CN116419611A - Display panel and electronic equipment - Google Patents

Display panel and electronic equipment Download PDF

Info

Publication number
CN116419611A
CN116419611A CN202310405123.2A CN202310405123A CN116419611A CN 116419611 A CN116419611 A CN 116419611A CN 202310405123 A CN202310405123 A CN 202310405123A CN 116419611 A CN116419611 A CN 116419611A
Authority
CN
China
Prior art keywords
layer
area
blocking
display panel
isolation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310405123.2A
Other languages
Chinese (zh)
Inventor
胡红刚
肖志慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Hefei Visionox Technology Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Hefei Visionox Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Govisionox Optoelectronics Co Ltd, Hefei Visionox Technology Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Priority to CN202310405123.2A priority Critical patent/CN116419611A/en
Publication of CN116419611A publication Critical patent/CN116419611A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The embodiment of the application provides a display panel and electronic equipment, relates to the technical field of display. The display panel is provided with a display area, an opening area, an isolation area and a blocking area, wherein the isolation area and the blocking area are arranged between the display area and the opening area, and the blocking area is used for blocking corrosive ions penetrating into the display panel through the opening area. In the display panel structure, the blocking area is arranged between the isolation area and the open area, so that corrosive ions invaded from the open area in the high-temperature high-humidity reliability test can be prevented from entering the isolation area and the display area, the situation that the films in the isolation area and the display area are stripped to form gaps capable of being invaded by water vapor due to the action of the corrosive ions is avoided, the situation that the water vapor cannot invade the display area to cause black spots in the high-temperature high-humidity reliability test is ensured, and the yield of the display panel in the high-temperature high-humidity reliability test is improved.

Description

Display panel and electronic equipment
Technical Field
The application relates to the technical field of display, in particular to a display panel and electronic equipment.
Background
At present, OLED display panels are increasingly applied to consumer electronic products such as smart phones and tablet computers, and in order to realize a full screen, optical sensors such as cameras and distance sensors are generally arranged under the screen. For this purpose, the display panel is cut during the manufacturing process to form an open area for receiving and assembling the sensor.
In order to ensure the stability of the display panel function, a more severe environment is generally simulated before the display panel leaves the factory than in actual use to perform high-temperature and high-humidity reliability test on the display panel. In the high-temperature high-humidity reliability, the display panel has poor black spots, which results in low yield in the high-temperature high-humidity reliability test, so how to avoid the poor black spots of the display panel in the high-temperature high-humidity reliability test is a technical problem which needs to be solved by the technicians in the field.
Disclosure of Invention
In order to overcome the technical problems mentioned in the background, embodiments of the present application provide a display panel and an electronic device.
In a first aspect of the present application, a display panel is provided, the display panel having a display region, an opening region, an isolation region, and a barrier region;
the isolation area and the blocking area are positioned between the display area and the open pore area, the isolation area is arranged close to the display area, and the blocking area is arranged close to the open pore area;
the blocking region is used for blocking ions penetrating into the display panel through the opening region.
In the structure, the blocking area is arranged between the isolation area and the open hole area, so that corrosive ions invaded from the open hole area in the high-temperature high-humidity reliability test can be prevented from entering the isolation area and the display area, the situation that water vapor invades a gap is formed due to the fact that film peeling (peeling) occurs due to the fact that film layers in the isolation area and the display area are acted by the corrosive ions is avoided, the fact that the water vapor cannot invade the display area in the high-temperature high-humidity reliability test is guaranteed, black spot defect is avoided, and the yield of the display panel in the high-temperature high-humidity reliability test is improved.
In one possible embodiment of the present application, the display panel includes a substrate, an inorganic film layer, and a metal film layer, the inorganic film layer and the metal film layer being located on the substrate;
the blocking region is used for blocking ions corrosive to the inorganic film layer and the metal film layer.
In one possible embodiment of the present application, the orthographic projections of the inorganic film layer and the metal film layer on the substrate do not overlap with the blocking region.
In one possible embodiment of the application, a plurality of isolation columns surrounding the open hole area are arranged on the substrate, and an inorganic filling layer is arranged between every two adjacent isolation columns, wherein the isolation columns are made of at least part of metal layers in the metal film layers, and the inorganic filling layer is made of at least part of film layers in the inorganic film layers;
preferably, the width of the blocking area is 2 times of the width of the isolation column in the direction that the opening area points to the display area;
preferably, the number of the isolation columns is 6-7.
In one possible embodiment of the present application, the display panel further comprises an ion blocking layer on the substrate;
the orthographic projection of the ion blocking layer on the substrate is at least positioned in the blocking area;
preferably, the ion blocking layer is an insulating layer.
In one possible embodiment of the present application, the ion blocking layer includes an organic material layer filled in the blocking region.
In one possible embodiment of the present application, the display panel further includes an array driving layer, and the metal film layer includes a metal layer in the array driving layer;
the array driving layer is positioned on the substrate, and the orthographic projection of the metal layer in the array driving layer on the substrate is not overlapped with the blocking area.
In one possible embodiment of the present application, the display panel further includes a pixel device layer located on a side of the array driving layer away from the substrate, and the metal film layer includes a pixel anode and a pixel cathode layer in the pixel device layer;
the pixel anodes are distributed in an array in the display area;
the orthographic projection of the cathode layer on the substrate does not overlap with the blocking area.
In one possible embodiment of the present application, the display panel further includes a thin film encapsulation layer located on a side of the pixel device layer away from the substrate, the inorganic film layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer in the thin film encapsulation layer, and the ion blocking layer includes an organic material encapsulation layer in the thin film encapsulation layer and/or an organic material layer in the pixel device layer;
the orthographic projection of the first inorganic packaging layer and the second inorganic packaging layer on the substrate is positioned in the display area and the isolation area, and the organic material packaging layer is positioned between the first inorganic packaging layer and the second inorganic packaging layer in the display area and the isolation area;
and the organic material packaging layer and/or the orthographic projection of the organic material layer on the substrate are positioned in the display area, the isolation area and the blocking area.
In a second aspect of the present application, there is provided an electronic device comprising a display panel according to any one of the possible embodiments of the first aspect.
The display panel and the electronic device provided by the embodiment of the application are provided with a display area, an opening area, an isolation area and a blocking area, wherein the isolation area and the blocking area are arranged between the display area and the opening area, and the blocking area is used for blocking corrosive ions which invade the display panel through the opening area. In the display panel structure, the blocking area is arranged between the isolation area and the open area, so that corrosive ions which invade from the open area in the high-temperature high-humidity reliability test can be prevented from entering the isolation area and the display area, the situation that a gap which can be invaded by water vapor is formed due to the fact that film layers in the isolation area and the display area are stripped (peeling) due to the action of the corrosive ions is avoided, the situation that the water vapor cannot invade the display area to cause black spot defect in the high-temperature high-humidity reliability test is ensured, and the yield of the display panel in the high-temperature high-humidity reliability test is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 illustrates a regional distribution diagram of a prior art display panel;
FIG. 2 illustrates a schematic diagram of a portion of the film structure of the isolation region of FIG. 1;
fig. 3 illustrates a regional distribution diagram of a display panel provided by the present embodiment;
FIG. 4 illustrates one of the partial film structures of the isolation region and the barrier region of FIG. 3;
FIG. 5 illustrates a schematic diagram of the structural distribution of the isolation and barrier regions as in FIG. 3;
FIG. 6 illustrates a second exemplary partial film structure of the isolation region and the barrier region of FIG. 3;
FIG. 7 illustrates a third exemplary partial film structure of the isolation and barrier regions of FIG. 3;
FIG. 8 is a schematic diagram illustrating the display panel of FIG. 2 compared with the display panel of FIG. 7 for high temperature and high humidity reliability test and electrostatic discharge test.
Icon: 10-a display panel; 10A-display area; 10B-an open area; 10C-isolation region; 10D-blocking region; 110-a substrate; 120-an organic material layer; 130-an electrode layer; 140-a thin film encapsulation layer; 1401-a first inorganic encapsulation layer; 1402-a second inorganic encapsulation layer; 1403—an organic material encapsulation layer; 200-isolating columns; 300-electron blocking layer; 400-inorganic filler layer.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put when the product of the application is used, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
It should be noted that, in the case of no conflict, different features in the embodiments of the present application may be combined with each other.
The inventors have found that, after performing a disassembly analysis of a display panel with poor black spots, one of the main causes of the poor black spots is intrusion of moisture into the display region, for example, through a gap between an inorganic encapsulation layer in a thin film encapsulation layer and an adjacent film layer. The analysis of the film structure of the inorganic encapsulation layer at the position where the gap exists shows that the inorganic encapsulation layer at the position has the condition of film expansion.
The reason for the expansion of the film layer of the inorganic encapsulation layer of the isolation region will be described with reference to the accompanying drawings, and fig. 1 illustrates a regional distribution diagram of a conventional display panel. The display panel 10 includes a display region 10A, an opening region 10B, and an isolation region 10C therebetween. In order to block water vapor from entering the display area 10A through the isolation area 10C, in the isolation area 10C, isolation columns having a certain height may be provided in the isolation area 10C, and the isolation columns are made of materials (for example, metal materials and inorganic materials) capable of isolating water vapor.
As shown in fig. 2, the isolation region 10C may further include an organic material layer 120, an electrode layer 130, and a thin film encapsulation layer 140, the organic material layer 120 may be formed when the organic light emitting material layer in the display region 10A is fabricated, the organic material layer 120 is distributed in the isolation region 10C in an array, the organic material layer 120 may be partially located on the isolation pillars 200 or partially located in a region outside the isolation pillars 200, the electrode layer 130 is electrically connected to the isolation pillars 200 of the isolation region, and the electrode layer 130 may be a cathode layer. The thin film encapsulation layer 140 covers the organic material layer 120, the electrode layer 130, and the isolation pillars 200.
The inventors have further studied and found that, in the high temperature and high humidity reliability test, positive ions (for example, potassium+ ions) in the polarizer migrate, penetrate into the isolation region 10C from the cut wall of the open region, metal ions corrode the inorganic material layer (for example, the inorganic encapsulation layer in the thin film encapsulation layer 140) in the isolation region 10C, causing the inorganic encapsulation layer to swell, and the inorganic encapsulation layer and its adjacent film layer form a gap allowing water vapor intrusion, which may extend from the isolation region 10C to the display region 10A, thereby causing black speck defect. It will be appreciated that the above analysis is only performed with respect to the display of black specks caused by corrosion of the inorganic encapsulation layer, which may also be formed during actual testing by corrosion of other film layers, such as the electrode layer 130.
In order to solve the above-mentioned problems, the inventor innovatively devised the following technical solutions, and a detailed description of specific embodiments of the present application will be given below with reference to the accompanying drawings. It should be noted that the above solutions in the prior art all have drawbacks that the inventors have obtained after they have practiced and studied carefully, and thus the discovery process of the above technical problem and the solutions presented in the following embodiments for the above problem should be all contributions of the inventors to the present application during the inventive process, and should not be construed as what is known to those skilled in the art.
Referring to fig. 3, fig. 3 illustrates a schematic area distribution diagram of a display panel according to the present embodiment. In the present embodiment, the display panel 10 includes a display region 10A, an opening region 10B, an isolation region 10C, and a barrier region 10D. The isolation region 10C and the blocking region 10D are located between the display region 10A and the opening region 10B, the isolation region 10C being disposed adjacent to the display region 10A, and the blocking region 10D being disposed adjacent to the opening region 10B. In other words, the blocking region 10D is located between the opening region 10B and the isolation region 10C, and the isolation region 10C is located between the blocking region 10D and the display region 10A. For example, when the opening region 10B is circular, the blocking region 10D may be a circular ring region located outside the opening region 10B, and the isolation region 10C may be a circular ring region located outside the blocking region 10D.
In the present embodiment, the blocking region 10D is used to block ions that invade the display panel 10 through the opening region 10B, wherein the ions are corrosive to the film layer in the display panel 10.
In the above structure, by providing the blocking region 10D between the isolation region 10C and the opening region 10B, corrosive ions entering from the opening region 10B into the isolation region 10C in the high-temperature high-humidity reliability test can be prevented, so that the film in the isolation region 10C is prevented from being peeled off by the corrosive ions to form a gap allowing water vapor to enter, the defect of black spots caused by the intrusion of water vapor into the display region 10A in the high-temperature high-humidity reliability test is ensured, and the yield of the display panel 10 in the high-temperature high-humidity reliability test is improved.
The inventors have found that in high temperature and high humidity reliability tests, the polarizer mainly releases positive ions (e.g., potassium ions) and negative ions (e.g., iodine ions and sulfur ions), wherein the positive ions corrode the inorganic film layer (e.g., the inorganic encapsulation layer in the thin film encapsulation layer), and the negative ions corrode the metal film layer (e.g., the cathode layer). The released ions invade the display panel 10 from the cut wall of the opening area 10B, and in order to avoid the corrosive effect of the ions on the film layer in the display panel 10, the present embodiment designs the film layer structure as follows.
In the display panel 10, the display panel 10 includes a substrate 110, an inorganic film layer, and a metal film layer, wherein the inorganic film layer and the metal film layer are disposed on the substrate 110. The blocking region 10D serves to block ions having corrosive effects on the inorganic film layer and the metal film layer in the display panel 10. It should be understood that the inorganic film layer herein is a generic term for a part or all of the inorganic film layer of the display panel 10, and the metal film layer is also a generic term for a part or all of the metal film layer of the display panel 10.
Further, in order to avoid the inorganic film layer and the metal film layer from being corroded, the inorganic film layer and the metal film layer may be disposed in a region other than the blocking region 10D, in other words, the orthographic projection of the inorganic film layer and the metal film layer on the substrate 110 does not overlap with the blocking region. In the above design, on one hand, since the metal film layer is not located at the position of the cutting wall of the opening area 10B, static electricity cannot enter the display panel 10 from the cutting wall, so that the antistatic capability of the opening area 10B can be improved; on the other hand, the film design can reduce the complexity of the film structure at the position where the holes are required (no metal film or inorganic film exists), and when the display panel 10 is perforated, adverse phenomena such as cracks are not easy to occur, so that the manufacturing yield of the display panel is improved.
Referring to fig. 4, in order to achieve the blocking effect of the blocking region 10D, the blocking effect of corrosive ions may be achieved by disposing the ion blocking layer 300 in the blocking region 10D, and the ion blocking layer 300 is illustratively located at least in the blocking region 10D, in other words, the orthographic projection of the ion blocking layer 300 on the substrate 110 is located at least in the blocking region 10D. In this embodiment, the ion blocking layer 300 may be manufactured by using an existing film layer in the existing display panel structure, or may be manufactured by using another newly added film layer. In order to save manufacturing costs, it is generally necessary to keep the manufacturing process unchanged, and for this reason, in the present embodiment, the ion blocking layer 300 is preferably manufactured by using an existing film layer in an existing display panel structure.
In this embodiment, to avoid the ion blocking layer 300 conducting static electricity, the ion blocking layer 300 may be an insulating layer.
The inventors have found, in combination with the previous analysis of the functional requirements of the ion blocking layer 300, that the ion blocking layer 300 may be made of an organic material layer existing in the display panel 10, and specifically, the ion blocking layer 300 may include an organic material layer filled in the blocking region 10D.
Referring to fig. 5, fig. 5 illustrates a schematic film distribution diagram of a barrier region 10D and an isolation region 10C provided in this embodiment, the isolation region 10C may have a plurality of isolation pillars 200 surrounding an opening region 10B, and the isolation pillars 200 are located on a substrate 110, wherein the isolation pillars 200 are different due to different shapes of the opening region 10B, for example, as shown in fig. 2, when the opening region 10B is circular, the isolation pillars 200 are circular. An inorganic filling layer 400 may be disposed between adjacent isolation columns 200, wherein the isolation columns 200 may be made of at least a portion of metal layers among the metal film layers, and the inorganic filling layer 400 may be made of at least a portion of the inorganic film layers.
In the present embodiment, in the direction in which the opening area 10D points to the display area 10A, the width of the barrier area 10D is 2 times the width of the isolation column 200.
In general, in the prior art, the number of the isolation columns 10C shown in fig. 2 is generally 8-9, in this embodiment, the isolation columns 200 in the position of the isolation regions 10C near the opening region 10B in fig. 2 may be removed, the region from which the isolation columns 200 are removed is taken as the blocking region 10D, and the ion blocking layer 300 is disposed in the position region, which is understood that the area occupied by the blocking region 10D and the isolation region 10C in the present embodiment may be the same as the area occupied by the isolation region 10C in the display panel 10 in fig. 2, and the number of the isolation columns 200 surrounding the opening region 10B is 6-7.
The distribution of each film in different areas will be described below with reference to a specific film structure of the display panel.
The display panel 10 further includes an array driving layer disposed on the substrate, wherein the metal film layer in the embodiment includes metal layers (e.g., the first metal layer M1, the second metal layer M2, and the third metal layer M3) in the array driving layer. The orthographic projection of the metal layer in the array driver layer on the substrate does not overlap with the blocking region 10D. The planarization layer in the array driver layer may extend to the blocking region 10D for forming the ion blocking layer 300 or forming a part of the ion blocking layer 300.
Further, the display panel 10 further includes a pixel device layer located on a side of the array driving layer away from the substrate, and the metal film layer in this embodiment may further include pixel anodes and cathode layers in the pixel device layer, where the pixel anodes are distributed in an array in the display area 10A, and the orthographic projection of the cathode layer on the substrate does not overlap with the barrier area. Illustratively, as shown in fig. 6, the organic material layer 120 in the pixel device layer may be used to form the ion blocking layer 300 or form a portion of the ion blocking layer 300.
Further, referring to fig. 7, the display panel 10 further includes a thin film encapsulation layer 140 located on a side of the pixel device layer away from the substrate, wherein the inorganic film layers in this embodiment include a first inorganic encapsulation layer 1401 and a second inorganic encapsulation layer 1402 in the thin film encapsulation layer 140, and the ion blocking layer 300 includes an organic material encapsulation layer 1403 in the thin film encapsulation layer 140. The front projection of the first and second inorganic encapsulation layers 1401 and 1402 on the substrate 110 is located in the display region 10A and the isolation region 10C, and the organic material encapsulation layer 1403 is located between the first and second inorganic encapsulation layers 1401 and 1402 in the display region 10B and the isolation region 10C.
The front projection of the organic material encapsulation layer 1403 on the substrate 110 is located in the display region 10A, the isolation region 10C and the barrier region 10D. The organic material encapsulation layer 1403 is used to form the ion barrier layer 300 or to form a portion of the ion barrier layer 300. In this embodiment, the organic material encapsulation layer 1403 may be manufactured by an Ink Jet Printing (IJP) method. Illustratively, the ion blocking layer 300 may be formed of the organic material layer 120 and the organic material encapsulation layer 1403.
The inventors found that, by using the display panel provided in this embodiment (the display panel in fig. 7) and the display panel in the prior art (the display panel in fig. 3) to perform the high-temperature high-humidity reliability test and the electrostatic discharge test, referring to fig. 8, the number of black spot defects in the 32 display panels provided in this embodiment is 0, and the number of black spot defects in the 32 display panels in the prior art is 10 under the same conditions. Meanwhile, when an electrostatic discharge test is performed, the number of black spot defects caused by static electricity generated by a 15kV electrostatic discharge test of 10 display panels provided by the embodiment is 0, and the number of black spot defects generated by a 12kV electrostatic discharge test of 10 display panels in the prior art is 5. Namely, the display panel provided by the embodiment can improve the yield in the high-temperature high-humidity reliability test and the yield in the electrostatic discharge test.
The embodiment of the application also provides electronic equipment, which comprises the display panel described in the embodiment, and the electronic equipment adopting the display panel can ensure good display effect in a more extreme working environment, so that the performance stability and market competitiveness of the product can be improved.
The display panel and the electronic device provided by the embodiment of the application are provided with a display area, an opening area, an isolation area and a blocking area, wherein the isolation area and the blocking area are arranged between the display area and the opening area, and the blocking area is used for blocking corrosive ions which invade the display panel through the opening area. In the display panel structure, the blocking area is arranged between the isolation area and the open area, so that corrosive ions invaded from the open area in the high-temperature high-humidity reliability test can be prevented from entering the isolation area and the display area, the situation that the films in the isolation area and the display area are stripped to form gaps capable of being invaded by water vapor due to the action of the corrosive ions is avoided, the situation that the water vapor cannot invade the display area to cause black spots in the high-temperature high-humidity reliability test is ensured, and the yield of the display panel in the high-temperature high-humidity reliability test is improved.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (10)

1. The display panel is characterized by comprising a display area, an opening area, an isolation area and a blocking area;
the isolation area and the blocking area are positioned between the display area and the open pore area, the isolation area is arranged close to the display area, and the blocking area is arranged close to the open pore area;
the blocking region is used for blocking ions penetrating into the display panel through the opening region.
2. The display panel of claim 1, wherein,
the display panel comprises a substrate, an inorganic film layer and a metal film layer, wherein the inorganic film layer and the metal film layer are positioned on the substrate;
the blocking region is used for blocking ions corrosive to the inorganic film layer and the metal film layer.
3. The display panel of claim 2, wherein,
orthographic projections of the inorganic film layer and the metal film layer on the substrate are not overlapped with the blocking area.
4. The display panel of claim 2, wherein,
the isolation region is provided with a plurality of isolation columns surrounding the open hole region, and an inorganic filling layer is arranged between every two adjacent isolation columns, wherein the isolation columns are made of at least part of metal layers in the metal film layers, and the inorganic filling layer is made of at least part of film layers in the inorganic film layers;
preferably, the width of the blocking area is 2 times of the width of the isolation column in the direction that the opening area points to the display area;
preferably, the number of the isolation columns is 6-7.
5. The display panel of any one of claims 2-4, further comprising an ion blocking layer on the substrate;
the orthographic projection of the ion blocking layer on the substrate is at least positioned in the blocking area;
preferably, the ion blocking layer is an insulating layer.
6. The display panel of claim 5, wherein the ion blocking layer comprises an organic material layer filled in the blocking region.
7. The display panel of claim 6, further comprising an array drive layer, the metal film layer comprising a metal layer in the array drive layer;
the array driving layer is positioned on the substrate, and the orthographic projection of the metal layer in the array driving layer on the substrate is not overlapped with the blocking area.
8. The display panel of claim 7, further comprising a pixel device layer on a side of the array drive layer remote from the substrate, the metal film layer comprising pixel anode and cathode layers in the pixel device layer;
the pixel anodes are distributed in an array in the display area;
the orthographic projection of the cathode layer on the substrate does not overlap with the blocking area.
9. The display panel of claim 8, further comprising a thin film encapsulation layer on a side of the pixel device layer remote from the substrate, the inorganic film layer comprising a first inorganic encapsulation layer and a second inorganic encapsulation layer of the thin film encapsulation layer, the ion blocking layer comprising an organic material encapsulation layer of the thin film encapsulation layer and/or an organic material layer of the pixel device layer;
the orthographic projection of the first inorganic packaging layer and the second inorganic packaging layer on the substrate is positioned in the display area and the isolation area, and the organic material packaging layer is positioned between the first inorganic packaging layer and the second inorganic packaging layer in the display area and the isolation area;
and the organic material packaging layer and/or the orthographic projection of the organic material layer on the substrate are positioned in the display area, the isolation area and the blocking area.
10. An electronic device, characterized in that the electronic device comprises the display panel of any one of claims 1-9.
CN202310405123.2A 2023-04-11 2023-04-11 Display panel and electronic equipment Pending CN116419611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310405123.2A CN116419611A (en) 2023-04-11 2023-04-11 Display panel and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310405123.2A CN116419611A (en) 2023-04-11 2023-04-11 Display panel and electronic equipment

Publications (1)

Publication Number Publication Date
CN116419611A true CN116419611A (en) 2023-07-11

Family

ID=87057766

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310405123.2A Pending CN116419611A (en) 2023-04-11 2023-04-11 Display panel and electronic equipment

Country Status (1)

Country Link
CN (1) CN116419611A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117542840A (en) * 2023-11-28 2024-02-09 惠科股份有限公司 Display panel and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117542840A (en) * 2023-11-28 2024-02-09 惠科股份有限公司 Display panel and display device

Similar Documents

Publication Publication Date Title
CN107482042B (en) OLED display substrate, manufacturing method thereof and OLED display device
JP2020531881A (en) Organic electroluminescent display board, its manufacturing method and display device
CN111129351B (en) Display panel and display device
CN107302016B (en) Organic light-emitting diode display panel and manufacturing method thereof
CN101221973B (en) Organic light emitting display device and method for fabricating the same
CN116419611A (en) Display panel and electronic equipment
US10553814B2 (en) Array substrate, display panel, display device, method for manufacturing array substrate and method for manufacturing display panel
KR100589888B1 (en) Organic electroluminescence device and method for producing the same
CN112835473B (en) Display panel, display device and preparation method of display panel
US11362302B2 (en) Array substrate, manufacturing method thereof and display panel
US8198624B2 (en) Organic light emitting device
JP2009277549A (en) Organic electroluminescent panel and defect detecting method of the same
CN113097418A (en) Display panel, manufacturing method of display panel and display device
JP2000200053A (en) Production of substrate for display element and substrate for display element
CN115605045A (en) Display panel and manufacturing method thereof
KR100870615B1 (en) Organic electroluminescence panel and method for detecting faill thereof
CN108666437B (en) Display panel and manufacturing method thereof
KR100327358B1 (en) Structure of rib of plasma display panel and Method for manufacturing the rib
US9595689B2 (en) Display device and manufacturing process of display device
KR20140044566A (en) Thin film transistor substrate, method for repairing the same, organic light emitting display apparatus and method for repairing the same
KR101156424B1 (en) Substrate for organic light emitting device
CN105549250A (en) Array substrate, display panel, methods for preparing array substrate and display panel, and display device
CN113764436B (en) Array substrate repairing method and device
CN116916695B (en) Display panel and display device
JP2007149406A (en) Inspection method of substrate for organic el panel, and manufacturing method of organic el device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination