the network sub-card module and the shell at a first position, a second position, a third position and a fourth position; the first position, the second position, the third position and the fourth position are separated from each other.
In an embodiment, the first location and the second location are located on the same side of the standard solid state memory card, the third location and the fourth location are located on the same side of the standard solid state memory card, and the first location and the third location are located on opposite sides of the standard solid state memory card, respectively;
and the first position, the second position and the third position define the mounting position of the standard solid state memory card and the shell, and the fourth position define the mounting position of the expansion sub card and the shell.
In an embodiment, the positioning assembly includes a first positioning portion, the first positioning portion is located at the first position, the first positioning portion is formed on at least part of the structure of the casing, the first positioning portion is configured to be one of a protrusion structure or a recess structure, and the second connecting portion of the first connecting member is configured to be the other of the protrusion structure or the recess structure, so that the first positioning portion is in snap connection with the second connecting portion.
In an embodiment, the positioning assembly further includes a second positioning portion, the second positioning portion is located at the second position, the second positioning portion is connected to at least part of the casing, at least part of the second positioning portion is configured as a plate structure, the position where the plate structure is attached to the casing forms a continuous bearing surface for receiving at least part of the first connector, the plate structure extends along the height direction of the standard solid-state memory card, and the plate structure and the side surface of the casing form a containing space for containing the first connector.
In an embodiment, the positioning assembly further includes a third positioning portion, the third positioning portion is located at the third position, the third positioning portion is mounted on the large surface of the casing, the third positioning portion includes a base and a first buckle mounted on the top surface of the base and capable of rotating relative to the base, and the first buckle has a clamping groove for clamping with the edge of the standard solid-state memory card.
In an embodiment, the positioning assembly further includes a fourth positioning portion, the fourth positioning portion is located at the fourth position, the fourth positioning portion is mounted on the large surface of the casing, the fourth positioning portion includes a support frame and a second fastener mounted on the top surface of the support frame and capable of rotating relative to the support frame, and the second fastener has a clamping groove for clamping with the edge of the expansion sub-card.
According to the network sub-card module and the network sub-card module, the installation space of the network sub-card module and the network sub-card module in the server can be reduced to the greatest extent through direct connection among the standard solid-state memory card, the connector and the expansion sub-card. Specifically, the first connecting piece is connected to one of them side of standard solid-state memory card, and first connecting piece is constructed to follow the thickness direction extending structure of standard solid-state memory card, so as long as use less size space for installing first connecting piece can, need not use the connecting piece of great size, and standard solid-state memory card passes through the direct joint of connector and extension sub-card, need not realize through other jumbo size mechanical structure spare, reduced the installation space on the server circuit board on the whole, and before carrying out vibration test, can alleviate the problem that the installation time is long because with the help of other mechanical structure spare leads to.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the disclosure, nor is it intended to be used to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following specification.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings, in which:
in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
FIG. 1 is a schematic diagram of a network sub-card module according to an embodiment of the present disclosure;
fig. 2 shows a second schematic structural diagram of a network sub-card module according to an embodiment of the disclosure;
FIG. 3 illustrates a third schematic diagram of a network sub-card module according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram illustrating an installation structure of a network sub-card module in a first positioning portion and a rack in the network sub-card module according to the embodiment of the disclosure;
fig. 5 is a schematic structural diagram of a second positioning portion in a network sub-card module according to an embodiment of the disclosure;
fig. 6 is a schematic diagram illustrating an installation structure of a network sub-card module in the network sub-card module according to the embodiment of the disclosure, and a third positioning portion and a fourth positioning portion, respectively;
fig. 7 is a schematic structural diagram of a third positioning portion in a network sub-card module according to an embodiment of the disclosure;
fig. 8 is a schematic structural diagram of a fourth positioning portion in a network sub-card module according to an embodiment of the disclosure.
The reference numerals in the figures illustrate:
1-a standard solid state memory card; 2-expanding the daughter card; 3-a first connector;
11-a first clamping part; a 21-connector; 22-handle; 211-a first fastening part;
31-a first connection; 32-a second connection;
41-a first positioning portion; 42-a second positioning portion; 43-a third positioning portion; 44-a fourth positioning portion;
431-base; 432-first clasp; 441-supporting frames; 442-second catch.
Detailed Description
In order to make the objects, features and advantages of the present disclosure more comprehensible, the technical solutions in the embodiments of the present disclosure will be clearly described in conjunction with the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person skilled in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.
When the test simulating the PCB vibration state of the shell is carried out, the existing applied standard solid-state memory card and the expansion sub-card are required to be installed on one side of the iron frame through the iron frame with larger size preferentially, and then the standard solid-state memory card is installed in the internal installation space of the iron frame, namely, the standard solid-state memory card cannot be directly connected with the expansion sub-card and is installed in the shell of the server, so that the shell of the server needs to reserve larger space for installing the assembly structure, and the assembly structure can only be used for adapting to the customer test of a single brand and cannot be used for adapting to the customer test of more brands.
In order to adapt to different brands of customer tests, the embodiment of the disclosure provides a network sub-card module and a network sub-card module, so as to improve the installation efficiency and vibration test efficiency of a standard solid state memory card with an extended sub-card. The specific embodiments are described with reference to the drawings.
In the existing applied terminal equipment, the server is regarded as a high-performance computer and is regarded as a node of a network, and can be used for storing and processing 80% of data and information on the network, wherein one storage medium for storing data and processing information is a standard solid-state memory card, and in actual application, the standard solid-state memory card is usually connected with an expansion sub-card through signals and is connected to a circuit board of the server so as to integrally improve the storage space of the data and the information.
Because the installation space on the circuit board in the server is limited, in order to reduce the installation space of the standard solid-state memory card and the expansion sub-card, the embodiments of the disclosure provide a network sub-card module, referring to fig. 1, 2 and 3, the network sub-card module includes a standard solid-state memory card 1, an expansion sub-card 2 detachably connected with the standard solid-state memory card 1, and a first connecting piece 3 disposed at a side installation port of the standard solid-state memory card 1, where the first connecting piece 3 is detachably connected with the standard solid-state memory card 1.
The detachable connection between the standard solid-state memory card 1 and the expansion sub card 2 in the embodiment of the disclosure can be understood as any connection mode of clamping connection, threaded connection or repeatable connection and detachment, as long as signal communication can be realized in the connection state of the two, and signal disconnection can be realized in the detachment state of the two.
The detachable connection between the first connector 3 and the standard solid state memory card 1 in the embodiments of the present disclosure may be understood as a snap connection, a threaded connection, or any connection manner in which connection and detachment can be repeatedly performed. The first connector 3 is kept connected to the standard solid state memory card 1 during the vibration test.
By adopting the network sub-card module, the installation space of the standard solid-state memory card 1 and the expansion sub-card 2 in the server can be reduced to the greatest extent through the direct connection of the two.
In this aspect, the first connector is connected to one of the side surfaces of the standard solid-state memory card, and the first connector is configured to extend in the thickness direction of the standard solid-state memory card. Therefore, as long as the smaller-sized space is used for installing the first connecting piece, the larger-sized connecting piece is not required to be used, and the standard solid-state memory card is directly clamped with the expansion sub-card through the connector and is not required to be realized through other large-sized mechanical structural parts, the installation space on the server circuit board is reduced as a whole, and the problem of long installation time caused by other mechanical structural parts can be relieved before vibration test is carried out.
With further reference to fig. 3, in combination with the application scenarios of the standard solid state memory card 1 and the expansion sub-card 2, the expansion sub-card 2 is typically in signal communication with other components through a connector 21. Illustratively, the network sub-card module of the embodiment of the present disclosure further includes a connector 21, where one port of the connector 21 is connected to the standard solid-state memory card 1 by a signal connection through a card connection, and the other port of the connector 21 is connected to the expansion sub-card 2 by a signal connection through a plug connection, so that the standard solid-state memory card 1 and the expansion sub-card 2 are connected closely through the connector 21.
The other port of the connector 21 may be signal-connected with the expansion sub-card 2 by a gold finger or a conductive sheet or wire, for example.
For example, a gold finger or a conductive sheet or a wire may be provided at a position where one of the ports of the connector 21 is to be snap-connected with the standard solid-state memory card 1.
The snap connection between one of the ports of the connector 21 and the standard solid state memory card 1 may be, for example, male-female or female-female. The concave matching mode can be understood as the clamping connection between two concave parts, namely, the two fine holes are crossed to realize the clamping connection. The network sub-card module scheme of the embodiment of the present disclosure will be further described by taking a male-female mating manner between the connector 21 and the standard solid-state memory card 1 as an example.
In some embodiments, the standard solid-state memory card 1 has a first engaging portion 11 extending from a side near the expansion sub-card 2, and the connector 21 is correspondingly provided with a first fastening portion 211 that is engaged with the first engaging portion 11 in a matching manner.
The first fastening portion 11 is a structure protruding from the standard solid-state memory card 1, and the corresponding first fastening portion 211 is a structure recessed from the connector 21. By adopting the mode, the quick installation between the standard solid-state memory card 1 and the expansion sub card 2 can be quickened, and the two parts of the structures are utilized to carry out close clamping connection, so that the structure of relatively fixed installation of the two parts can be obtained, and the small installation space can be occupied.
With further reference to fig. 1, a handle 22 is disposed above the expansion sub card 2, and the handle 22 may be made of a flexible material, so that the expansion sub card 2 can be conveniently drawn and installed through the structure of the handle 22.
The structure of the handle 22 is not limited in this application, and the handle 22 may have a sheet structure or a ring structure.
Specifically, the first engaging portion 11 is configured as one of a convex structure or a concave structure, and the first engaging portion 211 is configured as the other of a convex structure or a concave structure. That is, the first engaging portion 11 and the first engaging portion 211 are engaged with each other by a male-female engagement.
With further reference to fig. 3, the first connector 3 is constructed as a sheet metal structure having a first connector 31 for detachable connection with a standard solid state memory card 1 and a second connector 32 for positioning installation with a chassis.
The structural features and shapes of the first connecting portion 31 and the second connecting portion 32 are not limited in the present application, as long as the first connecting portion 31 can be detachably connected with at least part of the structure of the standard solid-state memory card 1, and the second connecting portion 32 can be positioned and mounted with at least part of the structure of the casing.
Illustratively, the first connection portion 31 may be configured in a sheet-like structure or a plate-like structure, and the first connection portion 31 may be detachably connected to either side of the standard solid-state memory card 1.
For example, the first connection portion 31 and the standard solid-state memory card 1 may be detachably connected by a threaded connection or a snap connection.
Illustratively, the first connecting portion 31 is provided with mounting holes therethrough, and the first connecting portion 31 is connected to the standard solid-state memory card 1 with screws or bolts that fit into the mounting holes.
The second connection portion 32 may be constructed in a sheet-like structure or a plate-like structure, and the second connection portion 32 has a recess structure that is positioned and mounted with the cabinet. This portion corresponds to the first positioning portion 41 of the casing, and the specific structure is subject to the second theme.
Based on the application scenario of the standard solid-state memory card 1 and the expansion sub card 2, the embodiment of the disclosure further provides a network sub card module, which comprises the network sub card module and a positioning component for installing the network sub card module on the casing, wherein the positioning component is arranged on the casing; at least part of the structure of the positioning assembly respectively limits the installation position of the network sub-card module and the shell in a first position, a second position, a third position and a fourth position, wherein the first position, the second position, the third position and the fourth position are separated from each other.
The specific position of the positioning component arranged on the shell is not limited, and the positioning component is only required to be matched with the installation position of the network sub-card.
Illustratively, the first location and the second location may be on the same side of the standard solid state memory card 1, the third location and the fourth location may be on the same side of the standard solid state memory card 1, and the first location and the third location may be on opposite sides of the standard solid state memory card 1, respectively. In addition, the mounting positions of the standard solid-state memory card 1 and the chassis are defined in the first position, the second position, and the third position, and the mounting positions of the expansion sub card 2 and the chassis are defined in the fourth position.
Specifically, referring to fig. 4, the positioning assembly includes a first positioning portion 41, where the first positioning portion 41 is located at a first position, the first positioning portion 41 is formed on at least a part of a structure of the casing, the first positioning portion 41 is configured as one of a convex structure or a concave structure, and correspondingly, the second connecting portion 32 of the first connecting member 3 is configured as the other of the convex structure or the concave structure, so that the first positioning portion 41 is in snap connection with the second connecting portion 32. The first positioning part 41 can be adapted to the second connecting part 32 of the first connecting piece 3 to realize positioning and clamping at the first position, so as to realize the first step of quick installation.
With further reference to fig. 5, the positioning assembly further includes a second positioning portion 42, where the second positioning portion 42 is located at a second position, the second positioning portion 42 is connected to at least part of the structure of the chassis, at least part of the structure of the second positioning portion 42 is configured as a plate structure, a joint position of the plate structure and the chassis forms a continuous bearing surface for receiving at least part of the structure of the first connector 3, the plate structure extends along a height direction of the standard solid-state memory card 1, and the plate structure and a lateral surface of the chassis form an accommodating space for accommodating the first connector 3. The second positioning part 42 can be adapted to the positioning and clamping of the first connecting piece 3 at the second position, so that the second step of quick installation is realized.
With further reference to fig. 6 and 7, the positioning assembly further includes a third positioning portion 43, where the third positioning portion 43 is located at a third position, the third positioning portion 43 is mounted on a large surface of the chassis (the large surface structure of the chassis is not shown in the drawing, and it can be understood that the large surface structure of the chassis is mounted at a position where the bottom surface of the third positioning portion 43 is located), the third positioning portion 43 includes a base 431 and a first buckle 432 mounted on the top surface of the base 431 and rotatable relative to the base 431, and the first buckle 432 has a slot for engaging with an edge of the standard solid-state memory card 1.
For example, the base 431 of the third positioning portion 43 may have a block-shaped or plate-shaped or bracket-shaped structure, and mainly plays a role in supporting and hinging the first buckle 432 mounted thereon, where the first buckle 432 may have a structure with a buckling groove capable of rotating relative to a preset hinging point on the base 431, and the first buckle 432 may be capable of being engaged with an edge of the standard solid-state memory card 1 after rotating by a preset angle.
Further, the third positioning portion 43 and the first positioning portion 41 may be disposed on opposite sides of the standard solid-state memory card 1, respectively, or the third positioning portion 43 and the first positioning portion 41 may be disposed on adjacent sides of the standard solid-state memory card 1, respectively.
The third step of quick installation is realized by adopting the structure of the third positioning part 43 to adapt to the positioning and clamping of the standard solid-state memory card 1 in the network sub-card module at the third position.
With further reference to fig. 6 and 8, the positioning assembly further includes a fourth positioning portion 44, where the fourth positioning portion 44 is located at a fourth position, the fourth positioning portion 44 is mounted on a large surface of the chassis (the large surface structure of the chassis is not shown in the drawing, it can be understood that the large surface structure of the chassis is mounted at a position where the bottom surface of the fourth positioning portion 44 is located), the fourth positioning portion 44 includes a support frame 441 and a second buckle 442 mounted on the top surface of the support frame 441 and capable of rotating relative to the support frame 441, and the second buckle 442 has a clamping groove for clamping with the edge of the expansion sub card 2.
For example, the supporting frame 441 of the fourth positioning portion 44 may adopt a block-shaped or plate-shaped or bracket-like structure, and mainly plays a role in supporting and hinging the second buckle 442 mounted thereon, where the second buckle 442 may be a structure having a buckling groove matched with the side edge of the expansion sub-card 2, and the second buckle 442 may rotate relative to a preset hinging point on the supporting frame 441, and the second buckle 442 may be engaged with the side edge of the expansion sub-card 2 after rotating by a preset angle.
The expansion sub-card 2 may be vertically installed as shown in fig. 6, or the expansion sub-card 2 may be horizontally or obliquely installed according to different installation environments. The direction of the fastening groove of the second fastener 442 is not limited in this application, as long as the fastening with the preset side of the expansion sub-card 2 can be realized.
Further, the fourth positioning portion 44 and the second positioning portion 42 may be disposed on opposite sides of the expansion sub-card 2, or the fourth positioning portion 44 and the second positioning portion 42 may be disposed on adjacent sides of the expansion sub-card 2, or the fourth positioning portion 44 and the third positioning portion 43 may be disposed on the same side of the standard solid-state memory card 1.
The fourth step of quick installation is realized by adopting the structure of the fourth positioning part 44 to adapt to the positioning and clamping of the expansion sub card 2 in the network sub card module at the fourth position.
In sum, the locating component sets up four different location portions in first position, second position, third position and fourth position respectively to correspond to the location installation of first connecting piece 3, standard solid-state memory card 1 and extension sub-card 2 respectively, reduce installation space on the whole, and can further realize the firm installation at the casing to the network sub-card module. In addition, the installation environment based on the embodiment of the disclosure is a circuit board of a server, and the corresponding positioning assembly or the structure with the auxiliary function can be preferentially made of insulating materials so as to avoid affecting the normal operation of each component on the circuit board.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps recited in the present disclosure may be performed in parallel or sequentially or in a different order, provided that the desired results of the technical solutions of the present disclosure are achieved, and are not limited herein.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the disclosure, and it is intended to cover the scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (10)
1. A network daughter card module comprising: a standard solid state memory card, a connector, an expansion daughter card, and a first connector;
one port of the connector is connected with the standard solid-state memory card through a clamping connection, and the other port of the connector is connected with the expansion sub-card through a plugging connection to realize a signal connection, so that the standard solid-state memory card and the expansion sub-card are connected in a close way through the connector;
the first connector is connected to one of the side surfaces of the standard solid state memory card, and the first connector is configured to extend in the thickness direction of the standard solid state memory card.
2. The network sub-card module of claim 1, wherein a first clamping portion extends from a side of the standard solid-state memory card, which is close to the expansion sub-card, and the connector is provided with a first buckling portion which is matched and buckled with the first clamping portion.
3. The network daughter card module of claim 2, wherein the first clip portion is configured as one of a protrusion-like structure or a depression-like structure and the first snap portion is configured as the other of a protrusion-like structure or a depression-like structure.
4. The network daughter card module of claim 1, wherein the first connector is configured as a sheet metal structure having a first connection portion for detachable connection with the standard solid state memory card and a second connection portion for positioning installation with a chassis.
5. A network sub-card module, comprising the network sub-card module according to any one of claims 1-4 and a positioning assembly for mounting the network sub-card module to a chassis, the positioning assembly being disposed on the chassis; at least part of the structure of the positioning assembly respectively limits the installation positions of the network sub-card module and the shell at a first position, a second position, a third position and a fourth position; the first position, the second position, the third position and the fourth position are separated from each other.
6. The network sub-card module of claim 5, wherein the first location and the second location are on the same side of the standard solid state memory card, the third location and the fourth location are on the same side of the standard solid state memory card, and the first location and the third location are on opposite sides of the standard solid state memory card, respectively;
and the first position, the second position and the third position define the mounting position of the standard solid state memory card and the shell, and the fourth position define the mounting position of the expansion sub card and the shell.
7. The network daughter card module of claim 6, wherein the positioning assembly comprises a first positioning portion, the first positioning portion is located at the first position, the first positioning portion is formed on at least a part of the structure of the chassis, the first positioning portion is configured as one of a convex structure or a concave structure, and the second connecting portion of the first connecting member is configured as the other of the convex structure or the concave structure, so that the first positioning portion is in snap connection with the second connecting portion.
8. The network daughter card module of claim 6, wherein the positioning assembly further comprises a second positioning portion, the second positioning portion is located at the second position, the second positioning portion is connected to at least a portion of the chassis, at least a portion of the second positioning portion is configured as a plate-shaped structure, a position where the plate-shaped structure is attached to the chassis forms a continuous bearing surface for receiving at least a portion of the first connector, the plate-shaped structure extends along a height direction of the standard solid state memory card, and the plate-shaped structure and a side surface of the chassis form a receiving space for receiving the first connector.
9. The network daughter card module of claim 6 wherein the positioning assembly further comprises a third positioning portion, the third positioning portion being positioned at the third location, the third positioning portion being mounted to the large face of the chassis, the third positioning portion comprising a base and a first fastener mounted to the top surface of the base and rotatable relative to the base, the first fastener having a slot for engaging an edge of the standard solid state memory card.
10. The network daughter card module of claim 6 wherein said positioning assembly further comprises a fourth positioning portion, said fourth positioning portion being positioned at said fourth location, said fourth positioning portion being mounted to a large surface of said housing, said fourth positioning portion comprising a support frame and a second fastener mounted to a top surface of said support frame and rotatable relative to said support frame, said second fastener having a slot for engaging an edge of said expansion daughter card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310693953.XA CN116430965B (en) | 2023-06-12 | 2023-06-12 | Network sub-card module and module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310693953.XA CN116430965B (en) | 2023-06-12 | 2023-06-12 | Network sub-card module and module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116430965A true CN116430965A (en) | 2023-07-14 |
| CN116430965B CN116430965B (en) | 2023-10-13 |
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| CN202310693953.XA Active CN116430965B (en) | 2023-06-12 | 2023-06-12 | Network sub-card module and module |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1732448A (en) * | 2002-11-13 | 2006-02-08 | 桑迪士克股份有限公司 | Universal non-volatile memory card used with various different standard cards containing a memory controller |
| US20090108060A1 (en) * | 2007-10-26 | 2009-04-30 | Simon Phillips | Method and apparatus for use in providing an identification token |
| CN101946247A (en) * | 2008-07-25 | 2011-01-12 | 富士通技术解决方案知识产权有限公司 | Data processing system |
| CN204925916U (en) * | 2015-09-21 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | Network card module |
| CN107479654A (en) * | 2017-08-16 | 2017-12-15 | 北京立华莱康平台科技有限公司 | Extend card installation device |
| CN218214010U (en) * | 2022-09-02 | 2023-01-03 | 江苏电子信息职业学院 | Computer fan interface expansion card |
-
2023
- 2023-06-12 CN CN202310693953.XA patent/CN116430965B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1732448A (en) * | 2002-11-13 | 2006-02-08 | 桑迪士克股份有限公司 | Universal non-volatile memory card used with various different standard cards containing a memory controller |
| US20090108060A1 (en) * | 2007-10-26 | 2009-04-30 | Simon Phillips | Method and apparatus for use in providing an identification token |
| CN101946247A (en) * | 2008-07-25 | 2011-01-12 | 富士通技术解决方案知识产权有限公司 | Data processing system |
| CN204925916U (en) * | 2015-09-21 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | Network card module |
| CN107479654A (en) * | 2017-08-16 | 2017-12-15 | 北京立华莱康平台科技有限公司 | Extend card installation device |
| CN218214010U (en) * | 2022-09-02 | 2023-01-03 | 江苏电子信息职业学院 | Computer fan interface expansion card |
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| Publication number | Publication date |
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| CN116430965B (en) | 2023-10-13 |
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