CN116281831A - MEMS device with two independent cavities and method of making the same - Google Patents
MEMS device with two independent cavities and method of making the same Download PDFInfo
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- CN116281831A CN116281831A CN202310080832.8A CN202310080832A CN116281831A CN 116281831 A CN116281831 A CN 116281831A CN 202310080832 A CN202310080832 A CN 202310080832A CN 116281831 A CN116281831 A CN 116281831A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 230000004927 fusion Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 230000001419 dependent effect Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000005496 eutectics Effects 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
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Abstract
The invention provides a MEMS device with two independent cavities and a manufacturing method thereof. The MEMS device includes: a MEMS wafer; the MEMS device comprises a first cover body wafer bonded with the MEMS wafer, wherein a first cavity and a second cavity are formed between the MEMS wafer and the first cover body wafer, and a through hole penetrating through the first cover body wafer and communicated with the second cavity is formed in the first cover body wafer; and a second cover wafer bonded to the first cover wafer, wherein the second cover wafer seals one end of the through hole such that the second cavity is sealed, and a pressure in the first cavity is lower than a pressure in the second cavity. Thus, two cavities with different pressures can be formed on the same chip more conveniently.
Description
[ field of technology ]
The present invention relates to the field of MEMS (Micro-Electro-Mechanical System, microelectromechanical systems) devices, and more particularly to a MEMS device having two independent cavities and a method of manufacturing the same.
[ background Art ]
The MEMS capacitive accelerometer has small size, low cost and excellent performance, and is widely applied to the fields of consumer electronics, internet of things and industrial measurement. Consumer electronics competition is becoming more and more active, and new demands are being made on cost and integration. In order to achieve the purpose, the current 6-axis product (3-axis accelerometer and 3-axis gyroscope) is changed from the original accelerometer, wherein the gyroscopes are respectively positioned on two independent chips to a mode of processing the gyroscopes and the accelerometers on the same chip, and in the process, air pressure problems are encountered, namely, the air pressure required by the cavities of the accelerometers is different from the air pressure required by the cavities of the gyroscopes. The accelerometer needs to have a cavity with higher air pressure to increase air damping, typically around 400mBar, improving the reliability of the device in impact environments. Whereas gyroscopes require cavities with lower air pressure, typically <5mBar, smaller, preferably a vacuum environment. When the accelerometer and the gyroscope are integrated on the same chip, the cavity of the accelerometer and the cavity of the gyroscope are simultaneously processed and molded, so that the internal pressure is increased and reduced simultaneously, and how to control the pressure of the two cavities is a problem encountered in the prior art.
Therefore, a new solution is needed to solve the above problems.
[ invention ]
One of the objectives of the present invention is to provide a MEMS device with two independent cavities and a method for manufacturing the same, which can more conveniently form two cavities with different pressures on the same chip.
To solve the above-mentioned problems, according to one aspect of the present invention, the present invention proposes a MEMS device comprising: a MEMS wafer; the MEMS device comprises a first cover body wafer bonded with the MEMS wafer, wherein a first cavity and a second cavity are formed between the MEMS wafer and the first cover body wafer, and a through hole penetrating through the first cover body wafer and communicated with the second cavity is formed in the first cover body wafer; and a second cover wafer bonded to the first cover wafer, wherein the second cover wafer seals one end of the through hole such that the second cavity is sealed, and a pressure in the first cavity is lower than a pressure in the second cavity.
According to another aspect of the present invention, there is provided a method of manufacturing a MEMS device, comprising: providing an MEMS wafer and a first cover wafer; bonding the MEMS wafer and the first cover wafer in a first external environment, wherein a first cavity and a second cavity are formed between the MEMS wafer and the first cover wafer; a through hole penetrating the first cover wafer and communicated with the second cavity is formed in the first cover wafer; bonding the second cover wafer with the first cover wafer in a second external environment, wherein the second cover wafer seals one end of the through hole so that the second cavity is sealed, and the pressure in the first cavity is lower than the pressure in the second cavity.
Compared with the prior art, the first cavity and the second cavity are sealed under different external environments, so that the first cavity and the second cavity with different pressures are obtained.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic diagram of a first process configuration of a MEMS device of the present invention during manufacture;
FIG. 2 is a schematic diagram of a second process configuration of the MEMS device of the present invention during manufacture;
FIG. 3 is a schematic diagram of a third process configuration of the MEMS device of the present invention during the fabrication process;
FIG. 4 is a schematic diagram of a fourth process configuration of the MEMS device of the present invention during manufacture;
FIG. 5 is a schematic diagram of the final structure of the MEMS device of the present invention;
FIG. 6 is a flow chart of a method of fabricating a MEMS device according to the present invention.
[ detailed description ] of the invention
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Unless specifically stated otherwise, the terms connected, or connected herein denote an electrical connection, either directly or indirectly.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "coupled," and the like should be construed broadly; for example, they may be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The invention provides an MEMS device with two independent cavities, which can more conveniently form two cavities with different pressures on the same chip.
FIG. 5 is a schematic diagram of the final structure of the MEMS device of the present invention. As shown in fig. 5, the MEMS device includes a MEMS wafer 110, a first cap wafer 120 bonded to the MEMS wafer 110, and a second cap wafer 150 bonded to the first cap wafer 120.
A first cavity 130 and a second cavity 140 are formed between the MEMS wafer 110 and the first cap wafer 120. The first cover wafer 120 is provided with a through hole 121 penetrating the first cover wafer 120 and communicating with the second cavity 140. The second cover wafer 150 seals one end of the through hole 121 so that the second cavity 140 is sealed. The first cavity 130 and the second cavity 140 are independent of each other. The pressure in the first cavity 130 is lower than the pressure in the second cavity 140.
The first cavity 130 is configured for a first function. For example, the first function is a MEMS gyroscope, and the MEMS gyroscope component 131 is disposed in the first cavity 130. The second cavity 140 is configured for a second function. For example, the second function is a MEMS accelerometer, and the MEMS accelerometer component 141 is disposed in the second cavity 140.
In one embodiment, the pressure within the first cavity 131 is dependent on the pressure of the first external environment when the MEMS wafer 110 is bonded to the first lid wafer 120. For example, the first external environment may be a vacuum environment. The pressure within the second cavity 140 is equal to a pressure that is dependent on the second external environment when the first lid wafer 120 is bonded to the second lid wafer 150. For example, the second external environment is the working environment of the fusion bonding tool. The working environment of the fusion bonding tool may be an atmospheric environment.
As shown in fig. 5, the MEMS wafer 110 includes: a substrate 111, an oxide anchor layer (anchor oxide) 112 formed on the substrate 111, a MEMS device layer 113 formed on the oxide anchor layer 112, and a metal layer formed on the MEMS device layer. Wherein the MEMS gyroscope component 131 and the MEMS accelerometer component 141 are located at the MEMS device layer 113. The metal layer includes an aluminum layer 114 and a germanium layer 115 which are sequentially stacked.
In particular implementations, the MEMS wafer 110 and the first cap wafer 120 are Eutectic bonded (Fusion bonded), and the first cap wafer 120 and the second cap wafer 150 are Fusion bonded (Fusion bonded).
The invention seals the first cavity 130 and the second cavity 140 under different external environments, thereby obtaining the first cavity 130 and the second cavity 140 with different pressures, and the means for sealing the second cavity 140 is simple and reliable and is easy to realize.
According to another aspect of the present invention, a method of fabricating a two-cavity independent MEMS device is provided. FIG. 6 is a flow chart of a method of fabricating a MEMS device according to the present invention. As shown in fig. 6, the manufacturing method includes the following steps.
At step 610, a MEMS wafer 110 and a first cap wafer 120 are provided.
At step 620, as shown in fig. 1, the MEMS wafer 110 is bonded to the first cover wafer 120 in a first external environment, wherein the first cavity 130 and the second cavity 140 are formed between the MEMS wafer 110 and the first cover wafer 120.
In particular implementations, the pressure within the first cavity 130 is dependent upon the pressure of the first external environment when the MEMS wafer 110 is bonded to the first lid wafer 120. For example, the first external environment may be a vacuum environment. At this time, the pressure in the second cavity 140 is the same as the pressure in the first cavity 130.
Specifically, the MEMS wafer 110 and the first cap wafer 120 are eutectic bonded together.
The first cavity 130 is configured for a first function. For example, the first function is a MEMS gyroscope, and the MEMS gyroscope component 131 is disposed in the first cavity 130. The second cavity 140 is configured for a second function. For example, the second function is a MEMS accelerometer, and the MEMS accelerometer component 141 is disposed in the second cavity 140.
As shown in fig. 5, the MEMS wafer 110 includes: a substrate 111, an oxide anchor layer (anchor oxide) 112 formed on the substrate 111, a MEMS device layer 113 formed on the oxide anchor layer 112, and a metal layer formed on the MEMS device layer. Wherein the MEMS gyroscope component 131 and the MEMS accelerometer component 141 are located at the MEMS device layer 113. The metal layer includes an aluminum layer 114 and a germanium layer 115 which are sequentially stacked.
In step 630, as shown in fig. 2, a through hole 121 penetrating the first cover wafer 120 and communicating with the second cavity 140 is formed in the first cover wafer 120. At this time, the second cavity 140 communicates with the atmosphere at the same pressure as the atmosphere.
At step 640, as shown in fig. 4, the second cover wafer 150 is bonded to the first cover wafer 120 in a second external environment, wherein the second cover wafer 150 seals one end of the through hole 121 such that the second cavity 140 is sealed.
In particular, the pressure within the second cavity 140 is equal to the pressure that is dependent upon the second external environment when the first lid wafer 120 is bonded to the second lid wafer 150. For example, the second external environment is the working environment of the fusion bonding tool. The working environment of the fusion bonding tool may be an atmospheric environment. Eventually, the pressure in the first cavity 130 is lower than the pressure in the second cavity 140.
Specifically, the first cover wafer 120 and the second cover wafer 150 are fusion bonded together.
In one embodiment, the manufacturing method 600 further comprises:
before bonding the second cover wafer 150 and the first cover wafer 120, the first cover wafer 120 is polished and thinned, see fig. 3;
after bonding the second cover wafer 150 to the first cover wafer 120, the second cover wafer 150 is polished and thinned, see fig. 5.
The thickness of the polished and thinned second cover wafer 150 may be less than 50 μm.
According to the manufacturing method, the first cavity 130 and the second cavity 140 are sealed under different external environments, so that the first cavity 130 and the second cavity 140 with different pressures are obtained, and the means for sealing the second cavity 140 are simple and reliable and are easy to realize.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art may combine and combine the different embodiments or examples described in this specification.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications and alternatives to the above embodiments may be made by those skilled in the art within the scope of the invention.
Claims (10)
1. A MEMS device, comprising:
a MEMS wafer;
the MEMS device comprises a first cover body wafer bonded with the MEMS wafer, wherein a first cavity and a second cavity are formed between the MEMS wafer and the first cover body wafer, and a through hole penetrating through the first cover body wafer and communicated with the second cavity is formed in the first cover body wafer;
and a second cover wafer bonded to the first cover wafer, wherein the second cover wafer seals one end of the through hole such that the second cavity is sealed, and a pressure in the first cavity is lower than a pressure in the second cavity.
2. The MEMS device, as recited in claim 1, wherein,
the first cavity is configured for a first function, the second cavity is configured for a second function,
the first function is a MEMS gyroscope, the second function is a MEMS accelerometer,
the first cavity is provided with a MEMS gyroscope component and the second cavity is provided with a MEMS accelerometer component.
3. The MEMS device, as recited in claim 1, wherein,
the pressure within the first cavity is dependent upon the pressure of the first external environment when the MEMS wafer is bonded to the first lid wafer,
the pressure in the second cavity is equal to a pressure that is dependent on a second external environment when the first lid wafer is bonded to the second lid wafer.
4. The MEMS device, as recited in claim 2, wherein the MEMS wafer comprises:
a substrate;
an oxide anchor layer formed on the substrate;
a MEMS device layer formed on the oxidized anchor layer, wherein the MEMS gyroscope component and the MEMS accelerometer component are located on the MEMS device layer;
a metal layer formed on the MEMS device layer,
the MEMS wafer and the first cap wafer are eutectic bonded together,
the first cover wafer and the second cover wafer are fusion bonded together.
5. The MEMS device, as recited in claim 4, wherein the metal layer comprises an aluminum layer and a germanium layer laminated in sequence.
6. A method of manufacturing a MEMS device, comprising:
providing an MEMS wafer and a first cover wafer;
bonding the MEMS wafer and the first cover wafer in a first external environment, wherein a first cavity and a second cavity are formed between the MEMS wafer and the first cover wafer;
a through hole penetrating through the first cover body wafer and communicated with the second cavity is formed in the first cover body wafer;
bonding the second cover wafer with the first cover wafer in a second external environment, wherein the second cover wafer seals one end of the through hole so that the second cavity is sealed, and the pressure in the first cavity is lower than the pressure in the second cavity.
7. The method according to claim 6, wherein,
the pressure of the first external environment is lower than the pressure of the second external environment,
the pressure within the first cavity is dependent upon the pressure of the first external environment when the MEMS wafer is bonded to the first lid wafer,
the pressure in the second cavity is equal to a pressure that is dependent on a second external environment when the first lid wafer is bonded to the second lid wafer.
8. The method according to claim 6, wherein,
the MEMS wafer and the first cap wafer are eutectic bonded together,
the first cover wafer and the second cover wafer are fusion bonded together.
9. The manufacturing method according to claim 6, characterized in that the manufacturing method further comprises:
grinding and thinning the first cover wafer before bonding the second cover wafer and the first cover wafer;
and after bonding the second cover wafer and the first cover wafer, grinding and thinning the second cover wafer.
10. The method of manufacturing as claimed in claim 6, wherein a first cavity is configured for a first function, a second cavity is configured for a second function, the first function being a MEMS gyroscope, the second function being a MEMS accelerometer, a MEMS gyroscope component being disposed in the first cavity, a MEMS accelerometer component being disposed in the second cavity,
the MEMS wafer includes:
a substrate;
an oxide anchor layer formed on the substrate;
a MEMS device layer formed on the oxidized anchor layer, wherein the MEMS gyroscope component and the MEMS accelerometer component are located on the MEMS device layer;
and a metal layer formed on the MEMS device layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310080832.8A CN116281831A (en) | 2023-01-31 | 2023-01-31 | MEMS device with two independent cavities and method of making the same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310080832.8A CN116281831A (en) | 2023-01-31 | 2023-01-31 | MEMS device with two independent cavities and method of making the same |
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| CN116281831A true CN116281831A (en) | 2023-06-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118062806A (en) * | 2024-04-18 | 2024-05-24 | 芯联集成电路制造股份有限公司 | MEMS device and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118062806A (en) * | 2024-04-18 | 2024-05-24 | 芯联集成电路制造股份有限公司 | MEMS device and preparation method thereof |
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