CN116412368A - Lamp and mounting method - Google Patents
Lamp and mounting method Download PDFInfo
- Publication number
- CN116412368A CN116412368A CN202111657821.9A CN202111657821A CN116412368A CN 116412368 A CN116412368 A CN 116412368A CN 202111657821 A CN202111657821 A CN 202111657821A CN 116412368 A CN116412368 A CN 116412368A
- Authority
- CN
- China
- Prior art keywords
- light source
- source substrate
- shell
- light
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000002347 injection Methods 0.000 claims abstract description 8
- 239000007924 injection Substances 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims abstract description 8
- 238000005476 soldering Methods 0.000 claims abstract description 7
- 238000004891 communication Methods 0.000 claims description 11
- 239000011324 bead Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000004519 grease Substances 0.000 abstract description 8
- 229920001296 polysiloxane Polymers 0.000 abstract description 8
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000258971 Brachiopoda Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a lamp, which comprises a shell, a light source module, a driving module and a mask, wherein the shell is provided with a light source module; the light source module comprises a light source substrate and a light source arranged on the light source substrate, and the shell and the light source substrate are integrally injection molded; the driving module comprises a plurality of electronic elements, and the electronic elements are welded on the light source substrate; the face shield is fixedly arranged on one side of the shell, on which the light source substrate is formed. The lamp is formed by integrally injection molding the shell and the light source substrate of the lamp, and then the shell and the light source substrate are tightly attached through reflow soldering after injection molding, so that heat conduction silicone grease is not required to be arranged between the shell and the light source substrate, the assembly process is simple, the speed is high, and the cost for arranging the heat conduction silicone grease is saved.
Description
Technical Field
The application belongs to the field of lamps and lanterns, and in particular relates to an integrally injection molded lamp and an installation method.
Background
LED projecting lamps or floodlights in the current market are inconvenient to assemble, have more interface layers and more conductive thermal resistances. In order to improve the heat conduction performance, the heat conduction silicone grease is added between the light source substrate and the lamp shell.
The current lamp such as an LED floodlight and a floodlight is complex in assembly process, low in reliability, and high in cost due to the fact that heat conduction silicone grease is added.
Disclosure of Invention
The purpose of the application is to solve the problems in the prior art, and provide a lamp and an installation method.
The first technical scheme of the application is as follows: a lamp comprises a shell, a light source module, a driving module and a mask; the light source module comprises a light source substrate and a light source arranged on the light source substrate, and the shell and the light source substrate are integrally injection molded; the driving module comprises a plurality of electronic elements, and the electronic elements are welded on the light source substrate; the face shield is fixedly arranged on one side of the shell, on which the light source substrate is formed.
Further, the shell comprises a base and side walls which are arranged around the base and vertically extend to form an accommodating space, and the light source substrate is arranged in the accommodating space and is attached to the base after being integrally formed with the shell.
Further, the housing is provided with a heat sink extending from the outer surface of the base.
Further, the driving module further comprises a communication module; the driving module is integrated on the light source substrate or provided with a driving circuit board, and the communication module is integrated on the driving module or is independently arranged and is electrically connected with the driving module.
Further, the luminaire comprises an optical configuration element; the lens is arranged on the light-emitting light paths of the lamp beads and is configured to concentrate or diverge light rays emitted by the lamp beads.
Further, the optical configuration element includes a lens; the lens is fixedly arranged on the light source substrate or the shell.
Further, the processor is electrically connected with the power module, the light source module and the communication module respectively.
Further, the mask is made of glass or acrylic.
The second technical scheme of the application: a method for installing the lamp comprises providing a light source substrate and a housing, and integrally injection molding the light source substrate and the housing; providing a plurality of electronic components and welding the electronic components to the light source substrate; providing a plurality of lenses and placing the lenses on light emergent paths of a plurality of lamp beads; the mask is fixedly arranged on one side of the shell, on which the light source substrate is formed.
Further, the electronic component is soldered to the light source substrate by reflow soldering.
The beneficial effects of this application are: the lamp is formed by integrally injection molding the shell and the light source substrate of the lamp, and then the shell and the light source substrate are tightly attached through reflow soldering after injection molding, so that heat conduction silicone grease is not required to be arranged between the shell and the light source substrate, the assembly process is simple, the speed is high, and the cost for arranging the heat conduction silicone grease is saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of an integrally molded lamp according to an embodiment of the present application.
Fig. 2 is an exploded view of an integrated injection lamp according to an embodiment of the present application.
Fig. 3 is a schematic diagram of an internal circuit structure of an integrally molded lamp according to an embodiment of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings, wherein it is apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The present application is further described below with reference to the accompanying drawings.
Example 1
Fig. 1 is a schematic cross-sectional structure of an integrally molded lamp according to an embodiment of the present application.
Fig. 2 is an exploded view of an integrated injection lamp according to an embodiment of the present application.
As shown in fig. 1-2, the integrally molded light fixture 10 includes a face mask 1, electronic components 2, a light source substrate 3, and a housing 4. The housing 4 may be made of plastic, thermally conductive plastic, or graphene. The light source substrate 3 and the shell 4 are integrally molded, the light source substrate 3 is arranged at the bottom of the inner space of the shell 4, and after the light source substrate 3 and the bottom of the shell 4 are integrally molded, the light source substrate and the shell 4 are attached and integrally molded. As can be seen from fig. 1, the bottom of the housing 4 is provided with a grid-shaped radiator 41, and the grid-shaped radiator 41 can increase the heat dissipation area and improve the heat dissipation efficiency of the housing 4.
After the light source substrate 3 and the housing 4 are integrally injection molded, the integrally molded light source substrate 3 and housing 4 may be brought into a reflow soldering shop, and the electronic component 2 may be soldered to the light source substrate 3 by a reflow soldering process. The electronic component 2 includes a power module 21, a processor 22, a communication module 23, and a light source module 24. The light source module comprises a plurality of lamp beads 241, and the layout of the lamp beads 241 can be set into the shape of ring, circle, square and the like. Preferably, the integrally molded lamp 10 further includes a lens 5 (not shown), and the lens 5 may be disposed on an upper portion of the lamp beads 241 for condensing or dispersing light emitted from each of the lamp beads 241. The lens 5 may be fixed on the light source substrate 3 or the housing 4.
When the electronic component 2 is welded to the light source substrate 3 and the lens 5 is mounted, the mask 1 is fixedly mounted on the upper end surface of the housing 4 far from the bottom, and the mounting of the integrated injection lamp 10 is completed. The mask 1 may be fixed to the upper end surface of the housing 4 by means of screw fixation or clamping. The mask 1 may be made of glass or acrylic.
Fig. 3 is a schematic diagram of an internal circuit structure of an integrally molded lamp according to an embodiment of the present application.
As shown in fig. 3, the processor 22 is electrically connected to the power module 21, the communication module 23, and the light source module 24, respectively. The power module 21 is externally connected with the mains supply, and converts the alternating current into direct current to supply power to the communication module 23, the processor 22 and the light source module 24. The communication module 23 can be connected with an external device in a wireless manner, and can receive a control signal of the external device, wherein the control signal comprises a dimming and toning signal of the light source module 24, and the external device comprises a mobile phone, a PAD and other devices of a user. When the communication module 23 receives the dimming and toning signal sent by the user, the dimming and toning signal is transferred to the processor 22, and the processor 22 controls the current input to the light source module 24 by the power module 21 according to the received dimming and toning signal, so as to realize dimming and toning of the light source module.
The lamp is formed by integrally injection molding the shell and the light source substrate of the lamp, and then the shell and the light source substrate are tightly attached through reflow soldering after injection molding, so that heat conduction silicone grease is not required to be arranged between the shell and the light source substrate, the assembly process is simple, the speed is high, and the cost for arranging the heat conduction silicone grease is saved.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.
Claims (10)
1. A lamp comprises a shell, a light source module, a driving module and a mask; it is characterized in that the method comprises the steps of,
the light source module comprises a light source substrate and a light source arranged on the light source substrate, and the shell and the light source substrate are integrally injection molded;
the driving module comprises a plurality of electronic elements, and the electronic elements are welded on the light source substrate;
the face shield is fixedly arranged on one side of the shell, on which the light source substrate is formed.
2. A light fixture as recited in claim 1, wherein,
the shell comprises a base and side walls which are arranged around the base and vertically extend to form an accommodating space, and the light source substrate is arranged in the accommodating space and is attached to the base after being integrally formed with the shell.
3. A light fixture as recited in claim 2, wherein,
the housing is provided with a heat sink extending from an outer surface of the base.
4. A light fixture as recited in claim 3, wherein,
the driving module further comprises a communication module;
the driving module is integrated on the light source substrate or provided with a driving circuit board, and the communication module is integrated on the driving module or is independently arranged and is electrically connected with the driving module.
5. A light fixture as recited in claim 4, wherein,
the luminaire comprises an optical configuration element;
the lens is arranged on the light-emitting light paths of the lamp beads and is configured to concentrate or diverge light rays emitted by the lamp beads.
6. A light fixture as recited in claim 5, wherein,
the optical configuration element includes a lens;
the lens is fixedly arranged on the light source substrate or the shell.
7. A light fixture as recited in claim 6, wherein,
the processor is electrically connected with the power supply module, the light source module and the communication module respectively.
8. A light fixture as recited in claim 7, wherein,
the face mask is made of glass or acrylic materials.
9. A method of installing a light fixture as recited in any one of claims 1-8,
providing a light source substrate and a shell, and integrally injection-molding the light source substrate and the shell;
providing a plurality of electronic components and welding the electronic components to the light source substrate;
providing a plurality of lenses and placing the lenses on light emergent paths of a plurality of lamp beads;
the mask is fixedly arranged on one side of the shell, on which the light source substrate is formed.
10. The method of claim 9, wherein the step of determining the position of the substrate comprises,
the electronic component is soldered to the light source substrate by means of reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111657821.9A CN116412368A (en) | 2021-12-30 | 2021-12-30 | Lamp and mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111657821.9A CN116412368A (en) | 2021-12-30 | 2021-12-30 | Lamp and mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116412368A true CN116412368A (en) | 2023-07-11 |
Family
ID=87051662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111657821.9A Pending CN116412368A (en) | 2021-12-30 | 2021-12-30 | Lamp and mounting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116412368A (en) |
-
2021
- 2021-12-30 CN CN202111657821.9A patent/CN116412368A/en active Pending
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