CN116273710B - LED chip glue filling machine - Google Patents
LED chip glue filling machine Download PDFInfo
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- CN116273710B CN116273710B CN202310523770.3A CN202310523770A CN116273710B CN 116273710 B CN116273710 B CN 116273710B CN 202310523770 A CN202310523770 A CN 202310523770A CN 116273710 B CN116273710 B CN 116273710B
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- Prior art keywords
- glue
- head body
- glue filling
- piston
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F27/00—Mixers with rotary stirring devices in fixed receptacles; Kneaders
- B01F27/80—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis
- B01F27/90—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis with paddles or arms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/30—Driving arrangements; Transmissions; Couplings; Brakes
- B01F35/31—Couplings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/30—Driving arrangements; Transmissions; Couplings; Brakes
- B01F35/32—Driving arrangements
- B01F35/32005—Type of drive
- B01F35/3204—Motor driven, i.e. by means of an electric or IC motor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/75—Discharge mechanisms
- B01F35/754—Discharge mechanisms characterised by the means for discharging the components from the mixer
- B01F35/75455—Discharge mechanisms characterised by the means for discharging the components from the mixer using a rotary discharge means, e.g. a screw beneath the receptacle
- B01F35/754551—Discharge mechanisms characterised by the means for discharging the components from the mixer using a rotary discharge means, e.g. a screw beneath the receptacle using helical screws
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/90—Heating or cooling systems
- B01F35/92—Heating or cooling systems for heating the outside of the receptacle, e.g. heated jackets or burners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/90—Heating or cooling systems
- B01F2035/99—Heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
- B01F2101/36—Mixing of ingredients for adhesives or glues; Mixing adhesives and gas
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses an LED chip glue filling machine, which relates to the technical field of glue filling machines and comprises a glue filling head body, wherein mini air cylinders are fixedly arranged at four corners of the outer side of the glue filling head body, and four groups of sliding blocks which are fixedly arranged at the output ends of the mini air cylinders and are in sliding connection with the glue filling head body. When the four groups of sealing frames extend out to the lower part of the glue filling head body, the outer sides of the four groups of sealing frames are tightly adhered to each other to seal the glue filling head body, so that the protection sealing effect on the glue filling head body is achieved, meanwhile, high-pressure gas respectively passes through a connecting hose and a shunt tube and then the piston cavities inside the four groups of piston cylinders, so that the high-pressure gas synchronously pushes the piston blocks to extend out of the piston cylinders, the four groups of piston blocks are tightly adhered to each other, and as the inner parts of each group of piston blocks are connected with heating wires, the four groups of piston blocks can store glue retained inside the glue filling head body at constant temperature through the heating wires, and the phenomenon that the retained glue is solidified due to long-time non-use is effectively avoided.
Description
Technical Field
The invention relates to the technical field of LED chip glue filling, in particular to an LED chip glue filling machine.
Background
The LED chip is a solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a negative electrode, the other end of the wafer is connected with the positive electrode of a power supply, the whole wafer is encapsulated by epoxy resin, and the encapsulation of the LED chip is often encapsulated by an encapsulating machine.
The automatic glue filling machine is used for controlling fluid, dropping, coating and filling liquid on the surface of product or inside product, and is mainly used for adhering, filling, coating, sealing and filling glue, oil and other liquid in product process.
In the prior art, the glue filling machine carries out glue filling operation on the LED chip through the glue filling head, after the glue filling operation is finished, a part of glue can be detained in the inside of the glue filling head, if the glue filling machine is not used for the second time for a long time, the detained glue can be solidified in the inside of the glue filling head, when the glue is used again, manual cleaning is needed to be carried out on the glue solidified in the inside of the glue filling head, the whole operation is more troublesome, and when the glue filling head is not used for a long time, dust in the outside air can be attached to the surface of the glue filling head in a large number, and when the glue filling operation is carried out again, the glue inside contains a large number of dust to influence the whole glue filling effect of the LED chip.
Disclosure of Invention
Based on the above, the invention aims to provide an LED chip glue filling machine, so as to solve the technical problems that if the glue filling machine is not used for the second time for a long time in the prior art, retained glue is solidified in the glue filling head, when the glue is reused, manual cleaning is needed to be carried out on the solidified glue in the glue filling head, and dust in the outside air is adhered to the surface of the glue filling head in a large amount, so that when the glue filling operation is carried out again, the glue is internally provided with a large amount of dust to influence the whole glue filling effect of an LED chip.
In order to achieve the above purpose, the present invention provides the following technical solutions: the LED chip glue filling machine comprises a glue filling head body, a mixing cavity and a transmission shaft in the glue filling head body, wherein mini air cylinders are fixedly arranged at four corners of the outer side of the glue filling head body, and four groups of sliding blocks which are in sliding connection with the glue filling head body are fixedly arranged at the output ends of the mini air cylinders;
the sliding block is characterized in that a connecting frame is fixed on the outer side of the sliding block, sealing frames are fixedly arranged at the bottoms of the four groups of connecting frames, piston cylinders are fixedly arranged on the outer sides of the four groups of sealing frames, piston cavities are formed in the four groups of piston cylinders, piston blocks penetrating through the sealing frames are connected in a sliding sealing mode in the piston cavities, and heating wires are arranged in the piston blocks;
each group of piston cylinder both ends all are provided with the shunt tubes that are linked together with the piston chamber, mini cylinder outside is connected with the intake pipe, and wherein the encapsulating head body outside is fixed to be provided with the circulation ring, and the circulation ring is linked together with four groups of intake pipes, circulation ring one side is provided with the connecting pipe that is connected with external pipeline, through coupling hose between intake pipe and the shunt tubes, every group the piston piece outside is all fixed to be provided with the bellows that runs through the piston cylinder, encapsulating head body outside four corners department all is provided with the connecting wire that runs through bellows and heater strip electric connection, and wherein encapsulating head body outside is fixed to be provided with the power control piece, and power control piece and four group connecting wire electric connection.
Through adopting above-mentioned technical scheme, after the glue filling of glue filling head body is accomplished, if no longer use the glue filling machine to carry out the glue filling operation for a long time, four sets of mini cylinder outputs drive four sets of sliders and slide and stretch out this moment, and then drive the seal frame through the link and stretch out to the below of glue filling head body, when four sets of seal frames stretch out completely, paste tightly each other between four sets of seal frames outsides, thereby play the protection sealed effect to the glue filling head body, and simultaneously, external high-pressure gas drives mini cylinder and stretches out when simultaneously, high-pressure gas passes through coupling hose and shunt tube and then four sets of piston intracavity that the piston is inside, and then high-pressure gas promotes the piston piece in step and stretch out the piston cylinder, and then four sets of piston pieces stretch out the back completely, paste tightly each other between four sets of piston pieces, owing to all be connected with the heater strip in every set of piston piece inside, and then four sets of piston pieces can carry out the constant temperature through the glue that the glue filling head body is inside to be detained to the heater strip, and then effectually avoided because of not using and lead to the phenomenon that the glue that detains takes place to solidification for a long time, the whole glue filling machine of being convenient for use to carry out the operation next time.
The invention is further characterized in that the inside of the glue filling head body is rotationally connected with a transmission shaft, the bottom of the outer side of the transmission shaft is provided with a feeding screw, the top of the glue filling head body is provided with a motor, the outer side of the transmission shaft is fixedly provided with a mixing impeller positioned in the mixing cavity, and the outer wall of the mixing impeller is attached to the inner wall of the mixing cavity.
Through adopting above-mentioned technical scheme, when two sets of glue got into the mixing chamber through two sets of glue inlets pipe respectively, the motor drove the transmission shaft and mix impeller and stir the mixture to two sets of glue of mixing chamber inside, and when mixing, the transmission shaft drove the feeding screw equally and extrude the glue of mixing, and then accomplishes the encapsulating operation of electronic components.
The invention is further characterized in that rubber inlet pipes are fixedly arranged on two sides of the top of the rubber filling head body, the inside of the rubber inlet pipe is rotationally connected with the dispersing impeller, a main gear positioned on the top of the rubber filling head body is fixedly arranged on the outer side of the transmission shaft, two sides of the main gear are meshed with auxiliary gears, and the auxiliary gears are fixedly connected with the rotating shafts of the two dispersing impellers.
Through adopting above-mentioned technical scheme, drive the rotation of two sets of pinion through the master gear, and then two sets of pinion drive two sets of dispersion impeller that are located into the inside of rubber tube and rotate, and then improved the glue dispersibility that gets into better, effectually improved holistic mixing efficiency.
The invention is further characterized in that the two ends of the top of the glue filling head body are fixedly provided with fixing frames matched with the motor, fixing grooves matched with the motor are formed in the fixing frames, one end of the glue filling head body is fixedly provided with a mounting frame, and mounting holes are formed in the mounting frame.
By adopting the technical scheme, the fixing frame plays a role in fixing and supporting the motor, and the fixing frame plays a role in integrally supporting and fixing the mobile device, so that external mobile devices are convenient to connect.
In summary, the invention has the following advantages:
1. according to the invention, after the glue filling operation of the LED chip is finished by the glue filling head body, if the glue filling operation is carried out by the glue filling machine for a long time, the output ends of the four groups of mini-cylinders drive the four groups of sliding blocks to extend in a sliding way, and then the sealing frames are driven to extend to the lower part of the glue filling head body through the connecting frames;
2. according to the invention, when two groups of glue enter the mixing cavity through the two groups of glue inlet pipes respectively, the motor drives the transmission shaft and the mixing impeller to stir and mix the two groups of glue in the mixing cavity, and the transmission shaft also drives the feeding screw to extrude the mixed glue while mixing, so that the glue filling operation of electronic components is completed, and the main gear drives the two groups of auxiliary gears to rotate, and then the two groups of auxiliary gears drive the two groups of dispersing impellers in the glue inlet pipes to rotate, so that the dispersibility of the entered glue is better, and the overall mixing efficiency is effectively improved.
Drawings
FIG. 1 is a schematic view of a first view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an enlarged view of the invention at A of FIG. 2;
FIG. 4 is an enlarged schematic view of the internal structure of the present invention;
FIG. 5 is an enlarged, partially exploded view of the present invention;
FIG. 6 is a schematic structural view of the stirring mechanism of the present invention;
fig. 7 is a schematic structural diagram of a second view angle of the present invention.
In the figure: 1. a glue filling head body; 2. a mixing chamber; 3. a transmission shaft; 4. a mini cylinder; 5. a slide block; 6. a connecting frame; 7. a sealing frame; 8. a piston cylinder; 9. a piston chamber; 10. a piston block; 11. an air inlet pipe; 12. a connecting hose; 13. a shunt; 14. a bellows; 15. connecting wires; 16. a power supply control block; 17. a flow-through ring; 18. a feed screw; 19. a mixing impeller; 20. a rubber inlet pipe; 21. a dispersing impeller; 22. a main gear; 23. a pinion gear; 24. a motor; 25. a fixing frame; 26. and (5) mounting a frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.
An LED chip glue-pouring machine, as shown in figures 1, 2, 3, 4 and 5, comprises a glue-pouring head body 1, a mixing cavity 2 and a transmission shaft 3 inside the glue-pouring head body, wherein mini cylinders 4 are fixedly arranged at four corners of the outer side of the glue-pouring head body 1, and sliding blocks 5 which are in sliding connection with the glue-pouring head body 1 are fixedly arranged at the output ends of the four groups of mini cylinders 4;
the outer sides of the sliding blocks 5 are fixedly provided with connecting frames 6, the bottoms of the four groups of connecting frames 6 are fixedly provided with sealing frames 7, the outer sides of the four groups of sealing frames 7 are fixedly provided with piston cylinders 8, the interiors of the four groups of piston cylinders 8 are provided with piston cavities 9, the interiors of the piston cavities 9 are in sliding sealing connection with piston blocks 10 penetrating through the sealing frames 7, and heating wires are arranged in the piston blocks 10;
the two ends of each group of piston cylinders 8 are provided with a shunt tube 13 communicated with a piston cavity 9, the outer sides of mini cylinders 4 are connected with air inlet pipes 11, the outer sides of the glue filling head bodies 1 are fixedly provided with circulation rings 17, the circulation rings 17 are communicated with four groups of air inlet pipes 11, one sides of the circulation rings 17 are provided with connecting pipes connected with external pipelines, corrugated pipes 14 penetrating through the piston cylinders 8 are fixedly arranged on the outer sides of each group of piston blocks 10 through connecting hoses 12, connecting wires 15 penetrating through the corrugated pipes 14 and electrically connected with heating wires are arranged at four corners of the outer sides of the glue filling head bodies 1, wherein power supply control blocks 16 are fixedly arranged on the outer sides of the glue filling head bodies 1, the power supply control blocks 16 are electrically connected with the four groups of connecting wires 15, when the glue filling operation of the glue filling head bodies 1 is finished, if a glue filling machine is not used for a long time, the output ends of the four groups of mini cylinders 4 drive the four groups of sliding blocks 5 to extend in a sliding mode, and then the sealing frames 7 are driven to extend to the lower than the glue filling head bodies 1 through the connecting frames 6, and when the four groups of sealing frames 7 extend completely, the sealing frames 7 are tightly adhered to the outer sides of the glue filling head bodies 1, and the glue filling head bodies are tightly sealed;
simultaneously, when the external high-pressure gas drives the mini cylinder 4 to extend, the high-pressure gas simultaneously passes through the connecting hose 12 and the shunt tubes 13 respectively so as to further drive the piston blocks 10 to extend out of the piston cylinders 8 in the piston cavities 9 in the four groups of piston cylinders 8, and then the four groups of piston blocks 10 are tightly adhered to each other after the four groups of piston blocks 10 are completely extended;
further, as the heating wires are connected inside each group of piston blocks 10, and then the four groups of piston blocks 10 can store the glue retained inside the glue filling head body 1 at a constant temperature through the heating wires, the phenomenon that the retained glue is solidified due to long-time non-use is effectively avoided, the glue filling operation is carried out by using the glue filling machine for the next time, and the whole use process is more convenient.
Referring to fig. 2, 3 and 6, a driving shaft 3 is rotatably connected inside a glue filling head body 1, a feeding screw 18 is arranged at the bottom of the outer side of the driving shaft 3, a motor 24 is mounted at the top of the glue filling head body 1, a mixing impeller 19 positioned inside a mixing cavity 2 is fixedly arranged outside the driving shaft 3, and the outer wall of the mixing impeller 19 is attached to the inner wall of the mixing cavity 2.
Referring to fig. 6, rubber inlet pipes 20 are fixedly arranged on two sides of the top of a rubber filling head body 1, dispersing impellers 21 are rotatably connected in the rubber inlet pipes 20, main gears 22 positioned on the top of the rubber filling head body 1 are fixedly arranged on the outer sides of transmission shafts 3, auxiliary gears 23 are meshed on two sides of each main gear 22, and the auxiliary gears 23 are fixedly connected with rotating shafts of two groups of dispersing impellers 21.
Referring to fig. 1, 2 and 7, fixing frames 25 matched with a motor 24 are fixedly arranged at two ends of the top of a glue filling head body 1, fixing grooves matched with the motor 24 are formed in the fixing frames 25, a mounting frame 26 is fixedly arranged at one end of the glue filling head body 1, and mounting holes are formed in the mounting frame 26.
The working principle of the invention is as follows: when the device is used, the whole device is connected with external mobile equipment through the mounting frame 26, so that the external mobile equipment can drive the whole device to perform mobile glue filling operation;
when the glue filling operation is finished by the glue filling head body 1, if a glue filling machine is not used for a long time, the output ends of the four groups of mini air cylinders 4 drive the four groups of sliding blocks 5 to slide and stretch out, and then the sealing frames 7 are driven to stretch out to the lower side of the glue filling head body 1 through the connecting frames 6, and when the four groups of sealing frames 7 are completely stretched out, the outer sides of the four groups of sealing frames 7 are tightly adhered to each other for sealing, so that the protection sealing effect on the glue filling head body 1 is achieved;
simultaneously, when the external high-pressure gas drives the mini cylinder 4 to extend, the high-pressure gas simultaneously passes through the connecting hose 12 and the shunt tubes 13 respectively so as to further drive the piston blocks 10 to extend out of the piston cylinders 8 in the piston cavities 9 in the four groups of piston cylinders 8, and then the four groups of piston blocks 10 are tightly adhered to each other after the four groups of piston blocks 10 are completely extended;
further, as the heating wires are connected inside each group of piston blocks 10, the four groups of piston blocks 10 can store the glue retained inside the glue filling head body 1 at constant temperature through the heating wires, so that the phenomenon that the retained glue is solidified due to long-time non-use is effectively avoided, the next glue filling operation by using a glue filling machine is better facilitated, and the whole use process is more convenient;
specifically, the outer side of each group of piston blocks 10 is fixedly provided with a corrugated pipe 14 penetrating through the piston cylinder 8, and further, a connecting wire 15 can penetrate through the corrugated pipe 14 to be connected with a heating wire inside the piston block 10 by wires, and four groups of connecting wires 15 are connected with a power supply control block 16 by wires to supply power to a plurality of groups of heating wires;
still further, the connecting wire 15 is a spiral wire, the connecting hose 12 is a spiral hose, when the sealing frame 7 and the piston cylinder 8 are completely extended below the glue filling head body 1, the connecting wire 15 and the connecting hose 12 are in a straightened state, when the sealing frame 7 and the piston cylinder 8 are reset, the connecting wire 15 and the connecting hose 12 rebound to the spiral state under the self acting force, so that the problem that the connecting hose 12 and the connecting wire 15 interfere is effectively avoided;
when two groups of glue water enter the mixing cavity 2 through the two groups of glue inlet pipes 20 respectively, the motor 24 drives the transmission shaft 3 and the mixing impeller 19 to stir and mix the two groups of glue water in the mixing cavity 2, and the transmission shaft 3 also drives the feeding screw 18 to extrude the mixed glue water while mixing, so that the glue filling operation of the LED chip is completed;
and drive the rotation of two sets of pinion 23 through master gear 22, and then two sets of pinion 23 drive two sets of dispersion impeller 21 that are located into rubber tube 20 inside and rotate, and then improved the glue dispersibility that gets into better, effectually improved holistic mixing efficiency.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (8)
1. The utility model provides a LED chip encapsulating machine, includes encapsulating head body (1) and inside hybrid chamber (2), transmission shaft (3), its characterized in that: the four corners of the outer side of the glue filling head body (1) are fixedly provided with mini air cylinders (4), and the output ends of the four groups of mini air cylinders (4) are fixedly provided with sliding blocks (5) which are in sliding connection with the glue filling head body (1);
the sliding block is characterized in that connecting frames (6) are fixed on the outer sides of the sliding blocks (5), sealing frames (7) are fixedly arranged at the bottoms of the four groups of connecting frames (6), piston cylinders (8) are fixedly arranged on the outer sides of the four groups of sealing frames (7), piston cavities (9) are formed in the four groups of piston cylinders (8), piston blocks (10) penetrating through the sealing frames (7) are connected in a sliding and sealing mode in the piston cavities (9), and heating wires are arranged in the piston blocks (10);
every group piston section of thick bamboo (8) both ends all are provided with shunt tubes (13) that are linked together with piston chamber (9), mini cylinder (4) outside is connected with intake pipe (11), through coupling hose (12) between intake pipe (11) and shunt tubes (13), every group piston piece (10) outside all is fixed to be provided with bellows (14) that run through piston section of thick bamboo (8), the four corners department all is provided with connecting wire (15) that run through bellows (14) and heater strip electric connection in the outer side of encapsulating head body (1) the fixed circulation ring (17) that is provided with in the outer side of encapsulating head body (1), and circulation ring (17) are linked together with four sets of intake pipes (11), circulation ring (17) one side is provided with the connecting pipe that is connected with external pipeline.
2. The LED chip glue-pouring machine according to claim 1, wherein: the outer side of the glue filling head body (1) is fixedly provided with a power supply control block (16), and the power supply control block (16) is electrically connected with four groups of connecting wires (15).
3. The LED chip glue-pouring machine according to claim 1, wherein: the glue-pouring head is characterized in that a transmission shaft (3) is connected to the inside of the glue-pouring head body (1) in a rotating mode, a feeding screw (18) is arranged at the bottom of the outer side of the transmission shaft (3), and a motor (24) is arranged at the top of the glue-pouring head body (1).
4. A LED chip glue-pouring machine according to claim 3, characterized in that: the mixing impeller (19) positioned in the mixing cavity (2) is fixedly arranged on the outer side of the transmission shaft (3), and the outer wall of the mixing impeller (19) is attached to the inner wall of the mixing cavity (2).
5. A LED chip glue-pouring machine according to claim 3, characterized in that: glue inlet pipes (20) are fixedly arranged on two sides of the top of the glue filling head body (1), and dispersing impellers (21) are rotatably connected inside the glue inlet pipes (20).
6. The LED chip glue-pouring machine according to claim 1, wherein: the main gear (22) positioned at the top of the glue filling head body (1) is fixedly arranged on the outer side of the transmission shaft (3), the two sides of the main gear (22) are meshed with the auxiliary gears (23), and the auxiliary gears (23) are fixedly connected with the rotating shafts of the two groups of dispersing impellers (21).
7. A LED chip glue-pouring machine according to claim 3, characterized in that: fixing frames (25) matched with the motors (24) are fixedly arranged at two ends of the top of the glue filling head body (1), and fixing grooves matched with the motors (24) are formed in the fixing frames (25).
8. The LED chip glue-pouring machine according to claim 1, wherein: one end of the glue filling head body (1) is fixedly provided with a mounting frame (26), and mounting holes are formed in the mounting frame (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310523770.3A CN116273710B (en) | 2023-05-11 | 2023-05-11 | LED chip glue filling machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310523770.3A CN116273710B (en) | 2023-05-11 | 2023-05-11 | LED chip glue filling machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116273710A CN116273710A (en) | 2023-06-23 |
| CN116273710B true CN116273710B (en) | 2023-08-01 |
Family
ID=86790854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310523770.3A Active CN116273710B (en) | 2023-05-11 | 2023-05-11 | LED chip glue filling machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116273710B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3804856A1 (en) * | 1988-02-17 | 1989-08-31 | Macon Gmbh Klebstoff Auftragsg | DEVICE FOR APPLYING GLUE OR THE LIKE |
| DE102017115264A1 (en) * | 2017-07-07 | 2019-01-10 | Hauni Maschinenbau Gmbh | Glue nozzle for gluing a surface of a product of the tobacco processing industry |
| CN107185755A (en) * | 2017-07-21 | 2017-09-22 | 无锡市湖昌机械制造有限公司 | The washer jet of disinfection protection set is installed |
| DE102018211676A1 (en) * | 2018-07-12 | 2020-01-16 | AUDI HUNGARIA Zrt. | Protective cap element and nozzle with a protective cap element |
| DE102019122918A1 (en) * | 2019-08-27 | 2021-03-04 | Dürr Systems Ag | Applicator for applying a sealing compound to a flange fold |
| CN211864796U (en) * | 2020-04-02 | 2020-11-06 | 杭州金丰环保科技有限公司 | Mixing device |
| CN215878587U (en) * | 2021-09-07 | 2022-02-22 | 苏州亿源宸智能科技有限公司 | Automatic feeding device for glue dispensing machine |
| CN113953118A (en) * | 2021-10-29 | 2022-01-21 | 湖南贝恩叮当猫婴童用品有限公司 | Adhesive spraying device for processing paper diapers |
| CN217569447U (en) * | 2022-05-18 | 2022-10-14 | 糜年艳 | Electronic components adhesive deposite device |
| CN218249866U (en) * | 2022-08-12 | 2023-01-10 | 烟台泰盛精化科技有限公司 | Double-group Pu heat-conducting structural adhesive pouring equipment |
| KR102500402B1 (en) * | 2022-12-02 | 2023-02-16 | 주식회사 금라기술단 | Sprinkler Head Protection Device for Fire Fighting |
| CN218790892U (en) * | 2022-12-29 | 2023-04-07 | 温州卡派鞋业有限公司 | Gluing device for production of casual shoes |
-
2023
- 2023-05-11 CN CN202310523770.3A patent/CN116273710B/en active Active
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