CN116364611B - Coarsening equipment after etching lead frame - Google Patents
Coarsening equipment after etching lead frame Download PDFInfo
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- CN116364611B CN116364611B CN202310476226.8A CN202310476226A CN116364611B CN 116364611 B CN116364611 B CN 116364611B CN 202310476226 A CN202310476226 A CN 202310476226A CN 116364611 B CN116364611 B CN 116364611B
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- fixedly connected
- plate
- lead frame
- block
- guide
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- 238000005530 etching Methods 0.000 title claims description 10
- 238000007789 sealing Methods 0.000 claims abstract description 72
- 238000007788 roughening Methods 0.000 claims abstract description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 238000000926 separation method Methods 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 15
- 239000000314 lubricant Substances 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 18
- 238000004806 packaging method and process Methods 0.000 description 15
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008844 regulatory mechanism Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of lead frame roughening, in particular to etched lead frame post-roughening equipment, which comprises a roughening pool, wherein the inner bottom surface of the roughening pool is fixedly connected with a base and a fixing frame, the upper surface of the base is fixedly connected with a lower template, air cylinders are symmetrically and fixedly connected to the fixing frame, telescopic shafts of the two air cylinders penetrate through the fixing frame and are fixedly connected with an upper template together, two ends of the lower template are respectively provided with a limit adjusting mechanism, the inside of the upper template is provided with a top groove, the edge of the top groove is fixedly connected with a sealing ring, the lower template is provided with an inner cavity I, two ends of the inner cavity I are fixedly connected with end plates, and the inner wall of the inner cavity I is provided with a separation assembly.
Description
Technical Field
The invention relates to the field of post-roughening of lead frames, in particular to post-roughening equipment for etching a lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electric connection between an internal circuit leading-out end of the chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electric loop, plays a role of a bridge connected with an external lead, and is an important basic material in the electronic information industry because the lead frame is needed to be used in most of semiconductor integrated blocks.
The prior art discloses an invention patent in the aspect of coarsening of a part of lead frames, and Chinese patent with the application number of CN202211491670.9 discloses selective coarsening equipment of the semiconductor lead frames, which comprises a spraying device, an upper template and a lower template, wherein the upper template and the lower template are used for clamping the lead frames, hollowed-out holes are formed in the lower template and used for exposing a to-be-coarsened area of the lead frames, and the spraying device is used for spraying coarsening liquid medicine in the to-be-coarsened area of the lead frames.
At present, the whole roughening process of spraying or soaking the lead frame in the roughening liquid is mature, the roughening treatment is carried out on the lead frame to increase the bonding force of the lead frame and the bonding force of the packaging resin, in the process of carrying out local roughening, the local roughening area and the non-roughening area are inconvenient to separate, the part which does not need to be bonded with the packaging resin is roughened, waste of the roughening liquid is caused, in addition, the packaging resin overflows to the non-cementing area when the chip is in plastic packaging, and the overflowed packaging resin has strong bonding force with the roughened surface of the non-functional area, so that the overflow glue is difficult to remove.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a roughening device after etching a lead frame.
In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a coarsening equipment behind etching lead frame, includes the coarsening pond, the inside bottom surface fixedly connected with base and the mount in coarsening pond, the tip fixed intercommunication of base has feed liquor pipe and drain pipe, the upper surface fixedly connected with lower bolster of base, the upper surface one side fixedly connected with stop strip of lower bolster, the upper surface opposite side of lower bolster is equipped with spacing subassembly, symmetrical fixedly connected with cylinder on the mount, two behind the telescopic shaft of cylinder runs through the mount common fixedly connected with cope match-plate pattern, the equal symmetrical fixedly connected with guide bar of both ends lateral wall of cope match-plate pattern, the equal symmetrical fixedly connected with guide frame of both ends lateral wall of lower bolster, the lower part of guide bar is pegged graft in corresponding position in the guide frame, the both ends of lower bolster all are provided with spacing adjustment mechanism, spacing adjustment mechanism is used for the cope match-plate pattern to descend the in-process to be placed in the middle to the lead frame body, the overhead groove is seted up to the inside of cope match-plate pattern, overhead groove edge fixedly connected with sealing ring, rectangular groove and two square grooves have been seted up to the cope match-plate pattern, an inner chamber has been seted up on the cope match-plate pattern, an inner chamber has been equipped with the inner chamber, a partition board and a function of separating the inner chamber is equipped with the partition board, and the function is used for realizing the partition district.
Preferably, the limiting component comprises a mounting seat, the mounting seat is symmetrically and fixedly connected to the upper surface of the lower die plate, a limiting block is slidably connected in the mounting seat, the end part of the limiting block is trapezoid, a first spring is fixedly connected to the back of the limiting block, and one end, away from the limiting block, of the first spring is fixedly connected to the inner wall of the mounting seat.
Preferably, the limit adjusting mechanism comprises two guide grooves, a clamping block and two pressing rods, the clamping block is slidably inserted into the middle position of the end part of the lower die plate, the two pressing rods are fixedly connected to the opposite surfaces of the two guide rods respectively, the two pressing rods are symmetrically arranged, the two guide grooves are symmetrically arranged on the end face of the clamping block, the two guide grooves comprise a first vertical guide groove, a second inclined guide groove and a second vertical guide groove, three springs are fixedly connected to the inner wall of a connecting cavity formed in the lower end of the clamping block, and one end of each spring, which is far away from the clamping block, is fixedly connected to the side wall of the lower die plate.
Preferably, the separation assembly comprises two supporting plates, the two supporting plates are fixedly connected to the inner wall of the first inner cavity, a lifting plate is connected to the inner side of the first inner cavity in a sliding mode in a connecting cavity formed in the top of the supporting plate, the end portion of the lifting plate is in sliding contact with the end plate, a sealing groove is formed in the lifting plate, the end portion of the supporting plate is provided with an upward pushing assembly, the upward pushing assembly is used for pushing the lifting plate to ascend to be matched with the upper template to isolate the end portion of the lead frame body, the upward pushing assembly comprises a pushing block, the pushing block is connected to the end portion of the lower template in a sliding mode, the pushing block is close to one end of the lifting plate and is connected to the inner side of the supporting plate in a sliding mode, an inclined plane I and an inclined plane II are arranged at the upper end of the pushing block, one end bottom of the supporting plate is fixedly connected with a spring IV, and one end of the spring IV is close to the supporting plate is fixedly connected to the side wall of the lower template.
Preferably, the top wall of the top groove of the upper template is fixedly connected with a plurality of groups of sealing seats, the distance between the plurality of groups of sealing seats is equal to the width of the pin library of the lead frame body, a plurality of groups of sealing seats are fixedly connected with sealing rubber sleeves on opposite surfaces, a cavity is formed in each sealing seat, and a rubber sleeve expanding and supporting assembly is arranged in each cavity.
Preferably, the expanding and supporting assembly comprises two guide plates, a pushing block and an estimating plate, wherein the pushing block is slidably connected to the side wall of the sealing seat, the two guide plates are fixedly connected to the inner wall of the cavity, the estimating plate is slidably connected between the two guide plates, the estimating plate is in a T-shaped, and an inclined plane III is arranged at one end of the estimating plate, which is close to the pushing block.
Preferably, the back of the presumption board is symmetrically and fixedly connected with a cylindrical rod, one end of the cylindrical rod, which is far away from the sealing rubber sleeve, is slidably connected to the guide plate, and a spring five is sleeved on the cylindrical rod.
Preferably, a first pushing surface is arranged at one end of the pushing block extending out of the sealing seat, the first pushing surface is inclined downwards, a first pushing surface is arranged at the other end of the pushing block, and a second pushing surface faces to the third inclined surface.
Preferably, the inside of presuming the board has seted up the storage chamber, presume the lateral wall symmetry of board seted up a plurality of with the round hole of storage chamber intercommunication, it holds the lubricant to presume in the board, be equipped with the shutoff structure in the presuming the board, the shutoff structure is used for a plurality of the round hole shutoff.
Preferably, the plugging structure comprises a seal and two cylindrical shafts, the seal is slidably connected in the estimating plate, one ends of the two cylindrical shafts are fixedly connected to the back of the seal, and the other ends of the two sealing seats penetrate through the side wall of the estimating plate and are fixedly connected to the guide plate.
Compared with the prior art, the invention has the following beneficial effects:
the invention is provided with the limit adjusting mechanism, when the compression bar slides into the inclined guide groove in the descending process of the upper template, the clamping blocks are pushed to move in opposite directions, so that the clamping blocks at the two ends of the lower template are beneficial to carrying out position correction and limit on the lead frame body;
according to the invention, the separation component is arranged, when the compression bar is contacted with the inclined plane I and extrudes the inclined plane I, so that the pushing blocks at two ends of the lower template move in opposite directions, the inclined plane II of the pushing block can push the lifting plate upwards, so that the lifting plate is upwards, the sealing groove of the lifting plate is clamped on the pin of the lead frame body, the side wall and the bottom surface of the functional area are separated from the side wall and the bottom surface of the nonfunctional area, the functional area and the nonfunctional area are separated in the roughening process, and the nonfunctional area is prevented from being roughened.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of a portion of the structure of the present invention;
FIG. 3 is a schematic diagram of a lower mold plate according to the present invention;
FIG. 4 is a schematic diagram of a lower template according to the present invention;
FIG. 5 is a schematic view of a clamping block structure according to the present invention;
FIG. 6 is a schematic diagram showing the relative positions of the lower die plate and the pushing block according to the present invention;
FIG. 7 is a schematic view of the connection of the pushing block and the support plate according to the present invention;
FIG. 8 is a schematic diagram of a cope match-plate pattern of the present invention;
FIG. 9 is a schematic view of the upper template part structure subdivision of the present invention;
fig. 10 is a schematic view of a leadframe body according to the present invention;
FIG. 11 is a schematic view of a seal strip of the present invention;
FIG. 12 is a schematic illustration of a putative plate subdivision of the present invention;
FIG. 13 is a schematic diagram of a putative block of the present invention;
FIG. 14 is a schematic view of a spacing assembly according to the present invention;
fig. 15 is a schematic view of the sealing of the lifting plate and the sealing strip to the lead frame of the present invention.
In the figure: 1. coarsening pool; 2. a base; 201. a liquid inlet pipe; 202. a liquid outlet pipe; 3. a fixing frame; 4. a cylinder; 5. a lower template; 51. an inner cavity I; 52. an end plate; 6. an upper template; 61. a top groove; 62. a seal ring; 63. a square groove; 7. a lead frame body; 701. a functional area; 702. a nonfunctional area; 8. a guide rod; 9. a compression bar; 10. a guide frame; 11. a stop bar; 111. rectangular grooves; 12. a mounting base; 13. a limiting block; 14. a first spring; 15. a clamping block; 151. a guide groove; 1501. a first vertical guide groove; 1502. an inclined guide groove; 1503. a second vertical guide groove; 16. a second spring; 17. a support plate; 18. a lifting plate; 19. sealing the groove; 191. a sealing gasket; 20. a third spring; 21. a pushing block; 211. an inclined plane I; 212. a second inclined plane; 22. a spring IV; 23. a sealing seat; 24. sealing the rubber sleeve; 25. a cavity; 26. a guide plate; 27. a presumption plate; 271. an inclined plane III; 28. pushing the jacking block; 281. pushing the first top surface; 282. pushing the second top surface; 29. a cylindrical rod; 30. a spring V; 31. a round hole; 32. a seal; 33. a cylindrical shaft.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art.
The roughening equipment after etching the lead frame as shown in figures 1 to 15 comprises a roughening pool 1, wherein the inner bottom surface of the roughening pool 1 is fixedly connected with a base 2 and a fixing frame 3, the end part of the base 2 is fixedly communicated with a liquid inlet pipe 201 and a liquid outlet pipe 202, the upper surface of the base 2 is fixedly connected with a lower template 5, one side of the upper surface of the lower template 5 is fixedly connected with a stop bar 11, the other side of the upper surface of the lower template 5 is provided with a limiting component, the fixing frame 3 is symmetrically and fixedly connected with air cylinders 4, telescopic shafts of the two air cylinders 4 penetrate through the fixing frame 3 and then are jointly and fixedly connected with an upper template 6, side walls at two ends of the upper template 6 are symmetrically and fixedly connected with guide rods 8, side walls at two ends of the lower template 5 are symmetrically and fixedly connected with guide frames 10, the lower part of the guide rod 8 is inserted into the guide frame 10 at a corresponding position, both ends of the lower template 5 are provided with limiting and adjusting mechanisms, the limiting and adjusting mechanisms are used for centering and adjusting the lead frame body 7 in the descending process of the upper template 6, a top groove 61 is formed in the upper template 6, a sealing ring 62 is fixedly connected to the edge of the top groove 61, a rectangular groove 111 and two square grooves 63 are formed in the upper template 6, an inner cavity I51 is formed in the lower template 5, end plates 52 are fixedly connected to both ends of the inner cavity I51, a separation component is arranged on the inner wall of the inner cavity I51, and the separation component is used for realizing separation of a functional area 701 and a nonfunctional area 701 of the lead frame body 7; when the lead frame is in operation, the whole roughening process of spraying or soaking the lead frame in the roughening liquid is mature, the roughening treatment is carried out on the lead frame to increase the binding force of the lead frame and the packaging resin, in the process of carrying out local roughening, the local roughening area and the non-roughening area are not convenient to separate, so that the part which is not required to be combined with the packaging resin is roughened, waste of the roughening liquid is caused, in addition, when a chip is in plastic packaging, packaging resin overflows to a non-glued area, the binding force of the overflowed packaging resin and the roughened surface of a non-functional area is stronger, so that the overflow glue is difficult to remove. The sealing ring 62 cooperates with the end plate 52 and the partition component to form an annular seal, so that only the functional area 701 is placed in the first cavity 51 and the top groove 61, so that after the functional area 701 is coarsened in the coarsening process, the stop strip 11 is placed in the rectangular groove 111, the upper part of the limit component is placed in the square groove 63, coarsening liquid enters into a cavity formed by the first cavity 51 of the lower die plate 5 and the top groove 61 of the upper die plate 6 from the liquid inlet pipe 201 of the base 2, coarsening liquid coarsens the functional area 701 of the lead frame body 7, and after coarsening, the coarsening liquid flows out from the liquid outlet pipe 202.
Note that, the functional region 701 refers to a portion requiring roughening as illustrated in fig. 10, and the nonfunctional region 702 refers to a portion requiring no roughening as illustrated in fig. 10.
As one implementation mode of the invention, the limiting component comprises a mounting seat 12, the mounting seat 12 is symmetrically and fixedly connected to the upper surface of the lower template 5, a limiting block 13 is slidably connected in the mounting seat 12, the end part of the limiting block 13 is trapezoid, the back of the limiting block 13 is fixedly connected with a first spring 14, and one end of the first spring 14, which is far away from the limiting block 13, is fixedly connected to the inner wall of the mounting seat 12; when the work, support in backstop strip 11 department when lead frame body 7 one side, then the opposite side of lead frame body 7 is downwards for stopper 13 is spacing lead frame body 7, is favorable to improving lead frame body 7 and places stability and the accuracy on lower bolster 5.
As one embodiment of the invention, the limit adjusting mechanism comprises two guide grooves 151, a clamping block 15 and two compression bars 9, wherein the clamping block 15 is in sliding connection with the middle position of the end part of the lower template 5, the two compression bars 9 are respectively and fixedly connected with the opposite surfaces of the two guide bars 8, the two compression bars 9 are symmetrically arranged, the two guide grooves 151 are symmetrically arranged on the end surface of the clamping block 15, the two guide grooves 151 comprise a first vertical guide groove 1501, an inclined guide groove 1502 and a second vertical guide groove 1503, three second springs 16 are fixedly connected to the inner wall of a connecting cavity arranged at the lower end of the clamping block 15, and one end, far away from the clamping block 15, of each second spring 16 is fixedly connected to the side wall of the lower template 5; when the lead frame body 7 is placed on the upper surface of the lower template 5, the lower template 5 is started, the upper template 6 starts to descend, the pressing rod 9 slides in the first vertical guide groove 1501, when the pressing rod 9 slides into the inclined guide groove 1502, the clamping blocks 15 are pushed to move in opposite directions, the clamping blocks 15 at two ends of the lower template 5 are beneficial to correcting and limiting the position of the lead frame body 7, when the pressing rod 9 slides into the second vertical guide groove 1503, the lead frame body 7 is limited and fixed, when the pressing rod 9 slides downwards in the second vertical guide groove 1503, the clamping blocks 15 do not move, and the condition that the clamping blocks 15 continuously move to clamp and damage the lead frame body 7 is avoided.
As an embodiment of the present invention, the partition assembly comprises two support plates 17, the two support plates 17 are fixedly connected to the inner wall of the first cavity 51, the lifting plate 18 is slidably connected in a connecting cavity formed at the top of the support plate 17, the end of the lifting plate 18 is in sliding contact with the end plate 52,
the lifting plate 18 is provided with a sealing groove 19, the end parts of the supporting plates 17 are respectively provided with an upward pushing component, the upward pushing components are used for pushing the lifting plate 18 to ascend to match the upper template 6 to isolate the end parts of the lead frame bodies 7, each upward pushing component comprises a pushing block 21, the pushing blocks 21 are connected with the end parts of the lower templates 5 in a sliding manner, one ends of the pushing blocks 21, which are close to the lifting plate 18, are connected in the supporting plates 17 in a sliding manner, the upper ends of the pushing blocks 21 are provided with an inclined surface I211 and an inclined surface II 212, the bottoms of the ends, which are far away from the supporting plates 17, of the pushing blocks 21 are fixedly connected with springs IV 22, and one ends, which are close to the supporting plates 17, of the springs IV are fixedly connected with the side walls of the lower templates 5; when the upper template 6 drives the pressing rod 9 to descend, when the pressing rod 9 slides into the first vertical guide groove 1501, the upper template 6 drives the pressing rod 9 to descend continuously, the pressing rod 9 contacts with the first inclined surface 211 and presses the first inclined surface 211, so that the pushing blocks 21 at two ends of the lower template 5 move oppositely, the second inclined surface 212 of the pushing block 21 pushes the lifting plate 18 upwards, the sealing groove 19 of the lifting plate 18 is clamped on a pin of the lead frame body 7, when the pressing rod 9 is separated from the first inclined surface 211, the lifting plate 18 does not continue to upwards, the end surface of the lifting plate 18 is flush with the end surface of the lead frame body 7, the side wall and the bottom surface of the functional area 701 are isolated from the side wall and the bottom surface of the non-functional area 702, the upper template 6 descends continuously, the sealing ring 62 cooperates with the end plate 52 and the lifting plate 18 to form annular sealing, and the end part of the end plate 52 can be provided with sealing pieces so as to increase the sealing performance of the sealing ring 62, so that only the functional area 701 is placed in the inner cavity 701 and the top groove 51 and the top groove 61, the non-functional area 702 is not roughened in the non-functional area 702 is also protected from being roughened in the non-functional area 702.
As an implementation mode of the invention, the top wall of the top groove 61 of the upper template 6 is fixedly connected with a plurality of groups of sealing seats 23, the distance between the plurality of groups of sealing seats 23 is equal to the pin width of the lead frame body 7, the opposite surfaces of the plurality of groups of sealing seats 23 are fixedly connected with sealing rubber sleeves 24, a cavity 25 is arranged in the sealing seat 23, and a rubber sleeve expanding and supporting assembly is arranged in the cavity 25; when the device works, after the upper template 6 drives the compression bar 9 to separate from the inclined plane one 211, the upper template 6 extrudes and descends, the upper template 6 drives the sealing seat 23 to descend, so that the sealing rubber sleeve 24 is propped against a gap between the pin 71 and the sealing groove 19 to seal the gap, when the upper template 6 drives the sealing seat 23 to continuously descend, the push block 28 extrudes with the lifting plate 18, the push block 28 moves into the cavity 25 after being extruded, and the push block 28 pushes the expanding and supporting assembly in the moving process, so that the expanding and supporting assembly extrudes the sealing rubber sleeve 24, the sealing performance of the sealing rubber sleeve 24 on the gap between the pin 71 and the sealing groove 19 is improved, and the coarsening liquid is prevented from contacting the functional area 701 of the pin 71.
As one embodiment of the present invention, the expanding and supporting assembly comprises two guide plates 26, a pushing block 28 and a presumption plate 27, wherein the pushing block 28 is slidably connected to the side wall of the sealing seat 23, the two guide plates 26 are fixedly connected to the inner wall of the cavity 25, the presumption plate 27 is slidably connected between the two guide plates 26, the presumption plate 27 is in a T shape, and one end of the presumption plate 27, which is close to the pushing block 28, is provided with a slope III 271; during operation, in the process that the upper template 6 drives the sealing seat 23 to descend, the ejector block 28 is extruded by the lifting plate 18 and moves into the cavity 25, the ejector block 28 extrudes the inclined surface III 271, so that the presumption plate 27 moves towards the inside of the sealing rubber sleeve 24, the presumption plate 27 props the sealing rubber sleeve 24 outwards, the extrusion degree of the sealing rubber sleeve 24, the lifting plate 18 and the side wall of the pin 71 is increased, and the sealing performance of the sealing rubber sleeve 24 on the gap between the pin 71 and the sealing groove 19 is improved.
As one embodiment of the invention, the back of the presumption plate 27 is symmetrically and fixedly connected with a cylindrical rod 29, one end of the cylindrical rod 29 far away from the sealing rubber sleeve 24 is slidingly connected on the guide plate 26, and the cylindrical rod 29 is sleeved with a spring five 30; when the coarsening device is in operation, after the coarsening of the lead frame body 7 is completed, the push block 28 is separated from the lifting plate 18, the spring five 30 can push the presumption plate 27 to push out of the sealing rubber sleeve 24 and return to the original state, and meanwhile, the inclined surface three 271 of the presumption plate 27 retreats the push block 28 to the original position, so that coarsening treatment of the lead frame body 7 to be coarsened is facilitated.
As an embodiment of the present invention, one end of the pushing block 28 extending out of the sealing seat 23 is provided with a pushing surface one 281, the pushing surface one 281 is inclined downward, the other end of the pushing block 28 is provided with a pushing surface one 282, and the pushing surface two 282 faces the inclined surface three 271; when the sealing device works, in the process that the upper template 6 drives the sealing seat 23 to descend, the first pushing surface 281 of the pushing block 28 is in contact with the lifting plate 18, so that the pushing block 28 moves into the cavity 25, and in the process that the pushing block 28 moves into the cavity 25, the second pushing surface 282 pushes the third inclined surface 271, so that the estimating plate 27 moves towards the sealing rubber sleeve 24 and enters the sealing rubber sleeve 24, and the sealing rubber sleeve 24 is expanded.
As one embodiment of the present invention, a storage cavity is formed in the estimation plate 27, a plurality of round holes 31 communicated with the storage cavity are symmetrically formed in the side wall of the estimation plate 27, a lubricant is contained in the estimation plate 27, and a plugging structure is arranged in the estimation plate 27 and is used for plugging the plurality of round holes 31; during operation, the plugging assembly is separated from the round hole 31 in the process of moving the inner wall of the sealant sleeve 24 and the presumption plate 27 are lubricated by the lubricant contained in the presumption plate 27 flowing out of the round hole 31, so that friction force is reduced to prevent the presumption plate 27 from moving into the sealant sleeve 24, movement smoothness of the presumption plate 27 is improved, and expansion of the sealant sleeve 24 is facilitated.
As one embodiment of the present invention, the plugging structure comprises a seal 32 and two cylindrical shafts 33, the seal 32 is slidably connected in the estimating plate 27, one ends of the two cylindrical shafts 33 are fixedly connected to the back of the seal 32, and the other ends of the two sealing seats 23 penetrate through the side wall of the estimating plate 27 and are fixedly connected to the guide plate 26; in the process of pushing the presumption plate 27 into the sealing gum cover 24 by the pushing block 28, the cylindrical shaft 33 is fixed, and the cylindrical shaft 33 is retreated relative to the presumption plate 27, so that the seal 32 is separated from the round hole 31, the blocking of the round hole 31 is relieved, the lubricant can flow out of the round hole 31 and enter the sealing gum cover 24, the friction force between the presumption plate 27 and the inner wall of the sealing gum cover 24 can be reduced, and the moving smoothness of the presumption plate 27 can be improved.
The working principle of the invention is as follows: the prior art of spraying or soaking the lead frame in roughening liquid is mature, the roughening treatment is carried out on the lead frame to increase the bonding force of the lead frame and packaging resin combination, in the process of carrying out local roughening, the separation of the local roughening area and the non-roughening area is inconvenient, the part which does not need to be combined with the packaging resin is roughened, waste of the roughening liquid is caused, in addition, when a chip is in plastic packaging, packaging resin overflows to a non-glued area, the bonding force of the overflowed packaging resin and the roughened surface of a non-functional area is strong, so that the overflow glue is difficult to remove, the embodiment of the invention can solve the problems, the specific implementation is as follows, one side of the lead frame body 7 is propped against a stop strip 11, then the other end of the lead frame body 7 is downwards pressed towards a limit component, the cooperation of the stop strip 11 and the limit component is carried out on the lead frame body 7, the stability of the lead frame body 7 is favorably increased on a lower template 5, then a telescopic shaft of a cylinder 4 drives an upper template 6 to be downwards, in the process of the upper template 6, the lead frame body 7 is subjected to the overflow regulation mechanism is carried out on the lead frame body, the position of the lead frame body 7 is favorably regulated, the position of the frame body 7 is higher than the roughened surface of the non-functional area, the roughened surface of the non-functional area is higher than the roughened surface of the lead frame body is favorably, the lead frame body 7 is favorably separated from the two ends of the lead frame body 7 are separated from the upper template 6, the upper template 6 is favorably, the upper template 6 is separated from the lower surface of the upper template 6, the upper end of the lead frame 7 is favorably is separated by the upper template 6, and the upper end of the upper template 6 is favorably and lower down surface of the lead frame 7 is favorably is separated, and the upper and lower down end of the lead frame 7 is sequentially, and lower down and lower surface of the lead frame 7 is sequentially, and lower frame is 6 is sequentially is separated, the sealing ring 62 cooperates with the end plate 52 and the partition assembly to form an annular seal, so that only 701 is placed in the first cavity 51 and the top groove 61, so that only 701 is roughened in the roughening process, after the upper die plate 6 is pressed, the stop bar 11 is placed in the rectangular groove 111, the upper part of the limit assembly is placed in the square groove 63, roughening liquid enters into a cavity formed by the first cavity 51 of the lower die plate 5 and the top groove 61 of the upper die plate 6 from the liquid inlet pipe 201 of the base 2, the roughening liquid performs roughening treatment on the functional area 701 of the lead frame body 7, and after the roughening treatment, the roughening liquid flows out from the liquid outlet pipe 202.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims.
Claims (8)
1. The coarsening equipment after etching the lead frame comprises a coarsening pool (1), and is characterized in that the inner bottom surface of the coarsening pool (1) is fixedly connected with a base (2) and a fixing frame (3), the end parts of the base (2) are fixedly connected with a liquid inlet pipe (201) and a liquid outlet pipe (202), the upper surface of the base (2) is fixedly connected with a lower template (5), one side of the upper surface of the lower template (5) is fixedly connected with a stop bar (11), the other side of the upper surface of the lower template (5) is provided with a limiting component, the fixing frame (3) is fixedly connected with a cylinder (4), two telescopic shafts of the cylinder (4) penetrate through the fixing frame (3) and are fixedly connected with an upper template (6), the side walls at two ends of the upper template (6) are fixedly connected with guide rods (8) symmetrically, the side walls at two ends of the lower template (5) are fixedly connected with guide frames (10) symmetrically, the lower parts of the guide rods (8) are inserted into the guide frames (10) at corresponding positions, the lower template (5) are fixedly connected with limiting mechanisms, the upper end parts of the lower template (5) are provided with limiting mechanisms (61) respectively, the upper template (61) are fixedly connected with a limiting groove (61), the upper die plate (6) is provided with a rectangular groove (111) and two square grooves (63), the lower die plate (5) is provided with an inner cavity I (51), two ends of the inner cavity I (51) are fixedly connected with end plates (52), the inner wall of the inner cavity I (51) is provided with a separation component, and the separation component is used for realizing separation of a functional area (701) and a nonfunctional area (701) of the lead frame body (7);
the limiting and adjusting mechanism comprises two guide grooves (151), a clamping block (15) and two pressing rods (9), wherein the clamping block (15) is in sliding insertion connection with the middle position of the end part of the lower die plate (5), the two pressing rods (9) are respectively and fixedly connected to the opposite surfaces of the two guide rods (8), the two pressing rods (9) are symmetrically arranged, the two guide grooves (151) are symmetrically formed in the end face of the clamping block (15), the two guide grooves (151) comprise a first vertical guide groove (1501), an inclined guide groove (1502) and a second vertical guide groove (1503), three second springs (16) are fixedly connected to the inner wall of a connecting cavity formed in the lower end of the clamping block (15), and one end, far away from the clamping block (15), of each second spring (16) is fixedly connected to the side wall of the lower die plate (5);
the separation assembly comprises two supporting plates (17), the two supporting plates (17) are fixedly connected to the inner wall of the first inner cavity (51), a lifting plate (18) is connected to the inner side of a connecting cavity formed in the top of the supporting plate (17) in a sliding mode, the end portion of the lifting plate (18) is in sliding contact with the end plate (52), a sealing groove (19) is formed in the lifting plate (18), an upward pushing assembly is arranged at the end portion of the supporting plate (17), the upward pushing assembly is used for pushing the lifting plate (18) to ascend to be matched with the upper template (6) to isolate the end portion of the lead frame body (7), the upward pushing assembly comprises a pushing block (21), the pushing block (21) is connected to the end portion of the lower template (5) in a sliding mode, one end of the pushing block (21) is close to the lifting plate (18) in the supporting plate (17), an inclined plane I (211) and an inclined plane II (212) are formed in the upper end of the pushing block (21), the end portion of the pushing block (21) is far away from the bottom of the supporting plate (17) in a fixed mode, four springs (22) are connected to the bottom of the supporting plate (17), and the four springs are connected to the side walls of the supporting plate (17) in a sliding mode.
2. The etched lead frame post-roughening device according to claim 1, wherein the limiting assembly comprises a mounting seat (12), the mounting seat (12) is symmetrically and fixedly connected to the upper surface of the lower die plate (5), a limiting block (13) is slidably connected to the mounting seat (12), the end portion of the limiting block (13) is trapezoid, a first spring (14) is fixedly connected to the back portion of the limiting block (13), and one end, away from the limiting block (13), of the first spring (14) is fixedly connected to the inner wall of the mounting seat (12).
3. The post-etching coarsening equipment for the lead frame according to claim 1, wherein a plurality of groups of sealing seats (23) are fixedly connected to the top wall of a top groove (61) of the upper template (6), the distance between the plurality of groups of sealing seats (23) is equal to the pin width of the lead frame body (7), the opposite surfaces of the plurality of groups of sealing seats (23) are fixedly connected with sealing rubber sleeves (24), a cavity (25) is formed in the sealing seats (23), and a rubber sleeve expanding and supporting assembly is arranged in the cavity (25).
4. A post-etching leadframe roughening apparatus according to claim 3, characterized in that the spreader assembly comprises two guide plates (26), an ejector block (28) and a presumption plate (27), the ejector block (28) is slidably connected to the side wall of the sealing seat (23), the two guide plates (26) are fixedly connected to the inner wall of the cavity (25), the presumption plate (27) is slidably connected between the two guide plates (26), the presumption plate (27) is in a T shape, and one end of the presumption plate (27) close to the ejector block (28) is provided with a bevel three (271).
5. The etched lead frame post-roughening device according to claim 4, wherein a cylindrical rod (29) is symmetrically and fixedly connected to the back of the presumption plate (27), one end, far away from the sealing rubber sleeve (24), of the cylindrical rod (29) is slidably connected to the guide plate (26), and a spring five (30) is sleeved on the cylindrical rod (29).
6. The post-etching roughening apparatus according to claim 5, wherein one end of the ejector block (28) extending out of the sealing seat (23) is provided with an ejector surface one (281), the ejector surface one (281) is inclined downward, the other end of the ejector block (28) is provided with an ejector surface two (282), and the ejector surface two (282) faces the inclined surface three (271).
7. The etched lead frame post-roughening device according to claim 4, wherein a storage cavity is formed in the presumption plate (27), a plurality of round holes (31) communicated with the storage cavity are symmetrically formed in the side wall of the presumption plate (27), lubricant is contained in the presumption plate (27), and a plugging structure is arranged in the presumption plate (27) and used for plugging a plurality of round holes (31).
8. The etched lead frame post-roughening device according to claim 7, wherein the plugging structure comprises a seal (32) and two cylindrical shafts (33), the seal (32) is slidably connected in the estimating plate (27), one ends of the two cylindrical shafts (33) are fixedly connected to the back of the seal (32), and the other ends of the two sealing seats (23) penetrate through the side wall of the estimating plate (27) and are fixedly connected to the guide plate (26).
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| CN202310476226.8A CN116364611B (en) | 2023-04-28 | 2023-04-28 | Coarsening equipment after etching lead frame |
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| CN202310476226.8A CN116364611B (en) | 2023-04-28 | 2023-04-28 | Coarsening equipment after etching lead frame |
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| CN116364611B true CN116364611B (en) | 2023-09-01 |
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|---|---|---|---|---|
| CN108155120A (en) * | 2017-12-18 | 2018-06-12 | 广州丰江微电子有限公司 | A kind of device for lead frame surface processing |
| CN112133640A (en) * | 2020-11-24 | 2020-12-25 | 宁波康强电子股份有限公司 | Preparation method of lead frame with rough side wall |
| CN213878086U (en) * | 2020-12-31 | 2021-08-03 | 苏州住立精工有限公司 | Local area coarsening lead frame capable of enhancing chip packaging stability |
| CN114050117A (en) * | 2021-11-17 | 2022-02-15 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
| CN115863181A (en) * | 2022-11-25 | 2023-03-28 | 崇辉半导体(江门)有限公司 | Selective coarsening equipment and coarsening method for semiconductor lead frame |
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2023
- 2023-04-28 CN CN202310476226.8A patent/CN116364611B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108155120A (en) * | 2017-12-18 | 2018-06-12 | 广州丰江微电子有限公司 | A kind of device for lead frame surface processing |
| CN112133640A (en) * | 2020-11-24 | 2020-12-25 | 宁波康强电子股份有限公司 | Preparation method of lead frame with rough side wall |
| CN213878086U (en) * | 2020-12-31 | 2021-08-03 | 苏州住立精工有限公司 | Local area coarsening lead frame capable of enhancing chip packaging stability |
| CN114050117A (en) * | 2021-11-17 | 2022-02-15 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
| CN115863181A (en) * | 2022-11-25 | 2023-03-28 | 崇辉半导体(江门)有限公司 | Selective coarsening equipment and coarsening method for semiconductor lead frame |
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| CN116364611A (en) | 2023-06-30 |
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