CN116411331A

CN116411331A - Coating device for magnet manufacturing

Info

Publication number: CN116411331A
Application number: CN202310680681.XA
Authority: CN
Inventors: 朱国栋; 朱国辉; 刘孝军
Original assignee: XUZHOU YUANYANG MAGNETIC MATERIAL CO Ltd
Current assignee: XUZHOU YUANYANG MAGNETIC MATERIAL CO Ltd
Priority date: 2023-06-09
Filing date: 2023-06-09
Publication date: 2023-07-11
Anticipated expiration: 2043-06-09
Also published as: CN116411331B

Abstract

The application relates to the technical field of metal electroplating, the utility model discloses a magnet manufacturing is with coating film device, which comprises a base, the liquid bath has been seted up in the base, the liquid bath intussuseption is filled with plating solution, the liquid bath top is equipped with puts the thing seat, put and set up electroplating pool in the thing seat, put and be equipped with power device on the thing seat, be equipped with strutting arrangement in the electroplating pool, strutting arrangement includes the transmission strip, be equipped with on the transmission strip with power device engaged tooth, be equipped with on the transmission strip and shift the arch, be equipped with supporting shoe I and supporting shoe II on the arch that shifts, be equipped with magnet on the supporting shoe I. According to the invention, the power device is driven to reciprocate through intermittent flow of the electroplating liquid, so that the power device drives the supporting device to reciprocate, the deflection protrusions in the supporting device squeeze the supporting blocks I and II, the height positions of the supporting blocks I and II are changed, the magnet is driven to reciprocate up and down, the contact between the magnet and more electroplating liquid is enlarged, and the electroplating effect is improved.

Description

Coating device for magnet manufacturing

Technical Field

The application relates to the technical field of metal electroplating, in particular to a film plating device for magnet manufacturing.

Background

In the process of manufacturing the magnet, electroplating treatment is needed, a thin layer is plated on the surface of the magnet to protect the magnet, wherein the magnet is placed on a hanging frame in the main electroplating process, the hanging frame carrying the magnet is placed in electroplating solution, plating metal ions existing in the electroplating solution enter the electroplating solution mainly through plating metal connected with an anode, the hanging frame carrying the magnet enables the magnet to be connected with a cathode, and the metal ions are plated on the surface of the magnet under the action of potential difference.

In order to improve the uniformity of the plating layer on the surface of the magnet and the electroplating efficiency, the electroplating solution is generally stirred, the contact amount of the electroplating solution and the magnet in unit time is improved, but in this way, the contact position of the magnet and the suspension bracket still cannot be changed, the problem that the magnet cannot be directly contacted with the electroplating solution is solved, the electroplating effect of the contact position of the magnet and the suspension bracket is poor, meanwhile, impurity crystallization (impurities generated by chemical reaction of auxiliary raw materials added in the electroplating solution, metal and the like) is gradually generated in the electroplating solution, the impurity concentration in the electroplating solution is continuously increased, the direct contact of effective metal ions in the electroplating solution and the magnet is influenced, and the electroplating effect is weakened.

Disclosure of Invention

The utility model provides a magnet manufacturing is with coating film device, possess circulating pump intermittent type nature start and stop drive plating solution intermittent type nature fast flow, fast flow's plating solution impact water wheel drives the central roller rotation, the central roller gyration when plating solution fluidity is poor, reciprocating pivoted central roller passes through the gear and drives the transmission line and do straight reciprocating motion, the transmission line passes through the protruding height that changes supporting shoe I and supporting shoe II that shifts, supporting shoe I and supporting shoe II are electroplated with the plating solution of intermittent type nature contact of magnet, the contact point of magnet and supporting shoe I and supporting shoe II can direct contact plating solution, the magnet carries out reciprocating motion from top to bottom under the drive of supporting shoe I and supporting shoe II, magnet cooperation spring drive stirring board rocks, stirring board stirs the advantage that the deposition impurity on every side makes impurity quick drainage, be used for solving the direct electroplating of unable obtaining plating solution and the impurity deposit in the plating solution of magnet and mounted frame's contact position and lead to the poor problem of electroplating effect.

In order to achieve the above purpose, the present application adopts the following technical scheme: the utility model provides a magnet manufacturing is with coating film device, includes the base, set up the pond in the base, be equipped with positive pole metal in the pond, the intussuseption of pond is filled with plating solution, the inlet has been seted up to the one end of pond, and the liquid outlet has been seted up to the other end for circulate the plating solution in the pond, one side of base is equipped with the circulating pump, the circulating pump is opened and close intermittently, is used for providing the power of the plating solution that flows and changes the mobility of plating solution, be connected with the runner pipe on the circulating pump, one side and the liquid outlet switch-on of runner pipe, the opposite side of runner pipe is equipped with the connecting pipe, the top of connecting pipe is equipped with the cloth liquid pipe, cloth liquid pipe and inlet switch-on for circulate the plating solution in the pond, the top of pond is equipped with two symmetrical thing seats of putting, set up the plating solution in the thing seat, be equipped with two symmetrical conveyer pipes and plating solution switch-on the cloth liquid pipe for to the plating solution in the plating solution pond, the leak hole that sets up bottom of thing seat was used for connecting the pond and the power conversion device is equipped with in the supporting device and magnet is used for carrying out the power conversion device is equipped with in the supporting device, and is used for carrying out the power transfer device with the magnet in the supporting device to flow on the equipartition.

Preferably, the power device comprises a central roller penetrating through the two object placing seats, a torsion spring is arranged between the central roller and the object placing seats and used for resetting the central roller, three water wheels are arranged on the central roller, the bottoms of the water wheels are positioned in the electroplating liquid in the liquid pool and used for receiving the power of the flowing electroplating liquid, and four gears are arranged on the central roller and used for transmitting the power to the supporting device.

Preferably, the supporting device comprises a transmission bar, the top end of the transmission bar is provided with uniformly distributed teeth and meshed gears for receiving power transmitted by the power device, two groups of symmetrical deflection protrusions are arranged on two sides of the top end of the transmission bar, and supporting blocks I and supporting blocks II with the same structure are arranged on the deflection protrusions and used for changing contact time between the supporting blocks I and II and the magnet.

Preferably, the group of deflection protrusions are formed by two connected isosceles triangular bodies, one isosceles triangular body is respectively attached to the bottom ends of the supporting block I and the supporting block II on two inclined edges, when the supporting block I is positioned at the bottom of the inclined edge, the supporting block II is positioned at the top of the inclined edge and used for changing the heights of the supporting block I and the supporting block II to form opposite action conditions of the supporting block I and the supporting block II.

Preferably, two symmetrical sliding grooves are formed in the bottom end of the electroplating pool, and the transmission bars are located in the sliding grooves and used for limiting the motion state of the transmission bars.

Preferably, symmetrical limit grooves are formed in two side walls of the electroplating tank, two ends of the supporting block I are inserted into limit grooves which are located on the same straight line with the supporting block I, two ends of the supporting block II are inserted into limit grooves which are located on the same straight line with the supporting block II, the height value of the limit grooves is larger than that of the supporting block I, and the width value of the limit grooves is equal to that of the supporting block I and used for limiting the motion state of the supporting block I and the supporting block II.

Preferably, all articulate on supporting shoe I and the supporting shoe II one side has the articulated pole, one side that the articulated pole on the supporting shoe I deviates from supporting shoe I is equipped with the stirring board, it has magnetism on the stirring board, inhale mutually with magnet for cooperate the magnet to change the position of stirring board, the bottom of stirring board is equipped with the spring, the bottom of spring is connected to one side of stirring board with supporting shoe I, is used for driving the stirring board and swings.

Preferably, one side of the hinging rod on the supporting block II, which is away from the supporting block II, is provided with an agitating plate, the agitating plate is provided with magnetism and attracts with the magnet, the bottom end of the agitating plate is provided with a spring, and the bottom end of the spring is connected with one side of the supporting block II, which is opposite to the agitating plate, and is used for changing the position of the agitating plate and agitating surrounding electroplating liquid.

The application has the following beneficial effects:

the utility model provides a pair of coating device for magnet manufacturing, it flows fast to drive the plating solution through circulating pump intermittent type nature, make the plating solution promote the water wheel rotatory when flowing fast, torsion spring energy storage this moment, it is rotatory that will not promote the water wheel when the plating solution mobility is poor, the torsion spring will drive the water wheel gyration this moment, thereby drive center roller and gear synchro-rotation, make the tooth on the gear engagement transmission strip, promote the transmission strip and remove, make the relative position that shifts protruding and supporting shoe I and supporting shoe II change, thereby make magnet do up-and-down reciprocating motion, the contact quantity of magnet and plating solution in the unit time is improved, the electroplating effect is improved.

Simultaneously, when supporting shoe I moves down, magnet on the supporting shoe I moves down, simultaneously supporting shoe II lifts, until the top of supporting shoe II and the bottom contact of magnet, this moment supporting shoe I continues to move down, supporting shoe II will drive the magnet and lift up, when lifting on supporting shoe I, supporting shoe II moves down, magnet on the supporting shoe II moves down this moment, until the bottom contact of supporting shoe I top and magnet, at this moment supporting shoe I promotes the magnet to continue to lift up, supporting shoe II continues to move down, thereby make the magnet when reciprocating motion from top to bottom, the contact position that magnet bottom was supported constantly changes, make the contact position that magnet bottom was supported also can direct contact plating solution, carry out efficient electroplating.

Simultaneously, when the supporting block I supports the magnet and moves downwards, the stirring plate on the supporting block I is attracted by the magnet and keeps in an upward deflection inclined state, when the supporting block II is gradually close to the bottom contact of the magnet and the magnet, the stirring plate on the supporting block II is attracted by the magnet and deflects upwards, the surrounding electroplating liquid is stirred to a certain extent, at the moment, the supporting block II drives the magnet to lift upwards, and the supporting block I continues to move downwards, so that the magnet gradually weakens the attraction of the magnet to the stirring plate on the supporting block I, the stirring plate on the supporting block I is driven by the spring below the stirring plate at the moment, the stirring plate stirs the surrounding electroplating liquid, at the moment, the stirring plate on the supporting block I is close to the bottom of the electroplating tank, impurities deposited around the stirring plate drift under stirring, and are discharged out of the electroplating tank along with the electroplating liquid discharged through the leakage holes at the moment, and therefore the impurity deposition amount in the electroplating tank is reduced (the supporting block II moves downwards, at the moment, the supporting block I is same at the moment, the conveying pipe is still conveyed into the electroplating tank when the supporting block II moves downwards, the conveying pipe is conveyed into the electroplating tank, the electroplating tank stops when the conveying block I moves downwards, the conveying pipe stops, the electroplating liquid in the electroplating tank, and the deposition in the electroplating tank is bad, and the electroplating liquid deposition is deposited in the electroplating tank.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.

The present application will be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic diagram of a liquid pool structure according to the present invention;

FIG. 3 is a schematic view of the structure of the storage seat according to the present invention;

FIG. 4 is a schematic view of the internal structure of the storage seat according to the present invention;

FIG. 5 is a schematic view of the structure of the supporting device of the present invention;

FIG. 6 is an enlarged schematic diagram of the structure of FIG. 5A according to the present invention.

Reference numerals:

1. a base; 2. a liquid pool; 3. a liquid outlet; 4. a liquid inlet; 5. a circulation pump; 6. a flow pipe; 7. a reflow hole; 8. a connecting pipe; 9. a liquid distribution pipe; 10. a delivery tube; 11. an anode metal; 12. a cathode frame; 13. a storage seat; 14. an electroplating pool; 15. a leakage hole; 16. a sliding groove; 17. a limit groove; 18. a transmission bar; 19. a displacement protrusion; 20. a supporting block I; 21. a supporting block II; 22. a magnet; 23. a center roller; 24. a water wheel; 25. a gear; 26. a hinge rod; 27. an agitating plate; 28. and (3) a spring.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

Example 1

Referring to fig. 1 to 3, a film plating device for manufacturing a magnet includes a base 1, a liquid pool 2 is provided in the base 1, the bottom end of the liquid pool 2 is inclined, so that the flow speed of the plating solution in the liquid pool 2 can be increased under the height difference of the liquid pool 2, thereby increasing the impact force of the plating solution flowing rapidly on a water wheel 24, a liquid inlet 4 is provided at one inclined end of the liquid pool 2, a liquid outlet 3 is provided at the other end, so that the plating solution powered by a circulating pump is discharged into the liquid pool 2 from the liquid inlet 4, then flows in the direction of the liquid outlet 3 again under the influence of the height difference in the liquid pool 2, the fluidity of the plating solution in the liquid pool 2 is improved, the bottom end of the liquid pool 2 is fixedly connected with anode metal 11, the anode metal 11 is close to the liquid inlet 4, and metal ions formed by the anode metal 11 can be melted into the plating solution rapidly.

Referring to fig. 1 to 3, a circulation pump 5 is fixedly connected to the outer side wall of a base 1, the circulation pump 5 is controlled by an existing intelligent control program, the circulation pump 5 is intermittently turned on and off under control, when the circulation pump 5 is started, power can be applied to electroplating liquid, the electroplating liquid rapidly flowing in a liquid pool 2 impacts a water wheel 24, the water wheel 24 and a central roller 23 can rotate, torsion springs store energy, after the circulation pump 5 is closed, the electroplating liquid in the liquid pool 2 has poor fluidity, at the moment, impact force received by the water wheel 24 is weakened, at the moment, the torsion springs store energy between the central roller 23 and a placement seat 13 drive the water wheel 24 and the central roller 23 to rotate, a flow pipe 6 is connected to the circulation pump 5, a filtering device can be additionally arranged on the flow pipe 6, and used for filtering impurities in the circulated electroplating liquid, two ends of the flow pipe 6 are inserted into the base 1, the position of the runner pipe 6 below the liquid outlet 3 is provided with a reflux hole 7, the reflux hole 7 is communicated with the liquid outlet 3, so that the electroplating liquid in the liquid pool 2 can enter the runner pipe 6 through the liquid outlet 3 and the reflux hole 7, then enter the circulating pump 5 through the runner pipe 6, the position of the runner pipe 6 below the liquid inlet 4 is fixedly connected with a connecting pipe 8, the top end of the connecting pipe 8 is fixedly connected with a liquid distribution pipe 9, the liquid distribution pipe 9 is opposite to one side of the liquid inlet 4 and is opened, one side of the opening of the liquid distribution pipe 9 is communicated with the liquid inlet 4, the circulating pump 5 can input the inhaled electroplating liquid into the liquid distribution pipe 9 through the runner pipe 6 and the connecting pipe 8, then be input into the liquid pool 2 again through the liquid inlet 4, two symmetrical conveying pipes 10 are fixedly connected to the liquid distribution pipe 9, so that the electroplating liquid can enter the conveying pipe 10 through the liquid distribution pipe 9, and then the electroplating liquid is conveyed into the electroplating pool 14 through the conveying pipe 10, the length values of the liquid outlet 3, the liquid inlet 4 and the liquid distribution pipe 9 are the same as the width value of the liquid pool 2, so that the speed of inputting and outputting the electroplating liquid into the liquid pool 2 is improved.

Referring to fig. 1 to 5, a cathode frame 12 is disposed above a liquid pool 2, two symmetrical object placing seats 13 are fixedly connected to the bottom end of the cathode frame 12, a plating pool 14 is disposed in the object placing seats 13, one end opening of a conveying pipe 10 is communicated with the plating pool 14, the plating pool 14 and the plating pool 2 are filled with plating liquid, the plating liquid level in the liquid pool 2 is located below the object placing seat 13, uniformly distributed leakage holes 15 are disposed at the bottom end of the object placing seat 13, after the plating liquid is sent into the plating pool 14 through the conveying pipe 10, the plating pool 14 can be discharged through the leakage holes 15, the discharged plating liquid falls back into the liquid pool 2, the plating liquid in the plating pool 14 is connected with the plating liquid in the liquid pool 2 through the discharge leakage holes 15, the current in the plating liquid in the liquid pool 2 is transferred to the plating pool 14 through the plating liquid in the discharge leakage holes 15, and after the plating pool 14 is discharged through the leakage holes 15, the plating liquid contained in the plating pool is always in the liquid pool 14, the two symmetrically disposed side walls of the two sides of the plating pool 2 are respectively disposed at the two side walls of the two symmetrical side walls of the plating pool 14, and the side walls of the plating pool 16 are symmetrically disposed at the two side walls of the plating pool 16 are respectively disposed.

Referring to fig. 3 to 5, the transmission bar 18 is movably sleeved in the sliding groove 16, the center of the top end of the transmission bar 18 is provided with uniformly distributed teeth, two groups of symmetrical deflection protrusions 19 are fixedly connected to two sides of the top end of the transmission bar 18, one group of deflection protrusions 19 is formed by two connected isosceles triangle bodies, two inclined edges of one isosceles triangle body are respectively provided with a support block i 20 and a support block ii 21, inclined edges are formed at the bottom ends of the support block i 20 and the support block ii 21 and are attached to the inclined edges of the isosceles triangle body, the support block i 20 and the support block ii 21 are identical in structure, the inclined edges of the bottom end are opposite in direction, when the support block i 20 is positioned at the bottom of one inclined edge, the support block ii 21 is positioned at the top of the other inclined edge, so that the transmission bar 18 can push the support block i 20 (the support block ii 21) through the inclined edges of the isosceles triangle body to move from the bottom of the inclined edges of the isosceles triangle body to the top, and the support block i 20 (the support block ii 21) can be lifted, and the support block ii 21 (the support block ii 21) can be lifted down (i) by lifting force of the support block ii 21) when the support block ii 21 is lowered, and the support block ii (i) can be lifted down (up and moved down (ii) reversely when the support block ii) is lifted.

Referring to fig. 4 to 6, both ends of the supporting block i 20 are inserted into the limiting grooves 17 on the same straight line as the supporting block i 20, both ends of the supporting block ii 21 are inserted into the limiting grooves 17 on the same straight line as the supporting block ii 21, the height value of the limiting grooves 17 is larger than the height value of the supporting block i 20, the width value of the limiting grooves 17 is equal to the width value of the supporting block i 20, the limiting grooves 17 limit the supporting block i 20 and the supporting block ii 21, the supporting block i 20 and the supporting block ii 21 can only move up and down, the supporting block i 20 on one isosceles triangle is closer to the liquid inlet 4 than the supporting block ii 21, the top ends of the supporting blocks i 20 on two isosceles triangles in the group of deflection protrusions 19 are provided with uniformly distributed magnets 22, the magnets 22 can be suspended in the plating liquid in the plating bath 14 under the support of the supporting block i 20 to perform plating, when the supporting block i 20 moves down, when the support block II 21 is lifted, the magnet 22 moves downwards along with the support block I20 until the support block II 21 is contacted with the magnet 22, at the moment, the support block II 21 supports the magnet 22 and drives the magnet 22 to lift upwards, and the support block I20 continues to move downwards, and similarly, when the support block II 21 moves downwards, the magnet 22 moves downwards along with the support block II 21, at the moment, the support block I20 lifts upwards until the support block I20 is contacted with the magnet 22, so that the support block I20 supports the magnet 22 and drives the magnet 22 to lift upwards, and the support block II 21 continues to move downwards, thereby enabling the magnet 22 to reciprocate upwards and downwards, increasing the contact between the magnet 22 and plating solution, improving the plating effect, and simultaneously, when the support block I20 and the support block II 21 respectively support the magnet 22, the contact point between the support block I20 and the support block II 21 and the magnet 22 is different, so that the contact point between the magnet 22 and the support block I20 and the support block II 21 can also directly contact the plating solution, electroplating is carried out.

Referring to fig. 1 to 5, the centers of the two placement bases 13 are movably sleeved with a through center roller 23, a torsion spring is arranged between the center roller 23 and the placement bases 13, three water wheels 24 are fixedly sleeved on the center roller 23, one water wheel 24 is positioned between the two placement bases 13, the other two water wheels 24 are respectively positioned between the placement bases 13 and two side walls of the liquid pool 2, the bottoms of the water wheels 24 are in contact with the electroplating liquid in the liquid pool 2, so that the electroplating liquid in the liquid pool 2 can push the water wheels 24 when flowing rapidly, the water wheels 24 drive the center roller 23 to rotate, at the moment, the torsion spring stores energy, and when the power of the electroplating liquid in the liquid pool 2 is poor due to the loss of the power of the circulating pump 5, the torsion spring stores energy can drive the center roller 23 and the water wheels 24 to rotate, so as to reciprocate, and the center roller 23 can reciprocate.

Referring to fig. 4 to 5, four gears 25 are fixedly sleeved on the central roller 23, the gears 25 are meshed with teeth on the driving strip 18, so that the central roller 23 drives the gears 25 to do reciprocating rotation, the gears 25 are meshed with teeth on the driving strip 18 in a reciprocating manner, the driving strip 18 is driven to do reciprocating linear motion in the sliding groove 16, the heights of the supporting block i 20 and the supporting block ii 21 are continuously changed by the displacement protrusions 19, and the magnet 22 is driven to do up-and-down reciprocating motion.

Example two

Referring to fig. 5 to 6, on the basis of the first embodiment, hinge rods 26 are hinged on one sides of the support block i 20 and the support block ii 21, one side of the hinge rods 26 on the support block i 20, which faces away from the support block i 20, is provided with an agitation plate 27, the agitation plate 27 is provided with magnetism, and is attracted by the magnet 22, the bottom end of the agitation plate 27 is fixedly connected with a spring 28, the bottom end of the spring 28 is fixedly connected with one side of the support block i 20, which faces the agitation plate 27, when the support block i 20 supports the magnet 22, the agitation plate 27 on the support block i 20 is attracted by the magnet 22 to maintain an upward deflection inclined state, when the support block ii 21 gradually approaches the bottom end of the magnet 22 and contacts the magnet 22, the agitation plate 27 on the support block ii 21 is attracted by the magnet 22, the agitation plate 27 is upwards deflected to stir the surrounding electroplating liquid to a certain extent, at this moment, the support block ii 21 drives the magnet 22 to lift up, and the support block i 20 continues to move down, the attraction of the agitation plate 27 on the support block i 20 is gradually weakened, the agitation plate 27 on the support block i 20 moves below the agitation plate 27, the agitation plate 27 moves below the spring 27, the agitation plate 27 moves down to the agitation plate 27 at this moment, the agitation plate 14 moves down, the surrounding the electroplating pool 14 is discharged from the agitation pool 14, and the impurity deposition pool 14 is reduced, and the impurity deposition is removed from the agitation pool 14 around the agitation plate 27, and the agitation pool 14 is deposited on the agitation pool 14.

Referring to fig. 5 to 6, an agitating plate 27 is arranged on one side of a hinge rod 26 on a supporting block ii 21, which is away from the supporting block ii 21, the agitating plate 27 is provided with magnetism and is attracted to a magnet 22, a spring 28 is fixedly connected to the bottom end of the agitating plate 27, the bottom end of the spring 28 is fixedly connected with one side of the supporting block ii 21, which is opposite to the agitating plate 27, when the supporting block ii 21 supports the magnet 22 and moves downwards, the agitating plate 27 on the supporting block ii 21 is attracted by the magnet 22 and keeps in an upward deflection inclined state, when the supporting block i 20 gradually approaches the magnet 22 and contacts with the bottom end of the magnet 22, the agitating plate 27 on the supporting block i 20 is attracted by the magnet 22 and deflects upwards, a certain degree of agitation is performed on surrounding electroplating liquid, at this moment, the supporting block i 20 drives the magnet 22 to lift up, and the supporting block ii 21 continues to move downwards, so that the attraction of the magnet 22 to the agitating plate 27 on the supporting block ii 21 gradually weakens, at this moment, the agitating plate 27 moves under the driving of the spring 28 below the agitating plate 27, so that the agitating plate 27 is attracted by the magnet 22, when the supporting block ii 20 gradually approaches the magnet 22 and contacts with the bottom end of the magnet 22, the agitating plate 27 is attracted by the magnet 22, the agitating plate 27, the agitation plate 22, the electromagnetic plate 20 is attracted by the magnet 22, and the supporting plate 22, and the bottom plate, and the supporting plate 22, and the supporting plate side other side surface adjacent to the supporting plate magnet 27, and the bottom plate 22.

Claims

1. The coating device for manufacturing the magnet is characterized by comprising a base (1), wherein a liquid pool (2) is formed in the base (1), anode metal (11) is arranged in the liquid pool (2), electroplating liquid is filled in the liquid pool (2), a liquid inlet (4) is formed in one end of the liquid pool (2), and a liquid outlet (3) is formed in the other end of the liquid pool and used for inputting and outputting the electroplating liquid in the liquid pool (2);

one side of the base (1) is provided with a circulating pump (5), the circulating pump (5) is intermittently opened and closed and used for providing power of flowing electroplating liquid and changing fluidity of the electroplating liquid, the circulating pump (5) is connected with a circulating pipe (6), one side of the circulating pipe (6) is communicated with a liquid outlet (3), the other side of the circulating pipe (6) is provided with a connecting pipe (8), the top end of the connecting pipe (8) is provided with a liquid distribution pipe (9), and the liquid distribution pipe (9) is communicated with a liquid inlet (4) and used for circulating the electroplating liquid in the liquid pool (2);

two symmetrical object placing seats (13) are arranged above the liquid pool (2), an electroplating pool (14) is arranged in each object placing seat (13), and two symmetrical conveying pipes (10) are arranged on each liquid distribution pipe (9) and are communicated with the electroplating pool (14) and used for conveying electroplating liquid into the electroplating pool (14);

the bottom of the storage seat (13) is provided with uniformly distributed leakage holes (15) for connecting the electroplating pool (14) with the electroplating liquid in the liquid pool (2), a supporting device is arranged in the electroplating pool (14), and uniformly distributed magnets (22) are arranged on the supporting device and used for supporting the magnets (22) to carry out electroplating;

the power device is arranged on the object placing seat (13) and used for absorbing and transmitting the power of flowing electroplating liquid, and the power device is in transmission connection with the supporting device and used for receiving the power by the supporting device and converting the power.

2. The magnet manufacturing coating device according to claim 1, wherein the power device comprises a central roller (23) penetrating through two object placing seats (13), a torsion spring is arranged between the central roller (23) and the object placing seats (13) and used for resetting the central roller (23), three water wheels (24) are arranged on the central roller (23), the bottoms of the water wheels (24) are positioned in the electroplating solution in the liquid pool (2) and used for receiving the power of the flowing electroplating solution, and four gears (25) are arranged on the central roller (23) and used for transmitting power to the supporting device.

3. The magnet manufacturing coating device according to claim 2, wherein the supporting device comprises a transmission bar (18), teeth uniformly distributed on the top end of the transmission bar (18) are meshed with a gear (25) and used for receiving power transmitted by the power device, two groups of symmetrical deflection protrusions (19) are arranged on two sides of the top end of the transmission bar (18), and supporting blocks I (20) and supporting blocks II (21) with the same structure are arranged on the deflection protrusions (19) and used for changing contact time between the supporting blocks I (20) and II (21) and the magnet (22).

4. A magnet manufacturing coating apparatus according to claim 3, wherein the set of displacement projections (19) is formed by two connected isosceles triangular bodies, two inclined sides of one isosceles triangular body are respectively attached to the bottom ends of the supporting block i (20) and the supporting block ii (21), and when the supporting block i (20) is at the bottom of the inclined side, the supporting block ii (21) is at the top of the other inclined side, for changing the heights of the supporting block i (20) and the supporting block ii (21), so as to form the opposite operating conditions of the supporting block i (20) and the supporting block ii (21).

5. A magnet manufacturing coating device according to claim 3, wherein two symmetrical sliding grooves (16) are formed in the bottom end of the electroplating tank (14), and the transmission bar (18) is located in the sliding grooves (16) and used for limiting the motion state of the transmission bar (18).

6. The magnet manufacturing coating device according to claim 4, wherein uniformly-distributed symmetrical limiting grooves (17) are formed in two side walls of the electroplating tank (14), two ends of the supporting block I (20) are inserted into the limiting grooves (17) which are on the same straight line with the supporting block I (20), two ends of the supporting block II (21) are inserted into the limiting grooves (17) which are on the same straight line with the supporting block II (21), the height value of the limiting grooves (17) is larger than that of the supporting block I (20), and the width value of the limiting grooves (17) is equal to that of the supporting block I (20) so as to limit the motion state of the supporting block I (20) and the supporting block II (21).

7. The magnet manufacturing coating device according to claim 6, wherein hinge rods (26) are hinged on one sides of the supporting block I (20) and the supporting block II (21), an agitating plate (27) is arranged on one side, deviating from the supporting block I (20), of the hinge rods (26) on the supporting block I (20), magnetism is arranged on the agitating plate (27), the agitating plate (27) is attracted with the magnet (22) and used for being matched with the magnet (22) to change the position of the agitating plate (27), a spring (28) is arranged at the bottom end of the agitating plate (27), and the bottom end of the spring (28) is connected with one side, opposite to the agitating plate (27), of the supporting block I (20) and used for driving the agitating plate (27) to swing.

8. The coating device for manufacturing a magnet according to claim 7, wherein a stirring plate (27) is arranged on one side of the hinging rod (26) on the supporting block II (21) facing away from the supporting block II (21), the stirring plate (27) is provided with magnetism and is attracted with the magnet (22), a spring (28) is arranged at the bottom end of the stirring plate (27), and the bottom end of the spring (28) is connected with one side of the supporting block II (21) facing the stirring plate (27) and is used for changing the position of the stirring plate (27) and stirring surrounding electroplating liquid.

9. The plating device for manufacturing a magnet according to claim 1, wherein the bottom end of the liquid pool (2) is inclined, the liquid inlet (4) is positioned at an inclined upward end of the liquid pool (2), and the liquid outlet (3) is positioned at an inclined downward end of the liquid pool (2) for accelerating the flow of the plating liquid in the liquid pool (2).