CN116341326A - Thermal field simulation analysis and design method of filter and device comprising thermal field simulation analysis and design method - Google Patents
Thermal field simulation analysis and design method of filter and device comprising thermal field simulation analysis and design method Download PDFInfo
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Abstract
The present disclosure provides a thermal field finite element simulation method of an electronic system, the electronic system including a plurality of components, the simulation method comprising: establishing a geometric model of the electronic system; determining a plurality of heat sources of the electronic system, performing physical field finite element analysis on the plurality of heat sources in a single analysis module, and extracting performance parameters of the plurality of heat sources; and performing thermal field finite element simulation on the electronic system according to the extracted performance parameters of the plurality of heat sources to obtain a simulation result.
Description
Technical Field
The present disclosure relates to the field of electronics, and in particular, to a method of simulation analysis and design of a filter and an apparatus incorporating the same.
Background
The filter as a core device of the radio frequency front end has a crucial significance in promoting the development of new generation communication standards and miniaturization and multifunctionality of personal mobile terminals, so that high requirements are placed on the performance of the filter, such as low insertion loss, steep filtering curve, high isolation and smaller size. The bulk acoustic wave resonator has the advantages of small volume, high frequency, large power capacity, high sensitivity and the like, and the application proportion of the bulk acoustic wave resonator in the radio frequency filter is larger and larger. The new generation of bulk acoustic wave resonator technology can effectively solve the above-mentioned technical problems of the filter. Filters constructed using bulk acoustic resonator technology have steeper filter curves, lower insertion loss, and excellent out-of-band rejection capabilities.
However, as the use of the filter increases, the applied power gradually increases, so that the self-heating phenomenon of the bulk acoustic wave resonator is serious, and the filter performance is deteriorated due to the fact that the filter is sensitive to the temperature and the excessive temperature. The influence of the self-heating effect is not considered in the existing design flow, and measures for improving the performance deterioration caused by the excessive temperature of the filter due to the self-heating effect are not taken. It is therefore desirable to provide a new filter design approach that solves the above-mentioned problems.
Disclosure of Invention
The present disclosure provides a thermal field simulation analysis and design method for a filter system based on finite elements, which can effectively analyze self-heating effects of components in the filter system, and optimize a design method for an electronic system based on simulation results.
A brief summary of the disclosure will be presented below in order to provide a basic understanding of some aspects of the disclosure. It should be understood that this summary is not an exhaustive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure or to delineate the scope of the disclosure. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is discussed later.
According to a first aspect of the present disclosure, there is provided a thermal field finite element simulation method of an electronic system, the electronic system comprising a plurality of components, the simulation method comprising: establishing a geometric model of the electronic system; determining a plurality of heat sources of the electronic system, performing physical field finite element analysis on the plurality of heat sources in a single analysis module, and extracting performance parameters of the plurality of heat sources; and performing thermal field finite element simulation on the electronic system according to the extracted performance parameters of the plurality of heat sources to obtain a simulation result.
According to a second aspect of the present disclosure, there is provided a structural design method of an electronic system including a plurality of components, the design method including: determining a physical structure of the component; determining a physical structure of the electronic system; simulating the components and the physical structure of the electronic system according to the thermal field finite element simulation method to obtain a simulation result; and carrying out structural optimization on the component or the electronic system structure based on the simulation result.
According to a third aspect of the present disclosure, there is provided a computer readable storage medium for storing computer instructions for performing a method as any one of the preceding claims.
According to a fourth aspect of the present disclosure, there is provided a heat generation evaluation device of an electronic system, comprising a storage medium for storing computer instructions executable to perform a method as set forth in any one of the preceding claims, and a processing unit, the processing unit being operable to invoke the computer instructions.
According to a fifth aspect of the present disclosure, there is provided a design apparatus of an electronic system, comprising a storage medium for storing computer instructions executable to perform the method described in the foregoing, and a processing unit, the processing unit being operative to invoke the computer instructions.
The solution of the present disclosure can at least help to achieve one of the following effects: the simulation time is shortened, the simulation efficiency is improved, the simulation result of steady-state heat distribution of the filter under different powers can be obtained, reasonable optimization design is carried out on components with serious heat, the self-heating effect of the components is improved, the temperature of the filter is reduced, and the working stability of the filter is improved.
Drawings
The above and other objects, features and advantages of the present disclosure will be more readily appreciated by reference to the following description of the specific details of the disclosure taken in conjunction with the accompanying drawings. The drawings are only for the purpose of illustrating the principles of the present disclosure. The dimensions and relative positioning of the elements in the figures are not necessarily drawn to scale.
Fig. 1 shows a filter architecture design flow diagram in accordance with a specific embodiment of the present disclosure.
Fig. 2 shows a finite element thermal field simulation flow diagram of a filter according to the present disclosure.
Fig. 3 shows a simulated filter S parameter curve of the present disclosure.
Fig. 4-6 show graphs of thermal field simulation results for different frequencies with the disclosed filter power at 1W.
Fig. 7-9 show graphs of thermal field simulation results for different frequencies at 3W for the disclosed filter power.
Detailed Description
Exemplary disclosure of the present disclosure will be described hereinafter with reference to the accompanying drawings. In the interest of clarity and conciseness, not all features of an implementation of the present disclosure are described in the specification. It will be appreciated, however, that in the development of any such actual implementation, numerous implementation-specific decisions may be made to achieve the developers' specific goals, and that these decisions may vary from one implementation to another.
It should be further noted that, in order to avoid obscuring the present disclosure due to unnecessary details, only features closely related to the scheme according to the present disclosure are shown in the drawings, and other details not greatly related to the present disclosure are omitted.
It is to be understood that the present disclosure is not limited to the described embodiments due to the following description with reference to the drawings. Herein, features between different embodiments may be substituted or borrowed where possible, and one or more features may be omitted in one embodiment. It should be understood that the design methodology of the present disclosure is exemplary in embodiments.
The present disclosure is applicable to electronic systems having multiple components. Electronic systems having multiple components are typically connected and integrally packaged together by an interconnect process. As the number of components increases, so does the complexity of the electronic system, and the heat generated during operation will greatly affect the performance of the electronic system.
In the prior art, finite element thermal field simulation analysis of a single physical field is carried out on an electronic system; however, the finite element thermal field simulation analysis of a single physical field results in insufficiently high accuracy of the final simulation results. In the prior art, mixed thermal field simulation analysis is performed on an electronic system, wherein the mixed thermal field simulation analysis mainly adopts circuit simulation analysis and is assisted by finite element simulation analysis, and the result of the integrated thermal field simulation analysis is not enough in accordance with the heating phenomenon of an actual device after the circuit simulation analysis and the finite element simulation analysis are related. The applicant also proposes to perform finite element thermal field simulation analysis on an electronic system, determine sources of a plurality of generated heat during operation of the electronic system, and perform physical field analysis on a plurality of heat sources of the selected electronic system in different analysis modules by adopting finite element analysis (Finite Element Analysis, FEA) through specific selection of the heat sources, and then perform coupling field analysis, thereby obtaining simulation results more in accordance with heating phenomena of actual devices. However, in the analysis method, different analysis modules are selected according to specific heat sources in finite element analysis software to perform physical field analysis respectively, and then coupling is performed according to the obtained result, so that finite element simulation time is long and efficiency is low.
The present disclosure provides a new thermal field finite element simulation method of an electronic system, which not only can obtain a simulation result more in line with the heating phenomenon of an actual device, but also can effectively reduce the time of thermal field finite element simulation analysis and improve the efficiency of thermal field finite element simulation.
The finite element analysis mentioned in the disclosure is a numerical method for solving partial differential equations, and the finite element analysis replaces complex problems with simpler problems and then simulates and solves a real physical system through mathematical approximation. Specifically, finite element analysis sees the solution domain as consisting of a number of small interconnected subfields called finite elements, assuming a suitable (simpler) approximate solution for each cell, and deriving the solution total to satisfy the condition to obtain an approximate solution to the problem. The finite element analysis has high calculation precision, can adapt to various complex shapes, and can convert the solving result of the partial differential equation into readable post-processing results such as digital images, animations and the like, so that the analysis result is visual and vivid, and the analysis requirement on engineering can be effectively met. Finite element analysis software compiled based on finite element analysis is adopted in the present disclosure to perform finite element thermal field simulation analysis on an electronic system.
The finite element analysis software mentioned in the present disclosure refers to various finite element analysis software which has been developed and perfected over several decades, such as Comsol, ansys, abaqus, and which helps to convert finite element analysis into social productivity. For ease of illustration, the finite element thermal field simulation analysis of the filter is performed in the present disclosure using the Comsol software as an example, but those skilled in the art will appreciate that the finite element thermal field simulation analysis scheme of the present disclosure may be applied to various finite element analysis software.
Referring to fig. 1, fig. 1 shows a structural design flow chart of an electronic system according to an embodiment of the disclosure.
As shown in fig. 1, the method for optimizing the structure of the filter of the present disclosure may include the following steps: s11: determining a physical model of the component; s12: determining a physical model of the electronic system; s13: simulating based on finite element thermal field simulation analysis; s14: performing physical model optimization of the component or the electronic system based on the simulation result; the above steps may be iterated a number of times.
Referring to fig. 2, fig. 2 illustrates a flow chart of finite element thermal field simulation analysis of an electronic system according to an embodiment of the disclosure.
As shown in fig. 2, the finite element thermal field simulation analysis of the electronic system of the present disclosure may include the steps of: s131: establishing a geometric model of the electronic system; s132: determining a plurality of heat sources of an electronic system, performing physical field finite element simulation analysis on the plurality of heat sources in a single analysis module, and extracting performance parameters of the plurality of heat sources; s133: performing thermal field finite element simulation on the electronic system according to the extracted performance parameters of the plurality of heat sources; s134, obtaining the temperature distribution in the steady state.
Furthermore, the temperature distribution under the steady state obtained through the finite element thermal field simulation analysis can be used for optimally designing the electronic system structure from multiple angles.
In summary, the design method and simulation analysis of the electronic system of the present disclosure have the following advantages:
1) According to the method, through effective determination of the heat sources in the electronic system, the corresponding analysis modules in the adaptive finite element analysis software are selected in a targeted mode to serve as physical field interfaces, and based on the determined different heat sources, corresponding performance parameters of the different heat sources are extracted from the same analysis module at the same time.
2) The thermal field simulation result of the present disclosure can be as close as possible to the heating status of a real electronic system.
3) The design method based on the simulation result effectively shortens the design period, reduces the design cost, and can effectively improve the performance of the electronic system without stream verification.
For better understanding of the inventive concepts of the present disclosure, the present disclosure specifically describes specific embodiments of the inventive concepts of the present disclosure with a filter as an electronic system. It should be understood that the concepts of the present disclosure are applicable to any electronic system having multiple components and are not limited to filters.
For a filter, the filter includes a plurality of components, such as bulk acoustic wave resonators, each of which is connected and integrally encapsulated in the filter by an interconnection process. Each bulk acoustic wave resonator has a different heat dissipation capacity based on a specific layout position on the substrate of the filter. In addition, due to specific material selection, structural arrangement and arrangement of conductive paths of electric connection components of each bulk acoustic wave resonator in the filter, a certain difficulty exists in thermal field simulation analysis of the filter.
In particular, the piezoelectric layer in the bulk acoustic wave resonator is used to achieve conversion between acoustic waves and electric signals, and most of acoustic energy is contained in the piezoelectric layer, so that heat loss caused by piezoelectric loss in the piezoelectric layer is high. Second, ohmic loss of electrodes in bulk acoustic wave resonators is another mechanism that results in heat loss.
In the prior art, comprehensive simulation analysis is adopted to analyze the heating condition of the filter, and the comprehensive simulation analysis comprises circuit simulation analysis and finite element simulation analysis. The circuit simulation analysis is to perform equivalent circuit simulation analysis on the filter, so as to calculate the dissipation power of the bulk acoustic wave resonator in the filter caused by the application of signals. The finite element simulation analysis is to obtain the thermal resistance matrixes of all resonators in the filter through finite element analysis, and then to correlate the dissipation power with the thermal resistance matrixes for comprehensive simulation, wherein the simulation result is not enough to conform to the heating phenomenon of an actual device.
In the finite element thermal field simulation analysis and filter design method of the filter, the finite element analysis is adopted to conduct physical field analysis on the piezoelectric layer and the upper electrode and the lower electrode of the bulk acoustic wave resonator in the filter in the piezoelectric module, then the coupling field analysis is conducted in the solid heat transfer module, and the simulation analysis is enabled to be more in line with the heating phenomenon of an actual device through the specific design of the finite element thermal field simulation analysis, meanwhile, the simulation time can be effectively shortened, and powerful support is provided for the structural optimization design of the filter.
Determining a physical model of a component
The bulk acoustic wave resonator may be an air cavity film bulk acoustic wave resonator, a bragg reflection type film bulk acoustic wave resonator, or a back etching type film bulk acoustic wave resonator, and the three types of film bulk acoustic wave resonators are collectively called a bulk acoustic wave resonator. In the embodiments of the present disclosure, an air cavity film bulk acoustic resonator is taken as an example for illustration, and a physical model of the bulk acoustic resonator is designed to determine specific structures, materials and performance parameters of the bulk acoustic resonator.
The physical model of the bulk acoustic wave resonator at least comprises a substrate, a cavity formed in the substrate, a lower electrode, an upper electrode and a piezoelectric layer clamped between the upper electrode and the lower electrode, wherein the upper electrode, the lower electrode and the piezoelectric layer form a laminated structure, and an overlapped area among the upper electrode, the piezoelectric layer and the lower electrode is an active area of the bulk acoustic wave resonator. Specifically, the piezoelectric layer is made of a piezoelectric material having an electromechanical conversion capability, such as aluminum nitride, doped aluminum nitride, or titanate zirconate, for realizing the conversion between acoustic waves and electric signals; exemplary performance parameters of the bulk acoustic wave resonator are as follows: the length, thickness, area, material, etc. of each laminated structure of the resonator.
In the present disclosure, the above-described stacked structure having the bulk acoustic wave resonator is described as an example, but the present disclosure is not limited to a stacked structure including other additional structural functional layers, and the other additional functional layers may be exemplified by additional structural functional layers such as a mass-loaded layer and a frame.
Determining a physical model of a filter
And determining a physical model of the filter comprising the bulk acoustic wave resonator according to the determined structure, material and performance parameters of the bulk acoustic wave filter, wherein the physical model comprises the topological structure, the order and the layout position of each component in the filter on a substrate.
And performing performance simulation on the filter to obtain piezoelectric loss density and electrode loss density distribution.
Since the higher heat dissipation due to piezoelectric loss is selected as one of the main heat sources of the filter, the piezoelectric module of Comsol is selected as the physical field interface in the finite element thermal field simulation analysis of the present disclosure in the hope that the loss density of the piezoelectric layer piezoelectric material and the electrode loss density can be obtained simultaneously by the physical field finite element simulation in the piezoelectric module.
After determining the module type analyzed in the finite element software, firstly building a geometric model of the filter containing the bulk acoustic wave resonator according to a physical model of the filter, wherein the geometric model of the filter is based on the size required by design. Specifically, the geometric model can be directly drawn in the coosol environment, or the three-dimensional geometric model of the designed filter can be imported into the coosol software. The material parameters and initial conditions of the various components of the filter are then input. In the piezoelectric module, when the filter is subjected to physical field simulation, the relative dielectric constant parts of the upper electrode and the lower electrode need to be assigned, and the expression when the relative dielectric constant takes a complex form is epsilon r
(ω)＝ε r ′(ω)-jε r "(ω) in which the imaginary part ε r "(ω) represents ohmic losses; it is caused by the fact that the electric polarization process follows the change of the external field. Due to the middle-default of the piezoelectric moduleThe electrodes of the bulk acoustic wave resonator in the filter are considered as equipotential bodies, i.e. the electrodes are considered to have no ohmic losses, so that the imaginary part in the relative permittivity part of the electrodes is set to zero by default in the piezoelectric module when setting the relative permittivity of the filter electrodes. For the bulk acoustic wave resonator, as the application scene expands, the frequency applied to the bulk acoustic wave resonator will also be different, so that the electrode of the resonator cannot have ohmic loss in practical application. In order to simulate and analyze the heating phenomenon more in line with the actual device, the applicant firstly carries out single performance simulation on the piezoelectric layer of the bulk acoustic wave resonator in the piezoelectric module, then takes the current module as the physical field interface of the upper electrode and the lower electrode of the bulk acoustic wave resonator, obtains the corresponding ohmic loss density distribution of the upper electrode and the lower electrode through simulation in the current module, and then carries out simulation on the coupling field.
Applicant considers that finite element analysis is a numerical method of solving partial differential equations. The Comsol software compiled based on finite element analysis is provided with a Comsol partial differential equation set, and the Comsol partial differential equation set is a mathematical model which simulates a real physical system through mathematical approximation after replacing a complex problem, and can be used for simulating the behavior of the physical system, so that the operation mechanism of the physical system is better solved. In the method, the partial differential equation which can simulate the behavior of the filter under the static current mode in the Comsol current module is utilized to carry out adaptive equivalent processing on the partial differential equation, so as to obtain the electrode relative dielectric constant epsilon with ohmic loss which can more reflect the real situation r (ω)。
Specifically, the partial differential equation describing the current physical field in the Comsol current module is expressed as follows:
wherein,,
is Hamiltonian, sigma is conductivity, epsilon 0 Is absolute dielectric constant epsilon r The relative dielectric constant, ω is the angular frequency, and V is the voltage.
Dividing both sides of equation one by jω gives:
the partial differential equation describing the electrostatic physical field in comsol is expressed as follows:
wherein the method comprises the steps of
Is Hamiltonian character, epsilon 0 Is absolute dielectric constant epsilon r The relative dielectric constant and V is the voltage.
Comparing the second equation with the third equation to obtain the relative dielectric constants of the upper electrode and the lower electrode with ohmic loss
In the finite element thermal field simulation analysis of the present disclosure, electrode ohmic losses are brought into the electrode relative permittivity of the piezoelectric module in the form of an imaginary part. An adaptive modeling process is then performed in the piezoelectric module. Illustratively, in the finite element thermal field simulation analysis of the present disclosure, based on the great difference between the thickness of the substrate and the thickness dimension of the filter in the actual product, the sound wave is transmitted along the thickness direction of the substrate, and no reflection or little reflection is formed, so that when the geometric model of the filter is actually constructed, the construction of the geometric model of the substrate is partially omitted, and based on the reflection of the sound wave at the boundary, the propagation of the sound wave in the substrate is simulated by adding a low reflection boundary condition or a perfect matching layer under the substrate, so that no reflection or little reflection of the sound wave is realized. The model processing avoids the interference of irrelevant factors and improves the calculation efficiency during simulation.
After proper processing of the filter geometry model is completed, the filter geometry model needs to be meshed based on the principle of the finite element analysis method. The frequency range of the filter and the structural size of the resonator are comprehensively considered when the geometric model of the filter is divided into grids, so that the balance of calculation accuracy and calculation efficiency is realized.
And then, performing physical field simulation on the filter in the piezoelectric module, and obtaining scattering parameters (S parameters) of the filter after software calculation is completed, and obtaining loss density distribution of the upper electrode, the lower electrode and the piezoelectric material under different frequencies according to a piezoelectric loss operator of the Comsol software.
Specifically, referring to fig. 3, fig. 3 shows a schematic view of scattering parameters. Where S11 is the input reflection coefficient, i.e. the input return loss, and S21 is the output reflection coefficient, i.e. the output return loss. Subsequent thermal field simulation analysis is conveniently performed through the S11 and S21 parameters.
Finite element thermal field simulation analysis is performed on the resonator.
Because two heat sources exist in the resonator, multiple physical fields exist in the resonator, after the piezoelectric loss density distribution of the piezoelectric layer and the ohmic loss density distribution corresponding to the upper electrode and the lower electrode are respectively obtained, a solid heat transfer module in the Comsol is selected for coupling field analysis, so that the heating condition of the resonator is visualized.
After the module type analyzed in the finite element software is determined, a heat transfer physical field is added on the basis of the simulation, and a Comsol self-contained witsol operator is utilized to introduce the piezoelectric loss density and the ohmic loss density into the solid heat transfer module to serve as heat sources, wherein the witsol operator is used for accessing any solution in the constructed geometric model.
Further, natural convection is arranged on the upper surface of the filter, the temperature of the bottom surface of the substrate is set to be normal temperature, and is exemplified by 25 ℃, so that the normal working environment of the filter is simulated, the results of different physical fields are coupled, and the coupled results of multiple physical fields are solved and analyzed to obtain the temperature distribution of the filter, so that the temperature distribution of the filter is as close to the self-heating effect of a real resonator as possible.
In one embodiment, the above protocol was tested to obtain the graphs shown in fig. 4-9. Fig. 4-6 show graphs of thermal field simulation results for different frequencies at 1W for the power of the filter in the present disclosure. Fig. 7-9 show graphs of thermal field simulation results for different frequencies at 3W for the power of the filter in the present disclosure. The electrode connections between the bulk acoustic wave resonators are hidden in fig. 4-9 for ease of illustration. Specifically, fig. 4 is a graph of thermal field simulation results for a filter with a power of 1W and a frequency of 2.29GHz, fig. 5 is a graph of thermal field simulation results for a filter with a power of 1W and a frequency of 2.37GHz, and fig. 6 is a graph of thermal field simulation results for a filter with a power of 1W and a frequency of 2.41 GHz. Fig. 7 is a thermal field simulation result diagram of a filter with a power of 3W and a frequency of 2.29GHz, fig. 8 is a thermal field simulation result diagram of a filter with a power of 3W and a frequency of 2.37GHz, and fig. 9 is a thermal field simulation result diagram of a filter with a power of 3W and a frequency of 2.41 GHz.
As is clear from fig. 4 to 6 and fig. 7 to 9, when the power is the same and the frequency is different, different bulk acoustic wave resonators in the filter have different heating temperatures. As is clear from comparison of fig. 4 and 7, fig. 5 and 8, and fig. 6 and 9, when the frequencies are the same and the powers are different, the heating temperature of the same bulk acoustic wave resonator in the filter increases with the increase of the powers, that is, the higher the powers, the more serious the self-heating effect of the same bulk acoustic wave resonator.
The test result is basically identical with the test result of the simulation of the coupling field in the solid heat transfer module, but the operation time of the simulation is shortened by about one third compared with that of the previous simulation method. Therefore, the simulation method disclosed by the invention can effectively shorten the simulation time and improve the simulation efficiency while being as close to the heating condition of the real electronic system as possible.
The structure of the filter is optimized.
Based on the thermal field simulation method, different powers are applied to the filter during simulation, so that a thermal simulation result is obtained; and then, judging whether the highest temperature exceeds the temperature threshold of normal operation of the bulk acoustic wave resonator according to the highest temperature of each bulk acoustic wave resonator in the thermal simulation result, and further obtaining the maximum power which can be born by each bulk acoustic wave resonator under the condition of not damaging the bulk acoustic wave resonator.
Further, the filter is redesigned according to the maximum power that each bulk acoustic wave resonator can withstand. Based on the redesigned filter, performing finite element thermal field simulation analysis of the filter again to obtain the maximum power which can be born by each bulk acoustic wave resonance in the redesigned filter until the maximum power meets the normal working requirement of the bulk acoustic wave resonator.
Illustratively, the redesigning of the filter may be splitting the bulk acoustic wave resonator with a maximum temperature exceeding the normal operating temperature threshold in the finite element thermal field simulation analysis. Specifically, a single bulk acoustic wave resonator can be split into at least two bulk acoustic wave resonators with larger areas; the split bulk acoustic wave resonators are connected in series or in parallel to reduce the self-heating effect of the bulk acoustic wave resonators. It will be appreciated that the number of split bulk acoustic wave resonators will be adapted to the predetermined layout area of the filter.
Illustratively, the redesign of the filter may also add a heat dissipation mechanism at the bulk acoustic wave resonator where the highest temperature exceeds the normal operating temperature threshold in the finite element thermal field simulation analysis. Specifically, a metal through hole is added at the bulk acoustic wave resonator with serious self-heating effect, and the metal through hole can be arranged at the position corresponding to the bulk acoustic wave resonator on the substrate, so that heat is conducted out better by utilizing the excellent heat conductivity of metal.
The implementation mode provides a feasible solution for thermal field simulation of the filter, provides powerful support for optimizing the design of the filter by depending on a visual result of the simulation, shortens the design period, reduces the design cost, and can effectively improve the performance of the filter without flow verification.
The present disclosure has been described above in terms of simulation analysis and design methodologies in connection with specific embodiments, but it should be apparent to those skilled in the art that such descriptions are exemplary and not intended to limit the scope of the present disclosure.
It is understood that embodiments in the present disclosure may be implemented in the form of computer instructions.
It will be appreciated that embodiments of the present disclosure may be stored on computer readable storage media (including, but not limited to, magnetic disk storage, optical read only disk, optical storage, etc.) by computer program instructions.
It will be appreciated that embodiments of the present disclosure may be implemented by providing computer program instructions to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce an electronic system heat generation assessment apparatus or electronic system design apparatus.
Various modifications and alterations of this disclosure may be made by those skilled in the art in light of the spirit and principles of this disclosure, and such modifications and alterations are also within the scope of this disclosure.
Claims (18)
1. A thermal field finite element simulation method of an electronic system, the electronic system comprising a plurality of components, comprising:
establishing a geometric model of the electronic system;
determining a plurality of heat sources of the electronic system, performing physical field finite element analysis on the plurality of heat sources in a single analysis module, and extracting performance parameters of the plurality of heat sources;
and performing thermal field finite element simulation on the electronic system according to the extracted performance parameters of the plurality of heat sources to obtain a simulation result.
2. The thermal field finite element simulation method of claim 1, wherein: and selecting an adaptive analysis module according to the heat loss of the heat sources, and compensating the heat loss of other heat sources into the analysis module in a parameter form.
3. The thermal field finite element simulation method of claim 2, wherein: the electronic system is a filter, the assembly includes a bulk acoustic wave resonator including a piezoelectric layer and upper and lower electrodes, and the plurality of heat sources includes the piezoelectric layer and upper and lower electrodes.
4. A thermal field finite element simulation method according to claim 3, wherein: and selecting an acoustic analysis module as a physical field analysis module of the filter, and compensating the equivalent electrical parameters into the acoustic analysis module to perform physical field analysis of the plurality of heat sources in the same analysis module.
5. The thermal field finite element simulation method of claim 4, wherein: the acoustic analysis module is a piezoelectric module, and the equivalent electrical parameters are the relative dielectric constants of the upper electrode and the lower electrode with ohmic loss after the equivalent electrical parameters are equivalent.
6. The thermal field finite element simulation method of claim 5, wherein: the relative dielectric constant equivalent is obtained by comparing an electrostatic partial differential equation in finite element simulation software with a processed current partial differential equation.
7. The thermal field finite element simulation method of claim 6, wherein: the partial differential equation of the current is
Wherein->
Is Hamiltonian, sigma is conductivity, epsilon 0 Is absolute dielectric constant epsilon r Is the relative dielectric constant, ω is the angular frequency, V is the voltage; dividing both sides by jωPartial differential equation of current after processing
8. The thermal field finite element simulation method of claim 7, wherein: the electrostatic partial differential equation is
Wherein->
Is Hamiltonian character, epsilon 0 Is absolute dielectric constant epsilon r The relative dielectric constant and V is voltage; comparing the electrostatic partial differential equation with the processed current partial differential equation to obtain relative dielectric constants of upper and lower electrodes with ohmic loss>
9. The thermal field finite element simulation method of claim 8, wherein: and replacing the imaginary parts of the relative dielectric constants of the upper electrode and the lower electrode with ohmic loss by the imaginary parts of the default relative dielectric constants of the upper electrode and the lower electrode in the piezoelectric module.
10. The thermal field finite element simulation method of claim 9, wherein: and performing model processing and grid division in the piezoelectric module.
11. The thermal field finite element simulation method of claim 10, wherein: and performing physical field simulation in the piezoelectric module to obtain scattering parameters (S parameters) of the filter, and further obtaining ohmic loss density distribution of the upper electrode and the lower electrode and piezoelectric loss density distribution of the piezoelectric material.
12. The thermal field finite element simulation method according to claim 11, wherein steady-state thermal field finite element simulation is performed on the filter in the solid heat transfer module according to the extracted piezoelectric loss density distribution and ohmic loss density distribution, and a temperature distribution simulation result in a steady state is obtained.
13. A structural design method of an electronic system, the electronic system including a plurality of components, comprising:
determining a physical structure of the component;
determining a physical structure of the electronic system;
the thermal field finite element simulation method according to any one of claims 1-12, simulating the physical structure of the component and the electronic system to obtain a simulation result;
and carrying out structural optimization on the component or the electronic system structure based on the simulation result.
14. The design method of claim 13, wherein: the simulation result comprises a sub-simulation result corresponding to each component, and the structural optimization of the component or the electronic system structure based on the simulation result comprises the following steps:
judging whether the sub-simulation result corresponding to the component exceeds a threshold value or not;
if yes, splitting the assembly to obtain at least two sub-assemblies.
15. The design method of claim 13, wherein: the simulation result comprises a sub-simulation result corresponding to each component, and the structural optimization of the component or the electronic system structure based on the simulation result comprises the following steps:
judging whether the sub-simulation result corresponding to the component exceeds a threshold value or not;
if yes, a heat dissipation channel is additionally arranged at the position of the component.
16. A computer readable storage medium storing computer instructions for performing the method of any one of claims 1-15.
17. A heat generation evaluation device of an electronic system, characterized in that:
comprising a storage medium for storing computer instructions executable to perform the method of any one of claims 1-12, and a processing unit, the processing unit being operative to invoke the computer instructions.
18. A design apparatus for an electronic system, characterized in that:
comprising a storage medium for storing computer instructions executable to perform the method as claimed in claims 13-15, and a processing unit, which is operative to invoke the computer instructions.
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| CN117131832B (en) * | 2023-10-23 | 2024-02-02 | 巨霖科技(上海)有限公司 | Method and device for constructing simulation component and storage medium |
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