CN116287857A - High-elasticity high-strength high-conductivity Cu-Ni-Sn alloy and preparation method thereof - Google Patents
High-elasticity high-strength high-conductivity Cu-Ni-Sn alloy and preparation method thereof Download PDFInfo
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 123
- 239000000956 alloy Substances 0.000 title claims abstract description 123
- 229910018100 Ni-Sn Inorganic materials 0.000 title claims abstract description 81
- 229910018532 Ni—Sn Inorganic materials 0.000 title claims abstract description 81
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052718 tin Inorganic materials 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- 239000010955 niobium Substances 0.000 claims abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 9
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 9
- 230000032683 aging Effects 0.000 claims description 27
- 238000001192 hot extrusion Methods 0.000 claims description 19
- 239000000243 solution Substances 0.000 claims description 14
- 238000003801 milling Methods 0.000 claims description 13
- 239000006104 solid solution Substances 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 238000000265 homogenisation Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 abstract description 9
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 230000002195 synergetic effect Effects 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 9
- 238000003723 Smelting Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 230000007547 defect Effects 0.000 description 8
- 238000005728 strengthening Methods 0.000 description 8
- 238000005204 segregation Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 230000006698 induction Effects 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
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- 239000002994 raw material Substances 0.000 description 2
- 239000011573 trace mineral Substances 0.000 description 2
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- 229910000906 Bronze Inorganic materials 0.000 description 1
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- 229910019790 NbNi Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
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- 230000001427 coherent effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
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- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1094—Alloys containing non-metals comprising an after-treatment
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract
The invention discloses a Cu-Ni-Sn alloy with high elasticity, high strength and high conductivity and a preparation method thereof, belonging to the technical field of metal material processing. The high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following components in percentage by mass: 8 to 18 percent of nickel, 6 to 10 percent of tin, 0.1 to 1.0 percent of silicon, 0.1 to 1.2 percent of niobium, 0.02 to 0.5 percent of yttrium, and the balance of copper and other unavoidable impurity elements. The invention adopts a microalloying mode, and the components of the copper-nickel-tin alloy are optimally regulated, so that the strength and the elastic modulus of the Cu-Ni-Sn alloy are obviously improved by the synergistic effect among the elements, the conductivity of the copper-nickel-tin alloy cannot be influenced, the prepared copper-nickel-tin alloy can be kept bright and beautiful and not darkened after being stored in the air for a long time, and the diversified application of the connector can be obtained.
Description
Technical Field
The invention belongs to the technical field of metal material processing, and particularly relates to a Cu-Ni-Sn alloy with high elasticity, high strength and high conductivity and a preparation method thereof.
Background
The switch, connector, elastic device, etc. in the insert directly determine the performance of the insert. For the plugboard, the quality of the copper sheet inside the plugboard directly determines the quality of the plugboard. In recent years, there has been an increasing demand for copper connectors for tensile strength, elastic modulus, electrical conductivity, bending workability, and stress relaxation resistance. Cu-Ni-Sn alloys, such as Cu-15Ni-8Sn, cu-9Ni-6Sn and Cu-6Ni-2Sn, are widely used in the fields of aerospace parts, electronic elastic components, electronic packaging and the like as conductive elastic copper alloys because of good conductivity, creep resistance and other comprehensive properties. In particular, the strength of the Cu-15Ni-8Sn alloy can reach more than 1000MPa, which is equivalent to that of toxic Cu-Be alloy and high-strength steel, so that the mechanical properties of the Cu-15Ni-8Sn alloy under high load conditions such as petroleum drilling platforms, heavy equipment and the like are better than those of the traditional tin bronze and beryllium copper alloy.
The Cu-Ni-Sn alloy belongs to an aging amplitude modulation decomposition reinforced copper alloy, and as an environment-friendly conductive elastic copper alloy, ni can obviously improve tensile strength, corrosion resistance, hardness, resistance and thermoelectric property and reduce resistivity temperature coefficient. Sn has effects of solid solution strengthening and improving stress relaxation resistance. The Ni and the Sn are solid-dissolved into the alpha phase of Cu through solid solution treatment to obtain an unstable supersaturated solid solution phase, and then a coherent metastable two-phase structure is formed in the grains through subsequent aging treatment, so that an elastic stress field is generated to block dislocation movement, and a strengthening effect is generated.
At present, copper nickel tin is preparedThe main technical route of the alloy is as follows: casting, homogenizing treatment, solution treatment, hot and cold deformation and aging treatment. The performance of the alloy is controlled mainly by controlling the aging temperature and the aging time, but in the aging process, the precipitation amount of nano-scale precipitated phases is small, and the strength, the plasticity and the conductivity of the alloy cannot be greatly improved, so that the hardness is reduced. Secondly, the research of micro-alloying, such as adding trace Fe, si, nb, al, ti, mn, zr, etc., and the influence mechanism of fusion casting process, hot-cold deformation and aging process on the microstructure and mechanical property of the alloy are researched by universities and scientific research institute at home. But still does not solve the large-area segregation phenomenon of Sn in the casting process, mainly because the alloy is easy to precipitate lamellar discontinuous precipitated phases in the aging process, the plasticity and the hardness are reduced, and the comprehensive performance of the alloy is greatly influenced. Finally, the mechanism research of the influence of trace elements on the comprehensive performance of the alloy by adding trace elements into a Cu-Ni-Sn alloy matrix in a microalloying mode is not completely mature. Based on the above points, the copper-nickel-tin alloy is not applied to industrialization. The invention provides a high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy and a preparation method thereof, which aim to further solve the problem of large-area segregation of Sn element in the casting process and separate discontinuous lamellar L1 in the aging process by a microalloying mode 2 The phase causes problems of reduced alloy strength, reduced elongation and subsequent processing to workpiece cracking.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a Cu-Ni-Sn alloy with high elasticity, high strength and high conductivity and a preparation method thereof.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following components in percentage by mass: 8 to 18 percent of nickel, 6 to 10 percent of tin, 0.1 to 1.0 percent of silicon, 0.1 to 1.2 percent of niobium, 0.02 to 0.5 percent of yttrium, and the balance of copper and other unavoidable impurity elements.
The high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy takes three elements of Cu, ni and Sn as matrixes, and improves microstructure and mechanics of ternary alloy in a microalloying modeInsufficient performance. The invention avoids the problems of hardness and strength reduction of alloy and large-area segregation of Sn element by regulating and controlling the proportion of Ni and Sn. In addition, the invention also inhibits the formation and growth of discontinuous precipitated phases in the later period of aging by adding trace Si elements. Meanwhile, the added Si element mainly forms Ni 3 Si phase, and improves the conductivity and hardness of the alloy. By adding a small amount of Nb to be solid-dissolved in the alloy matrix, a precipitate phase Ni is formed with Ni and Sn in the matrix 3 Nb and NbNi 2 Sn improves the ductility, elastic modulus and conductivity of the alloy. The micro rare earth element Y is added to obviously refine grains, so that a small amount of nano spherical particles Ni are precipitated at the grain boundary and in the grains 2 Y and Sn 3 Y blocks grain boundary movement, improves uniformity of alloy structure, inhibits discontinuous cellular precipitation, and improves alloy strength.
As a preferred embodiment of the invention, the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following components in percentage by mass: 9 to 16 percent of nickel, 6 to 8 percent of tin, 0.2 to 0.8 percent of silicon, 0.3 to 0.8 percent of niobium, 0.2 to 0.3 percent of yttrium, and the balance of copper and other unavoidable impurity elements.
More preferably, the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following components in percentage by mass: 15.0% of nickel, 8.0% of tin, 0.4% of niobium, 0.5% of silicon, 0.25% of yttrium, and the balance of copper and other unavoidable impurity elements.
The invention also claims a preparation method of the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy, which comprises the following steps:
(1) And (3) carrying out raw material metal sample preparation according to the mass percentage of the Cu-Ni-Sn alloy element composition, and smelting the prepared sample to obtain a Cu-Ni-Sn alloy ingot blank.
(2) The Cu-Ni-Sn alloy ingot blank is firstly subjected to surface milling treatment and then is subjected to homogenization treatment.
(3) And carrying out hot extrusion deformation treatment on the homogenized Cu-Ni-Sn alloy ingot blank.
(4) And carrying out solid solution and aging treatment on the ingot blank subjected to hot extrusion deformation treatment to obtain the Cu-Ni-Sn alloy with high elasticity, high strength and high conductivity.
As a preferred embodiment of the present invention, the raw metal is electrolytic copper, electrolytic nickel, tin balls, silicon 13502, high-purity niobium flakes and high-purity yttrium powder; the purity of the raw material metal is more than or equal to 99.99 percent. When the purity is not high, the presence of other impurity elements will affect the overall properties of the alloy.
In the preferred embodiment of the present invention, in the step (1), the melting temperature is 1250 to 1350 ℃ and the time is 8 to 10 minutes.
The too low smelting temperature can lead to insufficient melting of alloy elements and insufficient mixing time, so that the structure is uneven and the mechanical property is reduced. However, if the melting temperature is too high, the elements are burned and volatilized, the effect of microalloying is not achieved, and in addition, the segregation of Sn element is easy to occur, so that the mechanical property is deteriorated.
In the step (2), the thickness of the upper and lower milling surfaces of the milling surface treatment is 0.2-0.4 mm.
In a preferred embodiment of the present invention, in the step (3), the homogenization treatment is performed at a temperature of 850 to 900 ℃ for 480 to 600 minutes.
According to the invention, surface defects are removed by carrying out surface milling treatment on the alloy cast ingot. And then homogenizing treatment is carried out to ensure that the internal structure of the alloy is more uniform.
In the preferred embodiment of the present invention, in the step (3), the temperature of the hot extrusion deformed cu—ni—sn alloy ingot is 870 to 900 ℃ and the temperature of the extrusion vessel is 380 to 450 ℃.
In a preferred embodiment of the present invention, in the step (4), the solution treatment temperature is 790 to 860 ℃ and the time is 60 to 120 minutes.
According to the invention, the Sn-rich phase and the Ni-rich phase are fully dissolved, decomposed and diffused into the Cu matrix through solution treatment, so that the large-area segregation of Sn is reduced. However, if the solid solution temperature and time are lower than the range defined by the invention, insufficient diffusion will be caused, and the mechanical properties will be affected; if the solution temperature and time are outside the range defined by the present invention, desolventizing may be caused, and supersaturated solid solution is concentrated at grain boundaries, thereby affecting the overall properties of the alloy.
In the step (4), the aging treatment temperature is 350 to 450 ℃ and the aging treatment time is 180 to 300 minutes.
According to the invention, through aging treatment, aging precipitation is uniform and dispersed in the strengthening phase of the matrix, so that the tensile strength, elastic modulus and conductivity of the alloy are improved.
Compared with the prior art, the invention has the beneficial effects that:
(1) The invention adopts a microalloying mode, and the components of the copper-nickel-tin alloy are optimally regulated, so that the strength and the elastic modulus of the Cu-Ni-Sn alloy are obviously improved by the synergistic effect among the elements, the conductivity of the copper-nickel-tin alloy cannot be influenced, the prepared copper-nickel-tin alloy can be kept bright and beautiful and not darkened after being stored in the air for a long time, and the diversified application of the connector can be obtained.
(2) The preparation method of the Cu-Ni-Sn alloy realizes and utilizes multiple composite factors to strengthen and toughen the Cu-Ni-Sn alloy. The preparation method has the advantages of short process flow, simple operation and low process cost, and is suitable for large-scale application. The obtained high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy has the characteristics of fine grain strengthening, deformation strengthening, dispersion strengthening and precipitation hardening, so that higher strength, hardness, elastic modulus and conductivity are obtained.
Drawings
FIG. 1 is a micrograph of a Cu-Ni-Sn alloy prepared in comparative example 1.
FIG. 2 is a micrograph of a high-elasticity, high-strength and high-conductivity Cu-Ni-Sn alloy prepared in example 5.
Detailed Description
For a better description of the objects, technical solutions and advantages of the present invention, the present invention will be further described with reference to the following specific examples.
Examples 1 to 5
TABLE 1
The preparation method of the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following steps:
(1) Preparing samples according to the mass percentages of the Cu-Ni-Sn alloy elements in the table 1, and smelting the prepared samples at 1250 ℃ for 8min by adopting a vacuum arc induction smelting integrated furnace to obtain a Cu-Ni-Sn alloy ingot blank.
(2) The Cu-Ni-Sn alloy ingot blank is firstly processed by milling surface to the thickness of 0.2mm up and down, and then is processed by homogenization treatment at 850 ℃ for 480min.
(3) Carrying out hot extrusion deformation treatment on the homogenized Cu-Ni-Sn alloy ingot blank; the ingot blank temperature is 870 ℃ and the extrusion barrel temperature is 380 ℃.
(4) Carrying out solid solution and aging treatment on the ingot blank subjected to hot extrusion deformation treatment to obtain a high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy; the solution treatment temperature is 790 ℃ and the time is 60min; the aging treatment temperature is 350 ℃ and the time is 180min.
Example 6
The preparation method of the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following steps:
(1) The sample is prepared according to the mass percentage of the Cu-Ni-Sn alloy element composition in the embodiment 1, and the prepared sample is smelted for 9min at 1300 ℃ by adopting a vacuum arc induction smelting integrated furnace, so as to obtain a Cu-Ni-Sn alloy ingot blank.
(2) The Cu-Ni-Sn alloy ingot blank is firstly processed by milling surface to the thickness of 0.3mm up and down, and then is processed by homogenization treatment for 500min at 870 ℃.
(3) Carrying out hot extrusion deformation treatment on the homogenized Cu-Ni-Sn alloy ingot blank; the temperature of the ingot blank is 880 ℃, and the temperature of the extrusion cylinder is 400 ℃.
(4) Carrying out solid solution and aging treatment on the ingot blank subjected to hot extrusion deformation treatment to obtain a high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy; the solution treatment temperature is 830 ℃ and the time is 100min; the aging treatment temperature is 400 ℃ and the time is 280min.
Example 7
The preparation method of the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following steps:
(1) The sample is prepared according to the mass percentage of the Cu-Ni-Sn alloy element composition in the embodiment 1, and the prepared sample is smelted for 10min at 1350 ℃ by adopting a vacuum arc induction smelting integrated furnace, so as to obtain a Cu-Ni-Sn alloy ingot blank.
(2) The Cu-Ni-Sn alloy ingot blank is firstly processed by milling surface to the thickness of 0.4mm up and down, and then is processed by homogenization treatment for 600min at 870 ℃.
(3) Carrying out hot extrusion deformation treatment on the homogenized Cu-Ni-Sn alloy ingot blank; the ingot temperature was 900 ℃ and the extrusion barrel temperature was 450 ℃.
(4) Carrying out solid solution and aging treatment on the ingot blank subjected to hot extrusion deformation treatment to obtain a high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy; the solution treatment temperature is 850 ℃ and the time is 120min; the aging treatment temperature is 450 ℃ and the time is 300min.
Comparative examples 1 to 7
TABLE 2
The preparation method of the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy in comparative examples 1 to 7 is only different from that in example 7: in the step (1), the mass percentages of the Cu-Ni-Sn alloy element compositions are prepared according to the table 2.
Comparative example 8
The preparation method of the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following steps:
(1) The sample is prepared according to the mass percentage of the Cu-Ni-Sn alloy element composition in the embodiment 1, and the prepared sample is smelted for 8min at 1250 ℃ by adopting a vacuum arc induction smelting integrated furnace, so as to obtain a Cu-Ni-Sn alloy ingot blank.
(2) The Cu-Ni-Sn alloy ingot blank is firstly processed by milling surface to the thickness of 0.2mm up and down, and then is processed by homogenization treatment at 850 ℃ for 480min.
(3) Carrying out solid solution and aging treatment on the homogenized Cu-Ni-Sn alloy ingot blank to obtain high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy; the solution treatment temperature is 790 ℃ and the time is 60min; the aging treatment temperature is 350 ℃ and the time is 180min.
Comparative example 9
The preparation method of the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following steps:
(1) The sample is prepared according to the mass percentage of the Cu-Ni-Sn alloy element composition in the embodiment 1, and the prepared sample is smelted for 8min at 1250 ℃ by adopting a vacuum arc induction smelting integrated furnace, so as to obtain a Cu-Ni-Sn alloy ingot blank.
(2) Carrying out hot extrusion deformation treatment on the Cu-Ni-Sn alloy ingot blank; the ingot blank temperature is 870 ℃ and the extrusion barrel temperature is 380 ℃.
(3) And (3) carrying out surface milling treatment on the Cu-Ni-Sn alloy ingot blank subjected to hot extrusion deformation treatment until the thickness is 0.2mm, and homogenizing at 850 ℃ for 480min.
(4) Carrying out solid solution and aging treatment on the ingot blank subjected to the surface milling treatment to obtain a high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy; the solution treatment temperature is 790 ℃ and the time is 60min; the aging treatment temperature is 350 ℃ and the time is 180min.
Effect example
To compare technical effects of the examples and comparative examples according to the present invention, the alloys prepared in the examples and comparative examples were respectively tested for tensile strength, elastic modulus, hardness and electrical conductivity at room temperature, and the results are shown in table 3.
TABLE 3 Table 3
From the test results of Table 3, it is understood that the Si, nb and Y elements added to the Cu-Ni-Sn alloy can improve and enhance the tensile strength, elastic modulus, hardness and electrical conductivity of the alloy, thereby enhancing the overall properties of the alloy. And the Si, nb and Y elements have obvious synergistic effect, so that the comprehensive performance of the alloy is improved. From the data of examples 1-5, the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy comprises the following components in percentage by mass: the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy has the best comprehensive performance when 15.0% of nickel, 8.0% of tin, 0.4% of niobium, 0.5% of silicon, 0.25% of yttrium and the balance of copper and other unavoidable impurity elements. According to the data of the embodiment 1 and the comparative examples 8-9, the extrusion treatment can strengthen the comprehensive performance of the alloy, mainly because the amplitude modulation decomposition type Cu-Ni-Sn alloy is subjected to hot extrusion deformation treatment, the defects in the as-cast alloy are basically eliminated, the microstructure is obviously improved, uniform and fine grains are obtained, and the alloy is ensured to have excellent toughness; secondly, a continuous second phase is precipitated in the alloy structure after thermal deformation, so that the precipitation strengthening effect is remarkable; meanwhile, high-density dislocation and continuous phase are generated at the grain boundary in the deformation process of the alloy, the separation of the discontinuous phase is prevented, and the dislocation strengthening effect is obvious; thus, hot extrusion results in an increase in strength and hardness of the alloy. Because the alloy is deformed by hot extrusion, compared with cold deformation, the defects such as vacancies and the like in the structure are fewer, and solute atoms reduce electron scattering; on the other hand, trace Si, nb and Y elements are added to be dissolved in the matrix in a solid way, and the volume fraction of solute atoms is larger, so that the conductivity of the alloy is improved. The Cu-Ni-Sn alloy is firstly subjected to surface milling treatment and then extrusion treatment, so that the alloy performance can be obviously improved, and mainly because the alloy has defects of concentrated lock holes, shrinkage porosity, pits and the like on the surface of the smelted ingot blank, the surface milling treatment is firstly performed before hot extrusion, oxide layers and partial defects on the surface can be removed, the surface of the alloy ingot blank is smooth, the biting of an extrusion cylinder is facilitated, and the extrusion effect is greatly enhanced; on the contrary, if the alloy surface is defective to perform hot extrusion, the extrusion effect is poor, and the comprehensive performance of the alloy is reduced.
From the micrographs of the alloys of fig. 1 and 2, it is apparent that the cu—ni—sn alloy to which no alloying element is added in fig. 1 has a large defect area, has a large number of discontinuous phases in the casting process, has a large dislocation density, has a nonuniform structure, and has a large segregation of Sn. In fig. 2, the high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy prepared by microalloying design and optimization, deformation and heat treatment process optimization has fewer defects, reduces the segregation of Sn, and has uniform structure, so that the alloy performance is greatly improved.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted equally without departing from the spirit and scope of the technical solution of the present invention.
Claims (10)
1. The Cu-Ni-Sn alloy with high elasticity, high strength and high conductivity is characterized by comprising the following components in percentage by mass: 8 to 18 percent of nickel, 6 to 10 percent of tin, 0.1 to 1.0 percent of silicon, 0.1 to 1.2 percent of niobium, 0.02 to 0.5 percent of yttrium, and the balance of copper and other unavoidable impurity elements.
2. The high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy according to claim 1, which comprises the following components in percentage by mass: 9 to 16 percent of nickel, 6 to 8 percent of tin, 0.2 to 0.8 percent of silicon, 0.3 to 0.8 percent of niobium, 0.2 to 0.3 percent of yttrium, and the balance of copper and other unavoidable impurity elements.
3. The high-elasticity high-strength high-conductivity Cu-Ni-Sn alloy according to claim 1, which comprises the following components in percentage by mass: 15.0% of nickel, 8.0% of tin, 0.4% of niobium, 0.5% of silicon, 0.25% of yttrium, and the balance of copper and other unavoidable impurity elements.
4. A method for producing a highly elastic, high strength, highly conductive Cu-Ni-Sn alloy as defined in any one of claims 1-3, comprising the steps of:
(1) Sample preparation is carried out according to the mass percentage of the Cu-Ni-Sn alloy element composition, and the prepared sample is smelted to obtain a Cu-Ni-Sn alloy ingot blank;
(2) Firstly milling the surface of a Cu-Ni-Sn alloy ingot blank, and then homogenizing;
(3) Carrying out hot extrusion deformation treatment on the homogenized Cu-Ni-Sn alloy ingot blank;
(4) And carrying out solid solution and aging treatment on the ingot blank subjected to hot extrusion deformation treatment to obtain the Cu-Ni-Sn alloy with high elasticity, high strength and high conductivity.
5. The method of producing a highly elastic, high strength, highly conductive Cu-Ni-Sn alloy according to claim 4, wherein in step (1), the melting temperature is 1250 to 1350 ℃ and the time is 8 to 10 minutes.
6. The method of producing a highly elastic, high strength, highly conductive Cu-Ni-Sn alloy according to claim 4, wherein in step (2), the thickness of both the upper and lower milled surfaces of the milled surface treatment is 0.2-0.4 mm.
7. The method of producing a highly elastic, high strength, highly conductive Cu-Ni-Sn alloy according to claim 4, wherein in step (3), the homogenization is performed at a temperature of 850 to 900℃for 480 to 600 minutes.
8. The method of producing a highly elastic, high strength and highly conductive Cu-Ni-Sn alloy according to claim 4, wherein in step (3), the temperature of the hot extrusion deformed Cu-Ni-Sn alloy ingot is 870 to 900 ℃ and the temperature of the extrusion vessel is 380 to 450 ℃.
9. The method of producing a highly elastic, high strength, highly conductive Cu-Ni-Sn alloy according to claim 4, wherein in step (4), the solution treatment temperature is 790 to 860 ℃ and the time is 60 to 120 minutes.
10. The method of producing a highly elastic, high strength, highly conductive Cu-Ni-Sn alloy according to claim 4, wherein in step (4), the aging temperature is 350 to 450 ℃ and the time is 180 to 300 minutes.
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