CN116338876A - Photoelectric module based on glass-based waveguide substrate - Google Patents
Photoelectric module based on glass-based waveguide substrate Download PDFInfo
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- CN116338876A CN116338876A CN202310204374.4A CN202310204374A CN116338876A CN 116338876 A CN116338876 A CN 116338876A CN 202310204374 A CN202310204374 A CN 202310204374A CN 116338876 A CN116338876 A CN 116338876A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
Abstract
The invention discloses a photoelectric module based on a glass-based waveguide substrate, which comprises: the glass fundamental wave waveguide substrate, the organic medium layer arranged outside the upper surface of the glass fundamental wave waveguide substrate and the photoelectric chip; a glass waveguide is arranged in the upper surface of the glass-based waveguide substrate, a first end of the glass waveguide is provided with an inclined plane with a preset angle, and the inclined plane with the preset angle is used for reflecting light rays incident from a second end of the glass waveguide to a direction deviating from the upper surface of the glass-based waveguide substrate; an optical through hole and a conductive circuit are arranged in the organic medium layer, one end of the optical through hole is connected with the first end, so that light reflected by an inclined plane with a preset angle passes through the optical through hole to reach the other end of the optical through hole; the photoelectric chip comprises an optical connection port and an electric connection port, wherein the electric connection port is connected with the conductive circuit when the photoelectric chip is installed, and the optical connection port is connected with the other end of the optical through hole; therefore, the light path loss is effectively reduced, and the light path transmission efficiency is improved.
Description
Technical Field
The invention relates to the technical field of component packaging, in particular to a photoelectric module based on a glass fundamental wave guide substrate.
Background
With the increase of the signal rate, the problem based on the traditional pluggable optical module is highlighted, and is limited by the inherent attribute limitation of copper trace interconnection, so that the traditional electrical interconnection technology is difficult to further support the data transmission with higher rate and higher frequency; the most prominent advantage of optical interconnects is that their loss is independent of the transmission frequency, and thus the bandwidth and delay of the optical link is virtually independent of length, fan-out/fan-in, and overall density of the interconnect, optical interconnect technology can provide lower system design complexity and lower system power consumption, and has the potential to achieve higher channel densities through Wavelength Division Multiplexing (WDM) techniques.
At present, for short-distance interconnection between a daughter card and a backboard, an embedded waveguide interconnection is used in a conventional mode, a polymer waveguide is integrated on an organic substrate or a glass carrier plate, and photoelectric interconnection integration in a module is realized, but the problems of higher optical path coupling loss and lower optical path transmission efficiency are caused by poor matching degree of the optical refractive index of the polymer waveguide and the refractive index of an external optical fiber.
Disclosure of Invention
Based on this, it is necessary to provide an optoelectronic module based on a glass-based waveguide substrate to solve the problems of high optical coupling loss and low optical transmission efficiency caused by poor matching between the optical refractive index of the polymer waveguide and the refractive index of the external optical fiber in the prior art.
Based on the technical problems, the invention provides an optoelectronic module based on a glass-based waveguide substrate, comprising:
the device comprises a glass-based waveguide substrate, an organic medium layer and a photoelectric chip, wherein the organic medium layer is arranged outside the upper surface of the glass-based waveguide substrate;
a glass waveguide is arranged in the upper surface of the glass-based waveguide substrate, a first end of the glass waveguide is provided with an inclined plane with a preset angle, and the inclined plane with the preset angle is used for reflecting light rays incident from a second end of the glass waveguide to a direction deviating from the upper surface of the glass-based waveguide substrate;
an optical through hole and a conductive circuit are arranged in the organic medium layer, one end of the optical through hole is connected with the first end, so that light reflected by the inclined plane with the preset angle passes through the optical through hole to reach the other end of the optical through hole;
the photoelectric chip comprises an optical connection port and an electric connection port, wherein the electric connection port is connected with the conductive circuit when the photoelectric chip is installed, and the optical connection port is connected with the other end of the optical through hole.
Optionally, the photovoltaic module further includes:
and one end of the optical connector is connected with the second end of the glass waveguide, and the other end of the optical connector is used for being connected with an external optical path.
Optionally, a solder ball is disposed on the upper surface of the organic medium layer, and the solder ball is connected with the conductive circuit.
Optionally, an electrical interconnection through hole connected to two sides of the glass-based waveguide substrate is provided on the glass-based waveguide substrate, and an electrical interconnection structure connected to the conductive line is provided in the electrical interconnection through hole.
Optionally, a solder ball is disposed on the lower surface of the glass-based waveguide substrate, the solder ball is connected to one end of the electrical interconnection structure, and the other end of the electrical interconnection structure is connected to the conductive circuit.
Optionally, an organic waveguide is disposed in the optical through hole, and the organic waveguide is connected and communicated with an inclined plane of the glass waveguide at a preset angle.
Optionally, the inclined plane has an inclination angle of 45 °, and the organic waveguide is perpendicular to the glass-based waveguide substrate.
Optionally, the glass waveguide is located inside the glass-based waveguide substrate, and an upper surface of the glass waveguide is in the same plane with an upper surface of the glass-based waveguide substrate.
Optionally, the thickness of the glass-based waveguide substrate is 0.05-2mm.
Optionally, the thickness of the organic medium layer is 0.015-1mm.
The scheme has the following beneficial effects:
according to the photoelectric module based on the glass-based waveguide substrate, the glass waveguide with the inclined surface with the preset angle at one end is arranged in the glass-based waveguide substrate, light rays incident from the other end are reflected to the photoelectric chip through the optical through hole by utilizing the inclined surface, so that optical signal transmission of the photoelectric chip is realized, and electric signal transmission is realized by utilizing the connection of the photoelectric chip and the conductive circuit; because the glass waveguide in the glass fundamental wave guide substrate has good matching degree with external light, the optical path loss can be effectively reduced, and the optical path transmission efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a first photovoltaic module based on a glass fundamental waveguide substrate according to an embodiment of the present invention;
FIG. 2 is a schematic view of a second photovoltaic module based on a glass fundamental waveguide substrate according to an embodiment of the present invention;
FIG. 3 is a schematic view of a third photovoltaic module based on a glass-based waveguide substrate according to an embodiment of the present invention;
the symbols are as follows:
100. a glass fundamental wave guide substrate; 101. an electrical interconnect aperture; 102. an electrical interconnect structure; 200. an organic dielectric layer; 201. a conductive line; 301. a glass waveguide; 302. an optical through hole; 303. an organic waveguide; 310. an inclined plane; 400. an optical connector; 500. solder balls; 600. photoelectric chip, 700, main control chip.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments.
It is to be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
It will be further understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.
It will be further understood that the terms "upper," "lower," "left," "right," "front," "rear," "bottom," "middle," "top," and the like may be used herein to describe various elements and that the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings merely to facilitate describing the invention and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operate in a particular orientation, and that these elements should not be limited by these terms.
These terms are only used to distinguish one element from another element. For example, a first element could be termed a "upper" element, and, similarly, a second element could be termed a "upper" element, depending on the relative orientation of the elements, without departing from the scope of the present disclosure.
It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In one embodiment, there is provided an optoelectronic module based on a glass-based waveguide substrate as shown in fig. 1, the optoelectronic module comprising: the glass fundamental wave conductive substrate 100, the organic dielectric layer 200 arranged outside the upper surface of the glass fundamental wave conductive substrate 100 and the photoelectric chip 600.
Wherein, the glass waveguide 301 is disposed in the upper surface of the glass-based waveguide substrate 100, the first end of the glass waveguide 301 has a bevel 310 with a preset angle, and the bevel 310 with the preset angle is used for reflecting the light incident from the second end of the glass waveguide 310 in a direction away from the upper surface of the glass-based waveguide substrate 100.
In this embodiment, an optical through hole 302 and a conductive circuit 201 are disposed in the organic medium layer 200, wherein one end of the optical through hole 302 is connected to a first end of the glass waveguide 301, so that light reflected by the inclined plane 310 with a preset angle passes through the optical through hole 302 to reach the other end of the optical through hole; the optical through holes 302 and the conductive lines 201 are arranged in an staggered manner, the optical through holes 302 and the conductive lines 201 are not directly intersected, and the conductive lines 201 are distributed around the optical through holes 302.
In this embodiment, the optoelectronic chip 600 includes an optical connection port and an electrical connection port, the electrical connection port is connected to the conductive line 201, and the optical connection port is connected to the other end of the optical through-hole 302 to receive the light reflected from the inclined plane 310 through the optical through-hole 302 when the optoelectronic chip 600 is mounted.
In the photovoltaic module based on the glass fundamental wave guide substrate, a glass waveguide with one end provided with a preset angle inclined plane is arranged in the glass fundamental wave guide substrate, light rays incident from the other end are reflected to the photovoltaic chip through the light through hole by utilizing the inclined plane, so that the optical signal transmission of the photovoltaic chip is realized, and the electric signal transmission is realized by utilizing the connection of the photovoltaic chip and the conductive circuit; because the glass waveguide in the glass fundamental wave guide substrate has good matching degree with external light, the optical path loss can be effectively reduced, and the optical path transmission efficiency is improved.
In one embodiment, there is provided a glass-based photovoltaic module based on a glass-based waveguide board as shown in fig. 2, the photovoltaic module comprising: the glass fundamental wave conductive substrate 100, the organic dielectric layer 200 arranged outside the upper surface of the glass fundamental wave conductive substrate 100, the electric chip 600, the main control chip 700 and the optical connector 400, wherein the organic dielectric layer 200 is directly manufactured on the glass fundamental wave conductive substrate 100.
In this embodiment, the upper surface or the lower surface of the glass fundamental waveguide substrate 100 contains one or more arrays of glass waveguides 301, and the glass fundamental waveguide substrate 100 is made of schottky N-bk7 glass, pyrex glass, quartz and fused silica, and has a thickness of 0.05mm to 2mm, preferably 0.5mm to 1mm.
The glass has excellent dielectric property, and is beneficial to realizing small-spacing and small-scale high-frequency electric signal wiring; in addition, since glass has excellent dimensional stability under thermal load and a thermal expansion coefficient matched with that of a silicon-based chip, a higher I/O density and better thermo-mechanical reliability, i.e., a thermal expansion coefficient matched with silicon, can be obtained by using a glass-based waveguide substrate instead of an organic substrate, and thus higher alignment accuracy can be easily achieved.
In this embodiment, the organic dielectric layer 200 has a single-layer or multi-layer conductive circuit 201 inside, and the thickness of the organic dielectric layer 200 is 0.015mm-1mm, and as a more preferable parameter, the thickness of the organic dielectric layer is 0.1mm-0.3mm.
The organic dielectric layer 200 can be directly manufactured on the glass fundamental wave conductive substrate 100 through processes such as an addition method, a semi-addition method and the like, wherein the organic dielectric layer 200 and the glass fundamental wave conductive substrate 100 are bonded through a non-conductive film (NCF), the NCF bonding film is manufactured through processes such as spin coating, spray coating, knife coating and the like, and the non-conductive film has good optical transmittance so as to improve the transmittance of light rays.
In this embodiment, a glass waveguide 301 is disposed in the upper surface of the glass fundamental waveguide substrate 100, a first end of the glass waveguide 301 has a slope 310 with a preset angle, and the slope 310 with the preset angle is used to reflect the light incident from a second end of the glass waveguide 310 in a direction away from the upper surface of the glass fundamental waveguide substrate 100; the outstanding advantage of the glass fundamental waveguide substrate 100 is that the glass has good transparency, allowing for efficient assembly integration between the glass core material internal waveguide and planar active, passive and electro-optic components.
The glass waveguide 301 is located inside the glass fundamental wave guide substrate 100, and the upper surface of the glass waveguide 301 and the upper surface of the glass fundamental wave guide substrate 100 are in the same plane, and the glass waveguide 301 is arranged on the shallow surface layer of the glass fundamental wave guide substrate 100, so that the transmission path of light can be shortened, and the transmission efficiency of light can be improved.
The glass waveguide 301 may be fabricated by ion exchange, deposition, sol-gel, radio frequency sputtering, sol-gel, or the like, wherein the graded index glass waveguide 301 is preferably fabricated by ion exchange.
In this embodiment, one end of the optical connector 400 is connected to the second end of the glass waveguide 301, and the other end of the optical connector 400 is an optical fiber interface, so that an external optical fiber can be connected, and thus the optical connector is connected to the external optical fiber to receive and transmit optical signals; specifically, the optical connector is a mechanically connected MT connector or a modified MT optical connector of similar structure.
In this embodiment, an optical through hole 302 and a conductive circuit 201 are disposed in the organic dielectric layer 200, wherein an organic waveguide 303 is disposed in the optical through hole 302, and the organic waveguide 303 is connected and communicated with an inclined plane 310 of a preset angle of the glass waveguide 301; the optical through holes 302 and the conductive circuits 201 are arranged in a staggered manner, the optical through holes 302 and the conductive circuits 201 are not directly crossed, and the conductive circuits 201 are distributed around the optical through holes 302; the inclined plane 310 has an inclination angle of 45 °, and the organic waveguide 303 is disposed perpendicular to the glass fundamental waveguide substrate 100, so that light rays can reach a better reflection effect through the inclined plane 310.
The straight hole size of the optical through hole 302 is 20 μm to 500. Mu.m, preferably 50 μm to 250. Mu.m; the optical through hole 302 is filled with an optically transparent organic medium layer to form an organic waveguide 303, and the structure of the organic medium layer is a graded index column waveguide structure, and through the arrangement of the structure, the transmitted light is not zigzag any more, but is changed into continuous arc light, so that scattering loss of the light caused by irregular interfaces is avoided, and the transmission efficiency of the light is further improved.
A plurality of solder balls 500 are disposed on the upper surface of the organic dielectric layer 200, the solder balls 500 are connected to the conductive traces 201 in the organic dielectric layer 200, and the solder balls 500 are soldered to an external circuit board or trace.
In this embodiment, the upper surface of the organic medium layer 200 is also flip-chip with the photoelectric chip 600 and the main control chip 700, the photoelectric chip 600 and the main control chip 700 are assembled on the upper surface of the organic medium layer 200 through the anisotropic conductive film, and the photoelectric chip 600 and the main control chip 700 are connected through the conductive circuit in the organic medium layer 200, so as to realize the electric signal transmission between the photoelectric chip 600 and the main control chip 700;
the photo chip 600 includes an optical connection port connected to the conductive trace 201 and an electrical connection port connected to the other end of the optical through-hole 302 to receive light reflected from the inclined plane 310 through the optical through-hole 302 when the photo chip 600 is mounted.
The photovoltaic module based on the glass fundamental wave guide substrate of the embodiment has the following characteristics:
(1) The glass waveguide in the glass fundamental wave guide substrate has good matching degree with external light, so that the optical path loss can be effectively reduced, the optical path transmission efficiency is improved, and the glass fundamental wave guide substrate has excellent dielectric property, thereby being beneficial to realizing small-spacing and small-scale high-frequency electric signal wiring;
(2) Because the glass-based waveguide substrate has excellent dimensional stability under the heat load and the thermal expansion coefficient is matched with that of the silicon-based chip, the glass-based waveguide substrate is adopted to replace an organic substrate, so that higher I/O density and better thermo-mechanical reliability can be obtained, and higher alignment precision can be easily realized;
(3) The glass fundamental wave conducting substrate has good transparency, and high-efficiency assembly integration is realized between the glass core material internal waveguide and the planar active and passive and electro-optic components;
(4) The glass fundamental wave conducting substrate is used as a carrier for manufacturing the copper circuit, so that the manufacturing of a precise fine circuit can be realized, the interlayer alignment between the optical circuit layer and the electric circuit layer can be greatly improved, and the coupling efficiency of the optical circuit system package is improved;
(5) The wiring manufacture by adopting the re-wiring (RDL) technology can realize the encapsulation with low dielectric layer thickness, and the fan-out structure is favorable for realizing flip-chip encapsulation, further shortens the interconnection distance and improves the quality of high-speed signals.
In one embodiment, a glass-based waveguide substrate-based optoelectronic module as shown in fig. 3 is provided, which differs from the optoelectronic module of fig. 2 in that: the photoelectric module is provided with an electric interconnection hole 101 in a glass fundamental wave conductive substrate 100, and an electric interconnection structure 102 is arranged in the electric interconnection hole 101, wherein the electric interconnection structure 102 is connected with a conductive line in an organic dielectric layer 200.
A plurality of solder balls 500 are disposed on the lower surface of the glass fundamental wave conductive substrate 100, the solder balls 500 are connected to the electrical interconnection structure 102, and the solder balls 500 are used for soldering with an external circuit board or wire.
In an example, a plurality of solder balls 500 are disposed on the lower surface of the glass fundamental wave conductive substrate 100 and the upper surface of the organic dielectric layer 200, the solder balls 500 on the upper surface of the organic dielectric layer are connected with conductive wires inside the organic dielectric layer, the solder balls 500 on the lower surface of the glass fundamental wave conductive substrate 100 are connected with the electrical interconnection structure 102, and the solder balls 500 are used for soldering with external circuit boards or wires.
In this embodiment, the electrical interconnection hole 101 is a glass via (TGV), and the glass via does not need any isolation and has a lower manufacturing cost compared to a more complex Through Silicon Via (TSV).
The other structures of the photovoltaic module based on the glass fundamental wave conductive substrate in this embodiment are the same as those of the photovoltaic module in fig. 2, and are not described here again.
The photovoltaic module based on the glass fundamental wave guide substrate of the embodiment has the following characteristics:
(1) The glass waveguide in the glass fundamental wave guide substrate has good matching degree with external light, so that the optical path loss can be effectively reduced, the optical path transmission efficiency is improved, and the glass fundamental wave guide substrate has excellent dielectric property, and is beneficial to realizing high-frequency electric signal wiring of small-pitch and small-scale glass through hole (TGV) interconnection;
(2) Because the glass-based waveguide substrate has excellent dimensional stability under the heat load and the thermal expansion coefficient is matched with that of the silicon-based chip, the glass-based waveguide substrate is adopted to replace an organic substrate, so that higher I/O density and better thermo-mechanical reliability can be obtained, and higher alignment precision can be easily realized;
(3) The glass fundamental wave conducting substrate has good transparency, and high-efficiency assembly integration is realized between the glass core material internal waveguide and the planar active and passive and electro-optic components;
(4) The glass fundamental wave conducting substrate is used as a carrier for manufacturing the copper circuit, so that the manufacturing of a precise fine circuit can be realized, the interlayer alignment between an optical circuit layer and an electric circuit layer can be greatly improved, the coupling efficiency of the optical circuit system package is improved, the price of the glass fundamental wave conducting substrate is low, and the size is flexible to select;
(5) The wiring manufacture by adopting the re-wiring (RDL) technology can realize the encapsulation with low dielectric layer thickness, the fan-out structure is beneficial to the realization of flip chip encapsulation, the interconnection distance is further shortened, and the quality of high-speed signals is improved;
(6) The glass is used as a substrate, so that electric connection can be realized through TGV, optical connection can be realized through manufacturing a waveguide on the surface of the glass, and further, photoelectric integration is realized on the glass substrate;
(7) The circuit manufacturing by taking the glass fundamental wave guide substrate as the carrier plate is a mature process of a traditional display panel manufacturer, and the TGV process is relatively mature, so that the method has good realizability and low manufacturing and processing cost.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. An optoelectronic module based on a glass-based waveguide substrate, comprising:
the device comprises a glass-based waveguide substrate, an organic medium layer and a photoelectric chip, wherein the organic medium layer is arranged outside the upper surface of the glass-based waveguide substrate;
a glass waveguide is arranged in the upper surface of the glass-based waveguide substrate, a first end of the glass waveguide is provided with an inclined plane with a preset angle, and the inclined plane with the preset angle is used for reflecting light rays incident from a second end of the glass waveguide to a direction deviating from the upper surface of the glass-based waveguide substrate;
an optical through hole and a conductive circuit are arranged in the organic medium layer, one end of the optical through hole is connected with the first end, so that light reflected by the inclined plane with the preset angle passes through the optical through hole to reach the other end of the optical through hole;
the photoelectric chip comprises an optical connection port and an electric connection port, wherein the electric connection port is connected with the conductive circuit when the photoelectric chip is installed, and the optical connection port is connected with the other end of the optical through hole.
2. The optoelectronic module of claim 1 further comprising:
and one end of the optical connector is connected with the second end of the glass waveguide, and the other end of the optical connector is used for being connected with an external optical path.
3. The optoelectronic module of claim 1 wherein the upper surface of the organic dielectric layer is provided with solder balls, the solder balls being connected to the conductive traces.
4. The optoelectronic module of claim 1 wherein the glass-based waveguide substrate has electrical interconnect vias disposed thereon that connect two sides of the glass-based waveguide substrate, and wherein electrical interconnect structures are disposed within the electrical interconnect vias that connect the conductive lines.
5. The optoelectronic module of claim 4 wherein the lower surface of the glass-based waveguide substrate is provided with solder balls that connect one end of the electrical interconnect structure and the other end of the electrical interconnect structure connects the conductive trace.
6. The optoelectronic module of claim 1 wherein an organic waveguide is disposed within the optical through-hole, the organic waveguide in communication with the angled bevel connection of the glass waveguide.
7. The optoelectronic module of claim 6 wherein the bevel is angled at 45 ° and the organic waveguide is perpendicular to the glass-based waveguide substrate.
8. The optoelectronic module of claim 1 wherein the glass waveguide is positioned within the glass-based waveguide substrate and an upper surface of the glass waveguide is coplanar with an upper surface of the glass-based waveguide substrate.
9. The optoelectronic module of claim 1 wherein the glass-based waveguide substrate has a thickness of 0.05-2mm.
10. The optoelectronic module of claim 1 wherein the organic dielectric layer has a thickness of 0.015-1mm.
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| CN202310204374.4A CN116338876A (en) | 2023-02-22 | 2023-02-22 | Photoelectric module based on glass-based waveguide substrate |
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| CN202310204374.4A CN116338876A (en) | 2023-02-22 | 2023-02-22 | Photoelectric module based on glass-based waveguide substrate |
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