CN116352316A - 一种金锡焊带的制备方法、产品及应用 - Google Patents
一种金锡焊带的制备方法、产品及应用 Download PDFInfo
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- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 title claims abstract description 151
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 77
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000010931 gold Substances 0.000 claims abstract description 137
- 229910052737 gold Inorganic materials 0.000 claims abstract description 128
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 127
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 116
- 238000005476 soldering Methods 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000002131 composite material Substances 0.000 claims abstract description 38
- 238000003490 calendering Methods 0.000 claims abstract description 15
- 238000005096 rolling process Methods 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 12
- 238000007254 oxidation reaction Methods 0.000 abstract description 12
- 238000005275 alloying Methods 0.000 description 13
- 241001391944 Commicarpus scandens Species 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 238000003723 Smelting Methods 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 4
- 238000005056 compaction Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000009776 industrial production Methods 0.000 description 3
- 238000010301 surface-oxidation reaction Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- -1 firstly Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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Abstract
本申请公开了一种金锡焊带的制备方法、产品及应用,涉及焊接技术领域。一种金锡焊带的制备方法,包括以下步骤:将金锭进行压延,制成金带,再将金带冲裁成型,得金片;将锡锭进行压延,制成锡带,再将锡带冲裁成型,得锡片;将金片和锡片依次叠合,并压实,得金锡复合锭;对金锡复合锭进行压延,得金锡焊带。本申请的制备过程中由于并未合金化,故保留了金和锡的良好的延展性,使得制备的金锡焊带拥有高延展性,解决了在冲压成型过程中金锡焊带极易出现的崩边裂纹甚至断裂等问题,且极大程度地提高了金锡焊带的抗氧化性。
Description
技术领域
本申请涉及焊接技术领域,特别涉及一种金锡焊带的制备方法、产品及应用。
背景技术
金锡焊料Au80Sn20因其优良的抗拉强度、抗蚀性强、蒸气压低并有很好的流动性及润湿性等优点,已在气密封装、芯片封装等领域有很长的使用历史。其优势相比于低温钎料非常突出,而其抗拉强度又足以媲美高温钎料。
但金锡焊料也有明显的缺点从而限制了其部分应用和加工,由于在现有的制备工艺中,经过常规的熔炼合金化后再压延制备的金锡焊料在常温下很脆,延展性很低,故在冲压成型过程中由于金锡焊料延展性低,会导致金锡焊带极易出现崩边裂纹甚至断裂,影响使用,且加工过程中也极易出现断带。
发明内容
本申请的主要目的是提供一种金锡焊带的制备方法、产品及应用,旨在解决现有技术中的金锡焊带极易出现崩边裂纹甚至断裂的技术问题。
为实现上述目的,本申请提出了一种金锡焊带的制备方法,包括以下步骤:
将金锭进行压延,制成金带,再将上述金带冲裁成型,得金片;
将锡锭进行压延,制成锡带,再将上述锡带冲裁成型,得锡片;
将上述金片和上述锡片依次叠合,并压实,得金锡复合锭;
对上述金锡复合锭进行压延,得金锡焊带。
可选地,将上述金锭进行压延,制成金带的步骤,包括:将上述金锭用轧机压延成金带,并控制上述金带厚度在0.387-0.401mm。
可选地,将上述锡锭进行压延,制成锡带的步骤,包括:将上述锡锭用轧机压延成锡带,并控制上述锡带厚度在0.320-0.334mm。
可选地,在制备上述金锡复合锭前,还包括:对上述金片和上述锡片进行等离子清洗。
可选地,将金片和锡片依次叠合时,最外层均为金片。
可选地,将上述金片和上述锡片依次叠合,并压实,得金锡复合锭的步骤,包括:
制作模具,上述模具包括围框、底顶块和上顶块,上述底顶块嵌合于上述围框内;
将上述金片和上述锡片依次叠合于上述底顶块上,再将上述上顶块嵌合于上述围框内并覆盖于金片和锡片上;
对上述上顶块施加压力,压实后,得金锡复合锭。
可选地,施加压力时,压力调整为180-220吨。
可选地,上述金锡复合锭中金与锡的质量比为80:20。
基于同样的目的,本申请还提供了一种金锡焊带,通过上述制备方法而得。
基于同样的目的,本申请还提供了一种如上述的金锡焊带的应用,将上述金锡焊带通过以下步骤进行焊接:
将上述金锡焊带在真空回流炉内升温至280-300℃,形成Au80Sn20合金态,再对被焊接件和基板之间进行焊接。
在制备金锡焊料的现有工艺中,首先就是将金和锡进行熔炼合金化,后续再进行压延、预成型加工,而无法避免金锡合金化后在常温下易脆、延展性很低的问题,故本申请基于这一点出发,采用金锡叠层的方式制备金锡复合带代替现有的熔炼合金化,避免熔炼合金化过程中的高温所导致的金锡焊料延展性低的问题。金锡叠层的方式,不仅保留了金的高抗氧化性和锡的高延展性,在金锡焊带加工过程中也不易断裂,且能避免后续加工过程中表面发生氧化,提高了焊料的品质及成品率,并且由于成品金锡焊带具有高延展性和抗氧化性,更有利于后续的预成型加工,比如在冲压加工过程中,需要加工圆环时,由于圆环的边宽窄、厚度大的情况,常规合金化方式制备的金锡焊带加工圆环时,极易发生崩边甚至断裂,且当圆环厚度和宽度的比值大于2时,就完全无法实现圆环的加工,从而限制了金锡焊带的很多应用场景,而采用本申请制备的金锡焊带就完全解决了这个问题,能做到常规的金锡焊带做不到的尺寸或者形状。
本申请制备金锡焊带的过程中由于并未合金化,故保留了金和锡良好的延展性,使得制备的金锡焊带拥有高延展性,解决了在冲压成型过程中金锡焊带极易出现的崩边裂纹甚至断裂等问题。且制备过程中未进行高温加热,整个金锡焊带表面较少发生氧化,故而极大程度地提高了金锡焊带的抗氧化性,相比于常规合金化方式加工的金锡焊带,保质期能够得到极大的提升,并且能够节约能源,有利于工业化生产。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。
图1为本申请实施例所述的制备金锡复合锭的模具的示意图。
附图标记:
1-围框;2-底顶块;3-金片;4-锡片;5-上顶块。
本申请目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请的一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
金锡焊料在现有的制备工艺中,由于经过常规的熔炼合金化后再压延制备的金锡焊料在常温下很脆,延展性很低,故在冲压成型过程中由于金锡焊料延展性低,会导致金锡焊带极易出现崩边裂纹甚至断裂,影响使用,且加工过程中也极易出现断带。
针对上述现有的金锡焊料制备方法所存在的技术问题,本申请的实施例提供了一种金锡焊带的制备方法,包括以下步骤:
将金锭进行压延,制成金带,再将上述金带冲裁成型,得金片;
将锡锭进行压延,制成锡带,再将上述锡带冲裁成型,得锡片;
将上述金片和上述锡片依次叠合,并压实,得金锡复合锭;
对上述金锡复合锭进行压延,得金锡焊带。
本申请制备金锡焊带的过程中由于并未合金化,故保留了金和锡良好的延展性,使得制备的金锡焊带拥有高延展性,解决了在冲压成型过程中金锡焊带极易出现的崩边裂纹甚至断裂等问题。且制备过程中未进行高温加热,整个金锡焊带表面较少发生氧化,故而极大程度地提高了金锡焊带的抗氧化性,相比于常规合金化方式加工的金锡焊带,保质期能够得到极大的提升,并且能够节约能源,有利于工业化生产。
作为本申请的一种可实施方式,将上述金锭进行压延,制成金带的步骤,包括:将上述金锭用轧机压延成金带,并控制上述金带厚度在0.387-0.401mm。控制金带的厚度在0.387-0.401mm,便于控制金的质量,以便于后续在预成型加工中控制合金中金的比例。
作为本申请的一种可实施方式,将上述锡锭进行压延,制成锡带的步骤,包括:将上述锡锭用轧机压延成锡带,并控制上述锡带厚度在0.320-0.334mm。控制锡带的厚度在0.320-0.334mm,便于控制锡的质量,以便于后续在预成型加工中控制合金中锡的比例。
作为本申请的一种可实施方式,在制备上述金锡复合锭前,还包括:对上述金片和上述锡片进行等离子清洗。通过等离子清洗机对气体施加足够的能量使之离化便成为等离子状态,等离子体的“活性”组分包括:离子、电子、原子、活性基团、光子等,通过这些活性组分的性质来处理金片和锡片表面,从而实现清洁的目的,可除去金片和锡片表面的外来有机物和无机物,避免在后续加工过程中对金锡焊带的品质产生影响,且经等离子清洗之后金片和锡片表面是干燥的,不需要再经干燥处理即可送往下一道工序,可以提高整个制备过程的处理效率。
作为本申请的一种可实施方式,将金片和锡片依次叠合时,最外层均为金片。将金片和锡片按“金片、锡片、金片、锡片....金片”的顺序交替进行叠合。叠合时,金片在最外层,故而制备得到的金锡焊带表层均为金片,而黄金层的抗氧化性极高,故而进一步提升了金锡焊带的抗氧化性,从而提高了成品金锡焊带的保质期。
作为本申请的一种可实施方式,将上述金片和上述锡片依次叠合,并压实,得金锡复合锭的步骤,包括:
制作模具,上述模具包括围框、底顶块和上顶块,上述底顶块嵌合于上述围框内;
将上述金片和上述锡片依次叠合于上述底顶块上,再将上述上顶块嵌合于上述围框内并覆盖于金片和锡片上;
对上述上顶块施加压力,压实后,得金锡复合锭。
在制备金锡焊料的现有工艺中,首先就是将金和锡进行熔炼合金化,后续再进行压延、预成型加工,而无法避免金锡合金化后在常温下易脆、延展性很低的问题,故本申请基于这一点出发,采用金锡叠层的方式制备金锡复合带代替现有的熔炼合金化,避免熔炼合金化过程中的高温所导致的金锡焊料延展性低的问题。金锡叠层的方式,不仅保留了金的高抗氧化性和锡的高延展性,在金锡焊带加工过程中也不易断裂,且能避免后续加工过程中表面发生氧化,提高了焊料的品质及成品率,并且由于成品金锡焊带具有高延展性和抗氧化性,更有利于后续的预成型加工,比如在冲压加工过程中,需要加工圆环时,由于圆环的边宽窄、厚度大的情况,常规合金化方式制备的金锡焊带加工圆环时,极易发生崩边甚至断裂,且当圆环厚度和宽度的比值大于2时,就完全无法实现圆环的加工,从而限制了金锡焊带的很多应用场景,而采用本申请制备的金锡焊带就完全解决了这个问题,能做到常规的金锡焊带做不到的尺寸或者形状。
作为本申请的一种可实施方式,施加压力时,上述压力为180-220吨。通过油压力机将压力调整为180-220吨后,对金片和锡片施加压力,保证能够将金片和锡片充分压实,形成金锡复合带。
作为本申请的一种可实施方式,上述金锡复合锭中金与锡的质量比为80:20。
基于相同的发明思路,本申请的实施例还提供了一种金锡焊带,由上述制备方法而得。
本申请制备的金锡焊带保留了金和锡的高延展性,便于后续步骤中对金锡焊带进行压延而不易断裂或崩边,使得制备的金锡焊带品质较高,且金层的抗氧化性能优良,焊带的表层氧化程度较低,成品的保质期较高,可以得到可靠的焊接材料。
基于相同的发明思路,本申请的实施例还提供了一种如上述的金锡焊带的应用,将上述金锡焊带通过以下步骤进行焊接:
将上述金锡焊带在真空回流炉内升温至280-300℃,形成Au80Sn20合金态,再对被焊接件和基板之间进行焊接。
本申请制备的金锡焊带在真空回流炉内升温到280-300℃时,金锡叠层在此温度下完成合金化,自然形成Au80Sn20合金态,完成被焊接件和基板之间的焊接,且金锡焊带具有良好的流动性及润湿性,回到常温后拥有同样的抗拉强度,且抗蚀性强。
下面结合具体实施例对本申请所述技术方案进行详细说明。
实施例1
一种金锡焊带的制备方法,包括以下步骤:
将1000g的99.99%金锭用轧机压延成金带,再用300×70mm的模具和冲床将金带冲裁成300×70×0.394mm的片材,得金片,重量约160g/片;
将300g的99.99%锡锭用轧机压延成锡带,再用300×70mm的模具和冲床将锡带冲成300×70×0.327mm的片材,得锡片,重量约50g/片;
取5片金片和4片锡片,再通过等离子清洗机对金片和锡片进行清洗;
制作模具,上述模具包括围框、底顶块和上顶块,上述底顶块嵌合于上述围框内,其中,围框内型腔尺寸300×70mm;
将清洗后的金片和锡片按“金片、锡片、金片、锡片....金片”的顺序共9片依次叠合于上述底顶块上,再将上述上顶块嵌合于上述围框内并覆盖于叠合后的金片和锡片上;
将油压力机压力调整为200吨并对上述上顶块施加压力,压实后,得金锡复合锭,其中,金锡复合锭中金与锡的质量比为80:20;
通过冷轧机对上述金锡复合锭进行压延,反复多个道次将其加工成需要的厚度,得成品金锡焊带。
使用时,将上述成品金锡焊带在真空回流炉内升温至290℃,形成Au80Sn20合金态,再对被焊接件和基板之间进行焊接。
实施例2
一种金锡焊带的制备方法,包括以下步骤:
将1000g的99.99%金锭用轧机压延成金带,再用300×70mm的模具和冲床将金带冲裁成300×70×0.387mm的片材,得金片,重量约160g/片;
将300g的99.99%锡锭用轧机压延成锡带,再用300×70mm的模具和冲床将锡带冲成300×70×0.320mm的片材,得锡片,重量约50g/片;
取5片金片和4片锡片,再通过等离子清洗机对金片和锡片进行清洗;
制作模具,上述模具包括围框、底顶块和上顶块,上述底顶块嵌合于上述围框内,其中,围框内型腔尺寸300×70mm;
将清洗后的金片和锡片按“金片、锡片、金片、锡片....金片”的顺序共9片依次叠合于上述底顶块上,再将上述上顶块嵌合于上述围框内并覆盖于叠合后的金片和锡片上;
将油压力机压力调整为180吨并对上述上顶块施加压力,压实后,得金锡复合锭,其中,金锡复合锭中金与锡的质量比为80:20;
通过冷轧机对上述金锡复合锭进行压延,反复多个道次将其加工成需要的厚度,得成品金锡焊带。
使用时,将上述成品金锡焊带在真空回流炉内升温至280℃,形成Au80Sn20合金态,再对被焊接件和基板之间进行焊接。
实施例3
一种金锡焊带的制备方法,包括以下步骤:
将1000g的99.99%金锭用轧机压延成金带,再用300×70mm的模具和冲床将金带冲裁成300×70×0.401mm的片材,得金片,重量约160g/片;
将300g的99.99%锡锭用轧机压延成锡带,再用300×70mm的模具和冲床将锡带冲成300×70×0.334mm的片材,得锡片,重量约50g/片;
取5片金片和4片锡片,再通过等离子清洗机对金片和锡片进行清洗;
制作模具,上述模具包括围框、底顶块和上顶块,上述底顶块嵌合于上述围框内,其中,围框内型腔尺寸300×70mm;
将清洗后的金片和锡片按“金片、锡片、金片、锡片....金片”的顺序共9片依次叠合于上述底顶块上,再将上述上顶块嵌合于上述围框内并覆盖于叠合后的金片和锡片上;
将油压力机压力调整为220吨并对上述上顶块施加压力,压实后,得金锡复合锭,其中,金锡复合锭中金与锡的质量比为80:20;
通过冷轧机对上述金锡复合锭进行压延,反复多个道次将其加工成需要的厚度,得成品金锡焊带。
使用时,将上述成品金锡焊带在真空回流炉内升温至300℃,形成Au80Sn20合金态,再对被焊接件和基板之间进行焊接。
实施例4
一种金锡焊带的制备方法,包括以下步骤:
将1000g的99.99%金锭用轧机压延成金带,再用300×70mm的模具和冲床将金带冲裁成300×70×0.398mm的片材,得金片,重量约160g/片;
将300g的99.99%锡锭用轧机压延成锡带,再用300×70mm的模具和冲床将锡带冲成300×70×0.324mm的片材,得锡片,重量约50g/片;
取5片金片和4片锡片,再通过等离子清洗机对金片和锡片进行清洗;
制作模具,上述模具包括围框、底顶块和上顶块,上述底顶块嵌合于上述围框内,其中,围框内型腔尺寸300×70mm;
将清洗后的金片和锡片按“金片、锡片、金片、锡片....金片”的顺序共9片依次叠合于上述底顶块上,再将上述上顶块嵌合于上述围框内并覆盖于叠合后的金片和锡片上;
将油压力机压力调整为210吨并对上述上顶块施加压力,压实后,得金锡复合锭,其中,金锡复合锭中金与锡的质量比为80:20;
通过冷轧机对上述金锡复合锭进行压延,反复多个道次将其加工成需要的厚度,得成品金锡焊带。
使用时,将上述成品金锡焊带在真空回流炉内升温至295℃,形成Au80Sn20合金态,再对被焊接件和基板之间进行焊接。
实验例
检测实施例1-4所得的成品金锡焊带的厚度的均匀性,以及金锡焊带的成品率(统计生产50片金锡焊带的成品率),成品率主要包括金锡焊带中表面平整光洁、无崩边、无裂纹的焊带的占比,结果如表1所述。
表1
检测项目 | 厚度均匀性 | 成品率(%) |
实施例1 | 厚度均匀 | 99 |
实施例2 | 厚度均匀 | 96 |
实施例3 | 厚度均匀 | 95 |
实施例4 | 厚度均匀 | 98 |
从表中可以看出,经过本申请的制备方法所得的金锡焊带厚度均匀,成品率较高,由于本申请避免了熔炼合金化过程中的高温所导致的金锡焊料延展性低的问题,保留了金的高抗氧化性和锡的高延展性,在金锡焊带加工过程中不易断裂,在后续加工过程中提高了焊料的品质及成品率,故能够获得厚度均匀、品质优良的金锡焊带。
综上所述,本申请提供一种金锡焊带的制备方法,本申请采用金锡叠层的方式制备金锡复合带,避免了经过常规的熔炼合金化后再压延制备金锡焊料的方式所导致的金锡焊料在常温下易脆、延展性很低的问题,金锡叠层的方式,不仅保留了金和锡的高延展性,使其更容易被压延,且在金锡焊带加工过程也不易断裂,提高了焊料的品质及成品率,并且由于成品金锡焊带具有高延展性,更有利于后续的预成型加工,比如在冲压加工过程中,需要加工圆环时,由于圆环的边宽窄、厚度大的情况,常规合金化方式制备的金锡焊带加工圆环时,极易发生崩边甚至断裂,且当圆环厚度和宽度的比值大于2时,就完全无法实现圆环的加工,从而限制了金锡焊带的很多应用场景,而采用本申请制备的金锡焊带就完全解决了这个问题,能做到常规的金锡焊带做不到的尺寸或者形状。
本申请制备金锡焊带的过程中由于并未合金化,故保留了金和锡良好的延展性,使得制备的金锡焊带拥有高延展性,解决了在冲压成型过程中金锡焊带极易出现的崩边裂纹甚至断裂等问题。且制备过程中未进行高温加热,整个金锡焊带表面较少发生氧化,故而极大程度地提高了金锡焊带的抗氧化性,相比于常规合金化方式加工的金锡焊带,保质期能够得到极大的提升,并且能够节约能源,有利于工业化生产。
以上所述仅为本申请的可选实施例,并非因此限制本申请的专利范围,凡是在本申请的发明构思下,利用本申请说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。
Claims (10)
1.一种金锡焊带的制备方法,其特征在于,包括以下步骤:
将金锭进行压延,制成金带,再将所述金带冲裁成型,得金片;
将锡锭进行压延,制成锡带,再将所述锡带冲裁成型,得锡片;
将所述金片和所述锡片依次叠合,并压实,得金锡复合锭;
对所述金锡复合锭进行压延,得金锡焊带。
2.根据权利要求1所述的金锡焊带的制备方法,其特征在于,将所述金锭进行压延,制成金带的步骤,包括:将所述金锭用轧机压延成金带,并控制所述金带厚度在0.387-0.401mm。
3.根据权利要求1所述的金锡焊带的制备方法,其特征在于,将所述锡锭进行压延,制成锡带的步骤,包括:将所述锡锭用轧机压延成锡带,并控制所述锡带厚度在0.320-0.334mm。
4.根据权利要求1所述的金锡焊带的制备方法,其特征在于,在制备所述金锡复合锭前,还包括:对所述金片和所述锡片进行等离子清洗。
5.根据权利要求1所述的金锡焊带的制备方法,其特征在于,将金片和锡片依次叠合时,最外层均为金片。
6.根据权利要求1所述的金锡焊带的制备方法,其特征在于,将所述金片和所述锡片依次叠合,并压实,得金锡复合锭的步骤,包括:
制作模具,所述模具包括围框、底顶块和上顶块,所述底顶块嵌合于所述围框内;
将所述金片和所述锡片依次叠合于所述底顶块上,再将所述上顶块嵌合于所述围框内并覆盖于金片和锡片上;
对所述上顶块施加压力,压实后,得金锡复合锭。
7.根据权利要求6所述的金锡焊带的制备方法,其特征在于,施加压力时,所述压力为180-220吨。
8.根据权利要求1所述的金锡焊带的制备方法,其特征在于,所述金锡复合锭中金与锡的质量比为80:20。
9.一种金锡焊带,其特征在于,通过权利要求1-8任一项所述制备方法而得。
10.一种如权利要求9所述的金锡焊带的应用,其特征在于,将所述金锡焊带通过以下步骤进行焊接:
将所述金锡焊带在真空回流炉内升温至280-300℃,形成Au80Sn20合金态,再对被焊接件和基板之间进行焊接。
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