CN116322216A - Organic light emitting device, method of manufacturing the same, and organic light emitting display device - Google Patents
Organic light emitting device, method of manufacturing the same, and organic light emitting display device Download PDFInfo
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Abstract
The invention provides an organic light emitting device, a method for manufacturing the same and an organic light emitting display device, wherein the method comprises the following steps: manufacturing a source/drain electrode on the insulating layer, wherein the source/drain electrode comprises a first metal layer formed on the insulating layer, an intermediate metal layer formed on the first metal layer and a second metal layer formed on the intermediate metal layer, the width of the first metal layer and the width of the second metal layer are larger than those of the intermediate metal layer, and the second metal layer contracts under preset treatment; manufacturing an organic light-emitting functional layer on the source/drain electrode; and carrying out preset treatment on the second metal layer to shrink the second metal layer, and manufacturing a cathode layer on the organic light-emitting functional layer to cover the cathode layer on the middle metal layer and the first metal layer. The second metal layer is shrunk under the preset treatment to reduce the width, so that the cathode layer can be connected with the middle metal layer and the first metal layer, the connection effect of the cathode layer and the middle metal layer is good, and the contact resistance is effectively reduced.
Description
Technical Field
The present invention relates to the field of organic light emitting technology, and in particular, to an organic light emitting device, a method for manufacturing the same, and an organic light emitting display device.
Background
In the organic light emitting device, in the auxiliary cathode lower lapping scheme, an SD (ti/Al/ti) layer is used as a separation column, and izo metal auxiliary cathode lapping is added, so that the organic light emitting functional layer EL is disconnected due to the existence of metal ti on the top layer of the separation column, when the cathode izo is deposited, the cathode and the lower layer metal of the separation column can be lapped through middle metal Al of the lap joint separation column, but the width of metal ti on the top layer of the separation column is larger, the cathode izo is prevented from being deposited on the side wall of the middle metal Al, the cathode izo coated on the middle metal Al is caused to be less, and the contact resistance between the cathode izo and the middle metal Al is larger.
Disclosure of Invention
In view of the above, it is desirable to provide an organic light emitting device, a method of manufacturing the same, and an organic light emitting display device.
A method of manufacturing an organic light emitting device, comprising:
manufacturing a source/drain electrode on a substrate, wherein the source/drain electrode comprises a first metal layer formed on the substrate, an intermediate metal layer formed on the first metal layer and a second metal layer formed on the intermediate metal layer, the orthographic projection area of the second metal layer on the substrate is larger than the orthographic projection area of the intermediate metal layer on the substrate, and the second metal layer is used for shrinking under preset treatment;
manufacturing an organic light-emitting functional layer on the source/drain electrode;
and carrying out the preset treatment on the second metal layer to enable the second metal layer to shrink, and manufacturing a cathode layer on the organic light-emitting functional layer to enable the cathode layer to be coated on the middle metal layer and the first metal layer.
In one embodiment, the preset treatment includes applying a magnetic field to the second metal layer, where the material of the second metal layer is a metal magnetostrictive material, and the second metal layer is configured to shrink under the action of the magnetic field;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
a magnetic field is applied to the second metal layer to cause the second metal layer to shrink.
In one embodiment, the material of the second metal layer is metallic nickel.
In one embodiment, the preset treatment includes removing a magnetic field from the second metal layer, where the second metal layer is made of a metal magnetostrictive material, and the second metal layer is used for stretching under the action of the magnetic field;
the step of manufacturing the organic light emitting function layer on the source/drain electrode comprises the following steps:
applying a magnetic field to the second metal layer to stretch the second metal layer, and manufacturing an organic light-emitting functional layer on the source/drain electrode;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
removing or reducing a magnetic field applied to the second metal layer when the organic light emitting functional layer is manufactured, so that the second metal layer is contracted;
the second metal layer is made of iron-aluminum alloy.
In one embodiment, the pre-setting process includes reducing a temperature of the second metal layer, the second metal layer being configured to shrink when the temperature is reduced;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
reducing the temperature of the second metal layer so that the second metal layer contracts;
the second metal layer is made of metal chromium.
In one embodiment, the preset treatment includes applying an electric field to the second metal layer, where the material of the second metal layer is a metal electrostrictive material, and the second metal layer is used for shrinking under the action of the electric field;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
an electric field is applied to the second metal layer to cause the second metal layer to shrink.
In one embodiment, the second metal layer includes a second metal layer body formed on the intermediate metal layer and a deformed metal layer formed on the second metal layer body, and the deformed metal layer is used for stretching under a preset process;
and performing the preset treatment on the second metal layer to shrink the second metal layer, and manufacturing a cathode layer on the organic light-emitting functional layer to cover the cathode layer on the intermediate metal layer and the first metal layer, wherein the step of coating the cathode layer on the first metal layer comprises the following steps:
carrying out the preset treatment on the second metal layer to enable the deformed metal layer to stretch so as to enable the organic light-emitting functional layer on the deformed metal layer to break to form a gap;
manufacturing a cathode layer on the organic light-emitting functional layer, so that the cathode layer is coated on the intermediate metal layer and the first metal layer, the cathode layer is formed in the gap, and the cathode layer passes through the gap and is connected with the deformation metal layer;
the second metal layer body is made of metal titanium; the deformation metal layer is made of iron-aluminum alloy, metal chromium and metal nickel.
An organic light emitting device comprising:
the organic light-emitting diode comprises a substrate, an isolation column arranged on the substrate, an organic light-emitting functional layer and a cathode, wherein the organic light-emitting functional layer and the cathode are sequentially arranged on one side, far away from the substrate, of the isolation column;
the isolation column comprises a first metal layer, an intermediate metal layer and a second metal layer which are sequentially arranged along the direction far away from the substrate, wherein the orthographic projection area of the second metal layer on the substrate is larger than that of the intermediate metal layer on the substrate; the organic light-emitting functional layer is disconnected at the position of the isolation column, and the cathode is in contact with the second metal layer and the intermediate metal layer; the material of the second metal layer is at least an organic light-emitting function layer of a stretchable material.
In one embodiment, the stretchable material comprises metallic chromium, iron-aluminum alloy, metallic nickel.
In one embodiment, the second metal layer includes a second metal layer body close to the substrate and a deformed metal layer far away from the substrate, the second metal layer body is the same as the first metal layer, and the deformed metal layer is made of a stretchable material.
In one embodiment, the side, far away from the substrate, of the deformed metal layer is sequentially provided with the organic light-emitting functional layer and the cathode, the organic light-emitting functional layer is provided with a first pore, and the cathode is connected with the deformed metal layer through the first pore.
In one embodiment, the cathode layer comprises a first cathode sub-layer and a second cathode sub-layer adjacent to the substrate, the first cathode sub-layer having a second aperture, the second cathode sub-layer being connected by the second aperture and the first aperture of the organic light emitting functional layer and the deformed metal layer.
In one embodiment, an organic light emitting display apparatus is provided, including the organic light emitting device described in any one of the embodiments above.
According to the organic light-emitting device, the manufacturing method of the organic light-emitting device and the organic light-emitting display device, the second metal layer is made of the metal material capable of shrinking under the preset treatment, so that the second metal layer can keep a larger width when the organic light-emitting device is formed into the organic light-emitting functional layer through evaporation in the manufacturing process, and the second metal layer shrinks under the preset treatment to reduce the width when the cathode layer is manufactured through deposition, so that the cathode layer can be connected with the middle metal layer and the first metal layer, the connection effect of the cathode layer, the middle metal layer and the first metal layer is good, and the contact resistance is effectively reduced.
Drawings
Fig. 1 is a flow chart illustrating a method of manufacturing an organic light emitting device in one embodiment;
fig. 2 is a schematic structural diagram of a state of a source/drain before a preset process and a state after the preset process in one embodiment;
fig. 3 is a schematic cross-sectional structure of an organic light emitting device in one embodiment;
fig. 4 is a schematic structural diagram of a state before and a state after a predetermined process of a source/drain in another embodiment;
fig. 5 is a schematic cross-sectional structure of an organic light emitting device in another embodiment;
fig. 6 is a schematic view of a directional structure of an organic light emitting device in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
It will be understood that when an element is referred to as being "mounted" to "or" disposed "on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Example 1
In this embodiment, as shown in fig. 1, there is provided a method of manufacturing an organic light emitting device, including:
in step 110, please also refer to fig. 3, a source/drain electrode 210 is formed on the insulating layer 220, wherein the source/drain electrode 210 includes a first metal layer 211 formed on the insulating layer 220, an intermediate metal layer 213 formed on the first metal layer 211, and a second metal layer 212 formed on the intermediate metal layer 213, an area of the orthographic projection of the first metal layer 211 on the insulating layer 220 and an area of the orthographic projection of the second metal layer 212 on the insulating layer 220 are larger than an area of the orthographic projection of the intermediate metal layer 213 on the insulating layer 220, and the second metal layer 212 is used for shrinking under a predetermined process.
In this embodiment, the substrate includes an insulating layer 220. In this embodiment, the source/drain electrode 210 is an SD, which may also be referred to as an SD isolation column, the source/drain electrode 210 is a column structure, the first metal layer 211 is located at the bottom layer, the middle metal layer 213 is located between the first metal layer 211 and the second metal layer 212, and the second metal layer 212 is located at the top layer.
In this embodiment, a PI (polyimide) layer and a BUFFER layer BUFFER are first formed on a glass substrate, then a polysilicon layer POLY is formed on the BUFFER layer, a gate insulating layer GI is formed on the BUFFER layer such that the gate insulating layer GI covers the polysilicon layer POLY, a gate is formed on the gate insulating layer, an insulating layer 220 is formed on the gate insulating layer, the insulating layer 220 is ILD, a first metal layer 211 is formed on the insulating layer 220, an intermediate metal layer 213 is formed on the first metal layer 211, and a second metal layer 212 is formed on the intermediate metal layer 213.
In this embodiment, as shown in fig. 2a, the width of the second metal layer 212 is larger than the width of the middle metal layer 213 when the second metal layer 212 is not subjected to the preset treatment, so that the cross section of the source/drain 210 is in an i-shaped structure. As shown in B of fig. 2, the second metal layer 212 is shrunk under a predetermined process operation such that the width of the second metal layer 212 is reduced.
In step 120, an organic light emitting functional layer 230 is formed on the source/drain electrode 210.
In this embodiment, please also refer to fig. 3, a flat layer PLN is formed on the insulating layer 220, AND patterned, then an anode layer AND is formed on the flat layer, a pixel definition layer PDL is formed on the flat layer, AND then an organic light emitting function layer 230 is formed on the anode layer AND, the pixel definition layer PDL, AND the source/drain electrode 210, such that the organic light emitting function layer 230 covers the anode layer AND, the pixel definition layer PDL, AND the second metal layer 212 of the source/drain electrode 210. In this embodiment, the organic light emitting layer 230 is an EL layer, and the organic light emitting layer 230 is formed on the source/drain electrode 210 by vapor deposition.
In step 130, please refer to fig. 3 together, the second metal layer 212 is subjected to the predetermined process to shrink the second metal layer 212, and a cathode layer 240 is formed on the organic light emitting functional layer 230, so that the cathode layer 240 is coated on the intermediate metal layer 213 and the first metal layer 211.
In this step, after the second metal layer 212 is subjected to the preset processing operation, the second metal layer 212 is shrunk, such that the width of the second metal layer 212 is smaller than or equal to the width of the intermediate metal layer 213, and then, the cathode layer 240 is fabricated on the organic light emitting functional layer 230 by adopting a deposition manner, such that the cathode layer 240 is formed on the organic light emitting functional layer 230 and is coated on the intermediate metal layer 213 and the first metal layer 211, and is exposed in the longitudinal direction due to the shrinkage of the second metal layer 212, such that the cathode layer 240 formed on the organic light emitting functional layer 230 can be formed on the intermediate metal layer 213 and is coated on the intermediate metal layer 213.
In this embodiment, the material of the first metal layer 211 is metal titanium (Ti), and the material of the intermediate metal layer 213 is metal aluminum (Al), it should be understood that the conventional SD is a Ti/Al/Ti structure, and the width of Ti on the top layer is larger, so that IZO of the cathode cannot cover the Al in the middle, and the contact resistance between IZO and Al is larger. In this embodiment, the second metal layer 212 made of a material that can shrink under a preset process is adopted, so that the second metal layer 212 can shrink when preparing the cathode layer 240, and further the cathode layer 240 can be coated on the intermediate metal layer 213 and the first metal layer 211, so as to better contact with the intermediate metal layer 213 and the first metal layer 211. In this embodiment, the cathode layer 240 includes a cathode auxiliary overlap layer IZO, and the second metal layer 212 is shrunk by a predetermined process to reduce the width, so that the cathode auxiliary overlap layer IZO fabricated on the organic light emitting functional layer 230 can be deposited on the surfaces of the intermediate metal layer 213 and the first metal layer 211, and better connected to the intermediate metal layer 213 and the first metal layer 211.
In the above embodiment, the second metal layer 212 is made of a metal material that can shrink under a preset process, so that the second metal layer 212 can maintain a larger width when the organic light emitting function layer 230 is formed by evaporation in the manufacturing process of the organic light emitting device, and the second metal layer 212 shrinks under the preset process to reduce the width when the cathode layer 240 is formed by deposition, so that the cathode layer 240 can be connected with the intermediate metal layer 213 and the first metal layer 211, so that the connection effect between the cathode layer 240 and the intermediate metal layer 213 and the first metal layer 211 is good, and the contact resistance is effectively reduced.
Example two
In one embodiment, the pre-setting process includes applying a magnetic field to the second metal layer 212, where the material of the second metal layer 212 is a metal magnetostrictive material, and the second metal layer 212 is configured to shrink under the effect of the magnetic field; the step of performing the preset treatment on the second metal layer 212 to shrink the second metal layer 212 includes: a magnetic field is applied to the second metal layer 212 to cause the second metal layer 212 to shrink.
In this embodiment, the material of the second metal layer 212 is a negative hysteresis shrinkage material, and the predetermined treatment of the second metal layer 212 is to apply a magnetic field to the second metal layer 212, that is, to apply a magnetic field to the second metal layer 212 when the cathode auxiliary lap joint layer IZO is manufactured, and since the material of the second metal layer 212 is a negative hysteresis shrinkage material, the second metal layer 212 shrinks under the action of the magnetic field, so that the width is reduced.
In one embodiment, the material of the second metal layer 212 is metallic nickel. In this embodiment, the metal nickel can shrink under the action of the magnetic field, so that the width of the top layer of the SD isolation column shrinks, which is convenient for the cathode auxiliary overlap layer IZO to deposit the intermediate metal layer 213 and the surface of the first metal layer 211.
Example III
In this embodiment, the pre-setting process includes removing the magnetic field from the second metal layer 212, where the material of the second metal layer 212 is a metal magnetostrictive material, and the second metal layer 212 is used to stretch under the action of the magnetic field; the step of fabricating the organic light emitting functional layer 230 on the source/drain electrode 210 includes: applying a magnetic field to the second metal layer 212 to stretch the second metal layer 212, and forming an organic light emitting functional layer 230 on the source/drain electrode 210; the step of performing the preset treatment on the second metal layer 212 to shrink the second metal layer 212 includes: the magnetic field applied to the second metal layer 212 when the organic light emitting functional layer 230 is fabricated is removed or reduced so that the second metal layer 212 is shrunk.
In this embodiment, the material of the second metal layer 212 is a positive hysteresis shrinkage material, the second metal layer 212 stretches and stretches under the action of the magnetic field, and the second metal layer 212 shrinks after the magnetic field is reduced or removed. In the present embodiment, in the process of fabricating the organic light emitting functional layer 230, please also combine the diagram a in fig. 2, a magnetic field is applied to the second metal layer 212 to stretch the second metal layer 212, such that the width of the second metal layer 212 is larger than that of the middle metal layer 213; as shown in fig. 2B, when the cathode auxiliary overlap layer IZO is manufactured, the magnetic field applied to the second metal layer 212 is removed or reduced, and the second metal layer 212 is contracted after losing the magnetic field effect because the material of the second metal layer 212 is a positive hysteresis contraction material, so that the width is reduced.
In one embodiment, the second metal layer 212 is made of an iron-aluminum alloy (Fe 87Al 13). In this embodiment, when the organic light emitting function layer 230 is evaporated, the iron-aluminum alloy is stretched under the action of a larger magnetic field, so that the width of the second metal layer 212 at the top of the isolation column is larger, and when the cathode auxiliary overlap layer IZO is deposited, the magnetic field is removed or reduced, so that the iron-aluminum alloy is contracted, the width is reduced, and the cathode auxiliary overlap layer IZO is convenient to deposit the intermediate metal layer 213 and the surface of the first metal layer 211.
Example IV
In this embodiment, the preset process includes reducing the temperature of the second metal layer 212, where the second metal layer 212 is configured to shrink when the temperature is reduced; the step of performing the preset treatment on the second metal layer 212 to shrink the second metal layer 212 includes: the temperature is reduced for the second metal layer 212 so that the second metal layer 212 contracts.
In this embodiment, the second metal layer 212 is made of a metal material with a higher thermal expansion coefficient, and when the organic light emitting function layer 230 is evaporated, the second metal layer 212 is heated to a higher temperature, so that the second metal layer 212 stretches in an environment with a higher temperature, so that the width of the second metal layer 212 at the top of the isolation column is larger, and when the cathode auxiliary lap layer IZO is deposited, the temperature is reduced, so that the second metal layer 212 contracts, the width is reduced, and convenience is brought to the cathode auxiliary lap layer IZO to deposit the intermediate metal layer 213 and the surface of the first metal layer 211.
In one embodiment, the material of the second metal layer 212 is chromium metal. In other embodiments, the second metal layer 212 may be made of other metal materials with a higher thermal expansion coefficient, which is not illustrated in the present embodiment.
Example five
In this embodiment, the preset treatment includes applying an electric field to the second metal layer 212, where the material of the second metal layer 212 is a metal electrostrictive material, and the second metal layer 212 is configured to contract under the action of the electric field; the step of performing the preset treatment on the second metal layer 212 to shrink the second metal layer 212 includes: an electric field is applied to the second metal layer 212 to cause the second metal layer 212 to shrink.
In this embodiment, the material of the second metal layer 212 is a metal electrostrictive material, and the second metal layer 212 contracts under the action of an electric field. When the organic light emitting function layer 230 is evaporated, an electric field is temporarily applied to the second metal layer 212, so that the width of the second metal layer 212 is larger, and when the cathode auxiliary overlap layer IZO is deposited, an electric field is temporarily applied to the second metal layer 212, so that the second metal layer 212 is contracted, the width is reduced, and the cathode auxiliary overlap layer IZO is convenient to deposit the surfaces of the intermediate metal layer 213 and the first metal layer 211.
In other embodiments, the material of the second metal layer 212 may be a memory alloy, which deforms under the action of an external force, and returns to its original shape under a certain temperature condition when the external force is removed. In this way, the memory alloy shrinks while recovering the original shape, facilitating the deposition of the cathode auxiliary overlap layer IZO on the surface of the intermediate metal layer 213 and the first metal layer 211.
Example six
In one embodiment, as shown in fig. 4 and 5, the second metal layer 212 includes a second metal layer body 212a formed on the intermediate metal layer 213 and a deformed metal layer 212b formed on the second metal layer body 212a, and the deformed metal layer 212b is used to be stretched under a predetermined process; the step of performing the preset treatment on the second metal layer 212 to shrink the second metal layer 212, and fabricating a cathode layer 240 on the organic light emitting functional layer 230 so that the cathode layer 240 is coated on the intermediate metal layer 213 and the first metal layer 211 includes: performing the predetermined process on the second metal layer 212 to stretch the deformed metal layer 212b so that the organic light emitting functional layer 230 on the deformed metal layer 212b is broken to form a gap; a cathode layer 240 is fabricated on the organic light emitting functional layer 230, such that the cathode layer 240 is coated on the intermediate metal layer 213 and the first metal layer 211, such that the cathode layer 240 is formed in the gap, and the cathode layer 240 is connected with the deformed metal layer 212b through the gap.
In this embodiment, the material of the second metal layer body 212a is metal titanium (Ti), the second metal layer body 212a is not affected by the preset process, and the deformed metal layer 212b formed on the second metal layer body 212a deforms and stretches under the preset process, so that the width is increased. In this embodiment, the material of the deformation metal layer 212b may be a hysteresis shrinkage material, a metal material with a high thermal expansion coefficient, an electrostrictive material, or a memory alloy. Specifically, when the source/drain electrode 210 is fabricated, as shown in fig. 4 a, an intermediate metal layer 213 is fabricated on the first metal layer 211, a second metal layer body 212a is fabricated on the intermediate metal layer 213, a deformed metal layer 212b is fabricated on the second metal layer body 212a, and the organic light emitting function layer 230 is fabricated on the deformed metal layer 212b, wherein, when the organic light emitting function layer 230 is evaporated, a preset process is not performed on the deformed metal layer 212b such that the deformed metal layer 212b maintains a width, and when the cathode auxiliary lap layer IZO is deposited on the organic light emitting function layer 230, a preset process is performed on the deformed metal layer 212b, including applying a magnetic field to the deformed metal layer 212b, removing or reducing the magnetic field, lowering the temperature, applying an electric field, and the like. As shown in fig. 4B, by performing the preset treatment on the deformed metal layer 212B, the deformed metal layer 212B is stretched, so that the organic light emitting functional layer 230 on the deformed metal layer 212B is broken to form a gap, in this way, in the deposition process of the cathode auxiliary lap layer IZO, the cathode auxiliary lap layer IZO can be deposited in the gap, so that the cathode auxiliary lap layer IZO can be connected with the deformed metal layer 212B, and further, the connection between the cathode auxiliary lap layer IZO and the second metal layer body 212a, the intermediate metal layer 213 and the first metal layer 211 is realized, so that the connection effect between the cathode layer 240 and the intermediate metal layer 213 and the first metal layer 211 is good, and the contact resistance is effectively reduced.
In one embodiment, the material of the second metal layer body 212a is metallic titanium; the deformed metal layer 212b is made of iron-aluminum alloy, chromium metal, and nickel metal.
In one embodiment, the material of the deformed metal layer 212b is a metal hysteresis shrink material, and the predetermined process is to apply a magnetic field, for example, the material of the deformed metal layer 212b is an iron-aluminum alloy. Thus, when the cathode auxiliary overlap layer IZO is deposited, a magnetic field is applied to the deformed metal layer 212b such that the deformed metal layer 212b is stretched such that the organic light emitting functional layer 230 located on the deformed metal layer 212b is broken, and thus the cathode auxiliary overlap layer IZO can be deposited into the gap of the organic light emitting functional layer 230 to be connected with the deformed metal layer 212 b. Thereby realizing the connection between the cathode auxiliary lap joint layer IZO and the second metal layer body 212a, the intermediate metal layer 213 and the first metal layer 211
In one embodiment, the material of the deformation metal layer 212b is a metal hysteresis shrink material, and the predetermined process is to remove the magnetic field, for example, the material of the deformation metal layer 212b is metal nickel. Thus, when the organic light emitting function layer 230 is evaporated, a magnetic field is applied to the second metal layer 212 to shrink the deformed metal layer 212b, and when the cathode auxiliary overlap layer IZO is deposited, the magnetic field applied to the deformed metal layer 212b is removed to stretch the deformed metal layer 212b, so that the organic light emitting function layer 230 on the deformed metal layer 212b is broken, and thus the cathode auxiliary overlap layer IZO can be deposited in the gap of the organic light emitting function layer 230 to be connected with the deformed metal layer 212 b.
In one embodiment, the material of the deformed metal layer 212b is a metal electrostrictive material, and the predetermined process is to apply an electric field. Thus, when the cathode auxiliary overlap layer IZO is deposited, an electric field is applied to the deformed metal layer 212b such that the deformed metal layer 212b is stretched such that the organic light emitting functional layer 230 located on the deformed metal layer 212b is broken, and thus the cathode auxiliary overlap layer IZO can be deposited into the gap of the organic light emitting functional layer 230 to be connected with the deformed metal layer 212 b.
In one embodiment, the material of the deformed metal layer 212b is a metal material with a relatively high thermal expansion coefficient, and the preset process is to heat the deformed metal layer 212 b.
Example seven
In the present embodiment, as shown in fig. 3 and 6, there is provided an organic light emitting device 20 including: the organic light emitting diode comprises a substrate, isolation columns arranged on the substrate, an organic light emitting functional layer 230 and a cathode, wherein the organic light emitting functional layer 230 and the cathode are sequentially arranged on one side, far away from the substrate, of the isolation columns; the isolation column comprises a first metal layer 211, an intermediate metal layer 213 and a second metal layer 212 which are sequentially arranged along the direction far away from the substrate, wherein the orthographic projection area of the second metal layer 212 on the substrate is larger than that of the intermediate metal layer 213 on the substrate; the organic light emitting functional layer 230 is disconnected at the position of the isolation column, and the cathode is in contact with the second metal layer 212 and the intermediate metal layer 213; the material comprising at least the second metal layer 212 is a stretchable material.
In this embodiment, the material of the second metal layer 212 is a stretchable material, so that the second metal layer 212 can shrink or stretch under a predetermined process.
In this embodiment, the second metal layer 212 is made of a metal material capable of shrinking under a preset process, so that the second metal layer 212 can maintain a larger width when the organic light emitting function layer 230 is formed by evaporation in the manufacturing process of the organic light emitting device, and the second metal layer 212 shrinks under the preset process to reduce the width when the cathode layer 240 is formed by deposition, so that the cathode layer 240 can be connected with the intermediate metal layer 213 and the first metal layer 211, so that the connection effect between the cathode layer 240 and the intermediate metal layer 213 and the first metal layer 211 is good, and the contact resistance is effectively reduced.
In one embodiment, the stretchable material comprises metallic chromium, iron-aluminum alloy, metallic nickel. It should be appreciated that the second metal layer 212 may be an electrostrictive material, or a magnetostrictive material, or a thermally expanding and cold shrinking stretchable material. This allows the second metal layer 212 to shrink when depositing the cathode, so that the cathode layer 240 can better coat the outside of the intermediate metal layer 213.
In one embodiment, as shown in fig. 4B and fig. 5, the second metal layer 212 includes a second metal layer body 212a close to the substrate and a deformed metal layer 212B far from the substrate, where the second metal layer body 212a is the same as the first metal layer 211, and the deformed metal layer is made of a stretchable material.
In this embodiment, the first metal layer 211 and the second metal layer are made of metal titanium (Ti), and the deformation metal layer may be made of hysteresis shrinkage material, metal material with high thermal expansion coefficient, electrostrictive material or memory alloy.
In one embodiment, the side of the deformed metal layer away from the substrate is sequentially provided with the organic light emitting functional layer 230 and the cathode, the organic light emitting functional layer 230 is provided with a first hole, and the cathode is connected with the deformed metal layer through the first hole.
In one embodiment, as shown in fig. 5, the second metal layer 212 includes a second metal layer body 212a formed on the intermediate metal layer 213 and a deformed metal layer 212b formed on the second metal layer body 212a, and the deformed metal layer 212b is used to be stretched under a predetermined process; the organic light emitting functional layer 230 is provided with at least one gap through which the cathode layer 240 is connected with the deformed metal layer 212 b.
In this embodiment, the organic light emitting functional layer 230 breaks to form a gap when the deformed metal layer 212b contracts under the preset process, and the formed gap is the first hole, so that the cathode auxiliary overlap layer IZO can be deposited in the first hole of the organic light emitting functional layer 230 to be connected with the deformed metal layer 212 b.
In one embodiment, the cathode layer 240 includes a first cathode sub-layer and a second cathode sub-layer adjacent to the substrate, the first cathode sub-layer having a second aperture, the second cathode sub-layer being connected by the second aperture and the first aperture of the organic light emitting functional layer 230 and the deformed metal layer.
In this embodiment, the first cathode sub-layer is formed on the organic light emitting functional layer 230, and when the deformed metal layer is contracted, the first cathode sub-layer and the organic light emitting functional layer 230 are broken at the same time, the first cathode sub-layer is broken to form a second hole, and the second hole is aligned with and mutually communicated with the first hole, so that the second cathode sub-layer is connected with the deformed metal layer through the second hole and the first hole, thereby realizing connection with the intermediate metal layer 213.
Example eight
In one embodiment, an organic light emitting display apparatus is provided, including the organic light emitting device described in any one of the embodiments above.
In the organic light emitting display device of this embodiment, the second metal layer 212 is made of a metal material capable of shrinking under a preset process, so that the second metal layer 212 can maintain a larger width when the organic light emitting functional layer 230 is formed by vapor deposition in the manufacturing process of the organic light emitting device, and the second metal layer 212 shrinks under the preset process to reduce the width when the cathode layer 240 is formed by deposition, so that the cathode layer 240 can be connected with the intermediate metal layer 213 and the first metal layer 211, so that the connection effect between the cathode layer 240 and the intermediate metal layer 213 and the first metal layer 211 is good, and the contact resistance is effectively reduced.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (13)
1. A method of manufacturing an organic light emitting device, comprising:
manufacturing a source/drain electrode on a substrate, wherein the source/drain electrode comprises a first metal layer formed on the substrate, an intermediate metal layer formed on the first metal layer and a second metal layer formed on the intermediate metal layer, the orthographic projection area of the second metal layer on the substrate is larger than the orthographic projection area of the intermediate metal layer on the substrate, and the second metal layer is used for shrinking under preset treatment;
manufacturing an organic light-emitting functional layer on the source/drain electrode;
and carrying out the preset treatment on the second metal layer to enable the second metal layer to shrink, and manufacturing a cathode layer on the organic light-emitting functional layer to enable the cathode layer to be coated on the middle metal layer and the first metal layer.
2. The method according to claim 1, wherein the pre-setting process includes applying a magnetic field to the second metal layer, the second metal layer being made of a metal magnetostrictive material, the second metal layer being configured to shrink under the effect of the magnetic field;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
a magnetic field is applied to the second metal layer to cause the second metal layer to shrink.
3. The method of manufacturing an organic light-emitting device according to claim 2, wherein the material of the second metal layer is metallic nickel.
4. The method according to claim 1, wherein the pre-setting process includes removing a magnetic field from the second metal layer, the second metal layer being made of a metal magnetostrictive material, the second metal layer being configured to stretch under the action of the magnetic field;
the step of manufacturing the organic light emitting function layer on the source/drain electrode comprises the following steps:
applying a magnetic field to the second metal layer to stretch the second metal layer, and manufacturing an organic light-emitting functional layer on the source/drain electrode;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
removing or reducing a magnetic field applied to the second metal layer when the organic light emitting functional layer is manufactured, so that the second metal layer is contracted;
the second metal layer is made of iron-aluminum alloy.
5. The method of manufacturing an organic light-emitting device according to claim 1, wherein the preset process includes lowering a temperature of the second metal layer for shrinking when the temperature is lowered;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
reducing the temperature of the second metal layer so that the second metal layer contracts;
the second metal layer is made of metal chromium.
6. The method of manufacturing an organic light-emitting device according to claim 1, wherein the pre-setting process includes applying an electric field to the second metal layer, the second metal layer being made of a metal electrostrictive material, the second metal layer being for shrinking under the effect of the electric field;
the step of performing the preset treatment on the second metal layer to shrink the second metal layer includes:
an electric field is applied to the second metal layer to cause the second metal layer to shrink.
7. The method of manufacturing an organic light-emitting device according to claim 1, wherein the second metal layer includes a second metal layer body formed on the intermediate metal layer and a deformed metal layer formed on the second metal layer body, and the deformed metal layer is for stretching under a predetermined process;
and performing the preset treatment on the second metal layer to shrink the second metal layer, and manufacturing a cathode layer on the organic light-emitting functional layer to cover the cathode layer on the intermediate metal layer and the first metal layer, wherein the step of coating the cathode layer on the first metal layer comprises the following steps:
carrying out the preset treatment on the second metal layer to enable the deformed metal layer to stretch so as to enable the organic light-emitting functional layer on the deformed metal layer to break to form a gap;
manufacturing a cathode layer on the organic light-emitting functional layer, so that the cathode layer is coated on the intermediate metal layer and the first metal layer, the cathode layer is formed in the gap, and the cathode layer passes through the gap and is connected with the deformation metal layer;
the second metal layer body is made of metal titanium; the deformation metal layer is made of iron-aluminum alloy, metal chromium and metal nickel.
8. An organic light emitting device, comprising:
the organic light-emitting diode comprises a substrate, an isolation column arranged on the substrate, an organic light-emitting functional layer and a cathode, wherein the organic light-emitting functional layer and the cathode are sequentially arranged on one side, far away from the substrate, of the isolation column;
the isolation column comprises a first metal layer, an intermediate metal layer and a second metal layer which are sequentially arranged along the direction far away from the substrate, wherein the orthographic projection area of the second metal layer on the substrate is larger than that of the intermediate metal layer on the substrate; the organic light-emitting functional layer is disconnected at the position of the isolation column, and the cathode is in contact with the second metal layer and the intermediate metal layer; the material of the second metal layer is at least an organic light-emitting function layer of a stretchable material.
9. The organic light-emitting device of claim 8, wherein the stretchable material comprises metallic chromium, iron-aluminum alloy, metallic nickel.
10. The organic light-emitting device according to claim 8, wherein the second metal layer comprises a second metal layer body close to the substrate and a deformed metal layer far from the substrate, the second metal layer body is the same as the first metal layer in material, and the deformed metal layer is made of a stretchable material.
11. The organic light-emitting device according to claim 10, wherein the deformed metal layer has the organic light-emitting functional layer and the cathode in this order on a side away from the substrate, the organic light-emitting functional layer has a first aperture, and the cathode is connected to the deformed metal layer through the first aperture.
12. The organic light-emitting device of claim 11, wherein the cathode layer comprises a first cathode sub-layer and a second cathode sub-layer adjacent to the substrate, the first cathode sub-layer having a second aperture, the second cathode sub-layer being connected by the second aperture and the first aperture of the organic light-emitting functional layer and the deformed metal layer.
13. An organic light-emitting display device comprising the organic light-emitting device according to any one of claims 8 to 12.
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| CN202310004095.3A CN116322216A (en) | 2023-01-03 | 2023-01-03 | Organic light emitting device, method of manufacturing the same, and organic light emitting display device |
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