CN116298443A

CN116298443A - Preparation method of flow divider and processing equipment of flow divider

Info

Publication number: CN116298443A
Application number: CN202310232771.2A
Authority: CN
Inventors: 杨宝平; 黄以平; 宋宜梅
Original assignee: Guilin Strong Numerical Control Vacuum Equipment Co ltd
Current assignee: Guilin Strong Numerical Control Vacuum Equipment Co ltd
Priority date: 2023-03-12
Filing date: 2023-03-12
Publication date: 2023-06-23

Abstract

The invention discloses a preparation method of a shunt and a processing device of the shunt, wherein the preparation method of the shunt comprises the following steps: placing the diverter body and the circuit board in a processing environment, wherein the processing environment is in a vacuum and constant-temperature state; acquiring surface information on the circuit board, and positioning a pressing area according to the surface information; and the circuit board is welded with the opposite surfaces of the shunt body, and the pressing area of the circuit board is pressed so as to be close to and press the shunt body. The technical scheme of this application can improve the electric current detection precision of shunt.

Description

Preparation method of flow divider and processing equipment of flow divider

Technical Field

The invention relates to the field of current dividers, in particular to a preparation method of a current divider and processing equipment of the current divider.

Background

The shunt is an instrument for measuring direct current and is manufactured according to the principle that voltage is generated at two ends of a resistor when direct current passes through the resistor. In the electronic metering technology industry, the direct current shunt can be used for sampling and detecting current limiting, backflow and current sharing of a power supply of a battery management system, an electronic complete machine, a communication system and an automatic control system.

However, with the rapid development of some industries, the requirements on the detection accuracy of the current divider are also increasing, for example, in a BMS (Battery Management System ) in a new energy automobile, the requirements on the current detection of the current divider are higher, but the current divider on the market still has the problem that the requirements on the high-accuracy detection of the current are not met.

Disclosure of Invention

The invention mainly aims to provide a preparation method of a current divider, wherein in the production process of a copper bar, the surface of the copper bar is uneven due to the problem of a production process, or a certain gap exists between a circuit board of the current divider and the copper bar when the circuit board and the copper bar are welded, and bubbles can be generated between the circuit board and the copper bar when the circuit board and the copper bar are welded due to the uneven surface and/or the gap, so that the bubbles generated between the circuit board and the copper bar are eliminated, the influence of the bubbles on the impedance of the current divider is avoided, and the current detection precision of the current divider is improved.

In order to achieve the above object, the present invention provides a method for manufacturing a shunt, the shunt including a shunt body and a circuit board, the method for manufacturing the shunt including the steps of:

placing the diverter body and the circuit board in a processing environment, wherein the processing environment is in a vacuum and constant-temperature state;

Acquiring surface information on the circuit board, and positioning a pressing area according to the surface information;

and the circuit board is welded with the opposite surfaces of the shunt body, and the pressing area of the circuit board is pressed so as to be close to and press the shunt body.

Optionally, the diverter processing apparatus is provided with an identification device, and the step of acquiring the upper surface information of the circuit board and positioning the pressing area according to the surface information includes:

controlling the identification device to acquire surface information of the circuit board facing the shunt main body, wherein the surface information comprises identification information and/or position setting information of components;

determining at least one pressing point according to the surface information;

determining the priority of the at least one pressing point according to the information type of the surface information;

and determining the pressing area according to the pressing point with the previous priority.

Optionally, the diverter processing apparatus is provided with a pressing device, and the step of pressing the pressing area of the circuit board while welding the opposite surfaces of the diverter main body and the circuit board so as to approach and press the diverter main body includes:

Determining the pressing movement sequence of the diverter body and the circuit board;

and controlling the pressing device to press the pressing area of the circuit board according to the pressing movement sequence while welding the opposite surfaces of the diverter main body and the circuit board so as to enable the pressing device to approach and press the diverter main body.

Optionally, the step of pressing the pressing area of the circuit board while soldering the facing surfaces of the shunt body and the circuit board to approach and press the shunt body includes:

determining preset pressing force and preset pressing time according to the position information of the pressing area;

and when the surfaces of the shunt main body and the circuit board opposite to each other are welded, the pressing area of the circuit board is pressed according to the preset pressing force and the preset pressing time so as to enable the circuit board to approach and press the shunt main body.

Optionally, before the step of pressing the pressing area of the circuit board while soldering the surface of the circuit board opposite to the shunt body, the method further includes:

acquiring position information of the pressing area on the circuit board;

the step of pressing the pressing area of the circuit board while welding the opposite surfaces of the circuit board and the shunt body comprises the following steps:

If the position information of the pressing area is the preset position of the circuit board, determining a pressing force change curve corresponding to the pressing area, wherein the pressing force is reduced along with the increase of the pressing time after a preset time point;

determining the pressing force and the corresponding pressing time according to the pressing force change curve;

and the circuit board and the surface opposite to the shunt main body are welded, and the pressing area of the circuit board is pressed according to the pressing force and the pressing time.

Optionally, the diverter processing apparatus is provided with a pressing device, the pressing device is provided with pressing members with different sizes, and the step of pressing the pressing region of the circuit board while welding the opposite surfaces of the circuit board and the diverter main body includes:

determining a target pressing piece matched with the pressing area according to the area size of the pressing area;

and controlling the target pressing piece to press the pressing area of the circuit board while welding the opposite surfaces of the circuit board and the diverter main body.

Optionally, the step of controlling the target pressing member to press the pressing region of the circuit board while soldering the circuit board and the shunt body facing each other includes:

Determining the pressing force of the target pressing member according to the region size of the pressing region;

and controlling the target pressing piece while welding the opposite surfaces of the diverter main body and the circuit board, and pressing the pressing area of the circuit board according to the pressing force.

Optionally, after the step of pressing the pressing area of the circuit board to approach and press the shunt body while soldering the surface of the circuit board opposite to the shunt body, the method further includes:

acquiring welding information, and writing the welding information into a two-dimensional code corresponding to the shunt, wherein the welding information comprises at least one of welding time, welding temperature and a pressing area;

obtaining a welding detection result of the shunt;

and if the yield of the shunt preparation determined according to the welding detection result is smaller than a preset threshold value, determining the adjustment working parameters of the shunt processing equipment according to the welding detection result and the welding information.

Optionally, after the step of pressing the pressing area of the circuit board while soldering the surface of the circuit board opposite to the shunt body, the method further includes:

Vibrating either the circuit board or the shunt body according to preset vibration parameters.

In order to achieve the above object, the present invention provides a shunt processing apparatus including a memory, a processor, and a preparation program of a shunt stored in the memory and executable on the processor, which when executed by the processor, realizes the respective steps of the preparation method of a shunt as described above.

According to the preparation method of the technical scheme, the diverter main body and the circuit board are placed in a processing environment, the pressing area of the circuit board is obtained, and when the diverter main body and the circuit board are welded, the pressing area of the circuit board is pressed to drive the diverter main body and the circuit board to be close to each other for extrusion. Therefore, bubbles generated in a gap between the circuit board and the diverter main body can be eliminated in the extruded process, so that the influence of the bubbles on the impedance of the diverter can be reduced, and the technical scheme of the invention can effectively improve the detection precision of the diverter on the current through the preparation method under the condition that the diverter structure is not required to be improved, so that the high-precision detection requirement of the diverter in industry is met.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of an embodiment of a shunt according to the present invention;

FIG. 2 is a schematic flow chart of a first embodiment of a method for preparing a flow divider according to the present invention;

FIG. 3 is a schematic flow chart of a second embodiment of a method for preparing a flow divider according to the present invention;

FIG. 4 is a schematic flow chart of a third embodiment of a method for preparing a flow divider according to the present invention;

FIG. 5 is a schematic flow chart of a fourth embodiment of a method for preparing a flow divider according to the present invention;

FIG. 6 is a schematic flow chart of a fifth embodiment of a method for preparing a flow divider according to the present invention;

FIG. 7 is a schematic flow chart of a sixth embodiment of a method for preparing a flow divider according to the present invention;

FIG. 8 is a schematic view of an embodiment of the diverter processing apparatus of the present invention.

Reference numerals illustrate:

the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

The shunt is an instrument for measuring direct current and is manufactured according to the principle that voltage is generated at two ends of a resistor when direct current passes through the resistor. In the electronic metering technology industry, the direct current shunt can be used for sampling and detecting current limiting, backflow and current sharing of a power supply of a battery management system, an electronic complete machine, a communication system and an automatic control system. However, with the rapid development of some industries, the requirements on the detection accuracy of the current divider are also increasing, for example, in a BMS (Battery Management System ) in a new energy automobile, the requirements on the current detection of the current divider are higher, but the current divider on the market still has the problem that the requirements on the high-accuracy detection of the current are not met.

The current diverter manufacturers basically improve the current detection precision of the diverter by the following aspects in the aspect of poor current detection precision of the diverter to improve the detection precision of the diverter:

(1) The improvement is carried out in terms of the self material quality of the current divider, for example, aiming at the problem of uneven material quality of copper bars of the current divider, the production manufacturer of the current divider improves the detection precision of the current divider by improving the material uniformity of the copper bars;

(2) Improvement is made in the aspect of connection between the sampling connecting piece and the copper bar, for example, aiming at the problem of poor connection contact between the sampling connecting piece and the copper bar, a production manufacturer of the current divider increases the detection point on the current divider to improve the detection precision of the current divider;

(3) The use environment of the shunt is improved, for example, the problem of severe use environment of the shunt is solved, and a manufacturer of the shunt improves the detection precision of the shunt by improving the use environment of the shunt, for example, avoiding the use environment of the shunt from changing too much in temperature, avoiding the use environment from being too high in humidity or avoiding the vibration of the shunt and the like;

(4) The accuracy of the detection of the ADC (Analog to Digital Conver, analog-to-digital converter) from the shunt is improved, such as by increasing the accuracy of the detection of the ADC to increase the accuracy of the detection of the shunt.

The inventors of the present application have found that the current detection accuracy of the current divider is still poor on the premise of improving the current detection accuracy of the current divider generally in the research and development process. Therefore, through repeated experimental tests, other problems affecting the current detection precision of the current divider are found, and the problems are specifically: in the production process of the copper bar, the surface of the copper bar is uneven due to the problem of the production process, or a certain gap exists between the circuit board of the shunt and the copper bar when the circuit board and the copper bar are welded, and bubbles can be generated between the circuit board and the copper bar when the circuit board and the copper bar are welded due to the surface of the copper bar and the copper bar due to the uneven surface and/or the gap, and the impedance of the shunt main body can be influenced by the bubbles generated at the position through detection, so that the current detection precision of the shunt main body is influenced.

In the mode of eliminating the bubbles, the inventor of the application not only improves the self structure of the copper bar, but also eliminates the bubbles by a process step mode in the welding process of the circuit board and the copper bar so as to eliminate the bubbles, namely the technical scheme of the application is that the preparation method for eliminating the bubbles by the process in the welding process of the circuit board and the copper bar is adopted.

The invention provides a preparation method of a shunt.

It will be appreciated that the reasons for the occurrence of air bubbles between the shunt body 10 and the circuit board 30 during soldering include, but are not limited to, the following two: one reason is that during the production and processing of the copper bar 11 of the shunt body 10, due to the influence of the existing production process factors, a part of raised area or recessed area exists on the surface of the copper bar 11, so that the copper bar 11 of the shunt body 10 and the circuit board 30 cannot be tightly attached during welding, and bubbles affecting the current detection accuracy of the shunt 100 are generated; another reason is that during soldering, the soldering material cannot be uniformly distributed between the shunt body 10 and the circuit board 30, for example, solder cannot be uniformly distributed between the copper bar 11 of the shunt body 10 and the circuit board 30, so that the copper bar 11 and the circuit board 30 cannot be closely attached all the time during soldering, a certain gap exists, and the gap may cause the generation of bubbles that affect the current detection accuracy of the shunt 100.

Referring to fig. 1 to 2, fig. 2 is a first embodiment of a method for preparing a shunt according to the present invention, the method for preparing a shunt comprising the steps of:

in step S10, the shunt body 10 and the circuit board 30 are placed in a processing environment, which is a vacuum and constant temperature environment.

Alternatively, the method of preparing the flow splitter is applied to the flow splitter processing apparatus.

Alternatively, as shown in fig. 1, the shunt body 10 includes two copper bars 11 and a resistive alloy 13 disposed at a distance, and both ends of the resistive alloy 13 are welded to the two copper bars 11, respectively, and electrically connected to the two copper bars 11. Each copper bar 11 is provided with a measuring terminal, and it can be understood that the measuring connection end of one copper bar 11 is an anode connection end, and the measuring connection end of the other copper bar 11 is a cathode connection end, so that the measuring current can flow from the anode connection end to the resistance alloy 13 and then flow from the resistance alloy 13 to the cathode connection end, thereby realizing the measurement of the current value, and the current value can be transmitted to an external device by the circuit board 30. The material of the copper bar 11 may be a material such as red copper or brass, and the surface of the copper bar 11 may be coated with a protective layer to achieve an oxidation-preventing effect on the surface of the copper bar 11, so as to avoid the problem of poor contact caused by oxidation of the surface of the copper bar 11, for example, tin plating, nickel plating, or an organic solder mask may be attached, which is not limited herein. The material of the resistance alloy 13 may be a manganese-copper alloy 13, an iron-chromium-aluminum alloy 13, or a nickel-chromium alloy 13, wherein when the resistance alloy 13 is a manganese-copper alloy 13, the resistance alloy has low resistivity and low temperature coefficient characteristics.

It will be appreciated that, since the welding is a thermal processing method, the copper bar 11 is deformed by heat during the welding process of the copper bar 11 and the resistor alloy 13, and even though the electron beam welding method is still used, the copper bar 11 is still affected, so that an arc angle is formed between the upper surface of the copper bar 11 and the inner side surface thereof, and a gap is formed between the upper surface and the inner side surface. Therefore, bubbles are generated at the position where the copper bars 11 form the arc angle when soldering with the circuit board 30, and the bubbles affect the impedance of the shunt body 10 to affect the current detection accuracy of the shunt body 10. Of course, in other embodiments, the upper surface of the copper bar 11 is directly deformed by heat, so that the circuit board 30 and the upper surface of the copper bar 11 have a certain gap, and thus a certain air bubble is generated when the circuit board 30 and the upper surface of the copper bar 11 are soldered.

Optionally, the shunt body 10 and the circuit board 30 are prepared and preassembled before step S10. Wherein, the pre-assembly may be to prepare the shunt body 10 and the circuit board 30; fixing the circuit board 30; placing the shunt body 10 on the surface of the circuit board 30 facing the shunt body 10; the method can also be as follows: preparing a shunt body 10 and a circuit board 30; fixing the shunt body 10; the circuit board 30 is placed on the surface of the shunt body 10 facing the circuit board 30.

Optionally, the shunt body 10 and the circuit board 30 are placed in a processing environment. Wherein, the processing environment can be vacuum and constant temperature environment, so, when guaranteeing welding efficiency and welding effect, can improve the effect of eliminating the bubble to improve the detection precision of shunt 100 to the electric current. Under the constant temperature environment, can make the used solder paste of welding quick and flow to improve welding efficiency and welding effect. And in the vacuum environment, part of bubbles generated during welding can be eliminated, so that the bubble rate between the two is reduced while the welding effect is ensured, the influence of the bubbles on the impedance of the shunt 100 is reduced, and the current detection effect of the shunt 100 is improved. Optionally, the preset temperature range value in the constant temperature environment is XX ℃ to XX ℃. Optionally, the preset vacuum level in the vacuum environment is greater than XXKPa.

The processing environment can be a vacuum environment and/or a constant temperature environment, and under the constant temperature environment, the soldering paste used in the process of welding can flow fast, so that the welding efficiency and the welding effect are improved. It should be noted that, in the actual preparation process, the types of solder paste used by the shunt body 10 and the circuit board 30 need to be selected according to the actual preparation conditions, and the melting points of the solder pastes of different types are different, so the application does not limit the specific temperature range of the constant temperature environment, so long as the solder paste can be melted to realize good welding under the constant temperature environment. In some exemplary embodiments, when the melting point of the solder paste is 190 ℃, the temperature of the constant temperature environment may be arbitrarily selected at a temperature value between 190 ℃ and 200 ℃, so that the solder paste can be melted during the soldering process, and the manufacturing process can be continuously performed in the workshop under the constant temperature environment, so as to improve the manufacturing efficiency of the workshop, and meanwhile, the manufacturing cost of the workshop can be prevented from being increased in order to reach a higher temperature.

In a vacuum environment, part of bubbles generated during welding can be eliminated, so that the welding effect is ensured, and the bubble rate between the two is reduced, thereby reducing the influence of bubbles on the impedance of the shunt 100 and improving the detection effect of the shunt 100 on current; the vacuum degree range in the vacuum environment is not particularly limited, and the elimination effect of bubbles can be further improved in the vacuum environment in the preparation process. In some examples, when the preparation is performed under the preset vacuum degree of the vacuum environment, bubbles can be eliminated under the influence of the vacuum environment, and meanwhile, the value of the preset vacuum degree is not excessively large, for example, the vacuum environment of almost absolute vacuum is not reached, so that the cost of a workshop is prevented from increasing due to the large preset vacuum degree, and the preparation method is more suitable for actual preparation of the workshop.

Step S20, acquiring surface information on the circuit board 30, and positioning a pressing area according to the surface information.

Optionally, the diverter processing apparatus is provided with an identification device, and the identification device is controlled to acquire surface information of the circuit board 30 facing the diverter main body 10, wherein the surface information includes identification information and/or position setting information of components; the pressing area is acquired based on the surface information.

Optionally, determining at least one pressing point according to the surface information, wherein the pressing point can be a point except for the identification information and/or the position setting information of the component, and the position corresponding to the pressing point has no identification information and no component; determining the priority of at least one pressing point according to the information type of the surface information, for example, the priority of the pressing point a positioned at the middle position of the circuit board is a first priority, and the priority of the pressing point b positioned at the edge position of the circuit board is a second priority; the pressing area is determined according to the pressing point whose priority is previous. Alternatively, a pressing area of a preset position and a preset shape from the center is determined centering on the pressing point, for example, a square area constituting a preset side length centering on the pressing point.

Alternatively, the identification device 330 may be a CCD device (Charge Coupled Device ), under which the surface information of the circuit board 30 can be quickly and accurately identified, or may be a CMOS (Complementary Metal-Oxide-Semiconductor) device, which is not specifically limited herein, and the type of the identification device 330 may be selected according to the actual identification requirement and the actual manufacturing cost.

Alternatively, the pressing area is obtained according to the surface information, and it is understood that when the surface of the circuit board 30 facing the copper bar 11 is obtained without the component position, the position corresponding to the other surface of the circuit board 30 may be the pressing area. Thus, the automatic pressing area acquisition can be realized, and the air bubble eliminating effect of the electronic device is improved, and meanwhile, the circuit board 30 is prevented from being damaged in the pressing process.

Optionally, the surface information includes identification information and/or position setting information of the components, so that the bubble eliminating effect can be ensured and damage to the components of the circuit board 30 can be avoided. The embodiment may be that the surface information is identification information; the surface information may be position setting information of the component, or the surface information may be identification information and position setting information of the component, which is not particularly limited herein. The identification information may include pad information and white frame information, which are not particularly limited herein.

In some embodiments, on the surface of the circuit board 30 facing the copper bar 11, pads for soldering the copper bar 11 are disposed on two opposite sides along the center line of the circuit board 30, and no component is disposed on two positions, at this time, two pressing areas may be pad positions on the opposite surfaces of the circuit board 30, and since the positions where bubbles are generated are substantially gaps between the pads and the circuit board 30, the effect of eliminating bubbles can be ensured when the pressing areas are pressed, and damage to the components of the circuit board 30 can be avoided.

And step S30, welding the surfaces of the circuit board 30 and the shunt body 10 facing each other, and simultaneously, pressing the pressing area of the circuit board 30 to enable the circuit board 30 to approach and press the shunt body 10.

Optionally, the circuit board is disposed on a soldering surface of the shunt body.

Optionally, when the circuit board 30 and the copper bar 11 of the shunt body 10 are welded, the circuit board 30 and the copper bar 11 of the shunt body 10 are driven to be close to each other and extruded, so that a gap between the copper bar 11 of the shunt body 10 and the circuit board 30 is eliminated, the shunt body 10 and the circuit board 30 can be tightly attached when being welded, generation of bubbles at the gap between the shunt body 10 and the circuit board 30 can be reduced when welding is ensured, the bubble rate between the shunt body and the circuit board is reduced, and then the influence of the bubbles on impedance of the shunt 100 is reduced, so that the detection effect of the shunt 100 on current is improved.

Alternatively, the pressing movement sequence of the shunt body 10 and the circuit board 30 is determined; the pressing device is controlled to press the pressing area of the circuit board 30 according to the pressing movement sequence so as to approach and press the shunt body 10 while welding the surfaces of the shunt body 10 and the circuit board 30 facing each other. Alternatively, the pressing movement sequence may be to fix the circuit board 30, and drive the copper bar 11 to move close to the circuit board 30, where the two can move relatively close to each other, and pressing occurs. The pressing movement sequence may be to fix the copper bar 11, and the driving circuit board 30 moves close to the copper bar 11, and at this time, the two can move relatively close to each other, and pressing occurs. The pressing movement sequence may drive the pressing movement sequence to move so as to approach each other, and the pressing movement sequence is not particularly limited herein, and may be selected according to the actual manufacturing scenario and the actual diverter processing apparatus 300.

The surface of the circuit board 30 facing the shunt body 10 is soldered while pressing the pressing region of the circuit board 30 so as to be close to and press the copper bars 11 of the shunt body 10. So, can guarantee to press to the position that has the clearance between copper bar 11 and the circuit board 30, improve the elimination effect to the bubble, at the in-process of pressing down simultaneously, can avoid pressing the components and parts on the circuit board 30, cause the damage to the components and parts of circuit board 30, avoid leading to circuit board 30 to scrap in the preparation process to reduce the cost of manufacture in workshop.

Optionally, acquiring welding information, and writing the welding information into a two-dimensional code corresponding to the shunt 100, wherein the welding information comprises at least one of welding time, welding temperature and a pressing area, so that a worker can inquire according to the welding information in the two-dimensional code later; acquiring a welding detection result of the shunt 100; if the yield of the shunt preparation determined according to the welding detection result is smaller than the preset threshold, determining an adjustment working parameter of the shunt processing equipment according to the welding detection result and the welding information, so as to adjust the shunt processing equipment according to the adjustment working parameter, wherein the adjustment working parameter is optionally a control parameter of welding temperature, pressing area and welding duration. Alternatively, the welding detection result may be determined by irradiating the welding region with radiation, or by performing an experiment with red ink. Optionally, if there are more than a preset number of welding detection results that the edge of the circuit board is deformed, determining a welding pressing area again; if the welding detection result that is larger than the preset number is that the circuit board is burnt out during welding, the welding temperature needs to be determined again.

According to the preparation method of the technical scheme, the diverter main body 10 and the circuit board 30 are placed in a processing environment, the pressing area of the circuit board 30 is obtained, and when the diverter main body 10 and the circuit board 30 are welded, the pressing area of the circuit board 30 is pressed to drive the diverter main body 10 and the circuit board 30 to be close to each other for extrusion. In this way, the shunt main body 10 and the circuit board 30 can be tightly attached when being welded, and the generation of bubbles at the gap between the shunt main body and the circuit board 30 can be reduced when being welded, so that the influence of the bubbles on the impedance of the shunt 100 can be reduced.

Referring to fig. 3, fig. 3 is a second embodiment of the preparation method of the shunt according to the present invention, based on the first embodiment, before the step S10, further includes:

step S40, preparing the shunt body 10 and the circuit board 30, and preassembling the shunt body and the circuit board.

Wherein, step S40 includes:

step S41, preparing the shunt body 10 and the circuit board 30;

step S42 of fixing the deflector main body 10;

In step S43, the circuit board 30 is placed on the surface of the fixed surface of the shunt body 10.

In this embodiment, in the industrial line process, the two copper bars 11 and the resistor alloy 13 are welded in the preceding step to form the shunt body 10. Therefore, in the step S41 from the preceding step to the step of the present manufacturing method, the main body in the preceding step can be directly transported by the conveyor belt, and then the circuit board 30 can be subjected to the motherboard. In step S42, the shunt 100 is fixed to ensure that the shunt 100 is stable and does not deviate. In step S43, the circuit board 30 is sandwiched and the circuit board 30 is placed on the surface of the shunt body 10 facing the circuit board 30.

Alternatively, the circuit board 30 may be clamped manually, or may be clamped by an automation device, and the automation device may be a manipulator device 320 or an electric clamping jaw, etc., for example, the manipulator device 320 is used to implement clamping and releasing of the circuit board 30, so as to improve the automation preparation degree of the workshop, which is not limited herein. Thus, the method is convenient to operate and high in automation degree, so that the preparation efficiency of a workshop is improved.

Referring to fig. 4, fig. 4 is a third embodiment of the preparation method of the shunt according to the present invention, based on the first or second embodiment, step S30 includes:

Step S31, determining preset pressing force and preset pressing time according to the position information of the pressing area;

step S32, while welding the opposite surfaces of the shunt body 10 and the circuit board 30, pressing the pressing area of the circuit board 30 according to the preset pressing force and the preset pressing time so as to approach and press the shunt body 10.

Optionally, the pressing device is controlled to press the pressing area of the circuit board 30 according to a preset pressing force and a preset pressing time, wherein the pressing device may be a mechanical arm device. Optionally, the position information of different pressing areas corresponds to a preset pressing force and a preset pressing time.

Alternatively, the position information of the pressing area may be an edge position or a center position of the circuit board, or the like.

Optionally, the preset pressing force and the preset pressing time when the pressing area is located at the edge position of the circuit board are smaller than the preset pressing force and the preset pressing time when the pressing area is located at the center position of the circuit board. Optionally, the preset pressing force when the pressing area is located at the edge position of the circuit board is smaller than the preset pressing force when the pressing area is located at the center position of the circuit board, and the preset low-pressure time when the pressing area is located at the edge position of the circuit board is longer than the preset pressing time when the pressing area is located at the center position of the circuit board.

Optionally, by controlling the pressing area of the manipulator device 320 against the circuit board 30, an automatic pressing process can be achieved, and the manipulator device 320 can be controlled to give the circuit board 30 a preset pressing force and a preset pressing time, so that the effect of eliminating bubbles between the two can be improved while the circuit board 30 is not damaged. In some exemplary embodiments, the clamping and pressing of the circuit board 30 may be implemented by the manipulator device 320, and two functions may be implemented by one manipulator device 320, so that the number of devices may be reduced, and the device arrangement space of the workshop may be saved, so as to adapt to various workshop environments.

Here, it should be noted that, the force value of the preset pressing force to the circuit board 30 by the manipulator device 320 is not specifically limited, and the force value of the preset pressing force can be selected and adjusted according to the actual condition of the circuit board 30; for example, the substrate of the circuit board 30 may be a sheet material such as an epoxy glass laminated board, a ceramic substrate or a metal substrate, and the preset pressing force of the different types of substrates of the circuit board 30 may be different, so the force value of the preset pressing force may be adjusted according to the actual condition of the circuit board 30, so long as the air bubbles can be ensured to be pressed and eliminated, and the circuit board 30 is not damaged in the pressing process.

Likewise, the length of the preset pressing time is not specifically limited herein, and may be adjusted according to actual manufacturing conditions of the workshop. In the actual preparation process, the time length of the preset pressing time can be adjusted according to the magnitude of the force value of the preset pressing force. For example, when the force value of the preset pressing force is large, the preset pressing time can be correspondingly reduced at the moment so as to improve the preparation efficiency of the workshop; when the preset pressing force is smaller, the preset pressing time can be correspondingly increased, so that the eliminating effect on bubbles is ensured. In still other examples, the preset pressing time is also affected by specific welding conditions, for example, in the process of welding the diverter body 10 with the circuit board 30, the manipulator device 30 needs to be prevented from being too fast in the moving process between pressing and not pressing the circuit board 30, because if the manipulator device 30 moves too fast, severe impact is caused to the circuit board 30, so that the melted solder material is easy to splash under the severe impact, for example, the manipulator device 30 moves too fast and severe impact is caused to the melted solder paste, so that the risk of splashing of the solder paste exists, and further the risks of affecting the welding effect, causing injury to staff in workshops and the like exist; therefore, the preset pressing time can be adjusted according to the welding condition of the workshop, and is not particularly limited herein.

In the technical solution of this embodiment, according to the position information of the pressing area of the circuit board, the preset pressing force and the preset pressing time of the pressing device are determined, and the preparation is performed according to the shunts 100 corresponding to different preset pressing forces and preset pressing times, so as to realize the diversification of the shunts 100 processed by the shunt processing equipment.

Referring to fig. 5, fig. 5 is a fourth embodiment of the preparation method of the shunt according to the present invention, based on any one of the first to third embodiments, before step S30, further comprising:

step S50, acquiring position information of the pressing area on the circuit board 30;

step S30 includes:

step S33, if the position information of the pressing area is the preset position of the circuit board 30, determining a pressing force variation curve corresponding to the pressing area, where the pressing force is reduced as the pressing time increases after the pressing force variation curve is at the preset time point;

step S34, determining the pressing force and the corresponding pressing time according to the pressing force change curve;

step S35, soldering the surface of the circuit board 30 opposite to the shunt body 10, and pressing the pressing area of the circuit board 30 according to the pressing force and the pressing time.

Alternatively, position information of the pressing area on the circuit board 30 is acquired, wherein the position information may be a middle position or an edge position of the circuit board.

Alternatively, the preset position may be an edge position of the circuit board 30. Because the pressing area is at the edge of the circuit board 30, in the welding process, when the pressing area of the circuit board 30 is pressed, uneven stress is likely to occur, and the circuit board 30 corresponding to the pressing area is heated more, which may cause deformation of the edge area of the circuit board 30. Therefore, it is necessary to determine the pressing force variation curve corresponding to the pressing area.

Optionally, after a preset time point in the pressing force variation curve, the pressing force decreases with increasing pressing time. Optionally, in the pressing force variation curve, the pressing area of the circuit board 30 is pressed by using a first pressing force before the preset time point, and the pressing area of the circuit board 30 is pressed by using a second pressing force after the preset time point, wherein the first pressing force is greater than the second pressing force.

In the technical solution of this embodiment, by determining the pressure variation curve corresponding to the pressing area, so as to process different shunts 100, after the preset duration of welding the circuit board is pressed, the pressure of pressing the circuit board 30 is reduced, so that the situation that the edge of the circuit board 30 is deformed due to uneven heating of the circuit board 30 when the circuit board is pressed at the preset position is avoided.

Referring to fig. 6, fig. 6 is a fifth embodiment of a method for preparing a shunt according to the present invention, and based on any one of the first to fourth embodiments, step S30 includes:

step S36, determining a target pressing piece matched with the pressing area according to the area size of the pressing area;

and step S37, controlling the target pressing piece to press the pressing area of the circuit board while welding the opposite surfaces of the circuit board and the diverter main body.

Optionally, the diverter processing device is provided with a pressing device, and the pressing device is provided with pressing pieces with different sizes. Optionally, the pressing device is a manipulator device. Optionally, the target pressing member is a pressing member corresponding to a current pressing region, wherein the larger the region size of the pressing region is, the larger the target pressing member size for pressing the circuit board is; the smaller the area size of the pressing area, the smaller the target pressing piece size for pressing the circuit board.

Alternatively, the area size of the pressing area may be the area of the pressing area, or may be information such as the length and width of the pressing area.

Optionally, determining the pressing force of the target pressing member according to the area size of the pressing area; and controlling the target pressing piece while welding the opposite surfaces of the diverter main body and the circuit board, and pressing the pressing area of the circuit board according to the pressing force.

Optionally, the pressing areas have different area sizes, and the corresponding pressing forces of the target pressing members are different, and optionally, the larger the area size of the pressing area is, the larger the pressing force of the target pressing member for pressing the circuit board is; the smaller the area size of the pressing area, the smaller the pressing force of the target pressing member for pressing the circuit board.

Optionally, when the area size of the pressing area belongs to a preset first size range, the pressing piece corresponding to the preset first size range is acquired as the target pressing piece. And when the area size of the pressing area belongs to a preset second size range, acquiring the pressing force corresponding to the preset second size range.

Optionally, the diverter processing apparatus is provided with a detection device, wherein the detection device is for detecting the heating temperature, optionally the detection device is a temperature sensor. Controlling the heating device to heat the diverter main body 10 on the processing station and simultaneously controlling the detecting device to detect the temperature value of the heating surface of the diverter main body 10; the control device adjusts the heating temperature of the heating device according to the temperature value so that the heating surface of the distributor main body 10 changes. Optionally, when the temperature value of the heating surface is higher than a preset first threshold value, reducing the heating power of the heating device; and when the temperature value of the heating surface is lower than a preset second threshold value, increasing the heating power of the heating device.

Alternatively, the heating temperature at the time of welding may be varied. The step of soldering the surface of the shunt body 10 facing the circuit board 30 includes: acquiring a heating temperature curve of a heating surface of the shunt body 10, wherein the heating temperature curve is determined by temperature curve change of a welding surface of the shunt body 10; the heating device is controlled to heat the diverter body 10 at the processing station according to the heating temperature profile.

Optionally, the heating temperature of the heating surface is related to the heating temperature of the welding surface, and the higher the heating temperature of the heating surface is, the higher the heating temperature of the welding surface is; the lower the heating temperature of the heating surface, the lower the heating temperature of the welding surface. Then, from the historical temperature data obtained by the test, a heating temperature profile corresponding to a temperature change profile required for the welding surface of the shunt 100 can be determined. Optionally, the determination of the heating temperature profile is affected by factors such as the type of material of the shunt body 10, the thickness of the material, the thickness of the circuit board 30, etc. Through the control to the temperature, avoid the circuit board to burn out in the welding process, perhaps avoid the welding temperature condition such as not enough high.

In the technical scheme of the embodiment, different shunts are processed through different welding modes, and the heating temperature and the heating time are controlled, so that different shunts 100 are processed, and the situation that the circuit board is deformed due to overhigh temperature is avoided.

Referring to fig. 7, fig. 7 is a sixth embodiment of a method for preparing a shunt according to the present invention, based on any one of the first to fifth embodiments, after step S30, further including:

step S60, vibrating either the circuit board 30 or the shunt body 10 according to the preset vibration parameters.

In the present embodiment, since the pressing pressure is substantially perpendicular to the surface of the circuit board 30, there is no good effect of eliminating bubbles in the direction parallel to the surface of the circuit board 30. Therefore, in order to further improve the bubble eliminating effect between the circuit board 30 and the shunt body 10, in step S40, by vibrating either the circuit board 30 or the copper bar 11 according to the preset vibration parameter, the bubbles can be further eliminated on the basis of the extrusion, and the bubbles can be eliminated in the direction parallel to the surface of the circuit board 30, so that the bubble eliminating effect between the circuit board 30 and the copper bar 11 of the shunt body 10 can be further improved, and the detection accuracy of the shunt 100 to the current can be further improved.

Specifically, the diverter main body 10 may be vibrated according to preset vibration parameters, for example, a vibration device is disposed in the workbench 310, the diverter main body 10 is driven to vibrate by the vibration device, or the diverter main body 10 is driven to vibrate by the manipulator device 320; the circuit board 30 may also be vibrated according to preset vibration parameters, which is not limited herein.

Optionally, the welding surface of the diverter body is provided with at least one groove in parallel, and the length of the groove is greater than the width of the welding surface and less than the width of the diverter body, so as to discharge bubbles generated during welding.

Optionally, the control manipulator device 320 vibrates either the circuit board 30 or the shunt body 10 according to a preset vibration parameter.

In this embodiment, in step S41, by controlling the manipulator device 320 to vibrate any one of the circuit board 30 and the shunt body 10 according to the preset vibration parameters, the manipulator device 320 can give the circuit board 30 or the shunt body 10 preset vibration amplitude and preset vibration time, so that an automatic vibration effect can be achieved, and the preparation efficiency and the preparation effect can be improved. Moreover, in some exemplary embodiments, the three functions of clamping the circuit board 30, pressing and vibrating may be implemented by the manipulator device 320, for example, the manipulator device 320 clamps the circuit board 30 to be placed on the surface of the copper bar 11 of the shunt body 10, and then controls the manipulator device 320 to press and vibrate the circuit board 30 to eliminate bubbles between the copper bar 11 of the shunt body 10 and the circuit board 30. Therefore, the number of devices can be further reduced, the device arrangement space of a workshop is saved, and the device arrangement space can be more suitable for various workshop environments. It should be noted that, the preset amplitude and the preset vibration time of the manipulator device 320 are not specifically limited, and may be adjusted according to the actually required bubble eliminating effect and the actual manufacturing process of the workshop. For example, under the condition that the preset amplitude and the preset vibration time can ensure good elimination of bubbles, the excessive amplitude of the preset amplitude and the overlong preset vibration time can be avoided, so that the preparation efficiency of a workshop can be ensured, and meanwhile, the welding material between the shunt main body 10 and the circuit board 30 is prevented from splashing in the vibration process.

The invention provides a shunt processing device, which comprises a memory, a processor and a preparation program of a shunt stored in the memory and executable on the processor, wherein the preparation program of the shunt realizes the steps of the preparation method of the shunt in the embodiment when being executed by the processor.

Referring to fig. 1 and 8, the present application further proposes a diverter processing apparatus 300, and may be used to implement the method for preparing a diverter in any of the above embodiments, where the diverter processing apparatus 300 includes:

a first fixing member provided with one of the shunt body 10 and the circuit board 30; and

and a second fixing member provided with the other of the shunt body 10 and the circuit board 30, the first fixing member and the second fixing member being relatively moved therebetween so that the circuit board 30 and the shunt body 10 are brought close to and abutted against each other.

In this embodiment, the manner of moving the first fixing component and the second fixing component relatively may be that the first fixing component is fixed, and the second fixing component moves, for example, the first fixing component is a workbench 310, and the second fixing component is a pressing device; the second fixing component may be fixed, and the first fixing component moves, for example, the second fixing component is a workbench 310, and the first fixing component is a pressing device; the first fixing component and the second fixing component may both move, for example, the first fixing component and the second fixing component are both pressing devices, which are not limited herein. In this way, by bringing the circuit board 30 and the copper bar 11 of the shunt body 10 close to each other, air bubbles between them can be eliminated, and the air bubble rate between them can be reduced, so that the accuracy of detecting the current by the shunt 100 can be improved.

Optionally, the first fixing component is a workbench 310, and a processing station for placing one of the copper bar 11 or the circuit board 30 is arranged on the workbench 310;

the second fixing component is a pressing device, and the pressing device is movably arranged above the processing station and is used for pressing the other of the diverter main body 10 or the circuit board 30 so as to enable the circuit board 30 and the diverter main body 10 to be close to each other and to be abutted.

In this embodiment, the workbench 310 is provided with a processing station, and when one of the copper bar 11 and the circuit board 30 is placed on the processing station and the copper bar 11 and the circuit board 30 are preassembled, the processing environment is provided in the shunt processing apparatus 300. So that the pressing means can press the copper bar 11 or the other of the circuit board 30 to bring the circuit board 30 close to and press the copper bar 11 while soldering the circuit board 30 and the copper bar 11 of the shunt body 10. In this way, the copper bar 11 or the circuit board 30 can be pressed by the pressing device, so that the circuit board 30 and the shunt body 10 are mutually close to each other and pressed, air bubbles between the two are eliminated, the air bubble rate between the two is reduced, and the detection precision of the shunt 100 on current can be improved.

The shunt processing apparatus 300 further includes a soldering device (not shown) disposed above the processing station to solder the circuit board 30 with the copper bar 11 of the shunt body 10. Here, the pressing device may be a manipulator device 320 or a weight device, and the other of the shunt body 10 and the circuit board 30 may be pressed by the manipulator device 320, or the other of the shunt body 10 and the circuit board 30 may be pressed by the weight device, so that the circuit board 30 and the shunt body 10 may be close to each other and abut against each other, which is not limited herein.

Referring to fig. 8, in an embodiment of the present invention, the pressing device is a manipulator device 320.

In this embodiment, it can be understood that when the pressing device is the manipulator device 320, the copper bar 11 or the circuit board 30 that is automatically abutted against the shunt body 10 can be realized, so as to improve the automation degree of the shunt processing device 300, and improve the manufacturing efficiency of the workshop. Specifically, the manipulator device 320 may be a multi-axis manipulator, so as to implement a function of flexible movement and abutment.

Referring to fig. 8, in an embodiment of the present invention, the manipulator device 320 is movably disposed above the processing station, and the manipulator device 320 is used to press and vibrate the other of the diverter body 10 or the circuit board 30.

In this embodiment, it can be understood that the manipulator device 320 can simultaneously realize the function of pressing and vibrating the copper bar 11 of the shunt body 10 or the other of the circuit board 30, so that the two functions of pressing and vibrating can be realized by the manipulator device 320, thus, the number of devices in the shunt processing device 300 can be further reduced, the arrangement space of the shunt processing device 300 between workshops can be saved, and the device can be more suitable for various workshop environments.

Referring to fig. 8, in an embodiment of the present invention, the splitter processing apparatus 300 further includes an identifying device 330, where the identifying device 330 is disposed on the second fixing component and is used for identifying the surface of the circuit board 30 facing the splitter main body 10, so as to obtain surface information of the circuit board 30.

In this embodiment, the recognition device 330 may be a CCD device (Charge Coupled Device ) or a CMOS (Complementary Metal-Oxide-Semiconductor, complementary metal Oxide Semiconductor) device, etc., and when the recognition device 330 is a CCD device, the surface information of the circuit board 30 can be recognized quickly and accurately. The surface information may be pad information and/or positional setting information of the component, and the like, and is not particularly limited herein.

In some exemplary embodiments, the identification device 330 may be mounted on the manipulator device 320, so as to improve the accuracy of the manipulator device 320 when performing the clamping, pressing or vibrating operations.

Referring to fig. 8, in an embodiment of the present invention, the stage 310 is a heating stage, and the heating stage includes a stage main body, a heating device and a control device;

the heating device and the control device are arranged in the table main body, the processing station is arranged on the surface of the table main body, and the control device is connected with the heating device so that the heating device can heat one of the diverter main body 10 or the circuit board 30 on the processing station.

In this embodiment, the heating platform may further include a detecting device (not shown in the figure), and after the detecting device detects the temperature of the surface of the table main body, the control device adjusts the heating temperature of the heating device according to the detected temperature value, so that the surface temperature of the table main body changes. Therefore, the heating device can heat one of the diverter main body 10 or the circuit board 30 on the processing station in a constant temperature environment, and automatic adjustment is realized while the welding effect and efficiency are improved.

Referring to fig. 8, in an embodiment of the present invention, the apparatus 300 further includes a carrier 340, where the carrier 340 is disposed on the processing station and is used for carrying one of the shunt body 10 or the circuit board 30, and the carrier 340 is made of a heat conductive material.

In this embodiment, the carrier 340 can ensure the bearing and fixing effects on one of the copper bar 11 of the shunt body 10 and the circuit board 30, and ensure the relative fixing between the copper bar 11 and the circuit board 30 when the manipulator device 320 presses against the other of the shunt body 10 and the circuit board 30, and ensure the pressing effect. The material of the carrier 340 may be a heat conductive material, for example, a metal material or a silicone material, which is not particularly limited herein.

Referring to fig. 8, in an embodiment of the present invention, the diverter processing apparatus 300 further includes a vacuum cover (not shown) movably disposed above the processing station and configured to cover the diverter body 10, the circuit board 30 and the pressing device, so that the diverter body 10 and the circuit board 30 are welded in a vacuum environment.

In this embodiment, when the copper bar 11 of the shunt body 10 is to be welded to the circuit board 30, the copper bar 11, the circuit board 30 and the pressing device can be covered by the vacuum cover, so that the copper bar 11 of the shunt body 10 and the circuit board 30 are welded in a vacuum environment, and when the copper bar 11 and the circuit board 30 are welded in the vacuum environment, the bubbles between the copper bar 11 and the circuit board 30 are broken due to the vacuum environment, so that part of bubbles between the copper bar 11 and the circuit board 30 can be eliminated, and the detection accuracy of the shunt 100 to current is improved.

Furthermore, the present invention also proposes an industrial line (not shown in the figures) comprising a diverter processing apparatus 300 as described above.

It should be noted that, the detailed structure of the diverter processing apparatus 300 may refer to the embodiment of the diverter processing apparatus 300 described above, and will not be described herein again; because the diverter processing apparatus 300 is used in the industrial assembly line of the present invention, the embodiments of the diverter processing apparatus 300 of the present invention include all the technical solutions of all the embodiments of the diverter processing apparatus 300, and the achieved technical effects are identical, and are not described in detail herein.

The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.

Claims

1. The preparation method of the shunt is characterized by being applied to shunt processing equipment, wherein the shunt comprises a shunt main body and a circuit board, and the preparation method of the shunt comprises the following steps:

2. The method of manufacturing a shunt according to claim 1, wherein said shunt processing device is provided with identification means, and said step of acquiring surface information on said circuit board and locating a pressing area based on said surface information comprises:

determining at least one pressing point according to the surface information;

3. The method of manufacturing a shunt according to claim 1, wherein the shunt processing device is provided with a pressing means, and the step of pressing the pressing area of the circuit board so as to approach and press the shunt body while welding the surface of the shunt body facing the circuit board comprises:

4. The method of manufacturing a shunt according to claim 1, wherein the step of pressing the pressing region of the circuit board so as to approach and press the shunt body while soldering the surface of the shunt body facing the circuit board comprises:

5. The method of manufacturing a shunt according to claim 1, wherein, before the step of pressing the pressing region of the circuit board while soldering the surfaces of the circuit board and the shunt body facing each other, further comprising:

Acquiring position information of the pressing area on the circuit board;

6. The method of manufacturing a shunt according to claim 1, wherein the shunt processing device is provided with a pressing device provided with pressing pieces of different sizes, and the step of pressing the pressing area of the circuit board while soldering the surfaces of the circuit board and the shunt body facing each other includes:

7. The method of manufacturing a shunt according to claim 6, wherein the step of controlling the target pressing member to press the pressing region of the circuit board while the facing surfaces of the circuit board and the shunt body are soldered includes:

8. The method of manufacturing a shunt according to claim 1, wherein the step of pressing the pressing region of the circuit board so as to approach and press the shunt body while the facing surfaces of the circuit board and the shunt body are soldered, further comprises:

Obtaining a welding detection result of the shunt;

9. The method of manufacturing a shunt according to any one of claims 1 to 8, characterized by further comprising, after the step of pressing the pressing region of the circuit board while soldering the surfaces of the circuit board and the shunt body facing each other:

10. A shunt processing apparatus comprising a memory, a processor, and a shunt preparation program stored in the memory and executable on the processor, which when executed by the processor, performs the steps of the shunt preparation method of any one of claims 1-9.