CN116299859A - Waveguide modulator coupling encapsulation tool - Google Patents
Waveguide modulator coupling encapsulation tool Download PDFInfo
- Publication number
- CN116299859A CN116299859A CN202211739215.6A CN202211739215A CN116299859A CN 116299859 A CN116299859 A CN 116299859A CN 202211739215 A CN202211739215 A CN 202211739215A CN 116299859 A CN116299859 A CN 116299859A
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- China
- Prior art keywords
- base
- optical fiber
- clamping
- waveguide modulator
- assembly
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/46—Processes or apparatus adapted for installing or repairing optical fibres or optical cables
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides a waveguide modulator coupling packaging tool, which comprises a base, a waveguide chip arranged on the base and an optical fiber coupled with the waveguide chip, wherein the waveguide chip is arranged on the base; the encapsulation tool includes: the base clamping assembly is used for clamping and fixing the base; and the optical fiber clamping assembly is used for clamping and fixing the optical fiber. The waveguide modulator coupling packaging tool provided by the invention is used for fixing the base and the optical fiber and realizing the alignment between the optical fiber and the base.
Description
Technical Field
The invention relates to the technical field of optical waveguides, in particular to a waveguide modulator coupling packaging tool.
Background
Fig. 1 shows a schematic diagram of a waveguide modulator, and as shown in fig. 1, the waveguide modulator 10 includes a base 110, a waveguide chip 120 mounted on the base 110, and an optical fiber 130 coupled to the waveguide chip 120; in the process of packaging the waveguide modulator 10, it is necessary to package the waveguide chip 120 in the chassis 110 and couple both ends of the waveguide chip 120 with the optical fibers 130.
In the prior art, the packaging is usually performed manually, but the problems of poor fixation of the base and misalignment of the optical fibers usually occur in the manual packaging process.
Disclosure of Invention
In view of the above, the present invention provides a waveguide modulator coupling packaging tool for fixing a base and an optical fiber and achieving alignment between the optical fiber and the base.
In order to solve the technical problems, the invention adopts the following technical scheme: a waveguide modulator coupling packaging tool, the waveguide modulator comprising a base, a waveguide chip mounted on the base and an optical fiber coupled with the waveguide chip;
the encapsulation tool includes:
the base clamping assembly is used for clamping and fixing the base; and
and the optical fiber clamping assembly is used for clamping and fixing the optical fiber.
Preferably, the base clamping assembly comprises:
a lifting assembly;
the lifting platform is positioned at the top end of the lifting assembly; and
a tool located on the lifting platform;
the lifting assembly is used for adjusting the platform and the clamp on the platform in the Y-axis direction.
Preferably, the jig comprises:
clamping a base;
the first fixing component, the second fixing component and the third fixing component are fixed on the clamping base and slide relative to the clamping base;
the third fixed component is positioned between the first fixed component and the second fixed component, and the third fixed component is connected with the second fixed component through the spring component.
Preferably, the bottom of the third fixing component is fixedly provided with a sliding rail, and the clamping base is correspondingly provided with a sliding groove.
Preferably, the fiber clamping assembly comprises:
adjusting a platform; and
an optical fiber clamp positioned on the adjustment platform;
the adjusting platform is used for adjusting the optical fiber clamping assembly in the X-axis direction and the Z-axis direction.
Preferably, the optical fiber holder includes a holder base, a guide groove fixed to one end of the holder base, and a cover plate detachably fixed above the guide groove.
Preferably, a cushioning assembly is also included.
Preferably, the buffer component is a soft material attached to the surfaces of the guide groove and the optical fiber groove.
Preferably, the cushioning assembly is a cushioning sleeve.
Preferably, the buffer sleeve is a hard sleeve with a through hole in the center, and the buffer sleeve is clamped between the guide groove and the optical fiber groove.
The invention has the advantages and positive effects that: the invention provides a waveguide modulator coupling packaging tool, to secure the base and the optical fibers and to achieve alignment between the optical fibers and the base.
Drawings
FIG. 1 shows a schematic diagram of a waveguide modulator;
FIG. 2 shows a schematic side view of a packaging tool according to an embodiment of the invention;
FIG. 3 shows a schematic structural view of a clamp according to an embodiment of the present invention;
FIG. 4 is a schematic diagram showing the mating relationship between the third securing assembly and the clamping base;
FIG. 5 shows a schematic view of the structure of a fiber clamping assembly according to an embodiment of the present invention;
fig. 6 shows an enlarged view at a in fig. 5.
Detailed Description
For a better understanding of the present invention, the present invention is further described below with reference to specific examples and drawings.
Fig. 1 shows a schematic diagram of a waveguide modulator according to an embodiment of the present invention, and as shown in fig. 1, a waveguide modulator 10 includes a base 110, a waveguide chip 120 mounted on the base 110, and an optical fiber 130 coupled to the waveguide chip 120; in the process of packaging the waveguide modulator 10, it is necessary to package the waveguide chip 120 in the chassis 110 and couple both ends of the waveguide chip 120 with the optical fibers 130.
The base 110 includes a housing 111, a groove 112 defined by the housing 111, and a through hole 113 on the housing 111, the waveguide chip 120 is encapsulated in the groove 112, and the optical fiber 130 passes through the through hole 113 and is coupled with the waveguide chip 120 in the groove 112.
FIG. 2 shows a schematic side view of a packaging tool according to an embodiment of the invention; as shown in fig. 2, the encapsulation tool 20 includes: a base clamping assembly 210 for clamping and securing the base, and a fiber clamping assembly 220 for clamping and securing the fiber.
The base clamping assembly 210 includes: a lifting assembly 211, a platform 212 positioned at the top end of the lifting assembly 211; and a clamp 213 located on the platform 212. The lifting assembly 211 is used for adjusting the platform 212 and the clamp 213 on the platform 213 in the Y-axis direction. In this embodiment, the lift assembly 211 is, for example, a GCM-VC series precision lift table.
FIG. 3 shows a schematic structural view of a clamp according to an embodiment of the present invention; as shown in fig. 3, the clamp 213 includes a clamping base 2131, a first fixing assembly 2132 fixed to the clamping base 2131, a second fixing assembly 2133, and a third fixing assembly 2134 sliding relative to the clamping base 2131, the third fixing assembly 2134 being located between the first fixing assembly 2132 and the second fixing assembly 2133, and the third fixing assembly 2134 being connected to the second fixing assembly 2133 via a spring assembly 2135.
FIG. 4 is a schematic diagram showing the mating relationship between the third securing assembly and the clamping base; as shown in fig. 4, a slide rail 2136 is fixedly provided at the bottom of the third fixing assembly 2134, a slide groove 2137 is correspondingly provided on the clamping base 2131, and the slide rail 2136 of the third fixing assembly 2134 is slidably provided in the slide groove 2137 of the clamping base 2131. In order to prevent the third fixing assembly 2134 from falling out, the slide groove 2137 is, for example, a dovetail groove, and the cross-sectional shape of the slide rail 2136 matches the cross-sectional shape of the dovetail groove.
FIG. 5 shows a schematic view of the structure of a fiber clamping assembly according to an embodiment of the present invention; FIG. 6 shows an enlarged view at A in FIG. 5; referring to fig. 2, 3, 5 and 6, the fiber holding assembly 220 includes: the optical fiber clamping device comprises an adjusting platform 221 and an optical fiber clamp 222 arranged on the adjusting platform 221, wherein the adjusting platform 221 is used for adjusting the optical fiber clamping assembly 222 in the X-axis direction and the Z-axis direction. In the present embodiment of the present invention, the adjustment stage 221 is, for example, a MAX312D-M series adjustment stage.
The optical fiber holder 222 includes a holder base 2221, a guide groove 2222 fixed to one end of the holder base 2221, and a cover plate 2223 detachably fixed above the guide groove 2222. The cover plate 2223 is fastened above the guide groove 2222, and an optical fiber groove 2224 is provided on a side of the cover plate 2223 opposite to the guide groove 2222, wherein the cover plate 2223 is fixed above the guide groove 2222 via a bolt, and when the cover plate 2223 is fixed above the guide groove 2222, the optical fiber groove 2224 is opposite to the guide groove 2222, so as to clamp the optical fiber. In a preferred embodiment, the surfaces of the guide groove 2222 and the optical fiber groove 2224 are attached with a buffer component, and the buffer component is made of a soft material with elasticity, such as sponge, silica gel, etc., so as to prevent damage to the optical fiber 130.
In other embodiments, the buffer assembly is, for example, a buffer sleeve 2225, where the buffer sleeve 2225 is, for example, a hard sleeve with a through hole in the center, the optical fiber 130 passes through the buffer sleeve 2225, and the buffer sleeve 2225 is clamped between the guide groove 2222 and the optical fiber groove 2224.
In the process of packaging the waveguide modulator 10, the base 110 is fixed to the base clamping assembly 210, specifically, the base 110 is fixed between the first fixing assembly 2132 and the third fixing assembly 2134, and at this time, the spring assembly 2135 contracts to clamp the base 110. The encapsulation (e.g., soldering) of the waveguide chip 120 and the submount 110 is performed on the submount holding assembly 210, and further, the optical fiber 130 is fixed to the optical fiber holding assembly 220, specifically, held between the guide groove 2222 and the optical fiber groove 2224. Wherein the through hole 113 on the base 110 is opposite to the optical fiber 130 fixed on the optical fiber clamping assembly 220, and the lifting assembly 211 and the adjusting platform 221 are adjusted at the same time, so that the optical fiber 130 can pass through the through hole 113 on the base 110.
The foregoing describes the embodiments of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by this patent.
Claims (10)
1. A waveguide modulator coupling packaging tool, the waveguide modulator comprising a base, a waveguide chip mounted on the base and an optical fiber coupled with the waveguide chip;
the encapsulation tool includes:
the base clamping assembly is used for clamping and fixing the base; and
and the optical fiber clamping assembly is used for clamping and fixing the optical fiber.
2. The waveguide modulator coupling encapsulation tool of claim 1, wherein: the base clamping assembly includes:
a lifting assembly;
the lifting platform is positioned at the top end of the lifting assembly; and
a tool located on the lifting platform;
the lifting assembly is used for adjusting the platform and the clamp on the platform in the Y-axis direction.
3. The waveguide modulator coupling encapsulation tool of claim 2, wherein: the fixture comprises:
clamping a base;
the first fixing component, the second fixing component and the third fixing component are fixed on the clamping base and slide relative to the clamping base;
the third fixed component is positioned between the first fixed component and the second fixed component, and the third fixed component is connected with the second fixed component through the spring component.
4. A waveguide modulator coupling encapsulation tool according to claim 3, wherein: the bottom of the third fixing component is fixedly provided with a sliding rail, and the clamping base is correspondingly provided with a sliding groove.
5. The waveguide modulator coupling encapsulation tool of claim 1, wherein: the fiber clamping assembly includes:
adjusting a platform; and
is positioned on the adjusting platform is a fiber clamp;
the adjusting platform is used for adjusting the optical fiber clamping assembly in the X-axis direction and the Z-axis direction.
6. The waveguide modulator coupling encapsulation tool of claim 5, wherein: the optical fiber clamp comprises a clamp seat, a guide groove fixed at one end of the clamp seat, and a cover plate detachably fixed above the guide groove.
7. The waveguide modulator coupling encapsulation tool of claim 6, wherein: a cushioning assembly is also included.
8. The waveguide modulator coupling encapsulation tool of claim 7, wherein: the buffer component is made of soft materials attached to the surface of the guide groove and the optical fiber groove.
9. The waveguide modulator coupling encapsulation tool of claim 7, wherein: the buffer component is a buffer sleeve.
10. The waveguide modulator coupling encapsulation tool of claim 9, wherein: the buffer sleeve is a hard sleeve with a through hole in the center, and is clamped between the guide groove and the optical fiber groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211739215.6A CN116299859A (en) | 2022-12-31 | 2022-12-31 | Waveguide modulator coupling encapsulation tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211739215.6A CN116299859A (en) | 2022-12-31 | 2022-12-31 | Waveguide modulator coupling encapsulation tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116299859A true CN116299859A (en) | 2023-06-23 |
Family
ID=86834872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211739215.6A Pending CN116299859A (en) | 2022-12-31 | 2022-12-31 | Waveguide modulator coupling encapsulation tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116299859A (en) |
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2022
- 2022-12-31 CN CN202211739215.6A patent/CN116299859A/en active Pending
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