CN116314106B - Alumina ceramic substrate for chip packaging - Google Patents
Alumina ceramic substrate for chip packaging Download PDFInfo
- Publication number
- CN116314106B CN116314106B CN202310094204.5A CN202310094204A CN116314106B CN 116314106 B CN116314106 B CN 116314106B CN 202310094204 A CN202310094204 A CN 202310094204A CN 116314106 B CN116314106 B CN 116314106B
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- Prior art keywords
- alumina ceramic
- ceramic shell
- plate
- oxide ceramic
- upper cover
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 134
- 239000000758 substrate Substances 0.000 title claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 42
- 125000006850 spacer group Chemical group 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 claims abstract description 7
- 239000011224 oxide ceramic Substances 0.000 claims description 19
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 19
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- 230000001965 increasing effect Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The invention relates to the technical field of chip substrates, and discloses an alumina ceramic substrate for chip packaging, which comprises an alumina ceramic shell, wherein a wiring board is movably sleeved in the upper end of the alumina ceramic shell, a lower connecting board is arranged at the lower part of the alumina ceramic shell, a welding spot limiting board is arranged at the upper end of the wiring board, and an upper cover board is movably sleeved outside the upper end of the alumina ceramic shell. This aluminium oxide ceramic substrate for chip encapsulation has offered the slant recess through the outside four corners of aluminium oxide ceramic shell, upper cover plate and lower connecting plate, and first side spacer pin and second spacer pin activity cup joint in the inside of slant recess simultaneously, and first side spacer pin and second spacer pin are to the mutual encapsulation fixed between aluminium oxide ceramic shell, upper cover plate and the lower connecting plate promptly, and stability when increasing equipment definition is installed in the while, and first side spacer pin and second spacer pin are the slant installation, appear not hard up problem when avoiding follow-up installation.
Description
Technical Field
The invention relates to the technical field of chip substrates, in particular to an alumina ceramic substrate for chip packaging.
Background
The shell for mounting semiconductor integrated circuit chip plays roles of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chip with external circuits, namely, the joints on the chip are connected to pins of the packaging shell by wires, the pins are connected with other devices by wires on a printed board, in the process of packaging the chip, a substrate is generally a copper-clad laminate, and a single-sided and double-sided printed board is manufactured on a substrate material and a copper-clad laminate (Copper Clad Laminate, CCL) by selectively carrying out hole processing, electroless copper plating, electroplating copper, etching and other processing to obtain a required circuit pattern.
In the substrate for chip packaging, the inside of the substrate needs to contain welding spots and connecting wires, the connecting wires are carried to be spliced between the upper layer circuit and the lower layer circuit, the subsequent circuit is convenient to conduct electricity, corresponding holes are formed in the substrate, meanwhile, electroplated layers are filled in the holes, so that the upper and lower communicated electrifying circuits are formed, when the connecting wires are designed in an electroplating mode, the connecting wires are uniformly distributed, when the circuits need to be changed in the later period, the corresponding substrate needs to be replaced and designed, when the substrate is produced, the substrate needs to be changed according to different use requirements of the substrate, the substrate can be changed, and production and preparation of the substrate can be influenced.
Disclosure of Invention
Aiming at the defects of the existing alumina ceramic substrate for chip packaging, the invention provides the alumina ceramic substrate for chip packaging, which has the advantages that holes are formed in the alumina ceramic shell, meanwhile, connecting wires are sleeved in the alumina ceramic shell, the connecting wires at corresponding positions are installed according to the electrifying requirement, and meanwhile, the connecting wires can be detached and replaced, namely, the convenience is improved when the equipment is used later, and the problems in the background art are solved.
The invention provides the following technical scheme: the utility model provides an alumina ceramic base plate for chip encapsulation, includes alumina ceramic shell, the inside activity of alumina ceramic shell upper end has cup jointed the wiring board, the lower connecting plate is installed to the lower part of alumina ceramic shell, the solder joint limiting plate is installed to the upper end of wiring board, the outside activity of alumina ceramic shell upper end has cup jointed the upper cover plate, first connecting hole has been seted up to the inside of solder joint limiting plate, the internally mounted of alumina ceramic shell has the connecting wire, the hole of taking has been seted up to the inside of connecting wire, the second connecting hole has been seted up to the inside of upper cover plate, the lower part fixedly connected with internal limiting plate of upper cover plate, first side spacer pin and second spacer pin are installed respectively to the upper portion and the lower part of alumina ceramic shell side.
Preferably, grid-shaped grooves are formed in the outer portion of the welding spot limiting plate, and the welding spot limiting plate is arranged between the upper cover plate and the alumina ceramic shell.
Preferably, the lower ends of the second connecting holes formed in the upper cover plate are provided with connecting sleeves, and the connecting sleeves penetrate through the first connecting holes.
Preferably, the connection lines are arranged at equal intervals inside the alumina ceramic housing, and the upper parts of the connection lines are attached to the lower parts of the connection plates while the upper parts of the lower connection plates pass through the alumina ceramic housing and are in contact with the outside of the connection lines.
Preferably, two groups of taking holes are formed in the connecting wire, and the taking holes are spiral.
Preferably, the outer side of the welding spot limiting plate is hollow, and the inner limiting plate is movably sleeved in the hollow groove.
Preferably, the first side limiting pin is arranged in the joint of the alumina ceramic shell and the upper cover plate, the first side limiting pin is 45 degrees with the side surface of the alumina ceramic shell, and the second limiting pin is arranged between the joint of the alumina ceramic shell and the lower connecting plate.
A processing mode of an alumina ceramic substrate for chip packaging,
step one: the alumina ceramic is designed into the shape of an alumina ceramic shell, and grooves are formed in the alumina ceramic shell at equal intervals;
step two: the aluminum oxide ceramic shell is internally provided with the connecting wires in sequence, meanwhile, the inside of the connecting wires is provided with the taking holes which are spiral, and the inside of the taking holes can pass through the taking equipment, so that the connecting wires are convenient to install and limit;
step three: the wiring board is arranged in the alumina ceramic shell, and the welding point limiting plate and the upper cover plate are sequentially arranged on the upper part of the alumina ceramic shell;
step four: the lower carrying connecting plate is arranged at the lower part of the alumina ceramic shell, the upper part of the lower connecting plate is clamped in the lower end of the alumina ceramic shell, and the outer part of the alumina ceramic shell is integrally kept in a bonding state;
step five: the first side limiting pin is arranged in the side surfaces of the aluminum oxide ceramic shell and the first connecting hole, the second limiting pin is arranged in the inner parts of the two sides of the aluminum oxide ceramic shell and the lower connecting plate, and the first side limiting pin and the second limiting pin keep a limiting state among the aluminum oxide ceramic shell, the first connecting hole and the lower connecting plate.
Preferably, the aluminum oxide ceramic shell is prepared from aluminum oxide ceramic, and the grooves formed in the aluminum oxide ceramic shell can be used for installing connecting wires according to the needed connecting parts.
Compared with the existing alumina ceramic substrate for chip packaging, the invention has the following beneficial effects:
1. this alumina ceramic base plate for chip package has offered the hole through the inside of alumina ceramic shell, and the inside of hole is cup jointed in first connecting hole activity simultaneously, when needs line position difference between wiring board and the lower connecting plate, portability first connection Kong Yici dismantles the replacement, and the inside back at alumina ceramic shell is installed to first connecting hole simultaneously, and wiring board and lower connecting plate are installed in proper order in inside and the lower part of alumina ceramic shell, and the connecting wire carries and prescribes a limit to between wiring board and the lower connecting plate promptly, and the follow-up when needs replace the connecting wire of damage position simultaneously, multiplicable convenience.
2. This aluminium oxide ceramic substrate for chip encapsulation has offered the slant recess through the outside four corners of aluminium oxide ceramic shell, upper cover plate and lower connecting plate, and first side spacer pin and second spacer pin activity cup joint in the inside of slant recess simultaneously, and first side spacer pin and second spacer pin are to the mutual encapsulation fixed between aluminium oxide ceramic shell, upper cover plate and the lower connecting plate promptly, and stability when increasing equipment definition is installed in the while, and first side spacer pin and second spacer pin are the slant installation, appear not hard up problem when avoiding follow-up installation.
3. This alumina ceramic base plate for chip packaging has the solder joint through the externally mounted of wiring board, and the solder joint limiting plate cup joints in the outside back of wiring board simultaneously, and the solder joint limiting plate prescribes a limit to the position of solder joint, and when follow-up equipment welds, the solder joint limiting plate conveniently prescribes a limit to the solder joint, avoids welding department to, appears the problem of welding position skew.
Drawings
FIG. 1 is a schematic diagram of the main structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the main body of the present invention;
FIG. 3 is a schematic diagram of the main body explosion diagram of the present invention;
FIG. 4 is a schematic view of a partial cross-sectional structure of the present invention;
fig. 5 is a partially enlarged schematic view of the present invention.
In the figure: 1. an alumina ceramic shell; 2. a wiring board; 3. welding spot limiting plates; 4. an upper cover plate; 5. a first connection hole; 6. a connecting wire; 7. a taking hole; 8. a lower connecting plate; 9. a second connection hole; 10. a first side limit pin; 11. a second limiting pin; 12. an inner limiting plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, an alumina ceramic substrate for chip packaging includes an alumina ceramic housing 1, a wiring board 2 is movably sleeved in the interior of the upper end of the alumina ceramic housing 1, the wiring board 2 drives a basic internal circuit to connect, a lower connecting board 8 is installed at the lower part of the alumina ceramic housing 1, the lower connecting board 8 drives the rear end of the substrate to communicate, a welding point limiting board 3 is installed at the upper end of the wiring board 2, the welding point limiting board 3 protects the outside of the welding point, the welding deviation is avoided when welding, an upper cover board 4 is movably sleeved at the outer part of the upper end of the alumina ceramic housing 1, the upper cover board 4 protects the upper part of the welding point limiting board 3 and the wiring board 2, a first connecting hole 5 is provided in the interior of the welding point limiting board 3, the first connecting hole 5 drives a component to splice, a connecting wire 6 is installed in the interior of the alumina ceramic housing 1, a taking hole 7 is provided in the interior of the connecting wire 6, a second connecting hole 9 is provided in the interior of the upper cover board 4, a lower part of the upper cover board 4 is fixedly connected with a lower plate 12, a clamping joint 12 is clamped in the lower part of the upper cover board 4 and a welding point limiting board 12 is prevented from being clamped in the lower side of the welding point limiting board, and a limit pin is prevented from being extruded by the first side surface of the welding point limiting board 3 and the first side of the welding point is prevented from being extruded by the first side surface of the upper cover board 3, and the first side of the limiting board is prevented from being extruded and the welding point limited by the first side surface of the welding point is prevented from being extruded by the limiting the first side and the lower side of the limiting board 3.
Referring to fig. 3, the outer part of the welding spot limiting plate 3 is provided with grid-shaped grooves, the welding spot limiting plate 3 is installed between the upper cover plate 4 and the alumina ceramic shell 1, the grid-shaped grooves are formed through the outer part of the welding spot limiting plate 3, meanwhile, the welding spot limiting plate 3 is installed between the upper cover plate 4 and the alumina ceramic shell 1, after the welding spot limiting plate 3 covers the upper part of the wiring plate 2, the welding spot limiting plate 3 limits the position of welding spots formed inside the wiring plate 2, namely, when the subsequent welding is carried out on the outer part of the wiring plate 2, the welding position is conveniently positioned, and meanwhile, the upper cover plate 4 covers the outer part of the welding spot limiting plate 3, and the position of the welding spot limiting plate 3 is limited by the upper cover plate 4.
Referring to fig. 2, the connecting sleeves are all installed at the lower ends of the second connecting holes 9 opened inside the upper cover plate 4, penetrate through the inside of the first connecting holes 5, are installed through the lower parts of the second connecting holes 9, and can extend to the inside of the first connecting holes 5, namely, the positions between the first connecting holes 5 and the upper cover plate 4 are kept in a limited state, so that the problems of dislocation and position deviation after the positions between the upper cover plate 4 and the welding spot limiting plates 3 are packaged are avoided.
Referring to fig. 4, the connection wires 6 are arranged at equal intervals in the alumina ceramic housing 1, the upper parts of the connection wires 6 are attached to the lower parts of the connection plates 2, the upper parts of the lower connection plates 8 penetrate through the alumina ceramic housing 1 and are in contact with the outer parts of the connection wires 6, the connection wires 6 can be installed in the alumina ceramic housing 1, meanwhile, when the positions of connection wires are different according to the needs of a substrate, the portable clamping devices are installed in the clamping holes 7, the clamping devices are rotated, the clamping devices are clamped in the clamping holes 7, the utilization rate of the connection wires can be increased, the influence of the connection wires on efficiency due to the fault is avoided, and the connection wires 6 can be replaced conveniently when the subsequent connection wires 6 are damaged.
Referring to fig. 3 and 5, two sets of holes 7 of taking have been seted up to the inside of connecting wire 6, the hole 7 of taking is the heliciform, install in the inside of alumina ceramic shell 1 back through connecting wire 6, connecting wire 6 carries down and is connected between connecting plate 8 and the wiring board 2, the hole 7 of taking has been seted up to the inside of connecting wire 6 simultaneously, when equipment was used, can carry the inside that draws equipment screw conveying to connecting wire 6, can carry connecting wire 6 and draw promptly, increase the convenience when the replacement is taken to connecting wire 6 promptly.
Referring to fig. 3 and 5, the outer side of the welding spot limiting plate 3 is hollow, the inner limiting plate 12 is movably sleeved in the hollow groove, the outer side of the welding spot limiting plate 3 is hollow, and meanwhile, the upper cover plate 4 is mounted in the aluminum oxide ceramic shell 1, the inner limiting plate 12 is movably sleeved in the hollow groove, namely, the position of the welding spot limiting plate 3 is limited, so that stability is improved.
Referring to fig. 1, a first side limiting pin 10 is installed in the connection part of an alumina ceramic shell 1 and an upper cover plate 4, the side surface of the first side limiting pin 10 and the alumina ceramic shell 1 is 45 degrees, a second limiting pin 11 is installed between the connection part of the alumina ceramic shell 1 and a lower connecting plate 8, the first side limiting pin 10 and the second limiting pin 11 are installed at the outer side corners of the alumina ceramic shell 1, the upper cover plate 4 and the lower connecting plate 8, the first side limiting pin 10 and the second limiting pin 11 are clamped and limited in a bevel manner, and when the subsequent alumina ceramic shell 1 is used, the problem that the first side limiting pin 10 slides down can be avoided when the subsequent alumina ceramic shell 1 is stressed by the side surface.
A processing mode of an alumina ceramic substrate for chip packaging,
step one: the alumina ceramic is designed to be in the shape of an alumina ceramic shell 1, and grooves are formed in the alumina ceramic shell 1 at equal intervals;
step two: the aluminum oxide ceramic shell 1 is internally provided with the connecting wires 6 in sequence, meanwhile, the inside of the connecting wires 6 is provided with the taking holes 7, the taking holes 7 are spiral, and the inside of the taking holes 7 can be penetrated by taking equipment, so that the connecting wires 6 are convenient to install and limit;
step three: the wiring board 2 is arranged in the alumina ceramic shell 1, and meanwhile, the welding point limiting plate 3 and the upper cover plate 4 are sequentially arranged at the upper part of the alumina ceramic shell 1;
step four: simultaneously, the lower carrying connection plate 8 is arranged at the lower part of the alumina ceramic shell 1, the upper part of the lower connection plate 8 is clamped in the lower end of the alumina ceramic shell 1, and the outside of the alumina ceramic shell 1 is integrally kept in a bonding state;
step five: through having seted up first side spacer pin 10 in the inside of the side of alumina ceramic shell 1 and first connecting hole 5, the internally mounted of alumina ceramic shell 1 and lower connecting plate 8 both sides has second spacer pin 11, and first side spacer pin 10 and second spacer pin 11 keep the limit state to alumina ceramic shell 1, first connecting hole 5 and lower connecting plate 8 between.
Referring to fig. 1, an alumina ceramic housing 1 is made of alumina ceramic, a groove formed in the alumina ceramic housing 1 can be connected with a part to install a connecting wire 6 according to needs, the alumina ceramic housing 1 is made of alumina ceramic, the protection performance and the discharge characteristic of equipment are improved, the groove formed in the alumina ceramic housing 1 can be used for installing the connecting wire 6 according to needs, connection between subsequent circuits is facilitated, and when the connecting wire 6 is damaged, the connecting wire 6 can be conveniently detached and replaced.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides an alumina ceramic base plate for chip packaging, includes alumina ceramic shell (1), inside activity of alumina ceramic shell (1) upper end has cup jointed wiring board (2), lower connecting plate (8), its characterized in that are installed to the lower part of alumina ceramic shell (1): welding spot limiting plate (3) are installed to the upper end of wiring board (2), upper cover plate (4) have been cup jointed in the outside activity of aluminium oxide ceramic housing (1) upper end, first connecting hole (5) have been seted up to the inside of welding spot limiting plate (3), internally mounted of aluminium oxide ceramic housing (1) has connecting wire (6), take hole (7) have been seted up to the inside of connecting wire (6), second connecting hole (9) have been seted up to the inside of upper cover plate (4), lower part fixedly connected with inner limiting plate (12) of upper cover plate (4), first side spacer pin (10) and second spacer pin (11) are installed respectively to the upper portion and the lower part of aluminium oxide ceramic housing (1) side.
2. The alumina ceramic substrate for chip packaging according to claim 1, wherein: the outside of solder joint limiting plate (3) has offered latticed recess, solder joint limiting plate (3) are installed between upper cover plate (4) and alumina ceramic shell (1).
3. The alumina ceramic substrate for chip packaging according to claim 1, wherein: the lower ends of the second connecting holes (9) are respectively arranged in the upper cover plate (4), and the connecting sleeves penetrate through the first connecting holes (5).
4. The alumina ceramic substrate for chip packaging according to claim 1, wherein: the connecting wires (6) are arranged at equal intervals in the aluminum oxide ceramic shell (1), the upper parts of the connecting wires (6) are attached to the lower parts of the wiring boards (2), and meanwhile the upper parts of the lower connecting plates (8) penetrate through the aluminum oxide ceramic shell (1) and are in contact with the outer parts of the connecting wires (6).
5. The alumina ceramic substrate for chip packaging according to claim 1, wherein: two groups of taking holes (7) are formed in the connecting wire (6), and the taking holes (7) are spiral.
6. The alumina ceramic substrate for chip packaging according to claim 1, wherein: the outer side of the welding spot limiting plate (3) is hollow, and the inner limiting plate (12) is movably sleeved in the hollow groove.
7. The alumina ceramic substrate for chip packaging according to claim 1, wherein: the aluminum oxide ceramic shell is characterized in that the first side limiting pin (10) is arranged in the joint of the aluminum oxide ceramic shell (1) and the upper cover plate (4), the first side limiting pin (10) is 45 degrees to the side face of the aluminum oxide ceramic shell (1), and the second limiting pin (11) is arranged between the joint of the aluminum oxide ceramic shell (1) and the lower connecting plate (8).
8. The method for processing an alumina ceramic substrate for chip packaging according to claim 1, wherein:
step one: the alumina ceramic is designed to be in the shape of an alumina ceramic shell (1), and grooves are formed in the alumina ceramic shell (1) at equal intervals;
step two: the aluminum oxide ceramic shell (1) is internally provided with a groove, the inside of the groove is sequentially provided with connecting wires (6), meanwhile, the inside of the connecting wires (6) is provided with a taking hole (7), the taking hole (7) is spiral, and the inside of the taking hole (7) can penetrate through taking equipment, so that the connecting wires (6) are convenient to install and limit;
step three: the wiring board (2) is arranged in the alumina ceramic shell (1), and meanwhile, the welding point limiting plate (3) and the upper cover plate (4) are sequentially arranged on the upper part of the alumina ceramic shell (1);
step four: simultaneously, a lower carrying connecting plate (8) is arranged at the lower part of the alumina ceramic shell (1), the upper part of the lower connecting plate (8) is clamped in the lower end of the alumina ceramic shell (1), and the whole outside of the alumina ceramic shell (1) is kept in a bonding state;
step five: through having seted up first side spacer pin (10) in the inside of the side of aluminium oxide ceramic shell (1) and first connecting hole (5), internally mounted of aluminium oxide ceramic shell (1) and lower connecting plate (8) both sides has second spacer pin (11), and first side spacer pin (10) and second spacer pin (11) keep the limit state to aluminium oxide ceramic shell (1), between first connecting hole (5) and lower connecting plate (8).
9. The method for processing an alumina ceramic substrate for chip packaging according to claim 8, wherein: the aluminum oxide ceramic shell (1) is prepared from aluminum oxide ceramic, and a groove formed in the aluminum oxide ceramic shell (1) can be connected with a part mounting connecting wire (6) according to requirements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310094204.5A CN116314106B (en) | 2023-02-10 | 2023-02-10 | Alumina ceramic substrate for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310094204.5A CN116314106B (en) | 2023-02-10 | 2023-02-10 | Alumina ceramic substrate for chip packaging |
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| Publication Number | Publication Date |
|---|---|
| CN116314106A CN116314106A (en) | 2023-06-23 |
| CN116314106B true CN116314106B (en) | 2023-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794766A (en) * | 2009-01-29 | 2010-08-04 | 雅马哈株式会社 | Heat exchange unit |
| CN107393865A (en) * | 2016-05-17 | 2017-11-24 | 台湾积体电路制造股份有限公司 | Semiconductor devices |
| CN112289753A (en) * | 2019-07-25 | 2021-01-29 | 松山湖材料实验室 | Method for manufacturing enclosure dam ceramic substrate for ultraviolet LED packaging and product thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160133422A (en) * | 2014-01-17 | 2016-11-22 | 누보트로닉스, 인크. | Wafer scale test interface unit and contactors |
| US9786633B2 (en) * | 2014-04-23 | 2017-10-10 | Massachusetts Institute Of Technology | Interconnect structures for fine pitch assembly of semiconductor structures and related techniques |
-
2023
- 2023-02-10 CN CN202310094204.5A patent/CN116314106B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101794766A (en) * | 2009-01-29 | 2010-08-04 | 雅马哈株式会社 | Heat exchange unit |
| CN107393865A (en) * | 2016-05-17 | 2017-11-24 | 台湾积体电路制造股份有限公司 | Semiconductor devices |
| CN112289753A (en) * | 2019-07-25 | 2021-01-29 | 松山湖材料实验室 | Method for manufacturing enclosure dam ceramic substrate for ultraviolet LED packaging and product thereof |
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| Publication number | Publication date |
|---|---|
| CN116314106A (en) | 2023-06-23 |
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