CN116300219A - Display panel, display device and manufacturing method of frame sealing adhesive component - Google Patents

Abstract

The application provides a display panel, the display panel includes the display region and encloses the non-display region of locating the display region week side. The display panel further comprises an array substrate, a frame sealing glue assembly and a color film substrate which are arranged in a stacked mode, wherein the frame sealing glue assembly is located in the non-display area and comprises frame sealing glue and a plurality of photo-thermal elements dispersed in the frame sealing glue. When the array substrate and the color film substrate are paired, the frame sealing glue is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element heats under the irradiation of ultraviolet light so as to thermally cure the frame sealing glue at the same time. Therefore, the technical scheme of the application simultaneously carries out pre-curing and thermal curing on the frame sealing glue, simplifies the process, quickens the curing speed of the frame sealing glue, further avoids the pollution of liquid crystal molecules caused by incomplete pre-curing of the frame sealing glue, and improves the reliability of the display panel. The application also provides a display device and a manufacturing method of the frame sealing adhesive assembly.

Description

Display panel, display device and manufacturing method of frame sealing adhesive component

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a display device having the display panel, and a method for manufacturing a sealant assembly.

Background

The liquid crystal display has been widely used in the display field because of its advantages of thin body, low power consumption, low price, etc. The liquid crystal display generally comprises a display panel and a backlight module, wherein the display panel comprises a color film substrate, an array substrate, liquid crystal and frame sealing glue. The frame sealing glue is used for sealing the liquid crystal between the color film substrate and the array substrate and bonding the color film substrate and the array substrate. After the frame sealing glue is coated, an Ultraviolet (UV) photo-pre-curing process and a high-temperature heat curing process are generally required to sequentially perform the frame sealing glue so as to gel and fix the frame.

In the prior art, as the area where the frame sealing glue is arranged is provided with dense signal wires, partial UV light can be blocked from irradiating the frame sealing glue, so that the frame sealing glue is not completely pre-cured, and the color film substrate and the array substrate are separated. In addition, the frame sealing glue with incomplete pre-curing is easy to mix with the diffused liquid crystal, so that the liquid crystal is polluted, and the display defect occurs at the periphery of the display panel.

Therefore, how to solve the problem that the pre-curing of the frame sealing glue is not completely needed to be solved by the person skilled in the art in the prior art is needed.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, an object of the present application is to provide a display panel, a display device having the display panel, and a method for manufacturing a sealant assembly, which are aimed at solving the problem of incomplete pre-curing of sealant in the prior art.

In order to solve the above technical problems, an embodiment of the present application provides a display panel, which includes a display area and a non-display area surrounding the display area. The display panel further comprises an array substrate, a frame sealing glue assembly and a color film substrate which are arranged in a stacked mode, wherein the frame sealing glue assembly is located in the non-display area, and the frame sealing glue assembly comprises frame sealing glue and a plurality of photo-thermal elements dispersed in the frame sealing glue. When the array substrate and the color film substrate are paired, the frame sealing glue is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element heats under the irradiation of ultraviolet light so as to thermally cure the frame sealing glue at the same time.

In summary, in the display panel provided by the embodiment of the present application, when the array substrate and the color film substrate are aligned, the frame sealing glue is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element heats under the irradiation of ultraviolet light, so as to thermally cure the frame sealing glue. According to the technical scheme, the frame sealing glue is pre-cured and thermally cured at the same time, so that the process is simplified, the curing speed of the frame sealing glue is accelerated, and further the problem that the liquid crystal molecules are polluted due to incomplete pre-curing of the frame sealing glue is avoided. Moreover, when the frame sealing glue is thermally cured, the region with the raised temperature is only the region where the frame sealing glue component is located, and the whole display panel is not required to be heated at high temperature, so that the failure of the liquid crystal molecules at high temperature is avoided, and the display effect and the reliability of the display panel are further improved.

In an exemplary embodiment, the frame sealing glue assembly further includes a plurality of support elements dispersed in the frame sealing glue, the support elements being configured to maintain a spacing between the array substrate and the color film substrate in the non-display area.

In an exemplary embodiment, the photo-thermal element includes a photo-thermal layer that generates heat under irradiation of ultraviolet light and a support disposed in the photo-thermal layer, the support being configured to maintain a space between the array substrate and the color film substrate in the non-display region.

In an exemplary embodiment, the doping ratio of the photo-thermal element is 15% to 25%.

In an exemplary embodiment, the material of the photo-thermal element includes one or more of metal nanoparticles, synthetic graphene, graphite-phase sodium nitride nanomaterials, titanium dioxide, and titanium oxide.

In an exemplary embodiment, the array substrate includes a first substrate and a plurality of conductive elements, the first substrate is disposed on a side of the frame sealing glue assembly opposite to the color film substrate and spaced apart from the frame sealing glue assembly, and the plurality of conductive elements are disposed on a side of the first substrate opposite to the frame sealing glue assembly and located in the non-display area. The color film substrate comprises a second substrate and a shading layer, the second substrate is arranged on one side of the frame sealing glue component, which is opposite to the array substrate, and is spaced from the frame sealing glue component, and the shading layer is arranged on one side of the second substrate, which faces the frame sealing glue component, and is positioned in the non-display area.

In an exemplary embodiment, the orthographic projection of the plurality of conductive elements on the first substrate is offset from the orthographic projection of the light shielding layer on the first substrate.

In an exemplary embodiment, the orthographic projection of a plurality of the conductive elements on the first substrate is connected with the orthographic projection of the light shielding layer on the first substrate.

Based on the same inventive concept, the embodiment of the application also provides a display device, which comprises a backlight module and the display panel, wherein the display panel is arranged on the light emitting side of the backlight module.

In summary, the display device provided in the embodiment of the application includes a backlight module and a display panel, where the display panel is when the array substrate and the color film substrate are aligned to each other, the frame sealing glue is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element heats under the irradiation of ultraviolet light, so as to thermally cure the frame sealing glue. According to the technical scheme, the frame sealing glue is pre-cured and thermally cured at the same time, so that the process is simplified, the curing speed of the frame sealing glue is accelerated, and further the problem that the liquid crystal molecules are polluted due to incomplete pre-curing of the frame sealing glue is avoided. Moreover, when the frame sealing glue is thermally cured, the region with the raised temperature is only the region where the frame sealing glue component is located, and the whole display panel is not required to be heated at high temperature, so that the failure of the liquid crystal molecules at high temperature is avoided, and the display effect and the reliability of the display panel are further improved.

Based on the same inventive concept, the embodiment of the application also provides a method for manufacturing a frame sealing adhesive assembly, which is used for manufacturing the frame sealing adhesive assembly of the display panel, and the method for manufacturing the frame sealing adhesive assembly comprises the following steps:

providing frame sealing glue;

adding a plurality of photo-thermal elements into the frame sealing glue;

and stirring the frame sealing glue and a plurality of photo-thermal elements dispersed in the frame sealing glue to form a frame sealing glue assembly.

In summary, the method for manufacturing the frame sealing glue component provided by the embodiment of the application is used for forming the frame sealing glue component, and the frame sealing glue component can be pre-cured and thermally cured at the same time, so that the manufacturing process is simplified, the curing speed of the frame sealing glue is accelerated, and further pollution of the liquid crystal molecules caused by incomplete pre-curing of the frame sealing glue is avoided. Moreover, when the frame sealing glue is thermally cured, the region with the raised temperature is only the region where the frame sealing glue component is located, and the whole display panel is not required to be heated at high temperature, so that the failure of the liquid crystal molecules at high temperature is avoided, and the display effect and the reliability of the display panel are further improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic layer structure of a display device according to a first embodiment of the present disclosure;

fig. 2 is a schematic front view of a display panel according to a second embodiment of the present disclosure;

fig. 3 is a schematic view of a first layer structure of a display panel according to a second embodiment of the present disclosure;

FIG. 4 is a schematic diagram showing the effect of doping ratio on curing rate of the photo-thermal element according to the embodiment of the present application;

FIG. 5 is a schematic plan view of a light shielding layer of the display panel shown in FIG. 3;

fig. 6 is a schematic view of a second layer structure of a display panel according to a second embodiment of the present disclosure;

FIG. 7 is a schematic view illustrating an internal structure of a photo-thermal element of the display panel shown in FIG. 6;

fig. 8 is a flow chart of a method for manufacturing a frame sealing adhesive assembly according to a third embodiment of the present disclosure.

Reference numerals illustrate:

1-a display area; 2-a non-display area; 10-a display panel; 10 a-a display panel; 11-an array substrate;

13-a liquid crystal layer; 15-a color film substrate; 17-a frame sealing adhesive assembly; 30-a backlight module; 100-a display device;

111-a first substrate; 113-a driving circuit layer; 115-conductive elements; 117-insulating layer; 118-pixel electrode; 131-liquid crystal molecules; 151-a second substrate; 153-black matrix layer; 154-a light-shielding layer; 154 a-light entrance aperture; 155-first color resistance; 156-a second color resistance; 157-third color resistance; 158-a planar layer; 159-a common electrode layer; 171-frame sealing glue; 173-a photothermal element; 173 a-a photothermal layer; 173 b-a support; 175-a support member; S110-S130-frame sealing glue assembly manufacturing method.

Detailed Description

In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Preferred embodiments of the present application are shown in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "coupled" and "connected," as used herein, are intended to encompass both direct and indirect coupling (coupling), unless otherwise indicated. Directional terms referred to in this application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are merely directions referring to the attached drawings, and thus, directional terms are used for better, more clear description and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context. It should be noted that the terms "first," "second," and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprises," "comprising," "includes," "including," "may be" or "including" as used in this application mean the presence of the corresponding function, operation, element, etc. disclosed, but not limited to other one or more additional functions, operations, elements, etc. Furthermore, the terms "comprises" or "comprising" mean that there is a corresponding feature, number, step, operation, element, component, or combination thereof disclosed in the specification, and that there is no intention to exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof. It will also be understood that the meaning of "at least one" as described herein is one and more, such as one, two or three, etc., and the meaning of "a plurality" is at least two, such as two or three, etc., unless specifically defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Referring to fig. 1, fig. 1 is a schematic layer structure of a display device according to a first embodiment of the present disclosure. In this embodiment, the display device 100 may include a display panel 10 and a backlight module 30 that are stacked, where the display panel 10 is disposed on a light emitting side of the backlight module 30, and the display panel 10 is configured to display an image under a backlight provided by the backlight module 30.

In the embodiment of the present application, the backlight module 30 may be an edge-lit backlight module or a direct-lit backlight module, which is not particularly limited in the present application.

It is understood that the display device 100 may be used in electronic devices including, but not limited to, tablet computers, notebook computers, desktop computers, mobile phones, in-vehicle displays, and the like. According to the embodiment of the present invention, the specific type of the display device 100 is not particularly limited, and a person skilled in the art can correspondingly design according to the specific use requirement of the display device 100, which is not described herein.

In an exemplary embodiment, the display device 100 may further include other necessary components and constituent parts such as a driving board, a power board, a high-voltage board, and a key control board, which may be correspondingly supplemented by those skilled in the art according to the specific type and actual function of the display device 100, and will not be described herein.

Referring to fig. 2, fig. 2 is a schematic front view of a display panel according to a second embodiment of the present disclosure. In this embodiment, the display panel 10 includes a display area 1 and a non-display area 2 surrounding the display area 1. The display area 1 is used for performing image display, and the non-display area 2 is used for setting other auxiliary display components or modules and signal lines.

In this embodiment, referring to fig. 3, fig. 3 is a schematic view of a first layer structure of a display panel according to a second embodiment of the present application. The display panel 10 includes an array substrate 11, a liquid crystal layer 13, and a color film substrate 15 stacked in order. That is, the array substrate 11 is opposite to the color film substrate 15 and is disposed at a distance, and the liquid crystal layer 13 is disposed between the array substrate 11 and the color film substrate 15. The liquid crystal layer 13 is located in the display area 1, and the liquid crystal layer 13 includes a plurality of liquid crystal molecules 131, the array substrate 11 and the color film substrate 15 are used for forming a preset electric field, and the preset electric field drives the liquid crystal molecules 131 to deflect so as to control the transmittance of the liquid crystal layer 13, so that the display panel 10 displays different gray scales.

In this embodiment, the display panel 10 further includes a sealant assembly 17 disposed in the non-display area 2, where the sealant assembly 17 is disposed between the array substrate 11 and the color film substrate 15 and is disposed on a peripheral side of the liquid crystal layer 13, so as to seal the liquid crystal layer 13 between the array substrate 11 and the color film substrate 15. The frame sealing assembly 17 includes a frame sealing 171 and a plurality of photo-thermal elements 173 dispersed in the frame sealing 171. When the array substrate 11 and the color film substrate 15 are paired, the frame sealing glue 171 is pre-cured under the irradiation of Ultraviolet (UV) light, and the photo-thermal element 173 heats under the irradiation of UV light, so as to thermally cure the frame sealing glue 171 at the same time, and further increase the hardness of the frame sealing glue 171. Wherein, the pair box means: and aligning the array substrate 11 with the color film substrate 15, and adhering the array substrate 11 with the color film substrate 15 through the frame sealing adhesive assembly 17. The pre-curing means: the liquid seal 171 is UV light-cured under ultraviolet irradiation to become the solid seal 171. It is understood that the hardness of the frame sealing glue 171 when pre-cured is less than the hardness of the frame sealing glue 171 when thermally cured.

In the related art, when the array substrate and the color film substrate are aligned, the liquid crystal molecules diffusing to the periphery can quickly contact with the liquid frame sealing glue, and the liquid crystal molecules can be mixed with the liquid frame sealing glue, so that the liquid crystal molecules are polluted. Therefore, the frame sealing glue is usually pre-cured to avoid mixing of the liquid crystal molecules and the frame sealing glue, and then the frame sealing glue is heated and cured at high temperature to bond the array substrate and the color film substrate.

It can be understood that in the prior art, due to insufficient light quantity of the UV light, the frame sealing glue is not completely pre-cured, and the color film substrate and the array substrate are easily separated; in addition, when the pre-cured incomplete frame sealing glue is conveyed to a heat curing station, the diffused liquid crystal can be mixed with the frame sealing glue, so that the liquid crystal is polluted; meanwhile, the whole display panel needs to be heated at high temperature by heat curing, and liquid crystal can reach a phase change node at high temperature to fail. The technical scheme of the application can simultaneously perform pre-curing and thermal curing on the frame sealing glue 171, so that the manufacturing process of the display panel 10 is simplified, and the cost is saved; in addition, the simultaneous pre-curing and thermal curing accelerates the curing speed of the frame sealing glue 171, and when the liquid crystal molecules 131 do not contact the frame sealing glue 171, the frame sealing glue 171 is cured, so that the frame sealing glue 171 is prevented from being mixed with the liquid crystal molecules 131, and the liquid crystal molecules 131 are prevented from being polluted, so that poor display of the periphery of the display panel 10 is prevented. In addition, the heating of the photo-thermal element 173 only increases the temperature of the region where the frame sealing glue assembly 17 is located, but does not increase the temperature of the entire display panel 10, so that the liquid crystal molecules 131 do not fail, and the display effect of the display panel 10 is prevented from being reduced.

In an exemplary embodiment, the photo-thermal element 173 generates heat under irradiation of ultraviolet light, which is a photo-thermal effect (Photothermal Effect, PTT). Photo-thermal effect: after the material is irradiated by light, photon energy interacts with crystal lattices of the material, and the crystal lattices vibrate, so that the temperature of the material is increased.

In an exemplary embodiment, the material of the frame sealing adhesive 171 includes, but is not limited to, epoxy Resin (Epoxy Resin) that functions as a Cross-linking layer by being irradiated with ultraviolet light, and heat-cured single crystal Resin (Single Liquid Resin) and Phenol Resin (Phenol Resin), etc. The material of the photo-thermal element 173 includes one or more of metal nanoparticles, synthetic graphene, graphite-phase sodium nitride nanomaterial, titanium dioxide, titanium oxide, and the like.

In summary, in the display panel 10 provided in the embodiment of the present disclosure, when the array substrate 11 and the color film substrate 15 are paired, the frame sealing adhesive 171 is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element 173 generates heat under the irradiation of ultraviolet light, so as to thermally cure the frame sealing adhesive 171. According to the technical scheme, the frame sealing glue 171 is pre-cured and thermally cured at the same time, so that the process is simplified, the curing speed of the frame sealing glue 171 is increased, and further the pollution of the liquid crystal molecules 131 caused by incomplete curing of the frame sealing glue 171 is avoided. Moreover, when the sealant 171 is thermally cured, the region where the temperature is raised is only the region where the sealant assembly 17 is located, and no high-temperature heating is required for the entire display panel 10, so that the liquid crystal molecules 131 are prevented from being deactivated at a high temperature, and the display effect and reliability of the display panel 10 are improved.

As shown in fig. 3, in the embodiment of the present application, the frame sealing glue assembly 17 further includes a plurality of supporting elements 175 dispersed in the frame sealing glue 171, where the supporting elements 175 are used to maintain the thickness of the periphery of the display panel 10, that is, the supporting elements 175 are used to maintain the spacing between the array substrate 11 and the color film substrate 15 in the non-display area 2.

It can be understood that when the array substrate 11 and the color film substrate 15 are paired, the area where the frame sealing glue 171 is located (i.e. the periphery of the display panel 10) is prone to have uneven thickness, which results in poor display of the display panel 10. Accordingly, the thickness of the region where the frame sealing compound 171 is located is ensured to be uniform by disposing the supporting member 175 in the frame sealing compound 171.

It is further understood that, because the hardness of the photo-thermal element 173 is smaller, the photo-thermal element 173 cannot support between the array substrate 11 and the color film substrate 15, and therefore the supporting element 175 needs to be disposed in the frame sealing glue 171 to support the array substrate 11 and the color film substrate 15.

In an exemplary embodiment, the overall shape of the support element 175 may be spherical. The material of the supporting element 175 may be fiberglass, silicon, plastic, or the like.

In an exemplary embodiment, the size of the supporting element 175 is larger than the size of the photo-thermal element 173, so that the support is realized between the array substrate 11 and the color film substrate 15.

In the embodiment of the present application, the doping ratio of the photo-thermal element 173 is 15% to 25%, for example, 15%, 16%, 19%, 20%, 22%, 25%, or other values, which are not particularly limited in the present application. The doping ratio of the photo-thermal element 173 refers to: the weight ratio of the photo-thermal element 173 to the frame sealing adhesive 171.

In order to verify the effect of the doping ratio of the photo-thermal element 173 on the curing rate of the frame sealing glue 171, the photo-thermal element 173 with a diameter of 4um is subjected to experimental verification test. Referring to fig. 4 and table 1, fig. 4 is a schematic diagram illustrating an effect of a doping ratio of a photo-thermal device on a curing rate according to an embodiment of the present disclosure, and table 1 is an effect of a doping ratio of a photo-thermal device on a curing rate. As can be seen from fig. 4 and table 1, when the doping ratio of the photo-thermal element 173 is at least 15%, the curing rate of the frame sealing adhesive 171 is higher; when the doping ratio of the photo-thermal element 173 is 25% to 35%, the curing rate of the frame sealing compound 171 is not substantially increased and is maintained at a higher value, but as the doping ratio of the photo-thermal element 173 is increased, the cost of forming the frame sealing compound 171 is increased. Therefore, the doping ratio of the photo-thermal element 173 is set to 15% to 25% in consideration of the curing rate and cost. Wherein, the curing rate= (enthalpy value of liquid frame sealing glue-enthalpy value of frame sealing glue after curing)/enthalpy value of liquid frame sealing glue x 100%, wherein, the enthalpy value represents heat.

TABLE 1 influence of doping ratio of photo-thermal element on curing Rate

Doping ratio

0.5％

1％

1.5％

5％

10％

15％

20％

25％

30％

35％

Cure rate

0.09％

2.14％

25.1％

46.9％

65.3％

93.2％

97.8％

98.9％

98.9％

98.9％

In an exemplary embodiment, the overall shape of the photo-thermal element 173 may be spherical. The diameter of the photo-thermal element 173 is 1um to 10um, for example, 1um, 3um, 4um, 5um, 6um, 8um, 10um, or other values, which are not particularly limited in this application.

In the embodiment of the present application, referring to fig. 3, the array substrate 11 includes a first substrate 111, a driving circuit layer 113, and a plurality of conductive elements 115. The first substrate 111 is disposed on a side of the frame sealing assembly 17 opposite to the color film substrate 15, and is located in the display area 1 and the non-display area 2, and is spaced apart from the frame sealing assembly 17. The driving circuit layer 113 is disposed on a side of the first substrate 111 facing the liquid crystal layer 13 and is located in the display area 1, the plurality of conductive elements 115 are disposed at intervals on a side of the first substrate 111 facing the frame sealing component 17 and is located in the non-display area 2, the conductive elements 115 may directly contact with the driving circuit layer 113 to be electrically connected or may be electrically connected with the driving circuit layer 113 through wires, and the conductive elements 115 are used for transmitting electrical signals to the driving circuit layer 113.

In an exemplary embodiment, the array substrate 11 further includes an insulating layer 117, the insulating layer 117 covers the plurality of conductive elements 115 and the driving circuit layer 113 on the first substrate 111, and the liquid crystal layer 13 is located between the insulating layer 117 and the color film substrate 15. The insulating layer 117 is used for insulating the driving circuit layer 113 from the liquid crystal layer 13 and insulating the plurality of conductive elements 115 from the frame sealing assembly 17.

In an exemplary embodiment, the array substrate 11 further includes a plurality of pixel electrodes 118, and the plurality of pixel electrodes 118 are distributed on a side of the insulating layer 117 opposite to the driving circuit layer 113 and located in the display area 1. The driving circuit layer 113 is electrically connected to the plurality of pixel electrodes 118 to control the potential of the pixel electrodes 118.

In an exemplary embodiment, the driving circuit layer 113 may control the electric potentials of the plurality of pixel electrodes 118 by Passive driving (PM) or Active driving (AM). Wherein passive driving refers to: the driving circuit layer 113 directly applies a pulse current to the pixel electrode 118; active driving refers to: the driving circuit layer 113 is provided with a thin film transistor having a switching function and a capacitor storing electric charges for each of the pixel electrodes 118.

In an exemplary embodiment, the insulating layer 117 is provided with a plurality of vias (not shown) penetrating the insulating layer 117, and a connector (not shown) is disposed in the vias. The connection members are connected to the pixel electrode 118 and the driving circuit layer 113, respectively, to electrically connect the pixel electrode 118 and the driving circuit layer 113.

In the embodiment of the present application, referring to fig. 3, the color film substrate 15 includes a second substrate 151, a black matrix layer 153, and a light shielding layer 154. The second substrate 151 is disposed on a side of the frame sealing assembly 17 opposite to the array substrate 11, and is located in the display area 1 and the non-display area 2, and is spaced apart from the frame sealing assembly 17. The black matrix layer 153 is disposed on a side of the second substrate 151 facing the liquid crystal layer 13 and is located in the display area 1, and the light shielding layer 154 is disposed on a side of the second substrate 151 facing the sealant 17 and is located in the non-display area 2. The light shielding layer 154 is used for shielding light to prevent the display panel 10 from bright edges.

In the embodiment of the present application, the orthographic projection of the plurality of conductive elements 115 on the first substrate 111 is offset from the orthographic projection of the light shielding layer 154 on the first substrate 111, that is, the orthographic projection of the plurality of conductive elements 115 on the first substrate 111 does not overlap with the orthographic projection of the light shielding layer 154 on the first substrate 111. Further, the front projection of the plurality of conductive elements 115 on the first substrate 111 is connected with the front projection of the light shielding layer 154 on the first substrate 111, that is, there is no gap between the front projection of the plurality of conductive elements 115 on the first substrate 111 and the front projection of the light shielding layer 154 on the first substrate 111, that is, the front projection of the conductive elements 115 on the first substrate 111 and the front projection of the light shielding layer 154 on the first substrate 111 form a complementary area on the non-display area 2 and cover the whole area where the non-display area 2 is located.

It is understood that, to increase the curing rate of the frame sealing glue 171, the ultraviolet light irradiates the frame sealing glue assembly 17 from the side of the array substrate 11 and the side of the color film substrate 15, i.e. the side of the frame sealing glue assembly 17 facing the array substrate 11 and the side facing the color film substrate 15 receive the ultraviolet light. The material of the conductive element 115 may be metal, which may be light-shielding. If the front projection of the plurality of conductive elements 115 on the first substrate 111 coincides with the front projection of the light shielding layer 154 on the first substrate 111 or partially coincides with the front projection, at least a part of the sealant 17 cannot be irradiated by ultraviolet light, that is, a part of the sealant 17 cannot be irradiated by ultraviolet light from the side of the array substrate 11 or ultraviolet light from the side of the color film substrate 15, resulting in a lower curing rate of the sealant 171. Therefore, the front projection of the plurality of conductive elements 115 on the first substrate 111 is not overlapped with the front projection of the light shielding layer 154 on the first substrate 111, so that the whole frame sealing assembly 17 can be irradiated by ultraviolet light, that is, part of the frame sealing assembly 17 is irradiated by ultraviolet light entering from one side of the array substrate 11, and the other part of the frame sealing assembly 17 is irradiated by ultraviolet light entering from one side of the color film substrate 15, thereby improving the curing rate of the frame sealing 171. Meanwhile, in order to avoid bright edges of the display panel 10, a plurality of conductive elements 115 are disposed without gaps between the front projection of the conductive elements on the first substrate 111 and the front projection of the light shielding layer 154 on the first substrate 111, so as to shield the backlight provided by the backlight module 30.

In an exemplary embodiment, please refer to fig. 3 and fig. 5 together, fig. 5 is a schematic plan view of a light shielding layer of the display panel shown in fig. 3. The light shielding layer 154 is provided with a plurality of light incident holes 154a penetrating the light shielding layer 154. The positions of the light entrance holes 154a correspond to the positions of the conductive elements 115, that is, the orthographic projections of the light entrance holes 154a on the first substrate 111 coincide with the orthographic projections of the conductive elements 115 on the first substrate 111, so that ultraviolet light can be irradiated to the frame sealing assembly 17 through the light entrance holes 154a. The orthographic projection of the plurality of regions of the conductive element 115 on the first substrate 111 coincides with the orthographic projection of the light shielding layer 154 on the first substrate 111. By the above technical scheme, the whole frame sealing glue assembly 17 can be irradiated by ultraviolet light, and bright edges of the display panel 10 can be avoided.

In an exemplary embodiment, the light entrance aperture 154a may be a circular aperture or a polygonal aperture. For example, the light entrance aperture 154a is a rectangular aperture, and the side length thereof may be 3um. The distance between the outermost light entrance hole 154a and the outer surface of the frame sealing glue 171 is at least 5um.

In an exemplary embodiment, the color film substrate 15 further includes a plurality of first color resists 155, a plurality of second color resists 156, and a plurality of third color resists 157. The first color resistors 155, the second color resistors 156 and the third color resistors 157 are disposed on a side of the second substrate 151 facing the liquid crystal layer 13 and in the display area 1. The first color resistors 155, the second color resistors 156 and the third color resistors 157 may be alternately arranged in sequence. That is, the plurality of first color resists 155, the plurality of second color resists 156, and the plurality of third color resists 157 may be as follows: the first color resistor 155, the second color resistor 156, the third color resistor 157, the first color resistor 155, the second color resistor 156, the third color resistors 157, … …, the first color resistor 155, the second color resistor 156 and the third color resistor 157 are arranged in a mode, and adjacent color resistors are arranged at intervals. The black matrix layer 153 is disposed between adjacent color resistors, that is, the black matrix layer 153 is disposed between the first color resistor 155 and the second color resistor 156, the black matrix layer 153 is disposed between the second color resistor 156 and the third color resistor 157, and the black matrix layer 153 is disposed between the third color resistor 157 and the first color resistor 155.

In an exemplary embodiment, the first color resistor 155 is used to convert the backlight to a first color light, the second color resistor 156 is used to convert the backlight to a second color light, and the third color resistor 157 is used to convert the backlight to a third color light. The black matrix layer 153 is used to avoid color crosstalk between adjacent color resistors, i.e., the black matrix layer 153 may be used to avoid color crosstalk between the first color resistor 155, the second color resistor 156, and the third color resistor 157.

In an exemplary embodiment, the backlight may be white light, the first color resist 155 may be red color resist, the second color resist 156 may be green color resist, and the third color resist 157 may be blue color resist. Accordingly, the first color light may be red light, the second color light may be green light, and the third color light may be blue light, so as to realize full-color display.

In an exemplary embodiment, the black matrix layer 153 and the light shielding layer 154 may be integrally formed.

As shown in fig. 3, in the embodiment of the present application, the color film substrate 15 further includes a flat layer 158, where the flat layer 158 is disposed on a side of the black matrix layer 153 facing away from the second substrate 151 and a side of the light shielding layer 154 facing away from the second substrate 151, and is located in the display area 1 and the non-display area 2. That is, the flat layer 158 covers the black matrix layer 153, the light shielding layer 154, the plurality of first color resists 155, the plurality of second color resists 156, and the plurality of third color resists 157 on the second substrate 151. The flat layer 158 is also filled in the light entrance aperture 154 a. The planarization layer 158 is used for planarizing the surface of the color film substrate 15 facing the liquid crystal layer 13 and the frame sealing glue assembly 17.

In an exemplary embodiment, the frame sealing glue assembly 17 is connected between the flat layer 158 and the insulating layer 117.

In this embodiment, the color filter substrate 15 further includes a common electrode layer 159, where the common electrode layer 159 is disposed on a side of the flat layer 158 opposite to the black matrix layer 153 and is located in the display area 1, and the common electrode layer 159 and the plurality of pixel electrodes 118 form the preset electric field.

In an exemplary embodiment, the display panel 10 may be a display panel of a vertical alignment mode (Vertical Alignment, VA). In other embodiments, the display panel 10 may be an In-Plane Switching (IPS) display panel or a fringe field Switching (Fringe Field Switching, FFS) display panel, i.e., the common electrode layer 159 is disposed on the same side as the pixel electrode 118. The display mode of the display panel 10 is not particularly limited in this application.

The application further provides a second display panel, please refer to fig. 6, fig. 6 is a schematic diagram of a second layer structure of the display panel disclosed in the second embodiment of the application. The display panel 10a of the second structure is different from the display panel 10 of the first structure in that: the sealant assembly 17 of the display panel 10a of the second structure does not include the supporting member 175, and the photo-thermal member 173 of the sealant assembly 17 of the display panel 10a of the second structure includes a supporter. For a description of the display panel 10a of the second structure that is the same as the display panel 10 of the first structure, please refer to the related description of the display panel 10 of the first structure, and the description thereof will not be repeated here.

In the embodiment of the application, referring to fig. 7, fig. 7 is a schematic diagram illustrating an internal structure of a photo-thermal element of the display panel shown in fig. 6. The photo-thermal element 173 includes a photo-thermal layer 173a and a support 173b disposed in the photo-thermal layer 173 a. That is, the photo-thermal layer 173a is wrapped on the surface of the support 173b. When the array substrate 11 and the color film substrate 15 are paired, the photo-thermal layer 173a heats under the irradiation of ultraviolet light to thermally cure the frame sealing glue 171, and the support 173b is used for maintaining the thickness of the periphery of the display panel 10, that is, the support 173b is used for maintaining the distance between the array substrate 11 and the color film substrate 15 in the non-display area 2.

It is appreciated that by forming the support 173b within the photo-thermal layer 173a, the sealant assembly 17 may not include the support member 175, thereby simplifying the manufacturing process of the sealant assembly 17. If the supporting elements 175 are dispersed in the frame sealing glue 171, ultraviolet light is blocked, so that the ultraviolet light received by the photo-thermal element 173 is less, and the photo-thermal element 173 is affected to generate heat, thereby affecting the curing rate of the frame sealing glue 171.

In an exemplary embodiment, the material of the photo-thermal layer 173a includes one or more of metal nanoparticles, synthetic graphene, graphite-phase sodium nitride nanomaterial, titanium dioxide, titanium oxide, and the like. The overall shape of the support 173b may be spherical, and the material thereof may be fiberglass, silicon, plastic, or the like.

In an exemplary embodiment, the thickness of the photo-thermal layer 173a may be 0.1 to 3um, for example, 0.1um, 0.4um, 1um, 1.5um, 1.8um, 2um, 2.4um, 3um, or other values, which are not particularly limited in the present application.

In summary, in the display panel 10a provided in the embodiment of the present disclosure, when the array substrate 11 and the color film substrate 15 are paired, the frame sealing adhesive 171 is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element 173 generates heat under the irradiation of ultraviolet light, so as to thermally cure the frame sealing adhesive 171. According to the technical scheme, the frame sealing glue 171 is pre-cured and thermally cured at the same time, so that the process is simplified, the curing speed of the frame sealing glue 171 is increased, and further the pollution of the liquid crystal molecules 131 caused by incomplete pre-curing of the frame sealing glue 171 is avoided. Moreover, when the sealant 171 is thermally cured, the region where the temperature is raised is only the region where the sealant assembly 17 is located, and the entire display panel 10a is not required to be heated at a high temperature, so that the liquid crystal molecules 131 are prevented from being deactivated at a high temperature, and the display effect and reliability of the display panel 10 are improved.

Based on the same inventive concept, a third embodiment of the present application provides a method for manufacturing a frame sealing assembly 17 shown in fig. 3 to 6. For the relevant content of the frame sealing assembly 17 related to the manufacturing method of the frame sealing assembly provided in the third embodiment of the present application, please refer to the relevant description of the frame sealing assembly 17 of the second embodiment, and the description is omitted herein. Referring to fig. 8, fig. 8 is a flow chart of a method for manufacturing a frame sealing adhesive assembly according to a third embodiment of the present disclosure, where the method for manufacturing a frame sealing adhesive assembly may include the following steps.

S110, providing a frame sealing adhesive 171.

Specifically, in the embodiment of the application, a cold-sealed frame sealing adhesive is prepared, the cold-sealed frame sealing adhesive 171 is thawed in a room temperature environment, and the thawed frame sealing adhesive 171 is filled into a rubber tube.

S120, adding a plurality of photo-thermal elements 173 into the frame sealing glue 171.

Specifically, in the embodiment of the present application, a plurality of photo-thermal elements 173 of a first weight and a plurality of supporting elements 175 of a second weight are added into the frame sealing glue 171 thawed in the glue tube; or, a plurality of photo-thermal elements 173 with a third weight are added into the frame sealing glue 171 after being thawed in the glue tube, wherein the photo-thermal elements 173 comprise a photo-thermal layer 173a and a support 173b positioned in the photo-thermal layer 173 a.

In an exemplary embodiment, the weight of the frame sealing glue 171 in the hose may be 50g to 150g, for example, 50g, 70g, 80g, 100g, 130g, 140g, 150g, or other values, which are not particularly limited in this application.

In an exemplary embodiment, the mass ratio of the first weight to the frame sealing compound 171 may be 15% to 25%, and the mass ratio of the second weight to the frame sealing compound 171 may be 1%. The mass ratio of the third weight to the frame sealing adhesive 171 may be 16% to 26%.

And S130, stirring the frame sealing glue 171 and a plurality of photo-thermal elements 173 dispersed in the frame sealing glue 171 to form a frame sealing glue assembly 17.

Specifically, the rubber tube is placed into a centrifugal machine, the centrifugal machine is started, and substances in the rubber tube are uniformly mixed through uniform rotation of the centrifugal machine to form the frame sealing rubber assembly 17, so that the preparation of the frame sealing rubber assembly 17 is completed.

In an exemplary embodiment, the frame sealer 171, the photo-thermal element 173, and the support element 175 are agitated to form a frame sealer assembly 17; alternatively, the sealant 171 and the photo-thermal element 173 are stirred to form a sealant assembly 17, wherein the photo-thermal element 173 includes a photo-thermal layer 173a and a support 173b disposed within the photo-thermal layer 173 a.

In summary, the method for manufacturing the frame sealing adhesive assembly provided in the embodiment of the application includes: providing a frame sealing adhesive 171; adding a plurality of photo-thermal elements 173 to the frame sealing glue 171; the sealant 171 and the plurality of photo-thermal elements 173 dispersed within the sealant 171 are stirred to form a sealant assembly 17. When the array substrate 11 and the color film substrate 15 are paired, the frame sealing glue 171 is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element 173 generates heat under the irradiation of ultraviolet light to thermally cure the frame sealing glue 171. The frame sealing glue assembly 17 formed by the manufacturing method of the frame sealing glue assembly can be simultaneously pre-cured and thermally cured, so that the manufacturing process is simplified, the curing speed of the frame sealing glue 171 is increased, and the pollution of the liquid crystal molecules 131 caused by incomplete curing of the frame sealing glue 171 is avoided. Moreover, when the sealant 171 is thermally cured, the region where the temperature is raised is only the region where the sealant assembly 17 is located, and the entire display panel is not required to be heated at a high temperature, so that the liquid crystal molecules 131 are prevented from being deactivated at a high temperature, and the display effect and reliability of the display panel are improved.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

It is to be understood that the application of the present application is not limited to the examples described above, but that modifications and variations can be made by a person skilled in the art from the above description, all of which modifications and variations are intended to fall within the scope of the claims appended hereto. Those skilled in the art will recognize that the implementations of all or part of the procedures described in the embodiments described above and in accordance with the equivalent arrangements of the claims are within the scope of the present application.

Claims (10)

1. The display panel comprises a display area and a non-display area which is arranged around the periphery of the display area, and is characterized by further comprising an array substrate, a frame sealing glue component and a color film substrate which are arranged in a stacked mode, wherein the frame sealing glue component is positioned in the non-display area, and comprises frame sealing glue and a plurality of photo-thermal elements dispersed in the frame sealing glue;

When the array substrate and the color film substrate are paired, the frame sealing glue is pre-cured under the irradiation of ultraviolet light, and the photo-thermal element heats under the irradiation of ultraviolet light so as to thermally cure the frame sealing glue at the same time.

2. The display panel of claim 1, wherein the frame sealing compound assembly further comprises a plurality of support elements dispersed within the frame sealing compound for maintaining a spacing between the array substrate and the color film substrate in the non-display region.

3. The display panel of claim 1, wherein the photo-thermal element includes a photo-thermal layer that generates heat under irradiation of ultraviolet light and a support disposed in the photo-thermal layer for maintaining a space between the array substrate and the color film substrate in the non-display region.

4. A display panel as claimed in any one of claims 1-3, characterized in that the doping ratio of the photo-thermal element is 15% to 25%.

5. A display panel as claimed in any one of claims 1 to 3, characterized in that the material of the photo-thermal element comprises one or more of metal nanoparticles, synthetic graphene, graphite-phase sodium nitride nanomaterials, titanium dioxide.

6. The display panel of any one of claims 1-3, wherein the array substrate comprises a first substrate and a plurality of conductive elements, the first substrate is disposed on a side of the frame sealing assembly facing away from the color film substrate and is spaced apart from the frame sealing assembly, and the plurality of conductive elements are disposed on a side of the first substrate facing the frame sealing assembly and are located in the non-display area;

the color film substrate comprises a second substrate and a shading layer, the second substrate is arranged on one side of the frame sealing glue component, which is opposite to the array substrate, and is spaced from the frame sealing glue component, and the shading layer is arranged on one side of the second substrate, which faces the frame sealing glue component, and is positioned in the non-display area.

7. The display panel of claim 6, wherein orthographic projections of a plurality of the conductive elements on the first substrate are offset from orthographic projections of the light shielding layer on the first substrate.

8. The display panel of claim 7, wherein orthographic projections of a plurality of the conductive elements on the first substrate are connected with orthographic projections of the light shielding layer on the first substrate.

9. A display device comprising a backlight module and a display panel according to any one of claims 1-8, wherein the display panel is disposed on a light emitting side of the backlight module.

10. A method for manufacturing a frame sealing assembly for manufacturing the display panel according to any one of claims 1 to 8, the method comprising:

providing frame sealing glue;

adding a plurality of photo-thermal elements into the frame sealing glue;

and stirring the frame sealing glue and a plurality of photo-thermal elements dispersed in the frame sealing glue to form a frame sealing glue assembly.

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