CN116372403A - Jig for reducing deformation applied to mobile phone SUS processing and process thereof - Google Patents
Jig for reducing deformation applied to mobile phone SUS processing and process thereof Download PDFInfo
- Publication number
- CN116372403A CN116372403A CN202310523889.0A CN202310523889A CN116372403A CN 116372403 A CN116372403 A CN 116372403A CN 202310523889 A CN202310523889 A CN 202310523889A CN 116372403 A CN116372403 A CN 116372403A
- Authority
- CN
- China
- Prior art keywords
- jig
- processing
- sus
- mobile phone
- rear cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000001179 sorption measurement Methods 0.000 claims abstract description 55
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims description 9
- 238000001125 extrusion Methods 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 description 9
- 238000003698 laser cutting Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 206010010904 Convulsion Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
The invention provides a fixture for reducing deformation applied to mobile phone SUS processing and a process thereof, wherein the fixture comprises: the jig comprises a jig workbench, wherein a plurality of jig plates for bearing products are arranged on the jig workbench; the rear cover is arranged at the bottom of the jig workbench, and a cavity is formed in the rear cover; the vacuum adsorption system is arranged in the rear cover and is used for carrying out vacuum adsorption on products borne on the jig plate; the air draft system connector is arranged on the rear cover and used for being connected with an external air draft system to perform air draft cooling on products borne on the jig plate; through being provided with vacuum adsorption system, can closely adsorb on the tool through going to whole product edge on the tool board, prevent that the product from removing, it is more firm to adsorb, reduces the deformation that the thermal expansion of product produced, and adsorption system passes through adjustable device, and control vacuum pressure can avoid the product to produce extrusion deformation when adsorbing.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a jig for reducing deformation applied to mobile phone SUS processing and a process thereof.
Background
In the process of SUS laser cutting, more intensive processing is accompanied by modification, and currently, existing SUS cutting in the market is mostly carried out in two ways, namely, a saw-tooth-shaped support is added below the SUS plate, and a peripheral compression way is adopted. The method is suitable for sheet metal machining, has low requirement on product surface protection, and cannot control heat influence deformation in machining. The second mode is suitable for processing partial thin plates, improves deformation to a certain extent, is limited to scattered small pattern processing, and has low utilization rate.
In the conventional cutting technique, the product is deformed by heating during laser cutting, and the heated edge of the product is warped, shrunk in size, and the like.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention provides a jig for reducing deformation applied to mobile phone SUS processing and a process thereof, which solve the problems that in the prior art, in the traditional cutting technology, a product is deformed when being heated during laser cutting, the heated edge of the product is warped, the size of the heated edge is contracted and the like.
According to an embodiment of the present invention, a fixture for reducing deformation applied to SUS processing of a mobile phone is characterized by comprising: the jig comprises a jig workbench, wherein a plurality of jig plates for bearing products are arranged on the jig workbench; the rear cover is arranged at the bottom of the jig workbench, and a cavity is formed in the rear cover; the vacuum adsorption system is arranged in the rear cover and is used for carrying out vacuum adsorption on products borne on the jig plate; the exhaust system connector is arranged on the rear cover and used for being connected with an external exhaust system to exhaust and cool products borne on the jig plate.
Preferably, the middle position of the jig plate is provided with an adsorption through hole, and the adsorption through hole penetrates through the jig plate.
Preferably, the profile of the jig plate is shrunk by 0.3mm-1mm from the profile of the product.
Preferably, the jig plate is provided with an air passage guide groove, and the adsorption through hole is positioned at the middle position of the air passage guide groove and is mutually communicated with the air passage guide groove.
Preferably, a plurality of groove edges are fixedly connected to the periphery of the jig plate, and the depth of each groove edge is greater than 5mm.
Preferably, a plurality of hollowed-out grooves are formed in the periphery of the jig plate, and the hollowed-out grooves are located on one side of the groove edge.
Preferably, the vacuum adsorption system comprises: the number of the tee joints is the same as that of the jig plates, and the top end joints of the tee joints are fixedly connected with the adsorption through holes in the jig plates in sequence; the vacuum pipeline is fixedly communicated with a plurality of three-way connectors in sequence to form a closed loop; the pipeline joint is fixedly communicated with the vacuum pipeline through a pipeline.
Preferably, the exhaust system connector is in communication with the interior cavity of the rear cover.
Preferably, the rear cover is provided with a vacuum adsorption interface, and the vacuum adsorption interface is positioned at one side of the joint of the air draft system.
The process for reducing deformation applied to mobile phone SUS processing is characterized by comprising the following steps:
s1: placing a large piece of raw material on a jig plate and positioning the raw material by leaning against a positioning block;
s4: starting vacuum adsorption, and adsorbing the raw material on a jig plate;
s3: starting a cooling and air exhausting system;
s4: starting the laser processing equipment, and processing and producing according to the prefabricated pattern.
Compared with the prior art, the invention has the following beneficial effects: the vacuum adsorption system is arranged, so that the edge of the whole product on the jig plate can be tightly attached to the jig, the movement of the product is prevented, the adsorption is firmer, the deformation caused by the thermal expansion of the product is reduced, the vacuum pressure is controlled by the adsorption system through the adjustable device, and the extrusion deformation of the product during adsorption can be avoided; through setting up the exhaust system joint, can transfer partial heat to bottom tool board to the laminating of product edge and tool board and cool down, reduce the piling up and the heated size shrink of edge ablation, through adopting the processing method of this invention technology, can realize laser cutting cell-phone SUS does not have thermal deformation (warpage), and dislocation size deviation does not have, and the cutting effect is stable, and the disposable shaping need not aftertreatment, the obvious advantage of greatly reduced human cost.
Drawings
Fig. 1 is a schematic side view of the present invention.
Fig. 2 is a top view of the structure of fig. 1.
Fig. 3 is an enlarged schematic view of the structure at a in fig. 2.
Fig. 4 is a schematic view of the internal structure of the bottom of the jig table in fig. 1 (with the back cover removed).
In the above figures: 1. a jig workbench; 2. a jig plate; 3. a rear cover; 4. a vacuum adsorption system; 41. a three-way joint; 42. a vacuum pipeline; 43. a pipe joint; 5. an exhaust system joint; 6. adsorption through holes; 7. an airway guide slot; 8. a groove edge; 9. a hollow groove; 10. vacuum adsorption interface.
Detailed Description
The technical scheme of the invention is further described below with reference to the accompanying drawings and examples.
As shown in fig. 1 and fig. 4, an embodiment of the present invention provides a jig for reducing deformation applied to SUS processing of a mobile phone, which is characterized by comprising:
the jig comprises a jig workbench 1, wherein a plurality of jig plates 2 for bearing products are arranged on the jig workbench 1;
the rear cover 3 is arranged at the bottom of the jig workbench 1, and a cavity is formed in the rear cover 3;
the vacuum adsorption system 4 is arranged in the rear cover 3, and the vacuum adsorption system 4 is used for carrying out vacuum adsorption on the product borne on the jig plate 2;
the air draft system connector 5 is arranged on the rear cover 3 and used for being connected with an external air draft system to perform air draft cooling on products borne on the jig plate 2.
In the embodiment, the vacuum adsorption system 4 is arranged, so that the whole edge of the product on the jig plate 2 can be tightly adhered to the jig, the product is prevented from moving, the adsorption is more firm, the deformation generated by the thermal expansion of the product is reduced, the vacuum pressure is controlled by the adsorption system through the adjustable device, and the extrusion deformation of the product during adsorption can be avoided; through setting up ventilation system joint 5, can laminate product edge and tool board 2 and pass partial heat to the bottom tool board and cool down, reduce the accumulation and the heated size shrink of edge ablation.
Further as shown in fig. 2 and 3, an adsorption through hole 6 is formed in the middle of the jig plate 2, and the adsorption through hole 6 penetrates through the jig plate 2.
In this embodiment, through being provided with the absorption through-hole 6 in the intermediate position department of tool board 2 for link to each other with bottom vacuum adsorption system 4, conveniently carry out the absorption through-hole 6 to the product that bears on the tool board 2 and fix.
In addition, as shown in fig. 2 and 3, the profile of the jig plate 2 is 0.3mm-1mm smaller than the product profile.
In this embodiment, through being provided with tool board 2, tool board 2 adopts the profile modeling design, carries out the profile modeling according to the product outline, as shown in fig. 3, the tool is more than product outline shrink 0.3mm-1mm to be suitable, if be greater than more than 1mm panel thickness and be less than 0.05mm can appear adsorbing the sunk, be less than 0.3mm can appear the course of working and remain, and increase the counterpoint degree of difficulty, adopts the profile modeling design through tool board 2, and the highest 96% -98% (the frame loss is only left limit 3 mm) of product utilization ratio. Compared with the traditional clamping jig, the processing is improved by more than 10%, and the product utilization rate is greatly improved.
In addition, as shown in fig. 3, the jig plate 2 is provided with an air passage guide groove 7, and the adsorption through hole 6 is positioned at the middle position of the air passage guide groove 7 and is mutually communicated.
In this embodiment, through being provided with air flue guide slot 7, the vacuum adsorption is the face absorption, as shown in fig. 3, air flue guide slot 7 is along on a week on the tool board 2, middle makes whole air flue guide slot 7 be linked together with adsorb through-hole 6 through the cross guide slot, extend through the guide slot, paste closely whole product edge through going on adsorbing on the tool board 2, prevent that the product from moving, be linked together through adsorb through-hole 6 and air flue guide slot 7, under vacuum adsorption system 4 evacuation effect, air in the air flue guide slot 7 is evacuated, air flue guide slot 7 can adsorb the product on the tool board 2, adsorb more firm, the deformation that thermal expansion produced when greatly reduced product processing.
Specifically, as shown in fig. 3, a plurality of groove edges 8 are fixedly connected around the jig plate 2, and the depth of the groove edges 8 is greater than 5mm.
In this embodiment, through set up a plurality of slot limit 8 around tool board 2, fix each other with adjacent tool board 2 or tool workstation 1 through a plurality of slot limit 8, wherein the degree of depth of slot limit 8 is greater than 5mm, if the slot cut degree of depth is less than 5mm can appear the slag phenomenon that returns in the course of working, influences the surface cleanliness.
It should be noted that, as shown in fig. 3 and fig. 4, a plurality of hollow grooves 9 are formed around the jig plate 2, and the hollow grooves 9 are located at one side of the groove edge 8.
In this embodiment, through offer a plurality of fretwork groove 9 around tool board 2, in the laser processing process, laser can penetrate the former material and ablate tool board 2 to former material lower part, consequently need set up fretwork groove 9, dodge the processing to the laser, dodge and adopt fretwork processing all around.
Further as shown in fig. 4, the vacuum adsorption system 4 includes:
the three-way connectors 41, the number of the three-way connectors 41 is the same as that of the jig plates 2, and the top connectors of the three-way connectors 41 are fixedly connected with the adsorption through holes 6 on the jig plates 2 in sequence;
the vacuum pipeline 42 is sequentially fixedly communicated with a plurality of three-way connectors 41 to form a closed loop;
the pipeline joint 43, the pipeline joint 43 is fixedly communicated with the vacuum pipeline 42 through a pipeline.
In this embodiment, through being provided with three way connection 41, a plurality of three way connection 41 respectively with the fixture board 2 on adsorb the through-hole 6 fixed in proper order, wherein a plurality of three way connection 41 loops through vacuum pipe 42 fixed intercommunication, form closed return circuit passageway, pass through pipe connection 43 and vacuum pipe 42 fixed intercommunication, connect outside vacuum pump through pipe connection 43, pass through outside vacuum pump and take out vacuum in the vacuum pipe 42 through pipe connection 43, wherein vacuum pipe 42 passes through three way connection 41 intercommunication adsorb the through-hole 6, when outside vacuum pump work, can be to evacuating the air in the air flue guide slot 7 that adsorbs the through-hole 6 intercommunication on the fixture board 2, the air flue guide slot 7 can adsorb the product on the fixture board 2, wherein vacuum adsorption system 4 can pass through outside vacuum pump, control vacuum pressure, can avoid the product to produce extrusion deformation when adsorbing.
Further as shown in fig. 1, the suction system connector 5 communicates with the interior cavity of the rear cover 3.
In this embodiment, connect 5 through setting up the exhaust system, connect 5 through the exhaust system and connect outside exhaust system, wherein the back lid 3 is inside to be the cavity, exhaust system connects 5 and cavity are linked together, the hollow groove 9 has been seted up around tool board 2, when outside exhaust system opens, can cool down through cooling down in the cavity, can carry out bottom convulsions cooling to the product on the tool board 2 through the heat conduction, make hollow groove 9 form forced air cooling backward flow simultaneously and cool down to the product, through setting up exhaust system and connect 5, can cool down to product edge and tool board 2 laminating with partial heat transfer to bottom tool board, reduce the accumulation of edge ablation.
Further as shown in fig. 1, a vacuum adsorption interface 10 is arranged on the rear cover 3, and the vacuum adsorption interface 10 is positioned on one side of the joint 5 of the exhaust system.
In this embodiment, by providing the vacuum adsorption port 10, the vacuum adsorption system 4 in the cavity is conveniently connected to the external vacuum pump, and the pipe joint 43 is conveniently connected.
On the other hand, the embodiment of the invention also provides a jig process method for reducing deformation applied to mobile phone SUS processing, which comprises the following steps:
s1: placing a large piece of raw material on the jig plate 2, and positioning by leaning against the positioning block;
s2: starting vacuum adsorption, and adsorbing the raw materials on the jig plate 2;
s3: starting a cooling and air exhausting system;
s4: starting the laser processing equipment, and processing and producing according to the prefabricated pattern.
In the implementation process of the invention, a large piece of raw materials are placed on the jig plate 2, an external vacuum pump is connected, vacuum is pumped in a vacuum pipeline 42 through a pipeline joint 43 by the external vacuum pump, the vacuum pipeline 42 is communicated with an adsorption through hole 6 through a three-way joint 41, when the external vacuum pump works, air in an air passage guide groove 7 communicated with the adsorption through hole 6 on the jig plate 2 can be pumped out, the air passage guide groove 7 can adsorb a product on the jig plate 2, the external air suction system is connected through an air suction system joint 5, a cooling air suction system is started, the product on the jig plate 2 can be cooled by cooling the cavity, the bottom of the product can be sucked and cooled through heat conduction, and meanwhile, the hollow groove 9 forms air cooling reflux to cool the product by air suction, laser processing equipment is started, and processing production is carried out according to a prefabricated pattern.
By adopting the processing mode of the technology, the laser cutting mobile phone SUS has the obvious advantages of no thermal deformation (warping), no dislocation size deviation, stable cutting effect, no post-treatment for one-step molding and great reduction of labor cost;
the cutting process has the following advantages:
quick in mold changing and one-step molding, can be used for taking and discharging materials from the whole material taking 5S, is simple in leftover material collection, and does not need to detach any tool clamp. The material taking can be carried out by only turning off the vacuum valve, and the automatic operation can be matched.
The cutting effect is good, the traditional cutting edge has certain slag returning phenomenon (the molten and gasified substances after cutting form vortex after being sprayed by the air nozzle and form bead-shaped solid after being cooled on the surface of the product).
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered by the scope of the claims of the present invention.
Claims (10)
1. Use at cell-phone SUS processing reduction tool that warp, its characterized in that includes:
the jig comprises a jig workbench (1), wherein a plurality of jig plates (2) for bearing products are arranged on the jig workbench (1);
the rear cover (3) is arranged at the bottom of the jig workbench (1), and a cavity is formed in the rear cover (3);
the vacuum adsorption system (4) is arranged in the rear cover (3), and the vacuum adsorption system (4) is used for carrying out vacuum adsorption on products borne on the jig plate (2);
the air draft system connector (5), the air draft system connector (5) is arranged on the rear cover (3) and used for connecting an external air draft system to carry out air draft cooling on products borne on the jig plate (2).
2. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 1, wherein: the middle position of the jig plate (2) is provided with an adsorption through hole (6), and the adsorption through hole (6) penetrates through the jig plate (2).
3. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 1, wherein: the profile of the jig plate (2) is shrunk by 0.3mm-1mm from the product profile.
4. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 2, wherein: the jig plate (2) is provided with an air passage guide groove (7), and the adsorption through hole (6) is positioned at the middle position of the air passage guide groove (7) and is mutually communicated.
5. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 1, wherein: the jig is characterized in that a plurality of groove edges (8) are fixedly connected to the periphery of the jig plate (2), and the depth of each groove edge (8) is greater than 5mm.
6. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 5, wherein: a plurality of hollowed-out grooves (9) are formed in the periphery of the jig plate (2), and the hollowed-out grooves (9) are located on one side of the groove edge (8).
7. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 2, wherein: the vacuum adsorption system (4) comprises:
the three-way connectors (41) are the same in number as the jig plates (2), and the top connectors of the three-way connectors (41) are sequentially and fixedly connected with adsorption through holes (6) on the jig plates (2);
the vacuum pipeline (42) is sequentially fixedly communicated with a plurality of three-way connectors (41) to form a closed loop;
and the pipeline joint (43) is fixedly communicated with the vacuum pipeline (42) through a pipeline.
8. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 1, wherein: the exhaust system joint (5) is communicated with the inner cavity of the rear cover (3).
9. The fixture for reducing deformation in mobile phone SUS processing as claimed in claim 1, wherein: the rear cover (3) is provided with a vacuum adsorption interface (10), and the vacuum adsorption interface (10) is positioned at one side of the joint (5) of the air draft system.
10. A process for reducing deformation applied to mobile phone SUS processing, comprising the jig for reducing deformation applied to mobile phone SUS processing according to any one of claims 1-9, and characterized in that the process flow is as follows:
s1: placing a large piece of raw material on a jig plate (2) and positioning the raw material by leaning against a positioning block;
s2: starting vacuum adsorption, and adsorbing the raw material on the jig plate (2);
s3: starting a cooling and air exhausting system;
s4: starting the laser processing equipment, and processing and producing according to the prefabricated pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310523889.0A CN116372403A (en) | 2023-05-10 | 2023-05-10 | Jig for reducing deformation applied to mobile phone SUS processing and process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310523889.0A CN116372403A (en) | 2023-05-10 | 2023-05-10 | Jig for reducing deformation applied to mobile phone SUS processing and process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116372403A true CN116372403A (en) | 2023-07-04 |
Family
ID=86971148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310523889.0A Pending CN116372403A (en) | 2023-05-10 | 2023-05-10 | Jig for reducing deformation applied to mobile phone SUS processing and process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116372403A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216230A (en) * | 1999-01-27 | 2000-08-04 | Hitachi Ltd | Fixing jig for tft substrate and disconnection detecting device therefor |
| CN1974137A (en) * | 2006-12-12 | 2007-06-06 | 浙江大学 | Vacuum adsorbing positioning system for great area soft thin material |
| CN203733770U (en) * | 2014-01-24 | 2014-07-23 | 南通富士通微电子股份有限公司 | Tool used for wafer-level packaging technology |
| CN204308415U (en) * | 2014-11-19 | 2015-05-06 | 大族激光科技产业集团股份有限公司 | A kind of vacuum suction tool and laser cutting machine |
| CN109702802A (en) * | 2019-01-23 | 2019-05-03 | 青岛理工大学 | A kind of independent block absorption platform, control circuit and control method |
| CN209365666U (en) * | 2018-11-15 | 2019-09-10 | 广州春羽秋丰数码彩印设备有限公司 | A kind of vacuum absorption device of flat-panel printer |
| KR102158341B1 (en) * | 2020-07-09 | 2020-09-22 | (주) 예승이엔지 | Work table for cell laser cutting |
| CN216780703U (en) * | 2022-02-24 | 2022-06-21 | 重庆合利众恒科技有限公司 | A tool board for cell-phone POL processing |
| CN217253775U (en) * | 2022-02-24 | 2022-08-23 | 重庆合利众恒科技有限公司 | A tool for cell-phone display screen SUS processing |
| CN218775913U (en) * | 2022-09-06 | 2023-03-31 | 海目星激光科技集团股份有限公司 | Laser cutting tool platform suitable for carbon fiber product |
-
2023
- 2023-05-10 CN CN202310523889.0A patent/CN116372403A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216230A (en) * | 1999-01-27 | 2000-08-04 | Hitachi Ltd | Fixing jig for tft substrate and disconnection detecting device therefor |
| CN1974137A (en) * | 2006-12-12 | 2007-06-06 | 浙江大学 | Vacuum adsorbing positioning system for great area soft thin material |
| CN203733770U (en) * | 2014-01-24 | 2014-07-23 | 南通富士通微电子股份有限公司 | Tool used for wafer-level packaging technology |
| CN204308415U (en) * | 2014-11-19 | 2015-05-06 | 大族激光科技产业集团股份有限公司 | A kind of vacuum suction tool and laser cutting machine |
| CN209365666U (en) * | 2018-11-15 | 2019-09-10 | 广州春羽秋丰数码彩印设备有限公司 | A kind of vacuum absorption device of flat-panel printer |
| CN109702802A (en) * | 2019-01-23 | 2019-05-03 | 青岛理工大学 | A kind of independent block absorption platform, control circuit and control method |
| KR102158341B1 (en) * | 2020-07-09 | 2020-09-22 | (주) 예승이엔지 | Work table for cell laser cutting |
| CN216780703U (en) * | 2022-02-24 | 2022-06-21 | 重庆合利众恒科技有限公司 | A tool board for cell-phone POL processing |
| CN217253775U (en) * | 2022-02-24 | 2022-08-23 | 重庆合利众恒科技有限公司 | A tool for cell-phone display screen SUS processing |
| CN218775913U (en) * | 2022-09-06 | 2023-03-31 | 海目星激光科技集团股份有限公司 | Laser cutting tool platform suitable for carbon fiber product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112975287A (en) | Superplastic deformation/diffusion connection forming technology for wavy hollow skin structure part | |
| CN110434551A (en) | A kind of processing technology reducing thin-walled parts deflection | |
| CN116372403A (en) | Jig for reducing deformation applied to mobile phone SUS processing and process thereof | |
| CN102285116A (en) | Hot press with improved structure and hot-press forming method thereof | |
| CN213108325U (en) | A carbon fiber car fin integrated into one piece mould for burying metalwork in | |
| CN212625619U (en) | Solar panel lamination mold | |
| CN214676399U (en) | Assembling jig | |
| CN210360453U (en) | Multistation water pump cover processing frock clamp | |
| CN212885649U (en) | Fixture quick-change positioning mechanism of arc welding robot workstation | |
| TWI680059B (en) | Fixture for bonding and method for bonding | |
| CN219598709U (en) | Negative pressure fixing jig for machining aluminum alloy plate | |
| CN219542031U (en) | Vacuum suction type laser cutting jig | |
| CN114770011B (en) | Cutting, forming and welding equipment for uniform temperature plate | |
| CN212920411U (en) | Plastic product deformation correction tool | |
| CN215432540U (en) | A adsorb positioning fixture for processing of thin wall combined material structure | |
| CN212398887U (en) | Adjustable clamp for die machining | |
| CN110625215A (en) | Welding pressing device and series welding machine | |
| CN217493111U (en) | Laser jig | |
| CN220312596U (en) | Milling suction clamping mechanism | |
| CN221246862U (en) | Mould convenient to use in combination | |
| CN220074839U (en) | Adsorption tool for machining composite material with high precision requirement | |
| CN220052893U (en) | Dust removal scraper device for cleaning metal guide roller | |
| CN218638371U (en) | Stamping stainless steel die with long service life | |
| CN113771343B (en) | Screen bending equipment for intelligent manufacturing of mobile phone liquid crystal display screen | |
| CN217258505U (en) | Heating laminating processing equipment of foam board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |