CN116403868A - Chip type fuse and production method thereof - Google Patents
Chip type fuse and production method thereof Download PDFInfo
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- CN116403868A CN116403868A CN202111609899.3A CN202111609899A CN116403868A CN 116403868 A CN116403868 A CN 116403868A CN 202111609899 A CN202111609899 A CN 202111609899A CN 116403868 A CN116403868 A CN 116403868A
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- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 98
- 239000000945 filler Substances 0.000 claims abstract description 67
- 239000004005 microsphere Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000011159 matrix material Substances 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 21
- 239000011888 foil Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- 229910010293 ceramic material Inorganic materials 0.000 claims description 10
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- 238000010344 co-firing Methods 0.000 claims description 7
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- 239000002245 particle Substances 0.000 claims 1
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- 238000002360 preparation method Methods 0.000 abstract description 2
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- 239000000758 substrate Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 238000012946 outsourcing Methods 0.000 description 2
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- 230000035939 shock Effects 0.000 description 2
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- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/17—Casings characterised by the casing material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/18—Casing fillings, e.g. powder
- H01H85/185—Insulating members for supporting fusible elements inside a casing, e.g. for helically wound fusible elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention discloses a chip fuse, which comprises an insulating matrix and a fuse link, wherein an end electrode is arranged outside the insulating matrix, the insulating matrix comprises a ceramic shell and a filler, the ceramic shell is inwards recessed from the top wall to form a containing cavity, the fuse link is positioned in the containing cavity, the filler comprises ceramic powder or glass powder, hollow glass microspheres or hollow ceramic microspheres are uniformly distributed in the containing cavity, the filler is filled in the containing cavity and coats the fuse link, and the filler forms part of the upper wall of the chip fuse at the position corresponding to the opening of the containing cavity; the fuse link is a metal wire, a sheet or a foil and is electrically connected with the terminal electrode; the invention also provides a preparation method of the chip fuse; the chip fuse disclosed by the invention has good sealing property, the fuse link has high consistency, the heat conductivity coefficient is low, and the reliability is high.
Description
Technical Field
The invention relates to the field of electric protection elements, in particular to a chip fuse with a monolithic structure.
Background
Fuses are widely used for overcurrent protection of various electronic components. The metal conductor is used as a melt to be connected in series in the circuit, the temperature of the melt can be raised due to the heat converted by the current when the fuse is electrified, and the heat generated by the current and the heat radiated by the melt, the shell, the surrounding environment, and the like in the manners of radiation, convection, conduction and the like can be gradually balanced when the normal working current or the allowable overload current is loaded; if the heat dissipation speed is not equal to the heating speed, the heat can be gradually accumulated on the melt to raise the temperature of the melt, and once the temperature reaches or exceeds the melting point of the melt material, the melt can be liquefied or vaporized, so that the current is disconnected, and the safety protection effect on the circuit and the human body is achieved.
Along with the development of the new energy field, the requirements on battery protection are higher and higher, the fuse is used as a key component, most of the fuse needs to be encapsulated during assembly, and in order to avoid the influence of an internal structure during encapsulation, the high requirements on the tightness of the fuse are set; meanwhile, the automobile is used for more than 10 years, and higher requirements are put on the service life and performance consistency of components.
The surface mount fuses are mainly of two types: hollow structure fuses and solid device fuses. At present, a fuse with a hollow structure mainly adopts a ceramic tube and FR4 as base materials, and the fuse is suspended in an inner cavity, and has the following defects: (1) The ceramic tube fuse adopts lead-containing solder to weld the tube and the end cap, and the fuse taking FR4 as the base material adopts a multilayer lamination mode to laminate the base material and the wire, so that good sealing is difficult to ensure. Ceramic tube fuses are more dependent on process control capabilities, and seriously lead to solder paste penetrating into the cavity, affecting the fusing characteristics and reliability of the fuse. (2) The application of the fuse wire suspended fuse wire in the fields of high-frequency vibration and the like in the prior art is limited to a certain extent, and although the fuse wire suspended structure is favorable for forming a heat-insulating structure, the fuse wire suspended structure is more easy to cause fatigue of fuse wire metal materials under the condition of high-frequency vibration, and long-term work causes failure. (3) As the Sn alloy fuse wire is adopted as the melt, the temperature during arcing is reduced, and the breaking capacity of the breaker is further improved. But this also limits the operating temperature of the fuse, typically not exceeding 125 ℃; FR4 substrate fuses are generally more difficult to apply in higher operating environments due to the Tg point of the substrate (about 155 ℃). It can be seen that the hollow structure fuse does not meet the requirements of the new field for fuses.
The solid device type fuse mainly uses ceramics as a base material, and particularly comprises a monolithic structure and a fuse surface structure, wherein the monolithic structure has the outstanding advantages of good sealing performance and good arc extinguishing capability, and the fuse surface structure has the protruding advantage of low cost. But both also share the following disadvantages: (1) Most solid-state fuses adopt silk screen printing or film technology to form single-metal or bimetal fuses, and the consistency of the fuses is different from that of products using metal wires as fuses to a certain extent. In industries with high requirements on performance consistency and reliability, such as new energy automobiles, servers and the like, the application of the traditional solid-state fuse is limited to a certain extent. (2) The monolithic structure has good sealing performance and arc extinguishing capability, but has high requirements on materials and process control; and the fuse with the fuse surface structure is difficult to ensure sealing, and metal vapor overflows when the fuse is fused or broken, and the overflowed metal vapor is deposited near a high-density pin IC, so that a circuit is easily short-circuited, and secondary damage is generated. Therefore, the existing solid device type fuse cannot meet the requirements of the new field on the fuse.
In the prior art, a ceramic cavity type fuse is arranged in a hollow cavity of an insulating tube, two ends of the melt are led out from two ends of the hollow cavity, arc extinguishing glue is dripped into two end parts of the hollow cavity to fix two ends of the melt, quartz sand is filled in the middle area of the hollow cavity, an insulating cover plate is arranged at a notch position, and the cover plate is mechanically assembled to a housing base through friction joint, other mechanical matching technologies or modes such as an adhesive or a viscose, so that the cover plate is connected with the insulating tube; and (3) dripping solder paste into the end cap, installing the solder paste at two ends of the insulating tube in a close fit manner, and instantly melting the solder paste in the end cap by adopting a welding process to realize connection of the melt and the end cap. The fuse has the following defects: (1) The dripping precision requirement on the arc extinguishing glue is very high, too much glue is dripped, the glue can flow along the fuse wire to pollute the fuse wire, and the fuse wire is carbonized under the overload condition; too little dripping, the fixing and sealing effects cannot be achieved; (2) The requirements on sand filling amount and matching performance between the notch and the insulating cover plate are very high, otherwise, serious sealing performance problems can occur, and the cover plate can be directly blasted under high overload conditions; (3) The fuse shell and the metal cap are assembled one by one, the production efficiency is low, and the connection strength between the shell and the metal cap is difficult to ensure; (4) The connection position of the cover plate and the housing base is a structural weak part, and the sealing characteristic and the structural strength of the fuse are seriously affected.
In view of the foregoing, there is a strong need to provide a fuse that combines the features of high sealability, high operating temperature, good fusing characteristics, high electrical uniformity, and long life reliability.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide the chip fuse with the monolithic structure, which is easy to produce, has high electrical consistency and reliability, and has certain wire-in-air characteristics.
The invention provides a chip fuse, which comprises an insulating matrix and a fuse link, wherein an end electrode is arranged outside the insulating matrix,
the insulating matrix comprises a ceramic shell and a filler, wherein: the ceramic shell is recessed inwards from the top wall to form a containing cavity, the fuse link is positioned in the containing cavity, the filler comprises a matrix material, the matrix material and the ceramic shell are made of the same type of ceramic material, for example, the matrix material and the ceramic shell are made of low-temperature co-fired ceramic powder or glass powder, hollow glass microspheres or hollow ceramic microspheres are uniformly distributed in the matrix material, the filler is filled in the containing cavity and coats the fuse link, and the filler forms part of the upper wall of the chip fuse at the position corresponding to the opening of the containing cavity; the fuse link is a strip-shaped or sheet-shaped metal wire, and the fuse link is electrically connected with the terminal electrode.
The chip fuse provided by the invention, in particular to a surface-mounted chip fuse, wherein a ceramic shell, a fuse link, an end electrode and a filler containing low-temperature co-fired ceramic are tightly connected together to form a monolithic structure, and high-precision metal wires, sheets or foils with higher structural strength and electrical consistency are adopted as a fusing part, so that the chip fuse is stable and reliable. Meanwhile, due to the arrangement of the filler coated fuse link containing the hollow glass microspheres or the hollow ceramic microspheres, the chip fuse has wire-in-air characteristics on the premise of ensuring high structural strength, has good heat insulation effect, and effectively solves the problems of insufficient shock resistance and sealing performance and the like of the traditional hollow fuse.
In some embodiments, two opposite ends of the accommodating cavity are positioning grooves for limiting the fuse link, the accommodating cavity between the two positioning grooves is an accommodating cavity main body, the depth of the top wall of the accommodating cavity main body from the ceramic shell is smaller than or equal to the depth of the top wall of the accommodating cavity main body from the ceramic shell, two opposite ends of the fuse link are respectively positioned in the two opposite positioning grooves, and the width of the positioning groove is slightly larger than the width of the fuse link at the corresponding position.
In some embodiments, the two end electrodes respectively cover the end parts of the chip fuse at the corresponding positions of the positioning grooves, and the fuse body passes through the positioning grooves and is electrically connected with the end electrodes at the corresponding positions.
In some embodiments, a structural reinforcement part is disposed at a corresponding position of the positioning groove, and the silver structural reinforcement part covers the fuse link at the corresponding position and is electrically connected with the terminal electrode.
In some embodiments, the ceramic shell has a thermal conductivity between 1.0-5.0W/mK and the filler has a thermal conductivity between 0.02-2W/mK.
In some embodiments, a side of each positioning groove away from the accommodating cavity body is a side wall formed by the end electrode.
The invention also provides a production method of the chip fuse, which comprises the following steps:
s1, preparing a ceramic shell provided with a containing cavity main body and a locating groove, wherein the containing cavity main body and the locating groove are recessed inwards from a top wall of the ceramic shell, a ceramic green body can be manufactured after ceramic materials are formed, the top wall of the ceramic green body is provided with the containing cavity main body and the locating groove in a machining, laser cutting and other modes to manufacture a shell green body, namely the ceramic shell, or an outsourcing piece can be directly utilized, the prepared base plate of the ceramic shell with the locating groove and the containing cavity main body is used, the two locating grooves are oppositely arranged (including diagonally opposite or opposite to each other, and the locating groove is convenient for locating a fuse body), the containing cavity main body is communicated with the locating groove to form a containing cavity, and the depth of the containing cavity main body is more than or equal to the depth of the locating groove;
s2, arranging a fuse link in the positioning groove, wherein a main body of the fuse link is arranged in the accommodating cavity main body;
s3, filling a filler into the accommodating cavity and curing the filler to obtain a to-be-fired product array, wherein the filler coats the fuse link, the filler comprises a matrix material, the matrix material and the ceramic shell are selected from the same type of ceramic materials, the matrix material can be low-temperature co-firing glass powder or ceramic powder, and the filler also comprises hollow glass microspheres or hollow ceramic microspheres;
s4, separating the array of products to be burned into a plurality of single products to be burned in a cutting-stripping mode;
s5, after the glue of the product to be burned is discharged, sintering the product to be burned to obtain a compact fuse chip, wherein the ceramic green body and the filler are sintered together;
s6, chamfering, upper end burning, silver burning and electroplating are carried out on the fuse chip, and the chip type fuse is manufactured, wherein the filler forms the upper wall of the chip type fuse at the position corresponding to the opening of the accommodating cavity.
In some embodiments, after the step S1 and before the step S2, silver paste is coated in the groove of the positioning groove, so that the silver paste coats both ends of the fuse link in the step S2, and the contact area between the fuse link and the terminal is increased.
In some embodiments, the hollow glass microspheres or the hollow ceramic microspheres in the filler material are present in an amount of between 10-60% by weight.
In some embodiments, the fuse link is a wire or sheet metal & foil, and the fuse has a melting point greater than 900 ℃.
In some embodiments, the material of the surface layer of the fuse link is silver.
In some embodiments, in the step S1, the ceramic shell is formed by molding a low-temperature co-firing ceramic material; in the step S5, the sintering mode is low-temperature co-sintering, so that the filler and the ceramic shell are sintered into a whole at the same time, the connection strength of the filler and the ceramic shell is stronger, and the sealing performance and the structural strength of the chip fuse are higher.
The invention has the beneficial effects that:
compared with the prior art, the chip fuse provided by the invention has the advantages that the ceramic shell, the fuse link, the terminal electrode and the filler containing low-temperature co-fired ceramic are tightly connected together to form a monolithic structure, a cover plate is not needed, and the high-precision metal wire/sheet and foil with higher structural strength and electrical consistency is adopted as the fuse part, so that the chip fuse has higher consistency of electrical characteristics, higher sealing performance and stability and reliability. Meanwhile, the arrangement of the filler coated fuse link containing the hollow glass microspheres or the hollow ceramic microspheres ensures that the chip fuse has wire-in-air characteristics under the premise of ensuring high structural strength, and the ceramic shell and the filler have lower heat conductivity coefficient. The ceramic shell, the fuse wire and the filler are all high-temperature resistant materials, and can be applied to the environment temperature of 150 ℃ or even higher. Compared with the known solid-state fuse, the chip fuse provided by the invention adopts the high-precision metal fuse to replace the silk-screen printing and thin film silk-screen printing processes, so that the fuse defects are greatly reduced, and the process control difficulty is greatly reduced; meanwhile, the used shell material is relatively easier to obtain, has lower requirements on the characteristics of the material, and is easier to realize low-cost and large-scale mass production.
Drawings
Fig. 1 is a schematic view showing a partial sectional structure of a chip fuse in the present invention;
FIG. 2 is a schematic diagram of an explosion structure of a chip fuse according to the present invention;
FIG. 3 is a schematic view of a ceramic housing of a chip fuse of the present invention;
fig. 4 is a schematic view showing a longitudinal section of a chip fuse in the present invention;
FIG. 5 is a schematic cross-sectional view of a chip fuse of the present invention;
fig. 6 is a schematic diagram of a finished structure of a chip fuse according to the present invention.
The invention will be further described with reference to the drawings and detailed description.
Detailed Description
The invention will be further understood by the following specific examples of the invention, which are given by way of illustration and are not intended to be limiting.
Example 1
As shown in fig. 1 to 6, the present embodiment provides a chip fuse, including a ceramic housing 1, a filler 2 and a fuse link 3, wherein the ceramic housing 1 and the filler 2 belong to an insulating substrate of the chip fuse, and an end electrode 4 is disposed outside the insulating substrate, wherein: the ceramic shell 1 is recessed inwards from the top wall to form a containing cavity comprising a positioning groove 5 and a containing cavity main body 6, and the fuse link 2 is positioned in the containing cavity; specifically, the opposite ends of the accommodating cavity are positioning grooves 5 for limiting the fuse link 3, the accommodating cavity between the two positioning grooves 5 is an accommodating cavity main body 6, the depth of the positioning grooves 5 from the top wall 11 of the ceramic shell 1 is less than or equal to the depth of the accommodating cavity main body 6 from the top wall 11 of the ceramic shell 1, the two ends of the fuse link 3 are respectively positioned in the two opposite positioning grooves 5, the width of the positioning grooves 5 is slightly larger than the width of the fuse link 5 at the corresponding position, and the main body part of the fuse link 3 is positioned in the accommodating cavity main body 6.
The material of the ceramic shell 1 can be selected from composite ceramics composed of one or more components such as talcum porcelain, cordierite, forsterite, mullite, alumina, zirconia ceramics, low-temperature co-fired ceramics (LTCC) composed of alumina-glass powder and the like, and compared with the traditional ceramic matrix material for co-firing, the material of the ceramic shell 1 of the chip fuse in the embodiment only needs to provide certain strength, has no other special function and performance requirements, and has wider material selection range. The heat conductivity coefficient of the ceramic shell 1 in the embodiment is between 1.0 and 5.0W/mK, and the material is selected from LTCC, talcum porcelain and forsterite ceramics with low heat conductivity coefficient, so that the chip fuse has good heat insulation effect.
The matrix material of the filler 2 is selected from glass powder or ceramic powder which is consistent with the material of the ceramic shell 1, in the embodiment, the filler 2 comprises low-temperature co-fired ceramic 23, hollow glass microspheres or hollow ceramic microspheres 22 are uniformly distributed in the low-temperature co-fired ceramic 23, the filler is filled in the accommodating cavity and coats the fuse link, and the filler 2 forms the upper wall of the chip fuse at the position corresponding to the opening of part of the accommodating cavity without additionally arranging a cover plate, so that the tightness of the whole chip fuse is ensured; the hollow glass microsphere or hollow ceramic microsphere 22 is made of glass or ceramic, and contains a cavity inside, so that the heat conductivity coefficient of the filler 2 (between 0.02 and 2W/mK) is reduced to be close to that of air, thereby realizing wire-in-air characteristics and having good heat insulation effect. In this embodiment, the hollow glass microspheres or hollow ceramic microspheres in the filler material 2 are 10-60 wt%, and the sintering temperature of the filler material 2 is lower than 920 ℃.
The fuse link 3 is a strip or sheet high-precision metal wire, metal sheet or metal foil, the metal adopted by the fuse link can bear the sintering temperature of 850-900 ℃, the surface material of the fuse link 3 in the embodiment is silver, the material is silver or silver-coated alloy, the melting point of the fuse link 3 is higher than 900 ℃, and the fuse link is electrically connected with the terminal electrode.
The two end electrodes respectively cover the end parts of the chip fuse at the corresponding positions of the positioning grooves, and the fuse body passes through the positioning grooves and is electrically connected with the end electrodes at the corresponding positions.
The side of each positioning groove 5 away from the accommodating cavity body 6 is a side wall formed by the terminal electrode 4.
The production method of the chip fuse of the embodiment comprises the following steps:
s1, forming a ceramic green body by adopting a ceramic material forming method which is not limited by slip casting, injection molding, LTCC (low temperature co-fired ceramic) forming technology and UV (ultraviolet) coating method, and forming a containing cavity main body 6 and a positioning groove 5 on the top wall of the ceramic green body in a machining or laser cutting mode to obtain a shell green body, namely a ceramic shell, wherein the two positioning grooves 5 are oppositely arranged, the containing cavity main body 6 is communicated with the positioning grooves 5 to form a containing cavity, and the depth of the containing cavity main body is larger than that of the positioning grooves;
s2, arranging a silver fuse wire as a fuse link 3 in the positioning groove 5, wherein the main body of the fuse link is arranged in the accommodating cavity main body;
s3, filling a filler into the accommodating cavity and curing the filler in a UV (ultraviolet) light curing or heat curing mode to obtain a to-be-fired product array, wherein the filler coats the fuse link, the filler comprises co-fired ceramic powder as a matrix material, the matrix material and a ceramic shell are made of the same type of ceramic material, and the filler further comprises hollow glass microspheres or hollow ceramic microspheres;
s4, separating the array of products to be burned into a plurality of single products to be burned in a cutting-stripping mode;
s5, after the glue of the product to be burned is discharged, sintering the product to be burned in a low-temperature co-firing mode to obtain a compact-structure fuse chip, wherein the ceramic green body and the filler are sintered together;
s6, chamfering, upper end burning, silver plating processes are carried out on the fuse chips, so that a plurality of chip fuses which can be used for internal and external conduction and used for welding are manufactured, wherein the filler forms the upper wall of the chip fuse at the position corresponding to the opening of the accommodating cavity.
Example two
The difference between the chip fuse provided in this embodiment and the first embodiment is that a silver paste (not shown) is poured into the corresponding position of the positioning slot 5 to form a structural reinforcement portion, the silver structural reinforcement portion wraps the fuse link 3 at the corresponding position and is electrically connected with the terminal electrode 4, so as to increase the contact area between the fuse link and the terminal, and ensure the reliability of the electrical connection between the fuse link 3 and the terminal electrode 4.
The production method of the chip fuse of the embodiment comprises the following steps:
s1, forming a ceramic green body by adopting a ceramic material forming method which is not limited by slip casting, injection molding, LTCC (low temperature co-fired ceramic) forming technology and UV (ultraviolet) coating method, forming a containing cavity main body and a positioning groove on the top wall of the ceramic green body in a machining mode to obtain a shell green body, wherein the two positioning grooves are oppositely arranged, the containing cavity main body is communicated with the positioning groove to form a containing cavity, and the depth of the containing cavity main body is larger than that of the positioning groove;
pouring/coating silver paste at the corresponding position of the positioning groove;
s2, arranging the fuse link in the positioning groove, wherein silver paste coats two ends of the fuse link 3, and a main body of the fuse link is arranged in the accommodating cavity main body;
s3, filling a filler into the accommodating cavity and curing the filler to obtain a to-be-fired product array, wherein the filler coats the fuse link, the filler comprises co-fired ceramic powder, and the filler also comprises hollow glass microspheres or hollow ceramic microspheres;
s4, curing the filler by means of UV light curing or heat curing;
s5, separating the array of products to be burned into a plurality of single products to be burned in a cutting-stripping mode;
s6, after the glue of the product to be burned is discharged, sintering the product to be burned in a low-temperature co-firing mode to obtain a compact-structure fuse chip, wherein the ceramic green body and the filler are sintered together;
s7, chamfering, upper end burning, silver burning and electroplating are carried out on the fuse chip, so that the chip type fuse which can be used for internal and external conduction and welding is manufactured, wherein the filler forms the upper wall of the chip type fuse at the position corresponding to the opening of the accommodating cavity.
Example III
The difference between the chip fuse provided in the present embodiment and the first embodiment is that in step S1 of the preparation method, the ceramic housing directly uses an outsourcing member and a prepared substrate of the ceramic housing including a positioning groove and a receiving cavity main body; in step S5, after the glue is removed from the product to be fired, sintering the product to be fired to obtain a compact fuse chip, wherein the ceramic green body and the filler are sintered together.
The chip fuse provided by the invention has the advantages that the ceramic shell, the fuse link, the terminal electrode and the filler containing low-temperature co-fired ceramic are tightly connected together to form a monolithic structure, a cover plate is not needed, and the high-precision metal wire, the sheet and the foil with higher structural strength and electrical consistency are adopted as the fusing part, so that the chip fuse has higher electrical characteristic consistency, higher sealing performance and stability and reliability. Meanwhile, due to the arrangement of the filler coated fuse link containing the hollow glass microspheres or the hollow ceramic microspheres, the chip fuse has the wire-in-air characteristic on the premise of ensuring high structural strength, the heat conductivity coefficients of the ceramic shell and the filler are low, a good heat insulation effect is achieved, and the problems of shock resistance, insufficient sealing performance and the like of the traditional hollow fuse are effectively solved. The ceramic shell, the fuse wire and the filler are all high-temperature resistant materials, and can be applied to the environment temperature of 150 ℃ or even higher. Compared with the known solid-state fuse, the chip fuse provided by the invention adopts the high-precision metal fuse to replace the silk-screen printing and thin film silk-screen printing processes, so that the fuse defects are greatly reduced, and the process control difficulty is greatly reduced; meanwhile, the used shell material is relatively easier to obtain, has lower requirements on the characteristics of the material, and is easier to realize low-cost and large-scale mass production.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the claims, which follow, as defined in the claims.
Claims (10)
1. The utility model provides a chip fuse, includes insulating base member, fuse-link, the outside of insulating base member is provided with terminal electrode, its characterized in that:
the insulating matrix comprises a ceramic shell and a filler, wherein:
the ceramic shell is recessed inwards from the top wall to form a containing cavity, the fuse link is positioned in the containing cavity,
the filler comprises a matrix material and the ceramic shell is selected from the same type of ceramic material, wherein hollow glass microspheres or hollow ceramic microspheres are uniformly distributed in the matrix material, the filler is filled in the accommodating cavity and coats the fuse link, and the filler forms the upper wall of the chip fuse at the position corresponding to the opening of part of the accommodating cavity;
the fuse link is a metal wire, a metal sheet or a metal foil, and the fuse link is electrically connected with the terminal electrode.
2. The chip fuse of claim 1, wherein two opposite ends of the accommodating cavity are positioning grooves for limiting the fuse link, the accommodating cavity between two positioning grooves is an accommodating cavity main body, the depth of the positioning groove from the top wall of the ceramic housing is less than or equal to the depth of the accommodating cavity main body from the top wall of the ceramic housing, and two ends of the fuse link are respectively positioned in two opposite positioning grooves.
3. The chip fuse of claim 2, wherein two of the terminal electrodes respectively cover an end of the chip fuse at a corresponding position of the positioning slot, and the fuse body passes through the positioning slot and is electrically connected with the terminal electrode at the corresponding position.
4. The chip fuse of claim 2, wherein the corresponding position of the positioning slot is provided with a structural reinforcement portion, and the silver structural reinforcement portion wraps the fuse link at the corresponding position and is electrically connected with the terminal electrode.
5. The chip fuse of claim 1, wherein the ceramic housing has a thermal conductivity between 1.0-5.0W/m.k and the filler has a thermal conductivity between 0.02-2W/m.k.
6. A method of producing a chip fuse, comprising the steps of:
s1, preparing a ceramic shell provided with a containing cavity main body and a positioning groove, wherein the containing cavity main body and the positioning groove are formed by recessing inwards from a top wall of the ceramic shell, the containing cavity main body is communicated with the positioning groove to form a containing cavity, and the depth of the containing cavity main body is more than or equal to the depth of the positioning groove;
s2, arranging a fuse link in the positioning groove, wherein a main body of the fuse link is arranged in the accommodating cavity main body;
s3, filling a filler into the accommodating cavity and curing the filler to obtain a to-be-fired product array, wherein the filler coats the fuse link, the filler comprises a matrix material, the matrix material and the ceramic shell are selected from the same type of ceramic materials, and the filler further comprises hollow glass microspheres or hollow ceramic microspheres;
s4, separating the array of products to be burned into a plurality of single products to be burned in a cutting-stripping mode;
s5, after the glue of the product to be burned is discharged, sintering the product to be burned to obtain a compact fuse chip, wherein the ceramic green body and the filler are sintered together;
s6, performing upper end, silver burning and electroplating processes on the fuse chip to obtain the chip type fuse, wherein the filler forms the upper wall of the chip type fuse at the position corresponding to the opening of the accommodating cavity.
7. The method of manufacturing a chip fuse according to claim 6, wherein silver paste is poured into the positioning groove after the step S1 and before the step S2.
8. The method of producing a chip fuse according to claim 6, wherein the hollow glass microspheres or the hollow ceramic microspheres in the filler material are contained in an amount of 10 to 60% by weight, and the microsphere particle size is 0.1 to 200 μm.
9. The method of claim 6, wherein the fuse link is a wire, a sheet metal, or a foil, and the melting point of the fuse link is greater than 900 ℃.
10. The method for producing a chip fuse in accordance with claim 9, wherein in said step S1, a ceramic housing is formed of a low-temperature co-firing ceramic material; in the step S5, the sintering mode is low-temperature co-firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111609899.3A CN116403868A (en) | 2021-12-27 | 2021-12-27 | Chip type fuse and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111609899.3A CN116403868A (en) | 2021-12-27 | 2021-12-27 | Chip type fuse and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116403868A true CN116403868A (en) | 2023-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111609899.3A Pending CN116403868A (en) | 2021-12-27 | 2021-12-27 | Chip type fuse and production method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN116403868A (en) |
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2021
- 2021-12-27 CN CN202111609899.3A patent/CN116403868A/en active Pending
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