CN116245070B - Method, device and storage medium for converting grid lines into copper surfaces - Google Patents
Method, device and storage medium for converting grid lines into copper surfaces Download PDFInfo
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- CN116245070B CN116245070B CN202211674153.5A CN202211674153A CN116245070B CN 116245070 B CN116245070 B CN 116245070B CN 202211674153 A CN202211674153 A CN 202211674153A CN 116245070 B CN116245070 B CN 116245070B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
- G06T11/20—Drawing from basic elements, e.g. lines or circles
- G06T11/203—Drawing of straight lines or curves
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
- G06T11/40—Filling a planar surface by adding surface attributes, e.g. colour or texture
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/06—Structured ASICs
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- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Computer Networks & Wireless Communication (AREA)
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- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The invention discloses a method, a device and a storage medium for converting grid lines into copper surfaces, which comprise the steps of obtaining information of the grid lines of a circuit board circuit diagram file; analyzing and calculating the information of the grid lines to obtain peripheral frame lines; and filling coloring in the grid area according to the peripheral frame lines and removing the grid lines. According to the invention, after the peripheral frame wires are obtained by analyzing and calculating the information of the grid wires of the circuit board circuit diagram file, the coloring is filled in the grid area according to the peripheral frame wires, and the grid wires are removed, so that the automatic conversion of the grid wires and the copper surface can be realized, the processing speed and the processing efficiency of converting the grid wires into the copper surface are improved, the time is saved, the manual operation errors are reduced, and the accuracy of designing and manufacturing the circuit board can be effectively improved.
Description
Technical Field
The present invention relates to the field of circuit board design technologies, and in particular, to a method and an apparatus for converting grid lines into copper surfaces, and a storage medium.
Background
Grid lines are often adopted when a circuit board with a large design area is designed, the grid lines are generally composed of peripheral frame lines and inner grid line segments, the inner grid line segments are arranged in grid areas formed by surrounding the peripheral frame lines, and the grid lines are often required to be converted into copper surfaces to reduce data volume and save time due to excessively large data volume during optimization. In the prior art, engineers are relied on to perform manual conversion on the software such as Genes I s2000, I ncam, I ncampro and the like, but the number of grid lines is numerous, the processing efficiency of the manual conversion is low, the time consumption is long, and the manual operation errors such as omission and the like are easy to occur.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a method, a device and a storage medium for converting the grid lines into the copper surface, which can realize automatic conversion between the grid lines and the copper surface and has high conversion efficiency.
A method of gridlines converting a copper surface according to an embodiment of the first aspect of the present invention, the gridlines including a peripheral frame line for characterizing a peripheral contour edge of a gridregion, the method comprising the steps of:
acquiring information of the grid lines of the circuit board circuit diagram file;
analyzing and calculating information of the grid lines to obtain the peripheral frame lines;
and filling coloring in the grid area according to the peripheral frame wires and removing the grid lines.
The method for converting the grid lines into the copper surface has the following beneficial effects:
according to the method for converting the grid lines into the copper surface, disclosed by the invention, after the peripheral frame lines are obtained by analyzing and calculating the information of the grid lines of the circuit board circuit diagram file, the coloring is filled in the grid area according to the peripheral frame lines, and the grid lines are removed, so that the automatic conversion between the grid lines and the copper surface can be realized, the processing speed and the processing efficiency of converting the grid lines into the copper surface are improved, the time is saved, the manual misoperation is reduced, and the accuracy of designing and manufacturing the circuit board can be effectively improved.
According to some embodiments of the invention, the analyzing and calculating information of the grid lines to obtain the peripheral frame lines includes:
newly building a first standby layer;
copying the grid lines to the first standby layer;
extracting a plurality of lines forming the grid lines on the first standby layer;
calculating coordinate parameters of a plurality of lines forming the grid line, screening out the plurality of lines conforming to the line conditions forming the peripheral frame by using the coordinate parameters of the plurality of lines, and combining the plurality of lines to obtain the peripheral frame.
According to some embodiments of the invention, the calculating the coordinate parameters of the plurality of lines forming the grid line, the selecting the plurality of lines conforming to the line condition forming the peripheral frame using the coordinate parameters of the plurality of lines, and combining the plurality of lines to obtain the peripheral frame line includes:
calculating end point coordinates of two ends of a plurality of lines forming the grid line;
screening out coincident endpoint coordinates from endpoint coordinates of a plurality of lines forming the grid line;
and connecting a plurality of lines with the end point coordinates at two ends which are overlapped end to end in sequence, and enabling the enclosing area of the lines to be the largest so as to form the peripheral frame line.
According to some embodiments of the invention, the lines comprise straight lines and curved lines.
According to some embodiments of the invention, the filling coloring and removing the grid lines in the grid area according to the peripheral frame line comprises:
newly building a second standby layer;
copying the peripheral frame wire to the second standby layer;
filling a coloring in the grid area on the second standby layer according to the peripheral frame wire on the second standby layer;
copying the part filled with coloring on the second standby layer to the corresponding position of the circuit board wiring diagram file and removing the grid lines of the circuit board wiring diagram file.
According to an embodiment of the second aspect of the present invention, a conversion apparatus includes:
the acquisition module is used for acquiring information of grid lines of the circuit board circuit diagram file;
the analysis and calculation module is used for analyzing and calculating the information of the grid lines to obtain peripheral frame lines;
and the conversion module is used for filling coloring in the grid area according to the peripheral frame line and removing the grid line.
A processing apparatus according to an embodiment of the third aspect of the present invention includes a memory, a processor, and a program;
the program is stored in the memory, and the processor executes the program to implement the method as described in any of the embodiments above.
A storage medium according to an embodiment of a fourth aspect of the present invention stores a program which, when executed by a processor, implements a method as described in any of the above embodiments.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic flow chart of one embodiment of the present invention;
FIG. 2 is a schematic diagram of grid lines according to one embodiment of the present invention;
FIG. 3 is a schematic diagram of one embodiment of the present invention after grid lines remain only peripheral frame lines;
FIG. 4 is a schematic illustration of the grid area after filling coloring in accordance with one embodiment of the present invention.
Reference numerals:
grid lines 100, peripheral frame lines 110, medial grid line segments 120.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
It should be noted that, in the current circuit board industry, software such as Genes is 2000, I ncam, I ncampro is mostly adopted in designing a circuit board, and grid lines 100 are often adopted in designing a circuit board with a larger area, and the data amount of the grid lines 100 is too huge in optimizing, so that the grid lines 100 need to be converted into copper surfaces to reduce the data amount and save time. However, the existing software such as Genes I2000, I ncam, I ncampro and the like cannot be directly converted, if the manual conversion is performed by relying on engineers, the efficiency is low, the time consumption is long, and the missing and other artificial misoperation easily occur. Specifically, referring to fig. 2, the grid line 100 is generally formed by a peripheral frame line 110 and an inner grid line segment 120, where the peripheral frame line 110 can represent a peripheral outline edge of a grid region, the peripheral frame line 110 can enclose grid regions with different shapes and sizes, the inner grid line segment 120 is disposed in the grid region enclosed by the peripheral frame line 110, and further, it should be noted that the inner grid line segment 120 generally adopts inclined straight lines, a plurality of inclined straight lines are alternately disposed in a grid shape, and the peripheral frame line 110 has different shapes and sizes, and therefore, is formed by adopting a combination of straight lines and arcs, and forms a grid region with a specific shape and size through continuous straight lines and arcs. The inner grid line segment 120 and the outer frame line 110 constituting the grid line 100 are generally the same in thickness, and the inner grid line segment 120 is a straight line inclined, so that the straight line constituting the inner grid line segment 120 generally has a specific slope. Specifically, as shown in fig. 1, a method for converting copper surfaces by using grid lines 100 according to an embodiment of the present invention is characterized in that the grid lines 100 include a peripheral frame line 110 for characterizing a peripheral outline edge of a grid region, and the method includes the following steps:
s100, acquiring information of grid lines 100 of a circuit board circuit diagram file;
s200, analyzing and calculating information of the grid lines 100 to obtain peripheral frame lines 110;
s300, filling coloring in the grid area according to the peripheral frame lines 110 and removing the grid lines 100.
According to the method for converting the copper surface by the grid line 100, the obtained information of the grid line 100 of the circuit board circuit diagram file is analyzed and calculated, wherein the information of the grid line 100 can be the attribute and position information of straight lines and arcs forming the peripheral frame line 110 and the inner side grid line segment 120, such as the slope of the straight lines, the curvature of the arcs, the coordinates of the straight lines and the arcs and the like, after the peripheral frame line 110 of the grid line 100 is obtained according to the information analysis and calculation of the grid line 100, the grid line 100 is filled and colored in a grid area according to the peripheral frame line 110, and the grid line 100 is removed, so that the automatic conversion of the grid line 100 and the copper surface can be realized, the processing speed and the processing efficiency of converting the grid line 100 into the copper surface are improved, the time is saved, the manual operation errors are reduced, and the accuracy of circuit board design and manufacturing can be effectively improved.
In some embodiments of the present invention, in step S200, analyzing and calculating information of grid lines 100, obtaining peripheral frame line 110 includes:
s210, newly creating a first standby layer;
s220, copying the grid lines 100 to the first standby layer;
s230, extracting a plurality of lines forming the grid lines 100 on the first standby layer;
s240, calculating coordinate parameters of a plurality of lines forming the grid line 100, screening out a plurality of lines conforming to the conditions forming the peripheral frame line 110 by using the coordinate parameters of the plurality of lines, and combining the plurality of lines to obtain the peripheral frame line 110.
It should be noted that, by creating the first standby layer and copying the grid lines 100 on the circuit board circuit diagram file onto the first standby layer, then analyzing and calculating the extracted lines of the grid lines 100 on the first standby layer to obtain the peripheral frame line 110, since the first standby layer is a newly created working layer, only the lines forming the grid lines 100 are on the first standby layer, and the line elements are separated and extracted on the first standby layer, compared with the line elements separated and extracted directly on the circuit board circuit diagram file, the data volume of the line elements required to be analyzed and calculated is reduced, which is beneficial to improving the processing speed and avoiding the interference of other lines on the calculation.
In some embodiments of the present invention, in step S240, calculating coordinate parameters of a plurality of lines forming the grid line 100, screening out a plurality of lines conforming to the conditions forming the peripheral frame line 110 by using the coordinate parameters of the plurality of lines, and combining the plurality of lines to obtain the peripheral frame line 110, including:
s241, calculating the end point coordinates of two ends of a plurality of lines forming the grid line 100;
s242, screening out coincident endpoint coordinates from the endpoint coordinates of a plurality of lines forming the grid line 100;
and S243, connecting a plurality of lines with coincident end point coordinates at two ends in sequence end to end, and maximizing the enclosing area of the plurality of lines to form the peripheral frame line 110.
When calculating the coordinate parameters of the lines constituting the grid line 100, only the end point coordinates of the two ends of the line are calculated, which is advantageous in reducing the amount of data for calculating the line coordinates and improving the processing speed as compared with the case where the coordinates of all the points constituting the line are calculated. Further, taking the shape of the peripheral frame line 110 as an example of a square for concrete explanation, a plurality of staggered inner side grid line segments 120 are distributed in a grid area of the square, after the end point coordinates of two ends of the plurality of lines forming the grid line 100 are obtained by calculation, the coordinates of four corners of the square are obtained by screening out the end point coordinates of the plurality of lines forming the grid line 100, it should be understood that five coincident lines exist at the end point coordinates of the two ends, specifically, four side lines of the square and a diagonal line, wherein the four side lines are the four lines forming the peripheral frame line 110, the diagonal line belongs to one of the inner side grid line segments 120, if the two side lines and the diagonal line are connected end to end in sequence, the triangle is obtained, and the square is obtained if the four side lines are connected end to end in sequence, the area of the square is larger than the area of the triangle, therefore, the four lines with coincident end points at the two ends are connected end points end to end in sequence, and the four side lines with the four side lines forming the peripheral frame line 110 can be connected end to end in sequence, and the peripheral frame line 110 can not be formed by the same step of calculating the peripheral frame line 110, and the peripheral frame line 110 can be obtained by analyzing the peripheral frame line 110.
In some embodiments of the invention, the lines include straight lines and curved lines.
Specifically, the lines that extract the constituent grid lines 100 may be straight lines and arcs. Although the inner grid line segment 120 is generally a straight line, since the peripheral frame line 110 has different shapes, the peripheral frame line 110 may be divided into straight lines with different lengths and arcs with different lengths and radii of curvature for easy calculation. When analyzing and calculating the grid line 100, all the straight lines and the arcs constituting the grid line 100 are extracted, then the coordinate parameters of all the straight lines and the arcs are calculated, and finally all the straight lines and the arcs constituting the peripheral frame line 110 are judged and determined by utilizing the coordinate parameters of all the straight lines and the arcs, so that the peripheral frame line 110 of the grid line 100 can be obtained.
In some embodiments of the present invention, in step S300, filling coloring in the grid area and removing the grid lines 100 according to the peripheral frame lines 110 includes:
s310, newly creating a second standby layer;
s320, copying the peripheral frame line 110 to a second standby layer;
s330, filling coloring in the grid area on the second standby layer according to the peripheral frame line 110 on the second standby layer;
s340, copying the part filled with coloring on the second standby layer to the corresponding position of the circuit board wiring diagram file and removing the grid lines 100 of the circuit board wiring diagram file.
It should be understood that, referring to fig. 3, after the second standby layer is newly built, the obtained peripheral frame line 110 is copied to the second standby layer, and then the corresponding grid area on the second standby layer is filled with coloring, as shown in fig. 4 after the filling coloring, since only the peripheral frame line 110 is arranged on the second standby layer, the processing efficiency of filling coloring is effectively improved, and interference caused by other elements of the circuit board line file on the filling coloring of the grid area is avoided. After the filling coloring is completed on the second standby layer, copying the part of the filling coloring on the second standby layer to the corresponding position of the circuit board circuit diagram file, and removing the peripheral frame line 110 and the inner grid line segment 120 of the circuit board circuit diagram file, thereby realizing the automatic conversion of the grid line 100 on the circuit board circuit diagram file into a copper surface.
According to an embodiment of the second aspect of the present invention, a conversion apparatus includes: an acquisition module for acquiring information of the grid lines 100 of the circuit board wiring diagram file; an analysis and calculation module for analyzing and calculating information of the grid lines 100 to obtain peripheral frame lines 110; a conversion module for filling coloring in the grid area and removing the grid lines 100 according to the peripheral frame lines 110.
The conversion device provided by the embodiment of the invention can realize automatic conversion of the grid lines 100 and the copper surface, improves the processing speed and efficiency of converting the grid lines 100 into the copper surface, is beneficial to saving time and reducing human misoperation, and can effectively improve the accuracy of circuit board design and manufacture.
It should be noted that, the specific implementation process of the embodiment of the present invention may refer to the specific process described in the above method embodiment, which is not described herein.
A processing apparatus according to an embodiment of the third aspect of the present invention includes a memory, a processor, and a program; the program is stored in a memory and the processor executes the program to implement the method of any of the embodiments described above.
It should be noted that, the specific implementation process of the embodiment of the present invention may refer to the specific process described in the above method embodiment, which is not described herein.
A storage medium according to an embodiment of a fourth aspect of the present invention stores a program which, when executed by a processor, implements a method as in any of the above embodiments.
An embodiment of the present invention provides a storage medium having a program stored thereon, which when executed causes a computer to perform the method for converting a copper surface by grid lines 100 described in the above method embodiment.
Those of ordinary skill in the art will appreciate that all or part of the steps of the various methods of the above embodiments may be implemented by a program that instructs associated hardware, the program may be stored in a computer readable storage medium including read-on-y memory, ROM, random-access memory (random access memory, RAM), programmable read-only memory (programmab l eread-on-y memory, PROM), erasable programmable read-only memory (erasab l eprogrammab l e read on l y memory, EPROM), one-time programmable read-only memory (one-t i me programmab l e read on l y memory, OTPROM), electronically erasable programmable read-only memory (e l ectr i ca l l y-erasab l eprogrammab l e read-on-y memory, EEPROM), compact disc read-only memory (compactd i sc read-on-y memory, CD-ROM) or other optical disc memory, magnetic disc memory, tape memory, or any other medium that can be used to carry or store data.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. A method of gridline conversion copper face, characterized in that the gridlines (100) comprise a peripheral frame line (110) for characterizing a peripheral contour edge of a gridline region, the method comprising the steps of:
acquiring information of the grid lines (100) of the circuit board circuit diagram file;
-analyzing and calculating information of the grid lines (100) obtaining the peripheral frame line (110), wherein said analyzing and calculating information of the grid lines (100) obtaining the peripheral frame line (110) comprises: newly creating a first standby layer, copying the grid lines (100) to the first standby layer, extracting a plurality of lines forming the grid lines (100) on the first standby layer, calculating coordinate parameters of the lines forming the grid lines (100), screening out the lines conforming to the conditions forming the peripheral frame lines (110) by using the coordinate parameters of the lines, and combining the lines to obtain the peripheral frame lines (110);
filling coloring in the grid area and removing the grid lines (100) according to the peripheral frame lines (110).
2. The method of claim 1, wherein calculating the coordinate parameters of the plurality of lines constituting the grid line (100), screening the plurality of lines conforming to the condition constituting the peripheral frame line (110) using the coordinate parameters of the plurality of lines, and combining the plurality of lines to obtain the peripheral frame line (110), comprises:
calculating end point coordinates of two ends of a plurality of lines forming the grid line (100); screening out coincident end point coordinates from the end point coordinates of a plurality of lines forming the grid line (100);
and connecting a plurality of lines with the end point coordinates at two ends which are coincident end to end in sequence, and enabling the enclosing area of the lines to be the largest so as to form the peripheral frame line (110).
3. The method for converting a gridline into a copper surface according to claim 1, wherein: the lines include straight lines and arcs.
4. The method of gridline conversion copper face according to claim 1, characterized in that said filling coloring and removing said gridlines (100) in said gridline area according to said peripheral frame line (110) comprises:
newly building a second standby layer;
copying the peripheral wire (110) to the second standby layer;
filling a coloring in the grid area on the second backup layer according to the peripheral wire (110) on the second backup layer;
copying the filled-in colored portion of the second spare layer to a corresponding location of the circuit board wiring pattern file and removing the grid lines (100) of the circuit board wiring pattern file.
5. A conversion device, comprising:
an acquisition module for acquiring information of grid lines (100) of a circuit board wiring diagram file, the grid lines (100) comprising peripheral frame lines (110) for characterizing peripheral contour edges of a grid region;
an analysis and calculation module for analyzing and calculating information of the grid lines (100) to obtain a peripheral frame line (110), wherein the analyzing and calculating information of the grid lines (100) to obtain the peripheral frame line (110) comprises: newly creating a first standby layer, copying the grid lines (100) to the first standby layer, extracting a plurality of lines forming the grid lines (100) on the first standby layer, calculating coordinate parameters of the lines forming the grid lines (100), screening out the lines conforming to the conditions forming the peripheral frame lines (110) by using the coordinate parameters of the lines, and combining the lines to obtain the peripheral frame lines (110); a conversion module for filling coloring in the grid area and removing the grid lines (100) according to the peripheral frame lines (110).
6. A processing device comprising a memory, a processor, and a program; the program is stored in the memory, which is executed by the processor to implement the method of any of claims 1-4.
7. A storage medium storing a program which, when executed by a processor, implements the method of any one of claims 1-4.
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| CN202211674153.5A CN116245070B (en) | 2022-12-26 | 2022-12-26 | Method, device and storage medium for converting grid lines into copper surfaces |
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| CN202211674153.5A CN116245070B (en) | 2022-12-26 | 2022-12-26 | Method, device and storage medium for converting grid lines into copper surfaces |
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| CN108520121A (en) * | 2018-03-27 | 2018-09-11 | 信利半导体有限公司 | Lattice generation method and device and computer installation and readable storage medium storing program for executing |
| CN114980511A (en) * | 2021-02-19 | 2022-08-30 | 珠海方正科技高密电子有限公司 | Circuit board manufacturing method and circuit board |
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