CN116393788A - Self-locking type tube plate argon arc welding structure of semiconductor equipment parts - Google Patents
Self-locking type tube plate argon arc welding structure of semiconductor equipment parts Download PDFInfo
- Publication number
- CN116393788A CN116393788A CN202310177634.3A CN202310177634A CN116393788A CN 116393788 A CN116393788 A CN 116393788A CN 202310177634 A CN202310177634 A CN 202310177634A CN 116393788 A CN116393788 A CN 116393788A
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- China
- Prior art keywords
- argon arc
- arc welding
- welding structure
- self
- bottom plate
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- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 70
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910052786 argon Inorganic materials 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 229910000856 hastalloy Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 7
- 210000001503 joint Anatomy 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/16—Arc welding or cutting making use of shielding gas
Abstract
The invention provides a self-locking type tube plate argon arc welding structure of a semiconductor device part, which comprises a bottom plate and a branch pipe; the joint is in the form of a butt joint or an angle joint, and is an argon arc welding structure. A plurality of semi-continuous bosses are designed below the branch pipes, grooves and grooves are formed in the plates, and the grooves are matched with the semi-continuous bosses of the branch pipes to realize a self-locking function. The structure of the invention is a typical argon arc welding structure, is suitable for the field of precise parts of semiconductor equipment, can greatly reduce welding deformation by the design of the welding line position, ensures the perpendicularity of a tube plate, has good structural rigidity and high strength, and is a structural form of matching mechanical connection and welding. Can be widely applied to various welding products and welding components.
Description
Technical Field
The invention relates to the field of semiconductor equipment parts, in particular to a self-locking type tube plate argon arc welding structure of the semiconductor equipment parts. The device is mainly used for tube plate parts of semiconductor equipment, such as a heating device, a spraying device, a gas supply device and the like. The self-locking type tube plate welding structure can effectively reduce welding deformation, reduce the use of a tool, has high welding efficiency, and ensures the dimensional accuracy requirement of welded branch pipes and bottom plates.
Background
The semiconductor device parts have the characteristics of high precision, high cleanliness, high corrosion resistance, high breakdown voltage resistance and the like compared with the conventional parts and the like. Therefore, the manufacturing process is more strictly required, and high-cleanness precise manufacturing is an important link. For precision parts, welding distortion has been an important factor in theoretical design and manufacturing variations. In cavity type welding products, although post-welding finish machining can reach the tolerance required by the external dimension, the internal dimension of the cavity cannot be machined after welding, the deviation cannot be measured, and the deviation is quite different from the theoretical design, the deviation is quite often deviated from the design, the consistency of the product is quite poor, and the deviation value is quite discrete, so that the product is quite often required to be optimized in an iteration mode, and other process performance parameter optimization is carried out after the on-machine test to overcome manufacturing deviation.
Tube sheet structures are more common in the field of semiconductor devices and are commonly designed as gas conveying members or heating members, and because certain functional surfaces are matched with other members, the dimensional tolerance of the tube sheet structures influences the final use performance or assembly precision, so that the precision and the dimensional tolerance are higher, and the welding quality of the structures is higher. The argon arc welding is a common welding process method for welding parts of semiconductor equipment, and compared with the gas shielded welding or manual arc welding of a consumable electrode, the argon arc welding has no splashing, beautiful welding bead forming and high quality stability. The welding quality requirement of the semiconductor equipment parts is higher, the requirement on deformation is high, and the requirement on cleanliness is high, so that reasonable structural design and process method selection are important preconditions for quality assurance. The self-locking type argon arc welding structure of the tube plate can increase the rigidity of the component, ensure the stability of the part, reduce the welding deformation and improve the manufacturing efficiency and quality of the part.
Disclosure of Invention
The invention aims to provide a self-locking type tube plate argon arc welding structure of a semiconductor device part, in particular to a self-locking structure design, which can realize the high-precision and high-quality welding requirement by combining machinery and welding.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a self-locking tube plate argon arc welding structure of a semiconductor device part comprises a bottom plate and a branch tube. The material can be stainless steel, aluminum alloy, high-temperature alloy, titanium alloy, nickel-based alloy, hastelloy and the like. The bottom plate is provided with a groove with insertion at the matching position of the bottom plate and the pipe, a groove is provided at the groove position, an annular groove is provided below the groove, and the shape of the groove is as claimed in the claims, and the groove can be T-shaped groove matching, circular groove matching, dovetail groove matching and the like. The back of the bottom plate can be beveled to form a beveled weld with the branch pipe or not beveled to form an angled weld with the branch pipe. The branch pipe is designed to be provided with a boss below the pipe, and the boss is matched with the groove of the bottom plate in shape. The bottommost end of the branch pipe can be beveled or not beveled, and a beveled weld joint and a fillet weld are respectively formed with the bottom plate. And (3) respectively heating or cooling the tube plates to enable the tube plates and the tube plates to reach a preset temperature difference, assembling, and welding the assembled parts by adopting a welding process method of argon arc welding. Therefore, the accuracy requirements of the verticality, the size and the like of the parts are ensured.
The invention has the beneficial effects that:
1. the invention is suitable for structural design of semiconductor equipment parts, and has good rigidity and high structural strength.
2. The partial compressive stress existing in the interference assembly counteracts the tensile stress generated by partial welding, and the welding deformation is small and the dimensional stability is good.
3. The invention omits a complex welding tool, has precise self-positioning and no interference in the welding process.
Drawings
Fig. 1 is a perspective view of the structure of the base plate of the invention.
Fig. 2 is a front view of the floor structure of the invention.
FIG. 3 is a second elevation view of the base plate structure of the invention.
Fig. 4 is a schematic diagram of a manifold of the invention.
Fig. 5 is a schematic cross-sectional view of one of the branch pipes of the invention.
FIG. 6 is a second schematic cross-sectional view of the branch pipe of the present invention.
Fig. 7 is an assembled perspective view of the tube sheet of the invention.
FIG. 8 is a schematic illustration of an inventive tube sheet assembly.
FIG. 9 is a second schematic view of the tube sheet assembly of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clear, the present invention will be described in further detail with reference to specific embodiments.
Referring to the accompanying drawings 1-9, the argon arc welding structure of the self-locking tube plate of the semiconductor equipment component comprises a bottom plate and a branch pipe, wherein the branch pipe is connected with the bottom plate in a self-locking way; the shape of the bottom plate can be a polygon such as a circle, an ellipse, a rectangle, a square, a triangle, a hexagon and the like, and the shape of the bottom plate is not exhaustive; the branch pipes can be in the shape of a cylinder, a cone, a round table and the like, and the shape is not exhaustive; the bottom of the branch pipe can be beveled or not beveled.
The shape of the bottom groove 201 of the branch pipe 2 can be a V-shaped groove or a J-shaped groove, or no blunt edge; the bevel angle at the bottom of the branch pipe can be 10-90 degrees.
The base plate and the branch pipe are matched with each other in an interference fit or transition fit or clearance fit.
The interference fit quantity of the bottom plate and the branch pipe is less than 0.2mm; when the tube plates are in interference fit, cold fitting or hot fitting is needed in the assembly process of the tube plates; the temperature difference between the two is 50-400 ℃.
The clearance between the bottom plate and the branch pipe is 0.001mm to 0.5mm.
The matching positions of the bottom plate 1 and the branch pipes 2 are set as ring grooves 101, the ring grooves 101 can be made into T-shaped groove matching, round groove matching and dovetail groove matching, the shapes of various grooves are not listed, and the two grooves are matched through a groove with a certain shape.
The upper surface of the bottom plate is designed with an equal or unequal intermittent groove 102, and the groove 102 can be in the form of a U-shaped groove, a V-shaped groove, with or without a blunt edge.
The lower surface of the bottom plate can be provided with a bevel or not provided with a bevel to form a fillet weld with the pipe; if the groove is designed, the groove can be in a V-shaped groove or a U-shaped groove.
The bottom plate and the support plate material can be aluminum alloy, stainless steel, titanium alloy, nickel-based alloy and hastelloy.
The whole structure can be processed into the required shape and size after welding or without secondary processing.
The implementation steps are as follows:
(1) Checking the parts, and detecting that the matching dimensional tolerance of the parts meets the requirements;
(2) Cleaning the parts to remove pollutants such as surface oxide films, greasy dirt, dust and the like;
(3) Heating the cover plate or subjecting the tube to liquid nitrogen freezing to achieve the temperature difference of the claims;
(4) Inserting the pipe into the bottom plate according to the opening position, and rotating until the opening position of the pipe is aligned with the groove position of the bottom plate;
(5) Waiting for the assembled part to return to room temperature;
(6) And (3) spot-welding the parts, namely spot-welding the welding positions below the bottom plate, and spot-welding the groove positions above the bottom plate. The number of welding spots is 1-20 points;
(7) Welding parts, namely welding a groove welding seam on the upper surface of the bottom plate or welding a groove or a fillet welding seam on the lower surface of the bottom plate;
(8) Performing weld quality inspection and size inspection;
(9) With or without secondary processing.
Claims (10)
1. The utility model provides a semiconductor equipment spare part auto-lock formula tube sheet argon arc welded structure which characterized in that:
comprises a bottom plate and a branch pipe, wherein the branch pipe is connected with the bottom plate in a self-locking way;
the shape of the bottom plate can be a polygon such as a circle, an ellipse, a rectangle, a square, a triangle, a hexagon and the like, and the shape of the bottom plate is not exhaustive;
the branch pipes can be in the shape of a cylinder, a cone, a round table and the like, and the shape is not exhaustive;
the bottom of the branch pipe can be beveled or not beveled.
2. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that:
the shape of the bevel at the bottom of the branch pipe can be a V-shaped bevel or a J-shaped bevel, or no blunt edge exists; the bevel angle at the bottom of the branch pipe can be 10-90 degrees.
3. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that: the base plate and the branch pipe are matched with each other in an interference fit or transition fit or clearance fit.
4. A semiconductor device component self-locking tube sheet argon arc welding structure according to claim 3, wherein: the interference fit quantity of the bottom plate and the branch pipe is less than 0.2mm; when the tube plates are in interference fit, cold fitting or hot fitting is needed in the assembly process of the tube plates; the temperature difference between the two is 50-400 ℃.
5. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that: the clearance between the bottom plate and the branch pipe is 0.001mm to 0.5mm.
6. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that: the matching positions of the bottom plate and the branch pipes can be made into T-shaped groove matching, round groove matching and dovetail groove matching, the shapes of various grooves are not listed, and the two grooves are matched through a groove with a certain shape.
7. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that:
the upper surface of the bottom plate is designed with an equal or unequal intermittent groove, and the groove can be a U-shaped groove, a V-shaped groove or a blunt edge.
8. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that:
the lower surface of the bottom plate can be provided with a bevel or not provided with a bevel to form a fillet weld with the pipe; if the groove is designed, the groove can be in a V-shaped groove or a U-shaped groove.
9. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that:
the bottom plate and the support plate material can be aluminum alloy, stainless steel, titanium alloy, nickel-based alloy and hastelloy.
10. The argon arc welding structure of the self-locking tube plate of the semiconductor equipment part according to claim 1, wherein the argon arc welding structure is characterized in that:
the whole structure can be processed into the required shape and size after welding or without secondary processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310177634.3A CN116393788A (en) | 2023-02-28 | 2023-02-28 | Self-locking type tube plate argon arc welding structure of semiconductor equipment parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310177634.3A CN116393788A (en) | 2023-02-28 | 2023-02-28 | Self-locking type tube plate argon arc welding structure of semiconductor equipment parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116393788A true CN116393788A (en) | 2023-07-07 |
Family
ID=87008240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310177634.3A Pending CN116393788A (en) | 2023-02-28 | 2023-02-28 | Self-locking type tube plate argon arc welding structure of semiconductor equipment parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116393788A (en) |
-
2023
- 2023-02-28 CN CN202310177634.3A patent/CN116393788A/en active Pending
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