CN116264049A

CN116264049A - Display device and method of manufacturing the same

Info

Publication number: CN116264049A
Application number: CN202211548595.5A
Authority: CN
Inventors: 朴赞赫
Original assignee: LG Display Co Ltd
Current assignee: LG Display Co Ltd
Priority date: 2021-12-13
Filing date: 2022-12-05
Publication date: 2023-06-16
Also published as: DE102022130494A1; KR20230089318A; GB2616697B; GB202216495D0; GB2616697A; US20230189563A1

Abstract

The application relates to a display device and a method of manufacturing the same. Disclosed is a display device including a glass substrate and having improved heat dissipation function and impact absorption function, and at the same time having a reduced thickness. For this purpose, a plate including a porous member having both a heat dissipation function and an impact absorption function is disposed under the display panel. The plate may have both a heat dissipation function and a cushioning function using only the porous member without adding a separate heat dissipation layer or cushioning layer. Further, a display device is disclosed in which a black screen is displayed when a display panel is not activated, thereby improving display quality. For this reason, a black heat dispersion layer is formed under the porous member to improve heat dissipation performance and display quality.

Description

Display device and method of manufacturing the same

Technical Field

The present disclosure relates to a display device and a method of manufacturing the same, and more particularly, to a display device and a method of manufacturing the same capable of improving heat dissipation and impact absorption functions while reducing the thickness of the display device.

Background

Display devices that display images on TVs, monitors, smart phones, tablet PCs, laptop computers, and the like are used in various ways and forms.

Following the Liquid Crystal Display (LCD) devices hitherto used among display devices, the use and application range of Organic Light Emitting Display (OLED) devices are rapidly expanding.

The display device includes liquid crystal or light emitting elements for realizing an image, and includes thin film transistors for individually controlling the operation of each liquid crystal or light emitting element.

For example, an organic light emitting display device includes a driving thin film transistor for driving a pixel and a light emitting element generating light when a signal is received from the driving thin film transistor.

The organic light emitting display device is light and thin, and has advantages such as low power consumption, high luminance, and fast response.

The organic light emitting display device may include a substrate made of a plastic material or a glass material. When a plastic substrate is used, the substrate is thin and flexible, and is widely used for flexible display devices that can be bent and folded.

In addition, the glass substrate has a flat surface and has a certain strength and hardness, and the driving thin film transistor and the light emitting element can be easily formed on the glass substrate.

Small organic light emitting display devices are widely used in smart phones. Plastic substrates are widely used in flexible and foldable display devices.

In addition, the area of the medium-sized and large-sized organic light emitting display device is larger than that of the small-sized organic light emitting display device, and a larger number of driving circuits and pixels are required.

Therefore, the driving circuit and the pixels are complexly arranged. Thus, an accurate process for forming the driving circuit and the pixel is required. For this purpose, a glass substrate that can continuously maintain flatness is widely used.

Disclosure of Invention

The display apparatus using the glass substrate may be heavier and thicker than the display apparatus using the plastic substrate, and may be easily damaged due to external impact.

Further, with an increase in the area of the display panel and the application of high resolution, the output range of the driver for driving the pixels becomes wider and the driving speed thereof increases, so that the power consumption of the driver and the display panel increases. Thus, a large amount of high temperature heat is generated therefrom.

Accordingly, a reinforcing member for absorbing external impact applied to the display panel or for reinforcing the strength of the display panel and a heat dissipating member for removing high temperature heat generated from the display device are provided in a layered manner of a plurality of layers. Accordingly, the weight and thickness of the display device further increase.

For example, the reinforcing member may include a reinforcing layer made of polyethylene terephthalate (PET), polyimide (PI), or the like and disposed under the display panel. The heat dissipation member may include a metal layer or a metal plate made of a metal having high thermal conductivity, such as copper (Cu) and aluminum (Al), and disposed under the display panel or the reinforcement member.

As the thickness of each of the reinforcing member and the heat dissipation member increases, the reinforcing function and the heat dissipation function of the display device may increase. However, the overall thickness and weight of the display device increases as the thickness increases. This can be disadvantageous in terms of portability and design.

Further, when the thickness of each of the heat dissipation layer and the buffer layer is reduced to reduce the overall thickness of the display device, the heat dissipation function and the impact absorption function may be reduced.

In addition, the reinforcing member and the heat dissipation member having different functions may be made of different materials suitable for the different functions. Thus, interlayer separation phenomenon or poor adhesion may occur between layers made of different materials. In order to fix the layers to each other, it is necessary to add a separate adhesive layer between the layers and perform an adhesive process. Therefore, the manufacturing cost increases with the increase in thickness.

An object of the present disclosure is to improve a heat dissipation function and an enhancement function (or an impact absorbing function) of a display device using a glass substrate while reducing the thickness and weight of the display device, and to simplify a manufacturing process thereof.

The objects of the present disclosure are not limited to the above objects. Other objects and advantages of the present disclosure not mentioned may be understood based on the following description, and may be more clearly understood based on the embodiments of the present disclosure. Furthermore, it will be readily understood that the objects and advantages of the present disclosure may be realized by the means of the instrumentalities and combinations particularly pointed out in the appended claims.

The display device according to an embodiment of the present disclosure includes: a display panel including a front portion on which an image is displayed and a pad portion extending from the front portion; and a plate in contact with the bottom surface of the front portion, wherein the plate may include a porous member and an adhesive member on the porous member.

In addition, the substrate of the display panel may include a glass substrate. At least one of the first heat dissipation layer and the second heat dissipation layer may be formed under the display panel.

Specific details of other embodiments are included in the detailed description and the accompanying drawings.

The plate according to the present disclosure includes a porous member having both a heat dissipation function and a cushioning function. Therefore, an effective heat dissipation function and a reinforcing function (or an impact absorbing function) can be obtained using only the porous member.

The porous member has a very good heat dissipation function and reinforcing function (or impact absorbing function) even when its thickness is small. This can reduce the overall thickness of the panel, thereby reducing the overall thickness and weight of the display device.

Further, a black heat dissipation layer is formed on the bottom surface of the board according to the present disclosure, and the heat dissipation function is further improved. Due to the black dispersed thermal layer, the screen appears black when the display panel is not activated. This improves the display quality.

The effects of the present disclosure are not limited to the above-described effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

Drawings

Fig. 1A and 1B illustrate a front surface and a rear surface of a display device according to an embodiment of the present disclosure, respectively.

Fig. 2 is a sectional view taken along I-I' of fig. 1A, and illustrates a display device according to an embodiment of the present disclosure.

Fig. 3 is a cross-sectional view illustrating an adhesive member of a plate according to an embodiment of the present disclosure.

Fig. 4 is a cross-sectional view illustrating a porous member of a plate according to an embodiment of the present disclosure.

Fig. 5 is a cross-sectional view along I-I' of fig. 1A and illustrates a display device according to another embodiment of the present disclosure.

Fig. 6 is a sectional view along II' of fig. 1A, and shows a display device according to still another embodiment of the present disclosure.

Detailed Description

The advantages and features of the present disclosure and the methods of accomplishing the same will be apparent by reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but may be implemented in various forms. Accordingly, these embodiments are set forth only to complete the present disclosure and to fully inform the scope of the present disclosure to those ordinarily skilled in the art to which the present disclosure pertains.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for describing embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto. Like reference numerals refer to like elements throughout. In addition, descriptions and details of well-known steps and elements are omitted for simplicity of the description. Furthermore, in the following detailed description of the present disclosure, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the present disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the terms "a" and "an" are intended to also include the plural of the constituent unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and "including," when used in this specification, specify the presence of stated features, integers, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of …" may modify the entire list of elements when preceding the list of elements and may not modify individual elements in the list. In interpreting the values, errors or tolerances therein may occur even if there is no explicit description thereof.

Further, it will also be understood that when a first element or layer is referred to as being "on" a second element or layer, it can be directly on the second element or can be indirectly on the second element with a third element or layer disposed between the first and second elements or layers. It will be understood that when an element or layer is referred to as being "connected" or "coupled" to another element or layer, it can be directly on, connected or coupled to the other element or layer, or one or more intervening elements or layers may be present. Furthermore, it will also be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present.

Further, as used herein, when a layer, film, region, plate, etc. is disposed "on" or "on top of" another layer, film, region, plate, etc., the former may directly contact the latter, or yet another layer, film, region, plate, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed "on" or "on top of" another layer, film, region, plate, etc., the former is in direct contact with the latter and yet another layer, film, region, plate, etc. is not disposed between the former and the latter. Further, as used herein, when a layer, film, region, plate, etc., is disposed "under" or "beneath" another layer, film, region, plate, etc., the former may be in direct contact with the latter, or yet another layer, film, region, plate, etc., may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc., is disposed "under" or "beneath" another layer, film, region, plate, etc., the former is in direct contact with the latter and yet another layer, film, region, plate, etc., is not disposed between the former and the latter.

In the description of a temporal relationship, for example, a temporal relationship between two events such as "following …", "following …", "preceding …", etc., unless "directly following …", "directly following …", "directly preceding …" is indicated, another event may occur therebetween.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the spirit and scope of the present disclosure.

The features of the various embodiments of the present disclosure may be combined with each other, either locally or entirely, and may be technically associated with each other or interoperable. Embodiments may be implemented independently of each other, and may also be implemented together in association.

As used herein, the terms "substantially," "about," and similar terms are used as approximate terms and are intended to describe the inherent deviation of measured or calculated values as would be recognized by one of ordinary skill in the art. The term may be used to prevent unauthorized infringer designs from bypassing unauthorized use of accurate or absolute numbers that are enhanced to aid in understanding the present disclosure.

Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, a top or upward direction may refer to a +z-axis direction, while a bottom or downward direction may refer to a-Z-axis direction.

Further, in a plan view of the display device, an upper side surface or upper side, a lower side surface or lower side, a left side surface or left side, and a right side surface or right side may be defined on a plane defined by X-axis and Y-axis directions perpendicular to the Z-axis direction.

The display device of the present disclosure may be applied to an organic light emitting display device, but is not limited thereto, and may be applied to various display devices such as an LED display device or a quantum dot display device.

Hereinafter, various configurations of a display apparatus that can improve heat dissipation performance and an enhancing function (or an impact absorbing function) of a device while reducing thickness and weight of the device and can have improved display quality will be described.

Fig. 1A shows a front surface where a display area in a display device is located, and fig. 1B shows a rear surface of the display device.

The display apparatus 10 may include a cover member 20, a display panel 100 coupled to a rear surface of the cover member 20, and a frame disposed on the rear surface of the display panel 100 to support the cover member 20. The display panel 100 may be disposed between the cover member 20 and the frame.

The cover member 20 is disposed to cover the front surface of the display panel 100 to protect the display panel 100 from external impact. The cover member 20 may be made of cover glass, tempered glass, reinforced plastic, or the like. The present disclosure is not limited thereto.

The edge portion of the cover member 20 may have a curved portion curved toward the rear surface (in the-Z axis direction) of the display device 10.

In this case, the cover member 20 is provided to cover at least a partial area of the side surface of the display panel 100 provided on the rear surface thereof, so that not only the front surface of the display panel 100 but also the side surface thereof may be protected from external impact.

The cover member 20 may be made of a transparent material such that the cover member may overlap a display area of the display panel for displaying an image. For example, the cover member 20 may be made of a transparent plastic material or may be a cover glass made of a transparent glass material through which an image may be transmitted. The present disclosure is not limited thereto.

A display panel 100 including a front FP and a PAD portion PAD may be disposed under the cover member 20. The front FP may include a pixel array including a plurality of light emitting elements, pixels having driving thin film transistors, and signal lines for transmitting driving signals, thereby displaying images. The front FP may include a display area AA on which an image is displayed and a non-display area NA that is an area other than the display area AA. The non-display area NA may be formed to surround the display area AA.

The display area AA and the non-display area NA may be equally applied to the cover member 20. The area through which the image of the cover member 20 is transmitted may be the display area AA of the cover member. The area of the cover member surrounding the display area AA and through which the image is not transmitted may be a non-display area NA of the cover member. The non-display area NA may be a bezel area.

The PAD portion PAD of the display panel 100 extends from the front FP, and a driver for driving the pixels may be directly connected to the PAD portion PAD. Alternatively, the flexible circuit board 400 on which the driver 420 has been mounted may be connected to the PAD portion PAD.

Hereinafter, the display panel 100 and the board 200 according to the embodiment of the present disclosure will be described with reference to fig. 2.

Referring to fig. 2, the display panel 100 may be connected or coupled to the rear surface of the cover member 20.

The first connection member 150 having adhesiveness may be disposed between the cover member 20 and the display panel 100 such that the cover member 20 and the display panel 100 may be connected or coupled to each other by passing through the first connection member 150.

Since the first connection member 150 may be disposed to overlap the display area AA, the first connection member 150 may be made of a transparent adhesive member. For example, the first connection member 150 may be made of or include a material such as OCA (optically clear adhesive), OCR (optically clear resin), or PSA (pressure sensitive adhesive). The present disclosure is not limited thereto.

The optical film 140 may also be disposed between the first connection member 150 and the display panel 100. The optical film 140 may have a form in which one or more functional layers are laminated. However, the present disclosure is not limited thereto. For example, the optical film 140 may include an anti-reflection layer such as a polarizing film, which may prevent reflection of external light and improve outdoor visibility and contrast of an image displayed on the display panel 100.

Further, in one example, the optical film 140 may further include a barrier layer to prevent permeation of moisture or oxygen. The barrier layer may be made of a material having low moisture permeability, such as a polymeric material.

The display panel 100 may include a substrate 110, a pixel array 120 disposed on the substrate 110, and a package portion 130 disposed to cover the pixel array 120. The touch electrode may be additionally disposed on the encapsulation part 130.

The substrate 110 may serve as a base substrate of the display panel 100. The substrate 110 may be implemented as a glass substrate made of glass, which may have high flatness and may withstand high process temperatures.

The substrate 110 is thick and heavy in the mother glass state. Therefore, it is required to reduce the thickness and weight thereof to improve portability.

Accordingly, the surface of the substrate 110 may be etched by spraying an etchant on at least one surface of the substrate 110 or immersing the substrate 110 in the etchant. Etching may allow the thickness and weight of the substrate 110 to be reduced.

For example, the substrate is 500 μm thick in the parent glass state. Etching of the substrate may allow the substrate 110 to have a thickness of 200 μm. When the thickness of the substrate 110 is 200 μm or less, the substrate may be easily damaged. Further, when the thickness of the substrate 110 is 200 μm or more, the thickness and weight are increased, and thus portability may be lowered.

The pixel array 120 disposed on the substrate 110 may be implemented in the form of various elements displaying an image. The pixel array is not particularly limited.

The pixel array 120 may correspond to an area where an image is displayed toward the front surface of the cover member 20, and may correspond to a display area AA.

Accordingly, the region of the cover member 20 corresponding to the pixel array 120 may be the display region AA of the cover member, and the region other than the display region AA may be the non-display region NA of the cover member.

The pixel array 120 may include a plurality of pixels disposed in a pixel region defined by signal lines on the substrate 110 and displaying an image based on signals supplied to the signal lines. The signal lines may include gate lines, data lines, and pixel driving power lines.

Each of the plurality of pixels may include a driving thin film transistor, an anode electrode electrically connected to the driving thin film transistor, a light emitting element layer formed on the anode electrode, and a cathode electrode electrically connected to the light emitting element layer in the pixel region.

The driving thin film transistor may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. The semiconductor layer driving the thin film transistor may include silicon such as a-Si, polysilicon, or low temperature polysilicon, or oxide such as IGZO (indium-gallium-zinc-oxide).

The anode electrode may be disposed in each pixel region and corresponds to an opening region defined according to a pattern shape of a pixel and may be electrically connected to the driving thin film transistor.

The light emitting element layer may include, for example, an organic light emitting element formed on the anode electrode. Each organic light emitting element may be implemented to emit the same color of light (e.g., white light) for different sub-pixels or to emit different colors of light (e.g., red, green, and blue) for different sub-pixels.

The cathode electrodes may be commonly connected to light emitting elements of light emitting element layers respectively provided in the pixel regions.

The encapsulation part 130 may be formed on the substrate 110 so as to cover the pixel array 120. The encapsulation part 130 may prevent oxygen, moisture, or foreign substances from penetrating into the light emitting element layer of the pixel array 120. For example, the encapsulation portion 130 may be formed in a multi-layer structure in which organic material layers and inorganic material layers are alternately stacked.

The display panel 100 may include a front FP and a PAD portion PAD extending from the front FP. The board 200 may be disposed under the front FP and PAD portions PAD of the display panel 100. The board 200 may include a buffer board, and may have a heat dissipation function and an enhancement function (or an impact absorption function).

When a partial region of the flexible circuit board 400 is fixed to the board 200 and disposed under the board 200, the second connection member 300 may be disposed under the board 200. The second connection member 300 may be provided to fix the other side of the flexible circuit board 400 having one side connected to the PAD portion PAD to the bottom surface of the board 200. One side of the flexible circuit board 400 may be connected to the PAD portion PAD. The flexible circuit board 400 may be bent such that the other side thereof may be fixed to the second connection member 300 and disposed under the second connection member 300. The area occupied by the flexible circuit board 400 decreases as the flexible circuit board 400 is sharply bent. Accordingly, the size of the display apparatus 10 can be reduced.

A portion of the board 200, the second connection member 300, and the flexible circuit board 400 may be sequentially disposed under the display panel 100.

The plate 200 disposed under the display panel 100 may include a porous member 210 and an adhesive member 220. The porous member 210 may be implemented as a metal foam or a porous substrate.

The display panel 100 using the etched glass substrate 110 may be easily broken even under a low level of impact due to its small thickness. In addition, when high temperature heat generated from the driver 420 is transferred to the display panel 100, the pixel array 120 disposed on the substrate 110 may be damaged, and thus the screen may not operate or may malfunction.

Accordingly, in the display device 10 according to the embodiment of the present disclosure, the board 200 may be directly attached or fixed to the bottom surface of the display panel 100, thereby improving heat dissipation and impact absorption functions without increasing the thickness of the display device due to additional components.

The adhesive member 220 having a certain thickness may be laminated on one surface of the porous member 210 such that the porous member 210 may be directly attached or fixed to the display panel 100 through the adhesive member 220.

The adhesive member 220 may include an adhesive layer having a flat shape and including an adhesive component, or an adhesive layer having a relief pattern (embossed pattern) to prevent generation of bubbles. The adhesive member 220 is not limited thereto, and may be made of various materials and may have various shapes.

Fig. 3 is a cross-sectional view illustrating an adhesive member of a plate according to an embodiment of the present disclosure. Fig. 3 shows an adhesive member 220 having a relief pattern formed thereon.

The adhesive member 220 may be disposed on the top surface of the porous member 210. The adhesive member 220 may include a relief pattern 226e as a non-uniform structure (unevenness structure) formed on a top surface of the adhesive member 220. The relief pattern 226e, which is an uneven structure of the adhesive member 220, may prevent bubbles from being generated between the porous member 210 and the display panel 100 when the porous member 210 is attached to the display panel 100.

The adhesive member 220 may be in direct contact with the display panel 100 to connect or fix the porous member 210 to the display panel 100.

The adhesive member 220 may include a base 224, and a first layer 222 and a second layer 226 disposed on two vertically opposite surfaces of the base 224, respectively.

The second layer 226 of the adhesive member 220 may have a plurality of relief patterns 226e (e.g., uneven structures) formed thereon.

At least one of the first layer 222, the second layer 226, and the relief pattern 226e may be made of a material having an adhesive composition. For example, the first layer 222, the second layer 226, and the relief pattern 226e may all be made of a material having an adhesive composition.

The base 224 may be used to maintain the shape of the adhesive member 220, and may be made of a material having constant strength and hardness to maintain the shape of the base 224. For example, the base 224 may be made of a material such as PET (polyethylene terephthalate). The present disclosure is not limited thereto.

The porous member 210 may be a porous metal structure including a conductive metal 212 and a plurality of pores 214 located inside the conductive metal 212.

Since the conductive metal 212 of the porous member 210 is made of a metal having high thermal conductivity, the porous member 210 itself can provide an excellent heat dissipation function. Because the porous member 210 has a metal structure having a plurality of holes 214 therein, the porous member 210 can provide an excellent cushioning function.

Further, since the porous member 210 includes the conductive metal 212 including the plurality of holes 214 formed therein, the total surface area thereof may be increased, so that the porous member 210 itself may provide an excellent heat dissipation function.

Accordingly, the plate 200 according to the embodiment of the present disclosure can simultaneously and effectively perform the heat dissipation function and the shock absorbing function using only the porous member 210 without a separate heat dissipation layer for the heat dissipation function and a separate buffer layer for the buffer function.

Further, since no component is added to the board, the board can have a smaller thickness, thereby reducing the overall thickness of the display device.

That is, the board 200 may be disposed directly under the display panel 100 to reduce the thickness and weight of the display device 10.

The porosity of the porous member 210 having the plurality of pores 214 may be in the range of 50% to 76%, and the size of each pore may be in the range of 20 μm to 30 μm. When the porosity is below this range, the weight of the porous member 210 becomes large, and as the number of pores decreases, the heat radiation effect may decrease. In contrast, when the porosity is higher than this range, it is difficult to maintain the desired rigidity thereof.

The porous member 210 may be formed, for example, in the following manner of manufacture. The present disclosure is not limited thereto.

The porous member 210 may be formed by sintering a metal foam precursor containing metal powder.

The metal foam precursor refers to a structure before performing a process such as sintering to form the porous member 210.

For example, the metal foam precursor may be formed using a slurry comprising a metal powder, a dispersant, and a binder.

The metal powder may be a powder mixture of one or more metal powders or an alloy of one or more metals among copper powder, nickel powder, iron powder, SUS powder, molybdenum powder, silver powder, platinum powder, gold powder, aluminum powder, chromium powder, indium powder, tin powder, magnesium powder, phosphorus powder, zinc powder, and manganese powder, but may not be limited thereto.

The dispersant may be, for example, alcohol, but may not be limited thereto.

In this case, the alcohol may use a monohydric alcohol having 1 to 20 carbon atoms (such as methanol, ethanol, propanol, pentanol, octanol, ethylene glycol, propylene glycol, pentanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, glycerol, dodecanol ester, or terpineol), a dihydric alcohol having 1 to 20 carbon atoms (such as ethylene glycol, propylene glycol, hexylene glycol, octylene glycol, or pentylene glycol), or a polyhydric alcohol, but is not limited thereto.

The type of the binder may not be particularly limited, and may be selected based on the type of the metal component or the dispersant used in preparing the slurry.

For example, an alkyl cellulose including an alkyl group having 1 to 8 carbon atoms (such as methyl cellulose or ethyl cellulose), a polyalkylene carbonate including an alkylene unit having 1 to 8 carbon atoms (such as polypropylene carbonate or polyethylene carbonate), or a polyvinyl alcohol-based binder (such as polyvinyl alcohol or polyvinyl acetate) may be used as the binder, but may not be limited thereto.

After forming the slurry containing the metal powder, the dispersant, and the binder as described above, the slurry may be injected into a mold having a predetermined shape or coated on a substrate to form a metal foam precursor.

The metal foam precursor thus formed may be formed into the porous member 210 via a sintering process.

In this case, the conditions of the sintering process are not particularly limited as long as the sintering is performed at a temperature and for a time at which the solvent contained in the slurry can be removed to a desired level. For example, the sintering may be performed at a temperature range of about 50 ℃ to 250 ℃ for a predetermined time, but the present disclosure may not be limited thereto.

The plate 200 may be formed by forming the porous member 210 and then attaching the adhesive member 220 to one surface of the porous member 210.

Alternatively, a metal foam precursor may be formed on the adhesive member 220 and may be sintered to form the porous member 210 and the plate 200. The scheme of manufacturing the board 200 is not particularly limited.

Referring to fig. 2, the flexible circuit board 400 on which the driver 420 is mounted may be bent so as to be disposed under the board 200 and fixed to the board 200 via the second connection member 300. The driver 420 of the flexible circuit board 400 may be disposed under the board 200.

For example, the second connection member 300 may be implemented as a double-sided adhesive tape having adhesive strength, by which the flexible circuit board 400 and the porous member 210 may be fixed to each other. The present disclosure is not limited thereto. The second connection member 300 may be implemented as a foam pad or a foam tape having adhesive strength, and thus may have an effect of reducing impact.

The driver 420 may be mounted on the other side of the flexible circuit board 400 disposed under the second connection member 300. The driver 420 may output an image signal to drive the pixels. The area of the display panel 100 to which the signal output from the driver 420 is applied is larger and a fast driving speed is required. Therefore, the driver 420 needs to process and apply a large amount of data in a short time. In this process, the driver 420 may generate high temperature heat.

Since the high-temperature heat generated from the driver 420 shortens the life of the driver 420 or causes a malfunction, the shielding member 430 may be provided to radiate the high-temperature heat generated from the driver 420.

The shielding member 430 may include a first insulating layer 440, a conductive layer 450, and a second insulating layer 460. The shielding member 430 may be made of a flexible material and may include an adhesive assembly on a surface of the first insulating layer 440, and thus may be attached to the driver 420 to cover the driver 420.

The first insulating layer 440 of the shielding member 430 refers to a portion in direct contact with the driver 420, and may be made of a material that is electrically insulating and does not damage the driver 420.

For example, the first insulating layer 440 may be made of flexible polyimide, flexible PET (polyethylene terephthalate), flexible polyethylene naphthalate (PEN), or the like. The present disclosure is not limited thereto.

The conductive layer 450 may be made of a metal layer including at least one of copper (Cu), silver (Ag), aluminum (Al), iron (Fe), nickel (Ni), graphite, and tungsten (W), which has excellent thermal conductivity to effectively dissipate high temperature heat generated from the driver 420.

Alternatively, the conductive layer 450 may be formed by mixing a powder of at least one of copper (Cu), silver (Ag), aluminum (Al), iron (Fe), nickel (Ni), graphite, and tungsten (W) having excellent thermal conductivity with a resin composition such as epoxy resin or acrylic acid.

The second insulating layer 460 may be made of the same material as that of the first insulating layer 440, and may be formed to protect the driver 420 from external impact and to seal the conductive layer 450.

Each of the first insulating layer 440 and the second insulating layer 460 may be made of a black material to shield external light. Driver 420 may be a type of Integrated Circuit (IC). When the driver 420 is exposed to external light, defects and malfunctions may occur therein.

Accordingly, each of the first and second insulating

layers

440 and 460 may be made of a black material such that external light incident to the driver 420 is absorbed by the first and second insulating

layers

440 and 460.

For example, each of the first insulating layer 440 and the second insulating layer 460 may include carbon black or graphite, or may be formed by coating carbon black or graphite powder. Graphite may have high thermal conductivity and may also have a heat dissipation effect. The material and manufacturing scheme of each of the first insulating layer 440 and the second insulating layer 460 are not limited thereto, and various modifications may be made.

The printed circuit board 480 may be connected to the other side end of the flexible circuit board 400. A timing controller, a power supply, and a gamma voltage generator, which first process various signal information input from an external device to generate signal voltages required for image rendering, may be mounted on the printed circuit board 480.

The driver 420 may output image signals to the data lines, the gate lines, and the power lines of the display panel 100 via the signal voltages transmitted from the printed circuit board 480.

Referring to fig. 5, a first heat dissipation layer 500 may be disposed between the board 200 and the second connection member 300. The first heat dissipation layer 500 may be attached to the bottom surface of the porous member 210 or integrally formed with the porous member 210.

The first heat dissipation layer 500 may include a material having high thermal conductivity. For example, the first heat dissipation layer 500 may include a metal having high thermal conductivity, such as copper (Cu) and aluminum (Al), or graphite, or the like. The present disclosure is not limited thereto. Further, since the first heat dissipation layer 500 is conductive, the first heat dissipation layer 500 may have a grounding function and a function of protecting the rear surface of the porous member 210 as well as a heat dissipation function.

The first heat dissipation layer 500 may be in contact with the porous member 210 to transfer heat generated from the driver 420 to the porous member 210 to improve a heat dissipation effect.

In addition, the first heat dissipation layer 500 may directly radiate high temperature heat generated from the driver 420 to reduce the temperature thereof.

The first heat dissipation layer 500 may be attached or fixed to the bottom surface of the board 200 using an adhesive or the like.

Alternatively, the first heat dissipation layer 500 may be integrally formed with the porous member 210 and disposed under the porous member 210.

For example, when the porous member 210 is formed on the top surface of the first heat dissipation layer 500, the porous member 210 and the first heat dissipation layer 500 may be integrally formed with each other. In order to integrally form the porous member 210 and the first heat dissipation layer 500 into one another, a metal foam precursor including metal powder may be disposed on the first heat dissipation layer 500, and then the metal foam precursor may be sintered to form an integrated or monolithic structure between the first heat dissipation layer 500 and the porous member 210.

Further, the adhesive member 220 may be placed on the porous member 210, and then the display panel 100 may be placed on the adhesive member 220. In this way, the display device 10 can be formed.

The flexible circuit board 400 on which the driver 420 is mounted and the second connection member 300 for connecting or fixing the flexible circuit board 400 to the first heat dissipation layer 500 may be disposed under the first heat dissipation layer 500. Accordingly, high temperature heat generated from the driver 420 and then flowing upward may be dissipated via the first heat dissipation layer 500 and the porous member 210. Thus, the temperature of the driver 420 may be reduced.

The shielding member 430 may be disposed on the bottom surface and the side surface of the driver 420. Accordingly, heat generated from the driver 420 and flowing toward the bottom and side surfaces thereof may be dissipated via the shielding member 430. The shielding member 430 may be attached and fixed to the driver 420 so as to cover the driver 420.

Fig. 6 is a cross-sectional view taken along I-I' of fig. 1A, and illustrates a display device according to still another embodiment of the present disclosure.

Referring to fig. 6, a second heat dissipation layer 600 may be disposed under the first heat dissipation layer 500, so that a heat dissipation function may be further improved. That is, the second heat dissipation layer 600 may be disposed between the first heat dissipation layer 500 and the second connection member 300. The board 200, the first heat dissipation layer 500, the second heat dissipation layer 600, the second connection member 300, and the flexible circuit board 400 on which the driver 420 is mounted may be sequentially stacked and disposed under the display panel 100.

The second heat dissipation layer 600 may be formed by applying a heat dissipation resin on the first heat dissipation layer 500. The second heat dissipation layer 600 may be implemented as a coating that improves heat dissipation.

The second heat dissipation layer 600 may be formed by mixing a metal, carbon, graphite, etc. having high thermal conductivity with a resin to form a heat dissipation resin, then applying the heat dissipation resin to the surface of the first heat dissipation layer 500, and then curing the heat dissipation resin.

For example, the heat dissipation resin may be formed by mixing at least one of silicone, epoxy, polyurethane, and acrylic with at least one of aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), magnesium (Mg), carbon, or graphite. The present disclosure is not limited thereto.

Alternatively, the second heat dissipation layer 600 may be formed by applying an adhesive layer on the bottom surface of the first heat dissipation layer 500, then spraying a powder including carbon or graphite or the like on the adhesive layer, and then sealing the powder with polyimide, PET (polyethylene terephthalate), or the like.

The second heat dissipation layer 600 may be disposed on the bottom surface of the plate 200 to improve heat dissipation performance of the porous member 210. The second heat dissipation layer 600 may be formed in a scheme of applying a heat dissipation resin to the bottom surface of the porous member 210.

When the second heat dissipation layer 600 is formed to have black, external light incident on the display panel 100 may be absorbed by the second heat dissipation layer 600. Accordingly, when the display panel 100 is not activated, a black screen may be displayed.

The optical film 140 may be disposed on the display panel 100. However, the optical film 140 prevents reflection of external light by polarizing (or circularly polarizing) the external light. Therefore, the optical film 140 may not prevent reflection of the entire incident light. Therefore, it may be difficult to display a black screen when the display panel 100 is not activated.

Accordingly, the second heat dissipation layer 600 having black may be formed under the porous member 210 of the plate 200 disposed under the display panel 100, thereby absorbing external light incident on the display panel 100. Accordingly, when the display panel 100 is not activated, a black screen may be displayed. Accordingly, the boundary around the display panel 100 having the light blocking portion 21 may not be recognized, and thus display quality may be improved.

The radiation coating 610 may be formed to the surface of the shielding member 430 by applying a heat dissipation resin to the surface of the shielding member 430 disposed under the driver 420 in the same manner as the second heat dissipation layer 600 is formed. Accordingly, the radiation coating 610 may be made of the same material as that of the second heat dissipation layer 600.

The radiation coating layer 610 may be formed on the top surface or the bottom surface of the shielding member 430. The radiation coating 610 may be formed by attaching the shielding member 430 to the driver 420 and then applying a heat dissipation resin to the bottom surface of the shielding member 430.

When the radiation coating 610 contains carbon or graphite and thus has a black color, the radiation coating 610 may shield the driver 420 from external light.

The radiation coating 610 may be formed by applying an adhesive layer on the bottom surface of the first heat dissipation layer 500, then spraying powder including carbon or graphite on the adhesive layer, and then sealing the powder with polyimide, PET (polyethylene terephthalate), or the like.

Even when the display device according to the embodiment of the present disclosure includes a thick glass substrate having poor strength, since a thin plate is disposed under the substrate and has greater strength or excellent shock absorbing function, and excellent heat dissipation function, the thickness of the display device may be reduced and strength and heat dissipation performance may be enhanced.

According to an embodiment of the present disclosure, there is provided a display apparatus including: a display panel including a front portion for displaying an image, and a pad portion extending from the front portion; and a plate in contact with the bottom surface of the front portion, wherein the plate includes a porous member and an adhesive member on a top surface of the porous member.

In some embodiments of the display device, the display panel further includes a substrate and a pixel array disposed on a front surface of the substrate, wherein the substrate includes a glass substrate.

In some embodiments of the display device, the display device further includes a first heat dissipation layer in contact with the bottom surface of the plate.

In some embodiments of the display device, the display device further includes a second heat dissipation layer disposed on a bottom surface of the first heat dissipation layer.

In some embodiments of the display device, the display device further includes a second heat dissipation layer disposed on a bottom surface of the board.

In some embodiments of the display device, the second heat dissipation layer has a black color.

In some embodiments of the display device, the display device further includes a flexible circuit board connected to the pad portion, wherein the driver is mounted on the flexible circuit board, wherein the flexible circuit board is bent such that the driver is disposed under the board.

In some embodiments of the display device, the display device further comprises a shielding member covering the driver, wherein the radiation coating is disposed on a surface of the shielding member.

In some embodiments of the display device, the radiation coating is made of the same material as the material of the second heat sink layer.

According to an embodiment of the present disclosure, there is provided a method for manufacturing a display device, the method including: providing a first heat dissipation layer; placing a metal foam precursor comprising a metal powder on a top surface of a first heat sink layer; sintering the metal foam precursor to form a porous member adhered to the first heat dissipation layer; placing an adhesive layer on the porous member; and placing a display panel on the adhesive layer.

In some embodiments of the method, the method further comprises applying a heat dissipating resin to the bottom surface of the first heat dissipating layer, and curing the heat dissipating resin such that a second heat dissipating layer is formed on the bottom surface of the first heat dissipating layer.

In some embodiments of the method, the heat dissipating resin comprises at least one of silicone, epoxy, polyurethane, or acrylic, and a mixture of at least one of aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), magnesium (Mg), carbon, or graphite.

The scope of the present disclosure should be construed in accordance with the scope of the claims, and all technical ideas within the scope equivalent thereto should be construed to be included in the scope of the present disclosure. Although embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments. The present disclosure may be implemented in various modifications within a scope not departing from the technical idea of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical ideas of the present disclosure, but describe the present disclosure. The scope of the technical ideas of the present disclosure is not limited by the embodiments. Accordingly, it should be understood that the above-described embodiments are illustrative in all respects and not restrictive. The protection scope of the present disclosure should be interpreted according to the claims, and all technical ideas within the scope of the present disclosure should be interpreted as being included in the scope of the present disclosure.

Claims

1. A display device, the display device comprising:

a display panel including a front portion for displaying an image, and a pad portion extending from the front portion; and

a plate in contact with a bottom surface of the front portion,

wherein the plate comprises a porous member and an adhesive member on a top surface of the porous member.

2. The display device according to claim 1, wherein the display panel further comprises a substrate and a pixel array provided on a front surface of the substrate, and

wherein the substrate comprises a glass substrate.

3. The display device of claim 1, further comprising a first heat sink layer in contact with a bottom surface of the plate.

4. The display device of claim 3, further comprising a second heat sink layer disposed on a bottom surface of the first heat sink layer.

5. The display device of claim 1, further comprising a second heat sink layer disposed on a bottom surface of the plate.

6. The display device according to claim 4 or 5, wherein the second heat dissipation layer has black.

7. The display device according to claim 1, further comprising a flexible circuit board connected to the pad portion, wherein a driver is mounted on the flexible circuit board,

Wherein the flexible circuit board is bent such that the driver is disposed under the board.

8. The display device according to claim 7, further comprising a connection structure that is provided between the flexible circuit board and the porous member and connects the flexible circuit board and the porous member to each other.

9. The display device of claim 7, further comprising a shielding member covering the driver,

wherein a radiation coating is provided on a surface of the shielding member.

10. The display device according to claim 9, wherein the shielding member includes a first insulating layer, a conductive layer, and a second insulating layer, and

wherein each of the first insulating layer and the second insulating layer is made of a black material to shield external light from being incident to the driver.

11. The display device of claim 9, wherein the radiant coating is made of the same material as a second heat sink layer disposed below the plate.

12. The display device of claim 1, wherein the adhesive member includes a relief pattern as a non-uniform structure formed on a top surface of the adhesive member.

13. The display device of claim 1, wherein the porous member comprises a conductive metal and a plurality of pores within the conductive metal.

14. The display device according to claim 13, wherein a porosity of the porous member is in a range of 50% to 76%, and a size of each of the plurality of pores is in a range of 20 μm to 30 μm.

15. A method for manufacturing a display device, the method comprising the steps of:

providing a first heat dissipation layer;

placing a metal foam precursor comprising a metal powder on a top surface of the first heat sink layer;

sintering the metal foam precursor to form a porous member adhered to the first heat dissipation layer;

placing an adhesive layer on the porous member; and

and placing a display panel on the adhesive layer.

16. The method of claim 15, further comprising the step of: a heat dissipation resin is applied to a bottom surface of the first heat dissipation layer, and the heat dissipation resin is cured such that a second heat dissipation layer is formed on the bottom surface of the first heat dissipation layer.

17. The method of claim 16, wherein the heat dissipating resin comprises a mixture of at least one of silicone, epoxy, polyurethane, or acrylic and at least one of aluminum Al, molybdenum Mo, chrome Cr, titanium Ti, nickel Ni, neodymium Nd, copper Cu, silver Ag, magnesium Mg, carbon, or graphite.