CN116276460A - Semiconductor wafer processing device - Google Patents
Semiconductor wafer processing device Download PDFInfo
- Publication number
- CN116276460A CN116276460A CN202310529076.2A CN202310529076A CN116276460A CN 116276460 A CN116276460 A CN 116276460A CN 202310529076 A CN202310529076 A CN 202310529076A CN 116276460 A CN116276460 A CN 116276460A
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- Prior art keywords
- pressing
- lifting
- fixedly connected
- sliding
- driving
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 67
- 238000009434 installation Methods 0.000 claims abstract description 21
- 238000005498 polishing Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 39
- 238000003754 machining Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a semiconductor wafer processing device, which relates to the technical field of wafer processing and comprises an installation support piece; the mounting support is provided with a driving device; the mounting support piece is connected with a lifting limiting piece in a sliding manner; the installation support piece is fixedly connected with a pressing positioning device; the pressing positioning device is connected with a lifting connecting piece in a sliding manner; a limiting control piece is arranged on the lifting connecting piece; two chamfering workpieces are arranged on the pressing and positioning device; the auxiliary high-efficiency positioning can be realized, the coaxiality is ensured, the auxiliary increase of the yield can be realized, the damage of edge cutting is reduced, and the problems that the existing semiconductor wafer processing device does not have an auxiliary wafer concentric positioning structure, the wafer processing precision is low, and the auxiliary Notch chamfering integrated processing cannot be realized at the same time, and the processing efficiency is low are solved.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a semiconductor wafer processing device.
Background
With the development of the semiconductor industry, the demand of raw material wafers in semiconductor devices is increasing, and in the actual processing work of the wafers, chamfering work of the wafers is involved, and meanwhile, a small Notch, named Notch, is also arranged on the wafers, which has the effect of facilitating subsequent processing and positioning, and a good semiconductor wafer processing device is particularly important.
However, with the existing semiconductor wafer processing device, an auxiliary wafer concentric positioning structure is not provided, the processing precision of the wafer is low, meanwhile, the integrated processing of auxiliary Notch chamfering cannot be realized, the processing efficiency is low, meanwhile, the equipment chamfering operation is not provided with a limit guide structure, the exterior of the wafer is easy to be sprained, and the problem of low yield of the outer ring of the wafer is caused.
Disclosure of Invention
In view of the above, the present invention provides a semiconductor wafer processing apparatus, which has an anti-deformation connector, and can clamp both sides of a wafer in the wafer processing process without affecting the transfer of the wafer, so as to ensure the processing quality, reduce the damage, reduce the axial extrusion force, be more practical, and improve the yield.
The invention provides a purpose and an effect of a semiconductor wafer processing device, which particularly comprise an installation supporting piece; the mounting support is provided with a driving device; the mounting support piece is connected with a lifting limiting piece in a sliding manner; the installation support piece is fixedly connected with a pressing positioning device; the pressing positioning device is connected with a lifting connecting piece in a sliding manner; a limiting control piece is arranged on the lifting connecting piece; two chamfering workpieces are arranged on the pressing and positioning device; two anti-deformation connecting pieces are arranged on the pressing and positioning device; the mounting support includes: the device comprises an installation support plate, exhaust slotted holes and a rotary connecting cylinder, wherein a row of exhaust slotted holes are formed in the installation support plate; the installation support plate is fixedly connected with a rotary connecting cylinder; two support foot plates are fixedly connected to the bottom of the installation support plate.
Further, the deformation-resistant connector includes: the connecting and attaching frame is connected to the pressing and connecting frame in a sliding manner; the connecting and attaching frame is of a U-shaped structure; the connecting and attaching frame is sleeved with two connecting tension springs, and the two connecting tension springs are respectively connected between the connecting and attaching frame and the pressing and connecting frame; the connecting and positioning wheels are arranged in two, and the two connecting and positioning wheels are respectively connected to the two ends of the connecting and laminating frame in a rotating mode.
Further, the driving device includes: the device comprises a driving grinding motor, a supporting rotating disc and a wafer main body, wherein the driving grinding motor is fixedly connected to a mounting supporting plate; the output shaft of the driving grinding motor is fixedly connected with a supporting rotating disc; the supporting rotating disc is rotationally connected to the rotating connecting cylinder; the wafer body is placed on a supporting rotating disk.
Further, the lift limiter includes: the lifting connection sliding ring, the positioning propulsion spring and the positioning column are connected to the rotary connecting cylinder in a sliding manner; the rotary connecting cylinder is sleeved with a positioning pushing spring, and the positioning pushing spring is connected between the mounting support plate and the lifting connecting sliding ring; four positioning columns are fixedly connected to the lifting connection sliding ring; the top of the positioning column is of a conical structure.
Further, the chamfering workpiece further includes: the driving motor and the polishing roller are fixedly connected to the sliding connecting column; the output shaft of the driving motor is fixedly connected with a polishing roller; the polishing roller is rotationally connected to the sliding connecting column.
Further, the mounting support further comprises: connect the suction pump, installation backup pad bottom fixedly connected with connects the suction pump, and connects suction pump pipe joint installation backup pad.
Further, the limit control member includes: the device comprises a limiting connecting frame, a limiting guide shaft and a lifting guide shaft, wherein the limiting connecting frame is rotationally connected to a driving sliding column; the limiting connecting frame is fixedly connected with a limiting guide shaft which is connected to the pressing connecting frame in a sliding manner; the bottom of the limiting connecting frame is fixedly connected with a lifting guide shaft which is connected to the lifting connecting sliding ring in a sliding manner.
Further, the pressing and positioning device includes: the pressing connecting frame and the rotating connecting disc are fixedly connected to the mounting support plate; the pressing connecting frame is rotationally connected with a rotating connecting disc.
Further, the chamfering work piece includes: the chamfering electric screw rod is fixedly connected to the side face of the pressing connecting frame; the starting sleeve is fixedly connected to the inner side of the pressing connecting frame; the starting sleeve is connected with a sliding connecting column in a sliding manner; the sliding connecting column is in threaded connection with the chamfering electric screw rod.
Further, the lifting connection member includes: the lifting driving screw rod is in threaded connection with the rotating connecting disc; a driving sliding column is fixedly connected to the lifting driving screw rod; the driving sliding column is connected with a lifting pressing column in a sliding manner; the pressing connecting disc is fixedly connected to the bottom of the lifting pressing column; the driving sliding column is internally sleeved with a spring; a hand wheel is arranged on the lifting driving screw rod; the pressing connection disc is concentric with the rotating connection disc.
Advantageous effects
The processing device can realize auxiliary efficient positioning, ensure coaxiality, simultaneously realize auxiliary increase of yield and reduce damage of edge cutting.
In addition, through the lift locating part that adopts the setting, can realize supplementary coaxial concentric positioning, can effectually guarantee to use the flexibility, the effectual whole machining precision that improves simultaneously, the effectual overall structure practicality that improves avoids actual abrasive machining process to take place decentration, lead to the not good problem of chamfer effect, the overall structure practicality is stronger, can realize through adopting drive arrangement that the drive rotates auxiliary drive and rotates, supplementary grinding, through under the promotion of location propulsion spring, drive the reference column and reciprocate, realize auxiliary positioning wafer main part, and overall structure is simple, the practicality is strong.
In addition, through the spacing control piece that adopts the setting, can realize assisting the efficient and carry out spacing control, can be in the in-process of advancing the centre gripping wafer, realize that the drive extrusion goes up and down to connect the slip ring and descend, avoid the location to advance the spring and influence wafer main part side chamfer, spacing control piece can be along with lift drive lead screw drive removal simultaneously, has guaranteed the flexibility of use, when the drive slip post removes, drives spacing link and moves down the extrusion and go up and down to connect the slip ring simultaneously, realize driving the reference column and descend, avoid influencing subsequent processing work such as polishing of staff.
In addition, through adopting the anti deformation connecting piece that sets up, can effectually improve overall structure grinding quality, can realize assisting the outward flange processingquality that improves the wafer main part, can effectually reduce stress, overall structure is simpler to use, adopt the chamfer machined part, can realize assisting the efficient drive chamfer and set up the Notch, can realize assisting improvement overall structure processingquality and machining efficiency, two chamfer machined parts that set up in opposite directions simultaneously also help improving cutting grinding atress equilibrium, and is more practical, guarantee chamfering quality through the mode that is equipped with the arc recess on the grinding roller, simultaneously through the continuous propulsion of chamfer electronic lead screw, can assist through the Notch of seting up of grinding roller, through connecting extension spring and connection locating wheel, connect laminating frame sliding connection on pressing the link; the connecting tension spring sleeved on the connecting and attaching frame can drive the connecting and positioning wheel to roll and attach the auxiliary limiting axial swing of the wafer main body, so that the use flexibility is improved, and the yield of the subsequent cutting of the wafer main body is improved.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings of the embodiments will be briefly described below.
The drawings described below are only for illustration of some embodiments of the invention and are not intended to limit the invention.
In the drawings:
fig. 1 is a schematic view of the overall structure of the processing apparatus of the present invention.
Fig. 2 is a schematic view of the internal structure of the processing apparatus of the present invention.
Fig. 3 is a schematic view of the processing apparatus of the present invention.
Fig. 4 is a schematic view of the internal structure of the processing apparatus of the present invention.
Fig. 5 is a schematic view of the mounting support structure of the present invention.
Fig. 6 is a schematic view of the driving apparatus of the present invention.
Fig. 7 is a schematic view of the structure of the lifting limiting part of the invention.
Fig. 8 is a schematic structural view of the pressing and positioning device of the present invention.
Fig. 9 is a schematic view of a lifting connector according to the present invention.
Fig. 10 is an enlarged view of the B structure of fig. 3 in accordance with the present invention.
FIG. 11 is a schematic view of the structure of a chamfer work piece of the present invention.
List of reference numerals
1. Installing a support; 101. mounting a supporting plate; 102. an exhaust slot; 103. rotating the connecting cylinder; 104. connecting a suction pump; 2. a driving device; 201. driving a grinding motor; 202. supporting a rotating disc; 203. a wafer body; 3. lifting limiting pieces; 301. the lifting connection sliding ring; 302. positioning a propulsion spring; 303. positioning columns; 4. pressing the positioning device; 401. pressing the connecting frame; 402. rotating the connecting disc; 5. lifting the connecting piece; 501. lifting and driving the screw rod; 502. driving the sliding column; 503. lifting and pressing the column; 504. pressing the connecting disc; 6. a limit control member; 601. a limit connecting frame; 602. limiting the guide shaft; 603. a lifting guide shaft; 7. chamfering a machined part; 701. chamfering the electric screw rod; 702. starting the sleeve; 703. a sliding connection column; 704. a driving motor; 705. a grinding roller; 8. an anti-deformation connector; 801. connecting the laminating frame; 802. connecting a tension spring; 803. and is connected with a positioning wheel.
Detailed Description
In order to make the objects and advantages of the technical solution of the present invention more clear, the technical solution of the present invention will be clearly and completely described below with reference to the drawings of the specific embodiments of the present invention. Unless otherwise indicated, terms used herein have the meaning common in the art. Like reference numerals in the drawings denote like parts.
Examples: please refer to fig. 1 to 11:
the invention provides a semiconductor wafer processing device, which comprises a mounting support piece 1; the mounting support 1 is provided with a driving device 2; the mounting support piece 1 is connected with a lifting limiting piece 3 in a sliding way; the installation support piece 1 is fixedly connected with a pressing and positioning device 4; the pressing positioning device 4 is connected with a lifting connecting piece 5 in a sliding way; a limiting control piece 6 is arranged on the lifting connecting piece 5; two chamfering workpieces 7 are arranged on the pressing and positioning device 4; two anti-deformation connecting pieces 8 are arranged on the pressing positioning device 4; the mounting support 1 includes: the installation support plate 101 and the exhaust slotted hole 102 rotate the connecting cylinder 103, and a row of exhaust slotted holes 102 are formed in the installation support plate 101; the installation supporting plate 101 is fixedly connected with a rotary connecting cylinder 103; two supporting foot plates 1011 are fixedly connected to the bottom of the installation supporting plate 101.
Wherein the mounting support 1 further comprises: the bottom of the installation supporting plate 101 is fixedly connected with the connection suction pump 104, and the connection suction pump 104 is connected with the installation supporting plate 101 in a pipe joint manner; the driving device 2 includes: a driving grinding motor 201, a supporting rotating disc 202 and a wafer main body 203, wherein the driving grinding motor 201 is fixedly connected to the mounting support plate 101; the output shaft of the driving grinding motor 201 is fixedly connected with a supporting rotating disc 202; the supporting rotating disk 202 is rotatably connected to the rotating connecting cylinder 103; the wafer body 203 is placed on the support rotating plate 202; the lifting limiter 3 includes: the lifting connection sliding ring 301, the positioning pushing spring 302 and the positioning column 303, wherein the lifting connection sliding ring 301 is connected to the rotary connection cylinder 103 in a sliding manner; the rotary connecting cylinder 103 is sleeved with a positioning pushing spring 302, and the positioning pushing spring 302 is connected between the mounting support plate 101 and the lifting connecting sliding ring 301; four positioning columns 303 are fixedly connected to the lifting connection sliding ring 301; the reference column 303 top is the toper structure, through adopting the lift locating part 3 that sets up, can realize supplementary coaxial concentric location, can effectually guarantee the flexibility of use, the whole machining precision of effectual improvement simultaneously, the effectual overall structure practicality that improves, avoid actual abrasive machining process to take place eccentric, lead to the not good problem of chamfer effect, the overall structure practicality is stronger, can realize the drive through adopting drive arrangement 2 and rotate supplementary drive and rotate, supplementary grinding, through under the promotion of location propulsion spring 302, drive reference column 303 and reciprocate, realize assistance-localization real-time wafer main part 203, and a whole structure is simple, the practicality is strong.
Wherein the pressing and positioning device 4 comprises: a pressing connection frame 401 and a rotating connection plate 402, the pressing connection frame 401 being fixedly connected to the mounting support plate 101; a rotary connecting disc 402 is rotatably connected to the pressing connecting frame 401; the lifting connection 5 comprises: the lifting driving screw rod 501, the driving sliding column 502, the lifting pressing column 503 and the pressing connecting disc 504, wherein the lifting driving screw rod 501 is in threaded connection with the rotating connecting disc 402; a driving sliding column 502 is fixedly connected to the lifting driving screw rod 501; the driving sliding column 502 is connected with a lifting pressing column 503 in a sliding way; the pressing connection disc 504 is fixedly connected to the bottom of the lifting pressing column 503; a spring is sleeved inside the driving sliding column 502; a hand wheel is arranged on the lifting driving screw rod 501; pressing land 504 is concentric with rotating land 402; the limit control 6 includes: the limiting connecting frame 601, the limiting guide shaft 602 and the lifting guide shaft 603 are connected to the driving sliding column 502 in a rotating manner; a limit guide shaft 602 is fixedly connected to the limit connecting frame 601, and the limit guide shaft 602 is slidably connected to the pressing connecting frame 401; limiting connection frame 601 bottom fixedly connected with goes up and down guiding axle 603, and go up and down guiding axle 603 sliding connection on going up and down to connect slip ring 301, through the spacing control piece 6 that adopts the setting, can realize assisting the efficient and carry out spacing control, can be at the in-process of advancing the centre gripping wafer, realize that drive extrusion goes up and down to connect slip ring 301 and descend, avoid location advance spring 302 to influence wafer main part 203 side chamfer, limit control piece 6 can be along with lift drive lead screw 501 drive removal simultaneously, the flexibility of use has been guaranteed, when drive slip post 502 removes, drive simultaneously that limiting connection frame 601 moves down and extrudees to go up and down to connect slip ring 301, realize driving reference column 303 and descend, avoid influencing subsequent processing work such as polishing of staff.
Wherein the chamfering work piece 7 includes: the chamfering electric screw 701, the starting sleeve 702 and the sliding connecting column 703, wherein the chamfering electric screw 701 is fixedly connected to the side surface of the pressing connecting frame 401; the starting sleeve 702 is fixedly connected to the inner side of the pressing connection frame 401; a sliding connection post 703 is connected on the starting sleeve 702 in a sliding manner; the sliding connecting column 703 is in threaded connection with the chamfering electric screw 701; the chamfering work piece 7 further includes: a drive motor 704 and a grinding roller 705, the drive motor 704 being fixedly connected to the sliding connection column 703; a polishing roller 705 is fixedly connected to the output shaft of the driving motor 704; the grinding roller 705 is rotatably connected to the sliding connection column 703; the deformation-resistant connection 8 comprises: the connecting attaching frame 801, the connecting tension spring 802 and the connecting positioning wheel 803 are connected to the pressing connecting frame 401 in a sliding manner; the connecting and attaching frame 801 is of a U-shaped structure; two connecting tension springs 802 are sleeved on the connecting and attaching frame 801, and the two connecting tension springs 802 are respectively connected between the connecting and attaching frame 801 and the pressing and attaching frame 401; the two connecting positioning wheels 803 are respectively rotatably connected to two ends of the connecting attaching frame 801, the set anti-deformation connecting pieces 8 are adopted to effectively improve the grinding quality of the whole structure, the outer edge machining quality of the wafer main body 203 can be improved in an auxiliary mode, the stress can be effectively reduced, the whole structure is simpler to use, chamfering workpieces 7 are adopted to realize auxiliary efficient chamfering driving and Notch opening, the whole structure machining quality and machining efficiency can be improved in an auxiliary mode, meanwhile, the two oppositely arranged chamfering workpieces 7 are also beneficial to improving the cutting grinding stress balance, the chamfering quality is guaranteed in a mode that arc grooves are formed in the grinding roller 705, meanwhile, the chamfering motor-driven screw 701 is continuously pushed in a mode that the arc grooves are formed in the grinding roller 705 in an auxiliary mode, and the connecting attaching frame 801 is connected to the pressing attaching frame 401 in a sliding mode through the tension spring 802 and the connecting positioning wheels 803; under the pulling of the connecting tension spring 802 sleeved on the connecting and attaching frame 801, the connecting and positioning wheel 803 can be driven to roll and attach the auxiliary limiting axial swing of the wafer main body 203, so that the use flexibility is improved, and the yield of the subsequent cutting of the wafer main body 203 is improved.
Specific use and action of the embodiment: in the invention, firstly, auxiliary machining grinding is realized by driving the supporting rotating disc 202 to rotate by driving the grinding motor 201, the positioning column 303 is driven to move upwards by driving the positioning pushing spring 302 to realize auxiliary positioning of the wafer main body 203, the pressing connecting disc 504 on the lifting pressing column 503 is driven to move downwards by driving the driving sliding column 502 to extrude the wafer main body 203 by rotating the lifting driving screw rod 501, the elastic effect is increased by the assistance of the spring in the driving sliding column 502, and when the driving sliding column 502 moves, the limiting connecting frame 601 is simultaneously driven to move downwards to extrude the lifting connecting sliding ring 301, so that the positioning column 303 is driven to descend, the subsequent machining work of a worker is avoided, the movement of the driving sliding connecting column 703 can be realized by driving the grinding roller 705 by driving the driving motor 704, the chamfering quality is ensured by arranging an arc groove on the grinding roller 705, meanwhile, the continuous pushing of the chamfering electric screw rod 701 can be realized by arranging a tension spring 802 and a connecting positioning wheel 803 in an auxiliary manner, and the connecting frame 801 is connected to the pressing connecting frame 401 in a sliding manner by the connection manner by the grinding roller 705; the connecting positioning wheel 803 can be driven to roll and adhere to the wafer main body 203 to assist in limiting axial swing under the pulling of the connecting tension spring 802 sleeved on the connecting adhering frame 801.
The above is only an exemplary embodiment of the present invention and is not intended to limit the scope of the present invention, which is defined by the appended claims.
Claims (10)
1. A semiconductor wafer processing apparatus, characterized by comprising a mounting support (1); the driving device (2) is arranged on the mounting support piece (1); the lifting limiting piece (3) is connected to the mounting support piece (1) in a sliding manner; the installation support piece (1) is fixedly connected with a pressing and positioning device (4); the pressing positioning device (4) is connected with a lifting connecting piece (5) in a sliding manner; a limiting control piece (6) is arranged on the lifting connecting piece (5); two chamfering workpieces (7) are arranged on the pressing and positioning device (4); two anti-deformation connecting pieces (8) are arranged on the pressing and positioning device (4); the mounting support (1) comprises: the device comprises a mounting support plate (101), exhaust slotted holes (102) and a rotary connecting cylinder (103), wherein a row of exhaust slotted holes (102) are formed in the mounting support plate (101); the installation support plate (101) is fixedly connected with a rotary connecting cylinder (103); two supporting foot plates (1011) are fixedly connected to the bottom of the installation supporting plate (101).
2. A semiconductor wafer processing apparatus according to claim 1, wherein: the mounting support (1) further comprises: connect suction pump (104), install backup pad (101) bottom fixedly connected with and connect suction pump (104), and connect suction pump (104) pipe joint installation backup pad (101).
3. A semiconductor wafer processing apparatus according to claim 1, wherein: the driving device (2) includes: the wafer grinding device comprises a driving grinding motor (201), a supporting rotating disc (202) and a wafer main body (203), wherein the driving grinding motor (201) is fixedly connected to a mounting support plate (101); an output shaft of the driving grinding motor (201) is fixedly connected with a supporting rotating disc (202); the supporting rotating disc (202) is rotationally connected to the rotating connecting cylinder (103); the wafer body (203) is placed on a supporting rotating disk (202).
4. A semiconductor wafer processing apparatus according to claim 1, wherein: the lifting limiting piece (3) comprises: the lifting connection sliding ring (301), the positioning pushing spring (302) and the positioning column (303), wherein the lifting connection sliding ring (301) is connected to the rotary connection cylinder (103) in a sliding manner; the rotary connecting cylinder (103) is sleeved with a positioning pushing spring (302), and the positioning pushing spring (302) is connected between the mounting support plate (101) and the lifting connecting sliding ring (301); four positioning columns (303) are fixedly connected to the lifting connection sliding ring (301); the top of the positioning column (303) is of a conical structure.
5. The semiconductor wafer processing apparatus according to claim 4, wherein: the pressing and positioning device (4) comprises: a pressing connection frame (401) and a rotating connection disc (402), wherein the pressing connection frame (401) is fixedly connected to the mounting support plate (101); the pressing connecting frame (401) is rotatably connected with a rotating connecting disc (402).
6. A semiconductor wafer processing apparatus according to claim 5, wherein: the lifting connection (5) comprises: the lifting driving screw rod (501), the driving sliding column (502), the lifting pressing column (503) and the pressing connecting disc (504), wherein the lifting driving screw rod (501) is in threaded connection with the rotating connecting disc (402); a driving sliding column (502) is fixedly connected to the lifting driving screw rod (501); the driving sliding column (502) is connected with a lifting pressing column (503) in a sliding manner; the pressing connection disc (504) is fixedly connected to the bottom of the lifting pressing column (503); a spring is sleeved inside the driving sliding column (502); a hand wheel is arranged on the lifting driving screw rod (501); the pressing connection disc (504) is concentric with the rotating connection disc (402).
7. The semiconductor wafer processing apparatus according to claim 6, wherein: the limit control (6) comprises: the device comprises a limiting connecting frame (601), a limiting guide shaft (602) and a lifting guide shaft (603), wherein the limiting connecting frame (601) is rotationally connected to a driving sliding column (502); a limiting guide shaft (602) is fixedly connected to the limiting connecting frame (601), and the limiting guide shaft (602) is slidably connected to the pressing connecting frame (401); the bottom of the limiting connecting frame (601) is fixedly connected with a lifting guide shaft (603), and the lifting guide shaft (603) is connected to the lifting connecting sliding ring (301) in a sliding mode.
8. A semiconductor wafer processing apparatus according to claim 5, wherein: the chamfering work piece (7) includes: the chamfering electric screw rod (701), a starting sleeve (702) and a sliding connecting column (703), wherein the chamfering electric screw rod (701) is fixedly connected to the side surface of the pressing connecting frame (401); the starting sleeve (702) is fixedly connected to the inner side of the pressing connecting frame (401); a sliding connecting column (703) is connected to the starting sleeve (702) in a sliding manner; the sliding connecting column (703) is in threaded connection with the chamfering electric screw rod (701).
9. The semiconductor wafer processing apparatus according to claim 8, wherein: the chamfering work piece (7) further comprises: a driving motor (704) and a polishing roller (705), wherein the driving motor (704) is fixedly connected to the sliding connecting column (703); an output shaft of the driving motor (704) is fixedly connected with a polishing roller (705); the polishing roller (705) is rotatably connected to the sliding connecting column (703).
10. A semiconductor wafer processing apparatus according to claim 5, wherein: the deformation-resistant connection (8) comprises: the connecting and attaching frame (801), a connecting tension spring (802) and a connecting and positioning wheel (803), wherein the connecting and attaching frame (801) is connected to the pressing and connecting frame (401) in a sliding manner; the connecting and attaching frame (801) is of a U-shaped structure; two connecting tension springs (802) are sleeved on the connecting and attaching frame (801), and the two connecting tension springs (802) are respectively connected between the connecting and attaching frame (801) and the pressing and attaching frame (401); the two connecting positioning wheels (803) are arranged, and the two connecting positioning wheels (803) are respectively connected to the two ends of the connecting attaching frame (801) in a rotating mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310529076.2A CN116276460A (en) | 2023-05-11 | 2023-05-11 | Semiconductor wafer processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310529076.2A CN116276460A (en) | 2023-05-11 | 2023-05-11 | Semiconductor wafer processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116276460A true CN116276460A (en) | 2023-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310529076.2A Withdrawn CN116276460A (en) | 2023-05-11 | 2023-05-11 | Semiconductor wafer processing device |
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| Country | Link |
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| CN (1) | CN116276460A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116787328A (en) * | 2023-06-27 | 2023-09-22 | 山东振淇机械股份有限公司 | Excavator guide wheel processing and measuring device |
| CN117260450A (en) * | 2023-11-22 | 2023-12-22 | 连云港弘鼎石英有限公司 | Quartz product processing edging equipment with dustproof mechanism |
-
2023
- 2023-05-11 CN CN202310529076.2A patent/CN116276460A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116787328A (en) * | 2023-06-27 | 2023-09-22 | 山东振淇机械股份有限公司 | Excavator guide wheel processing and measuring device |
| CN116787328B (en) * | 2023-06-27 | 2024-04-30 | 山东振淇机械股份有限公司 | Excavator guide wheel processing and measuring device |
| CN117260450A (en) * | 2023-11-22 | 2023-12-22 | 连云港弘鼎石英有限公司 | Quartz product processing edging equipment with dustproof mechanism |
| CN117260450B (en) * | 2023-11-22 | 2024-01-23 | 连云港弘鼎石英有限公司 | Quartz product processing edging equipment with dustproof mechanism |
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Application publication date: 20230623 |
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