CN116313274A - High-heat-conductivity insulating copper flat wire for 10kV high-voltage motor and preparation method thereof - Google Patents
High-heat-conductivity insulating copper flat wire for 10kV high-voltage motor and preparation method thereof Download PDFInfo
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- CN116313274A CN116313274A CN202310087207.6A CN202310087207A CN116313274A CN 116313274 A CN116313274 A CN 116313274A CN 202310087207 A CN202310087207 A CN 202310087207A CN 116313274 A CN116313274 A CN 116313274A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/42—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
- H01B7/428—Heat conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/10—Insulating conductors or cables by longitudinal lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/025—Other inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
- H01B7/0225—Three or more layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
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- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
The invention relates to the technical field of electrical insulation, in particular to a high-heat-conductivity insulated copper flat wire for a 10kV high-voltage motor and a preparation method thereof, which are mainly applied to the preparation of high-voltage motor coils. The high-heat-conductivity insulating copper flat wire consists of a flat copper conductor and an insulating layer, wherein the insulating layer is sequentially provided with a high-heat-conductivity polyester-imide paint layer and a high-heat-conductivity polyimide film reinforced few-glue mica tape wrapping layer from inside to outside; the high-heat-conductivity polyester imine paint layer comprises polyester imine wire enamel and high-heat-conductivity filler; the high-heat-conductivity polyimide film reinforced small-glue mica tape wrapping layer is formed by covering a layer of high-heat-conductivity epoxy adhesive containing high-heat-conductivity filler on the polyimide film surface of a polyimide film powder mica tape; the high-heat-conductivity insulated copper flat wire has good insulativity, heat conductivity and heat resistance, and is suitable for a 10kV high-voltage motor.
Description
Technical Field
The invention relates to the technical field of electrical insulation, in particular to a high-heat-conductivity insulated copper flat wire for a 10kV high-voltage motor and a preparation method thereof, which are mainly applied to the preparation of high-voltage motor coils.
Background
Along with the technical development of high-voltage motors, the high-voltage motor needs to have higher power and compact structure, which can cause higher heat generated by the high-voltage motor during operation, so that the operation temperature of the high-voltage motor is excessively high, and the high temperature is an important reason for reducing the electrical performance, mechanical performance and service life of an insulation system of the high-voltage motor and also directly influences the working efficiency of the high-voltage motor. Therefore, the heat dissipation efficiency of the high-voltage motor is improved, the temperature rise is reduced, and the service life and the reliability of the high-voltage motor are further improved, so that the high-voltage motor has become one of the technical problems which are urgently needed to be solved in the technical development of the modern motor.
The insulated copper flat wire is insulated by a conductor prepared by the high-voltage motor coil, when the high-voltage motor operates, the copper conductor heats and contacts with the insulating layer on the surface of the copper flat wire, and if the insulated copper flat wire has high heat conduction performance, the heat can be rapidly transferred to the main insulating layer, so that the layer-by-layer heat transfer can be effectively performed, and the operating temperature rise of the high-voltage motor is reduced. But the insulated copper flat wire used by the current high-voltage motor mainly comprises a polyester film reinforced small-glue mica tape wrapped copper flat wire, a polyimide film wrapped polyester film reinforced small-glue mica tape wrapped copper flat wire, a polyester film reinforced small-glue mica tape wrapped glass fiber wrapped copper flat wire and the like, and has excellent insulating performance.
CN102514345a discloses a method for manufacturing mica tape with low production cost, which is suitable for energy saving, emission reduction and environmental pollution reduction, comprising: adding nano material with the surface subjected to activation treatment into mica powder, and uniformly stirring and dispersing the nano material and the mica powder at a high speed for later use; coating a first adhesive on the reinforcing material through a roller, and adsorbing the mica raw material on the reinforcing material by utilizing an electrostatic field; spraying a second adhesive onto the mica raw material on the reinforcing material; and (3) drying the semi-finished product of the single-sided reinforced mica tape by a drying oven, removing the organic solvent, cooling, rolling by a roller, and obtaining a mica tape roll, thus obtaining a finished product of the single-sided reinforced mica tape.
CN106626626a discloses a high heat conduction film reinforced mica tape, a preparation method and application thereof, wherein the mica tape comprises a mica paper layer, an adhesive layer and a high heat conduction polyimide film layer which are mutually overlapped from top to bottom in sequence; the high heat conduction polyimide film layer is adhered to the mica paper layer through the adhesive layer, and the mica paper layer mainly comprises mica sheets and reinforcing fibers; the mica tape is also added with a heat-conducting filler; the heat conducting filler comprises at least one of micron-level heat conducting filler and nanometer-level heat conducting filler; the preparation method comprises the steps of dispersing the heat conducting filler, rubbing the surface of the high heat conducting polyimide film, compounding the high heat conducting mica paper, carrying out surface treatment, baking, rolling, cutting and the like.
In the prior art, the improvement of the mica tape is mainly aimed at, although the improvement in the aspects of insulation and heat conduction is achieved, the conductor heat can not be effectively transferred when the high-power density high-voltage motor is operated, the operation temperature rise of the high-voltage motor is not favorably reduced, the service life is prolonged, the operation reliability is improved, and therefore, the preparation of the high-heat-conductivity insulated copper flat wire has important significance for the high-power density high-voltage motor.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing a high-heat-conductivity insulating copper flat wire suitable for a 10kV high-voltage motor and a preparation method thereof.
In order to solve the technical problems, the invention adopts the following technical scheme:
the high-heat-conductivity insulating copper flat wire comprises a flat copper conductor and an insulating layer, wherein the insulating layer is sequentially provided with a high-heat-conductivity polyester-imide paint layer and a high-heat-conductivity polyimide film reinforced few-glue mica tape wrapping layer from inside to outside;
the high-heat-conductivity polyester imide paint layer comprises polyester imide wire enamel and high-heat-conductivity filler;
the high-heat-conductivity polyimide film reinforced small-glue mica tape wrapping layer is formed by covering a layer of high-heat-conductivity epoxy adhesive on the polyimide film surface of a polyimide film powder mica tape;
the high-heat-conductivity epoxy adhesive comprises epoxy resin and high-heat-conductivity filler.
In some preferred embodiments, the polyesterimide wire enamel is selected from the group consisting of polyesterimide wire enamels having a temperature index of greater than or equal to 180 ℃; specifically, the polyesterimide wire enamel is at least one selected from ELANTAS TONGVAR 355G, 1760/40 and 1760/38.
In some preferred embodiments, the epoxy resin is selected from the group consisting of phenolic epoxy resins having an epoxy equivalent weight of 160-200 g/mol; specifically, the epoxy resin is selected from at least one of F44, F51 and 431.
In some preferred embodiments, the high thermal conductivity filler is selected from at least one of aluminum oxide, boron nitride, aluminum nitride species.
In some preferred embodiments, the high thermal conductivity filler has an average particle size of 80 to 6000nm, preferably 100 to 2000nm, more preferably 800 to 2000nm.
In some preferred embodiments, the high thermal conductivity insulated copper flat wire has a double sided insulation thickness of 0.4-0.6mm.
In some preferred embodiments, the thickness of the high thermal conductivity polyester imide paint layer is 10-30%, preferably 25-30%, more preferably 25-28% of the total thickness of the insulating layer.
In some preferred embodiments, the high thermal conductivity polyester imide enameling coating comprises more than or equal to 10% of the high thermal conductivity filler by mass. Preferably 10-50%,10-30%,10-20% or 10-15%.
In some preferred embodiments, the high thermal conductivity polyester imide paint layer is coated on the surface of the flat copper conductor in a coating mode.
In some preferred embodiments, the high thermal conductivity polyimide film reinforced low glue mica tape wrap is made from a 0.06-0.15mm thick high thermal conductivity polyimide film reinforced low glue mica tape half lap wrap.
In some preferred embodiments, the high thermal conductivity polyimide film reinforced low glue mica tape has a thickness of 0.06 to 0.09mm.
In some preferred embodiments, the high-heat-conductivity polyimide film reinforced small-glue mica tape is obtained by uniformly coating high-heat-conductivity epoxy adhesive on the surface of polyimide film powder mica tape, removing solvent and rolling. Wherein the thickness of the polyimide film mica tape is 0.05-0.1mm, and the coating thickness of the high heat conduction epoxy adhesive is 0.01-0.2mm.
In some preferred embodiments, the high thermal conductivity epoxy adhesive comprises greater than or equal to 50% of the high thermal conductivity filler, preferably 50-70%, more preferably 50-60%.
In some preferred embodiments, the high thermal conductivity polyester imide paint layer is prepared by the steps of:
s1: adding the high-heat-conductivity filler into the polyesterimide wire enamel, and uniformly mixing;
s2: grinding and dispersing the mixture obtained in the step S1 to obtain the high-heat-conductivity polyester-imide paint;
s3: and coating the high-heat-conductivity polyester-imide paint on the surface of the flat copper conductor to form the high-heat-conductivity polyester-imide paint layer.
In some preferred embodiments, the high thermal conductivity epoxy adhesive is prepared by:
SS1: and mixing the epoxy resin with a solvent, adding the high-heat-conductivity filler, and homogenizing and emulsifying to obtain the high-heat-conductivity epoxy adhesive.
In some preferred embodiments, the high thermal conductivity polyimide film reinforced few-gum mica tape is prepared by the steps of:
SSS1: and coating the polyimide film surface of the polyimide film powder mica tape with the high-heat-conductivity epoxy adhesive, removing the solvent, and rolling to obtain the high-heat-conductivity polyimide film reinforced few-glue mica tape.
The invention has the advantages that:
1. the surface insulating layer of the copper flat wire has higher heat conduction performance, and the heat conduction coefficient is more than or equal to 0.5W/m.k;
2. the surface insulating layer of the copper flat wire has higher heat resistance, and the temperature resistance index reaches more than 200 ℃;
3. the surface insulating layer of the copper flat wire has good insulativity, and the breakdown voltage is more than or equal to 10kV.
Drawings
Fig. 1: the invention discloses a high-heat-conductivity insulating copper flat wire structure schematic diagram.
Reference numerals illustrate: 1-a polyimide film reinforced few-glue mica tape wrapping layer with high heat conductivity; 2-a high thermal conductivity polyester imine paint layer; 3-Flat copper conductor
Detailed Description
Example 1
A high heat conduction insulated copper flat wire comprises a flat copper conductor and an insulating layer, wherein the bilateral insulation thickness is 0.5mm;
the insulating layer is sequentially provided with a high-heat-conductivity polyester imide paint layer and a high-heat-conductivity polyimide film reinforced few-glue mica tape wrapping layer from inside to outside;
the thickness of the high heat conduction polyester imine paint layer is 0.13mm, and the thickness of the high heat conduction polyimide film reinforced few-glue mica tape wrapping layer is 0.37mm.
The high-heat-conductivity insulating copper flat wire is prepared by the following method:
preparing a high-heat-conductivity polyester imine paint layer:
adding 1kg of aluminum oxide with the average grain diameter of 100nm and 5.5kg of boron nitride with the average grain diameter of 200nm into 50kg ELANTAS TONGVAR 355G polyesterimide wire enamel under the stirring condition, continuously stirring until high-heat-conductivity powder is uniformly dispersed in the polyesterimide wire enamel after the addition, and coating the high-heat-conductivity polyesterimide paint layer on a flat copper conductor by using a die method through a horizontal wire enamel machine after grinding and dispersing.
The preparation method of the high-heat-conductivity polyimide film reinforced mica tape wrapping layer with less glue comprises the following steps:
15kg of F51 epoxy resin and 120kg of toluene are uniformly mixed, 3.5kg of aluminum oxide with the average particle size of 1000nm, 15.5kg of boron nitride with the average particle size of 800nm and 1kg of aluminum nitride with the average particle size of 1500nm are added, and the high-heat-conductivity epoxy adhesive is obtained after uniform homogenization, emulsification and dispersion.
Uniformly coating a polyimide film surface of a 0.06mm polyimide film powder mica tape with a 0.03mm high heat conduction epoxy adhesive, removing a solvent through a drying tunnel, and rolling to obtain the 0.09mm high heat conduction polyimide film reinforced few-glue mica tape.
And wrapping the 0.09mm high-heat-conductivity polyimide film reinforced small-glue mica tape outside the high-heat-conductivity polyester-imide paint layer by using a half-lap wrapping machine to obtain a high-heat-conductivity polyimide film reinforced small-glue mica tape wrapping layer.
Example 2
A high heat conduction insulated copper flat wire comprises a flat copper conductor and an insulating layer, wherein the bilateral insulation thickness is 0.55mm;
the insulating layer is sequentially provided with a high-heat-conductivity polyester imide paint layer and a high-heat-conductivity polyimide film reinforced few-glue mica tape wrapping layer from inside to outside;
the thickness of the high heat conduction polyester imine paint layer is 0.15mm, and the thickness of the high heat conduction polyimide film reinforced few-glue mica tape wrapping layer is 0.40mm.
The high-heat-conductivity insulating copper flat wire is prepared by the following method:
preparing a high-heat-conductivity polyester imine paint layer:
adding 1.68kg of aluminum oxide with the average grain diameter of 200nm, 6.6kg of boron nitride with the average grain diameter of 150nm and 0.4kg of 20nm of aluminum nitride into 62kg of JF-710/40 polyester imide wire enamel under the stirring condition, continuously stirring until high heat conduction powder is uniformly dispersed in the polyester imide wire enamel, grinding and dispersing, and coating the high heat conduction polyester imide paint layer on a flat copper conductor by using a horizontal type wire enamel coating machine by adopting a die method.
The preparation method of the high-heat-conductivity polyimide film reinforced mica tape wrapping layer with less glue comprises the following steps:
uniformly mixing 20kg of F44 epoxy resin and 115kg of toluene, adding 5kg of aluminum oxide with the average particle size of 1200nm, 20.5kg of boron nitride with the average particle size of 900nm and 2.5kg of aluminum nitride with the average particle size of 2000nm, homogenizing, emulsifying and dispersing uniformly, and obtaining the high-heat-conductivity epoxy adhesive.
Uniformly coating a polyimide film surface of a 0.06mm polyimide film powder mica tape with a 0.02mm high heat conduction epoxy adhesive, removing a solvent through a drying tunnel, and rolling to obtain the 0.08mm high heat conduction polyimide film reinforced few-glue mica tape.
And wrapping the 0.08mm high-heat-conductivity polyimide film reinforced low-glue mica tape outside a high-heat-conductivity polyester imine paint layer by using a half-lap wrapping machine to obtain a high-heat-conductivity polyimide film reinforced low-glue mica tape wrapping layer.
Comparative example 1
The double-sided insulation thickness of the insulated copper flat wire is 0.55mm, and the insulated copper flat wire consists of a polyimide film wrapping layer and a polyester film reinforced small-glue mica tape wrapping layer, wherein the thickness of the polyimide film wrapping layer is 0.15mm, and the thickness of the polyimide film reinforced small-glue mica tape wrapping layer is 0.40mm.
The preparation method comprises the following steps: the copper conductor is manufactured by first overlapping and wrapping a 0.035mm commercial 6051 polyimide film on an electromagnetic wire wrapping machine, then overlapping and wrapping a 0.09mm commercial JF-5452-1D polyimide film reinforced few-glue mica tape, and winding.
Comparative example 2
The insulated copper flat wire has a bilateral insulation thickness of 0.55mm and is formed by wrapping a polyester film reinforced mica tape with less glue.
The preparation method comprises the following steps: the copper conductor is overlapped and wrapped on an electromagnetic wire wrapping machine to form a 0.07mm commercial JF-5442-1D polyester film reinforced few-glue mica tape, and the tape is rolled.
Comparative example 3:
the only difference from example 2 is that the high thermal conductivity polyester imide paint layer was not contained and the high thermal conductivity polyimide film reinforced low glue mica tape was set to 0.55mm around the cladding.
The invention also tries to prepare a thicker polyimide film reinforced small-glue mica tape with high heat conductivity, for example, 0.13mm, and the polyimide film reinforced small-glue mica tape has the advantages of poor effect and easiness in wrinkling in the wrapping process, and the prepared heat-conducting insulated copper flat wire has poor heat-conducting effect and low breakdown voltage.
Effect example
The testing method comprises the following steps:
breakdown voltage: the test method of GB/T4074.5-2008 winding wire is adopted in part 5: the test method of the electrical properties is carried out.
Thermal conductivity of insulating layer: the thermal conductivity of the electrical insulation material is tested by using a test method of GB/T29313-2012.
Temperature resistance grade: and (3) performing inspection by adopting a test method for measuring the temperature index of the enamelled winding wire in the 7 th part of the test method for the winding wire of GB/T4074.7-2009.
The respective properties of the insulated copper flat wires of examples 1 to 2 and comparative examples 1 to 3 were tested, and the results are shown in table 1.
TABLE 1 comparison of the Properties of insulated copper flat wires of examples 1-2 and comparative examples 1-3
It can be seen that the high-heat-conductivity insulated copper flat wire has higher breakdown voltage, better heat conductivity coefficient and higher temperature resistance level, and when the conventional insulating materials are adopted in comparative example 1 and comparative example 2, the performance can not meet the requirements of a 10kV special high-voltage motor, and the heat conductivity coefficient and the temperature resistance level are relatively poor. In contrast, in comparative example 3, the high heat conductive polyimide film is wrapped, and the heat conductivity of the insulating layer is still significantly lower than that of the embodiment of the invention, although the breakdown voltage and the temperature resistance index meet the technical requirements.
Finally, it should be noted that the above description is only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and that the simple modification and equivalent substitution of the technical solution of the present invention can be made by those skilled in the art without departing from the spirit and scope of the technical solution of the present invention.
Claims (10)
1. The high-heat-conductivity insulating copper flat wire comprises a flat copper conductor and an insulating layer, wherein the insulating layer is sequentially provided with a high-heat-conductivity polyester-imide paint layer and a high-heat-conductivity polyimide film reinforced few-glue mica tape wrapping layer from inside to outside;
the high-heat-conductivity polyester imide paint layer comprises polyester imide wire enamel and high-heat-conductivity filler;
the high-heat-conductivity polyimide film reinforced small-glue mica tape wrapping layer is formed by covering a layer of high-heat-conductivity epoxy adhesive on the polyimide film surface of a polyimide film powder mica tape;
the high-heat-conductivity epoxy adhesive comprises epoxy resin and high-heat-conductivity filler.
2. The heat conductive insulated copper flat wire according to claim 1, wherein the polyesterimide wire enamel is selected from the group consisting of polyesterimide wire enamel with a temperature index of not less than 180 ℃;
the epoxy resin is selected from phenolic epoxy resins with the epoxy equivalent weight of 160-200 g/mol.
3. The thermally conductive and insulated copper flat wire according to claim 2, wherein the polyesterimide wire enamel is selected from at least one of elaas wire enamel 355G, 1760/40, 1760/38.
4. The thermally conductive and electrically insulating copper flat wire according to claim 2, wherein the epoxy resin is at least one selected from F44, F51, 431.
5. The thermally conductive and insulating copper flat wire according to any one of claims 1 to 4, wherein the high thermal conductive filler is at least one selected from the group consisting of aluminum oxide, boron nitride, and aluminum nitride
The average grain diameter of the high heat conduction filler is 80-6000nm;
wherein, in the high heat conduction polyester imine paint coating, the mass ratio of the high heat conduction filler is more than or equal to 10%;
in the high-heat-conductivity epoxy adhesive, the mass ratio of the high-heat-conductivity filler is more than or equal to 50%.
6. The thermally conductive and insulated flat copper wire according to any one of claims 1 to 4, wherein the high thermally conductive and insulated flat copper wire has a double-sided insulation thickness of 0.4 to 0.6mm.
7. The thermally conductive and electrically insulating copper flat wire according to claim 6, wherein the thickness of the high thermal conductivity polyester imide paint layer is 10-30% of the total thickness of the insulating layer.
8. The heat-conducting and insulating copper flat wire according to any one of claims 1 to 4, wherein the high-heat-conducting polyester imide paint layer is coated on the surface of the flat copper conductor in a coating manner;
the high-heat-conductivity polyimide film reinforced small-glue mica tape wrapping layer is formed by wrapping a half-stacked high-heat-conductivity polyimide film reinforced small-glue mica tape with the thickness of 0.06-0.15 mm.
9. The heat-conducting insulated copper flat wire according to claim 8, wherein the high heat-conducting polyimide film reinforced few-glue mica tape is obtained by uniformly coating high heat-conducting epoxy adhesive on the surface of polyimide film powder mica tape, removing solvent and rolling;
wherein the thickness of the polyimide film mica tape is 0.05-0.1mm, and the coating thickness of the high heat conduction epoxy adhesive is 0.01-0.2mm.
10. The heat conductive and insulating copper flat wire according to any one of claims 1 to 4, wherein the high heat conductive polyester imide paint layer is prepared by:
s1: adding the high-heat-conductivity filler into the polyesterimide wire enamel, and uniformly mixing;
s2: grinding and dispersing the mixture obtained in the step S1 to obtain the high-heat-conductivity polyester-imide paint;
s3: coating high-heat-conductivity polyester-imide paint on the surface of the flat copper conductor to form the high-heat-conductivity polyester-imide paint layer;
the high-heat-conductivity epoxy adhesive is prepared by the following steps:
SS1: mixing the epoxy resin and the solvent, adding the high-heat-conductivity filler, and homogenizing and emulsifying to obtain the high-heat-conductivity epoxy adhesive;
the high-heat-conductivity polyimide film reinforced few-glue mica tape is prepared by the following steps:
SSS1: and coating the polyimide film surface of the polyimide film powder mica tape with the high-heat-conductivity epoxy adhesive, removing the solvent, and rolling to obtain the high-heat-conductivity polyimide film reinforced few-glue mica tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310087207.6A CN116313274A (en) | 2023-02-08 | 2023-02-08 | High-heat-conductivity insulating copper flat wire for 10kV high-voltage motor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310087207.6A CN116313274A (en) | 2023-02-08 | 2023-02-08 | High-heat-conductivity insulating copper flat wire for 10kV high-voltage motor and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116313274A true CN116313274A (en) | 2023-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310087207.6A Pending CN116313274A (en) | 2023-02-08 | 2023-02-08 | High-heat-conductivity insulating copper flat wire for 10kV high-voltage motor and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116313274A (en) |
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2023
- 2023-02-08 CN CN202310087207.6A patent/CN116313274A/en active Pending
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