CN116364798A - Battery packaging structure and packaging method - Google Patents

Battery packaging structure and packaging method Download PDF

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Publication number
CN116364798A
CN116364798A CN202310277475.4A CN202310277475A CN116364798A CN 116364798 A CN116364798 A CN 116364798A CN 202310277475 A CN202310277475 A CN 202310277475A CN 116364798 A CN116364798 A CN 116364798A
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CN
China
Prior art keywords
substrate
battery
cover plate
rewiring layer
package structure
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Pending
Application number
CN202310277475.4A
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Chinese (zh)
Inventor
谢国梁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd
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Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd
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Publication date
Application filed by Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd filed Critical Suzhou Sicui Chegui Semiconductor Industry Technology Research Institute Co ltd
Priority to CN202310277475.4A priority Critical patent/CN116364798A/en
Publication of CN116364798A publication Critical patent/CN116364798A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022433—Particular geometry of the grid contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a battery packaging structure and a battery packaging method. The substrate has a rewiring layer formed thereon. The cover plate is arranged on the substrate and forms a sealed cavity with the substrate in a surrounding mode, the rewiring layer extends into the sealed cavity, and inert gas is filled in the sealed cavity. The battery cell is disposed within the sealed cavity and electrically connected to the rewiring layer. The battery packaging structure and the packaging method can solve the packaging problem of the novel solar compound battery and prolong the service life of the novel solar compound battery.

Description

Battery packaging structure and packaging method
Technical Field
The invention relates to the technical field of semiconductors, in particular to a novel packaging structure and a novel packaging method of a solar compound battery.
Background
In the existing battery package, the market occupation rate of the first generation solar battery taking Si as a battery carrier is maintained to be more than 90%, and the photoelectric conversion efficiency of the first generation solar battery is twenty percent. However, in the case of the novel solar cell, the photoelectric conversion efficiency of the novel solar cell is improved to thirty percent by using the compound as a receiving (power generation) material. However, the compound is easy to decompose and unstable, so that the traditional battery packaging structure and the packaging method cannot meet the requirement of packaging of the novel solar battery.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide a packaging structure and a packaging method of a novel solar compound battery, which can solve the packaging problem of the novel solar compound battery and prolong the service life of the novel solar compound battery.
In order to achieve the above object, an embodiment of the present invention provides a battery package structure including a substrate, a cover plate, and a battery unit. The substrate has a rewiring layer formed thereon. The cover plate is arranged on the substrate and forms a sealed cavity with the substrate in a surrounding mode, the rewiring layer extends into the sealed cavity, and inert gas is filled in the sealed cavity. The battery cell is disposed within the sealed cavity and electrically connected to the rewiring layer.
In one or more embodiments of the invention, the substrate has an extension extending out of the sealed chamber, the rewiring layer extending from within the sealed chamber onto the extension.
In one or more embodiments of the present invention, the cover plate includes a transparent substrate and a bank formed on the transparent substrate, the bank and the substrate being hermetically bonded to form the sealed chamber.
In one or more embodiments of the invention, the transparent substrate comprises glass.
In one or more embodiments of the invention, the dam is an FR4 epoxy board or BT board.
In one or more embodiments of the invention, the battery cell is a solar cell that uses a compound as a receiving or power generating material, the solar cell comprising a perovskite material cell.
In one or more embodiments of the invention, the substrate comprises a silicon substrate or a glass substrate.
The invention also provides a battery packaging method, which comprises the following steps: providing a substrate, wherein the substrate is provided with a first surface, and a rewiring layer is formed on the first surface of the substrate; manufacturing a cover plate so that a plurality of chambers are formed on the cover plate; providing a plurality of battery cells, wherein the battery cells are arranged on the first surface of the substrate and are electrically connected with the rewiring layer; sealing the cover plate to the first surface of the substrate in an inert gas environment, wherein each chamber contains at least one battery unit.
In one or more embodiments of the present invention, the step of manufacturing the cover plate such that a plurality of chambers are formed on the cover plate includes: providing a second substrate, forming through holes on the second substrate, and forming cutting areas between adjacent through holes; providing a third substrate, and sealing and bonding the second substrate and the third substrate to form the cover plate.
In one or more embodiments of the present invention, the battery packaging method further includes: the substrate and the cover plate are cut along the cutting region to form a single battery package structure.
In one or more embodiments of the invention, the rewiring layer extends from within the chamber to on the substrate outside the chamber.
In one or more embodiments of the invention, the battery cell is a solar cell that uses a compound as a receiving or power generating material, the solar cell comprising a perovskite material cell.
Compared with the prior art, according to the battery packaging structure and the packaging method, the inert gas is filled in the sealed cavity where the battery unit is located, so that the stability of the battery unit packaging structure is improved, and the service life of the battery unit is prolonged.
Drawings
Fig. 1 is a schematic structural view of a battery package structure according to an embodiment of the present invention;
fig. 2 is a sectional view of a battery package structure according to an embodiment of the present invention;
fig. 3 is a process flow diagram of a battery packaging method according to an embodiment of the present invention;
fig. 4 to 9 are process step configuration diagrams of a battery packaging method according to an embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention is, therefore, to be taken in conjunction with the accompanying drawings, and it is to be understood that the scope of the invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations thereof such as "comprises" or "comprising", etc. will be understood to include the stated element or component without excluding other elements or components.
As described in the background art, the novel solar cell has high photoelectric conversion efficiency due to the fact that the compound is used as the receiving (power generation) material, and the problem that the performance is unstable and the service life of the solar cell is short when the novel solar cell is packaged by using the traditional packaging structure due to the fact that the compound is used as the receiving (power generation) material.
In order to solve the technical problems, the invention creatively provides a packaging structure and a packaging method of a battery, which can solve the packaging problem of a novel solar compound battery and prolong the service life of the novel solar compound battery.
As shown in fig. 1 to 2, the battery package structure according to the embodiment of the present invention includes a base plate 10, a cap plate 20, and a battery cell 30. The substrate 10 is formed with a rewiring layer 11, the cover plate 20 is disposed on the substrate 10 and encloses a sealing chamber 12 with the substrate 10, the rewiring layer 11 extends into the sealing chamber 12, and the sealing chamber 12 is filled with inert gas. The battery cell 30 is disposed within the sealed chamber 12 and electrically connected to the rewiring layer 11.
As shown in fig. 2, the substrate 10 may be made of a silicon substrate or a glass substrate. The substrate 10 has an extension 101 extending out of the sealed chamber 12. The rewiring layer 11 is partially located within the sealed chamber 12 and partially extends from within the sealed chamber 12 onto the extension 101. The rewiring layer 11 located within the sealed chamber 12 is used to form an electrical connection with the battery cells 30 within the sealed chamber 12. The rewiring layer 11 located on the extension 101 is used for forming electrical connection with an external circuit so as to electrically connect the battery cell 30 with the external circuit.
As shown in fig. 1, the cover plate 20 includes a transparent substrate 21 and a bank 22 formed on the transparent substrate 21. The bank 22 is provided in a ring-shaped structure, and one end of the bank 22 is hermetically bonded to the transparent substrate 21 and the other end is hermetically bonded to the substrate 10 to form the sealed chamber 12 together. The material of the transparent substrate 21 includes glass. The dam 22 material comprises FR4 epoxy board or BT board.
The battery unit 30 is disposed on the substrate 10 and located in the sealed chamber 12, and the battery unit 30 is a solar cell using a compound as a receiving or generating material, and the solar cell includes a perovskite material cell. One or more battery cells 30 may be disposed within each sealed chamber 12, and when a plurality of battery cells 30 are disposed, the plurality of battery cells 30 are tiled over the substrate 10 and are each electrically connected to the rewiring layer 11. The sealed chamber 12 is filled with an inert gas such as argon and/or helium.
Compared with the prior art, according to the battery packaging structure provided by the embodiment of the invention, the inert gas is filled in the sealing cavity where the battery unit is located, so that the stability of the battery unit packaging structure is improved, and the service life of the battery unit is prolonged.
As shown in fig. 3, the present invention further provides a battery packaging method, including: s1 provides a substrate 10, the substrate 10 having a first surface 10a, and a rewiring layer 11 formed on the first surface 10a of the substrate 10. S2, manufacturing the cover plate 20, so that a plurality of cavities 201 are formed on the cover plate 20. S3 providing the battery cells 30, and disposing a plurality of battery cells 30 on the first surface 10a of the substrate 10 and electrically connecting the rewiring layer 11; s4 sealing the cover plate 20 to the first surface 10a of the substrate 10 in an inert gas environment to form a plurality of sealed chambers 12, wherein each sealed chamber 12 contains at least one battery cell 30 therein. S5, cutting the substrate 10 and the cap plate 20 to form a single battery package structure.
Fig. 4 to 9 are process step structures of a battery packaging method according to an embodiment of the present invention. The battery packaging method of the present invention will be described in detail with reference to fig. 4 to 9.
Referring to fig. 4, a substrate 10 is provided, and the substrate 10 may preferably be a silicon substrate or a glass substrate. The substrate 10 has a first surface 10a, and the first surface 10a of the substrate 10 is divided into a plurality of regions b. After the post-cutting, a separate battery packaging structure is formed in each region b. A rewiring layer 11 is formed on the first surface 10a of the substrate 10, wherein there is a complete and independent rewiring layer 11 in each region b.
Referring to fig. 5 and 6, the cover plate 20 is manufactured such that a plurality of chambers 201 are formed on the cover plate 20.
Illustratively, referring to fig. 5, a second substrate 20a is provided, and the second substrate 20a may preferably be an FR4 epoxy board or a BT board. A plurality of through holes c are formed on the second substrate 20 a. The number of the through holes c is opposite to the number of the regions b, and the size of the through holes c is smaller than the area of the regions b, so that the rewiring layer 11 in the regions b extends out of the through holes c. A cutting region d is formed between adjacent through holes c. The dicing area d may be a groove formed on the second substrate 20a and located between adjacent through holes c, so as to facilitate the later dicing, and also enable a portion of the rewiring layer 11 to be exposed after the second substrate 20a is bonded to the first surface 10a of the substrate 10. The cutting area d corresponds to an area boundary on the first surface 10a of the substrate 10.
Referring to fig. 6, a third substrate 20b is provided, and the third substrate 20b may preferably be transparent glass. The second substrate 20a and the third substrate 20b are hermetically bonded to form the cap plate 20.
Referring to fig. 7, a battery cell 30 is provided, and the battery cell 30 is a solar cell using a compound as a receiving or power generating material, and the solar cell includes a perovskite material cell. A plurality of battery cells 30 are provided on the first surface 10a of the substrate 10 and electrically connected to the rewiring layer 11. Wherein, each area b is provided with one battery unit 30 or a plurality of battery units 30 which are horizontally arranged.
Referring to fig. 8, a cover plate 20 is sealed to a first surface 10a of a substrate 10 in an inert gas atmosphere to form a sealed chamber 12. Wherein each sealed chamber 12 contains at least one battery cell 30 therein. The rewiring layer 11 is located partially within each sealed chamber 12 and extends partially onto the substrate 10 outside each sealed chamber 12. The gap between the cover plate 20 and the substrate 10 may be filled with a sealant.
Referring to fig. 9, the substrate 10 and the cap plate 20 are cut along the cutting region d to form a single battery package structure.
Compared with the prior art, according to the battery packaging method, the battery unit is packaged in the inert gas environment, so that the inert gas is filled in the sealed cavity where the battery unit is located, the stability of the battery unit packaging structure is improved, and the service life of the battery unit is prolonged.
The various aspects, embodiments, features and examples of the invention are to be considered in all respects as illustrative and not intended to limit the invention, the scope of which is defined solely by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.
The use of headings and chapters in this application is not meant to limit the invention; each section may apply to any aspect, embodiment, or feature of the present invention.
Throughout this application, where a composition is described as having, comprising, or including a particular component, or where a process is described as having, comprising, or including a particular process step, it is contemplated that the composition of the teachings of the present invention also consist essentially of, or consist of, the recited component, and that the process of the teachings of the present invention also consist essentially of, or consist of, the recited process step.
Where elements or components are referred to in this application as being included in and/or selected from a list of recited elements or components, it should be understood that the elements or components may be any of the recited elements or components and may be selected from the group consisting of two or more of the recited elements or components. Furthermore, it is to be understood that the elements and/or features of the compositions, apparatus, or methods described herein may be combined in various ways, whether explicitly or implicitly described herein, without departing from the spirit and scope of the teachings of the invention.
The use of the terms "comprising," "having," and "including" are generally understood to be open-ended and not limiting, unless specifically stated otherwise.
The use of the singular herein includes the plural (and vice versa) unless specifically stated otherwise. Furthermore, the singular forms "a," "an," and "the" include plural forms unless the context clearly dictates otherwise. In addition, where the term "about" is used prior to a magnitude, the present teachings include the particular magnitude itself, unless specifically stated otherwise.
It should be understood that the order of steps or order in which a particular action is performed is not critical, as long as the present teachings remain operable. Furthermore, two or more steps or actions may be performed simultaneously.
It is to be understood that the figures and descriptions of the present invention have been simplified to illustrate elements that are relevant for a clear understanding of the present invention, while eliminating, for purposes of clarity, other elements. However, one of ordinary skill in the art will recognize that these and other elements may be desirable. However, since such elements are well known in the art, and since they do not facilitate a better understanding of the present invention, a discussion of such elements is not provided herein. It should be appreciated that the figures are presented for illustrative purposes and are not as constructional figures. Omitted details and modified or alternative embodiments are within the purview of one skilled in the art.
It can be appreciated that in particular aspects of the invention, a single component can be replaced by multiple components and that multiple components can be replaced by a single component to provide an element or structure or perform a given function or functions. Such alternatives are considered to be within the scope of the invention except where such alternatives would not operate to practice a particular embodiment of the invention.
While the invention has been described with reference to an illustrative embodiment, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (12)

1. A battery package structure, characterized by comprising:
a substrate on which a rewiring layer is formed;
the cover plate is arranged on the substrate and is enclosed with the substrate to form a sealed cavity, the rewiring layer extends into the sealed cavity, and inert gas is filled in the sealed cavity;
and the battery unit is arranged in the sealed cavity and is electrically connected with the rewiring layer.
2. The battery package structure of claim 1, wherein the substrate has an extension extending out of the sealed cavity, the rewiring layer extending from within the sealed cavity onto the extension.
3. The battery package structure of claim 1, wherein the cover plate includes a transparent substrate and a dam formed on the transparent substrate, the dam and the substrate being hermetically bonded to form the sealed chamber.
4. The battery package structure of claim 3, wherein the transparent substrate comprises glass.
5. The battery package structure of claim 3, wherein the dam is an FR4 epoxy board or a BT board.
6. The battery package structure of claim 1, wherein the battery cell is a solar cell using a compound as a receiving or power generating material.
7. The battery package structure of claim 1, wherein the substrate comprises a silicon substrate or a glass substrate.
8. A battery packaging method, comprising:
providing a substrate, wherein the substrate is provided with a first surface, and a rewiring layer is formed on the first surface of the substrate;
manufacturing a cover plate so that a plurality of chambers are formed on the cover plate;
providing a plurality of battery cells, wherein the battery cells are arranged on the first surface of the substrate and are electrically connected with the rewiring layer;
sealing the cover plate to the first surface of the substrate in an inert gas environment, wherein each chamber contains at least one battery unit.
9. The battery packaging method of claim 8, wherein the step of manufacturing the cover plate such that a plurality of chambers are formed on the cover plate, comprises:
providing a second substrate, forming through holes on the second substrate, and forming cutting areas between adjacent through holes;
providing a third substrate, and sealing and bonding the second substrate and the third substrate to form the cover plate.
10. The battery packaging method of claim 9, further comprising:
the substrate and the cover plate are cut along the cutting region to form a single battery package structure.
11. The battery packaging method of claim 8, wherein the rewiring layer extends from within the chamber to a substrate outside the chamber.
12. The battery packaging method of claim 8, wherein the battery cell is a solar cell using a compound as a receiving or power generating material.
CN202310277475.4A 2023-03-21 2023-03-21 Battery packaging structure and packaging method Pending CN116364798A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310277475.4A CN116364798A (en) 2023-03-21 2023-03-21 Battery packaging structure and packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310277475.4A CN116364798A (en) 2023-03-21 2023-03-21 Battery packaging structure and packaging method

Publications (1)

Publication Number Publication Date
CN116364798A true CN116364798A (en) 2023-06-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310277475.4A Pending CN116364798A (en) 2023-03-21 2023-03-21 Battery packaging structure and packaging method

Country Status (1)

Country Link
CN (1) CN116364798A (en)

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