CN116262328A - Double-sided grinding device - Google Patents

Double-sided grinding device Download PDF

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Publication number
CN116262328A
CN116262328A CN202211594491.8A CN202211594491A CN116262328A CN 116262328 A CN116262328 A CN 116262328A CN 202211594491 A CN202211594491 A CN 202211594491A CN 116262328 A CN116262328 A CN 116262328A
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CN
China
Prior art keywords
flange
double
upper platform
annular groove
platen
Prior art date
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Pending
Application number
CN202211594491.8A
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Chinese (zh)
Inventor
森田优
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Sumco Corp
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Sumco Corp
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Publication of CN116262328A publication Critical patent/CN116262328A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Provided is a double-sided polishing device (1), wherein the double-sided polishing device (1) is provided with an upper platen (2), a lower platen (3), a rotation shaft (4) for rotating the upper platen (2), and a shape deformation mechanism (9) for deforming the upper platen (2), and the shape deformation mechanism (9) is provided with an upper platen flange (10) which is connected to the lower end of the rotation shaft (4) and is fixed to the upper surface of the upper platen (2), and a heat deformation mechanism (20) for deforming the upper platen flange (10) by heating.

Description

Double-sided grinding device
Technical Field
The present invention relates to a double-sided polishing apparatus for simultaneously polishing both sides of a wafer.
Background
In general, in a process for processing a disk-shaped wafer such as a semiconductor wafer, a polishing liquid (slurry) is supplied to the upper platen and the lower platen, which are bonded with polishing pads, while sandwiching the wafer therebetween, to polish both surfaces of the wafer.
In a double-sided polishing apparatus for performing double-sided polishing, a technique is known in which the shape, angle, and the like of a platen are changed during polishing work so that an upper platen and a lower platen are parallel to each other. Thus, the surface pressure distribution of the upper and lower stages is uniform, and the flatness of the wafer can be improved.
In document 1 (japanese patent application laid-open No. 2004-314192), as a means for changing the shape of the platen, a double-sided polishing apparatus is disclosed which has a shape control means for deforming the platen diameter on the bottom side of the platen opposite to the surface to which the polishing pad is attached.
However, the mechanism described in document 1 is a mechanism that deforms a part of the platen by expanding and contracting the platen by heat, and therefore, there is a problem that the heat affects polishing conditions such as polishing heat, and thus, ideal polishing cannot be performed. Although control considering this effect can also be performed, very complicated control is required.
Disclosure of Invention
The present invention aims to provide a double-sided polishing apparatus capable of deforming a platen without affecting polishing conditions by heat, and making the surface pressure distribution between an upper platen and a lower platen nearly uniform.
The double-sided polishing apparatus of the present invention is characterized by comprising an upper platen, a lower platen, a rotation shaft for rotating the upper platen, and a shape deformation mechanism for deforming the upper platen, wherein the shape deformation mechanism has an upper platen flange connected to a lower end of the rotation shaft and fixed to an upper surface of the upper platen, and a heat deformation mechanism for deforming the upper platen flange by heating the upper platen flange.
In the double-sided polishing apparatus, preferably, the thermal deformation mechanism includes an annular groove formed over substantially the entire circumference of the upper surface of the upper platen flange around the axis of the rotary shaft as a central axis, and a cover that seals the annular groove and is fixed to the upper platen flange, and a temperature adjustment water passage is formed between the cover and the annular groove, and the annular groove is formed at a position satisfying the following expression when the diameter of the upper platen is D1 and the central diameter of the annular groove is D2.
1/7 ＜ D2/D1 ＜ 1/3。
In the double-sided polishing apparatus, the annular groove preferably travels in a curved manner along the circumferential direction.
In the double-sided polishing apparatus, the annular groove is preferably divided.
In the double-sided polishing apparatus, preferably, a coefficient of thermal expansion of a metal forming the cover is different from a coefficient of thermal expansion of a metal forming the upper platen flange.
In the double-sided polishing apparatus, preferably, the upper platen includes an upper platen main body and an upper platen fixing bracket, the upper platen fixing bracket connects the upper platen main body and the upper platen flange, a hole is formed in a central portion, a space to be blocked is formed in the upper platen flange, and the upper platen flange and the upper platen fixing bracket include a plurality of air circulation holes for filling air into the space.
In the double-sided polishing apparatus, it is preferable that the thermal deformation mechanism has a heater, the heater is disposed over substantially the entire circumference of the upper surface and the lower surface of the upper platen flange, the circumference being centered on the axis of the rotation shaft, and the heater is formed at a position satisfying the following expression when the diameter of the upper platen is D1 and the center diameter of the heater is D3.
1/7 ＜ D3/D1 ＜ 1/3。
In the double-sided polishing apparatus, it is preferable that the upper platen has an upper platen main body and an upper platen fixing bracket, the upper platen fixing bracket connects the upper platen main body and the upper platen flange, and the double-sided polishing apparatus has a plurality of through holes formed radially outward of the heater on the upper platen flange.
According to the present invention, the platen can be deformed without affecting the grinding conditions by heat, and the surface pressure distribution between the upper platen and the lower platen can be made nearly uniform.
Drawings
Fig. 1 is an exploded perspective view of a first embodiment of a double-sided polishing apparatus of the present invention.
Fig. 2 is a cross-sectional view of a first embodiment of the double-sided lapping apparatus of the present invention.
Fig. 3 is a plan view of the upper platen flange of the double-sided polishing apparatus of the present invention.
Fig. 4 is a detailed cross-sectional view of the shape deformation mechanism of the double-sided polishing apparatus of the present invention.
Fig. 5 is a diagram illustrating the action of the shape deforming mechanism, and is a diagram illustrating the case where the outer peripheral side of the upper stage is deformed so as to descend downward.
Fig. 6 is a diagram illustrating the action of the shape deforming mechanism, and is a diagram illustrating a case where the outer peripheral side of the upper stage is deformed so as to rise upward.
Fig. 7 is an exploded perspective view of a second embodiment of the double-sided lapping device of the present invention.
Fig. 8 is an exploded perspective view of a third embodiment of the double-sided lapping device of the present invention.
Fig. 9 is a graph showing a relationship between the temperature of hot water and the deformation amount of the upper plate.
Fig. 10 is a diagram illustrating the measurement position of the deformation amount of the upper stage.
Detailed Description
[ first embodiment ]
Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings.
The double-sided polishing apparatus is an apparatus for simultaneously polishing both sides of a wafer to improve the flatness of the wafer. As shown in fig. 1 and 2, the double-sided polishing apparatus 1 includes an upper platen 2 and a lower platen 3 disposed vertically opposite to each other, a rotation shaft 4 for rotating the upper platen 2, and a rotation shaft 5 for rotating the lower platen 3. Polishing pads 23 and 33 are provided on the lower surface of the upper platen 2 and the upper surface of the lower platen 3.
In the following description, the circumferential direction means the circumferential direction about the axis a of the rotary shafts 4 and 5, and the radial direction means the radial direction about the axis a of the rotary shafts 4 and 5.
A plurality of carrier plates 6 for holding the wafer W are arranged between the upper stage 2 and the lower stage 3. The carrier 6 has a holding hole 61 for holding the wafer W. The carrier plate 6 is a gear formed with an outer peripheral gear (not shown), and performs planetary rotation in mesh with the sun gear 7 and the internal gear 8. In fig. 2, the carrier plate 6, the sun gear 7, the internal gear 8, and the like are not shown.
The upper stage 2 and the lower stage 3 can clamp the wafer W held in the holding hole 61 with a desired load. The rotation shafts 4 and 5 rotate the upper stage 2 and the lower stage 3 in opposite directions.
The double-sided polishing apparatus 1 performs chemical mechanical polishing simultaneously on the front and back surfaces of the wafer W by pressurizing and dropping slurry (not shown) by the polishing pads 23 and 33 while planetary-rotating the sandwiched carrier plate 6.
The upper deck 2 of the present embodiment includes an upper deck main body 21 and an upper deck fixing bracket 22 connected to the upper surface of the upper deck main body 21.
The rotation shaft 4 and the upper platform 2 are connected via the flange 10 for the upper platform. Specifically, an upper platform flange 10 is connected to the lower end of the rotation shaft 4, and the upper platform flange 10 is connected to an upper platform fixing bracket 22 of the upper platform 2.
The upper platform flange 10 is formed of metal and has a circular plate shape.
The upper platen fixing bracket 22 has a disk shape with a circular hole 22a formed in the center. The hole 22a is formed to be a size to be closed by the flange 10 for the upper stage. A space V is formed inside the hole 22a and below the upper stage flange 10. The hole 22a is not limited to a circular shape, and may be a polygonal shape, for example.
The upper platform flange 10 and the upper platform fixing bracket 22 are fixed by a plurality of fixing bolts B1. The upper platform fixing bracket 22 and the upper platform main body 21 are fixed by a plurality of fixing bolts B2.
The upper platen body 21 and the lower platen 3 have thermostatic chambers 24 and 34 formed continuously in the circumferential direction. The thermostatic chambers 24 and 34 are supplied with thermostatic water for the stage to constantly maintain the stage temperature.
The double-sided polishing apparatus 1 includes a shape deforming mechanism 9 for deforming the shape of the upper platen 2 so that the lower surface of the upper platen 2 and the upper surface of the lower platen 3 are parallel. The shape deforming mechanism 9 includes an upper stage flange 10 and a heat deforming mechanism 20 for deforming the upper stage flange 10 by heating.
The thermal deformation mechanism 20 of the present embodiment includes an annular groove 11 formed in the upper stage flange 10, and a cover 16 that closes the annular groove 11 and is fixed to the upper stage flange 10, and deforms the upper stage flange 10 by heat, thereby deforming the upper stage 2.
As shown in fig. 3, the annular groove 11 is formed over substantially the entire circumference in the circumferential direction. An annular groove 11 is formed in the upper surface of the upper stage flange 10.
As shown in fig. 4, the annular groove 11 of the shape deforming mechanism 9 is formed at a position close to the rotation shaft 4. Specifically, when the diameter of the upper stage 2 is D1 (see fig. 2) and the center diameter of the annular groove 11 is D2 (see fig. 2), the position satisfying the following expression (1) is formed.
1/7 ＜ D2/D1 ＜ 1/3・・・ (1)。
The annular groove 11 is formed to be substantially circular as viewed in the axial direction. The annular groove 11 has a rectangular cross-sectional shape, and has a bottom surface 11a and a pair of side surfaces 11b and 11c. As shown in fig. 3, a plurality of first protruding walls 12 are formed on the side surface 11b of the inner side of the annular groove 11. The plurality of protruding walls 12 are formed at equal intervals in the circumferential direction.
Similarly, a plurality of second protruding walls 13 are formed on the outer side surface 11c of the annular groove 11. The plurality of protruding walls 13 are formed at equal intervals in the circumferential direction.
The first protruding walls 12 and the second protruding walls 13 are arranged in an alternating manner in the circumferential direction.
The annular groove 11 of the present embodiment is divided into a first annular groove 111 and a second annular groove 112. The first annular groove 111 and the second annular groove 112 are formed to have substantially the same circumferential length. The annular groove 11 is not necessarily divided, and may be formed continuously over the entire circumference. The number of the annular grooves 11 may be three or more, instead of two.
The upper platform flange 10 and the upper platform fixing bracket 22 have a plurality of air circulation holes 14 and 15 for filling the space V with air.
At the upper platform flange 10, a plurality of first air circulation holes 14 are formed so as to communicate the upper surface of the upper platform flange 10 with the space V through the holes in the axial direction. A plurality of first air circulation holes 14 are formed radially outward of the annular groove 11. The plurality of first air circulation holes 14 are preferably formed at equal intervals in the circumferential direction.
As shown in fig. 2, a plurality of second air circulation holes 15 penetrating in the radial direction to communicate the side surface of the upper stage fixing bracket 22 with the space V are formed at the upper stage fixing bracket 22. The plurality of second air circulation holes 15 are preferably formed at equal intervals in the circumferential direction.
The cover 16 is formed in an annular shape when viewed in the axial direction so as to close the annular groove 11.
The cover 16 is fixed to the upper platform flange 10 by means of the fixing bolts B3. The annular groove 11 is closed by the cover 16, and thereby a water passage 17 for temperature adjustment is formed between the annular groove 11 and the cover 16. The annular groove 11 of the present embodiment is divided into two parts, so the temperature adjustment water passage 17 is divided into a first temperature adjustment water passage 171 and a second temperature adjustment water passage 172.
The double-sided polishing apparatus 1 includes a water supply device (not shown) that supplies constant-temperature water to the temperature adjustment water channel 17 via a water channel inlet (not shown). The water supply device has a function of heating and cooling supplied water by a heat source such as a boiler or a cooler. The water supplied from the water supply device is discharged through a water channel outlet (not shown). By the water supply device, water is supplied to the temperature adjustment water channel 17, and thereby water flows from one end to the other end of the temperature adjustment water channel 17.
The plurality of protruding walls 12, 13 are alternately arranged at the annular groove 11 constituting the temperature adjustment water passage 17, whereby the temperature adjustment water passage 17 has a shape that is curved to travel in the circumferential direction.
The lid 16 and the upper platform flange 10 are formed of metals having different coefficients of thermal expansion. As the metal constituting the cover 16, for example, an alloy having a small thermal expansion coefficient such as a watt can be used. As the metal constituting the upper stage flange 10, for example, stainless steel can be used.
The coefficient of thermal expansion of the metal forming the lid 16 of this embodiment is smaller than that of the metal forming the flange 10 for the upper stage. The coefficient of thermal expansion of the metal forming the lid 16 is preferably 1/20 to 1/3 of the coefficient of thermal expansion of the metal forming the flange 10 for the upper stage.
Next, the operation of the shape deforming mechanism 9 will be described.
In the double-sided polishing apparatus 1 of the present invention, the constant-temperature water flows to the temperature adjustment water channel 17 of the shape deforming mechanism 9, and thereby the upper platen flange 10 is heated to deform it.
Here, the heat quantity of the water supplied to the volume of the flange 10 for upper stage is small. Thus, when the constant temperature water flows to the temperature adjustment water passage 17, the temperature around the temperature adjustment water passage 17 on the upper surface of the upper platen flange 10 changes, and the upper platen flange 10 other than the periphery of the temperature adjustment water passage 17 is maintained at a predetermined reference temperature by the air circulation holes 14 and 15 formed in the upper platen flange 10 and the upper platen fixing bracket 22 and the space V. The upper platen flange 10 is deformed due to such a temperature distribution generated at the upper platen flange 10. The deformation can be adjusted by changing the thermal expansion coefficient of the cover 16. The deformation can also be adjusted by changing the thickness of the cover 16 and the upper stage flange 10 and changing the rigidity in terms of construction.
For example, when constant-temperature water having a temperature higher than a predetermined reference temperature (for example, reference temperature +5℃ C.) is introduced into the temperature adjustment water passage 17, the periphery of the temperature adjustment water passage 17 on the upper surface of the upper stage flange 10 expands at a position other than the periphery of the temperature adjustment water passage 17, and thereby, as shown in FIG. 5, the upper stage flange 10 is deformed so that the outer peripheral side thereof is lowered downward.
Since the upper deck 2 of the present embodiment is composed of the upper deck main body 21 and the upper deck fixing bracket 22, the upper deck fixing bracket 22 connected to the upper deck flange 10 is deformed by the deformation of the upper deck flange 10, and accordingly, the upper deck main body 21 can be deformed so as to descend downward from the outer peripheral side.
On the other hand, when constant-temperature water having a temperature lower than the reference temperature (for example, the reference temperature of-5 ℃) is introduced into the temperature adjustment water passage 17, the periphery of the temperature adjustment water passage 17 of the upper stage flange 10 is contracted than the periphery of the temperature adjustment water passage 17, and thereby the upper stage flange 10 is deformed so as to rise upward on the outer peripheral side as shown in fig. 6.
The deformation of the upper platform flange 10 deforms the upper platform fixing bracket 22 connected to the upper platform flange 10, and accordingly, the upper platform main body 21 can be deformed so as to rise upward on the outer peripheral side.
In the present embodiment, since the cover 16 uses a shoe having a small thermal expansion coefficient, the deformation is reduced, but the size of the deformation can be adjusted by appropriately selecting a metal having an appropriate thermal expansion coefficient as the metal for the cover 16.
Next, a method of applying the double-sided polishing apparatus 1 of the present embodiment will be described.
The platen of the double-sided polishing apparatus 1 is manufactured such that the structural parts of the platen respectively meet a certain dimensional tolerance, but individual differences occur due to the limitation of machining accuracy and tolerance accumulation of the structural parts, and differences occur in the surface pressure distribution between the apparatuses.
In the method of applying the double-sided polishing apparatus, after grasping the surface pressure distribution between the upper platen 2 and the lower platen 3 at the time of introducing the double-sided polishing apparatus 1 before polishing the wafer by the double-sided polishing apparatus 1, the upper platen 2 is deformed so that the surface pressure distribution becomes uniform (the lower surface of the upper platen 2 and the upper surface of the lower platen 3 become parallel).
The method for applying the double-sided polishing apparatus according to the present embodiment includes a surface pressure distribution measurement step, a temperature setting step, and a confirmation adjustment step.
The surface pressure distribution measuring step is a step of measuring the surface pressure distribution between the upper platen 2 and the lower platen 3 by the surface pressure distribution measuring device when the double-sided polishing apparatus 1 is introduced.
The surface pressure distribution measuring device has a sensor sheet in which electrodes are disposed in a grid pattern, and measures the surface pressure distribution from a change in resistance value based on pressure. As the surface pressure distribution measuring apparatus, for example, a large area pressure distribution measuring system BIG-MAT (manufactured by Neida Co., ltd.) can be used.
In the surface pressure distribution measuring step, the polishing pads 23 and 33 are mounted on the upper platen 2 and the lower platen 3, and the plurality of sensor pieces are arranged at equal intervals in the circumferential direction, so that the upper platen 2 is lowered to a predetermined load, and the surface pressure distribution is measured.
The temperature setting step is as follows: the temperature of the constant-temperature water flowing into the temperature adjustment water channel 17 is set so as to have a desired surface pressure distribution in which the surface pressure distribution of the introduced double-sided polishing apparatus 1 is constant. The temperature of the constant temperature water was set based on the results of the previous test. For example, by a prior test, the deformation amount of the upper stage 2 with respect to the temperature of the constant temperature water and the deformation amount of the upper stage 2 with respect to the temperature change of the constant temperature water by 1 ℃ are grasped, and the temperature of the constant temperature water is set based on the result.
For example, when it is determined that the outer peripheral side of the upper platen 2 is lowered downward by the surface pressure distribution measurement step, the constant temperature water at the temperature is set to a temperature at which the outer peripheral side of the upper platen 2 is lowered downward.
In the water passage step, the constant-temperature water having the temperature set in the temperature setting step is passed to the temperature adjustment water passage 17.
In the confirmation adjustment step, the surface pressure distribution is confirmed by the surface pressure distribution measuring device in a state where the shape change of the upper stage 2 is stabilized. If the surface pressure distribution is uneven, the temperature of the hot water is adjusted so that the lower surface of the upper platform 2 is parallel to the upper surface of the lower platform 3. By making the lower surface of the upper stage 2 and the upper surface of the lower stage 3 parallel, the surface pressure distribution is nearly uniform.
After the surface pressure distribution becomes a desired surface pressure distribution which is constant in the double-sided polishing apparatus 1, the confirmation adjustment step is ended. In addition, even when the adjustment cannot be performed only by adjusting the temperature of the constant-temperature water, the thickness (rigidity) of the cover 16 and the thickness of the upper-stage flange 10 can be changed, but it is preferable to change the thickness of the cover 16, which is simple in shape and inexpensive.
According to the above embodiment, the shape of the upper stage 2 is deformed by the shape deforming mechanism 9, and the lower surface of the upper stage 2 and the upper surface of the lower stage 3 are thereby brought into parallel proximity, whereby the surface pressure distribution can be made nearly uniform.
Further, by providing a structure in which the upper platform 2 is deformed by deforming the upper platform flange 10 by heat without deforming a part of the upper platform 2 by heat, the influence of heat becomes difficult to affect the upper platform 2. Thus, the surface pressure distribution between the upper platen 2 and the lower platen 3 can be made nearly uniform without affecting the grinding conditions.
Further, since the upper stage 2 is not directly deformed, the deformation by a small heat source can be performed, and the deformation speed following the temperature change can be increased.
The thermal deformation mechanism 20 includes an annular groove 11 formed in the upper flange 10, and a cover 16 closing the annular groove 11, and the upper flange 10 and the cover 16 are made of metals having different coefficients of thermal expansion, whereby the deformation amount of the upper flange 10 can be adjusted. For example, the size of the deformation can be reduced as compared with the case where the metal single body is expanded and contracted by heat.
Further, the annular groove 11 of the thermal deformation mechanism 20 is formed at a position closer to the rotation shaft 4, and thus the change in the outer circumferential position of the upper stage 2 can be increased with respect to the minute deformation of the upper stage flange 10.
Further, since the protruding walls 12 and 13 are formed in the annular groove 11, and the temperature adjustment water channel 17 travels in a curved manner, heat of the hot water can be more transferred to the flange 10 for the platform.
Further, as the length of the temperature adjustment water passage 17 becomes longer and approaches the water passage outlet, the temperature of the constant temperature water decreases, but the temperature adjustment water passage 17 of the present embodiment is divided into two, and thus the temperature difference of the constant temperature water in the circumferential direction can be made smaller.
Further, by forming the air circulation holes 14 and 15 in the upper platen flange 10 and the upper platen fixing bracket 22, air circulates through the air circulation holes 14 and 15 in response to the rotational movement of the upper platen 2, and the periphery of the contact portion between the upper platen flange 10 and the upper platen fixing bracket 22 can be cooled, so that heat transfer from the thermal deformation mechanism 20 to the upper platen main body 21 can be prevented. Further, the lower surface temperature of the upper platen flange 10 is also reduced.
Further, the upper platen 2 is constituted by the upper platen body 21 and the upper platen fixing bracket 22 in which the space V is formed, and thereby the heat transfer from the platen surface side and the heat transfer from the constant temperature water in the temperature adjustment water passage 17 can be cut off. This can suppress the influence of the polishing heat on the temperature adjustment water passage 17 and the change in the deformation amount. Further, the heat transfer of the constant temperature water to the temperature adjustment water passage 17 to the platen surface can be suppressed, and the polishing condition can be prevented from changing.
In the above embodiment, the protruding walls 12 and 13 are disposed in the annular groove 11, but if the temperature distribution difference due to the constant temperature water acts sufficiently, the protruding walls 12 and 13 do not need to be provided.
[ second embodiment ]
Next, a double-sided polishing apparatus 1B according to a second embodiment of the present invention will be described.
The thermal deformation mechanism 20 of the double-sided polishing apparatus 1 according to each of the above embodiments deforms the upper platen flange 10 by the difference in temperature distribution and the difference in thermal deformation amount, but is not limited thereto.
As shown in fig. 7, the upper platen flange 10B of the double-sided polishing apparatus 1B of the present embodiment includes a temperature adjustment tube 30 attached to the upper surface of the upper platen flange 10B as a heat deformation mechanism 20B (shape deformation mechanism 9B). The temperature adjustment pipe 30 is disposed on the upper surface of the upper platen flange 10B in a spiral or concentric manner.
The thermal deformation mechanism 20B of the present embodiment can deform the upper stage flange 10B by supplying hot water to the temperature adjustment pipe 30, thereby deforming the upper stage 2.
In the first and second embodiments, the protruding walls 12 and 13 are disposed in the annular groove 11, but if the temperature distribution difference due to the constant temperature water is sufficiently applied, the protruding walls 12 and 13 do not need to be provided.
[ third embodiment ]
Next, a double-sided polishing apparatus 1C according to a third embodiment of the present invention will be described.
As shown in fig. 8, the upper platen flange 10C of the double-sided polishing apparatus 1C of the present embodiment has an upper surface heater 31A mounted on the upper surface of the upper platen flange 10C and a lower surface heater 31B mounted on the lower surface of the upper platen flange 10C as the heat deformation mechanism 20C (shape deformation mechanism 9C).
The heaters 31A and 31B are heating devices for heating the vicinity of the center of the upper platen flange 10C, and are, for example, film-shaped heaters that generate heat by the resistance of metal. The heaters 31A and 31B are disposed over substantially the entire circumference in the circumferential direction.
The heaters 31A and 31B are formed at positions close to the rotation shaft 4. Specifically, assuming that the diameter of the upper stage 2 is D1 and the center diameters of the heaters 31A and 31B are D3 (see fig. 8), the heaters 31A and 31B are formed at positions satisfying the following expression (2).
1/7 ＜ D3/D1 ＜ 1/3・・・ (2)。
The upper platen flange 10C and the upper platen fixing bracket 22 of the double-sided polishing apparatus 1C of the present embodiment have a plurality of air circulation holes 14, 15, similarly to the double-sided polishing apparatus of the first and second embodiments.
A plurality of first air circulation holes 14 (through holes) are formed in the upper stage flange 10C so as to communicate the upper surface of the upper stage flange 10C with the space V in the axial direction. A plurality of first air circulation holes 14 are formed radially outward of the heaters 31A, 31B. The plurality of first air circulation holes 14 are preferably formed at equal intervals in the circumferential direction.
The heat deformation mechanism 20C of the present embodiment can deform the upper stage flange 10C by supplying power to the heaters 31A and 31B, thereby deforming the upper stage 2.
For example, when only the upper surface heater 31A is energized, the upper surface of the upper stage flange 10C expands more than the lower surface, and thereby the upper stage flange 10C deforms so as to descend downward from the outer peripheral side. The deformation of the upper platform flange 10C deforms the upper platform fixing bracket 22 connected to the upper platform flange 10C, and accordingly, the upper platform main body 21 can be deformed so as to be lowered downward from the outer peripheral side.
When the current is supplied only to the lower surface heater 31B, the lower surface of the upper platen flange 10C expands more than the upper surface, and the upper platen flange 10C is deformed so as to rise upward on the outer peripheral side. The deformation of the upper stage flange 10C deforms the upper stage fixing bracket 22 connected to the upper stage flange 10C, and accordingly, the upper stage main body 21 can be deformed so that the outer peripheral side rises upward.
Further, by fine-tuning the temperature of the heaters 31A and 31B, the deformation amount can be adjusted.
According to the above embodiment, since the liquid is not used for temperature adjustment, a waterproof structure or the like is not required, and structural simplification can be achieved.
Further, by forming the air circulation holes 14 and 15 in the upper stage flange 10C and the upper stage fixing bracket 22, air circulates through the air circulation holes 14 and 15 in response to the rotational movement of the upper stage 2, the periphery of the contact portion between the upper stage flange 10C and the upper stage fixing bracket 22 can be cooled, and heat transfer from the heaters 31A and 31B to the upper stage main body 21 can be prevented.
This can suppress the change in polishing conditions due to heat transfer from the heaters 31A and 31B to the platen surface.
In the double-sided polishing apparatus 1C according to the third embodiment, the space V formed below the upper platen flange 10 may be omitted, and in this case, the air circulation hole 15 may be omitted.
In the above embodiments, the stages 2 and 3 have the thermostats 24 and 34, but the thermostats 24 and 34 may be omitted as long as the water for the stages is not necessary.
Examples
The following description will be made with respect to an example in which the function of the shape deforming mechanism 9 of the double-sided polishing apparatus 1 of the present invention is confirmed.
Example 1 >
In example 1, in order to confirm the action of the shape deformation mechanism 9 of the double-sided polishing apparatus 1, constant temperature water was introduced into the temperature adjustment water channel 17 of the shape deformation mechanism 9, and the deformation amount of the upper platen 2 was measured.
The deformation amount of the upper platen 2 was measured at equal intervals in the diameter direction by providing a straightness shape measuring machine (manufactured by hitachi corporation) directly below the upper platen 2 with the upper platen 2 and the lower platen 3 attached to the double-sided polishing apparatus 1.
Fig. 9 is a graph showing a relationship between the temperature of hot water and the deformation amount of the upper stage 2. The horizontal axis of the graph shown in fig. 9 represents the measurement position in the diameter direction of the land, and the vertical axis represents the deformation amount. The measurement positions are set on a straight line L indicated by a one-dot chain line in fig. 10, and 1000 points are measured between the outer peripheral points P1 and P2 of the upper stage 2. The deformation amount is plotted at 100-point intervals in the graph of fig. 9. The deformation amount is a distance in the up-down direction from a horizontal plane passing through the lower end of the outermost periphery of the upper deck 2 to the bottom surface of the upper deck 2.
As is clear from the graph of fig. 9, when constant temperature water at a predetermined reference temperature is supplied to the temperature adjustment water channel 17 of the shape deformation mechanism 9, the maximum deformation amount measured near the center of the upper stage 2 is +23 μm.
When constant temperature water having a predetermined reference temperature of-5 ℃ is introduced into the water channel 17 for temperature adjustment of the shape deformation mechanism 9, the maximum deformation amount measured near the center of the upper stage 2 is-68 μm.
On the other hand, when constant temperature water having a predetermined reference temperature of +5℃ is supplied to the temperature adjustment water channel 17 of the shape deformation mechanism 9, the maximum deformation amount measured near the center of the upper stage 2 is +111 μm.
That is, the deformation amplitude was 179 μm/10℃and the deformation amount per 1℃was 17.9. Mu.m. The deformation amount is deformation that is approximately proportional to temperature.
Example 2 >
In example 2, the surface pressure distribution between the upper platen 2 and the lower platen 3 was measured while the upper platen 2 was deformed. The above-described surface pressure distribution measuring device was used for the measurement. The measurement conditions were 3 conditions shown in fig. 9.
The measurement result showed that the constant temperature water having a reference temperature of-5 ℃ was a high surface pressure distribution on the inner peripheral side of the platen, and the constant temperature water having a reference temperature of +5 ℃ was a high surface pressure distribution on the outer peripheral side of the platen, which matches the result assumed from the measurement of the deformation amount.

Claims (8)

1. A double-sided grinding device is characterized in that,
comprises an upper platform, a lower platform, a rotation shaft for rotating the upper platform, and a shape deforming mechanism for deforming the upper platform,
the shape deforming mechanism includes an upper stage flange connected to a lower end of the rotary shaft and fixed to an upper surface of the upper stage, and a heat deforming mechanism for deforming the upper stage flange by heating the upper stage flange.
2. The double-sided lapping device of claim 1,
the aforementioned heat deformation mechanism has an annular groove and a cover,
the annular groove is formed on the upper surface of the upper flange over substantially the entire circumference of the circumference around the axis of the rotary shaft,
the cover seals the annular groove and is fixed to the flange for the upper platform, a water path for temperature adjustment is formed between the cover and the annular groove,
the annular groove is formed at a position satisfying the following expression when the diameter of the upper stage is D1 and the center diameter of the annular groove is D2,
1/7 ＜ D2/D1 ＜ 1/3。
3. the double-sided lapping device of claim 2,
the annular groove is curved in the circumferential direction.
4. The double-sided lapping device of claim 2,
the annular groove is divided.
5. The double-sided lapping device of claim 2,
the thermal expansion coefficient of the metal forming the cover is different from that of the metal forming the flange for the upper stage.
6. The double-sided lapping device as claimed in any one of claims 1 to 5, wherein,
the upper platform has an upper platform main body and an upper platform fixing bracket, the upper platform fixing bracket connects the upper platform main body and the upper platform by a flange, a hole is formed at the central part, a blocked space is formed at the flange for the upper platform,
the flange for upper platform and the upper platform fixing bracket have a plurality of air circulation holes for filling the space with air.
7. The double-sided lapping device of claim 1,
the thermal deformation mechanism has a heater,
the heater is disposed on an upper surface and a lower surface of the upper stage flange over substantially the entire circumference of the upper stage flange around the axis of the rotary shaft,
the heater is formed at a position satisfying the following expression when the diameter of the upper stage is D1 and the center diameter of the heater is D3,
1/7 ＜ D3/D1 ＜ 1/3。
8. the double-sided lapping device of claim 7,
the upper platform is provided with an upper platform main body and an upper platform fixing bracket, the upper platform fixing bracket connects the upper platform main body and the upper platform by a flange,
the heater includes a plurality of through holes formed radially outward of the heater on the upper stage flange.
CN202211594491.8A 2021-12-14 2022-12-13 Double-sided grinding device Pending CN116262328A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-202707 2021-12-14
JP2021202707A JP2023088070A (en) 2021-12-14 2021-12-14 Double-side polishing device

Publications (1)

Publication Number Publication Date
CN116262328A true CN116262328A (en) 2023-06-16

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ID=86723055

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211594491.8A Pending CN116262328A (en) 2021-12-14 2022-12-13 Double-sided grinding device

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Country Link
JP (1) JP2023088070A (en)
CN (1) CN116262328A (en)

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