CN116258666A - Wafer detection Mark point positioning method and application - Google Patents
Wafer detection Mark point positioning method and application Download PDFInfo
- Publication number
- CN116258666A CN116258666A CN202211101939.8A CN202211101939A CN116258666A CN 116258666 A CN116258666 A CN 116258666A CN 202211101939 A CN202211101939 A CN 202211101939A CN 116258666 A CN116258666 A CN 116258666A
- Authority
- CN
- China
- Prior art keywords
- positioning
- mark
- coarse positioning
- mark point
- mark points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/11—Region-based segmentation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention discloses a wafer detection Mark point positioning method, which comprises the following steps: acquiring all picture images of the wafer detection image under the same index, and performing coarse positioning through a first template covering surrounding information of Mark points to be detected and the corresponding picture images; cutting out a coarse positioning area according to the coarse positioning result, and carrying out fine positioning on the coarse positioning area through a second template only containing Mark points to be detected and the corresponding coarse positioning area; and calculating the matching score of each Mark point to be detected according to the coarse positioning result and the fine positioning result, sequencing the matching scores, and selecting the Mark point to be detected with the highest score as the accurately positioned target Mark point. The method can solve the problem that the traditional Mark point positioning method adopts single template matching calculation, and error positioning is easy to occur under the condition that the backgrounds of Mark points and non-Mark points are very similar.
Description
Technical Field
The present invention relates to the field of optical inspection, and in particular, to a method for positioning Mark points in wafer inspection, a device for positioning Mark points in wafer inspection, and a computer readable storage medium.
Background
When detecting a wafer, only one image to be detected is shot, sometimes defects cannot be fully displayed, so that a plurality of images to be detected can be shot, defect results of the images to be detected are combined after the detection of each image to be detected is finished, and a final detection result is obtained. During the merging process, the same Mark point in a plurality of images to be detected is needed, so that the detection of the Mark point is crucial to the accuracy of a final result.
The existing Mark point positioning is mainly a method for directly carrying out single template matching, namely, a position with the largest matching score is obtained as the position of the Mark point by utilizing a single template matching algorithm. However, in some types of wafer inspection, the backgrounds of Mark points and non-Mark points are very similar, and the similarity of all pixel points is considered in the template matching algorithm, so that the matching score is very high due to the similar backgrounds, and therefore, incorrect positioning is easy to occur. To prevent incorrect positioning, sometimes the definition of the matching score is added again, and if it is smaller than the set threshold, the found Mark point is considered invalid. However, the threshold value is set to be a fixed value, and the current position is possibly suitable, and a plurality of images to be detected changed to another angle are too large, so that Mark points are screened out, namely, optimization introduced by wrong positioning is processed, and correct positioning is possibly filtered out.
Disclosure of Invention
Aiming at the defects or improvement demands of the prior art, the invention provides a wafer detection Mark point positioning method, a wafer detection Mark point positioning device and a computer readable storage medium, which can solve the problem that the traditional Mark point positioning method adopts single template matching calculation and is easy to have error positioning under the condition that the backgrounds of Mark points and non-Mark points are very similar.
In one aspect, an embodiment of the present invention provides a method for positioning Mark points in wafer inspection, including: acquiring all picture images of a wafer detection image under the same index, and performing coarse positioning through a first template covering surrounding information of Mark points to be detected and the corresponding picture images; cutting out a coarse positioning area according to a coarse positioning result, and performing fine positioning on the coarse positioning area through a second template only comprising Mark points to be detected and the corresponding coarse positioning area; and calculating the matching score of each Mark point to be detected according to the coarse positioning result and the fine positioning result, sequencing the matching scores, and selecting the Mark point to be detected with the highest score as a target Mark point for accurate positioning.
In one embodiment of the present invention, the coarse positioning by the first template covering the surrounding information of the target Mark point and the corresponding picture map includes: and performing coarse positioning matching calculation after downsampling on the picture image and the first template so as to improve the coarse positioning matching speed.
In one embodiment of the present invention, before the image alignment according to the overlapping area between the plurality of die detection images, the method further includes: and selecting an alignment point and acquiring the grain detection image in which the alignment point is positioned as a reference image, and performing image alignment on other grain detection images according to the reference image.
In an embodiment of the present invention, the obtained field of view of all the frame images is the same, and after the coarse positioning is performed on the first template covering the surrounding information of the Mark point to be measured and the corresponding frame image, the method further includes: judging the position deviation between Mark points of each picture after coarse positioning as a test condition; and adding the Mark points meeting the preset position deviation into a rough positioning candidate point sequence.
In one embodiment of the present invention, after the determining, using the position deviation between Mark points of each of the picture images after coarse positioning as the inspection condition, the method further includes: establishing an ROI region according to the Mark points meeting the preset position deviation and the prior position relation among the picture images; and carrying out coarse positioning again in the ROI area according to the first template, and adding the Mark points meeting the preset position deviation into the coarse positioning candidate point sequence.
In one embodiment of the present invention, after the determining, using the position deviation between Mark points of each of the picture images after coarse positioning as the inspection condition, the method further includes: setting a minimum number threshold of the rough positioning candidate points, and exiting rough positioning when the number of the rough positioning candidate points reaches the minimum number threshold.
In one embodiment of the present invention, the performing fine positioning by using the second template including only the Mark point to be detected and the corresponding coarse positioning area includes: calculating Mark point position information of the precise positioning; and based on the Mark point position information of the fine positioning and the Mark point position information of the coarse positioning, combining the sampling multiple of the downsampling to convert the Mark point position information to the whole wafer detection image.
On the other hand, an embodiment of the present invention provides a wafer detection Mark point positioning device, including: the coarse positioning module is used for acquiring all picture images under the same index of the wafer detection image, and performing coarse positioning on the picture images through a first template covering surrounding information of Mark points to be detected and the corresponding picture images; the fine positioning module is used for cutting out a coarse positioning area according to a coarse positioning result and carrying out fine positioning on the coarse positioning area through a second template only comprising the Mark points to be detected and the corresponding coarse positioning area; the target Mark point selecting module is used for calculating the matching score of each Mark point to be detected according to the coarse positioning result and the fine positioning result, sequencing the matching scores and selecting the Mark point to be detected with the highest score as the target Mark point for accurate positioning.
In one embodiment of the present invention, the wafer inspection Mark point positioning device further includes: the deviation checking module is used for judging the position deviation between Mark points of each picture after coarse positioning as a checking condition; and adding the Mark points meeting the preset position deviation into a rough positioning candidate point sequence.
In one embodiment of the present invention, the wafer inspection Mark point positioning device further includes: the ROI area establishing module is used for establishing an ROI area according to the Mark points meeting the preset position deviation and the prior position relation between the picture images; and carrying out coarse positioning again in the ROI area according to the first template, and adding the Mark points meeting the preset position deviation into the coarse positioning candidate point sequence.
In yet another aspect, an embodiment of the present invention provides a computer readable storage medium storing computer executable instructions for performing the method for positioning a Mark point for wafer inspection according to any one of the embodiments above.
As can be seen from the above, compared with the prior art, the above solution contemplated by the present invention may have one or more of the following advantages:
(1) Mark point positioning is carried out on the wafer detection image through two templates, one large template image containing Mark point peripheral information is subjected to rough positioning, the other small template image only containing Mark point is subjected to fine positioning, mark point positioning accuracy can be improved, and the positioning accuracy of the Mark point can be effectively improvedUnder the condition that the background of Mark point and non-Mark point are very similar, adopting single template matching Matching calculation leads to the problem of easy occurrence of wrong positioning；
(2) Through priori knowledge established by the position relation among a plurality of pictures under the same index, mark points of other pictures can be found by using Mark points only by finding Mark points of some pictures in the positioning process, so that the robustness of an algorithm is improved;
(3) Aiming at the missed Mark points, capturing an interested region near the Mark points which are successfully positioned by utilizing Mark rough positioning information of the images which are successfully positioned and combining with a position constraint condition, and re-rough positioning in the interested region, if the Mark points are successfully positioned, adding the Mark points into a rough positioning candidate point sequence, so that when the images which are failed to be roughly positioned are matched and positioned again, the matching threshold value is dynamically reduced, the problem of Mark point omission caused by a fixed threshold value can be effectively solved, and the positioning accuracy is improved;
(4) By setting the limit of the number of the candidate points, the positioning is finished when the number of the candidate points reaches the threshold value, the problem of long judgment time consumption caused by excessive number of the candidate Mark points can be effectively solved, and the positioning speed is improved.
Other aspects of the features of the invention will become apparent from the following detailed description, which refers to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the invention. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a flowchart of a method for positioning Mark points in wafer inspection according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating steps performed in a method for positioning a Mark point of wafer inspection according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a positioning device for detecting Mark points of a wafer according to an embodiment of the present invention
Fig. 4 is a schematic structural diagram of a computer readable storage medium according to an embodiment of the present invention.
Description of the reference numerals
S1 to S3: a step of a wafer detection Mark point positioning method;
20: a wafer detection Mark point positioning device; 201: a coarse positioning module; 202: a fine positioning module; 203: a target Mark point selection module;
40: computer readable storage media.
Detailed Description
It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described below with reference to the accompanying drawings in combination with embodiments.
In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments of the embodiments are all within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the above figures are applicable to distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, it is possible to provide a device for the treatment of a disease. The terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be further noted that the division of the embodiments in the present invention is only for convenience of description, and should not be construed as a specific limitation, and features in the various embodiments may be combined and mutually referenced without contradiction.
[ first embodiment ]
As shown in fig. 1, a first embodiment of the present invention provides a method for positioning Mark points of wafer inspection, for example, comprising the following steps: step S1, obtaining all picture images of a wafer detection image under the same index, and performing coarse positioning through a first template covering surrounding information of Mark points to be detected and the corresponding picture images; s2, cutting out a coarse positioning area according to a coarse positioning result, and performing fine positioning on the coarse positioning area through a second template only comprising Mark points to be detected and the corresponding coarse positioning area; and S3, calculating the matching score of each Mark point to be detected according to the coarse positioning result and the fine positioning result, sequencing the matching scores, and selecting the Mark point to be detected with the highest score as a target Mark point for accurate positioning.
In step S1, a plurality of inspection images are captured for a wafer to be inspected by a device such as a camera, and the wafer inspection images input in series are acquired by the upper computer software. Since a plurality of images are often required for the same area in wafer inspection, the acquired images for wafer inspection are divided into a plurality of indexes, for example, and each image corresponding to each index has all the images of the inspection area. For all the picture images under the same index, coarse positioning is performed on the corresponding picture images through a first template covering surrounding information of the Mark point to be detected. Among these are mentioned, for example, personal computers, hand-held devices, portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, editable consumer electronics, network PCs, minicomputers, mainframe computers, or distributed computing environments that include any of the above systems or devices, and the like.
In one embodiment, under the condition of not affecting the positioning result, for example, the coarse positioning matching calculation is performed after the downsampling is performed on the picture image and the first template, so that the coarse positioning matching speed can be further improved.
Referring to fig. 2, if it is determined that coarse positioning matching of all the picture images under the current index is successful, adding the corresponding Mark point into the candidate point sequence. In one embodiment, the plurality of pictures are photographed with, for example, the field of view being unchanged, and based on this known information, it is possible to ensure that the positional deviation of Mark points between the plurality of pictures is small. Therefore, for example, the position deviation between Mark points of each picture after rough positioning is determined as a test condition, and Mark points satisfying the preset position deviation are added to the rough positioning candidate point sequence. Therefore, through the priori knowledge established by the position relation among a plurality of pictures under the same index, mark points of other pictures can be found by using Mark points only by finding Mark points of some pictures in the positioning process, and the robustness of an algorithm is improved.
Further, if coarse positioning in a certain picture fails, the Mark point coarse positioning information of the picture meeting the preset position deviation (i.e. the picture is successfully positioned) can be utilized to intercept the ROI (region of interest) near the Mark point with successful positioning in combination with the position constraint condition of each picture. Through re-coarse positioning in the region of interest, if successful, the images are added into the coarse positioning candidate point sequence, so that when the images which fail to be subjected to coarse positioning are subjected to re-matching positioning, the matching threshold value is dynamically reduced, the omission problem caused by the fixed threshold value can be effectively solved, and the positioning accuracy is improved.
In one embodiment, for example, a minimum number threshold of coarse positioning candidate points is also set, and coarse positioning is exited when it is determined that the number of coarse positioning candidate points reaches the minimum number threshold. Therefore, the problem of long judgment time consumption caused by excessive number of the candidate Mark points can be effectively solved, and the Mark point positioning speed is improved.
In step S2, for example, the upper computer software cuts out the coarse positioning area according to the coarse positioning result, and performs fine positioning with the corresponding coarse positioning area through the second template only including the Mark point to be detected. Specifically, since the matching calculation is already performed in a small range at this time, the down-sampling speed is already fast without performing. It should be noted that the precisely located Mark point position information obtained by this step is the starting point of the relatively coarse positioning result, so when it is converted into the whole wafer inspection image, for example, the Mark point position information is converted into the whole wafer inspection image by combining the sampling multiple of the downsampling based on the precisely located Mark point position information plus the coarse located Mark point position information.
In step S3, a score of each candidate Mark point is calculated from the coarse positioning result and the fine positioning result. The score of each Mark point is, for example, the rough positioning matching score in step S1 plus the fine positioning matching score in step S2, the matching scores are ordered, and the Mark point to be detected with the highest score is selected as the target Mark point for accurate positioning. It should be noted that the final score of the candidate Mark points is, for example, the sum of the positioning scores of each picture, instead of only depending on a single picture, so that the algorithm has better stability.
In summary, according to the Mark point positioning method for wafer detection provided by the embodiment of the invention, mark point positioning is performed on a wafer detection image through two templates, one large template image containing information around the Mark point is roughly positioned, and the other small template image containing only the Mark point is finely positioned, so that the Mark point positioning accuracy can be improved, and the problem that error positioning is easy to occur due to single template matching calculation under the condition that the backgrounds of the Mark point and the non-Mark point are very similar is effectively solved; through priori knowledge established by the position relation among a plurality of pictures under the same index, mark points of other pictures can be found by using Mark points only by finding Mark points of some pictures in the positioning process, so that the robustness of an algorithm is improved; aiming at the missed Mark points, capturing an interested region near the Mark points which are successfully positioned by utilizing Mark rough positioning information of the images which are successfully positioned and combining with a position constraint condition, and re-rough positioning in the interested region, if the Mark points are successfully positioned, adding the Mark points into a rough positioning candidate point sequence, so that when the images which are failed to be roughly positioned are matched and positioned again, the matching threshold value is dynamically reduced, the problem of Mark point omission caused by a fixed threshold value can be effectively solved, and the positioning accuracy is improved; by setting the limit of the number of the candidate points, the positioning is finished when the number of the candidate points reaches the threshold value, the problem of long judgment time consumption caused by excessive number of the candidate Mark points can be effectively solved, and the positioning speed is improved.
[ second embodiment ]
As shown in fig. 3, a second embodiment of the present invention provides a wafer inspection Mark point positioning apparatus 20, for example, including: coarse positioning module 201, fine positioning module 202, and target Mark point selection module 203.
The coarse positioning module 201 is configured to obtain all the frame images of the wafer inspection image under the same index, and perform coarse positioning with the corresponding frame images by using a first template covering surrounding information of the Mark point to be inspected. The fine positioning module 202 is configured to cut out a coarse positioning area according to a coarse positioning result, and perform fine positioning on the coarse positioning area through a second template that only includes the Mark point to be detected. The target Mark point selecting module 203 is configured to calculate a matching score of each Mark point to be detected according to the coarse positioning result and the fine positioning result, sort the matching scores, and select the Mark point to be detected with the highest score as the accurately positioned target Mark point.
Further, the wafer inspection Mark point positioning apparatus 20 further includes: the deviation checking module 204 is configured to determine, as a checking condition, a position deviation between Mark points of each of the roughly located picture images; and adding the Mark points meeting the preset position deviation into a rough positioning candidate point sequence.
Further, the wafer inspection Mark point positioning apparatus 20 further includes: further comprises: the ROI area establishing module is used for establishing an ROI area according to the Mark points meeting the preset position deviation and the prior position relation between the picture images; and carrying out coarse positioning again in the ROI area according to the first template, and adding the Mark points meeting the preset position deviation into the coarse positioning candidate point sequence.
The wafer inspection Mark point positioning method implemented by the wafer inspection Mark point positioning device 20 according to the second embodiment of the present invention is as described in the foregoing first embodiment, and thus will not be described in detail herein. Optionally, each module in the second embodiment and the other operations or functions described above are respectively for implementing the method described in the first embodiment, and the beneficial effects of this embodiment are the same as those of the foregoing first embodiment, which are not described herein for brevity.
[ third embodiment ]
As shown in fig. 4, a third embodiment of the present invention proposes a computer readable storage medium 30, where the computer readable storage medium 40 is a non-volatile memory and stores computer readable instructions, which when executed by one or more processors, for example, cause the one or more processors to perform the wafer inspection Mark point positioning method described in the foregoing first embodiment. The specific method may refer to the method described in the first embodiment, and is not described herein for brevity, and the beneficial effects of the computer readable storage medium 40 provided in this embodiment are the same as those of the wafer inspection Mark point positioning method provided in the first embodiment.
In addition, it should be understood that the foregoing embodiments are merely exemplary illustrations of the present invention, and the technical solutions of the embodiments may be arbitrarily combined and matched without conflict in technical features, contradiction in structure, and departure from the purpose of the present invention.
In the several embodiments provided herein, it should be understood that the disclosed systems, devices, and/or methods may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and the division of the units/modules is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or modules may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units/modules described as separate units may or may not be physically separate, and units/modules may or may not be physically units, may be located in one place, or may be distributed on multiple network units. Some or all of the units/modules may be selected according to actual needs to achieve the purpose of the embodiment.
In addition, each functional unit/module in the embodiments of the present invention may be integrated in one processing unit/module, or each unit/module may exist alone physically, or two or more units/modules may be integrated in one unit/module. The integrated units/modules may be implemented in hardware or in hardware plus software functional units/modules.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The wafer detection Mark point positioning method is characterized by comprising the following steps of:
acquiring all picture images of a wafer detection image under the same index, and performing coarse positioning through a first template covering surrounding information of Mark points to be detected and the corresponding picture images;
cutting out a coarse positioning area according to a coarse positioning result, and performing fine positioning on the coarse positioning area through a second template only comprising Mark points to be detected and the corresponding coarse positioning area;
and calculating the matching score of each Mark point to be detected according to the coarse positioning result and the fine positioning result, sequencing the matching scores, and selecting the Mark point to be detected with the highest score as a target Mark point for accurate positioning.
2. The method for positioning a Mark point on a wafer according to claim 1, wherein the coarse positioning by the first template covering the surrounding information of the target Mark point and the corresponding picture image comprises:
and performing coarse positioning matching calculation after downsampling on the picture image and the first template so as to improve the coarse positioning matching speed.
3. The method for positioning Mark points on wafer inspection according to claim 1, wherein the fields of view of all the obtained frame images are the same, and after the coarse positioning is performed between the first template covering the surrounding information of the Mark points to be inspected and the corresponding frame image, the method further comprises:
judging the position deviation between Mark points of each picture after coarse positioning as a test condition;
and adding the Mark points meeting the preset position deviation into a rough positioning candidate point sequence.
4. The method for positioning Mark points for wafer inspection according to claim 3, further comprising, after said determining as an inspection condition a positional deviation between Mark points of each of said picture images after rough positioning:
establishing an ROI region according to the Mark points meeting the preset position deviation and the prior position relation among the picture images;
and carrying out coarse positioning again in the ROI area according to the first template, and adding the Mark points meeting the preset position deviation into the coarse positioning candidate point sequence.
5. The method for positioning Mark points for wafer inspection according to claim 3, further comprising, after said determining as an inspection condition a positional deviation between Mark points of each of said picture images after rough positioning:
setting a minimum number threshold of the rough positioning candidate points, and exiting rough positioning when the number of the rough positioning candidate points reaches the minimum number threshold.
6. The method for positioning Mark points on wafer inspection according to claim 2, wherein the performing fine positioning by using the second template including only Mark points to be inspected and the corresponding rough positioning area comprises:
calculating Mark point position information of the precise positioning;
and based on the Mark point position information of the fine positioning and the Mark point position information of the coarse positioning, combining the sampling multiple of the downsampling to convert the Mark point position information to the whole wafer detection image.
7. The utility model provides a wafer detects Mark point positioner which characterized in that includes:
the coarse positioning module is used for acquiring all picture images under the same index of the wafer detection image, and performing coarse positioning on the picture images through a first template covering surrounding information of Mark points to be detected and the corresponding picture images;
the fine positioning module is used for cutting out a coarse positioning area according to a coarse positioning result and carrying out fine positioning on the coarse positioning area through a second template only comprising the Mark points to be detected and the corresponding coarse positioning area;
the target Mark point selecting module is used for calculating the matching score of each Mark point to be detected according to the coarse positioning result and the fine positioning result, sequencing the matching scores and selecting the Mark point to be detected with the highest score as the target Mark point for accurate positioning.
8. The wafer inspection Mark point positioning apparatus as claimed in claim 7, further comprising: the deviation checking module is used for judging the position deviation between Mark points of each picture after coarse positioning as a checking condition; and adding the Mark points meeting the preset position deviation into a rough positioning candidate point sequence.
9. The wafer inspection Mark point positioning apparatus as claimed in claim 8, further comprising: the ROI area establishing module is used for establishing an ROI area according to the Mark points meeting the preset position deviation and the prior position relation between the picture images; and carrying out coarse positioning again in the ROI area according to the first template, and adding the Mark points meeting the preset position deviation into the coarse positioning candidate point sequence.
10. A computer readable storage medium, characterized in that it stores a computer program executable by an access authentication device, which when run on the access authentication device causes the access authentication device to perform the steps of the method according to any of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211101939.8A CN116258666A (en) | 2022-09-09 | 2022-09-09 | Wafer detection Mark point positioning method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211101939.8A CN116258666A (en) | 2022-09-09 | 2022-09-09 | Wafer detection Mark point positioning method and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116258666A true CN116258666A (en) | 2023-06-13 |
Family
ID=86679858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211101939.8A Pending CN116258666A (en) | 2022-09-09 | 2022-09-09 | Wafer detection Mark point positioning method and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116258666A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116678898A (en) * | 2023-07-28 | 2023-09-01 | 苏州赫芯科技有限公司 | Generalized wafer defect detection method, system, equipment and medium |
-
2022
- 2022-09-09 CN CN202211101939.8A patent/CN116258666A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116678898A (en) * | 2023-07-28 | 2023-09-01 | 苏州赫芯科技有限公司 | Generalized wafer defect detection method, system, equipment and medium |
| CN116678898B (en) * | 2023-07-28 | 2023-10-24 | 苏州赫芯科技有限公司 | Generalized wafer defect detection method, system, equipment and medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7693348B2 (en) | Method of registering and aligning multiple images | |
| CN114220757B (en) | Wafer detection alignment method, device and system and computer medium | |
| US20080205769A1 (en) | Apparatus, method and program product for matching with a template | |
| US10692291B2 (en) | Apparatus, method, and medium for generating a 3D model of a finger using captured image | |
| US11842481B2 (en) | Defect offset correction | |
| CN110211185B (en) | Method for identifying characteristic points of calibration pattern in group of candidate points | |
| US20220084189A1 (en) | Information processing apparatus, information processing method, and storage medium | |
| US11657644B2 (en) | Automatic ruler detection | |
| CN110346704B (en) | Method, device and equipment for determining test file in board test and storage medium | |
| CN111310753B (en) | Meter alignment method and device | |
| CN116542945B (en) | Wafer image segmentation processing method, electronic equipment and storage medium | |
| US20160350615A1 (en) | Image processing apparatus, image processing method, and storage medium storing program for executing image processing method | |
| CN116258666A (en) | Wafer detection Mark point positioning method and application | |
| JP2017049742A (en) | Image processing method, image processing apparatus, robot apparatus, program and recording medium | |
| JP2008135568A (en) | Method and device for reviewing defect | |
| CN115546219B (en) | Detection plate type generation method, plate card defect detection method, device and product | |
| EP2300990B1 (en) | Image analysis system & method | |
| CN113327204B (en) | Image calibration method, device, equipment and storage medium | |
| JP2010091525A (en) | Pattern matching method of electronic component | |
| CN113570539A (en) | Screw missing lock detection method, system, device and storage medium | |
| JP2000321038A (en) | Method for detecting fault of pattern | |
| CN116481434B (en) | Self-positioning control method and device for visual detection and self-positioning system | |
| Nagarajan et al. | Automated Analogue Dial Reading in Cockpits | |
| CN111199533B (en) | Image processing apparatus and method | |
| CN116892880B (en) | Electronic component high-precision detection system based on machine vision |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |