CN116243737A

CN116243737A - Temperature control method of reagent bin, temperature control system controller and temperature control system of reagent bin

Info

Publication number: CN116243737A
Application number: CN202211676772.8A
Authority: CN
Inventors: 袁竹根; 张涛; 李晓峰; 皮定; 邓国清; 翟文平
Original assignee: Guangdong Saikulaite Biological Co ltd
Current assignee: Fapon Biotech Inc; Guangdong Runpon Bioscience Co Ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-06-09

Abstract

The invention discloses a temperature control method of a reagent bin, a temperature control system controller and a temperature control system of the reagent bin. Wherein the method comprises the following steps: receiving a temperature signal sent by a temperature sensor in the reagent bin to determine a temperature value in the reagent bin; determining a target temperature control task according to the temperature value; determining target equipment needing to execute a target temperature control task and target parameters of the target equipment executing the target temperature control task; and sending the target instruction to target equipment so as to enable the target equipment to operate according to the target instruction, wherein the target instruction carries target parameters. The invention solves the technical problems of lower temperature control efficiency and inaccurate control when the temperature control is performed on the reagent bin to protect the reagent in the related technology.

Description

Temperature control method of reagent bin, temperature control system controller and temperature control system of reagent bin

Technical Field

The invention relates to the field of circuits, in particular to a temperature control method of a reagent bin, a temperature control system controller and a temperature control system of the reagent bin.

Background

Many reagents cannot be stored at normal temperature, the performance of the reagents can be guaranteed only in a proper temperature environment, the reagents are usually stored in a preset temperature range for better storage, and the reagents are usually placed in a reagent bin, so that a reagent bin temperature control system is a key point for guaranteeing the reagents in the preset temperature range. When the temperature control is performed on the reagent bin in the related technology to protect the reagent, the temperature control efficiency is low, the control is not accurate enough, the temperature rise and fall brought by the temperature control are slow, and the reagent can be out of a preset temperature range for a longer time, so that the reagent performance is affected.

In view of the above problems, no effective solution has been proposed at present.

Disclosure of Invention

The embodiment of the invention provides a temperature control method of a reagent bin, a temperature control system controller and a temperature control system of the reagent bin, which at least solve the technical problems of lower temperature control efficiency and inaccurate control when the reagent bin is subjected to temperature control to protect reagents in the related technology.

According to an aspect of an embodiment of the present invention, there is provided a temperature control method of a reagent cartridge, including: receiving a temperature signal sent by a temperature sensor in the reagent bin to determine a temperature value in the reagent bin; determining a target temperature control task according to the temperature value; determining target equipment needing to execute the target temperature control task and target parameters of the target equipment executing the target temperature control task; and sending a target instruction to the target equipment so as to enable the target equipment to operate according to the target instruction, wherein the target instruction carries the target parameter.

Optionally, the target device includes a semiconductor refrigerator TEC, a coolant pump, a cold end fan, and a hot end fan, the target temperature control task includes controlling the temperature value to be a first target temperature, and determining the target temperature control task according to the temperature value includes: and under the condition that the temperature value is larger than a first preset threshold value, determining the target temperature control task as a first target temperature control task for cooperatively cooling by using the TEC, the coolant pump, the cold end fan and the hot end fan.

Optionally, the target device includes a TEC, a cold end fan, and a hot end fan, the target temperature control task includes controlling the temperature value to be a second target temperature, and determining the target temperature control task according to the temperature value includes: and under the condition that the temperature value is smaller than or equal to a first preset threshold value and larger than a second preset threshold value, determining the target temperature control task as a second target temperature control task which uses the TEC, the cold end fan and the hot end fan to cooperatively cool.

Optionally, the target device includes a semiconductor refrigerator TEC and a hot-end fan, the target temperature control task includes controlling the temperature value to be a third target temperature, and determining the target temperature control task according to the temperature value includes: and under the condition that the temperature value is smaller than or equal to a second preset threshold value, determining the target temperature control task as a third target temperature control task for cooling by using the hot end fan.

Optionally, the target device includes a coolant pump, and after the sending the target instruction to the target device, the method further includes: receiving a liquid level signal of the cooling liquid sent by the cooling liquid pump; and determining the current liquid level according to the liquid level signal of the cooling liquid.

Optionally, the method further comprises: and when the liquid level is lower than a preset liquid level, a cooling liquid shortage and/or liquid supplementing reminding is sent out.

Optionally, after the sending the target instruction to the target device, the method further includes: receiving an equipment operation signal sent by the target equipment; and determining the running state of the target equipment according to the equipment running signal, and sending out a fault prompt corresponding to the target equipment when the running state is abnormal.

According to an aspect of an embodiment of the present invention, there is provided a temperature control system controller for performing any one of the above methods, including: the receiving module is used for receiving the temperature signal sent by the temperature sensor in the reagent bin so as to determine the temperature value in the reagent bin; the first determining module is used for determining a target temperature control task according to the temperature value; the second determining module is used for determining target equipment which needs to execute the target temperature control task and target parameters of the target equipment for executing the target temperature control task; and the sending module is used for sending a target instruction to the target equipment so as to enable the target equipment to operate according to the target instruction, wherein the target instruction carries the target parameter.

According to an aspect of an embodiment of the present invention, there is provided a temperature control system of a reagent cartridge, including: the device comprises a semiconductor refrigerator TEC, a temperature control system controller, a reagent bin assembly, a cold end heat dissipation assembly arranged in the reagent bin and a hot end heat dissipation assembly arranged outside the reagent bin, wherein a temperature sensor is further arranged in the reagent bin assembly, and the TEC and the temperature sensor are electrically connected with the temperature control system controller; one end of the TEC is contacted with the cold end heat dissipation assembly, and the other end of the TEC is contacted with the hot end assembly; wherein the temperature control system controller is configured to execute instructions to implement the method of controlling temperature of a reagent cartridge of claim 1.

Optionally, the temperature control system controller further includes a processor, a temperature sensor connection port electrically connected to the temperature sensor, and a TEC connection port electrically connected to the TEC, where the processor is configured to receive, through the temperature sensor connection port, a temperature signal sent by the temperature sensor, and further configured to send, through the TEC connection port, a first control signal to the TEC.

Optionally, the temperature control system controller further includes: a two-stage semiconductor field effect transistor MOS drive circuit, wherein the two-stage MOS drive circuit is connected in series between the processor and the TEC connection port; and/or, the AD conversion circuit, the follower circuit and the filter circuit are connected in series between the processor and the temperature sensor connection port, the AD conversion circuit is electrically connected with the processor, and the filter circuit is electrically connected with the temperature sensor connection port.

Optionally, the hot end heat dissipation assembly comprises a hot end radiator in contact with the TEC, a coolant liquid pipe in contact with the hot end radiator, a hot end fan for dissipating heat of the coolant liquid in the coolant liquid pipe, and a coolant pump for driving the coolant liquid to flow; the temperature control system controller further comprises a hot end fan connecting port and a cooling liquid pump connecting port, and the processor is further used for sending a second control signal to the hot end fan through the hot end fan connecting port and/or sending a third control signal to the cooling liquid pump through the cooling liquid pump connecting port.

Optionally, the temperature control system controller further includes a hot-end fan MOS driving circuit disposed between the hot-end fan connection port and the processor; and/or a gate drive integrated circuit IC disposed between the coolant pump connection port and the processor.

Optionally, the temperature control system controller further includes: and the hot end fan feedback circuit is arranged between the processor and the hot end fan connecting port, and the processor is also used for determining the running state of the hot end fan through the hot end fan feedback circuit.

Optionally, the cold end heat dissipation assembly includes a cold end fan, and a cold end heat sink in contact with the TEC, the temperature control system controller further includes a cold end fan connection port, and the processor is further configured to send a fourth control signal to the cold end fan through the cold end fan connection port.

Optionally, the temperature control system controller further includes: and the cold end fan feedback circuit is connected between the processor and the cold end fan connection port, and the processor is further used for determining the running state of the cold end fan through the cold end fan feedback circuit.

Optionally, the temperature control system controller further includes a liquid level detection sensor connection port and a liquid level acquisition circuit connected between the liquid level detection sensor connection port and the processor, the liquid level sensor is connected with the liquid level detection sensor connection port, and the processor is further configured to receive a liquid level signal of the cooling liquid through the liquid level detection sensor connection port.

Optionally, the system further comprises a nixie tube, the temperature control system controller further comprises a nixie tube driving circuit connected between the processor and the nixie tube, and the processor is further used for sending a temperature signal to the nixie tube so that the nixie tube displays the temperature value inside the reagent bin.

Optionally, the temperature control system controller includes a display panel, the display panel displays the temperature of the reagent cabin and the operation state of the target device, and when the temperature and/or the operation state are abnormal, a temperature abnormality prompt and/or a fault prompt corresponding to the target device are displayed.

According to an aspect of an embodiment of the present invention, there is provided a gene sequencer including: a processor; a memory for storing the processor-executable instructions; wherein the processor is configured to execute the instructions to implement the method of controlling the temperature of the reagent cartridge of any one of the above.

According to an aspect of an embodiment of the present invention, there is provided a computer readable storage medium, which when executed by a processor in a reagent cartridge temperature control system, causes the processor to perform the method of controlling the temperature of a reagent cartridge according to any one of the above.

In the embodiment of the invention, the temperature value in the reagent bin is determined by receiving the temperature signal sent by the temperature sensor in the reagent bin, and then the target temperature control task is determined according to the temperature value, so that target equipment which needs to execute the target temperature control task and target parameters of the target equipment for executing the target temperature control task are determined, and finally, a target instruction carrying the target parameters is sent to the target equipment, so that the target equipment can operate according to the target instruction. Because the target temperature control task is determined according to the temperature values, the corresponding target temperature control task can be determined according to different temperature values in a targeted manner, so that the technical effects of rapidly controlling the temperature of the reagent bin and protecting the reagent are realized, and the technical problems of lower temperature control efficiency and inaccurate control when the temperature of the reagent bin is controlled to protect the reagent in the related technology are solved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:

FIG. 1 is a flow chart of a method of temperature control of a reagent cartridge according to an embodiment of the present invention;

FIG. 2 is a schematic view of a temperature control assembly of a reagent cartridge according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a temperature control circuit according to an embodiment of the present invention;

FIG. 4 is a software functional schematic of a temperature control system provided by an alternative embodiment of the present invention;

FIG. 5 is a block diagram of a temperature control system controller according to an embodiment of the present invention.

Detailed Description

In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Example 1

In accordance with an embodiment of the present invention, there is provided an embodiment of a method of controlling the temperature of a reagent cartridge, it being noted that the steps illustrated in the flow chart of the figures may be performed in a computer system, such as a set of computer executable instructions, and, although a logical sequence is illustrated in the flow chart, in some cases, the steps illustrated or described may be performed in a different order than that illustrated herein.

FIG. 1 is a flow chart of a method of controlling the temperature of a reagent cartridge according to an embodiment of the present invention, as shown in FIG. 1, comprising the steps of:

step S102, receiving a temperature signal sent by a temperature sensor in the reagent bin to determine a temperature value in the reagent bin;

in step S102 provided in the present application, a temperature signal sent by a temperature sensor inside a reagent bin is received, and because the temperature signal is acquired by the temperature sensor inside the reagent bin, the temperature signal can accurately reflect the temperature inside the reagent bin, so as to determine the temperature value inside the reagent bin according to the temperature signal.

Step S104, determining a target temperature control task according to the temperature value;

in step S104 provided in the present application, it is indicated that the corresponding target temperature control task may be determined according to different temperature values, so that the determined target temperature control task is targeted, and different tasks may be determined at different temperatures, so as to achieve cooling through different cooling measures.

Step S106, determining target equipment which needs to execute a target temperature control task and target parameters of the target equipment for executing the target temperature control task;

in step S106 provided in the present application, a target device that needs to perform a target temperature control task is determined, that is, the target device needs to be used to perform the temperature control task, and a target parameter of the target device that performs the target temperature control task is determined, so that the target device can perform the temperature control task according to the target parameter, so as to achieve the purpose of temperature control.

Step S108, a target instruction is sent to target equipment so that the target equipment can operate according to the target instruction, wherein the target instruction carries target parameters.

In step S108 provided in the present application, a target instruction carrying a target parameter is sent to a corresponding target device, so that the target device operates according to the target instruction to execute a target temperature control task, thereby achieving a temperature control purpose.

Through the steps, the temperature value in the reagent bin is determined by receiving the temperature signal sent by the temperature sensor in the reagent bin, and then the target temperature control task is determined according to the temperature value, so that target equipment which needs to execute the target temperature control task and target parameters of the target equipment for executing the target temperature control task are determined, and finally, a target instruction carrying the target parameters is sent to the target equipment, so that the target equipment can operate according to the target instruction. Because the target temperature control task is determined according to the temperature values, the corresponding target temperature control task can be determined according to different temperature values in a targeted manner, so that the technical effects of rapidly controlling the temperature of the reagent bin and protecting the reagent are realized, and the technical problems of lower temperature control efficiency and inaccurate control when the temperature of the reagent bin is controlled to protect the reagent in the related technology are solved.

As an alternative embodiment, the target device includes a semiconductor refrigerator TEC, a coolant pump, a cold end fan, and a hot end fan, the target temperature control task includes controlling a temperature value to be a first target temperature, and determining the target temperature control task according to the temperature value includes: and under the condition that the temperature value is larger than a first preset threshold value, determining the target temperature control task as a first target temperature control task for cooperatively cooling by using the TEC, the coolant pump, the cold end fan and the hot end fan.

In this embodiment, a case where the temperature value is greater than the first predetermined threshold is described, for example, the first predetermined threshold is 8 ℃, and in the case where the temperature value is greater than 8 ℃, when the target device includes a semiconductor refrigerator TEC, a coolant pump, a cold end fan, and a hot end fan, it is determined that the target temperature control task is a first target temperature control task that uses the TEC, the coolant pump, the cold end fan, and the hot end fan to cooperatively cool, that is, the coolant pump performs air cooling, the cold end fan and the hot end fan perform air cooling, so as to achieve cooling with the maximum effect, for example, it may be determined that the first predetermined threshold is 8 ℃, and in the case where the temperature value is greater than 8 ℃, the coolant pump and the fan simultaneously perform cooperative cooling, so that the cooling speed may be increased, and the cooling efficiency may be improved.

As an alternative embodiment, the target device includes a TEC, a cold end fan, and a hot end fan, the target temperature control task includes controlling a temperature value to be a second target temperature, and determining the target temperature control task according to the temperature value includes: and under the condition that the temperature value is smaller than or equal to a first preset threshold value and larger than a second preset threshold value, determining the target temperature control task as a second target temperature control task which uses the TEC, the cold end fan and the hot end fan to cooperatively cool.

In this embodiment, a case where the temperature value is less than or equal to the first predetermined threshold and greater than the second predetermined threshold is described, for example, the first predetermined threshold is 8 ℃, the second predetermined threshold is 2 ℃, and when the temperature value is less than 8 ℃ and greater than 2 ℃, in this case, when the target device includes a TEC, a cold end fan and a hot end fan, it is determined that the target temperature control task is a second target temperature control task that uses the TEC, the cold end fan and the hot end fan to cooperatively cool, that is, only the fan is used to cool, and cooling is not required to be performed by using a coolant pump, so that the cost can be reduced, and meanwhile, the orderly performance of the task is ensured.

As an alternative embodiment, the target device includes a semiconductor refrigerator TEC and a hot side fan, the target temperature control task includes controlling a temperature value to be a third target temperature, and determining the target temperature control task according to the temperature value includes: and under the condition that the temperature value is smaller than or equal to a second preset threshold value, determining the target temperature control task as a third target temperature control task for cooling by using the hot end fan.

In this embodiment, a case where the temperature value is less than or equal to the second predetermined threshold is described, for example, the second predetermined threshold is 2 ℃, and when the temperature value is greater than 2 ℃, in this case, when the target device includes the TEC and the hot-end fan, it is determined that the target temperature control task is a third target temperature control task for cooling by using the hot-end fan, and since the temperature inside the reagent bin is not high, air cooling can be performed only by the hot-end fan, and the running cost can be reduced while ensuring orderly performance of the tasks.

As an alternative embodiment, the target device includes a coolant pump, and after sending the target command to the target device, the method further includes: receiving a liquid level signal of the cooling liquid sent by the cooling liquid pump; and determining the current liquid level according to the liquid level signal of the cooling liquid.

In this embodiment, the coolant level signal sent by the coolant pump may be received, so that the current level can be determined from the coolant level signal.

As an alternative embodiment, a coolant starvation and/or replenishment alert is issued when the liquid level is below a preset liquid level.

In this embodiment, a minimum liquid level warning line may be set according to the capacity of the coolant pump, and is assigned as Vmin, when the liquid level value Liq is less than Vmin, the liquid level is determined to be low, a supplement result of the coolant to be supplemented is obtained, a coolant shortage and/or a coolant supplement reminder is sent, and when the liquid level value Liq is greater than Vmin, the liquid level is determined to be normal, and a supplement result of the coolant not to be supplemented is obtained. By the aid of the method, the cooling liquid can be timely supplemented under the condition that the cooling liquid is needed to be supplemented, and the situation that the cooling liquid pump cannot work normally due to insufficient cooling liquid is effectively avoided.

As an alternative embodiment, after sending the target instruction to the target device, the method further includes: receiving a device operation signal sent by target device; and determining the operation state of the target equipment according to the equipment operation signal, and sending out a fault prompt corresponding to the target equipment when the operation state is abnormal.

In this embodiment, the device operation signal can determine the operation state of the target device, and when the operation state is abnormal, a fault prompt corresponding to the target device is issued. The faults may include a fan locked rotor fault, a coolant pump locked fault, and the like, and are not limited herein, and corresponding fault conditions may be determined according to specific target devices. The running condition of the target equipment can be judged through the equipment running signal, whether the target equipment fails or not can be timely determined, and the failed target equipment can be timely processed under the condition that the target equipment fails.

It should be noted that, for simplicity of description, the foregoing method embodiments are all described as a series of acts, but it should be understood by those skilled in the art that the present invention is not limited by the order of acts described, as some steps may be performed in other orders or concurrently in accordance with the present invention. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present invention.

From the description of the above embodiments, it will be clear to a person skilled in the art that the method according to the above embodiments may be implemented by means of software plus the necessary general hardware platform, but of course also by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) comprising several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method of the various embodiments of the present invention.

Example 2

According to another aspect of the embodiment of the present invention, there is also provided a temperature control system for a reagent cartridge for implementing the temperature control method for a reagent cartridge, including: the semiconductor refrigerator TEC, the temperature control system controller, the reagent bin assembly, the cold end heat dissipation assembly arranged in the reagent bin and the hot end heat dissipation assembly arranged outside the reagent bin, and a temperature sensor is also arranged in the reagent bin assembly, wherein the TEC and the temperature sensor are electrically connected with the temperature control system controller; one end of the TEC is contacted with the cold end heat dissipation assembly, and the other end of the TEC is contacted with the hot end assembly; the temperature control system controller is configured to execute instructions to realize the temperature control method of the reagent bin.

As an alternative embodiment, the temperature control system controller further includes a processor, a temperature sensor connection port electrically connected to the temperature sensor, and a TEC connection port electrically connected to the TEC, where the processor is configured to receive a temperature signal sent by the temperature sensor through the temperature sensor connection port, and is further configured to send a first control signal to the TEC through the TEC connection port.

In this embodiment, the processor may receive the temperature signal sent by the temperature sensor through the temperature sensor connection port, determine the temperature value inside the reagent bin, and may also send a first control signal to the TEC through the TEC connection port, so that the TEC may pass direct current, and heat is transferred from the cold end to the hot end.

As an alternative embodiment, the temperature control system controller further comprises: the two-stage semiconductor field effect transistor MOS driving circuit is connected in series between the processor and the TEC connecting port; and/or the AD conversion circuit, the follower circuit and the filter circuit are connected in series between the processor and the temperature sensor connection port, the AD conversion circuit is electrically connected with the processor, and the filter circuit is electrically connected with the temperature sensor connection port.

In the embodiment, a two-stage MOS driving circuit is arranged between the processor and the TEC connection port, wherein the first-stage MOS driving circuit is used for driving and controlling the on-off of the TEC. Because the current required by the operation of the TEC is larger, the GPIO driving capability of the processor is weaker, the voltage born by the GPIO of the processor is generally 0V-3.6V, the operating voltage of the TEC is generally 12V or 24V, and the operating current is larger, the requirement cannot be met only through one-stage MOS driving, and therefore the second-stage MOS driving circuit is arranged.

In this embodiment, an AD conversion circuit, a follower circuit, and a filter circuit connected in series between the processor and the connection port of the temperature sensor are further provided, where the filter circuit can filter or reduce noise, improve the signal-to-noise ratio, the follower circuit can perform isolation buffering on the AD value input by the temperature sensor, and the a/D conversion circuit can convert the analog signal input by the temperature sensor into a digital signal to be recognized by the machine.

As an alternative embodiment, the hot end heat dissipation assembly comprises a hot end radiator contacted with the TEC, a cooling liquid pipe contacted with the hot end radiator, a hot end fan for dissipating heat of cooling liquid in the cooling liquid pipe, and a cooling liquid pump for driving the cooling liquid to flow; the temperature control system controller further comprises a hot end fan connecting port and a cooling liquid pump connecting port, and the processor is further used for sending a second control signal to the hot end fan through the hot end fan connecting port and/or sending a third control signal to the cooling liquid pump through the cooling liquid pump connecting port.

In this embodiment, the hot side heat sink may utilize the heat transfer properties of the metal to transfer TEC hot side heat to the hot side heat sink assembly. The cooling liquid pipe can utilize the cooling liquid to flow in the radiator to take away the heat at the hot end of the TEC. The hot end fan is used for taking away the heat transferred by the hot end radiating component by the hot end fan, and is used for radiating the cooling liquid in the cooling liquid pipe. The coolant pump drives the coolant to flow, and provides power for the coolant to flow.

In this embodiment, the temperature control system controller further comprises a hot side fan connection port and a coolant pump connection port, and the processor is further configured to send a second control signal, i.e. a control signal for rotating the hot side fan, to the hot side fan through the hot side fan connection port, and/or send a third control signal, i.e. a control signal for causing the coolant pump to drive the coolant to flow, to the coolant pump through the coolant pump connection port.

As an optional embodiment, the temperature control system controller further includes a hot-end fan MOS driving circuit disposed between the hot-end fan connection port and the processor; and/or a gate drive integrated circuit IC disposed between the coolant pump connection port and the processor.

In this embodiment, a hot-side fan MOS driving circuit and a gate driving integrated circuit IC are provided, the hot-side fan MOS driving circuit may be used to drive the hot-side fan, and the gate driving integrated circuit IC may control the rotational speed of the fan by adopting a PWM control manner.

As an alternative embodiment, the temperature control system controller further comprises: and the hot end fan feedback circuit is arranged between the processor and the hot end fan connecting port, and the processor is also used for determining the running state of the hot end fan through the hot end fan feedback circuit.

In this embodiment, a hot-end fan feedback circuit is provided, and the hot-end fan feedback circuit can determine the running state of the hot-end fan, and feed back the actual running condition of the fan to the processor, so as to avoid the fan from stalling or the running speed not corresponding to the PWM control.

As an alternative embodiment, the cold side heat sink assembly includes a cold side fan, and a cold side heat sink in contact with the TEC, the temperature control system controller further includes a cold side fan connection port, and the processor is further configured to send a fourth control signal to the cold side fan through the cold side fan connection port.

In this embodiment, a cold side fan, a cold side radiator, and both the cold side fan and the cold side radiator can be used to reduce the temperature inside the reagent chamber and speed up the rate of temperature reduction inside the reagent chamber. The processor is also configured to send a fourth control signal to the cold end fan via the cold end fan connection port, i.e., a control signal for causing the cold end fan to rotate.

As an alternative embodiment, the temperature control system controller further comprises: and the cold end fan feedback circuit is connected between the processor and the cold end fan connection port, and the processor is also used for determining the running state of the cold end fan through the cold end fan feedback circuit.

In the embodiment, a cold end fan feedback circuit is arranged, the cold end fan feedback circuit can determine the running state of the cold end fan, and the actual running condition of the fan is fed back to the processor, so that the fan is prevented from stalling or the running speed is prevented from being not corresponding to PWM control.

As an alternative embodiment, the temperature control system controller further comprises a liquid level detection sensor connection port and a liquid level acquisition circuit connected between the liquid level detection sensor connection port and the processor, the liquid level sensor is connected with the liquid level detection sensor connection port, and the processor is further used for receiving the liquid level signal of the cooling liquid through the liquid level detection sensor connection port.

In this embodiment, the processor may receive the coolant level signal through the level detection sensor connection port, and the level acquisition circuit may be used to acquire the status of the amount of coolant in the coolant pump, so that the user may add the coolant in time.

As an alternative embodiment, the system further comprises a nixie tube, the temperature control system controller further comprises a nixie tube driving circuit connected between the processor and the nixie tube, and the processor is further used for sending a temperature signal to the nixie tube so that the nixie tube displays the temperature value in the reagent bin.

In the embodiment, the nixie tube is further arranged, the temperature value inside the reagent bin can be displayed through the nixie tube, and an operator can conveniently and intuitively observe the temperature inside the reagent bin. The digital tube driving circuit is also arranged, the digital tube driving circuit can be used for driving the digital tube, and the digital tube driving circuit adopts a serial input parallel output displacement register, and the specific model is not limited, so that the digital tube can be driven.

As an alternative embodiment, the temperature control system controller comprises a display panel, wherein the temperature of the reagent cabin and the operation state of the target equipment are displayed on the display panel, and when the temperature and/or the operation state are abnormal, a temperature abnormality prompt and/or a fault prompt of the corresponding target equipment are displayed.

In the embodiment, the operation panel capable of displaying the temperature of the reagent bin and the operation state of the target equipment is arranged, and when the temperature and/or the operation state are abnormal, a temperature abnormality prompt and/or a fault prompt corresponding to the target equipment are displayed, so that the fault problem caused by the abnormal condition is ignored due to the fact that the surface is not prompted in time.

Based on the foregoing embodiments and optional embodiments, an optional implementation is provided, and is specifically described below.

In an alternative embodiment of the present invention, a temperature control system for a reagent cartridge is provided, where the temperature control system for a reagent cartridge includes a temperature control component and a temperature control circuit, and the following description of the alternative embodiment of the present invention is provided:

a temperature control component of the reagent bin:

the control by temperature change subassembly in reagent storehouse includes: a semiconductor refrigerator, a temperature control system controller, a reagent bin assembly, a hot end heat dissipation assembly, a hot end fan and a coolant pump, wherein the reagent bin assembly comprises a cold end fan, a cold end heat radiator and a temperature sensor in the reagent bin, the hot end heat dissipation assembly comprises the hot end heat radiator and a coolant liquid pipe, and fig. 2 is a schematic diagram of the temperature control assembly of the reagent bin according to an embodiment of the invention, and in fig. 2, the S1-semiconductor refrigerator TEC; s2, a temperature control system controller; s3-a reagent bin assembly; s4-a cold end radiator; s5-a cold end fan; s6, a reagent bin temperature sensor; s7, a hot end heat dissipation assembly; s8, a cooling liquid pipe; s9, a hot end radiator; s10, a hot end fan; s11, a coolant pump.

S1-TEC, a semiconductor material cooled by a reagent bin, when direct current is conducted to the TEC, heat is transmitted from a cold end to a hot end, if the direct current direction is changed, namely, after the anode and the cathode of the input current of the TEC are changed, the cold end and the hot end of the TEC are exchanged;

S2-a temperature control system controller, which is used for controlling the on-off of TEC current, controlling the rotating speeds of a cold end fan and a hot end fan, controlling the on-off of a cooling liquid pump and the flow rate of cooling liquid, and monitoring the internal temperature of a reagent bin in real time;

s3-reagent bin assembly, including S4, S5 and S6, used for guaranteeing the temperature in the reagent bin to keep in the range of 2-8 ℃, so as to achieve the effect of prolonging the shelf life of the reagent;

s4-cold end radiator, which is used to make the temperature inside the reagent cabin decrease;

s5-a cold end fan for accelerating the temperature reduction rate in the reagent bin;

s6, a reagent bin temperature sensor for monitoring the temperature inside the reagent bin in real time and transmitting the temperature to a temperature control system controller in the form of an analog signal;

s7-a heat end radiating assembly, which comprises S8 and S9 and is used for taking away heat of the TEC heat end;

s8, a cooling liquid pipe, wherein cooling liquid flows in the radiator to take away heat of the hot end of the TEC;

s9-a hot end radiator, which is used for transmitting the heat of the hot end of the TEC to a hot end radiating component by utilizing the heat transmission property of metal;

s10, a hot end fan, namely a hot end fan which is used for taking away the heat transferred by the hot end radiating component and taking away the heat of the cooling liquid in the cooling liquid pump;

S11-a cooling liquid pump for providing power for the flow of the cooling liquid.

The connection relation of the components is shown in fig. 2, the semiconductor refrigerator is respectively connected with the temperature control system controller, the reagent bin component and the hot end heat dissipation component, the hot end heat dissipation component is respectively connected with the hot end fan, the cooling liquid pump, and the temperature control system controller is respectively connected with the hot end fan, the cooling liquid pump and the reagent bin component.

(II) a temperature control circuit of the reagent bin:

the temperature control circuit of the reagent bin comprises: the device comprises a semiconductor refrigerator control circuit, an instruction control circuit, a temperature detection circuit, a temperature display circuit, a reagent bin assembly control circuit, a hot end fan control circuit, a cooling liquid pump control circuit and a cooling liquid level detection circuit.

FIG. 3 is a schematic diagram of a temperature control circuit according to an embodiment of the present invention, in FIG. 3, S12-a temperature sensor connection port (corresponding to the temperature sensor connection port above), S13-a filter circuit, S14-a follower circuit, S15-a/D converter circuit (corresponding to the AD converter circuit above), S16-a processor, S17-nixie tube driving circuit, S18-nixie tube, S19-first stage MOS driving circuit, S20-second stage MOS driving circuit, semiconductor field effect transistor driving circuit including S19 and S20, S21-TEC connection port, S22-cold end fan MOS driving circuit (corresponding to the cold end fan MOS driving circuit above), S23-cold end fan connection port, S24-cold end fan feedback circuit; s25-matching resistor 1, S26-hot-end fan MOS drive circuit (corresponding to the hot-end fan MOS drive circuit), S27-hot-end fan connection port, S28-hot-end fan feedback circuit, S29-matching resistor 2, S30-grid drive IC (corresponding to the grid drive integrated circuit IC), S31-coolant pump connection port, S32-pump rotation speed feedback circuit, S33-MOS isolation circuit (corresponding to the follower circuit), S34-coolant liquid level sensor connection port, S35-liquid level acquisition circuit, S36-temperature control system controller external device. Wherein,,

S12-a temperature sensor connecting port in the reagent bin, which is used for connecting a temperature sensor in the reagent bin, and is generally used for collecting real-time analog temperature signals in the reagent bin by a negative temperature coefficient NTC thermistor at a sensor position;

s13-filtering circuit, filtering or reducing noise of analog temperature signal, and improving signal-to-noise ratio;

s14-a follower circuit, wherein an analog temperature signal input by a temperature sensor is isolated and buffered;

S15-A/D conversion circuit, the temperature sensor inputs analog signal, and the analog signal can be recognized by the machine after being converted into digital signal by the A/D conversion circuit;

s16-processor, which is used to realize temperature algorithm process, TEC control algorithm process, hot end and cold end fan speed regulation control and feedback signal closed loop process, coolant pump flow speed control and detection process, coolant liquid level collection process, the processor can be micro control unit MCU (Microcontroller Unit), ARM, field programmable gate array FPGA (Field Programmable Gate Array), etc., and is not required here;

s17-a nixie tube driving circuit, which is used for driving a nixie tube to display data, wherein a serial input and parallel output displacement register is adopted, and the specific model is not limited;

S18-nixie tube, is used for displaying the temperature in the reagent cabin in real time, so that operators can intuitively observe the temperature in the reagent cabin;

s19-a first-stage MOS driving circuit for driving and controlling the on-off of the TEC;

the S20-second-stage MOS driving circuit has the advantages that the current required by the operation of the TEC is larger, the General-purpose input/output (GPIO) driving capability of the processor is weaker, the voltage born by the GPIO of the processor is generally 0V-3.6V, the operating voltage of the TEC is generally 12V or 24V, and the operating current is larger, and the requirements cannot be met only through one-stage MOS driving, so that the two-stage MOS driving circuit is used for meeting the operating requirements of the TEC;

the S21-TEC connection port is used for connecting a TEC semiconductor refrigeration block and used for realizing refrigeration;

s22-a cold end fan MOS driving circuit for driving the cold end fan, wherein the microprocessor controls the rotating speed of the fan by adopting a Pulse Width Modulation (PWM) control mode;

s23-a cold end fan connecting port, which is used for connecting a cold end fan, wherein the space of the reagent chamber is relatively large, the reagent chamber is refrigerated only by the cold end radiator, the required time is relatively long, and the actual temperature inside the reagent chamber is difficult to be uniform, so that the cold end fan is used for refrigerating the reagent chamber;

S24-a cold end fan feedback circuit feeds back the actual running condition of the fan to the processor, so that the fan is prevented from stalling or the running speed is prevented from being not corresponding to PWM control;

s25-a matching resistor 1, wherein the fan feedback signal is usually a square wave pulse, and peak protrusions can exist in the square wave pulse, so that a matching resistor needs to be connected in series to avoid burning out a processor, and the feedback signal is stable;

s26, a hot end fan MOS driving circuit for driving the hot end fan, wherein the microprocessor controls the rotating speed of the fan in a PWM control mode;

s27, a hot end fan connection port is used for being connected with a hot end fan, heat generated by the hot end is brought to the outside of the machine through the fan, and the hot end fan can also take away the heat in cooling liquid in the cooling liquid pump;

s28, a hot-end fan feedback circuit feeds back the actual running condition of the fan to the processor, so that the phenomenon that the fan is locked or the running speed is not corresponding to PWM control is avoided;

s29, matching resistor 2, wherein the fan feedback signal is usually a square wave pulse, and peak protrusions can exist in the square wave pulse, so that a matching resistor needs to be connected in series to avoid burning out the processor, and the feedback signal is stable;

s30, controlling the rotating speed of the coolant pump by a grid driving IC through a PWM mode;

S31-a coolant pump connection port for connecting a coolant pump;

s32-a pump rotating speed feedback circuit, wherein the rotating speed of the cooling liquid pump is required to be monitored in real time in order to avoid the blockage of the cooling liquid;

S33-MOS isolation circuit, the feedback signal of the coolant pump may have peak protrusion, in order to avoid burning the processor, the feedback signal is buffered by MOS isolation circuit;

s34, a cooling liquid level sensor connecting port is used for connecting a cooling liquid level sensor;

s35-a liquid level acquisition circuit for acquiring the condition of the liquid amount of cooling liquid in the cooling pump so as to facilitate an instrument operator to add the cooling liquid in time;

s36-external devices of the temperature control system controller, including S12, S21, S23, S27, S31 and S34.

The connection relation between the circuits is shown in fig. 3, and the temperature control method of the reagent chamber can be realized through the arrangement of the components and the circuits.

Example 3

In the related art, when the reagent bin is cooled to protect the reagent, the technical problem of low cooling efficiency exists.

In view of this, an alternative embodiment of the present invention provides a temperature control method for a reagent cartridge, which can rapidly cool the reagent cartridge.

FIG. 4 is a schematic software function diagram of a temperature control system provided by an alternative embodiment of the present invention, in FIG. 4, S37-upper computer, S38-TEC on-off and power consumption control of semiconductor refrigerator, S39-digital analog AD acquisition module, S40-temperature algorithm processing, S41-user interface UI (User Interface) temperature display, S42-nixie tube round-robin algorithm processing, S43-nixie tube display, S44-fan on-off and rotation speed control, S45-fan feedback signal acquisition, S46-fan stall and rotation speed pre-judging processing, S47-fan rotation speed display, S48-fan stall fault reporting, S49-coolant pump on-off and flow speed control, S50-coolant pump flow speed feedback signal acquisition, S51-pump stall machine flow speed pre-judging processing, S52-coolant pump flow speed display, S53-coolant pump stall fault reporting, S54-coolant liquid level information acquisition, S55-liquid level detection algorithm processing, S56-coolant liquid level alarm.

As shown in FIG. 4, S37-upper computer is used for providing man-machine interaction interface for operator, so that operator can more simply check the real-time temperature of reagent cabin, cold end and hot end fan speed condition and fan locked-rotor alarm, coolant pump speed condition and locked alarm, coolant liquid level condition and alarm;

S38-TEC on-off and power consumption control, wherein the processor controls the voltage and current in an access circuit of the TEC in a Pulse Width Modulation (PWM) control mode, so that the cooling effect of the reagent bin is ensured to reach the expected range of 2-8 ℃;

S39-AD acquisition module for acquiring temperature in the reagent cabin;

s40-temperature algorithm processing, namely determining the number of the acquired temperature AD values in unit time according to the ADC acquisition rate, then averaging and assigning the average value to the Temp;

S41-UI temperature display for displaying temperature value Temp value obtained by temperature algorithm processing;

s42-processing by a nixie tube wheel scanning algorithm, wherein the processor drives the nixie tube by the collected temperature Temp value in the reagent bin through the nixie tube wheel scanning algorithm;

s43-nixie tube display, which is used for displaying a temperature value Temp value obtained by temperature algorithm processing;

s44, controlling the on-off and the rotating speed of the fan, wherein the processor controls the on-off and the rotating speed of the fan in a PWM control mode;

s45-fan feedback signal acquisition, which is used for acquiring the rotating speed condition of the fan in real time;

s46, fan stalling and rotating speed pre-judging processing, wherein the collected fan rotating speed condition is compared with a fan specification, frequency corresponding to rated rotating speed in the fan specification is assigned as f, frequency corresponding to the collected fan rotating speed is assigned as f real in unit Hz, when 0<f real < f, the corresponding rotating speed is displayed on a UI interface, and when 0=f real, the fan stalling is judged;

S47, displaying the rotation speed of the fan, wherein the display is used for displaying the rotation speed condition of the fan;

s48-fan locked rotor fault reporting, wherein when the fan locked rotor is pre-judged to be locked rotor, a fan locked rotor alarm is required to be carried out on an upper computer;

s49-on-off and flow rate control of the coolant pump, wherein the on-off and flow rate of the coolant pump are controlled by the processor in a PWM control mode;

s50, collecting a flow speed feedback signal of the coolant pump, and collecting the rotation speed condition of the coolant pump in real time;

s51, liquid pump blockage and flow rate pre-judging treatment, wherein the collected liquid pump flow rate condition is compared with a liquid pump specification, wherein the rated rotation speed in the liquid pump specification is assigned as n amount, the unit r/min, the collected liquid pump rotation speed is assigned as n real, when 0<n real < n amount, the corresponding flow rate is displayed on a UI interface, and when 0 = n real, the liquid pump blockage is judged;

s52, displaying the flow rate of the cooling pump, wherein the flow rate of the cooling pump is displayed;

s53-reporting a cooling liquid pump blockage fault, and when the cooling liquid pump blockage is predicted to be blocked, carrying out cooling liquid pump blockage alarm on an upper computer;

s54, collecting liquid level information of the cooling liquid, wherein a liquid level sensor is generally used for detecting the liquid level condition of the cooling liquid in the liquid pump; s55-liquid level detection algorithm processing, wherein the number of collected liquid level AD values in unit time can be determined according to the ADC collection rate, and then an average value is obtained and assigned to Liq;

S56-liquid level alarming of the cooling liquid, wherein the processor sets a lowest liquid level warning line according to the capacity of the cooling liquid pump, assigns Vmin, judges that the liquid level is low when Liq is smaller than Vmin, and the upper computer alarms on the UI interface, judges that the liquid level is normal when Liq is larger than Vmin, and does not alarm.

Through the optional implementation manner, the beneficial effect of efficiently controlling the temperature of the reagent bin can be achieved.

Example 4

According to an embodiment of the present invention, there is further provided an apparatus for implementing the temperature control method of the reagent cartridge, and fig. 5 is a block diagram of a temperature control system controller according to an embodiment of the present invention, as shown in fig. 5, where the apparatus includes: the receiving module 502, the first determining module 504, the second determining module 506 and the transmitting module 508 are described in detail below.

The receiving module 502 is configured to receive a temperature signal sent by a temperature sensor inside the reagent compartment, so as to determine a temperature value inside the reagent compartment; the first determining module 504, coupled to the receiving module 502, is configured to determine a target temperature control task according to the temperature value; a second determining module 506, coupled to the first determining module 504, for determining a target device that needs to perform a target temperature control task and a target parameter of the target device that performs the target temperature control task; and a sending module 508, coupled to the second determining module 506, configured to send a target instruction to the target device, so that the target device operates according to the target instruction, where the target instruction carries a target parameter.

Here, the above-mentioned receiving module 502, the first determining module 504, the second determining module 506 and the sending module 508 correspond to steps S102 to S108 in the temperature control method for implementing the reagent cartridge, and the plurality of modules are the same as examples and application scenarios implemented by the corresponding steps, but are not limited to those disclosed in the above-mentioned embodiment 1.

Example 6

According to another aspect of the embodiment of the present invention, there is also provided an electronic device including: a processor; a memory for storing processor-executable instructions, wherein the processor is configured to execute the instructions to implement the method of controlling the temperature of the reagent cartridge of any of the above.

Example 7

According to another aspect of embodiments of the present invention, there is also provided a computer-readable storage medium, which when executed by a processor of an electronic device, causes the electronic device to perform the method of controlling the temperature of a reagent cartridge of any one of the above.

The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.

In the foregoing embodiments of the present invention, the descriptions of the embodiments are emphasized, and for a portion of this disclosure that is not described in detail in this embodiment, reference is made to the related descriptions of other embodiments.

In the several embodiments provided in the present application, it should be understood that the disclosed technology content may be implemented in other manners. The above-described embodiments of the apparatus are merely exemplary, and the division of the units, for example, may be a logic function division, and may be implemented in another manner, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interfaces, units or modules, or may be in electrical or other forms.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.

The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied essentially or in part or all of the technical solution or in part in the form of a software product stored in a storage medium, including instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing program codes.

The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.

Claims

1. A method of controlling the temperature of a reagent cartridge, comprising:

receiving a temperature signal sent by a temperature sensor in the reagent bin to determine a temperature value in the reagent bin;

determining a target temperature control task according to the temperature value;

determining target equipment needing to execute the target temperature control task and target parameters of the target equipment executing the target temperature control task;

and sending a target instruction to the target equipment so as to enable the target equipment to operate according to the target instruction, wherein the target instruction carries the target parameter.

2. The method of claim 1, wherein the target device comprises a semiconductor cooler TEC, a coolant pump, a cold side fan, and a hot side fan, the target temperature control task comprises controlling the temperature value to a first target temperature, and the determining the target temperature control task based on the temperature value comprises:

And under the condition that the temperature value is larger than a first preset threshold value, determining the target temperature control task as a first target temperature control task for cooperatively cooling by using the TEC, the coolant pump, the cold end fan and the hot end fan.

3. The method of claim 1, wherein the target device comprises a TEC, a cold side fan, and a hot side fan, wherein the target temperature control task comprises controlling the temperature value to a second target temperature, wherein determining the target temperature control task based on the temperature value comprises:

and under the condition that the temperature value is smaller than or equal to a first preset threshold value and larger than a second preset threshold value, determining the target temperature control task as a second target temperature control task which uses the TEC, the cold end fan and the hot end fan to cooperatively cool.

4. The method of claim 1, wherein the target device comprises a semiconductor cooler TEC and a hot side fan, the target temperature control task comprises controlling the temperature value to a third target temperature, and the determining the target temperature control task based on the temperature value comprises:

and under the condition that the temperature value is smaller than or equal to a second preset threshold value, determining the target temperature control task as a third target temperature control task for cooling by using the hot end fan.

5. The method of claim 1, wherein the target device comprises a coolant pump, and wherein after the sending the target command to the target device, further comprising:

receiving a liquid level signal of the cooling liquid sent by the cooling liquid pump;

and determining the current liquid level according to the liquid level signal of the cooling liquid.

6. The method of claim 5, wherein the method further comprises:

and when the liquid level is lower than a preset liquid level, a cooling liquid shortage and/or liquid supplementing reminding is sent out.

7. The method according to any one of claims 1 to 6, further comprising, after the sending the target instruction to the target device:

receiving an equipment operation signal sent by the target equipment;

and determining the running state of the target equipment according to the equipment running signal, and sending out a fault prompt corresponding to the target equipment when the running state is abnormal.

8. A temperature control system controller for performing the method of any one of claims 1 to 7, comprising:

the receiving module is used for receiving the temperature signal sent by the temperature sensor in the reagent bin so as to determine the temperature value in the reagent bin;

The first determining module is used for determining a target temperature control task according to the temperature value;

the second determining module is used for determining target equipment which needs to execute the target temperature control task and target parameters of the target equipment for executing the target temperature control task;

and the sending module is used for sending a target instruction to the target equipment so as to enable the target equipment to operate according to the target instruction, wherein the target instruction carries the target parameter.

9. A temperature control system for a reagent cartridge, comprising: the semiconductor refrigerator TEC, the temperature control system controller, the reagent bin assembly, the cold end heat dissipation assembly arranged in the reagent bin and the hot end heat dissipation assembly arranged outside the reagent bin, the inside of the reagent bin assembly is also provided with a temperature sensor, wherein,

the TEC and the temperature sensor are electrically connected with the temperature control system controller;

one end of the TEC is contacted with the cold end heat dissipation assembly, and the other end of the TEC is contacted with the hot end assembly;

wherein the temperature control system controller is configured to execute instructions to implement the method of controlling temperature of a reagent cartridge of claim 1.

10. The system of claim 9, wherein the temperature control system controller further comprises a processor, a temperature sensor connection port electrically connected to the temperature sensor, and a TEC connection port electrically connected to the TEC, wherein,

The processor is used for receiving the temperature signal sent by the temperature sensor through the temperature sensor connecting port and sending a first control signal to the TEC through the TEC connecting port.

11. The system of claim 10, wherein the temperature control system controller further comprises:

a two-stage semiconductor field effect transistor MOS drive circuit, wherein the two-stage MOS drive circuit is connected in series between the processor and the TEC connection port; and/or the number of the groups of groups,

the AD conversion circuit, the follower circuit and the filter circuit are connected in series between the processor and the temperature sensor connection port, the AD conversion circuit is electrically connected with the processor, and the filter circuit is electrically connected with the temperature sensor connection port.

12. The system of claim 10, wherein the hot side heat sink assembly comprises a hot side heat sink in contact with the TEC, a coolant liquid pipe in contact with the hot side heat sink, the system further comprising a hot side fan for dissipating heat from coolant liquid in the coolant liquid pipe, and a coolant pump for driving the flow of coolant liquid; the temperature control system controller also comprises a hot end fan connecting port and a cooling liquid pump connecting port,

The processor is further configured to send a second control signal to the hot side fan through a hot side fan connection port and/or send a third control signal to the coolant pump through a coolant pump connection port.

13. The system of claim 12, wherein the temperature control system controller further comprises a hot side fan MOS drive circuit disposed between the hot side fan connection port and the processor; and/or a gate drive integrated circuit IC disposed between the coolant pump connection port and the processor.

14. The system of claim 12, wherein the temperature control system controller further comprises:

and the hot end fan feedback circuit is arranged between the processor and the hot end fan connecting port, and the processor is also used for determining the running state of the hot end fan through the hot end fan feedback circuit.

15. The system of claim 12 wherein said cold side heat sink assembly includes a cold side fan and a cold side heat sink in contact with said TEC, said temperature control system controller further comprising a cold side fan connection port, said processor further configured to send a fourth control signal to said cold side fan through said cold side fan connection port.

16. The system of claim 15, wherein the temperature control system controller further comprises:

and the cold end fan feedback circuit is connected between the processor and the cold end fan connection port, and the processor is further used for determining the running state of the cold end fan through the cold end fan feedback circuit.

17. The system of claim 10, wherein the temperature control system controller further comprises a liquid level detection sensor connection port and a liquid level acquisition circuit connected between the liquid level detection sensor connection port and the processor, the liquid level sensor connected to the liquid level detection sensor connection port, the processor further configured to receive a coolant liquid level signal through the liquid level detection sensor connection port.

18. The system of claim 10, further comprising a nixie tube, wherein the temperature control system controller further comprises a nixie tube drive circuit coupled between the processor and the nixie tube, and wherein the processor is further configured to send a temperature signal to the nixie tube to cause the nixie tube to display a temperature value inside the reagent cartridge.

19. The system according to any one of claims 9 to 18, wherein the temperature control system controller comprises a display panel on which the temperature of the reagent cartridge and the operating state of the target device are displayed, and when the temperature and/or the operating state are abnormal, a temperature abnormality cue and/or a fault cue corresponding to the target device are displayed.

20. A genetic sequencer, comprising:

a processor;

a memory for storing the processor-executable instructions;

wherein the processor is configured to execute the instructions to implement the method of temperature control of a reagent cartridge of any one of claims 1 to 6.

21. A computer readable storage medium, characterized in that instructions in the computer readable storage medium, when executed by a processor in a reagent cartridge temperature control system, enable the processor to perform the method of temperature control of a reagent cartridge according to any one of claims 1 to 6.