CN116328504A - Harmless device for waste gas - Google Patents

Harmless device for waste gas Download PDF

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Publication number
CN116328504A
CN116328504A CN202211650442.1A CN202211650442A CN116328504A CN 116328504 A CN116328504 A CN 116328504A CN 202211650442 A CN202211650442 A CN 202211650442A CN 116328504 A CN116328504 A CN 116328504A
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Prior art keywords
gas
flow path
line
path switching
harmless
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Chinese (zh)
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中村谕
宫崎一知
江田健
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Ebara Corp
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Ebara Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/14Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
    • B01D53/18Absorbing units; Liquid distributors therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/346Controlling the process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/46Removing components of defined structure
    • B01D53/68Halogens or halogen compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D47/00Separating dispersed particles from gases, air or vapours by liquid as separating agent
    • B01D47/02Separating dispersed particles from gases, air or vapours by liquid as separating agent by passing the gas or air or vapour over or through a liquid bath
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/005Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by heat treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/14Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
    • B01D53/1456Removing acid components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/30Controlling by gas-analysis apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/46Removing components of defined structure
    • B01D53/54Nitrogen compounds
    • B01D53/58Ammonia
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/73After-treatment of removed components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/75Multi-step processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/77Liquid phase processes
    • B01D53/78Liquid phase processes with gas-liquid contact
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405Cleaning of reactor or parts inside the reactor by using reactive gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23GCREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
    • F23G7/00Incinerators or other apparatus for consuming industrial waste, e.g. chemicals
    • F23G7/06Incinerators or other apparatus for consuming industrial waste, e.g. chemicals of waste gases or noxious gases, e.g. exhaust gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2252/00Absorbents, i.e. solvents and liquid materials for gas absorption
    • B01D2252/10Inorganic absorbents
    • B01D2252/103Water
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/20Halogens or halogen compounds
    • B01D2257/202Single element halogens
    • B01D2257/2025Chlorine
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/20Halogens or halogen compounds
    • B01D2257/202Single element halogens
    • B01D2257/2027Fluorine
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/20Halogens or halogen compounds
    • B01D2257/204Inorganic halogen compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/20Halogens or halogen compounds
    • B01D2257/204Inorganic halogen compounds
    • B01D2257/2047Hydrofluoric acid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/40Nitrogen compounds
    • B01D2257/406Ammonia
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/55Compounds of silicon, phosphorus, germanium or arsenic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2258/00Sources of waste gases
    • B01D2258/02Other waste gases
    • B01D2258/0216Other waste gases from CVD treatment or semi-conductor manufacturing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23GCREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
    • F23G2209/00Specific waste
    • F23G2209/14Gaseous waste or fumes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23GCREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
    • F23G2209/00Specific waste
    • F23G2209/14Gaseous waste or fumes
    • F23G2209/142Halogen gases, e.g. silane

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  • Chemical & Material Sciences (AREA)
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  • Environmental & Geological Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Mechanical Engineering (AREA)
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  • Metallurgy (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Treating Waste Gases (AREA)
  • Incineration Of Waste (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Provided is a harmless device capable of treating waste gas with less wet treatment devices than conventional devices. The harmless device comprises: a front wet treatment device (5); a combustion type treatment device (6); gas introduction lines (7A-7D) connected to the process chambers (2A-2D) of the film forming apparatus (1); first channel switching devices (8A-8D) connected to the gas introduction lines, respectively; first gas transport lines (9A-9D) extending from the first flow path switching device to the front-stage wet processing device; second gas transfer lines (10A-10D) extending from the first flow path switching device to the combustion type processing device; and an operation control unit (15) for controlling the operation of the first flow path switching device, and for supplying the process gas to the front-stage wet processing device and supplying the cleaning gas to the combustion type processing device. The number of front stage wet treatment devices is less than the number of process chambers.

Description

Harmless device for waste gas
Technical Field
The present invention relates to a harmless apparatus for treating a process gas and a cleaning gas exhausted from a film forming apparatus such as a CVD apparatus used for manufacturing semiconductor devices.
Background
In the manufacture of semiconductor devices, CVD apparatuses for forming films on wafers are used. The CVD apparatus comprises Dichlorosilane (DCS) and ammonia (NH) 3 ) And introducing a process gas into the process chamber to form a film on the wafer (film forming step). After the film forming step, a purge gas such as nitrogen is supplied to the process chamber, and the process gas is exhausted from the process chamber (purge step). Further, fluorine gas (F) is supplied into the process chamber 2 ) A cleaning gas such as Hydrogen Fluoride (HF) gas, and the like, to clean the inside of the process chamber (cleaning step).
In this way, the film forming step, the purging step, and the cleaning step are repeated in the CVD apparatus. Since the process gas and the cleaning gas are harmful gases, both gases need to be treated by a harmless device. In general, a CVD apparatus includes a plurality of process chambers to improve productivity. The innocuous device is connected with the plurality of process chambers and processes the process gas and the cleaning gas exhausted from each process chamber.
Fig. 9 is a schematic diagram showing a conventional harmless apparatus. As shown in fig. 9, the harmless treatment apparatus includes a plurality of wet treatment apparatuses 501 and combustion treatment apparatuses 502. The plurality of wet treatment apparatuses 501 are connected to the plurality of process chambers 500, respectively, and the combustion type treatment apparatus 502 is connected to the wet treatment apparatus 501. The wet treatment apparatus 501 has a function of removing water-soluble components contained in the process gas and the cleaning gas with water and preventing the formation of by-products. The combustion processing apparatus 502 has a function of performing combustion processing on a process gas and a cleaning gas to render these gases harmless.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 5977419 specification
Technical problem to be solved by the invention
The process gas such as Dichlorosilane (DCS) and ammonia (NH 3) used in the film forming step is a flammable gas, and the fluorine gas (F) used in the cleaning step 2 ) The cleaning gas such as Hydrogen Fluoride (HF) is combustion-supportingAnd (5) sex gas. If the process gas and the cleaning gas are mixed, there is a concern that the mixed gas explodes. Thus, as shown in fig. 9, a plurality of process chambers 500 are respectively connected to a plurality of wet processing apparatuses 501. According to such a configuration, the process gas, the purge gas, and the cleaning gas discharged from each process chamber 500 are sequentially supplied to the corresponding wet processing apparatus 501, and thus, there is no case where the process gas and the cleaning gas are mixed in the wet processing apparatus 501.
However, since the conventional innocuous device shown in fig. 9 requires the provision of a plurality of wet treatment devices 501 corresponding to the plurality of process chambers 500, the cost of the entire innocuous device increases, and the space occupied by the innocuous device increases.
Disclosure of Invention
Accordingly, the present invention provides a harmless apparatus capable of treating waste gas with less wet treatment apparatuses than conventional ones.
Technical means for solving the technical problems
In one embodiment, there is provided a harmless apparatus for treating an exhaust gas containing a process gas and a cleaning gas, comprising: at least one front-end wet treatment device; a combustion type treatment device; a plurality of gas introduction lines connected to a plurality of process chambers of the film forming apparatus; a plurality of first flow path switching devices connected to the plurality of gas introduction lines, respectively; a first gas delivery line extending from the plurality of first flow switching devices to the front stage wet processing device; a second gas delivery line extending from the plurality of first flow switching devices to the combustion processing device; and an operation control unit that controls operations of the plurality of first flow path switching devices, and that supplies the process gas to the pre-stage wet processing device and supplies the cleaning gas to the combustion type processing device, wherein the number of the at least one pre-stage wet processing device is smaller than the number of the plurality of process chambers.
In one embodiment, the operation control unit is configured to operate the corresponding first flow path switching device to connect the corresponding one of the plurality of gas introduction lines to the first gas delivery line and to shut off the connection between the corresponding gas introduction line and the second gas delivery line when a process gas discharge signal indicating discharge of a process gas from any one of the plurality of process chambers is received from the film forming device, and to operate the corresponding first flow path switching device to connect the corresponding one of the plurality of gas introduction lines to the second gas delivery line and to shut off the connection between the corresponding gas introduction line and the first gas delivery line when a cleaning gas discharge signal indicating discharge of a cleaning gas from any one of the plurality of process chambers is received from the film forming device.
In one embodiment, the plurality of first flow switching devices are a plurality of three-way valves.
In one aspect, the operation control unit is configured to operate the plurality of first flow path switching devices to communicate the plurality of gas introduction lines with the second gas transport line and to shut off communication between the plurality of gas introduction lines and the first gas transport line when closure of the wet processing apparatus is detected.
In one aspect, the innocuous device further includes: at least one second flow path switching device mounted to the second gas delivery line; and a bypass line connected to the second flow path switching device, wherein the operation control unit is configured to operate the second flow path switching device.
In one aspect, the operation control unit is configured to operate the plurality of first flow path switching devices to communicate the plurality of gas introduction lines with the second gas delivery line and to shut off the communication between the plurality of gas introduction lines and the first gas delivery line, and to operate the plurality of second flow path switching devices to communicate the second gas delivery line with the bypass line and to shut off the communication between the plurality of first flow path switching devices and the combustion processing device when the closure of the combustion processing device is detected.
In one aspect, the innocuous device further includes: a post-stage wet treatment device disposed downstream of the combustion treatment device; and an exhaust line connected to the rear wet treatment device, the bypass line being connected to the exhaust line.
In one embodiment, the front-stage wet treatment device is a single front-stage wet treatment device.
Effects of the invention
The operation control unit can supply the process gas to the front-stage wet processing apparatus by operating the plurality of first flow path switching devices, respectively, and can supply the cleaning gas to the combustion type processing apparatus. Since the cleaning gas is not supplied to the front-stage wet processing apparatus, the mixing of the cleaning gas and the process gas in the front-stage wet processing apparatus does not occur. Thus, there is no need to provide a significant number of wet treatment devices as the number of process chambers. As a result, the cost and the amount of space required for the innocuous device can be reduced.
Drawings
Fig. 1 is a schematic view showing an embodiment of a harmless device for treating an exhaust gas containing a process gas and a cleaning gas.
Fig. 2 is a schematic diagram illustrating an operation state in which the process gas is transferred to the combustion type processing apparatus by bypassing the front wet processing apparatus.
Fig. 3 is a cross-sectional view showing one embodiment of the detailed configuration of the front-stage wet treatment apparatus, the combustion type treatment apparatus, and the rear-stage wet treatment apparatus.
Fig. 4 is a schematic view of another embodiment of the innocuous device.
Fig. 5 is a diagram illustrating the flow of process gas and cleaning gas when a serious malfunction occurs in the combustion type processing apparatus.
Fig. 6 is a schematic view showing still another embodiment of the harmless apparatus.
Fig. 7 is a schematic view showing another embodiment of the harmless treatment apparatus.
Fig. 8 is a schematic view showing another embodiment of the harmless treatment apparatus.
Fig. 9 is a schematic diagram showing a conventional harmless apparatus.
Symbol description
1. Film forming apparatus
2A, 2B, 2C, 2D process chamber
5. Front wet treatment device
6. Combustion type treatment device
7A, 7B, 7C, 7D gas introduction line
8A, 8B, 8C, 8D first flow path switching device
9A, 9B, 9C, 9D first gas conveying line
10A, 10B, 10C, 10D second gas delivery line
15. Action control part
21. First connecting line
22. Rear wet treatment device
23. Exhaust line
24. Second connecting line
30. Pressure sensor
41. Water storage chamber
42. Water supply nozzle
44. Wetting wall
46. Water ejector
48. Gas-liquid separation box
48a reduced flow path
50. Combustion chamber
51. Burner with a burner body
60. Water treatment chamber
61. 62 water spray nozzle
71A, 71B, 71C, 71D second channel switching device
73A, 73B, 73C, 73D bypass line
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a schematic view showing an embodiment of a harmless device for treating an exhaust gas containing a process gas and a cleaning gas. The abatement device is a device for abating an exhaust gas containing a process gas and a cleaning gas, which is exhausted from a film forming device 1 used in the manufacture of semiconductor devices. In the embodiment described below, the film forming apparatus 1 is a CVD (Chemical Vapor Deposition: chemical vapor deposition) apparatus including a plurality of process chambers 2A, 2B, 2C, and 2D.
In the film forming apparatus 1 as a CVD apparatus, a process gas (a gas containing a material of a film) for forming a film on a wafer, a purge gas for exhausting the process gas from the process chambers 2A to 2D, and a cleaning gas for cleaning the inside of the process chambers 2A to 2D are sequentially supplied to the process chambers 2A to 2D. Examples of the process gas include Dichlorosilane (DCS) and ammonia (NH) 3 ) Etc. Examples of the cleaning gas include fluorine gas (F 2 ) Hydrogen fluoride gas (HF), nitrogen trifluoride gas (NF) 3 ) Chlorine trifluoride gas (ClF) 3 ) Etc.
In the film forming apparatus 1, the film forming process, the purging process, and the cleaning process are repeated in different cycles in the process chambers 2A to 2D. The film forming step is a step of introducing a process gas containing a material for forming a film into the process chambers 2A to 2D and forming the film on the wafer. After the film forming step, a purge step of supplying a purge gas such as nitrogen gas to the process chambers 2A to 2D and exhausting the process gas from the process chambers 2A to 2D is performed. Further, fluorine gas (F) is supplied into the process chambers 2A to 2D 2 ) And a cleaning step of cleaning the process chambers 2A to 2D with a cleaning gas such as Hydrogen Fluoride (HF).
As shown in fig. 1, the harmless apparatus includes: a single front-stage wet treatment device 5; a single combustion type treatment device 6; a plurality of gas introduction lines 7A, 7B, 7C, 7D connected to the plurality of process chambers 2A, 2B, 2C, 2D of the film forming apparatus 1, respectively; a plurality of first flow switching devices 8A, 8B, 8C, 8D connected to the plurality of gas introduction lines 7A, 7B, 7C, 7D, respectively; a plurality of first gas transport lines 9A, 9B, 9C, 9D extending from the plurality of first flow path switching devices 8A, 8B, 8C, 8D to the front stage wet processing device 5; a plurality of second gas delivery lines 10A, 10B, 10C, 10D extending from the plurality of first flow path switching devices 8A, 8B, 8C, 8D to the combustion processing device 6; and an operation control unit 15 for controlling the operations of the first channel switching devices 8A, 8B, 8C, 8D.
The operation control unit 15 is composed of at least one computer. The operation control unit 15 includes a storage device 15a and an arithmetic device 15b. The arithmetic device 15b includes a CPU (central processing unit) or a GPU (graphics processing module) that performs arithmetic operations based on instructions included in a program stored in the storage device 15 a. The storage device 15a includes a main storage device (e.g., a random access memory) accessible to the computing device 15b and an auxiliary storage device (e.g., a hard disk or a solid state disk) that stores data and programs. However, the specific configuration of the operation control unit 15 is not limited to these examples.
The front wet treatment device 5 is connected to the combustion treatment device 6 via a first connection line 21. One end of each of the gas introduction lines 7A to 7D is connected to each of the process chambers 2A to 2D, and the other end of each of the gas introduction lines 7A to 7D is connected to each of the first flow switching devices 8A to 8D. The number of gas introduction lines 7A to 7D is the same as the number of first flow switching devices 8A to 8D. In the present embodiment, four process chambers 2A to 2D, four gas introduction lines 7A to 7D, and four first flow switching devices 8A to 8D are provided, but the number is not limited to the present embodiment.
One ends of the first gas transport lines 9A to 9D are connected to the first flow path switching devices 8A to 8D, respectively, and the other ends of the first gas transport lines 9A to 9D are connected to the front-stage wet processing device 5. In the embodiment shown in fig. 1, the plurality of first gas transport lines 9A to 9D extend to the front stage wet treatment apparatus 5 without being joined, but in one embodiment, the plurality of first gas transport lines 9A to 9D may be joined to form at least one joined line, and the joined line may be connected to the front stage wet treatment apparatus 5.
One end of the second gas transport lines 10A to 10D is connected to the first flow path switching devices 8A to 8D, respectively, and the other end of the second gas transport lines 10A to 10D is connected to the combustion processing device 6. In the embodiment shown in fig. 1, the plurality of second gas delivery lines 10A to 10D extend to the combustion processing apparatus 6 without merging, but in one embodiment, the plurality of second gas delivery lines 10A to 10D may merge to form at least one merging line connected to the combustion processing apparatus 6.
The first flow path switching devices 8A to 8D are configured to selectively connect the gas introduction lines 7A to 7D to one of the first gas transport lines 9A to 9D and the second gas transport lines 10A to 10D. The first channel switching devices 8A to 8D are configured to be operable independently of each other. In the embodiment shown in fig. 1, the first flow path switching devices 8A to 8D are each constituted by a three-way valve. Each three-way valve is an actuator driven valve such as an electric valve or a solenoid valve. In one embodiment, the first flow path switching devices 8A to 8D may be each composed of a combination of a plurality of valves.
The operation control unit 15 is electrically connected to the first flow path switching devices 8A to 8D, and is configured to be able to operate the first flow path switching devices 8A to 8D, respectively. Therefore, for example, as shown in fig. 1, the operation control unit 15 can operate the first flow path switching device 8A to connect the gas introduction line 7A to the first gas transport line 9A and to shut off the connection between the gas introduction line 7A and the second gas transport line 10A, and can operate the first flow path switching device 8B to shut off the connection between the gas introduction line 7B and the first gas transport line 9B and to connect the gas introduction line 7B to the second gas transport line 10B. Similarly, the operation control unit 15 can operate the first flow switching devices 8C and 8D independently of each other, and can operate the first flow switching devices 8C and 8D independently of the first flow switching devices 8A and 8B.
The film forming apparatus 1 performs a film forming process, a purging process, and a cleaning process in different cycles in the plurality of process chambers 2A to 2D. Accordingly, the process gas, the purge gas, and the cleaning gas are sequentially exhausted from the process chambers 2A to 2D at different timings. The purge gas is an inert gas such as nitrogen, but the process gas is a flammable gas, and the purge gas is a combustion supporting gas. Therefore, if both the process gas and the cleaning gas are fed to the single pre-stage wet processing apparatus 5, the two gases are mixed in the pre-stage wet processing apparatus 5, and there is a risk of explosion.
Then, the operation control unit 15 is configured to control the operations of the first flow path switching devices 8A to 8D to supply the process gas to the front-stage wet processing device 5 and to supply the cleaning gas to the combustion processing device 6. That is, the cleaning gas is not supplied to the front stage wet processing apparatus 5. For example, as shown in fig. 1, when the process gas is exhausted from the process chamber 2A, the operation control portion 15 operates the first flow switching device 8A to communicate the gas introduction line 7A with the first gas delivery line 9A and to shut off the communication between the gas introduction line 7A and the second gas delivery line 10A. As a result, the process gas is supplied to the front stage wet treatment apparatus 5 through the first gas supply line 9A. In fig. 1, the white triangles of the first flow switching device 8A indicate the open state and the black triangles indicate the closed state.
Meanwhile, when the cleaning gas is discharged from the process chamber 2B, the operation control portion 15 operates the first flow path switching device 8B, cuts off the communication of the gas introduction line 7B and the first gas delivery line 9B, and causes the gas introduction line 7B to communicate with the second gas delivery line 10B. As a result, the cleaning gas is not supplied to the front-stage wet treatment device 5, but is supplied to the combustion type treatment device 6 through the second gas supply line 10B. In fig. 1, the white triangles of the first flow switching device 8B represent the open state and the black triangles represent the closed state.
In this way, the operation control unit 15 can supply the process gas to the front-stage wet processing apparatus 5 and supply the cleaning gas to the combustion type processing apparatus 6 by operating the first flow path switching devices 8A to 8D, respectively. Since the cleaning gas is not supplied to the front-stage wet processing apparatus 5, the cleaning gas and the process gas are not mixed in the front-stage wet processing apparatus 5. Accordingly, it is not necessary to provide a number of wet treatment apparatuses corresponding to the number of process chambers as in the conventional innocuous apparatus shown in fig. 9. In particular, in the embodiment shown in fig. 1, since only a single front wet treatment apparatus 5 is provided, the cost and the amount of space required for the harmless apparatus can be reduced.
In order to prevent the cleaning gas from being supplied to the front-stage wet processing apparatus 5 while reliably supplying the process gas to the front-stage wet processing apparatus 5, it is preferable that the timing at which the operation control unit 15 operates the first flow path switching devices 8A to 8D is the timing at which the purge gas is passing through the first flow path switching devices 8A to 8D.
The operation control unit 15 is electrically connected to the film forming apparatus 1, and is configured to receive a process gas discharge signal, a purge gas discharge signal, and a cleaning gas discharge signal, which are emitted from the film forming apparatus 1. The film forming apparatus 1 is configured to generate and transmit a process gas exhaust signal to the operation control unit 15 when exhausting a process gas from any one of the process chambers 2A to 2D. The process gas exhaust signal determines information about which of the process chambers 2A-2D is exhausting the process gas.
For example, when receiving a process gas exhaust signal indicating that the process gas is exhausted from the process chamber 2A from the film forming apparatus 1, the operation control unit 15 operates the first flow path switching device 8A corresponding to the process chamber 2A, causes the corresponding gas introduction line 7A to communicate with the first gas transport line 9A, and cuts off the communication between the corresponding gas introduction line 7A and the second gas transport line 10A. By the operation of the first flow switching device 8A, the process gas discharged from the process chamber 2A is supplied to the front stage wet processing device 5 through the gas introduction line 7A, the first flow switching device 8A, and the first gas supply line 9A.
The film forming apparatus 1 is configured to generate and transmit a cleaning gas exhaust signal to the operation control unit 15 when exhausting a cleaning gas from any one of the plurality of process chambers 2A to 2D. The cleaning gas exhaust signal is information for determining which of the process chambers 2A to 2D is exhausting the cleaning gas.
For example, when receiving a cleaning gas exhaust signal indicating that the cleaning gas is exhausted from the process chamber 2B from the film forming apparatus 1, the operation control unit 15 operates the first flow path switching device 8B corresponding to the process chamber 2B, cuts off communication between the corresponding gas introduction line 7B and the first gas transport line 9B, and communicates the corresponding gas introduction line 7B with the second gas transport line 10B. By the operation of the first flow switching device 8B, the cleaning gas discharged from the process chamber 2B is supplied to the combustion processing device 6 through the gas introduction line 7B, the first flow switching device 8B, and the second gas supply line 10B.
The harmless device further includes a post-stage wet treatment device 22 provided downstream of the combustion type treatment device 6, and an exhaust line 23 connected to the post-stage wet treatment device 22. The subsequent wet treatment device 22 is connected to the combustion treatment device 6 via a second connection line 24. According to the innocuous apparatus having such a structure, the process gas is treated by the front stage wet treatment apparatus 5, the combustion type treatment apparatus 6, and the rear stage wet treatment apparatus 22 in this order, and the cleaning gas is treated by the combustion type treatment apparatus 6 and the rear stage wet treatment apparatus 22 in this order.
Comprising fluorine gas (F) 2 ) Hydrogen fluoride gas (HF) or nitrogen trifluoride gas (NF) 3 ) When the cleaning gas such as the above is wet-treated, acidic water having corrosiveness to the metal is generated. According to the embodiment shown in fig. 1, since the cleaning gas bypasses the front-stage wet treatment device 5, corrosion of the first connection line 21 connecting the front-stage wet treatment device 5 and the combustion type treatment device 6 can be prevented.
Further, since the cleaning gas bypasses the front-stage wet treatment device 5, the cleaning gas can be guided to the combustion treatment device 6 while maintaining the dry state and avoiding a decrease in the temperature of the cleaning gas. As a result, the combustion processing apparatus 6 can efficiently perform combustion processing on the cleaning gas. In particular, the combustion type processing apparatus 6 can efficiently process the gas containing chlorine trifluoride (ClF) 3 ) Such as a cleaning gas which is a hardly decomposable gas.
The mixture of process gas and cleaning gas may form solid by-products as its temperature decreases. Examples of the by-product include ammonium fluoride and ammonium fluorosilicate. Such by-products are easily formed upstream of the combustion type processing apparatus 6 having the lowest temperature. The side products may close the gas flow path, and the formation of the side products should be prevented as much as possible. According to the above embodiment, ammonia (NH 3 ) The cleaning gas is removed by the front-stage wet treatment device 5 and bypasses the front-stage wet treatment device 5, and therefore the above-described by-products are not formed. Further, since ammonia is removed by the front-stage wet treatment device 5, NO generation in the combustion type treatment device 6 is suppressed X
As shown in fig. 1, the harmless device includes a pressure sensor 30 connected to at least one of the plurality of gas introduction lines 7A to 7D. In the embodiment shown in fig. 1, the pressure sensor 30 is connected to the gas introduction line 7A. The pressure sensor 30 is electrically connected to the operation control unit 15, and a measured value of the pressure in the gas introduction line 7A is sent from the pressure sensor 30 to the operation control unit 15. The plurality of pressure sensors 30 may be connected to the plurality of gas introduction lines 7A to 7D, respectively.
By-products formed from the components of the process gas may accumulate in the front stage wet processing apparatus 5. If such accumulation of by-products proceeds, the internal flow path of the front wet treatment apparatus 5 may be blocked. Then, the operation control unit 15 is configured to detect the closing of the front-stage wet treatment apparatus 5 based on the measured value of the pressure transmitted from the pressure sensor 30. Specifically, when the measured value of the pressure in the gas introduction line 7A exceeds the threshold value in a state where the first flow path switching device 8A communicates the gas introduction line 7A with the first gas transport line 9A, and when the measured value of the pressure in the gas introduction line 7A is lower than the threshold value in a state where the first flow path switching device 8A communicates the gas introduction line 7A with the second gas transport line 10A, the operation control unit 15 determines that the front stage wet processing apparatus 5 is closed.
On the other hand, when the measured value of the pressure in the gas introduction line 7A is lower than the threshold value in the state where the gas introduction line 7A is communicated with the first gas transport line 9A by the first flow path switching device 8A, the operation control unit 15 determines that both the front wet treatment device 5 and the combustion type treatment device 6 are not closed.
If it is determined that the front wet processing apparatus 5 is closed, as shown in fig. 2, the operation control unit 15 operates all of the first flow path switching devices 8A to 8D, cuts off the communication between all of the gas introduction lines 7A to 7D and all of the first gas transport lines 9A to 9D, and communicates all of the gas introduction lines 7A to 7D with all of the second gas transport lines 10A to 10D. By such operation, the process gas is not fed to the fore-stage wet treatment apparatus 5 (bypasses the fore-stage wet treatment apparatus 5) but fed to the combustion type treatment apparatus 6. Although the process gas and the cleaning gas can be simultaneously supplied to the combustion type processing apparatus 6, the process gas as the combustible gas and the cleaning gas as the combustion supporting gas are mixed in the combustion type processing apparatus 6 to form a mixed gas, and the mixed gas is rapidly combusted, so that an unexpected explosion does not occur.
Fig. 3 is a cross-sectional view showing one embodiment of the detailed structures of the front-stage wet treatment apparatus 5, the combustion type treatment apparatus 6, and the rear-stage wet treatment apparatus 22. The front-stage wet processing apparatus 5 includes: a water reservoir 41; a water supply nozzle 42 for supplying water to the water reservoir 41; a wetting wall section 44 where water hangs down from the water reservoir 41 to form a wetting wall; a water jet 46 for spraying a mist of water onto the process gas passing through the wetted wall portion 44; and a gas-liquid separation tank 48 that separates water from gas. The front-stage wet treatment device 5 is connected to the combustion type treatment device 6 via a first connection line 21, and the combustion type treatment device 6 is connected to the rear-stage wet treatment device 22 via a gas-liquid separation tank 48 and a second connection line 24.
The combustion processing apparatus 6 includes: a combustion chamber 50 connected to the first connection line 21; a burner 51 for forming a flame in the combustion chamber 50; and the above-described gas-liquid separation tank 48 that separates water from gas. The gas-liquid separation tank 48 is common to the front-stage wet treatment apparatus 5, and water in the gas-liquid separation tank 48 circulates as indicated by an arrow. The contracted flow path 48a formed by a part of the gas-liquid separation tank 48 is filled with water, and the contracted flow path 48a located between the front-stage wet treatment device 5 and the combustion type treatment device 6 is sealed with water.
The subsequent wet treatment device 22 includes a water treatment chamber 60 connected to the second connection line 24, and water spray nozzles 61 and 62 disposed in the water treatment chamber 60. The second connection line 24 is connected to the gas-liquid separation tank 48 of the combustion processing apparatus 6.
The process gas and the cleaning gas are treated as follows. The process gas is initially treated by a pre-stage wet treatment device 5. The process gas flows into the water reservoir 41, and then flows downward in the wetted wall portion 44. The water injector 46 sprays water mist to the process gas flowing in the flow path 47, thereby removing water contained in the process gasAnd (3) a soluble component. For example, si component contained in Dichlorosilane (DCS) is dissolved in water and removed, and thus the processing load of the combustion processing apparatus 6 is reduced. Ammonia (NH) in process gas 3 ) Is also removed by water.
The water sprayed from the water injector 46 and the process gas are separated in the gas-liquid separation tank 48, and the water is accumulated in the gas-liquid separation tank 48, and the process gas flows into the combustion chamber 50 of the combustion type processing apparatus 6 through the first connection line 21. The water in the gas-liquid separation tank 48 contains ammonia (NH) in the process gas 3 ) And becomes alkaline water. The alkaline water does not corrode the gas-liquid separation tank 48 composed of metal, and a coating or the like for preventing corrosion is not required.
The process gas treated by the pre-stage wet treatment apparatus 5 is then treated by the combustion type treatment apparatus 6. The cleaning gas is not treated by the pre-stage wet treatment device 5 but is treated by the combustion type treatment device 6. The burner 51 forms a flame in the combustion chamber 50, and the process gas as a combustible gas and the cleaning gas as a combustion supporting gas are burned by the flame. A wetted wall composed of a water film is formed on the inner surface of the combustion chamber 50 to protect the combustion chamber 50.
The burned process gas and/or cleaning gas (hereinafter referred to as treated gas) flows down in the combustion chamber 50, passes through the gas-liquid separation tank 48, and is sent to the subsequent wet treatment apparatus 22 through the second connection line 24. The post-stage wet treatment device 22 sprays water from the water spray nozzles 61 and 62 to the treated gas, and thereby the treated gas is further subjected to wet treatment. The treated gas wet-treated by the subsequent wet treatment device 22 is discharged from the harmless device through the exhaust line 23. In this way, the process gas is treated by the front stage wet treatment device 5, the combustion type treatment device 6, and the rear stage wet treatment device 22, and the cleaning gas is treated by the combustion type treatment device 6 and the rear stage wet treatment device 22.
In the embodiment shown in fig. 3, a common gas-liquid separation tank 48 is used for the front-stage wet treatment apparatus 5 and the combustion type treatment apparatus 6. The contracted flow path 48a between the front-stage wet processing apparatus 5 and the combustion processing apparatus 6 is always filled with water, and therefore, the process gas does not flow from the front-stage wet processing apparatus 5 to the combustion processing apparatus 6 through the gas-liquid separation tank 48. However, the process gas falls down to the water in the gas-liquid separation tank 48 together with the water sprayed from the water injector 46, and bubbles may be generated in the water. The bubbles of the process gas are carried by the water circulating in the gas-liquid separation tank 48, and may reach the downstream side of the combustion processing apparatus 6 through the contracted flow path 48 a. Although such shortcuts of the process gas are generated, the process gas is discharged without being treated because the shortcut process gas is treated by the rear wet treatment device 22.
On the other hand, the cleaning gas does not flow to the preceding wet treatment device 5, and therefore, in principle, a shortcut through the inside of the gas-liquid separation tank 48 as described above does not occur. That is, the cleaning gas inevitably passes through the combustion type processing apparatus 6, and is processed by the combustion type processing apparatus 6. Further, the cleaning gas is treated by the subsequent stage wet treatment device 22.
Next, another embodiment of the harmless device will be described with reference to fig. 4. The configuration and operation of the present embodiment, which are not specifically described, are the same as those of the embodiment described with reference to fig. 1 to 3, and thus, a repetitive description thereof will be omitted.
As shown in fig. 4, the harmless apparatus further includes: a plurality of second flow path switching devices 71A, 71B, 71C, 71D mounted on the plurality of second gas delivery lines 10A, 10B, 10C, 10D, respectively; and a plurality of bypass lines 73A, 73B, 73C, 73D connected to the second flow path switching devices 71A, 71B, 71C, 71D, respectively. The bypass lines 73A to 73D are connected to the exhaust line 23. The second flow path switching devices 71A to 71D are electrically connected to the operation control unit 15, and the operation control unit 15 is configured to be able to independently operate the second flow path switching devices 71A to 71D. In the embodiment shown in fig. 4, the second flow path switching devices 71A to 71D are each constituted by a three-way valve. Each three-way valve is an actuator driven valve such as an electric valve or a solenoid valve. In one embodiment, the second flow path switching devices 71A to 71D may be each constituted by a combination of a plurality of valves.
The second flow path switching devices 71A to 71D are configured to selectively flow the cleaning gas flowing through the second gas delivery lines 10A to 10D to one of the combustion processing device 6 and the bypass lines 73A to 73D. That is, the second channel switching devices 71A to 71D are configured to be switchable between the normal channel and the emergency channel. The normal path is a path that connects the first flow switching devices 8A to 8D to the combustion processing device 6 and cuts off the connection between the second gas delivery lines 10A to 10D and the bypass lines 73A to 73D. The emergency path is a path for connecting the second gas transfer lines 10A to 10D to the bypass lines 73A to 73D and for disconnecting the first flow switching devices 8A to 8D from the combustion processing device 6.
In fig. 4, white triangles of the second channel switching devices 71A to 71D indicate open states, and black triangles indicate closed states. As shown in fig. 4, in the normal operation, the second channel switching devices 71A to 71D are in the state of the normal channel. That is, the first flow path switching devices 8A to 8D communicate with the combustion processing device 6 via the second flow path switching devices 71A to 71D, and the communication between the second gas delivery lines 10A to 10D and the bypass lines 73A to 73D is blocked by the second flow path switching devices 71A to 71D. Therefore, the cleaning gas can be supplied to the combustion processing apparatus 6 through the plurality of gas introduction lines 7A to 7D, the first flow path switching devices 8A to 8D, the second gas supply lines 10A to 10D, and the second flow path switching devices 71A to 71D.
On the other hand, as shown in fig. 5, when a serious failure in the harmless apparatus should be stopped, the operation control section 15 operates the plurality of first flow path switching devices 8A to 8D, causes the gas introduction lines 7A to 7D to communicate with the second gas transport lines 10A to 10D, and cuts off the communication between the gas introduction lines 7A to 7D and the first gas transport lines 9A to 9D. Further, the operation control unit 15 operates the second channel switching devices 71A to 71D to switch from the normal channel to the emergency channel. The second gas delivery lines 10A to 10D communicate with the bypass lines 73A to 73D via the second flow path switching devices 71A to 71D, and the communication between the first flow path switching devices 8A to 8D (and the gas introduction lines 7A to 7D) and the combustion processing device 6 is shut off by the second flow path switching devices 71A to 71D. Therefore, the process gas and the cleaning gas bypass both the front-stage wet treatment device 5 and the combustion type treatment device 6 and are sent to the exhaust line 23. More specifically, the process gas and the cleaning gas are supplied to the exhaust line 23 through the gas introduction lines 7A to 7D, the first flow switching devices 8A to 8D, the second gas supply lines 10A to 10D, the second flow switching devices 71A to 71D, and the bypass lines 73A to 73D.
An example of serious failure in which the harmless treatment apparatus should be stopped is closing of the combustion treatment apparatus 6. The operation control unit 15 can detect the closing of the combustion processing apparatus 6 based on the measured value of the pressure in the gas introduction line 7A sent from the pressure sensor 30. More specifically, when the measured value of the pressure in the gas introduction line 7A exceeds the threshold value in the state where the first flow path switching device 8A communicates the gas introduction line 7A with the second gas delivery line 10A, the operation control unit 15 determines that the combustion processing device 6 is closed.
When it is determined that the combustion processing apparatus 6 is closed, as shown in fig. 5, the operation control unit 15 operates all of the first flow path switching devices 8A to 8D to shut off the communication between all of the gas introduction lines 7A to 7D and all of the first gas transport lines 9A to 9D, and to communicate all of the gas introduction lines 7A to 7D with all of the second gas transport lines 10A to 10D. Further, the operation control unit 15 operates all of the second flow path switching devices 71A to 71D, cuts off the communication between all of the first flow path switching devices 8A to 8D and the combustion processing device 6, and communicates all of the second gas delivery lines 10A to 10D with all of the bypass lines 73A to 73D.
By such operation, the process gas and the cleaning gas are not supplied to both the pre-stage wet processing apparatus 5 and the combustion type processing apparatus 6 (bypass the pre-stage wet processing apparatus 5 and the combustion type processing apparatus 6) but supplied to the exhaust line 23. As a result, breakage due to pressure rise in the harmless apparatus can be prevented.
When a flame in the combustion processing apparatus 6 is caused to be in trouble due to a failure of the burner 51 or the like, a combustion trouble signal is sent from a combustion detector, not shown, to the operation control unit 15. When the operation control unit 15 receives the combustion problem signal (that is, when a problem occurs in the flame in the combustion processing apparatus 6), the operation control unit 15 maintains the normal path of the second flow path switching devices 71A to 71D. The problem of flame is classified as a mild failure, and the fire-extinguishing combustion processing apparatus 6 functions only as a flow path. Therefore, the process gas processed by the pre-stage wet processing apparatus 5 and the cleaning gas supplied through the second gas supply lines 10A to 10D pass through only the combustion type processing apparatus 6.
In one embodiment, as shown in fig. 6, the second gas transport line 10 may be constituted by an aggregate line having one end connected to the first flow switching devices 8A to 8D and the other end connected to the combustion processing device 6. In this case, one second flow path switching device 71 may be attached to the second gas transmission line 10, and one bypass line 73 may be connected to the second flow path switching device 71. Further, as shown in fig. 7, a plurality of second flow path switching devices 71A and 71B, the number of which is smaller than that of the first flow path switching devices 8A to 8D, may be attached to the second gas transport lines 10A and 10B.
In the embodiment shown in fig. 1 to 7, only a single front-stage wet treatment apparatus 5 is provided, but in one embodiment, a plurality of front-stage wet treatment apparatuses 5 fewer in number than the plurality of process chambers 2A to 2D may be provided. For example, in the example shown in fig. 8, the gas introduction line 7A is constituted by an aggregate line connected to the plurality of process chambers 2A and 2B that perform the film formation process and the cleaning process in the same cycle, and the gas introduction line 7B is constituted by an aggregate line connected to the plurality of process chambers 2C and 2D that perform the film formation process and the cleaning process in the same cycle. In this case, a plurality of front wet treatment devices 5 corresponding to the gas introduction lines 7A and 7B may be provided. In this embodiment, the number of the plurality of front-stage wet treatment devices 5 is also smaller than the number of the plurality of process chambers 2A to 2D, and thus a low-cost and low-duty harmless device is realized.
The above-described embodiments are described with the object that a person having ordinary knowledge in the technical field of the present invention can practice the present invention. Various modifications of the above-described embodiments will be obvious to those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the embodiments described above, but is to be construed as the broadest scope of the technical idea defined by the scope of the present invention.

Claims (8)

1. A harmless apparatus is an exhaust gas harmless apparatus including a process gas and a cleaning gas, and is characterized by comprising:
at least one front-end wet treatment device;
a combustion type treatment device;
a plurality of gas introduction lines connected to a plurality of process chambers of the film forming apparatus;
a plurality of first flow path switching devices connected to the plurality of gas introduction lines, respectively;
a first gas delivery line extending from the plurality of first flow switching devices to the front stage wet processing device;
a second gas delivery line extending from the plurality of first flow switching devices to the combustion processing device; and
an operation control unit that controls operations of the plurality of first flow path switching devices, and that supplies the process gas to the pre-stage wet processing device and supplies the cleaning gas to the combustion processing device,
the number of the at least one front stage wet treatment device is less than the number of the plurality of process chambers.
2. The harmless device according to claim 1, wherein,
the operation control unit is configured to control the operation of the vehicle,
when a process gas exhaust signal indicating exhaust of a process gas from any one of the plurality of process chambers is received from the film forming apparatus, a corresponding first flow switching device is operated to communicate a corresponding one of the plurality of gas introduction lines with the first gas delivery line, and communication between the corresponding gas introduction line and the second gas delivery line is shut off,
when a cleaning gas discharge signal indicating discharge of a cleaning gas from any one of the plurality of process chambers is received from the film forming apparatus, a corresponding first flow path switching device is operated to communicate a corresponding one of the plurality of gas introduction lines with the second gas delivery line, and communication between the corresponding gas introduction line and the first gas delivery line is cut off.
3. The harmless device according to claim 1 or 2, wherein,
the plurality of first flow path switching devices are a plurality of three-way valves.
4. The harmless device according to claim 1 or 2, wherein,
the operation control unit is configured to operate the plurality of first flow path switching devices to communicate the plurality of gas introduction lines with the second gas transport line and to shut off communication between the plurality of gas introduction lines and the first gas transport line when closure of the wet processing apparatus is detected.
5. The harmless device according to claim 1 or 2, wherein,
the harmless device further comprises:
at least one second flow path switching device mounted to the second gas delivery line; and
a bypass line connected to the second flow switching device,
the operation control unit is configured to operate the second channel switching device.
6. The harmless treatment device according to claim 5, wherein,
the operation control unit is configured to operate the plurality of first flow path switching devices to communicate the plurality of gas introduction lines with the second gas delivery line and to shut off communication between the plurality of gas introduction lines and the first gas delivery line, and to operate the plurality of second flow path switching devices to communicate the second gas delivery line with the bypass line and to shut off communication between the plurality of first flow path switching devices and the combustion processing device when closure of the combustion processing device is detected.
7. The harmless treatment device according to claim 5, wherein,
the harmless device further comprises:
a post-stage wet treatment device disposed downstream of the combustion treatment device; and
an exhaust line connected to the rear wet treatment device,
the bypass line is connected to the exhaust line.
8. The harmless device according to claim 1 or 2, wherein,
the front-stage wet treatment device is a single front-stage wet treatment device.
CN202211650442.1A 2021-12-24 2022-12-21 Harmless device for waste gas Pending CN116328504A (en)

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