CN116265511A - Preparation method and application of inorganic fiber gasket material with high heat conductivity - Google Patents
Preparation method and application of inorganic fiber gasket material with high heat conductivity Download PDFInfo
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- CN116265511A CN116265511A CN202310160015.3A CN202310160015A CN116265511A CN 116265511 A CN116265511 A CN 116265511A CN 202310160015 A CN202310160015 A CN 202310160015A CN 116265511 A CN116265511 A CN 116265511A
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- 239000012784 inorganic fiber Substances 0.000 title claims abstract description 39
- 239000000463 material Substances 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000835 fiber Substances 0.000 claims abstract description 127
- 229920000642 polymer Polymers 0.000 claims abstract description 45
- 239000011265 semifinished product Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 239000000047 product Substances 0.000 claims abstract description 9
- 229920002521 macromolecule Polymers 0.000 claims abstract 2
- 239000004814 polyurethane Substances 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920005546 furfural resin Polymers 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920001083 polybutene Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 29
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 29
- 230000007547 defect Effects 0.000 abstract description 2
- 238000004100 electronic packaging Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000945 filler Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 101710149792 Triosephosphate isomerase, chloroplastic Proteins 0.000 description 1
- 101710195516 Triosephosphate isomerase, glycosomal Proteins 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920005594 polymer fiber Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Combustion & Propulsion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention discloses a preparation method and application of a high-heat-conductivity inorganic fiber gasket material, wherein the preparation method comprises the following steps: s1: cutting inorganic fibers into short fibers, and arranging the short fibers in parallel to obtain a short fiber bundle; s2: coating a high molecular polymer on the short fiber bundles to obtain high molecular short fiber bundles; s3: the macromolecule short fiber bundles are stacked and cut after being solidified, and a semi-finished product is obtained; s4: and (5) carrying out post-treatment on the semi-finished product to obtain the finished product. The high-heat-conductivity silicon nitride fiber gasket prepared by the method is simple in preparation method, good in heat conductivity, excellent in insulativity and tensile strength, overcomes the defects of the traditional high-heat-conductivity material, better meets the requirements of practical application, and can be applied to electronic packaging, such as a shell of a circuit built-in chip.
Description
Technical Field
The invention relates to the technical field of heat conducting strips, and specifically relates to a preparation method and application of a high-heat-conductivity inorganic fiber gasket material, wherein the classification number of the material is C08J 5/18.
Background
With the rapid development of two electronic products, people put higher demands on the performance and service life of the electronic products, and thermal management becomes one of the great problems in the development of the electronic product industry. If the heat conducting and radiating material is not good, the performance of the electronic product is greatly reduced, and the service life of the electronic product is shortened. In most high power electronics, heat is dissipated by the heat sink, but the rigidity of the chip and the heat sink both prevent full contact and create a large number of wavy, concave-convex air gaps between the interfaces. These gaps greatly impede heat transfer between the mating surfaces. There is therefore a need for efficient heat dissipation using a thermally conductive interface material (TIM) to efficiently transfer a heat source to a heat sink.
In the prior art, in order to improve the heat conducting performance of the silicone rubber/gel gasket, a composite material is generally formed by using a plurality of heat conducting fillers such as metal, ceramic, carbon nano tube, graphene, boron nitride and the like, but the following problems occur, because of the high interface thermal resistance between the gel and the heat conducting filler, the heat conducting performance is reduced to a certain extent, and in addition, if the filler content is further increased, the mechanical performance of the heat conducting gasket is reduced.
Silicon nitride fiber has advantages such as insulating nature is good, mechanical strength is high, the wearability is good, coefficient of thermal expansion is low, thermal conductivity is good, is widely used as the raw and other materials of TIMs, but under the general circumstances, the fibre can not vertically arrange along the horizontal direction to the arrangement between fibre and the fibre is inseparable, and fibre heat conduction gasket surface is uneven, and then makes heat conductivility greatly reduced.
Patent CN112409798A discloses a high thermal conductivity gasket and a preparation method thereof, and after aluminum oxide and liquid silicone rubber are solidified and formed by a vacuum resin transfer process, the overall thermal conductivity of the material is improved, but the problem of mechanical properties of the thermal conductivity gasket is not solved.
Disclosure of Invention
In order to solve the above problems, the first aspect of the present invention provides a method for preparing an inorganic fiber gasket material with high heat conductivity, comprising the following steps:
s1: cutting inorganic fibers into short fibers, bundling the short fibers into a bundle, and simultaneously arranging the fibers in parallel to obtain a short fiber bundle with the thickness of 0.1-0.5 mm;
s2: coating a high molecular polymer on the short fiber bundles to fully infiltrate each short fiber, and naturally solidifying for 1-1.5h to obtain the high molecular short fiber bundles;
s3: and (3) bonding the polymer short fiber bundles and the other polymer short fiber bundles in parallel, sequentially repeating the steps, stacking the polymer short fiber bundles layer by layer, naturally curing for 0.5-1h, and longitudinally cutting to obtain a semi-finished product.
S4: soaking the semi-finished product with 15-20mL of sol for 5-10min, ultrasonically washing with deionized water for 10-20min, naturally drying, and polishing the surface to be smooth.
Preferably, the mass ratio between the inorganic fiber and the high molecular polymer is (3-6): (4-6).
Further preferably, the mass ratio between the inorganic fiber and the high molecular polymer is (3-5): (4-6).
Further preferably, the mass ratio between the inorganic fiber and the high molecular polymer is 4:5.
preferably, the inorganic fibers include at least one of glass fibers, ceramic fibers, boron fibers, and carbon fibers.
Further preferably, the inorganic fibers are ceramic fibers including at least one of quartz fibers, silicon carbide fibers, zirconia fibers, alumina fibers, and silicon nitride fibers.
Further preferably, the ceramic fiber is a silicon nitride fiber.
Preferably, the inorganic fibers have a diameter of 1 to 5 μm.
Further preferably, the inorganic fibers have a diameter of 2 to 4. Mu.m.
Further preferably, the inorganic fiber has a diameter of 3 μm.
Preferably, the high molecular polymer comprises at least one of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin, polybutene and organic silica gel.
Further preferably, the high molecular polymer is polyurethane.
Preferably, the length of the short fiber in the step S1 is 5-10cm.
Further preferably, the length of the short fibers in the step S1 is 6-8cm.
Further preferably, the length of the short fiber in the step S1 is 7cm.
Preferably, the number of the short fibers in the short fiber bundles in the step S1 is 20-35.
Further preferably, the number of the short fibers in the short fiber bundles in the step S1 is 25 to 35.
Further preferably, the number of the short fibers in the short fiber bundles in the step S1 is 30.
Preferably, the thickness of the polymer staple fiber bundles in the step S2 is 0.1-0.5mm.
Further preferably, the thickness of the polymer staple fiber bundles in the step S2 is 0.2-0.4mm.
Further preferably, the thickness of the polymer staple fiber bundles in the step S2 is 0.3mm.
Preferably, the thickness of the semi-finished product in the step S3 is 0.5-1.5mm.
Further preferably, the thickness of the semi-finished product in the step S3 is 0.8-1.2mm.
Further preferably, the thickness of the semi-finished product in the step S3 is 1mm.
The invention provides an application of a preparation method of a high-heat-conductivity silicon nitride fiber gasket material in electronic products.
The applicant found that when the mass ratio between the silicon nitride fiber and the polyurethane is (3-6): (4-6) improving the heat conduction property of the gasket material, and supposing that: when the amount of the silicon nitride fibers is small, the silicon nitride fibers are in discrete distribution in the high polymer, the silicon nitride fibers are distributed in the high polymer in an isolated manner, the mutual effect is not generated, the heat conducting performance is reduced, the silicon nitride fibers are in synergistic effect along with the increase of the filling amount, and overlap joint to form a heat conducting passage, at the moment, the heat conducting performance of the heat conducting gasket is obviously improved, but if the content of the silicon nitride fibers is too high, the cross-linking density among the high molecules is reduced, so that the tensile strength is reduced to a certain extent, and in order to obtain more heat conducting performance, the applicant further limits the thickness of the high polymer fiber bundles to be 0.2-0.4mm, the number of the short fibers to be 25-35, the heat conducting performance is ensured, meanwhile, the tensile strength is improved, and presumably, polyurethane and the silicon nitride fibers form a three-dimensional reticular elastomer structure after solidification, the fibers are tightly arranged, and meanwhile, the tensile strength is improved.
The beneficial effects are that: the preparation method of the high-heat-conductivity silicon nitride fiber gasket is simple, the silicon nitride fibers in the prepared heat-conductivity gasket have high directionality, the silicon nitride fibers are closely arranged, the heat conducting performance of the high-heat-conductivity silicon nitride fiber gasket is improved, in addition, the high-heat-conductivity silicon nitride fiber gasket conducts heat longitudinally, so that transverse heat accumulation is avoided, the high-heat-conductivity silicon nitride fiber gasket also has excellent insulativity and tensile strength, the defects of the traditional high-heat-conductivity material are overcome, the requirements of practical application are better met, and the high-heat-conductivity silicon nitride fiber gasket can be applied to electronic packaging such as a shell of a circuit built-in chip.
Examples
Example 1
A preparation method of a high-heat-conductivity inorganic fiber gasket material comprises the following steps:
s1: cutting inorganic fibers into short fibers with the length of 7cm, bundling 30 short fibers into a bundle, and arranging the fibers in parallel to obtain a short fiber bundle;
s2: coating a high polymer on the short fiber bundles, wherein the coating thickness is 50 mu m, so that each short fiber is fully soaked, and naturally solidifying for 1h to obtain the high polymer short fiber bundles with the thickness of 0.3 mm;
s3: and (3) bonding the polymer short fiber bundles and the other polymer short fiber bundles in parallel, sequentially repeating the steps, stacking the polymer short fiber bundles layer by layer, naturally curing for 1h, and longitudinally cutting to obtain a semi-finished product with the thickness of 1mm.
S4: soaking the semi-finished product with 20mL of sol for 8min, ultrasonically washing with deionized water for 15min, naturally drying, and polishing the surface to be smooth.
The inorganic fiber is silicon nitride fiber with the diameter of 3 mu m, and is purchased from Fu-established new material Co., ltd, and the model is 03.
The high polymer is polyurethane, and is purchased from Dongli (Dongguan) new material technology Co., ltd, and the model is JL-6039.
The mass ratio of the silicon nitride fiber to the polyurethane is 4:5.
example 2
A preparation method of a high-heat-conductivity inorganic fiber gasket material comprises the following steps:
s1: cutting inorganic fibers into short fibers with the length of 7cm, bundling 30 short fibers into a bundle, and arranging the fibers in parallel to obtain a short fiber bundle;
s2: coating a high polymer on the short fiber bundles, wherein the coating thickness is 50 mu m, so that each short fiber is fully soaked, and naturally solidifying for 1h to obtain the high polymer short fiber bundles with the thickness of 0.3 mm;
s3: and (3) bonding the polymer short fiber bundles and the other polymer short fiber bundles in parallel, sequentially repeating the steps, stacking the polymer short fiber bundles layer by layer, naturally curing for 1h, and longitudinally cutting to obtain a semi-finished product with the thickness of 1mm.
S4: soaking the semi-finished product with 20mL of sol for 8min, ultrasonically washing with deionized water for 15min, naturally drying, and polishing the surface to be smooth.
The inorganic fiber is silicon nitride fiber with the diameter of 3 mu m, and is purchased from Fu-established new material Co., ltd, and the model is 03.
The high polymer is polyurethane, and is purchased from Dongli (Dongguan) new material technology Co., ltd, and the model is JL-6039.
The mass ratio of the silicon nitride fiber to the polyurethane is 3:4.
example 3
A preparation method of a high-heat-conductivity inorganic fiber gasket material comprises the following steps:
s1: cutting inorganic fibers into short fibers with the length of 7cm, bundling 25 short fibers into a bundle, and arranging the fibers in parallel to obtain a short fiber bundle;
s2: coating a high polymer on the short fiber bundles, wherein the coating thickness is 50 mu m, so that each short fiber is fully soaked, and naturally solidifying for 1h to obtain the high polymer short fiber bundles with the thickness of 0.4 mm;
s3: and (3) bonding the polymer short fiber bundles and the other polymer short fiber bundles in parallel, sequentially repeating the steps, stacking the polymer short fiber bundles layer by layer, naturally curing for 1h, and longitudinally cutting to obtain a semi-finished product with the thickness of 1mm.
S4: soaking the semi-finished product with 20mL of sol for 8min, ultrasonically washing with deionized water for 15min, naturally drying, and polishing the surface to be smooth.
The inorganic fiber is silicon nitride fiber with the diameter of 3 mu m, and is purchased from Fu-established new material Co., ltd, and the model is 03.
The high polymer is polyurethane, and is purchased from Dongli (Dongguan) new material technology Co., ltd, and the model is JL-6039.
The mass ratio of the silicon nitride fiber to the polyurethane is 4:5.
example 4
A preparation method of a high-heat-conductivity inorganic fiber gasket material comprises the following steps:
s1: cutting inorganic fibers into short fibers with the length of 7cm, bundling 30 short fibers into a bundle, and arranging the fibers in parallel to obtain a short fiber bundle;
s2: coating a high polymer on the short fiber bundles, wherein the coating thickness is 50 mu m, so that each short fiber is fully soaked, and naturally solidifying for 1h to obtain the high polymer short fiber bundles with the thickness of 0.2 mm;
s3: and (3) bonding the polymer short fiber bundles and the other polymer short fiber bundles in parallel, sequentially repeating the steps, stacking the polymer short fiber bundles layer by layer, naturally curing for 1h, and longitudinally cutting to obtain a semi-finished product with the thickness of 1mm.
S4: soaking the semi-finished product with 20mL of sol for 8min, ultrasonically washing with deionized water for 15min, naturally drying, and polishing the surface to be smooth.
The inorganic fiber is silicon nitride fiber with the diameter of 3 mu m, and is purchased from Fu-established new material Co., ltd, and the model is 03.
The high polymer is polyurethane, and is purchased from Dongli (Dongguan) new material technology Co., ltd, and the model is JL-6039.
The mass ratio of the silicon nitride fiber to the polyurethane is 6:6.
comparative example 1
The mass ratio between the silicon nitride fiber and polyurethane is changed to 4:2, the thickness of the polymer short fiber bundles was changed to 0.1mm, and the procedure of example 1 was repeated.
Comparative example 2
The procedure of example 1 was repeated except that the thickness of the polymer staple fiber bundles was changed to 0.6mm, the number of the staple fibers was changed to 15.
Comparative example 3
The mass ratio between the silicon nitride fiber and polyurethane is changed to 1:5, the number of short fibers was changed to 40, and the rest was the same as in example 1.
Evaluation of Performance
(1) Measurement of thermal conductivity: the thermal conductivity measurements were performed for examples 1-4 and comparative examples 1-3 using a TIM Tester 1400 material thermal resistance thermal conductivity Tester from ANALYSIS TECH, U.S. A.A., with test standard ASTM D5470, and the test data are given in Table 1 below.
(2) Determination of tensile Strength: examples 1-4 and comparative examples 1-3 were tested according to the methods described in standard ASTM D638-2010, with test data as in table 1 below.
TABLE 1
Claims (10)
1. The preparation method of the inorganic fiber gasket material with high heat conductivity is characterized by comprising the following steps:
s1: cutting inorganic fibers into short fibers, and arranging the short fibers in parallel to obtain a short fiber bundle;
s2: coating a high molecular polymer on the short fiber bundles to obtain high molecular short fiber bundles;
s3: stacking and cutting the macromolecule short fiber bundles to obtain a semi-finished product;
s4: and (5) carrying out post-treatment on the semi-finished product to obtain the finished product.
2. The method for preparing a high thermal conductivity inorganic fiber gasket material according to claim 1, wherein the mass ratio between the inorganic fiber and the high molecular polymer is (3-6): (4-6).
3. The method of making a highly thermally conductive inorganic fibrous gasket material of claim 1 wherein said inorganic fibers comprise at least one of glass fibers, ceramic fibers, boron fibers and carbon fibers.
4. The method for preparing a high thermal conductivity inorganic fiber gasket material according to claim 1, wherein the diameter of the inorganic fiber is 1-5 μm.
5. The method for preparing a high thermal conductivity inorganic fiber gasket material according to claim 1, wherein said high molecular polymer comprises at least one of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin, polybutene and silicone.
6. The method for preparing a high thermal conductivity inorganic fiber gasket material according to claim 1, wherein the length of the short fiber in the step S1 is 5-10cm.
7. The method for preparing a high thermal conductivity inorganic fiber gasket material according to claim 1, wherein the number of short fibers in the short fiber bundles in the step S1 is 20-35.
8. The method for preparing a high thermal conductivity inorganic fiber gasket material according to claim 1, wherein the thickness of the polymer short fiber bundles in the step S2 is 0.1-0.5mm.
9. The method for preparing a high thermal conductivity inorganic fiber gasket material according to claim 1, wherein the thickness of the semi-finished product in the step S3 is 0.5-1.5mm.
10. Use of a method for the preparation of a highly thermally conductive inorganic fibrous gasket material according to any one of claims 1 to 9 in an electronic product.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310160015.3A CN116265511A (en) | 2023-02-24 | 2023-02-24 | Preparation method and application of inorganic fiber gasket material with high heat conductivity |
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| CN202310160015.3A CN116265511A (en) | 2023-02-24 | 2023-02-24 | Preparation method and application of inorganic fiber gasket material with high heat conductivity |
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