CN116320885A - Shell vibration suppression assembly, electronic device and vibration suppression method - Google Patents
Shell vibration suppression assembly, electronic device and vibration suppression method Download PDFInfo
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- CN116320885A CN116320885A CN202111571055.4A CN202111571055A CN116320885A CN 116320885 A CN116320885 A CN 116320885A CN 202111571055 A CN202111571055 A CN 202111571055A CN 116320885 A CN116320885 A CN 116320885A
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- 230000001629 suppression Effects 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000005236 sound signal Effects 0.000 claims abstract description 69
- 238000004458 analytical method Methods 0.000 claims description 19
- 238000004364 calculation method Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
Abstract
The disclosure discloses a shell vibration suppression assembly, electronic equipment and a vibration suppression method, and belongs to the field of vibration suppression. The shell vibration suppression component is used for electronic equipment and comprises a shell and a piezoelectric module; the piezoelectric module is connected with the inner wall of the shell; the piezoelectric module is configured to acquire an audio signal and drive the housing to deform according to the audio signal so as to counteract vibration caused by playing the audio signal to the housing. The present disclosure is capable of counteracting vibrations imparted to the housing by playing an audio signal.
Description
Technical Field
The disclosure belongs to the field of vibration suppression, and in particular relates to a shell vibration suppression assembly, electronic equipment and a vibration suppression method.
Background
Electronic devices such as cell phones, tablet computers, etc. typically have sound emitting capabilities.
In the related art, an electronic device includes a housing and a speaker connected to an inner wall of the housing. The speaker emits a corresponding sound according to the received audio signal.
During sound production by the speaker, the speaker radiates sound pressure to the housing. Since the inner space of the housing is relatively closed, sound pressure cannot escape, and resonance between the housing and the speaker is easily caused.
Disclosure of Invention
In order to overcome the problems existing in the related art to a certain extent, the embodiments of the present disclosure provide a shell vibration suppression assembly, an electronic device, and a vibration suppression method, where the technical scheme is as follows:
in order to achieve the above purpose, the technical scheme adopted in the present disclosure is as follows:
according to one aspect of the present disclosure, there is provided a housing vibration suppression assembly for an electronic device, the housing vibration suppression assembly including a housing and a piezoelectric module;
the piezoelectric module is connected with the inner wall of the shell;
the piezoelectric module is configured to acquire an audio signal and drive the shell to deform according to the audio signal so as to counteract vibration caused by playing the audio signal to the shell.
In one implementation of the present disclosure, the piezoelectric module includes an application processor, an amplifying circuit, and a piezoelectric;
the input end of the application processor is used for acquiring the audio signal, and the output end of the application processor is electrically connected with the input end of the amplifying circuit;
the output end of the amplifying circuit is electrically connected with the input end of the piezoelectric element;
the piezoelectric element is connected with the inner wall of the shell.
In one implementation of the present disclosure, the housing has at least one vibration region, which is a region where the speaker causes vibration;
the piezoelectric element corresponds to the position of the vibration region on the housing.
In one implementation of the present disclosure, the vibration region is determined by:
performing calculation mode analysis or test mode analysis on the shell to obtain a vibration mode of the shell;
and determining the vibration area according to the vibration mode of the shell.
In one implementation of the present disclosure, the piezoelectric element is disposed in the vibration region by:
determining the amplitude of each of the vibration regions;
determining the vibration area with the amplitude larger than an amplitude threshold as an area to be suppressed;
and arranging the piezoelectric element in the region to be restrained.
In one implementation of the disclosure, the piezoelectric element is a sheet structure, and the piezoelectric element is attached to an inner wall of the housing.
According to another aspect of the present disclosure, there is provided an electronic device comprising a speaker and the foregoing shell vibration suppression assembly;
the speaker is connected with the inner wall of the shell vibration suppression assembly, and the speaker is electrically connected with the piezoelectric module of the shell vibration suppression assembly.
According to still another aspect of the present disclosure, there is provided a vibration suppression method, suitable for the shell vibration suppression assembly described previously, comprising:
acquiring an audio signal of the electronic equipment;
driving the piezoelectric module to vibrate according to the audio signal;
the piezoelectric module vibrates to drive the shell to deform so as to offset the vibration brought by playing the audio signal to the shell.
In one implementation of the present disclosure, driving the piezoelectric module to vibrate according to the audio signal includes:
if the audio signal comprises real-time phase information, a first suppression signal is input to a piezoelectric element of the piezoelectric module;
and if the audio signal does not comprise real-time phase information, inputting a second suppression signal to a piezoelectric element of the piezoelectric module.
In one implementation of the present disclosure, the first suppression signal is a single frequency sinusoidal signal, and the phase of the first suppression signal is opposite to the phase of the audio signal.
In one implementation of the present disclosure, the second suppression signal is a single frequency direct current signal.
The technical scheme provided by the embodiment of the disclosure has the beneficial effects that at least:
since the speaker of the electronic device generates corresponding vibrations when the electronic device plays the audio signal. Therefore, when the electronic equipment plays the audio signal, the piezoelectric module acquires the audio signal, so that the piezoelectric module can drive the shell to generate corresponding deformation according to the audio signal, and vibration brought to the shell by playing the audio signal is counteracted.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is an exploded view of an electronic device provided by an embodiment of the present disclosure;
fig. 2 is a schematic structural view of a piezoelectric module provided in an embodiment of the present disclosure;
FIG. 3 is a schematic layout of a piezoelectric element provided by an embodiment of the present disclosure;
FIG. 4 is a schematic layout of a piezoelectric element provided by an embodiment of the present disclosure;
FIG. 5 is a flow chart of a method of assembling a shell vibration suppression assembly provided by an embodiment of the present disclosure;
FIG. 6 is a flow chart of a vibration suppression method provided by an embodiment of the present disclosure;
fig. 7 is a flowchart of a vibration suppression method provided by an embodiment of the present disclosure.
The symbols in the drawings are as follows:
10. a housing;
101. a vibration region; 102. a front frame; 103. a back cover plate; 104. a rear camera hole;
20. a speaker;
30. a piezoelectric module;
301. an application processor; 302. an amplifying circuit; 303. a piezoelectric member; 304. a flexible circuit board.
Detailed Description
For the purposes of clarity, technical solutions and advantages of the present disclosure, the following further details the embodiments of the present disclosure with reference to the accompanying drawings.
Electronic devices such as cell phones, tablet computers, etc. typically have sound emitting capabilities.
In the related art, an electronic device includes a housing and a speaker connected to an inner wall of the housing. The speaker emits a corresponding sound according to the received audio signal.
During sound production by the speaker, the speaker radiates sound pressure to the housing. Since the inner space of the housing is relatively closed, sound pressure cannot escape, and resonance between the housing and the speaker is easily caused.
For example, when the electronic device is a mobile phone, for the current mainstream mobile phone, the speaker is typically a rear-sound-cavity open speaker due to the limited space within the housing. When the mobile phone is used for playing sound, the loudspeaker radiates sound pressure to the shell. Since the inner space of the housing is relatively closed, sound pressure cannot escape, and resonance between the housing and the speaker is easily caused. In this way, when the user holds the mobile phone, the user can obviously feel vibration, so that the user can misuse that a new message or a new incoming call exists. Even abnormal sound can be generated when resonance is serious.
To solve the above-mentioned technical problems, an embodiment of the present disclosure provides an electronic device, fig. 1 is an exploded view of the electronic device, and referring to fig. 1, the electronic device includes a speaker 20 and a shell vibration suppression assembly. The speaker 20 is connected to an inner wall of the shell vibration suppressing member, and the speaker 20 is electrically connected to the shell vibration suppressing member.
When the speaker 20 is in operation, vibrations of the electronic device caused by the speaker 20 can be canceled by the shell vibration suppression assembly.
It can be seen that the shell vibration suppression assembly is a key component for suppressing self vibration of the electronic device, and is described below.
With continued reference to fig. 1, the housing vibration suppression assembly includes a housing 10 and a piezoelectric module 30. The piezoelectric module 30 is connected to the inner wall of the housing 10. When the shell vibration suppression assembly is applied to an electronic device, the speaker 20 is connected to the inner wall of the housing 10, and the speaker 20 is electrically connected to the piezoelectric module 30.
The piezoelectric module 30 is configured to acquire an audio signal and drive the housing 10 to deform according to the audio signal so as to cancel vibration caused by playing the audio signal to the housing 10.
Since the electronic device generates corresponding vibrations when playing audio signals, the speaker 20 of the electronic device. Therefore, when the electronic device plays the audio signal, the piezoelectric module 30 obtains the audio signal, so that the piezoelectric module 30 can drive the housing 10 to generate corresponding deformation according to the audio signal, thereby counteracting the vibration caused by playing the audio signal to the housing 10.
From the foregoing, it can be seen that the piezoelectric module 30 plays a key role in canceling vibrations of the housing 10 caused by the speaker 20. The piezoelectric module 30 is described below.
Fig. 2 is a schematic structural diagram of the piezoelectric module 30, and in this embodiment, the piezoelectric module 30 includes an application processor 301, an amplifying circuit 302, and a piezoelectric element 303.
The input end of the application processor 301 is used for acquiring an audio signal, the output end of the application processor 301 is electrically connected with the input end of the amplifying circuit 302, and the output end of the amplifying circuit 302 is electrically connected with the input end of the piezoelectric element 303.
Fig. 3 is a schematic layout view of the piezoelectric element 303, and in combination with fig. 3, in this embodiment, the piezoelectric element 303 is connected to the inner wall of the housing 10.
Optionally, the application processor 301 and the amplifying circuit 302 are integrally mounted on the motherboard, so that the integration of the piezoelectric module 30 is improved, and thus, the shell vibration suppression component is advantageously applied to electronic devices with smaller internal space of the housing 10, such as a mobile phone. In addition, the piezoelectric element 303 is electrically connected to the main board through a flexible circuit board 304 (Flexible Printed Circuit, FPC).
In the present embodiment, there are two kinds of electric signals output from the application processor 301 to the amplifying circuit 302 based on the audio signal. The first electrical signal is a first suppression signal and the second electrical signal is a second suppression signal.
For the first suppression signal, the first suppression signal is a single-frequency sinusoidal signal, and the phase of the first suppression signal is opposite to the phase of the audio signal. In this way, the piezoelectric element 303 drives the housing 10 to vibrate, and the vibration is opposite to the vibration of the housing 10 caused by the speaker 20, so as to cancel the vibration of the housing 10 caused by the speaker 20.
For the second suppression signal, the second suppression signal is a single-frequency direct current signal. In this way, the piezoelectric element 303 can drive the housing 10 to bend slightly inwards all the time by the second suppression signal, i.e. the housing 10 is straightened inwards, so as to counteract the vibration of the housing 10 caused by the speaker 20.
As can be seen, the piezoelectric module 30 outputs the first suppression signal or the second suppression signal to the piezoelectric element 303 through the amplifying circuit 302, so that the piezoelectric element 303 drives the housing 10 to generate two different deformation forms, and the vibration of the housing 10 caused by the speaker 20 can be counteracted.
Since the vibration of the speaker 20 caused on the housing 10 does not necessarily have to be the entire housing 10, in order to accurately cancel the vibration of the speaker 20 caused on the housing 10, the piezoelectric member 303 needs to be provided in the region where the vibration exists on the housing 10.
With continued reference to fig. 3, in the present embodiment, the housing 10 has at least one vibration region 101, the vibration region 101 being a region in which the speaker 20 causes vibration, and the piezoelectric member 303 corresponds to the position of the vibration region 101 on the housing 10.
In the above implementation, the piezoelectric element 303 is positioned in such a manner as to ensure that the vibration caused by the piezoelectric element 303 can be accurately offset from the vibration caused by the speaker 20. The vibration caused by the speaker 20 can be eliminated accurately, and the vibration of the housing 10 caused by the excessive vibration caused by the piezoelectric member 303 can be avoided.
In the present embodiment, the vibration region 101 is determined in the following manner.
First, a calculation mode analysis or a test mode analysis is performed on the housing 10 to obtain a vibration mode of the housing 10.
In the above-described implementation, the vibration mode of the housing 10 can be obtained by both the calculation mode analysis and the test mode analysis. Computing modal analysis refers to modal analysis using finite element simulation calculations. The test modal analysis refers to carrying out modal analysis in such a way that acquired parameters are subjected to parameter identification through a test, so as to obtain modal parameters.
The structure of the housing 10 needs to be fully considered in the calculation mode analysis and the test mode analysis. In this embodiment, referring to fig. 1, the housing 10 includes a front frame 102 and a rear cover 103, the front frame 102 corresponds to a display panel, the rear cover 103 corresponds to a battery, and the rear cover has a rear camera hole 104, and the rear cover 103 is connected to the front frame 102. The piezoelectric element 303 is attached to the back plate 103 and sandwiched between the battery and the back plate 103.
In the calculation mode analysis and the test mode analysis, it is necessary to combine the dimensions of the front frame 102, the rear cover 103, and the rear camera hole 104 of the housing 10, and the materials, connection manners, and the like of the front frame 102 and the rear cover 103.
Then, the vibration region 101 is determined according to the vibration mode of the housing 10, and the vibration region 101 is a region in which the speaker 20 causes vibration.
In the above-described implementation, the vibration region 101 can be obtained in analysis software by calculation modal analysis or test modal analysis. The analysis software is software capable of performing vibration mode analysis, such as ANSYS and the like.
In the simulation experiment, it is found that there may be a plurality of vibration areas 101 on the housing 10, and in order to further improve the vibration suppressing effect on the housing 10, the correspondence between the piezoelectric element 303 and the vibration areas 101 is designed in the embodiment of the present application.
Fig. 4 is a schematic layout view of the piezoelectric element 303, and fig. 4 differs from fig. 3 in that a plurality of vibration regions 101 exist in fig. 4. Referring to fig. 4, in the present embodiment, each vibration region 101 has one piezoelectric element 303, and the piezoelectric elements 303 are spaced apart from each other. The vibration in the vibration regions 101 corresponding to the piezoelectric elements 303 are canceled, and the vibration suppressing effect on the housing 10 is further improved.
It is easy to understand that, since the internal space of the case 10 is limited, if a large number of piezoelectric elements 303 are provided, a large amount of space may be occupied in the case 10. Therefore, the number of the vibration regions 101 and the number of the piezoelectric members 303 can be adjusted according to actual demands, which is not limited by the present disclosure.
That is, in the present embodiment, the piezoelectric member 303 is required to be provided in part of the vibration region 101, and the piezoelectric member 303 is not required to be provided in part of the vibration region 101. Then, the piezoelectric element 303 is disposed in the vibration region 101 in the following manner.
First, the amplitude of each vibration region 101 is determined, the amplitude being able to be obtained by the vibration mode.
Next, the vibration region 101 having an amplitude greater than the amplitude threshold is determined as the region to be suppressed.
In the above-described implementation, the vibration region 101 is screened by the amplitude threshold, and the vibration region 101 having an amplitude greater than the amplitude threshold is determined as the region to be suppressed, that is, the region to be suppressed is the region in which vibration suppression by the piezoelectric element 303 is required. If the amplitude of the vibration region 101 is not greater than the amplitude threshold value, it is indicated that the amplitude of the vibration region 101 is small, and vibration suppression by the piezoelectric element 303 is not required. In this way, the vibration suppressing effect can be ensured, and the excessive piezoelectric members 303 are prevented from occupying the internal space of the housing 10.
The amplitude threshold value is an artificial set value, which can be adjusted according to the need, and the present disclosure is not limited thereto.
Finally, the piezoelectric element 303 is disposed in the region to be suppressed.
With the case vibration suppressing assembly assembled by the assembly method provided by the embodiment of the present disclosure, the speaker 20 sounds after receiving the input audio signal, and the vibration region 101 is formed on the case 10. Wherein at least part of the vibration region 101 is a region to be suppressed. Meanwhile, the input terminal of the application processor 301 receives the audio signal, and outputs a corresponding electrical signal to the amplifying circuit 302 according to the audio signal. After being amplified by the amplifying circuit 302, the signal is output to the piezoelectric element 303, so that the piezoelectric element 303 is deformed. Since the piezoelectric element 303 is located in the region to be suppressed, the housing 10 in the region to be suppressed can be driven to deform, thereby canceling the vibration caused by the speaker 20.
Also, since it is ensured that the piezoelectric members 303 are all disposed in the region to be suppressed, the vibration caused by the piezoelectric members 303 is ensured, and the vibration caused by the speaker 20 can be accurately canceled. The vibration caused by the loudspeaker 20 can be eliminated accurately, and the vibration of the casing 10 caused by the redundant vibration caused by the piezoelectric element 303 can be avoided.
In the above manner of determining the region to be suppressed, it is ensured that the vibration region 101 having the largest amplitude is determined as the region to be suppressed, and the vibration region 101 having the largest amplitude is the largest in negative feeling to the user. By providing the piezoelectric material 303 in the vibration region 101 having the largest amplitude, the vibration of the entire housing 10 can be reduced most effectively.
Alternatively, the piezoelectric element 303 is a sheet-like structure, and the piezoelectric element 303 is attached to the inner wall of the housing 10.
In the above implementation manner, the piezoelectric element 303 is a piezoelectric sheet, and the piezoelectric element 303 can increase the contact area with the housing 10 by using its own shape, so as to be more beneficial to driving the housing 10 to deform. In addition, the internal space of the case 10 occupied by the piezoelectric element 303 can be effectively reduced.
Illustratively, the piezoelectric element 303 is connected to the inner wall of the housing 10 by bonding, so that not only can the close contact between the piezoelectric element 303 and the inner wall of the housing 10 be ensured, but also the installation space required for the piezoelectric element 303 can be further reduced.
Fig. 5 is a flow chart of a method of assembling a shell vibration suppression assembly according to an embodiment of the present disclosure, the method of assembling being applicable to the shell vibration suppression assembly shown in fig. 1-4. Referring to fig. 5, the assembly method includes:
step 501: the vibration region 101 of the housing 10 is determined, and the vibration region 101 is a region where the speaker 20 causes vibration.
Step 502: the piezoelectric element 303 of the piezoelectric module 30 is disposed in the vibration region 101.
The manner of determining the vibration area 101 and the manner of setting the piezoelectric element 303 are the same as those described above, and will not be described here.
The position of the piezoelectric element 303 is set in this way, so that the vibration caused by the piezoelectric element 303 is ensured, and the vibration caused by the loudspeaker 20 can be accurately offset. The vibration caused by the loudspeaker 20 can be eliminated accurately, and the vibration of the casing 10 caused by the redundant vibration caused by the piezoelectric element 303 can be avoided.
Fig. 6 is a flowchart of a vibration suppression method provided by an embodiment of the present disclosure, which is applicable to the shell vibration suppression assembly shown in fig. 1-4. Referring to fig. 6, the vibration suppressing method includes:
step 601: an audio signal of the electronic device is acquired.
Step 602: the piezoelectric module is driven to vibrate according to the audio signal.
Step 603: the vibrating piezoelectric module drives the housing 10 to deform so as to counteract the vibration caused by playing the audio signal to the housing 10.
Since the electronic device generates corresponding vibrations when playing audio signals, the speaker 20 of the electronic device. Therefore, when the electronic device plays the audio signal, the piezoelectric module 30 obtains the audio signal, so that the piezoelectric module 30 can drive the housing 10 to generate corresponding deformation according to the audio signal, thereby counteracting the vibration caused by playing the audio signal to the housing 10.
Fig. 7 is a flowchart of a vibration suppression method provided by an embodiment of the present disclosure, which is applicable to the shell vibration suppression assembly shown in fig. 1-4. Referring to fig. 7, the vibration suppressing method includes:
step 701: an audio signal of the electronic device, which is an audio signal input to the speaker 20, is acquired.
After step 701, the housing 10 is deformed according to the audio signal to cancel the vibration of the housing 10 caused by the speaker 20, which is respectively step 702 and step 703.
Step 702: if the audio signal includes real-time phase information, a first suppression signal is input to the piezoelectric element 303 of the piezoelectric module 30, the first suppression signal is a single-frequency sinusoidal signal, and the phase of the first suppression signal is opposite to the phase of the audio signal. The real-time phase information is used to reflect the real-time phase of the audio signal, which corresponds to the phase of the vibrations of the housing 10 caused by the loudspeaker 20.
In the above implementation, the piezoelectric element 303 will drive the housing 10 to vibrate, and the vibration is opposite to the vibration of the housing 10 caused by the speaker 20, so that the vibration of the housing 10 caused by the speaker 20 can be counteracted.
Step 703: if the audio signal does not include real-time phase information, a second suppression signal is input to the piezoelectric element 303 of the piezoelectric module 30, and the second suppression signal is a single-frequency direct current signal.
In the above implementation, the piezoelectric element 303 can be caused to drive the housing 10 to bend slightly inward all the time by the second suppression signal, that is, the housing 10 is always straightened inward, so as to cancel the vibration of the housing 10 caused by the speaker 20.
It can be seen that the first suppression signal and the second suppression signal are determined according to whether the real-time phase information is included in the audio signal. If the audio signal includes real-time phase information, a corresponding first suppression signal with opposite phase can be sent to the piezoelectric element 303. If the audio signal does not include real-time phase information, the second suppression signal is directly transmitted, so that the effect of suppressing vibration can be achieved no matter what phase information the audio signal includes, and implementation is easier.
The foregoing description of the preferred embodiments of the present disclosure is provided for the purpose of illustration only, and is not intended to limit the disclosure to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, alternatives, and alternatives falling within the spirit and principles of the disclosure.
Claims (11)
1. A shell vibration suppression assembly for an electronic device, characterized by comprising a housing (10) and a piezoelectric module (30);
the piezoelectric module (30) is connected with the inner wall of the shell (10);
the piezoelectric module (30) is configured to acquire an audio signal and to drive the housing (10) to deform in response to the audio signal to counteract vibrations imparted to the housing (10) by playing the audio signal.
2. The shell vibration suppression assembly according to claim 1, wherein the piezoelectric module (30) comprises an application processor (301), an amplifying circuit (302) and a piezoelectric element (303);
the input end of the application processor (301) is used for acquiring the audio signal, and the output end of the application processor (301) is electrically connected with the input end of the amplifying circuit (302);
the output end of the amplifying circuit (302) is electrically connected with the input end of the piezoelectric element (303);
the piezoelectric element (303) is connected to the inner wall of the housing (10).
3. The shell vibration suppression assembly according to claim 2, characterized in that the housing (10) has at least one vibration area (101), the vibration area (101) being the area where the loudspeaker (20) causes vibrations;
the piezoelectric element (303) corresponds to the position of the vibration region (101) on the housing (10).
4. A shell vibration suppression assembly according to claim 3, characterized in that the vibration area (101) is determined by:
performing a calculation mode analysis or a test mode analysis on the shell (10) to obtain a vibration mode of the shell (10);
the vibration region (101) is determined according to a vibration mode of the housing (10).
5. A shell vibration suppression assembly according to claim 3, characterized in that the piezoelectric element (303) is arranged in the vibration region (101) by:
determining the amplitude of each of said vibration areas (101);
-determining the vibration region (101) with an amplitude greater than an amplitude threshold as a region to be suppressed;
the piezoelectric element (303) is arranged in the region to be suppressed.
6. The shell vibration suppression assembly according to claim 2, wherein the piezoelectric member (303) is a sheet-like structure, the piezoelectric member (303) being bonded to an inner wall of the housing (10).
7. An electronic device comprising a loudspeaker (20) and a shell vibration suppression assembly according to any one of claims 1-6;
the speaker (20) is connected to an inner wall of a housing (10) of the shell vibration suppression assembly, and the speaker (20) is electrically connected to a piezoelectric module (30) of the shell vibration suppression assembly.
8. A vibration suppression method, adapted for use in the shell vibration suppression assembly of any one of claims 1-6, comprising:
acquiring an audio signal of the electronic equipment;
driving the piezoelectric module to vibrate according to the audio signal;
the vibrating piezoelectric module drives the shell (10) to deform so as to counteract the vibration brought by playing the audio signal to the shell (10).
9. The vibration suppression method according to claim 8, characterized in that driving the piezoelectric module to vibrate according to the audio signal includes:
if the audio signal comprises real-time phase information, inputting a first suppression signal to a piezoelectric element (303) of the piezoelectric module (30);
if the audio signal does not include real-time phase information, a second suppression signal is input to a piezoelectric element (303) of the piezoelectric module (30).
10. The vibration suppression method according to claim 9, characterized in that the first suppression signal is a single-frequency sinusoidal signal, and the phase of the first suppression signal is opposite to the phase of the audio signal.
11. The vibration suppression method according to claim 9, characterized in that the second suppression signal is a single frequency direct current signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111571055.4A CN116320885A (en) | 2021-12-21 | 2021-12-21 | Shell vibration suppression assembly, electronic device and vibration suppression method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111571055.4A CN116320885A (en) | 2021-12-21 | 2021-12-21 | Shell vibration suppression assembly, electronic device and vibration suppression method |
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| CN116320885A true CN116320885A (en) | 2023-06-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116634052A (en) * | 2023-07-26 | 2023-08-22 | 荣耀终端有限公司 | Parameter determination method and electronic equipment |
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2021
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116634052A (en) * | 2023-07-26 | 2023-08-22 | 荣耀终端有限公司 | Parameter determination method and electronic equipment |
| CN116634052B (en) * | 2023-07-26 | 2023-10-20 | 荣耀终端有限公司 | Parameter determination method and electronic equipment |
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