CN116344572A - Micro LED structure and preparation method thereof - Google Patents
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- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 199
- 230000003287 optical effect Effects 0.000 claims abstract description 104
- 230000005540 biological transmission Effects 0.000 claims abstract description 85
- 230000008878 coupling Effects 0.000 claims abstract description 74
- 238000010168 coupling process Methods 0.000 claims abstract description 74
- 238000005859 coupling reaction Methods 0.000 claims abstract description 74
- 238000000034 method Methods 0.000 claims description 25
- 239000011159 matrix material Substances 0.000 claims description 16
- 210000001503 joint Anatomy 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000003032 molecular docking Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- H01L33/58—Optical field-shaping elements
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- H01L2933/0008—Processes
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Abstract
The disclosure relates to a Micro LED structure and a preparation method thereof, and belongs to the technical field of Micro LED display; the Micro LED structure comprises a light emitting component, a first substrate, a waveguide transmission layer and an optical coupling component; the light-emitting component is arranged on one side of the first substrate; the waveguide transmission layer and the optical coupling component are arranged on one side of the first substrate, which is away from the light emitting component, and the optical coupling component is arranged in alignment with the light emitting component and embedded on one side of the waveguide transmission layer, which is close to the light emitting component; the first substrate is at least used for transmitting the light emitted by the light emitting component to the light coupling component; the optical coupling assembly is used for controlling the rotation angle of the light so that the light is transmitted according to a preset direction, and the waveguide transmission layer is used for transmitting the light in the preset direction to the diffraction optical waveguide. Therefore, the size of the Micro LED structure is reduced, and miniaturization of products is facilitated.
Description
Technical Field
The disclosure relates to the technical field of Micro LED display, in particular to a Micro LED structure and a preparation method thereof.
Background
At present, the existing Micro LED display technology mostly uses a mechanical huge transfer technology to take and place LEDs on a driving substrate, the distance between Micro LED pixels is large due to the limitation of mechanical precision and preparation yield, and after the preparation of the LEDs is completed, the LEDs are attached to structures such as a collimating lens module with large size and the like, and the structures are packaged, so that the size of the whole Micro LED structure is greatly increased, and the miniaturization of products is not facilitated.
Disclosure of Invention
In order to solve the technical problems described above or at least partially solve the technical problems described above, the present disclosure provides a Micro LED structure and a method of manufacturing the same.
The disclosure provides a Micro LED structure, which is connected with a diffraction optical waveguide in a matching way; the Micro LED structure comprises a light emitting component, a first substrate, a waveguide transmission layer and an optical coupling component;
the light-emitting component is arranged on one side of the first substrate; the waveguide transmission layer and the optical coupling component are arranged on one side of the first substrate, which is away from the light-emitting component, and the optical coupling component is arranged in alignment with the light-emitting component and embedded on one side of the waveguide transmission layer, which is close to the light-emitting component;
the first substrate is at least used for transmitting the light emitted by the light emitting component to the optical coupling component; the optical coupling assembly is used for controlling the rotation angle of light so as to enable the light to be transmitted according to a preset direction, and the waveguide transmission layer is used for transmitting the light in the preset direction to the diffraction optical waveguide.
Optionally, the optical coupling assembly comprises a light collimating component and a tilted grating;
the inclined grating is arranged on one side of the light collimation component, which faces away from the light-emitting component;
the light collimation component is used for collimating light; the inclined grating is used for controlling the collimated light to exit from the inclined grating at a preset rotation angle.
Optionally, the Micro LED structure further comprises a second substrate;
the second substrate is arranged on one side of the waveguide transmission layer, which is away from the first substrate;
the first substrate and the second substrate are jointly used for guiding light to transmit according to a preset direction based on total reflection of the light at the corresponding interface;
the interface surfaces of the first substrate and the waveguide transmission layer are corresponding to each other, and the interface surfaces of the second substrate and the waveguide transmission layer are corresponding to each other.
Optionally, the refractive index of the inclined grating is greater than the refractive index of the waveguide transmission layer, and the refractive index of the waveguide transmission layer is greater than the refractive index of the first substrate or the refractive index of the second substrate;
wherein the refractive index of the first substrate is equal to the refractive index of the second substrate.
Optionally, the Micro LED structure further comprises a black matrix; the light emitting assembly comprises LEDs arranged in an array;
the black matrix and the LEDs are alternately arranged;
the black matrix is used for blocking crosstalk of light emitted by adjacent LEDs.
Optionally, the Micro LED structure further comprises a driving substrate;
the driving substrate is arranged on the backlight side of the light-emitting component;
the driving substrate is used for driving and lighting the light emitting assembly.
Optionally, the Micro LED structure further comprises a waveguide interface layer;
the waveguide butt joint layer is arranged between the driving substrate and the first substrate;
the waveguide butt joint layer and the second substrate are respectively provided with a corresponding groove so as to be connected with the diffraction optical waveguide.
The disclosure also provides a preparation method of the Micro LED structure, which is used for preparing any one of the Micro LED structures; the method comprises the following steps:
forming a light emitting assembly on one side of a first substrate;
forming the waveguide transmission layer and the optical coupling assembly on one side of the first substrate away from the light emitting assembly;
the optical coupling component and the light emitting component are arranged in an alignment manner and embedded in one side, close to the light emitting component, of the waveguide transmission layer; the first substrate is at least used for transmitting the light emitted by the light emitting component to the optical coupling component; the optical coupling assembly is used for controlling the rotation angle of light so as to enable the light to be transmitted according to a preset direction, and the waveguide transmission layer is used for transmitting the light in the preset direction to the diffraction optical waveguide.
Optionally, the method further comprises:
and forming a second substrate on one side of the waveguide transmission layer, which is away from the first substrate.
Optionally, the method further comprises:
providing a driving substrate;
and forming electrical connection between the driving substrate and the light-emitting component by using a hybrid bonding mode.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:
the Micro LED structure provided by the embodiment of the disclosure comprises a light emitting component, a first substrate, a waveguide transmission layer and an optical coupling component; the light-emitting component is arranged on one side of the first substrate; the waveguide transmission layer and the optical coupling component are arranged on one side of the first substrate, which is away from the light emitting component, and the optical coupling component is arranged in alignment with the light emitting component and embedded on one side of the waveguide transmission layer, which is close to the light emitting component; the first substrate is at least used for transmitting the light emitted by the light emitting component to the light coupling component; the optical coupling assembly is used for controlling the rotation angle of the light so that the light is transmitted according to a preset direction, and the waveguide transmission layer is used for transmitting the light in the preset direction to the diffraction optical waveguide. Therefore, the light emitting component and the light coupling component are arranged on the two opposite sides of the first substrate respectively, and the light coupling component is embedded in the waveguide transmission layer, so that the size of the Micro LED structure is reduced, and the miniaturization of products is facilitated.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments of the present disclosure or the solutions in the prior art, the drawings that are required for the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a Micro LED structure provided in the prior art;
fig. 2 is a schematic structural diagram of a Micro LED structure according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of another Micro LED structure provided in an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a connection between a Micro LED structure and a diffractive optical waveguide according to an embodiment of the present disclosure;
fig. 5 is a schematic flow chart of a method for manufacturing a Micro LED structure according to an embodiment of the present disclosure.
Wherein, prior art: 110. a diffractive optical waveguide; 120. transparent adhesive tape; 130. a collimating lens module; 140. an LED array structure;
the scheme is as follows: 110. a diffractive optical waveguide; 210. a light emitting assembly; 211. an LED; 220. a first substrate; 230. a waveguide transport layer; 240. an optical coupling assembly; 241. a light collimation component; 242. tilting the grating; 250. a second substrate; 260. a black matrix; 270. the substrate is driven.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, a further description of aspects of the present disclosure will be provided below. It should be noted that, without conflict, the embodiments of the present disclosure and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced otherwise than as described herein; it will be apparent that the embodiments in the specification are only some, but not all, embodiments of the disclosure.
First, the defects existing in the prior art and the improvement points of the present application will be described in connection with the relevant background.
In the technical field of Micro LED display, an LED is usually formed on a driving substrate by adopting a mechanical transfer mode and the like, for example, the mechanical precision of the Micro LED can be more than 500nm and even more than 1 μm, so that the distance between Micro LED pixels is larger, for example, the pixel distance is usually 20um or more, and the LED and a collimating lens module and other structures are attached and packaged in the subsequent process, so that the conventional function is realized, but after the collimating lens module and other structures are introduced by using the attaching mode in the prior art, the Micro LED is connected with a diffraction optical waveguide in a matching way, and the overall size is increased. Illustratively, fig. 1 is a schematic structural diagram of a Micro LED structure provided in the prior art. Referring to fig. 1, fig. 1 shows that the LED array structure 140 is attached to one side of the collimating lens module 130 through the transparent adhesive 120, and the other side of the collimating lens module 130 is attached to the diffractive optical waveguide 110 through the transparent adhesive 120, so that the light emitted by the LED array structure 140 is collimated by the collimating lens module 130, and then the collimated light is transmitted to the diffractive optical waveguide 110. It should be noted that, to achieve a good collimation effect based on the lamination and assembly processes in the prior art, the collimating lens module 130 generally includes 5 to 10 resin lenses, which results in a longer length, a larger size of the collimating lens module 130, and is not beneficial to miniaturization of the product.
In view of at least one of the above drawbacks, embodiments of the present disclosure provide a Micro LED structure including a light emitting assembly, a first substrate, a waveguide transport layer, and an optical coupling assembly; the light-emitting component is arranged on one side of the first substrate; the waveguide transmission layer and the optical coupling component are arranged on one side of the first substrate, which is away from the light emitting component, and the optical coupling component is arranged in alignment with the light emitting component and embedded on one side of the waveguide transmission layer, which is close to the light emitting component; the first substrate is at least used for transmitting the light emitted by the light emitting component to the light coupling component; the optical coupling assembly is used for controlling the rotation angle of the light so that the light is transmitted according to a preset direction, and the waveguide transmission layer is used for transmitting the light in the preset direction to the diffraction optical waveguide. Like this, through integrated light emitting component and optical coupling subassembly on same base plate, first base plate, compare the Micro LED structure that the mode that carries out the laminating of collimating lens module again was compared in traditional discrete preparation, the whole volume and the size of Micro LED structure that this disclosed embodiment provided are littleer, do benefit to the miniaturization of product.
The Micro LED structure and the preparation method thereof provided by the embodiment of the present disclosure are described below by way of example with reference to the accompanying drawings.
Illustratively, in some embodiments, fig. 2 is a schematic structural diagram of a Micro LED structure provided by an embodiment of the present disclosure. Referring to fig. 2, the Micro LED structure and the diffraction optical waveguide 110 are coupled in a matching manner, the Micro LED structure including a light emitting assembly 210, a first substrate 220, a waveguide transmission layer 230, and an optical coupling assembly 240; the light emitting assembly 210 is disposed at one side of the first substrate 220; the waveguide transmission layer 230 and the optical coupling component 240 are both arranged on one side of the first substrate 220 away from the light emitting component 210, and the optical coupling component 240 is arranged in alignment with the light emitting component 210 and embedded on one side of the waveguide transmission layer 230 close to the light emitting component 210; the first substrate 220 is at least used for transmitting the light emitted by the light emitting component 210 to the light coupling component 240; the optical coupling assembly 240 is used to control the rotation angle of the light so that the light is transmitted in a predetermined direction, and the waveguide transmission layer 230 is used to transmit the light in the predetermined direction to the diffraction optical waveguide 110.
The first substrate 220 is a substrate for forming the light emitting element 210, the waveguide transmission layer 230, and the optical coupling element 240. Illustratively, taking the orientation and structure shown in fig. 2 as an example, the light emitting assembly 210 may be formed above the first substrate 220, and when the light emitting assembly 210 is located above the first substrate 220, one side of the light emitting assembly 210 may be flush with one side of the first substrate 220; on this basis, the optical coupling component 240 and the waveguide transmission layer 230 may be formed below the first substrate 220, and the optical coupling component 240 and the light emitting component 210 are aligned and covered by the waveguide transmission layer 230, so that the light emitted by the light emitting component 210 above can be transmitted to the optical coupling component 240 through the first substrate 220, so that the light can be transmitted to the diffractive optical waveguide 110 through the waveguide transmission layer 230, and the specific arrangement position of the light emitting component 210 is not limited herein, and only the alignment arrangement of the light emitting component 210 and the optical coupling component 240 is ensured.
It should be noted that, by setting the optical coupling component 240 on the surface below the first substrate 220, that is, embedded in the waveguide transmission layer 230 at the side close to the light emitting component 210, the rotation angle of the light transmitted by the first substrate 220 can be controlled directly, for example, the light transmitted by the first substrate 220 can be collimated first, and then the rotation angle of the collimated light is controlled to be a left-inclined angle or a right-inclined angle, for example, the rotation angle of the light is controlled to be a left-inclined angle or a right-inclined angle, so that the collimated light is transmitted to the left side or the right side along the waveguide transmission layer 230, which is beneficial to the subsequent entering into the diffractive optical waveguide 110 in matching connection with the Micro LED structure, so that the diffractive optical waveguide 110 is convenient to project the light to human eyes based on the diffraction characteristic thereof, thereby realizing application in the technical fields of augmented reality (Augmented Reality, AR) and the like.
The predetermined direction is a direction in which light enters the diffractive optical waveguide 110 from the waveguide transmission layer 230. Specifically, referring to fig. 2, when the right side of the light emitting device 210 is flush with the right side of the first substrate 220, the diffractive optical waveguide 110 may be coupled to the left side of the light emitting device 210 in the Micro LED structure in a matching manner, so that the optical coupling device 240 is used to control the rotation angle of the light to be an angle inclined to the left, so that the light is transmitted to the diffractive optical waveguide 110 to the left along the waveguide transmission layer 230, and a corresponding preset direction may be set according to a specific coupling position of the diffractive optical waveguide, which is not particularly limited herein.
The Micro LED structure provided in the embodiments of the present disclosure includes a light emitting component 210, a first substrate 220, a waveguide transmission layer 230, and an optical coupling component 240; the light emitting assembly 210 is disposed at one side of the first substrate 220; the waveguide transmission layer 230 and the optical coupling component 240 are both arranged on one side of the first substrate 220 away from the light emitting component 210, and the optical coupling component 240 is arranged in alignment with the light emitting component 210 and embedded on one side of the waveguide transmission layer 230 close to the light emitting component 210; the first substrate 220 is at least used for transmitting the light emitted by the light emitting component 210 to the light coupling component 240; the optical coupling assembly 240 is used to control the rotation angle of the light so that the light is transmitted in a predetermined direction, and the waveguide transmission layer 230 is used to transmit the light in the predetermined direction to the diffraction optical waveguide 110. In this way, the light emitting component 210 and the light coupling component 240 are respectively disposed on two opposite sides of the first substrate 220, and the light coupling component is embedded in the waveguide transmission layer 230, so that the size of the Micro LED structure is reduced, and miniaturization of the product is facilitated.
In some embodiments, fig. 3 is a schematic structural diagram of another Micro LED structure provided in an embodiment of the disclosure. Referring to fig. 3 on the basis of fig. 2, the optical coupling assembly 240 includes a light collimating part 241 and an inclined grating 242; the inclined grating 242 is disposed on one side of the light collimating component 241 facing away from the light emitting component 210; the light collimating part 241 is for collimating light; the inclined grating 242 is used to control the collimated light to exit the inclined grating at a preset rotation angle.
Taking the orientation and structure shown in fig. 3 as an example, the light collimating component 241 is located on the surface below the first substrate 220, and the inclined grating 242 is located below the light collimating component 241, i.e. on the side of the light collimating component 241 facing away from the light emitting assembly 210. For example, on the basis that the light collimating component 241 is disposed between the first substrate 220 and the inclined grating 242, the light collimating component 241 firstly collimates the light transmitted from the first substrate 220, so that the light vertically irradiates the inclined grating 242, and then the inclined grating 242 is used to control the rotation angle of the collimated light, so that the light exits from the inclined grating at a preset rotation angle, for example, the preset rotation angle may be 45 ° left, 50 ° left or other rotation angles, so that the light exiting from the inclined grating 242 can be transmitted to the diffractive optical waveguide along a preset direction by the waveguide transmission layer 230.
For example, the light collimating component 241 may be a light collimating component such as a super surface collimating structure or a quantum crystal structure, and when the light collimating component 241 is a super surface collimating structure, the preparation material may include Indium Tin Oxide (ITO), aluminum, gold, and other materials, and the thickness of the light collimating component may be formed to be thinner, for example, may be less than 5um. In other embodiments, other types of components for collimating light known to those skilled in the art are also possible, and are not limited herein.
In some embodiments, with continued reference to fig. 3, the Micro LED structure further includes a second substrate 250; the second substrate 250 is disposed on a side of the waveguide transmission layer 230 facing away from the first substrate 220; the first substrate 220 and the second substrate 250 are commonly used to guide light to be transmitted in a preset direction based on total reflection of light at the corresponding interfaces; wherein the respective interfaces include interfaces corresponding to the first substrate 220 and the waveguide transport layer 230, and interfaces corresponding to the second substrate 250 and the waveguide transport layer 230.
Taking the orientation and structure shown in fig. 3 as an example, the second substrate 250 is disposed below the waveguide transmission layer 230, that is, a side of the waveguide transmission layer 230 facing away from the first substrate 220. Specifically, since the waveguide transmission layer 230 and the optical coupling assembly 240 are disposed between the first substrate 220 and the second substrate 250, thereby forming interfaces corresponding to the first substrate 220 and the waveguide transmission layer 230 and interfaces corresponding to the second substrate 250 and the waveguide transmission layer 230, light emitted from the inclined grating 242 can be transmitted in a predetermined direction, for example, to the left side in the waveguide transmission layer 230 based on refractive index differences among the inclined grating 242, the waveguide transmission layer 230, the first substrate 220 and the second substrate 250, so as to ensure that light transmitted from the waveguide transmission layer 230 can be emitted to the diffraction optical waveguide, and refractive index differences among the inclined grating 242, the waveguide transmission layer 230, the first substrate 220 and the second substrate 250 will be exemplarily described later.
It will be appreciated that when the diffractive optical waveguide is coupled to the left side of the light emitting device 210 in the Micro LED structure, the light emitted from the inclined grating 242 is totally reflected at the interface between the first substrate 220 and the waveguide transmission layer 230 and the interface between the second substrate 250 and the waveguide transmission layer 230 due to the refractive indexes of the waveguide transmission layer 230 and the first substrate 220 being different and the refractive indexes of the waveguide transmission layer 230 being different, and is transmitted to the diffractive optical waveguide to the left side.
In some embodiments, with continued reference to fig. 3, the index of refraction of the tilted grating 242 is greater than the index of refraction of the waveguide transport layer 230, and the index of refraction of the waveguide transport layer 230 is greater than the index of refraction of the first substrate 220 or the index of refraction of the second substrate 250; wherein the refractive index of the first substrate 220 is equal to the refractive index of the second substrate 250.
Specifically, since the refractive index of the inclined grating 242 is greater than that of the waveguide transmission layer 230, the inclined grating 242 is enabled to couple collimated light to the waveguide transmission layer 230 at a preset rotation angle; correspondingly, since the refractive index of the waveguide transmission layer 230 is greater than that of the first substrate 220 or that of the second substrate 250, the light emitted from the inclined grating 242 with a predetermined rotation angle is totally reflected at the interface between the first substrate 220 and the waveguide transmission layer 230 and the interface between the second substrate 250 and the waveguide transmission layer 230. It should be noted that, when the refractive index of the waveguide transmission layer 230 is far greater than that of the first substrate 220 or the second substrate 250, the requirement on the refractive index of the inclined grating 242 may be reduced, for example, the refractive index of the inclined grating 242 may be slightly greater than that of the waveguide transmission layer 230, so that the light emitted from the inclined grating 242 can be transmitted in the predetermined direction in the waveguide transmission layer 230 without rotating by a great angle.
Illustratively, the tilted grating 242 may be fabricated from silicon nitride, silicon oxide, or other higher refractive index materials, as not limited herein.
Since the refractive index of the first substrate 220 is equal to that of the second substrate 250, the first substrate 220 and the second substrate 250 may be substrates of the same material, for example, the first substrate 220 and the second substrate 250 may be substrates of silicon substrate, sapphire substrate or other materials, which is not limited herein. It will be appreciated that since the number of Micro LED screens fabricated using a silicon substrate is greater than the number of Micro LED screens fabricated using a sapphire substrate and the fabrication cost of the silicon substrate is lower, the embodiments of the present disclosure may preferably employ a silicon substrate as the first substrate 220 or the second substrate 250.
In some embodiments, with continued reference to fig. 3, the Micro LED structure further includes a black matrix 260; the light emitting assembly 210 includes LEDs 211 arranged in an array; the black matrix 260 is alternately arranged with the LEDs 211; the black matrix 260 serves to block crosstalk of light emitted from adjacent LEDs.
The black matrix 260 may be abbreviated as BM (black matrix), and is a light-tight structure for shielding light emitted from the LEDs 211, so as to prevent the LEDs 211 from leaking light and causing crosstalk between adjacent LEDs. In this regard, the black matrix 260 is at least located in the interval region of the adjacent LEDs, for example, the black matrix 260 may be located in the interval region of the adjacent LEDs and on both left and right sides of the light emitting assembly 210, and the specific position and size of the black matrix 260 may be set according to the light shielding effect required for the Micro LED structure, which is not limited herein.
In some embodiments, with continued reference to fig. 3, the Micro LED structure further includes a drive substrate 270; the driving substrate 270 is disposed on the backlight side of the light emitting assembly 210; the driving substrate 270 is used for driving and lighting the light emitting assembly 210.
Taking the orientation and structure shown in fig. 3 as an example, the driving substrate 270 is disposed above the light emitting assembly 210, i.e., on the backlight side, so as to control whether the LED211 is lighted by using an internal driving circuit. For example, the driving substrate 270 may be electrically connected to the light emitting component 210 below via the internal wiring, and for subsequent connection of the Micro LED structure to the diffractive optical waveguide, the length of the driving substrate 270 in the horizontal direction needs to be smaller than that of the first substrate 220 to avoid affecting the subsequent connection of the Micro LED structure to the diffractive optical waveguide, which is not limited herein.
In some embodiments, with continued reference to fig. 3, the Micro LED structure further includes a waveguide interface layer 280; the waveguide interface layer 280 is disposed between the drive substrate 270 and the first substrate 220; the waveguide docking layer 280 and the second substrate 250 are respectively provided with corresponding grooves to be connected with the diffraction optical waveguide.
Illustratively, taking the orientation and structure shown in fig. 3 as an example, the grooves of the waveguide docking layer 280 and the grooves of the second substrate 250 are aligned, the grooves may be in a cube, a cylinder or other docking shapes, to provide aiming for subsequent assembly of the diffractive optical waveguide, and correspondingly, the diffractive optical waveguide has a corresponding protrusion structure, so as to realize the matching connection between the diffractive optical waveguide and the Micro LED structure through the engagement of the protrusion structure and the grooves, where the corresponding grooves may be provided according to the specific shape of the protrusion structure of the diffractive optical waveguide, and the shape of the grooves is not specifically limited.
It is to be understood that, for facilitating the matching connection between the diffractive optical waveguide and the Micro LED structure, the interfaces reserved by the waveguide docking layer 280 and the second substrate 250, that is, the corresponding grooves, are all disposed close to the side alignment of the Micro LED structure. Illustratively, when the light emitting assembly 210 is disposed above and to the right of the first substrate 220, the right side of the light emitting assembly 210 may be flush with the right side of the first substrate 220, the light coupling assembly 240 is disposed in alignment with the light emitting assembly 210 and below and to the right of the first substrate 220, and the waveguide docking layer 280 and the left side of the second substrate 250 may be provided with corresponding grooves; correspondingly, when the light emitting component 210 is disposed above and left of the first substrate 220, the optical coupling component 240 is disposed opposite to the light emitting component 210 and is located below and left of the first substrate 220, the waveguide docking layer 280 and the right side of the second substrate 250 may be provided with corresponding grooves, and the grooves of the waveguide docking layer 280 and the second substrate 250 may be disposed according to the positions of the coupling component 240 and the light emitting component 210, which is not limited herein.
Exemplary, fig. 4 is a schematic structural diagram of a connection between a Micro LED structure and a diffractive optical waveguide according to an embodiment of the present disclosure. On the basis of fig. 3, referring to fig. 4, corresponding grooves are formed on the left sides of the waveguide docking layer 280 and the second substrate 250 in the micro LED structure, so that the waveguide docking layer 280 and the second substrate 250 are connected with the diffraction optical waveguide 110 in a matching manner. It should be noted that, the actual size of the diffractive optical waveguide 110 is larger than the size of the Micro LED structure, and the actual size of the diffractive optical waveguide 110 will not be described herein.
On the basis of the above embodiment, the embodiment of the present disclosure further provides a method for manufacturing a Micro LED structure, which is used for manufacturing any one of the Micro LED structures provided in the above embodiment, and has a corresponding beneficial effect.
In some embodiments, fig. 5 is a schematic flow chart of a method for manufacturing a Micro LED structure according to an embodiment of the disclosure. Referring to fig. 5 on the basis of fig. 4, the preparation method comprises the following steps:
s310, forming a light-emitting component on one side of the first substrate.
In the example of the structure shown in fig. 4, the light emitting element 210 is formed on the upper right or upper left of the first substrate 220. For example, when the first substrate 220 is a silicon substrate, the light emitting assembly 210 may be epitaxially formed using the silicon substrate, and the LEDs 211 arranged in an array may be etched above the silicon substrate, which is not limited herein with respect to the manufacturing method of the LEDs 211.
S320, forming a waveguide transmission layer and an optical coupling assembly on one side of the first substrate away from the light emitting assembly.
Wherein, the optical coupling component 240 is aligned with the light emitting component 210, and embedded in the waveguide transmission layer 230 at a side close to the light emitting component 210; the first substrate 220 is at least used for transmitting the light emitted by the light emitting component 210 to the light coupling component 240; the optical coupling assembly 240 is used to control the rotation angle of the light so that the light is transmitted in a predetermined direction, and the waveguide transmission layer 230 is used to transmit the light in the predetermined direction to the diffraction optical waveguide 110.
Taking the structure shown in fig. 4 as an example, the waveguide transmission layer 230 and the optical coupling assembly 240 are formed under the first substrate 220. For example, the first substrate 220 may be polished and thinned to a predetermined thickness, and then the light collimating component 241 and the inclined grating 242 are sequentially formed by using a preparation process such as photolithography and etching, and then the waveguide transmission layer 230 coating the optical coupling assembly 240 is formed by using a chemical vapor deposition (Chemical Vapor Deposition, CVD) process, which is not limited herein with respect to the specific preparation process of the waveguide transmission layer 230 and the optical coupling assembly 240.
According to the preparation method of the Micro LED structure, the light emitting component 210 and the light coupling component 240 are respectively arranged on the two opposite sides of the first substrate 220, and the light coupling component 240 is embedded in the waveguide transmission layer 230, so that the size of the Micro LED structure is reduced, and miniaturization of products is facilitated.
In some embodiments, on the basis of fig. 5, the preparation method further comprises: a second substrate is formed on a side of the waveguide transport layer facing away from the first substrate.
Wherein the second substrate 250 is formed under the waveguide transfer layer 230. Illustratively, the second substrate 250 with mechanical supporting function may be formed under the waveguide transmission layer 230 by hybrid bonding, while the excessive portion on the second substrate 250 is removed by etching to reserve an interface for engagement with the diffractive optical waveguide 110, and the processing procedure for other interfaces will be exemplified later.
In some embodiments, the method of preparing further comprises the steps of, on the basis of fig. 5:
step one: a drive substrate is provided.
When the light emitting component 210 is formed on one side of the first substrate 220, the waveguide interface layer 280 without an interface is formed at the same time, and the black matrix 260 is filled in the interval region of the LED211, and on the basis, the driving substrate 270 and the light emitting component 210 are electrically connected.
Illustratively, the waveguide interface layer 280 may be made of silicon, and in other embodiments, may be of other harder materials known to those skilled in the art, and is not limited herein.
Step two: the driving substrate and the light emitting component are electrically connected by using a hybrid bonding mode.
The alignment accuracy is high, for example, 50nm alignment accuracy can be achieved when the whole surface of the light-emitting component is bonded to the driving substrate by using a hybrid bonding mode to form electrical connection.
On the basis that the driving substrate 270 and the light emitting component 210 are electrically connected, the optical coupling component 240, the waveguide transmission layer 230 and the second substrate 250 with no interface reserved below the first substrate 220 may be sequentially formed by using a hybrid bonding method, and compared with the error of 5um and above caused by mechanical alignment in the conventional bonding method, the semiconductor process provided in the embodiment of the disclosure achieves the accuracy of 100nm and below, and then the redundant portions of the waveguide butt-joint layer 280 and the second substrate 250 are removed to form grooves, so that a complete Micro LED structure is obtained.
It should be noted that, in the process of electrically connecting the driving substrate and the light emitting component, the driving substrate 270 having a smaller size than the first substrate 220 and the first substrate 220 may be directly bonded, and the size at this time should not affect the butt joint with the subsequent diffractive optical waveguide 110; alternatively, the driving substrate 220 and the first substrate 220 having the same size as the first substrate 220 may be bonded, and the unnecessary portion may be removed together with the waveguide interface layer 280 and the second substrate 250 in the following steps, and the specific size of the driving substrate 270 is not limited.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely a specific embodiment of the disclosure to enable one skilled in the art to understand or practice the disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown and described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The Micro LED structure is characterized in that the Micro LED structure is connected with the diffraction optical waveguide in a matching way; the Micro LED structure comprises a light emitting component, a first substrate, a waveguide transmission layer and an optical coupling component;
the light-emitting component is arranged on one side of the first substrate; the waveguide transmission layer and the optical coupling component are arranged on one side of the first substrate, which is away from the light-emitting component, and the optical coupling component is arranged in alignment with the light-emitting component and embedded on one side of the waveguide transmission layer, which is close to the light-emitting component;
the first substrate is at least used for transmitting the light emitted by the light emitting component to the optical coupling component; the optical coupling assembly is used for controlling the rotation angle of light so as to enable the light to be transmitted according to a preset direction, and the waveguide transmission layer is used for transmitting the light in the preset direction to the diffraction optical waveguide.
2. The Micro LED structure of claim 1, wherein the light coupling assembly comprises a light collimating component and a tilted grating;
the inclined grating is arranged on one side of the light collimation component, which faces away from the light-emitting component;
the light collimation component is used for collimating light; the inclined grating is used for controlling the collimated light to exit from the inclined grating at a preset rotation angle.
3. The Micro LED structure of claim 2, further comprising a second substrate;
the second substrate is arranged on one side of the waveguide transmission layer, which is away from the first substrate;
the first substrate and the second substrate are jointly used for guiding light to transmit according to a preset direction based on total reflection of the light at the corresponding interface;
the interface surfaces of the first substrate and the waveguide transmission layer are corresponding to each other, and the interface surfaces of the second substrate and the waveguide transmission layer are corresponding to each other.
4. The Micro LED structure of claim 3, wherein the refractive index of the tilted grating is greater than the refractive index of the waveguide transport layer, which is greater than the refractive index of the first substrate or the refractive index of the second substrate;
wherein the refractive index of the first substrate is equal to the refractive index of the second substrate.
5. The Micro LED structure of claim 1, further comprising a black matrix; the light emitting assembly comprises LEDs arranged in an array;
the black matrix and the LEDs are alternately arranged;
the black matrix is used for blocking crosstalk of light emitted by adjacent LEDs.
6. The Micro LED structure of claim 3, further comprising a driving substrate;
the driving substrate is arranged on the backlight side of the light-emitting component;
the driving substrate is used for driving and lighting the light emitting assembly.
7. The Micro LED structure of claim 6, further comprising a waveguide interface layer;
the waveguide butt joint layer is arranged between the driving substrate and the first substrate;
the waveguide butt joint layer and the second substrate are respectively provided with a corresponding groove so as to be connected with the diffraction optical waveguide.
8. A method for preparing a Micro LED structure, characterized by being used for preparing a Micro LED structure according to any one of claims 1-7; the method comprises the following steps:
forming a light emitting assembly on one side of a first substrate;
forming the waveguide transmission layer and the optical coupling assembly on one side of the first substrate away from the light emitting assembly;
the optical coupling component and the light emitting component are arranged in an alignment manner and embedded in one side, close to the light emitting component, of the waveguide transmission layer; the first substrate is at least used for transmitting the light emitted by the light emitting component to the optical coupling component; the optical coupling assembly is used for controlling the rotation angle of light so as to enable the light to be transmitted according to a preset direction, and the waveguide transmission layer is used for transmitting the light in the preset direction to the diffraction optical waveguide.
9. The method as recited in claim 8, further comprising:
and forming a second substrate on one side of the waveguide transmission layer, which is away from the first substrate.
10. The method as recited in claim 8, further comprising:
providing a driving substrate;
and forming electrical connection between the driving substrate and the light-emitting component by using a hybrid bonding mode.
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