CN116315969A - Manufacturing process of liquid cooling data line connector and connector - Google Patents

Manufacturing process of liquid cooling data line connector and connector Download PDF

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Publication number
CN116315969A
CN116315969A CN202310296392.XA CN202310296392A CN116315969A CN 116315969 A CN116315969 A CN 116315969A CN 202310296392 A CN202310296392 A CN 202310296392A CN 116315969 A CN116315969 A CN 116315969A
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CN
China
Prior art keywords
circuit board
shell
data line
sealing
flowing medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310296392.XA
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Chinese (zh)
Inventor
易水波
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Dongguan Xinlewei Electronic Technology Co ltd
Original Assignee
Dongguan Xinlewei Electronic Technology Co ltd
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Publication date
Application filed by Dongguan Xinlewei Electronic Technology Co ltd filed Critical Dongguan Xinlewei Electronic Technology Co ltd
Priority to CN202310296392.XA priority Critical patent/CN116315969A/en
Publication of CN116315969A publication Critical patent/CN116315969A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/005—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The invention relates to the technical field of data wires, in particular to a liquid cooling data wire connector manufacturing process and a connector, wherein the liquid cooling data wire connector manufacturing process comprises the following steps: providing a shell with at least one cavity and a circuit board with terminals connected to two ends; storing the circuit board and the flowing medium in the same or different chambers; the molded outer seal structure encloses the circuit board and the flowing medium within the housing. The problem of current data line form one, the aesthetic property is poor is solved.

Description

Manufacturing process of liquid cooling data line connector and connector
[ field of technology ]
The invention relates to the technical field of data lines, in particular to a manufacturing process of a liquid cooling data line connector and the connector.
[ background Art ]
With the progress of intelligent science and technology, the data line is generally applied to people's daily life, and along with the stability of data line technique, people's requirement to data line outward appearance is gradually improved. The existing data wire shell is usually shading, the change of the appearance of the data wire can only add patterns on the outer surface of the shell, the form is single, and the pursuit of increasing the appearance of the data wire by people cannot be met. Therefore, there is a need to provide a data line with better visual impact and better aesthetic property, so as to solve the problems of the first form and the poor aesthetic property of the existing data line.
[ invention ]
The invention provides a manufacturing process of a liquid cooling data line connector and the connector, which are used for solving the problems of first form and poor attractiveness of the existing data line.
The invention provides a manufacturing process of a liquid cooling data line connector, which comprises the following steps:
providing a shell with at least one cavity and a circuit board with terminals connected to two ends;
storing the circuit board and the flowing medium in the same or different chambers;
the molded outer seal structure encloses the circuit board and the flowing medium within the housing.
Preferably, the housing is a single layer housing, the chamber first chamber; the assembly circuit board and the flowing medium comprise the following steps:
forming sealing pieces at two ends of the circuit board, wherein filling openings are formed in the sealing pieces;
loading a circuit board into the first chamber;
filling a flowing medium into the first chamber through the filling port;
the fill port is sealed using a seal.
Preferably, the shell is a double-layer shell, the double-layer shell is a coaxial shell, the inner layer of the double-layer shell is a first cavity, and the interlayer of the double-layer shell is a second cavity; the casing is provided with a filling port communicated with the second cavity, and the assembly circuit board and the flowing medium comprise the following steps:
filling the flowing medium into the second chamber through the filling port;
sealing the fill port with a seal;
forming a sealing piece at one end of the circuit board;
the circuit board is loaded into the first chamber and the other end closure is molded.
Preferably, the flowing medium filled in the first chamber is an insulating medium.
Preferably, a sealing groove is formed in the sealing piece, a sealing ring is sleeved on the sealing groove, and after the circuit board is installed in the shell, the sealing ring abuts against the inner wall of the shell.
Preferably, the seal is sized larger than the fill port, and the seal is interference fit with the fill port.
Preferably, the sealing structure is over-molded onto the closure.
Preferably, the flow medium is a thermally conductive flow medium comprising liquid and/or solid particles.
Preferably, the housing is made of transparent material.
The invention further provides a liquid cooling data line connector, which is manufactured by adopting the manufacturing process of the liquid cooling data line connector.
Compared with the prior art, the manufacturing process of the liquid cooling data line connector and the connector have the following advantages:
1. the embodiment of the invention provides a manufacturing process of a liquid cooling data line connector, which comprises the following steps:
providing a shell with at least one cavity and a circuit board with terminals connected to two ends;
storing the circuit board and the flowing medium in the same or different chambers;
the molded outer seal structure encloses the circuit board and the flowing medium within the housing.
By sealing the flowing medium in the cavity through the steps, when the data is used, the flowing medium flows in the cavity to give a dynamic visual look and feel to a user, so that the data line has more attractive appearance.
2. According to the manufacturing process of the liquid cooling data line connector, the shell is a single-layer shell, and the cavity is a first cavity; the assembly circuit board and the flowing medium comprise the following steps:
forming sealing pieces at two ends of the circuit board, wherein filling openings are formed in the sealing pieces;
loading a circuit board into the first chamber;
filling a flowing medium into the first chamber through the filling port;
the fill port is sealed using a seal.
The sealing pieces at the two ends of the circuit board are enclosed with the shell to form a cavity and wrap the circuit board in the cavity, and the flowing medium is filled in the cavity to be in contact with the circuit board, so that heat generated during the working of the circuit board can be taken away rapidly.
3. According to the manufacturing process of the liquid cooling data line connector, the shell is a double-layer shell, the double-layer shell is a coaxial shell, the inner layer of the double-layer shell is a first cavity, and the interlayer of the double-layer shell is a second cavity; the casing is offered the filling mouth of intercommunication second cavity, and assembly circuit board and flowing medium include following step:
filling the flowing medium into the second chamber through the filling port;
sealing the fill port with a seal;
forming a sealing piece at one end of the circuit board;
the circuit board is loaded into the first chamber and the other end closure is molded.
The flowing medium filled in the second cavity is not directly contacted with the circuit board, and has no insulation limit, so that the flowing medium is more diversified.
4. According to the manufacturing process of the liquid-cooled data line connector, the flowing medium filled in the first cavity is an insulating medium. The insulating flowing medium can avoid short circuit of electronic elements on the circuit board when the flowing medium is contacted with the circuit board, and further damage to the data wires.
5. According to the manufacturing process of the liquid cooling data line connector provided by the embodiment of the invention, the sealing piece is provided with the sealing groove, the sealing groove is sleeved with the sealing ring, and after the circuit board is arranged in the shell, the sealing ring is abutted against the inner wall of the shell. The sealing piece is matched with the sealing ring, so that the two axial ends of the shell are completely sealed, and flowing medium is prevented from flowing out of the shell from the sealing piece when the flowing medium is filled.
6. According to the manufacturing process of the liquid cooling data line connector, the size of the sealing element is larger than that of the filling port, and the sealing element is in interference fit with the filling port. The sealing element in engagement with the filling opening provides a seal so that the flowing medium does not flow out of the filling opening.
7. According to the manufacturing process of the liquid cooling data line connector, the sealing structure is covered and formed on the sealing piece. The sealing piece is covered with a formed sealing structure, so that the cavity can be secondarily sealed, and flowing medium is prevented from flowing out of the shell.
8. According to the manufacturing process of the liquid-cooled data line connector, the flowing medium is a heat-conducting flowing medium, and the heat-conducting flowing medium comprises liquid and/or solid particles. When the circuit board works to generate heat, the heat conduction flowing medium can quickly transfer the heat to the outside of the shell to cool the circuit board; the variety of flowing medium states can provide a richer, more level of visual perception.
9. According to the manufacturing process of the liquid cooling data line connector provided by the embodiment of the invention, the shell is made of transparent materials. The transparent housing allows the user to visually see the flow of the flowing medium within the housing, giving the user visual impact.
10. The embodiment of the invention also provides a liquid cooling data line connector, which is manufactured by adopting the manufacturing process of the liquid cooling data line connector, and has the same beneficial effects as the manufacturing process, and the details are not repeated here.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of a manufacturing process of a liquid-cooled data line connector according to a first embodiment of the present invention.
Fig. 2 is a dielectric fill flow diagram of a single layer housing connector provided in accordance with a first embodiment of the present invention.
Fig. 3 is a schematic structural view of a single-layer housing connector according to a first embodiment of the present invention.
Fig. 4 is a dielectric filling flow chart of a double-shell connector according to a first embodiment of the present invention.
Fig. 5 is a schematic structural view of a double-shell connector according to a first embodiment of the present invention.
The attached drawings are used for identifying and describing:
1. a circuit board; 2. a sealing member; 3. a housing; 4. a sealing structure;
21. sealing grooves; 22 sealing rings; 23. a front end seal; 24. a rear end closure;
241. a seal; 242. and filling the mouth.
[ detailed description ] of the invention
For the purpose of making the technical solution and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and examples of implementation. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a, from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may also determine B from a and/or other information.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art will also appreciate that the embodiments described in the specification are alternative embodiments and that the acts and modules referred to are not necessarily required for the present invention.
In various embodiments of the present invention, it should be understood that the sequence numbers of the foregoing processes do not imply that the execution sequences of the processes should be determined by the functions and internal logic of the processes, and should not be construed as limiting the implementation of the embodiments of the present invention.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Referring to fig. 1 and 3, a first embodiment of the present invention provides a manufacturing process of a liquid-cooled data line connector, which includes the following steps:
s1: providing a shell with at least one cavity and a circuit board with terminals connected to two ends;
s2: storing the circuit board and the flowing medium in the same or different chambers;
s3: the molded outer seal structure encloses the circuit board and the flowing medium within the housing.
It should be noted that, the housing with the cavity provided in step S1 includes, but is not limited to, a connector, a connection terminal, a housing 3 of a digital display or a middle-grade wire divider, and may be specifically designed according to an actual product structure, where a receiving space is provided in the housing 3 and two ends of the housing are open in an axial direction, and the circuit board 1 is mounted in the space in the housing 3 from the opening.
It should be understood that the sealing members 2 at the two ends of the circuit board 1 and the housing 3 can enclose to form a cavity, and the rest positions of the cavity except for a filling port 242 for filling the flowing medium are completely sealed, and the flowing medium with rated capacity is filled into the cavity by using the cavity opening, and it should be understood that the flowing medium does not completely fill the whole cavity, so that the flowing medium can flow in the cavity; after filling the flowing medium, the opening of the cavity is required to be completely sealed, so that the flowing medium is prevented from flowing out of the cavity from the opening.
It should be noted that the color of the housing 3 is not limited to one or more of red, yellow, green, blue, purple, pink, and gold, and may be an gradual color change or a fluorescent color; the material of the housing 3 may be acrylic, polyvinyl chloride, resin, glass, or the like. It should be understood that the specific colors and types of materials mentioned above are only one possible example, and the specific embodiments are not limited thereto.
Referring to fig. 2 and 3, the housing 3 is a single-layer housing 3, and a chamber is a first chamber; the assembly of the circuit board 1 and the flowing medium comprises the steps of:
s a21: forming sealing pieces at two ends of the circuit board, wherein filling openings are formed in the sealing pieces;
s a22: loading a circuit board into the first chamber;
s a23: filling a flowing medium into the first chamber through the filling port;
s a24: the fill port is sealed using a seal.
It will be appreciated that when the housing 3 is a single-layer housing, the housing itself encloses a space of only one place, i.e. only the first chamber, which accommodates both the circuit board 1 and the filling flow medium. It should be understood that the shell layer, which is in contact with both the flowing medium and the outside, should have a certain transparency so that the user can see the flow path of the flowing medium.
In step S a, the sealing members 2 at the two ends of the circuit board 1 are integrally formed with the circuit board 1, and the data line bodies are connected to the two ends of the circuit board 1 in advance. The single-layer housing needs to rely on the sealing members 2 at both ends of the circuit board 1 to seal the openings at both axial ends of the housing 3 so as to form a chamber that can be filled with flowing medium, and the sealing members 2 seal the openings of the housing 3 and simultaneously seal the circuit board 1 in the chamber. At this time, the flowing medium filled in the cavity can directly contact the circuit board 1, and heat generated during the operation of the electronic components on the circuit board 1 is rapidly taken away during the flowing, so as to achieve the effect of heat dissipation and cooling. Since the flowing medium directly contacts the circuit board 1, in order to avoid the flowing medium from causing short circuit of electronic components on the circuit board 1, the flowing medium filled in the cavity of the single-layer housing needs to be an insulating medium.
The filling port 242 may be provided in the sealing member 2 at one or both ends, and may be specifically set according to the actual situation. If both end caps 2 are provided with the filling port 242, one of the filling ports 242 needs to be sealed in advance when filling the flowing medium. The sealing member 2 in this embodiment specifically includes a front end sealing member 23 and a rear end sealing member 24, where the rear end sealing member 24 is provided with a filling port 242 communicating with the cavity, and the sealing member 241 and the filling port 242 are in interference fit to seal the cavity.
It will be appreciated that the closure 2 encloses a closed chamber with the housing, wherein the rear end closure 24 is provided with a filling port 242 for communicating the chamber with the environment for filling the chamber with a flow medium. The closure 2 further comprises a sealing element 241 for sealing the filling opening 242 after filling of the flowing medium. It will be appreciated that the chamber defined by closure 2 and the housing, except for fill port 242, is completely sealed to prevent flow medium from flowing out of the other locations during filling, reducing filling efficiency.
Further, a sealing groove 21 is provided on the sealing member 2, a sealing ring 22 is sleeved on the sealing groove 21, and after the circuit board 1 is installed in the housing 3, the sealing ring 22 abuts against the inner wall of the housing 3.
It will be appreciated that there is a high requirement for sealing the chamber in order to avoid losses caused by flowing medium out of the chamber. The sealing piece 2 is provided with the sealing groove 21 matched with the sealing ring 22 to limit the sealing ring, so that the sealing effect of the sealing piece 2 is prevented from being lost due to the fact that the position of the sealing ring 22 is changed and separated from the sealing piece due to resistance in the assembly process or collision in the use process; the sealing ring 22 is sleeved in the sealing groove 21 and is in interference fit with the sealing groove 21, and the sealing ring 22 is in interference fit with the shell 3, so that the opening at the two axial ends of the shell 3 can be completely sealed by the sealing piece 2, and flowing media filled in the cavity are ensured not to flow out from the opening.
In one possible embodiment, seal grooves are also formed at two ends of the inner wall of the shell, which are abutted against the seal rings 22, and when the connector is assembled, the seal grooves 21 on the seal members 2 at two ends of the circuit board 1 are sleeved with the seal rings 22, and then the circuit board 1 is installed into the shell from an opening at one end of the shell 3 until the seal rings 22 on the seal members 2 at two ends are matched with the seal grooves 21 at two ends of the shell 3, so that the circuit board 1 is limited, and the circuit board 1 can be accurately arranged in a cavity of the shell 3.
In a further possible embodiment, the sealing groove 21 is not provided on the closure 2, but the sealing ring 22 is formed directly in the corresponding position. The sealing ring 22 and the sealing piece 2 are integrally formed, so that a better sealing effect can be achieved, and the situation that the sealing effect is lost or the matching error is reduced due to collision of the sealing ring 22 and the sealing piece 2 in the assembly or use process is avoided.
Further, the flowing medium filled in the first chamber is an insulating medium.
It will be appreciated that the circuit board 1 is disposed in the first chamber, and when the flowing medium fills the first chamber, the circuit board 1 will be in direct contact with the flowing medium, and in order to avoid the flowing medium from causing short circuit of electronic components on the circuit board 1, the flowing medium filled in the first chamber needs to be an insulating medium, which is not limited to an insulating material such as grease liquid or heat-conducting silica gel particles.
Further, the shell 3 is a double-layer shell 3, the double-layer shell 3 is a coaxial shell 3, the inner layer of the double-layer shell 3 is a first cavity, and the interlayer of the double-layer shell 3 is a second cavity; the casing 3 is provided with a filling port communicated with the second cavity, and the assembly circuit board 1 and the flowing medium comprise the following steps:
s b 21: filling the flowing medium into the second chamber through the filling port;
s b 22: sealing the fill port with a seal;
s b 23: forming a sealing piece at one end of the circuit board;
s b 24: the circuit board is loaded into the first chamber and the other end closure is molded.
In step S b, the second chamber is an interlayer of the double-layer casing 3, one end of the interlayer is open at both axial ends, the other end is in a sealed state, the open end is a filling port of the second chamber, the flowing medium is filled into the interlayer from the open end, and the opening of the interlayer is sealed by the sealing member 241 after the filling amount of the flowing medium reaches the rated value.
The inner layer of the housing 3 further has a receiving space with two open ends in the axial direction for placing the circuit board 1. The front end sealing piece 23 is formed at one end of the circuit board 1, the maximum projection area of the front end sealing piece 23 is equal to the maximum projection area of the shell 3 in the axial direction, one end of the circuit board 1, which is not provided with the sealing piece 2, is arranged in the shell 3 until the front end sealing piece 23 abuts against the shell 3, and then the rear end sealing piece 24 is formed at the other end of the circuit board 1 to fixedly seal the circuit board 1 in the shell 3.
It will be appreciated that the double-layered shell is essentially formed by two concentric single-layered shells of different sizes nested with an interlayer gap between the layers, the interlayer gap forming a second chamber that can be filled with a flowable medium. The double-layer shell can be filled with flowing media with the same or different colors and materials in the first cavity and the second cavity, so that the connector has multiple layers and multiple types of flowing media, and has more diversity and ornamental value. The double-layered casing 3 may be filled with the flow medium in all of the chambers, or may be filled with the flow medium in only a part of the chambers. It should be understood that if the inner layer chamber of the circuit board 1 is not filled with the flowing medium, the sealing member 2 does not need to be additionally provided with a sealing ring 22 to enhance the tightness, so that the flowing medium is prevented from flowing out of the chamber; meanwhile, the circuit board 1 is not in direct contact with the flowing medium, so that the flowing medium has no requirement on the insulating property and can be selected in a more various way.
Further, the sealing member 241 is larger than the filling port 242, and the sealing member 241 is in interference fit with the filling port 242.
The shape of the sealing material 241 is identical to the shape of the filling port, and the specific shape thereof is not limited to a cylindrical shape, a rectangular parallelepiped shape, a prismatic shape, or the like; and the diameter of the sealing member 241 is larger than the inner diameter of the filling port 242, both can be in interference fit to seal the filling port 242 from flowing medium out of the chamber from the filling port 242. The material of the sealing member 241 is not limited to silica gel, rubber or thermoplastic elastomer; the shape and material of the sealing member 241 are only one possible example, and may be specifically selected according to practical situations, which is not limited herein.
Further, the sealing structure 4 is over-molded onto the closure member 24.
The sealing members 2 provided at both ends of the circuit board 1 are not the same in size, and the maximum projection area of the front sealing member 23 is equal to the maximum projection area of the housing 3 in the axial direction, so that when the circuit board 1 is axially mounted in the housing 3, the front sealing member 23 is partially left outside the housing 3 and abuts against the housing 3. The maximum projection area of the rear end sealing piece 24 is smaller than the maximum projection area of the axial direction of the shell body 3, the sealing structure 4 is formed on the rear end sealing piece 24 in a covering mode, the maximum projection area of the sealing structure 4 is equal to the maximum projection area of the axial direction of the shell body 3, transition between the shell body 3 and the sealing piece 2 is smooth, attractive appearance of a product is improved, meanwhile, the sealing piece 2 is sealed secondarily, and sealing effect of the sealing piece is further improved.
Further, the flow medium is a thermally conductive flow medium comprising liquid and/or solid particles.
As will be appreciated, the flow medium needs to have thermal conductivity to dissipate heat from the circuit board 1; it will be appreciated that both liquid and smaller diameter solid particles may flow within the chamber.
It should be noted that, when the flowing medium is in direct contact with the circuit board 1, the flowing medium must be an insulating medium, and may specifically be a grease liquid or heat-conducting silica gel particles; if the flowing medium is filled in the interlayer cavity of the casing 3, the inner layer of the casing 3 isolates the flowing medium from the circuit board 1 to perform an insulating function, so that the flowing medium at the moment can be an uninsulated medium, such as electrolyte solution, liquid metal and the like.
Optionally, to enhance visual perception, the color of the flowing medium may be one or more of red, yellow, green, blue and purple, fluorescent substances capable of emitting light, and flowing medium with liquid and solid particles in the same chamber or different colors or materials filled in different chambers. The variety of the flowing medium colors, materials and filling positions improves the beauty and individuation of the product.
Further, the shell is made of transparent materials.
It will be appreciated that when the housing 3 forming the chamber is of transparent material, a user may see the flow of the medium within the chamber through the housing, or may be a less transparent housing having a frosted feel, so that the user may see the medium flow within the housing but not so clearly, with a hazy aesthetic appearance.
Referring to fig. 3, a second embodiment of the present invention provides a liquid-cooled data line connector, which is manufactured by the manufacturing process of the liquid-cooled data line connector. The transparent shell can observe the flow of the flowing medium in the shell, brings novel visual feeling to the user, and improves the use feeling of the user.
It should be noted that, the connector provided in this embodiment has a transparent housing 3, openings are formed at two ends of the housing 3, a circuit board 1 is placed in the housing 3, a gap is left between the circuit board 1 and the housing 3, two ends of the circuit board 1 are provided with sealing members 2, the sealing members 2 seal the openings at two ends of the housing 3 and enclose the housing to form a cavity, wherein a filling opening 242 is formed in a rear end sealing member 24 for injecting a flowing medium into the cavity, and a sealing member 241 is provided to seal the filling opening 242 after filling of the flowing medium is completed, and finally a molded sealing structure 4 is covered on the rear end sealing member 24 to secondarily seal the filling opening 242, so that the cavity in the housing is completely sealed, and the flowing medium is prevented from overflowing outside the cavity.
Referring to fig. 5, in another possible embodiment, the housing of the connector is a double-layer transparent housing 3, the housing 3 has an interlayer with an opening at one end, the interlayer is filled with a flowing medium, and the opening is sealed by a sealing member 241, so as to obtain a double-layer transparent housing 3 with a sealed interlayer and the interlayer is filled with the flowing medium. It should be noted that, the two ends of the shell 3 far away from the outer inner shell are both openings in the axial direction, the circuit board 1 is installed in the shell 3 from the opening, and the sealing pieces 2 connected with the circuit board 1 are arranged at the two ends of the shell 3 and enclose the inner shell to form a containing space of the circuit board 1.
It will be appreciated that the circuit board 1 is accommodated in the inner housing, and the flowing medium is filled in the interlayer of the housing 3 and is not in contact with the circuit board 1, so that the flowing medium filled in the interlayer has no insulation requirement, and the type of the medium can be selected more variously.
Compared with the prior art, the manufacturing process of the liquid cooling data line connector and the connector have the following advantages:
1. the embodiment of the invention provides a manufacturing process of a liquid cooling data line connector, which comprises the following steps:
providing a shell with at least one cavity and a circuit board with terminals connected to two ends;
storing the circuit board and the flowing medium in the same or different chambers;
the molded outer seal structure encloses the circuit board and the flowing medium within the housing.
By sealing the flowing medium in the cavity through the steps, when the data is used, the flowing medium flows in the cavity to give a dynamic visual look and feel to a user, so that the data line has more attractive appearance.
2. According to the manufacturing process of the liquid cooling data line connector, the shell is a single-layer shell, and the cavity is a first cavity; the shell is a double-layer shell, the double-layer shell is a coaxial shell, the inner layer of the double-layer shell is a first cavity, and the interlayer of the double-layer shell is a second cavity; the single-layer shell and double-layer shell assembled circuit board and flowing medium comprise the following steps:
forming sealing pieces at two ends of the circuit board, wherein filling openings are formed in the sealing pieces;
loading a circuit board into the first chamber;
filling a flowing medium into the first chamber through the filling port;
the fill port is sealed using a seal.
The sealing pieces at the two ends of the circuit board are enclosed with the shell to form a cavity and wrap the circuit board in the cavity, and the flowing medium is filled in the cavity to be in contact with the circuit board, so that heat generated during the working of the circuit board can be taken away rapidly.
3. According to the manufacturing process of the liquid cooling data line connector, the shell is a double-layer shell, the double-layer shell is a coaxial shell, the inner layer of the double-layer shell is a first cavity, and the interlayer of the double-layer shell is a second cavity; the casing is offered the filling mouth of intercommunication second cavity, and assembly circuit board and flowing medium include following step:
filling the flowing medium into the second chamber through the filling port;
sealing the fill port with a seal;
forming a sealing piece at one end of the circuit board;
the circuit board is loaded into the first chamber and the other end closure is molded.
The flowing medium filled in the second cavity is not directly contacted with the circuit board, and has no insulation limit, so that the flowing medium is more diversified.
4. According to the manufacturing process of the liquid-cooled data line connector, the flowing medium filled in the first cavity is an insulating medium. The insulating flowing medium can avoid short circuit of electronic elements on the circuit board when the flowing medium is contacted with the circuit board, and further damage to the data wires.
5. According to the manufacturing process of the liquid cooling data line connector provided by the embodiment of the invention, the sealing piece is provided with the sealing groove, the sealing groove is sleeved with the sealing ring, and after the circuit board is arranged in the shell, the sealing ring is abutted against the inner wall of the shell. The sealing piece is matched with the sealing ring, so that the two axial ends of the shell are completely sealed, and flowing medium is prevented from flowing out of the shell from the sealing piece when the flowing medium is filled.
6. According to the manufacturing process of the liquid cooling data line connector, the size of the sealing element is larger than that of the filling port, and the sealing element is in interference fit with the filling port. The sealing element in engagement with the filling opening provides a seal so that the flowing medium does not flow out of the filling opening.
7. According to the manufacturing process of the liquid cooling data line connector, the sealing structure is covered and formed on the sealing piece. The sealing piece is covered with a formed sealing structure, so that the cavity can be secondarily sealed, and flowing medium is prevented from flowing out of the shell.
8. According to the manufacturing process of the liquid-cooled data line connector, the flowing medium is a heat-conducting flowing medium, and the heat-conducting flowing medium comprises liquid and/or solid particles. When the circuit board works to generate heat, the heat conduction flowing medium can quickly transfer the heat to the outside of the shell to cool the circuit board; the variety of flowing medium states can provide a richer, more level of visual perception.
9. According to the manufacturing process of the liquid cooling data line connector provided by the embodiment of the invention, the shell is made of transparent materials. The transparent housing allows the user to visually see the flow of the flowing medium within the housing, giving the user visual impact.
10. The embodiment of the invention also provides a liquid cooling data line connector, which is manufactured by adopting the manufacturing process of the liquid cooling data line connector, and has the same beneficial effects as the manufacturing process, and the details are not repeated here.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a, from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may also determine B from a and/or other information.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art will also appreciate that the embodiments described in the specification are alternative embodiments and that the acts and modules referred to are not necessarily required for the present invention.
In various embodiments of the present invention, it should be understood that the sequence numbers of the foregoing processes do not imply that the execution sequences of the processes should be determined by the functions and internal logic of the processes, and should not be construed as limiting the implementation of the embodiments of the present invention.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, with the determination being made based upon the functionality involved. It will be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Claims (10)

1. A manufacturing process of a liquid cooling data line connector is characterized in that: the manufacturing process comprises the following steps:
providing a shell with at least one cavity and a circuit board with terminals connected to two ends;
storing the circuit board and the flowing medium in the same or different chambers;
the molded outer seal structure encloses the circuit board and the flowing medium within the housing.
2. The liquid-cooled data line connector manufacturing process of claim 1, wherein: the shell is a single-layer shell, and the cavity is a first cavity; the assembly circuit board and the flowing medium comprise the following steps:
forming sealing pieces at two ends of the circuit board, wherein filling openings are formed in the sealing pieces;
loading a circuit board into the first chamber;
filling a flowing medium into the first chamber through the filling port;
the fill port is sealed using a seal.
3. The liquid-cooled data line connector manufacturing process of claim 1, wherein: the shell is a double-layer shell, the double-layer shell is a coaxial shell, the inner layer of the double-layer shell is a first cavity, and the interlayer of the double-layer shell is a second cavity; the casing is provided with a filling port communicated with the second cavity, and the assembly circuit board and the flowing medium comprise the following steps:
filling the flowing medium into the second chamber through the filling port;
sealing the fill port with a seal;
forming a sealing piece at one end of the circuit board;
the circuit board is loaded into the first chamber and the other end closure is molded.
4. The liquid-cooled data line connector manufacturing process of claim 2, wherein: the flowing medium filled in the first chamber is an insulating medium.
5. The liquid-cooled data line connector manufacturing process of claim 2, wherein: the sealing piece is provided with a sealing groove, a sealing ring is sleeved on the sealing groove, and after the circuit board is installed in the shell, the sealing ring is propped against the inner wall of the shell.
6. A process for manufacturing a liquid-cooled data line connector according to claim 2 or 3, wherein: the seal is sized larger than the fill port, and the seal is in interference fit with the fill port.
7. The liquid-cooled data line connector manufacturing process of claim 1, wherein: the sealing structure is formed on the sealing piece in a covering mode.
8. The liquid-cooled data line connector manufacturing process of claim 1, wherein: the flow medium is a thermally conductive flow medium comprising liquid and/or solid particles.
9. The liquid-cooled data line connector manufacturing process of claim 1, wherein: the shell is made of transparent materials.
10. A liquid cooled data line connector, characterized by: the liquid-cooled data line connector is manufactured by the liquid-cooled data line connector manufacturing process according to any one of claims 1-9.
CN202310296392.XA 2023-03-23 2023-03-23 Manufacturing process of liquid cooling data line connector and connector Pending CN116315969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310296392.XA CN116315969A (en) 2023-03-23 2023-03-23 Manufacturing process of liquid cooling data line connector and connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310296392.XA CN116315969A (en) 2023-03-23 2023-03-23 Manufacturing process of liquid cooling data line connector and connector

Publications (1)

Publication Number Publication Date
CN116315969A true CN116315969A (en) 2023-06-23

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209448061U (en) * 2019-05-08 2019-09-27 徐航 A kind of USB interface with radiator structure
CN212434909U (en) * 2020-05-20 2021-01-29 中航光电科技股份有限公司 Liquid cooling substructure
CN112437572A (en) * 2020-11-30 2021-03-02 华为技术有限公司 Power adapter
CN212677606U (en) * 2020-08-25 2021-03-09 宇瞻科技股份有限公司 Liquid cooling heat radiation module
CN113517583A (en) * 2021-05-17 2021-10-19 成都肯保捷旭阳新能源电器有限公司 DC + and DC-liquid cooling terminal for super charging gun
CN114552944A (en) * 2022-01-29 2022-05-27 华为数字能源技术有限公司 Power adapter

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209448061U (en) * 2019-05-08 2019-09-27 徐航 A kind of USB interface with radiator structure
CN212434909U (en) * 2020-05-20 2021-01-29 中航光电科技股份有限公司 Liquid cooling substructure
CN212677606U (en) * 2020-08-25 2021-03-09 宇瞻科技股份有限公司 Liquid cooling heat radiation module
CN112437572A (en) * 2020-11-30 2021-03-02 华为技术有限公司 Power adapter
CN113517583A (en) * 2021-05-17 2021-10-19 成都肯保捷旭阳新能源电器有限公司 DC + and DC-liquid cooling terminal for super charging gun
CN114552944A (en) * 2022-01-29 2022-05-27 华为数字能源技术有限公司 Power adapter

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