CN116306425A - Multifunctional Chiplet module - Google Patents
Multifunctional Chiplet module Download PDFInfo
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- CN116306425A CN116306425A CN202310250071.6A CN202310250071A CN116306425A CN 116306425 A CN116306425 A CN 116306425A CN 202310250071 A CN202310250071 A CN 202310250071A CN 116306425 A CN116306425 A CN 116306425A
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- chip
- chiplet
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- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000003993 interaction Effects 0.000 claims abstract description 25
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- 230000008054 signal transmission Effects 0.000 claims description 5
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- 238000006243 chemical reaction Methods 0.000 claims description 3
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- 238000011161 development Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
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- 238000004891 communication Methods 0.000 description 2
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- 238000013468 resource allocation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
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- 239000002184 metal Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/337—Design optimisation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a multifunctional Chiplet module, which is used for completing different kinds of chips and comprises the following components: an organic substrate; the chip is connected to the organic substrate through the expansion slot positions by connecting wires; a microprocessor module; an interaction module; the programmable path selection module comprises a switch controller and a path selection circuit; the plurality of transceiving internet modules comprise circuit connection interfaces, a plurality of module connection interfaces and a switch matrix. The circuit connection interface is used for being connected with the programmable path selection module; the module connecting interface is used for connecting the chiplet module; a plurality of sets of physical interfaces; a storage module; and a power supply module. The invention realizes the generalization and modularization scheme of the chiplet module, has multifunctional use, and in addition, the invention is convenient for the rapid deployment of the system, and shortens the development period and the cost.
Description
Technical Field
The invention relates to the field of integrated circuit design, in particular to a multifunctional Chiplet module.
Background
The development of moore's law has reached the latter molar age over decades, and the cost of continuing to develop moore's law has been far greater than that of finding new alternatives. Thus, the concept of chiplet is proposed, by means of heterogeneous integrated system schemes, different components can be chip designed and implemented on separate dies, where different dies can be manufactured by selecting different process nodes. For example, some chips unsuitable for advanced process fabrication can be manufactured by one-step-less technology, thereby reducing cost. Finally, the components realize data transmission among the components by adopting a multi-chip interconnection mode on a low-cost substrate. chiplet can bring several benefits, most directly shortening the design cycle and reducing the cost. Hardware multiplexing can also be achieved on an organic substrate by a multichip encapsulation technique.
The existing chiplet package integration technical scheme is as follows:
the passive interposer of the silicon substrate is provided with Through Silicon Vias (TSVs) in the interposer, and interconnection between boards is realized by connecting metal layers on the upper surface and the lower surface of the silicon substrate through the TSVs.
The silicon substrate active interposer, in which some active devices and a network on chip can be integrated, has the disadvantage of no unified interface standard, cannot realize universality and poor configurability.
The existing chiplet scheme mostly adopts an application-specific integration strategy of a chip-architecture, no matter what chiplet scheme is, no general scalable modularized chiplet computing architecture exists. Therefore, when working under a complex working environment, a large number of special integration strategies need to be introduced, so that a large amount of economic consumption is generated, and the labor cost is wasted.
Disclosure of Invention
In order to solve the above problems, the present invention aims to provide a multifunctional Chiplet module, which solves the problems set forth in the above background art.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a multi-functional Chiplet module for completing heterogeneous chips comprising: an organic substrate; the chip is connected to the organic substrate through the expansion slot positions by connecting wires; the microcontroller module is used for processing the instruction; the interaction module is connected with the chiplet module through a connecting wire; the programmable path selection module is integrated in the organic substrate and comprises a switch controller and a path selection circuit; the transceiver interconnection network modules are integrated in the organic substrate, and each transceiver interconnection network module comprises a circuit connection interface, a plurality of module connection interfaces and a switch matrix; the circuit connection interface is used for being connected with the programmable path selection module; the module connecting interface is used for connecting the chiplet module; the switch matrix is used for controlling the selection of the signal transmission channel in the receiving-transmitting internet module; each module is connected with an interface switch matrix; the plurality of groups of physical interfaces are integrated on the organic substrate and connected with the chip through connecting wires for transmitting service data and non-service data; the storage module is used for storing and extracting important information and transmitting data through a physical interface during extraction; and the power supply module is used for providing the working voltage of the chip for the chip module according to different working voltages required by the chip during normal operation.
According to a further improved technical scheme, the number of the expansion slots is 1-3; the expansion slot adopts one or a combination of PCI slot, AGP slot and PCI Express slot.
According to a further improved technical scheme, the interaction module comprises an internal data interaction module and an external data interaction module which are integrated in the organic substrate; the internal data interaction module is used for carrying out interaction on data between chips and between the chips and the modules integrated in the organic substrate; the external data interaction module is used for data interaction between the chip or the organic substrate and the outside.
Further improved technical scheme, the switch controller includes: the route gating device is used for controlling the direction of a signal transmission path in the receiving-transmitting internet module; a path decoding table for storing related data of the transmission path; and a path circuit that completes the change of the transmission path based on a path decoding table.
In a further development, the module connection interface is connected to the switching matrix via a direct connection circuit, a transmitting circuit and a receiving circuit.
In a further improved technical scheme, each direct connection circuit comprises a direct connection wire;
each transmitting circuit comprises a driving circuit and a synchronizing circuit;
each receiving circuit comprises an amplifying circuit, a comparator and a synchronizing circuit.
Further improved technical scheme, still integrate on the organic base plate: and the format conversion module is used for converting the service data and the non-service data into target data packets under the condition that the service data and the non-service data are transmitted through the physical interface.
According to a further improved technical scheme, each group of physical interfaces comprises: a clock type interface and a data type interface.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention realizes the generalization and modularization scheme of the chiplet module, has multifunctional use, and in addition, the invention is convenient for the rapid deployment of the system, and shortens the development period and the cost.
2. The invention can also meet the working modes of different chips by adjusting the working voltage.
3. The invention realizes interconnection among heterogeneous chips, reduces line loss and error rate, and can adjust the connection mode among chips to complete chip communication, so that the resource allocation is more reasonable in specific application.
Drawings
The invention is described in further detail below with reference to the attached drawings and detailed description:
fig. 1 is a schematic block diagram of an organic substrate according to an embodiment of the present invention.
Fig. 2 is a functional block diagram of a programmable path selection module in an embodiment of the invention.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
Please refer to fig. 1-2. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.
Example 1
As shown in fig. 1-2, the present embodiment discloses a multifunctional chip module for completing different kinds of chips, including an organic substrate 1.
A plurality of chiplet modules 2 are integrated on the organic substrate 1. Each chiplet module 2 provides one or more expansion slots 12 through which the chip is connected to the organic substrate by connection lines. Meanwhile, a plurality of expandable slots 5, 6, 8 may also be provided on the organic substrate 1. The combination of the expansion slots and the expandable slots are integrated on the organic substrate 1. The number of the expansion slots is 1-3. The expansion slot 12 is one or a combination of PCI slot, AGP slot and PCI Express slot.
The interaction module 7 is integrated on the organic substrate 1 and is connected with the chiplet module through a connecting wire. The interaction module 7 comprises an internal data interaction module and an external data interaction module, which are integrated in the organic substrate 1. The internal data interaction module is used for interaction between the chips and the modules integrated inside the organic substrate. And the external data interaction module is used for data interaction between the chip or the organic substrate and the outside.
The programmable routing module 4 is integrated within the organic substrate 1. The programmable path selection module 4 comprises a switch controller and a path selection circuit. The switch controller 19 includes a route gate 17, a path decoding table 18, and a path circuit 16. The routing gate 17 is used to control the direction of the transmission path of the signals in the transceiving internet module. The path decoding table 18 is used to hold the relevant data of the transmission path. The path circuit 16 completes the change of the transmission path based on a path decoding table.
And a plurality of transceiver interconnection network modules 3 integrated in the organic substrate. Each of the transceiving internet modules 3 comprises a circuit connection interface, a plurality of module connection interfaces, and a switch matrix. The circuit connection interface is used for being connected with the programmable path selection module. The module connection interface is used for connecting the chiplet module. And the switch matrix is used for controlling the selection of the signal transmission channel in the transceiving interconnection network module, and each module is connected with the interface switch matrix. The module connection interface is connected to the switch matrix via a direct connection circuit, a transmitting circuit and a receiving circuit. Each direct connection circuit comprises a direct connection wire; each transmitting circuit comprises a driving circuit and a synchronizing circuit; each receiving circuit comprises an amplifying circuit, a comparator and a synchronizing circuit.
And the plurality of groups of physical interfaces are integrated on the organic substrate and are connected with the chip through connecting wires. The plurality of sets of physical interfaces are for transmitting traffic data and non-traffic data. Each set of said physical interfaces comprises a clock type interface 11 and a data type interface 10.
And the power supply module 9 is used for providing the working voltage of the chip for the chiplet module according to different working voltages required by the chip in normal operation.
And the organic substrate is also integrated with a format conversion module which is used for converting the business data and the non-business data into target data packets under the condition that the business data and the non-business data are transmitted through the physical interface.
The organic substrate has integrated thereon a memory module 15. The storage module 15 is a display storage module, and is connected with the data type interface through a connecting line. The storage module 15 is used for storing and extracting important information and transmitting data through a physical interface during extraction.
In practical application, according to specific working requirements, a proper chip is selected, a power supply module provides working voltage for the chiplet module according to the selected chip, and a user finishes the change of a signal path through a switch controller in a programmable path selection module, so that the chip participating in the work is further selected.
Example 2
An electronic device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the processor using a multi-function Chiplet module as previously described.
The invention realizes the generalization and modularization scheme of the chiplet module, has multifunctional use, and in addition, the invention is convenient for the rapid deployment of the system, and shortens the development period and the cost.
The invention can also meet the working modes of different chips by adjusting the working voltage.
The invention realizes interconnection among heterogeneous chips, reduces line loss and error rate, and can adjust the connection mode among chips to complete chip communication, so that the resource allocation is more reasonable in specific application.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (8)
1. A multi-functional Chiplet module for completing different types of chips, comprising:
an organic substrate;
the chip is connected to the organic substrate through the expansion slot positions by connecting wires;
the microcontroller module is used for processing the instruction;
the interaction module is connected with the chiplet module through a connecting wire;
the programmable path selection module is integrated in the organic substrate and comprises a switch controller and a path selection circuit;
the transceiver interconnection network modules are integrated in the organic substrate, and each transceiver interconnection network module comprises a circuit connection interface, a plurality of module connection interfaces and a switch matrix; the circuit connection interface is used for being connected with the programmable path selection module;
the module connecting interface is used for connecting the chiplet module;
the switch matrix is used for controlling the selection of the signal transmission channel in the receiving-transmitting internet module; each module is connected with an interface switch matrix;
the plurality of groups of physical interfaces are integrated on the organic substrate and connected with the chip through connecting wires for transmitting service data and non-service data;
the storage module is used for storing and extracting important information and transmitting data through a physical interface during extraction;
and the power supply module is used for providing the working voltage of the chip for the chip module according to different working voltages required by the chip during normal operation.
2. The multifunctional chip module according to claim 1, wherein the number of the expansion slots is 1-3; the expansion slot adopts one or a combination of PCI slot, AGP slot and PCI Express slot.
3. The multifunctional chip module of claim 2, wherein the interaction module comprises an internal data interaction module and an external data interaction module, both integrated within the organic substrate;
the internal data interaction module is used for carrying out interaction on data between chips and between the chips and the modules integrated in the organic substrate;
the external data interaction module is used for data interaction between the chip or the organic substrate and the outside.
4. A multi-function Chiplet module as claimed in claim 3 wherein the switch controller includes:
the route gating device is used for controlling the direction of a signal transmission path in the receiving-transmitting internet module;
a path decoding table for storing related data of the transmission path;
and a path circuit that completes the change of the transmission path based on a path decoding table.
5. The multifunctional chip module of claim 4, wherein the module connection interface is connected to the switch matrix through a direct connection circuit, a transmitting circuit and a receiving circuit.
6. The multifunctional chip module of claim 5, wherein each of said direct-connect circuits comprises a direct-connect wire;
each transmitting circuit comprises a driving circuit and a synchronizing circuit;
each receiving circuit comprises an amplifying circuit, a comparator and a synchronizing circuit.
7. The multifunctional chip module of claim 6, wherein the organic substrate further comprises integrated thereon:
and the format conversion module is used for converting the service data and the non-service data into target data packets under the condition that the service data and the non-service data are transmitted through the physical interface.
8. The multi-purpose chip module of claim 7, wherein each set of said physical interfaces comprises: a clock type interface and a data type interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310250071.6A CN116306425A (en) | 2023-03-13 | 2023-03-13 | Multifunctional Chiplet module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310250071.6A CN116306425A (en) | 2023-03-13 | 2023-03-13 | Multifunctional Chiplet module |
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| Publication Number | Publication Date |
|---|---|
| CN116306425A true CN116306425A (en) | 2023-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310250071.6A Pending CN116306425A (en) | 2023-03-13 | 2023-03-13 | Multifunctional Chiplet module |
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| Country | Link |
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| CN (1) | CN116306425A (en) |
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- 2023-03-13 CN CN202310250071.6A patent/CN116306425A/en active Pending
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