CN116428984A - Hardware mould stamping processing intelligent detection system - Google Patents

Hardware mould stamping processing intelligent detection system Download PDF

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Publication number
CN116428984A
CN116428984A CN202310591985.9A CN202310591985A CN116428984A CN 116428984 A CN116428984 A CN 116428984A CN 202310591985 A CN202310591985 A CN 202310591985A CN 116428984 A CN116428984 A CN 116428984A
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workpiece
offset
detection
die
detected
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Inventor
刘明
刘燕妮
綦普查
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Hunan Taomiao Industrial Co ltd
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Hunan Taomiao Industrial Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C51/00—Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/10—Die sets; Pillar guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/02—Advancing work in relation to the stroke of the die or tool
    • B21D43/18—Advancing work in relation to the stroke of the die or tool by means in pneumatic or magnetic engagement with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D55/00—Safety devices protecting the machine or the operator, specially adapted for apparatus or machines dealt with in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined

Abstract

The invention provides an intelligent detection system for stamping processing of a hardware die, which comprises a detection device, an operation host, a control device connected with a punch and a data monitoring center device. The method comprises the steps of finishing workpiece position detection, temperature detection and burr detection through control of an operation host, sending early warning prompts on a display in advance, and timely sending detection data to a data monitoring center for data tracking. The intelligent monitoring device and the intelligent monitoring method effectively improve intelligent monitoring in the stamping production process of the die in the field.

Description

Hardware mould stamping processing intelligent detection system
Technical Field
The invention relates to the field of hardware die stamping processing, in particular to an intelligent detection system for hardware die stamping processing.
Background
The stamping is a part processing method for obtaining certain size, shape and performance by applying pressure or pulling force to a plate through a die to enable the plate to be plastically formed and sometimes applying shearing force to the plate to separate the plate.
The experimental team carries out browsing and researching of a large number of related record data aiming at the related technologies of hardware die stamping processing and intelligent detection for a long time, and simultaneously relies on related resources, and carries out a large number of related experiments, and finds out the existing prior technologies such as US09205481B2, US08757056B2, JP2006212754A and CN112536376B through a large number of searches, and a photoelectric detection method for the placement position of a blank in a stamping die such as CN103100582B in the prior art comprises the following steps: a light source emitter and an infrared receiving head which are fixedly arranged above and below the boundary of the blank placing and processing position; and the control module is connected with the light source emitter and the infrared receiving head, and is used for detecting whether the boundary position is covered by the blank to be processed or not through effective perception detection of the change of the weak light signal of the light source point, so as to judge whether the blank to be processed is positioned in place or not.
The invention is made for effectively solving the problem that the work piece offset cannot be obtained through intelligent measurement in the field, and a fault prediction model is built through a data monitoring center device according to detection data, and early warning signals are sent out on a display in advance.
The foregoing discussion of the background art is intended to facilitate an understanding of the present invention only. This discussion is not an admission or admission that any of the material referred to was common general knowledge.
Disclosure of Invention
The invention aims to provide an intelligent detection system for stamping of a hardware die, aiming at the defects existing in the prior art.
In order to overcome the defects in the prior art, the invention adopts the following technical scheme:
the intelligent detection system for the stamping processing of the hardware mould comprises a detection device, an operation host, a control device connected with a punch press and a data monitoring center device;
the detection device comprises a temperature detection mechanism and a vibration detection mechanism which are arranged on the hardware mould to be detected; the position detection mechanism and the burr detection mechanism are arranged around the hardware mold to be detected; the temperature detection mechanism is used for detecting the temperature of the hardware die to be detected; the vibration detection mechanism is used for detecting the vibration amplitude of the hardware die to be detected in the machining process; the position detection mechanism is used for detecting the offset of the workpiece at the processing position before stamping the workpiece; the burr detection mechanism is used for detecting the detection burr amount generated after the workpiece is stamped;
the operation host comprises acquisition equipment connected with the detection device, a processor connected with the acquisition equipment, a display connected with the processor and wireless communication equipment connected with the processor;
the acquisition equipment acquires detection temperature, vibration amplitude, workpiece offset and detection burr amount on the detection device, and sends detection data to the processor and the wireless communication equipment;
the processor executes a program to operate the detection data so as to judge whether the hardware mould to be detected has a fault or not, and sends fault information to the wireless communication equipment;
the wireless communication equipment sends detection data and fault information to the data monitoring center device;
the data monitoring center device comprises a mould part database, a fault statistics database and a prediction processor with a built-in fault prediction model; the die part database comprises die part information such as die names, punch lengths, cutting edge cutting values and the like; the fault statistical database is connected with the wireless communication equipment to acquire fault occurrence position and fault occurrence time information; the prediction processor predicts the optimal maintenance time of the mold part in advance by inputting the obtained mold part information, failure occurrence position and failure occurrence time information into a failure prediction model, thereby obtaining a mold maintenance plan.
Optionally, the position detection mechanism includes an interval setting unit, an image capturing unit, a reference line setting unit, and an offset calculating unit; the interval setting unit is connected with a punch press of the hardware die to be detected and is used for setting the punching frequency of the punch press; the image pickup unit shoots and detects a processing position image of the workpiece before stamping according to stamping frequency and sends the processing position image to the datum line setting unit; the reference line setting unit adds and sets a virtual reference line on the processing position image to obtain a reference line auxiliary processing position image, and sends the obtained reference line auxiliary processing position image to the offset calculating unit; the offset calculating unit calculates a workpiece offset amount based on the reference line auxiliary processing position image;
the set virtual datum line comprises a first datum line and a second datum line which are positioned at the end of the processing position edge A, B in the feeding direction; a third reference line and a fourth reference line at ends of the processing position edge C, D perpendicular to the feeding direction.
Optionally, the offset calculating unit identifies and obtains an external contour line of the detected workpiece on the reference line auxiliary processing position image, and compares the external contour line of the detected workpiece with a set virtual reference line to obtain a first offset K1 of the external contour line of the detected workpiece and the first reference line, a second offset K2 of the detected workpiece and the second reference line, a third offset K3 of the detected workpiece and a fourth offset K4 of the detected workpiece and the fourth reference line.
Optionally, the operation steps of judging whether the placing position of the workpiece is wrong or not before die assembly according to the offset of the workpiece by the operation host are as follows:
step S1: the acquisition equipment is connected with the offset calculation unit and used for sending the acquired workpiece offset to the processor;
step S2: the processor compares the first offset K1, the second offset K2, the third offset K3 and the fourth offset K4 with standard offsets to obtain phase difference values Q1, Q2, Q3 and Q4, and compares the phase difference values Q1, Q2, Q3 and Q4 with a first threshold value:
if the phase difference values Q1, Q2, Q3, Q4 are all smaller than the first threshold value, the workpiece placement position before die assembly is correct, and step S3 is executed;
if one of the phase difference values Q1, Q2, Q3, Q4 is greater than a first threshold value, indicating that the workpiece placement position is wrong before die assembly at this time, and executing step S4;
step S3: the display prompts that the current detected die works well without overhauling;
step S4: the processor judges the processing position with wrong workpiece placement position before die assembly: if the phase difference value Q1 is larger than a first threshold value, indicating that the machining position edge A fails; if the phase difference value Q2 is larger than a first threshold value, indicating that the machining position edge B fails; if the phase difference value Q3 is larger than a first threshold value, indicating that the machining position edge C fails; if the phase difference value Q4 is larger than a first threshold value, indicating that the machining position edge D fails; the processor sends fault information to the wireless communication device and the display;
step S5: the display prompts that the workpiece placement position is wrong before the current die assembly and the maintenance is needed.
The beneficial effects obtained by the invention are as follows:
1. the image pickup unit, the datum line setting unit and the offset calculating unit are used for adding a set virtual datum line to the shot image and identifying an external contour line of the detected workpiece, and comparing the external contour line of the detected workpiece with the set virtual datum line to obtain the offset of the detected workpiece, so that the offset of the workpiece can be automatically judged without stopping a hardware die.
2. The workpiece offset at the processing position before stamping is monitored and obtained through the position detection mechanism, and the workpiece offset is compared with the standard offset in the processor to judge whether the workpiece is placed well before die assembly and has residues, so that the die is prevented from being damaged, and the intelligent level is improved.
3. In the stamping process, the hardware die can be subjected to continuous vibration and impact, so that die parts are worn to generate faults and defective products are generated, a fault prediction model is built according to detection data through a data monitoring center device, an early warning signal is sent out on a display in advance, and technicians are informed of timely maintaining and replacing the parts with problems so as to reduce equipment downtime and improve machining production efficiency.
4. The control of the operation host machine is used for completing the position detection, temperature detection and burr detection of the workpiece, sending early warning prompts on the display in advance, and timely sending detection data to the data monitoring center for data tracking, so that the intelligent monitoring in the automatic production process is effectively solved.
Drawings
The invention will be further understood from the following description taken in conjunction with the accompanying drawings. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the embodiments. Like reference numerals designate corresponding parts throughout the different views.
Fig. 1 is a schematic diagram of a hardware die stamping intelligent detection system according to the present invention.
Fig. 2 is a schematic diagram of the intelligent detection system for stamping processing of the hardware die.
Fig. 3 is a schematic view of a processing image of a second burr detection mechanism according to an embodiment of the present invention.
FIG. 4 is a flowchart illustrating the operation steps of the host computer according to the present invention for determining faults based on the workpiece offset.
FIG. 5 is a schematic diagram of the workflow of the present invention during periodic maintenance of the mold.
The figure illustrates 1-a detection device; 2-operating a host; 3-a data monitoring center device; 4-a production plan inputter; 5-technician port; 6-maintenance personnel ports.
Detailed Description
The technical scheme and advantages of the present invention will become more apparent, and the present invention will be further described in detail with reference to the following examples thereof; it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. Other systems, methods, and/or features of the present embodiments will be or become apparent to one with skill in the art upon examination of the following detailed description. It is intended that all such additional systems, methods, features and advantages be included within this description, be within the scope of the invention, and be protected by the accompanying claims. Additional features of the disclosed embodiments are described in, and will be apparent from, the following detailed description.
The same or similar reference numbers in the drawings of embodiments of the invention correspond to the same or similar components; in the description of the present invention, it should be understood that, if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc., based on the orientation or positional relationship shown in the drawings, this is for convenience of description and for simplification of the description, rather than to indicate or imply that the apparatus or component referred to must have a specific orientation.
Embodiment one:
the embodiment constructs an intelligent detection system for hardware die stamping processing for predicting faults in advance;
the intelligent detection system for the stamping processing of the hardware mould comprises a detection device, an operation host, a control device connected with a punch press and a data monitoring center device;
the detection device comprises a temperature detection mechanism and a vibration detection mechanism which are arranged on the hardware mould to be detected; the position detection mechanism and the burr detection mechanism are arranged around the hardware mold to be detected; the temperature detection mechanism is used for detecting the temperature of the hardware die to be detected; the vibration detection mechanism is used for detecting the vibration amplitude of the hardware die to be detected in the machining process; the position detection mechanism is used for detecting the offset of the workpiece at the processing position before stamping the workpiece; the burr detection mechanism is used for detecting the detection burr amount generated after the workpiece is stamped;
the operation host comprises acquisition equipment connected with the detection device, a processor connected with the acquisition equipment, a display connected with the processor and wireless communication equipment connected with the processor;
the acquisition equipment acquires detection temperature, vibration amplitude, workpiece offset and detection burr amount on the detection device, and sends detection data to the processor and the wireless communication equipment;
the processor executes a program to operate the detection data so as to judge whether the hardware mould to be detected has a fault or not, and sends fault information to the wireless communication equipment;
the wireless communication equipment sends detection data and fault information to the data monitoring center device;
the data monitoring center device comprises a mould part database, a fault statistics database and a prediction processor with a built-in fault prediction model; the die part database comprises die part information such as die names, punch lengths, cutting edge cutting values and the like; the fault statistical database is connected with the wireless communication equipment to acquire fault occurrence position and fault occurrence time information; the prediction processor predicts the optimal maintenance time of the mold part in advance by inputting the obtained mold part information, failure occurrence position and failure occurrence time information into a failure prediction model, thereby obtaining a mold maintenance plan.
The position detection mechanism comprises an interval setting unit, an imaging unit, a datum line setting unit and an offset calculating unit; the interval setting unit is connected with a punch press of the hardware die to be detected and is used for setting the punching frequency of the punch press; the image pickup unit shoots and detects a processing position image of the workpiece before stamping according to stamping frequency and sends the processing position image to the datum line setting unit; the reference line setting unit adds and sets a virtual reference line on the processing position image to obtain a reference line auxiliary processing position image, and sends the obtained reference line auxiliary processing position image to the offset calculating unit; the offset calculating unit calculates a workpiece offset amount based on the reference line auxiliary processing position image;
the set virtual datum line comprises a first datum line and a second datum line which are positioned at the end of the processing position edge A, B in the feeding direction; a third reference line and a fourth reference line at ends of the processing position edge C, D perpendicular to the feeding direction.
The offset calculating unit identifies and obtains an external contour line of the detected workpiece on the datum line auxiliary processing position image, and compares the external contour line of the detected workpiece with a set virtual datum line to obtain a first offset K1 of the external contour line of the detected workpiece and the first datum line, a second offset K2 of the detected workpiece and the second datum line, a third offset K3 of the detected workpiece and a fourth offset K4 of the detected workpiece and the fourth datum line.
The algorithm of the offset calculating unit for identifying and obtaining the external contour line function V (x, y) of the detected workpiece on the datum line auxiliary processing position image is as follows:
fitting the external contour of the workpiece to a simulated closed contour curve: v (S) =a (x (S), y (S)), where S is a variation factor related to the abscissa x, the ordinate y on the simulated closed contour curve; the change factor function E (S) of the external contour line of the workpiece is minimized by finding a continuous closed curve, so that the found curve is closest to the actual contour of the workpiece:
Figure BDA0004245810720000061
wherein E is 1 Is the energy coefficient, V s ' s is the first derivative of the profile curve function, V s "s" is the second derivative of the profile curve function, α(s), β(s) are the first and second functions affecting the internal energy coefficient variation, and are passed by the skilled person in the artThe limited experiments can obtain that the convergence function of the closed contour curve is the external contour function V (x, y) of the detection workpiece by calculating the minimum value of E (S);
the operation steps of judging whether the placing position of the workpiece is wrong or not before die assembly according to the offset of the workpiece by the operation host are as follows:
step S1: the acquisition equipment is connected with the offset calculation unit and used for sending the acquired workpiece offset to the processor;
step S2: the processor compares the first offset K1, the second offset K2, the third offset K3 and the fourth offset K4 with standard offsets to obtain phase difference values Q1, Q2, Q3 and Q4, and compares the phase difference values Q1, Q2, Q3 and Q4 with a first threshold value:
if the phase difference values Q1, Q2, Q3, Q4 are all smaller than the first threshold value, the workpiece placement position before die assembly is correct, and step S3 is executed;
if one of the phase difference values Q1, Q2, Q3, Q4 is greater than a first threshold value, indicating that the workpiece placement position is wrong before die assembly at this time, and executing step S4;
step S3: the display prompts that the current detected die works well without overhauling;
step S4: the processor judges the processing position with wrong workpiece placement position before die assembly: if the phase difference value Q1 is larger than a first threshold value, indicating that the machining position edge A fails; if the phase difference value Q2 is larger than a first threshold value, indicating that the machining position edge B fails; if the phase difference value Q3 is larger than a first threshold value, indicating that the machining position edge C fails; if the phase difference value Q4 is larger than a first threshold value, indicating that the machining position edge D fails; the processor sends fault information to the wireless communication device and the display;
step S5: the display prompts that the workpiece placement position is wrong before the current die assembly and the maintenance is needed.
Embodiment two:
in addition to the inclusion of the above embodiments, in connection with fig. 1-5, the following are:
the burr detection mechanism comprises a light-emitting unit for emitting infrared light, a photoelectric switch connected with the light-emitting unit for controlling the light-emitting unit to be turned on, a light sensor for receiving the light emitted by the light-emitting unit and generating a workpiece reflection image, a storage unit for storing a workpiece standard outline map, and a burr detection processing unit connected with the light sensor and the storage unit;
the burr detection processing unit comprises a binarization computing circuit, a difference computing circuit, an area computing circuit and a burr judging circuit;
the binarization calculation circuit carries out binarization processing on the workpiece reflection image, and a workpiece real outline image is obtained from the black-white clear gray level image;
the formula used for binarization processing:
Figure BDA0004245810720000071
where x represents the pixel value of the reflected image of the workpiece and y represents the pixel value of the true contour map of the workpiece.
The difference calculation circuit is used for obtaining a burr contour area diagram by differentiating the real contour diagram of the workpiece and the standard contour diagram of the workpiece; the area calculating circuit is connected with the differential calculating circuit and calculates the area of the burr outline area according to the burr outline area diagram;
the burr judging circuit is connected with the area calculating circuit and compares the area of the burr outline area with a preset threshold area: if the area of the burr contour area is larger than the threshold area, the current workpiece is unqualified; and if the area of the burr contour area is smaller than the threshold area, the current workpiece is qualified.
Embodiment III:
in addition to the inclusion of the above embodiments, in connection with fig. 1-5, the following are:
the intelligent detection system for the stamping processing of the hardware mould comprises a detection device, a maintenance feedback device, an operation host, a control device connected with a punch press and a data monitoring center device;
the maintenance feedback device comprises an input unit for inputting maintenance information and a video recording unit for shooting images of a maintenance process;
the processor executes a program to operate the detection data so as to judge whether the hardware mould to be detected has a fault or not, and sends fault information to the wireless communication equipment;
the acquisition equipment is connected with the maintenance feedback device and the detection device and transmits detection data, maintenance information and maintenance process to the wireless communication equipment;
the data monitoring center device establishes a fault prediction model according to the detection data, integrates and sends maintenance information and photographed maintenance process images to a port of a design department, the design department summarizes the faults of the die, and can grasp the complete life flow of the die to be tested in the next die change.
The data monitoring center device comprises a production plan input device, a mould part database, a fault statistics database and a prediction processor; the production plan inputter inputs the monthly planned production quantity by a production planner; the die part database comprises die names, punch lengths and stamping times of parts easy to wear; the fault statistical database is connected with the wireless communication equipment to acquire fault occurrence position and fault occurrence time information; the prediction processor obtains a die maintenance plan by inputting the obtained monthly planned production quantity, the stamping times of the parts easy to wear, the fault occurrence position and the fault occurrence time information into a fault prediction model.
The mold maintenance schedule includes a machining schedule for easily worn parts by the machining section, an inspection schedule for periodically inspecting the qualification rate of machined workpieces, and a maintenance schedule for replacing easily worn parts.
The workflow for the regular maintenance of the mold is as follows:
step S21: a production planning person inputs the monthly planned production quantity in the production planning input device;
step S22: the prediction processor obtains a die maintenance plan by inputting the obtained monthly plan production quantity, the stamping times of the parts easy to wear, the fault occurrence position and the fault occurrence time information into a fault prediction model;
step S23: the prediction processor sends a machining plan to a machining part and notifies the machining of the parts easy to wear in a set period;
step S24: the prediction processor sends an inspection plan to a technician port, and notifies a technician to input a maintenance starting instruction on the input unit during setting so as to control a control device to stop the punching machine tool; checking whether a workpiece passes or not before stopping the punching machine on site;
step S25: the prediction processor sends a maintenance plan to a port of a maintainer, the maintainer obtains a die name, a punch length and stamping times of the easily-worn part from the die part database, checks whether the current using times of the easily-worn part exceed the expected stamping times, and timely replaces the worn part;
the invention adds the set virtual datum line to the shot picture and identifies the outline of the detected workpiece through the shooting unit, the datum line setting unit and the offset calculating unit, and compares the external outline of the detected workpiece with the set virtual datum line to obtain the offset of the detected workpiece, so that the offset of the workpiece can be automatically judged without stopping a hardware die. And the workpiece offset at the processing position before stamping is monitored and obtained through the position detection mechanism, and the workpiece offset is compared with the standard offset in the processor to judge whether the workpiece is placed well before die assembly and has residues, so that the die is prevented from being damaged, and the intelligent level is improved. And a fault prediction model is established according to the detection data through the data monitoring center device, an early warning signal is sent out on a display in advance, and technicians are informed of timely maintaining and replacing parts with problems so as to reduce equipment downtime and improve processing production efficiency. The method comprises the steps of finishing workpiece position detection, temperature detection and burr detection through control of an operation host, sending early warning prompts on a display in advance, and timely sending detection data to a data monitoring center for data tracking. The intelligent monitoring device and the intelligent monitoring method effectively improve intelligent monitoring in the stamping production process of the die in the field.
While the invention has been described above with reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the invention. That is, the methods, systems and devices discussed above are examples. Various configurations may omit, replace, or add various procedures or components as appropriate. For example, in alternative configurations, the methods may be performed in a different order than described, and/or various components may be added, omitted, and/or combined. Moreover, features described with respect to certain configurations may be combined in various other configurations, such as different aspects and elements of the configurations may be combined in a similar manner. Furthermore, as the technology evolves, elements therein may be updated, i.e., many of the elements are examples, and do not limit the scope of the disclosure or the claims.
Specific details are given in the description to provide a thorough understanding of exemplary configurations involving implementations. However, the configuration may be practiced without these specific details, e.g., well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail in order to avoid obscuring the configuration. This description provides only an example configuration and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configuration will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes may be made in the function and arrangement of elements without departing from the spirit or scope of the disclosure.
It is intended that the foregoing detailed description be regarded as illustrative rather than limiting, and that it be understood that it is intended that it be regarded as illustrative rather than limiting. Various changes and modifications to the present invention may be made by one skilled in the art after reading the teachings herein, and such equivalent changes and modifications are intended to fall within the scope of the invention as defined in the appended claims.

Claims (4)

1. The intelligent detection system for the stamping processing of the hardware mould is characterized by comprising a detection device, an operation host, a control device connected with a punch and a data monitoring center device;
the detection device comprises a temperature detection mechanism and a vibration detection mechanism which are arranged on the hardware mould to be detected; the position detection mechanism and the burr detection mechanism are arranged around the hardware mold to be detected; the temperature detection mechanism is used for detecting the temperature of the hardware die to be detected; the vibration detection mechanism is used for detecting the vibration amplitude of the hardware die to be detected in the machining process; the position detection mechanism is used for detecting the offset of the workpiece at the processing position before stamping the workpiece; the burr detection mechanism is used for detecting the detection burr amount generated after the workpiece is stamped;
the operation host comprises acquisition equipment connected with the detection device, a processor connected with the acquisition equipment, a display connected with the processor and wireless communication equipment connected with the processor;
the acquisition equipment acquires detection temperature, vibration amplitude, workpiece offset and detection burr amount on the detection device, and sends detection data to the processor and the wireless communication equipment;
the processor calculates the detection data to judge whether the hardware mould to be detected has a fault or not, and sends fault information to the wireless communication equipment;
the wireless communication equipment sends detection data and fault information to the data monitoring center device;
the data monitoring center device comprises a mould part database, a fault statistics database and a prediction processor with a built-in fault prediction model; the die part database comprises die part information of die names, punch lengths and cutting edge cutting values; the fault statistical database is connected with the wireless communication equipment to acquire fault occurrence position and fault occurrence time information; the prediction processor predicts the optimal maintenance time of the mold part in advance by inputting the obtained mold part information, failure occurrence position and failure occurrence time information into a failure prediction model, thereby obtaining a mold maintenance plan.
2. The intelligent detection system for stamping processing of a hardware die according to claim 1, wherein the position detection mechanism comprises an interval setting unit, an image capturing unit, a datum line setting unit and an offset calculating unit; the interval setting unit is connected with a punch press of the hardware die to be detected and is used for setting the punching frequency of the punch press; the image pickup unit shoots and detects a processing position image of the workpiece before stamping according to stamping frequency and sends the processing position image to the datum line setting unit; the reference line setting unit adds and sets a virtual reference line on the processing position image to obtain a reference line auxiliary processing position image, and sends the obtained reference line auxiliary processing position image to the offset calculating unit; the offset calculating unit calculates a workpiece offset amount based on the reference line auxiliary processing position image;
the set virtual datum line comprises a first datum line and a second datum line which are positioned at the end of the processing position edge A, B in the feeding direction; a third reference line and a fourth reference line at ends of the processing position edge C, D perpendicular to the feeding direction.
3. The intelligent detection system for press working of a metal mold according to claim 2, wherein the offset calculating unit recognizes an outer contour line of the detected workpiece on the reference line auxiliary working position image, and compares the outer contour line of the detected workpiece with a set virtual reference line to obtain a first offset K1 of the outer contour line of the detected workpiece from the first reference line, a second offset K2 of the detected workpiece from the second reference line, a third offset K3 of the third reference line, and a fourth offset K4 of the fourth reference line.
4. The intelligent detection system for stamping processing of a hardware die according to claim 3, wherein the operation step of the operation host machine for judging whether the placing position of the workpiece is wrong before die assembly according to the offset of the workpiece is as follows:
step S1: the acquisition equipment is connected with the offset calculation unit and used for sending the acquired workpiece offset to the processor;
step S2: the processor compares the first offset K1, the second offset K2, the third offset K3 and the fourth offset K4 with standard offsets to obtain phase difference values Q1, Q2, Q3 and Q4, and compares the phase difference values Q1, Q2, Q3 and Q4 with a first threshold value:
if the phase difference values Q1, Q2, Q3, Q4 are all smaller than the first threshold value, the workpiece placement position before die assembly is correct, and step S3 is executed;
if one of the phase difference values Q1, Q2, Q3, Q4 is greater than a first threshold value, indicating that the workpiece placement position is wrong before die assembly at this time, and executing step S4;
step S3: the display prompts that the current detected die works well without overhauling;
step S4: the processor judges the processing position with wrong workpiece placement position before die assembly: if the phase difference value Q1 is larger than a first threshold value, indicating that the machining position edge A fails; if the phase difference value Q2 is larger than a first threshold value, indicating that the machining position edge B fails; if the phase difference value Q3 is larger than a first threshold value, indicating that the machining position edge C fails; if the phase difference value Q4 is larger than a first threshold value, indicating that the machining position edge D fails; the processor sends fault information to the wireless communication device and the display;
step S5: the display prompts that the workpiece placement position is wrong before the current die assembly and the maintenance is needed.
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