CN116207483A - Communication device - Google Patents

Abstract

A communication device. The communication device includes: the first grounding element, the second grounding element, the third grounding element, the first signal conductor, the second signal conductor, the resonant circuit and the dielectric substrate; the first signal conductor is arranged between the first grounding element and the second grounding element; the second signal conductor is arranged between the second grounding element and the third grounding element; the first signal conductor is coupled to the first grounding element through the resonant circuit; the dielectric substrate is provided with a first surface and a second surface which are opposite, wherein the first grounding element, the second grounding element, the third grounding element, the first signal conductor and the second signal conductor are all arranged on the first surface of the dielectric substrate; the resonant circuit is used for improving the isolation degree of the first signal conductor and the second signal conductor in a target frequency band. Compared with the traditional design, the communication device has at least the advantages of high isolation, low manufacturing cost and the like, so the communication device is very suitable for being applied to various mobile communication devices.

Description

Communication device

Technical Field

The present invention relates to a communication device, and more particularly, to a communication device capable of improving Isolation (Isolation).

Background

With the development of mobile communication technology, mobile devices are becoming increasingly popular in recent years, and common examples are: portable computers, mobile phones, multimedia players, and other portable electronic devices with hybrid functions. To meet the needs of people, mobile devices often have wireless communication capabilities. Some cover long range wireless communication ranges, such as: mobile phones use 2G, 3G, LTE (Long Term Evolution) systems and the frequency bands of 700MHz, 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, 2300MHz, and 2500MHz for communication, while some cover short range wireless communication ranges, such as: wi-Fi, bluetooth systems use the frequency bands of 2.4GHz, 5.2GHz, and 5.8GHz for communication.

Antennas (antennas) are common elements in mobile devices that support wireless communications. However, due to the small internal space of the mobile device, the arrangement of the antennas and their transmission lines is often very close and is prone to interference. Therefore, a new solution is needed to improve the problem of poor Isolation (Isolation) in the conventional design.

Accordingly, there is a need to provide a communication device to solve the above-mentioned problems.

Disclosure of Invention

In a preferred embodiment, the present invention provides a communication device, comprising: a first grounding element; a second grounding element; a third grounding element; the first signal conductor is arranged between the first grounding element and the second grounding element; the second signal conductor is arranged between the second grounding element and the third grounding element; a resonant circuit, wherein the first signal conductor is coupled to the first ground element through the resonant circuit; the dielectric substrate is provided with a first surface and a second surface which are opposite, wherein the first grounding element, the second grounding element, the third grounding element, the first signal conductor and the second signal conductor are arranged on the first surface of the dielectric substrate; the resonant circuit is used for improving the isolation degree of the first signal conductor and the second signal conductor in a target frequency band.

In some embodiments, the first signal conductor and the resonant circuit are coupled in parallel with the first ground element.

In some embodiments, the target frequency band is between 5150MHz to 5850 MHz.

In some embodiments, the resonant circuit includes an inductive element and a capacitive element coupled in series.

In some embodiments, the first and second signal conductors are completely separated from the first, second, and third ground elements.

In some embodiments, the communication device further comprises: and the system grounding surface is arranged on the second surface of the dielectric substrate.

In some embodiments, the communication device further comprises: the first conductive through element penetrates through the dielectric substrate, and the first grounding element is coupled to the system grounding surface through the first conductive through element; a second conductive through element penetrating the dielectric substrate, wherein the second ground element is coupled to the system ground plane via the second conductive through element; and a third conductive through element penetrating the dielectric substrate, wherein the third ground element is coupled to the system ground plane via the third conductive through element.

In some embodiments, the first signal conductor has a first feed point and the second signal conductor has a second feed point.

In some embodiments, the first feeding point is further coupled to a first antenna, and the second feeding point is further coupled to a second antenna.

In some embodiments, the resonant circuit has a first connection node coupled to the first signal conductor and a second connection node coupled to the first ground element, and the first connection node is adjacent to the first feed point.

In some embodiments, the first connection node and the first feed-in point are spaced between 0mil and 100mil apart.

In some embodiments, the inductive element comprises: and the winding conductor is arranged on the first surface of the dielectric substrate.

In some embodiments, the inductive element comprises: the first conductor pad is arranged on the first surface of the dielectric substrate; the second conductor pad is arranged on the first surface of the dielectric substrate; the third conductor pad is arranged on the second surface of the dielectric substrate; a fourth conductor pad disposed on the second surface of the dielectric substrate and coupled to the third conductor pad; the first connecting through element penetrates through the dielectric substrate and is coupled between the first conductor pad and the third conductor pad; and a second connecting through element penetrating the dielectric substrate and coupled between the second conductor pad and the fourth conductor pad.

In some embodiments, the first conductor pad, the second conductor pad, the third conductor pad, and the fourth conductor pad each have a circular shape.

In some embodiments, the first and second connecting through elements each take on a cylindrical shape.

In some embodiments, the radius of the circle is approximately 2 times the radius of the cylinder.

In some embodiments, the capacitive element comprises: the first conductor is arranged on the first surface of the dielectric substrate; and a second conductor arranged on the first surface of the dielectric substrate and adjacent to the first conductor.

In some embodiments, the first conductors and the second conductors are staggered with respect to each other.

In some embodiments, the first conductor and the second conductor are arranged parallel to each other.

In some embodiments, a coupling gap is formed between the first conductor and the second conductor, and the coupling gap has a width between 2 mils and 10 mils.

The present invention provides a novel communication device comprising a resonant circuit that is mutually integrated with a dielectric substrate. Compared with the traditional design, the invention has at least the advantages of high isolation, low manufacturing cost and the like, so that the invention is very suitable for being applied to various mobile communication devices.

Drawings

Fig. 1A shows a top view of a communication device according to an embodiment of the invention.

Fig. 1B shows a cross-sectional view of a communication device according to an embodiment of the invention.

Fig. 2A shows a top view of a communication device according to an embodiment of the invention.

Fig. 2B shows a cross-sectional view of a communication device according to an embodiment of the invention.

Fig. 3 shows an S-parameter diagram of a communication device according to an embodiment of the invention.

Fig. 4A shows a top view of an inductance component according to an embodiment of the invention.

Fig. 4B is a perspective view of an inductance component according to an embodiment of the invention.

Fig. 5A shows a top view of a capacitive element according to an embodiment of the invention.

Fig. 5B shows a top view of a capacitive element according to an embodiment of the invention.

Fig. 6A shows a top view of a communication device according to an embodiment of the invention.

Fig. 6B shows an S-parameter diagram of a communication device according to an embodiment of the invention.

Fig. 7A shows a top view of a communication device according to an embodiment of the invention.

Fig. 7B shows an S-parameter diagram of a communication device according to an embodiment of the invention.

Fig. 8A shows a top view of a communication device according to an embodiment of the invention.

Fig. 8B shows an S-parameter diagram of a communication device according to an embodiment of the invention.

Description of main reference numerals:

100. 200, 600, 700, 800 communication device

110. First grounding element

115. The hollowed-out area of the first grounding element

120. Second grounding element

130. Third grounding element

140. First signal conductor

141. First end of first signal conductor

142. Second end of first signal conductor

150. Second signal conductor

151. First end of second signal conductor

152. The second end of the second signal conductor

160. 260, 660, 760, 860 resonant circuit

170. Dielectric substrate

262. 410, 450 inductance element

264. 510, 550 capacitive element

280. System ground plane

281. First antenna

282. Second antenna

283. First radio frequency module

284. Second radio frequency module

291. First conductive through element

292. Second conductive through element

293. Third conductive through element

411. First end point of 451 inductance element

412. 452 second terminal of the inductive element

420. Winding conductor

461. First conductor pad

462. Second conductor pad

463. Third conductor pad

464. Fourth conductor pad

481. First connecting through element

482. Second connecting through element

511. First end of 551 capacitive element

512. 552 capacitor element second terminal

520. 560 first conductor

530. 570 second conductor

D1, D2 spacing

E1 First surface of dielectric substrate

E2 Second surface of dielectric substrate

FB1, FB2, FB3, FB4 target frequency band

FC center frequency

FP1 first feed-in point

FP2 second feed point

G1 Gap of

GC1, GC2 coupling gap

LC1, LC2 section line

NC1 first connection node

NC2 second connection node

Radius of R1 and R2

VSS ground potential

Width of W1, W2, W3, W4, W5

Detailed Description

The following detailed description of the invention refers to the accompanying drawings, which illustrate specific embodiments of the invention.

Certain terms are used throughout the description and claims to refer to particular components. Those of ordinary skill in the art will appreciate that a hardware manufacturer may refer to the same element by different names. The description and claims do not take the form of an element differentiated by name, but rather by functional differences. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. The term "substantially" means that within an acceptable error range, a person skilled in the art can solve the technical problem within a certain error range, and achieve the basic technical effect. In addition, the term "coupled" as used herein includes any direct or indirect electrical connection. Accordingly, if a first device couples to a second device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections.

The following disclosure provides many different embodiments, or examples, for implementing different features of the disclosure. The following disclosure describes specific examples of various components and arrangements thereof to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if the specification describes a first feature being formed on or over a second feature, that means that it may include embodiments in which the first feature is in direct contact with the second feature, and that additional features may be formed between the first feature and the second feature, such that the first feature and the second feature may not be in direct contact. In addition, the following description may repeat use of the same reference numerals and/or characters in various examples. These repetition are for the purpose of simplicity and clarity and do not in itself dictate a particular relationship between the various embodiments and/or configurations discussed.

Furthermore, spatially relative terms, such as "below" …, "below," "lower," "above," "upper," and the like, are used for convenience in describing the relationship of one element or feature to another element(s) or feature(s) in the figures. In addition to the orientations depicted in the drawings, the spatially dependent terms are intended to encompass different orientations of the device in use or operation. The device may be turned to a different orientation (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Fig. 1A shows a top view of a communication device 100 according to an embodiment of the invention. Fig. 1B shows a cross-sectional view (along a section line LC1 of fig. 1A) of a communication device 100 according to an embodiment of the invention. Please refer to fig. 1A and 1B together. The communication Device 100 may be applied to a Mobile Device (Mobile Device), for example: a Smart Phone, a Tablet Computer, or a notebook Computer (Notebook Computer). In the embodiment of fig. 1A, 1B, the communication device 100 includes: a first Ground Element 110, a second Ground Element 120, a third Ground Element 130, a first signal conductor (Signaling Conductor) 140, a second signal conductor 150, a Resonant Circuit (Resonant Circuit) 160, and a dielectric substrate (Dielectric Substrate) 170, wherein the first Ground Element 110, the second Ground Element 120, the third Ground Element 130, the first signal conductor 140, and the second signal conductor 150 are all made of metal materials, such as: copper, silver, aluminum, iron, or alloys thereof. It must be understood that although not shown in fig. 1A, 1B, the communication device 100 may also include other elements, such as: a Processor, a touch module (Touch Control Panel), a Speaker (Speaker), a power module (Power Supply Module), or a Housing (Housing).

The first grounding element 110, the second grounding element 120, and the third grounding element 130 can be used to provide a ground potential VSS. The first signal conductor 140 may generally take the shape of a straight strip. The first signal conductor 140 is disposed between the first ground element 110 and the second ground element 120. The second signal conductor 150 may have a substantially other straight shape, which may be substantially parallel to the first signal conductor 140. The second signal conductor 150 is disposed between the second ground element 120 and the third ground element 130. In some embodiments, the first signal conductor 140 and the second signal conductor 150 are completely separated from the first ground element 110, the second ground element 120, and the third ground element 130.

The first signal conductor 140 is coupled to the first ground element 110 via the resonant circuit 160. In some embodiments, the first signal conductor 140 and the resonant circuit 160 are coupled in parallel with the first ground element 110, but is not limited thereto. It should be noted that the resonant circuit 160 may be used to enhance Isolation (Isolation) of the first signal conductor 140 and the second signal conductor 150 within a target frequency band (Target Frequency Band). That is, the first signal conductor 140 and the second signal conductor 150 are less likely to interfere with each other in the aforementioned target frequency band.

The dielectric substrate 170 may be an FR4 (frame reflector 4) substrate, a printed circuit board (Printed Circuit Board, PCB), or a flexible circuit board (Flexible Printed Circuit, FPC). The dielectric substrate 170 has a first surface E1 and a second surface E2 opposite to each other, wherein the first grounding element 110, the second grounding element 120, the third grounding element 130, the first signal conductor 140, and the second signal conductor 150 are disposed on the first surface E1 of the dielectric substrate 170.

Various configurations and detailed structural features of the communication device are described below. It is to be understood that the drawings and descriptions are proffered by way of example only and are not intended to limit the invention.

Fig. 2A shows a top view of a communication device 200 according to an embodiment of the invention. Fig. 2B shows a cross-sectional view (along a section line LC2 of fig. 2A) of the communication device 200 according to an embodiment of the invention. Fig. 2A, 2B are similar to fig. 1A, 1B. In the embodiment of fig. 2A and 2B, the communication device 200 further includes a system ground plane (System Ground Plane) 280, a first conductive via (Conductive Via Element) 291, a second conductive via 292, and a third conductive via 293, wherein the system ground plane 280 may be disposed on the second surface E2 of the dielectric substrate 170. The first conductive through element 291 may penetrate the dielectric substrate 170, wherein the first ground element 110 may be coupled to the system ground plane 280 via the first conductive through element 291. The second conductive via 292 may penetrate the dielectric substrate 170, wherein the second ground element 120 may be coupled to the system ground plane 280 via the second conductive via 292. The third conductive through-element 293 may penetrate the dielectric substrate 170, wherein the third ground element 130 may be coupled to the system ground plane 280 via the third conductive through-element 293. The addition of the system ground plane 280, the first conductive via 291, the second conductive via 292, and the third conductive via 293 helps to reduce transmission losses (Transmission Loss) of the communication device 200.

The first signal conductor 140 has a first end 141 and a second end 142, wherein a first Feeding Point FP1 is located at the first end 141 of the first signal conductor 140. The first feed point FP1 may also be coupled to a first Antenna 281. The second signal conductor 150 has a first end 151 and a second end 152, wherein a second feed point FP2 is located at the first end 151 of the second signal conductor 150. The second feed point FP2 may also be coupled to a second antenna 282. In addition, the second end 142 of the first signal conductor 140 may be coupled to a first Radio Frequency (RF) module 283, and the second end 152 of the second signal conductor 150 may be coupled to a second RF module 284. For example, the first rf module 283 may excite the first antenna 281 via the first signal conductor 140, and the second rf module 284 may excite the second antenna 282 via the second signal conductor 150.

In the embodiment of fig. 2A, 2B, a resonant circuit 260 of the communication device 200 includes an inductive element (Inductive Element) 262 and a capacitive element (Capacitive Element) 264. In detail, the resonant circuit 260 has a first connection node NC1 coupled to the first signal conductor 140, and a second connection node NC2 coupled to the first grounding element 110, wherein the inductive element 262 and the capacitive element 264 are serially coupled between the first connection node NC1 and the second connection node NC 2. The connection order of the inductance element 262 and the capacitance element 264 is not particularly limited in the present invention. In other embodiments, the positions of both the inductive element 262 and the capacitive element 264 may be interchanged. It should be noted that the first connection node NC1 is adjacent to the first feed-in point FP1. The term "adjacent" or "adjacent" in the present specification may refer to that the distance between two corresponding elements is smaller than a predetermined distance (e.g., 10mm or less), and may include the case where the two corresponding elements are in direct contact with each other (i.e., the distance is shortened to 0).

Fig. 3 shows an S-Parameter (S-Parameter) diagram of a communication device 200 according to an embodiment of the invention, wherein the horizontal axis represents the operating frequency (MHz) and the vertical axis represents the S-Parameter (dB). If the first feed point FP1 is set as a first Port (Port 1) and the second feed point FP2 is set as a second Port (Port 2), the S21 parameter therebetween is as shown in fig. 3. According to the measurement result of fig. 3, the isolation of the first signal conductor 140 and the second signal conductor 150 in a target frequency band FB1 can be improved by about 36dB by using the resonant circuit 260. For example, the target band FB1 may be between 5150MHz and 5850MHz, but is not limited thereto. In some embodiments, a center frequency FC of the target frequency band FB1 can be described by the following equation (1):

where "FC" represents the center frequency FC, "L" represents the Inductance value (Inductance) of the Inductance element 262, and "C" represents the Capacitance value (Capacitance) of the Capacitance element 264.

Generally, the first signal conductor 140 is mainly used for transmitting signals in a first frequency band, and the second signal conductor 150 is mainly used for transmitting signals in a second frequency band. For example, the first frequency band may be between 2400MHz and 2500MHz, and the second frequency band may be between 5150MHz and 5850MHz, wherein the second frequency band may overlap the target frequency band FB 1. Since the resonant circuit 260 absorbs the current distribution in the target frequency band FB1, the communication device 200 of the present invention can effectively avoid the mutual interference between the first signal conductor 140 and the second signal conductor 150 (especially in the target frequency band FB 1). In addition, according to the actual measurement result, if the distance D1 between the first connection node NC1 and the first feed-in point FP1 is between 0mil and 100mil, the isolation effect of the resonant circuit 260 is further enhanced. The remaining features of the communication device 200 of fig. 2A and 2B are similar to those of the communication device 100 of fig. 1A and 1B, so that similar operation effects can be achieved in both embodiments. Next, the following embodiments will describe various possible detailed structures of the inductive element 262 and the capacitive element 264.

Fig. 4A shows a top view of an inductive element 410 according to an embodiment of the invention. In the embodiment of fig. 4A, the inductive element 410 includes a meandering conductor (Meandering Conductor) 420, which can be disposed on the first surface E1 of the dielectric substrate 170. For example, the serpentine conductor 420 may include a plurality of coupled U-shaped portions. The inductive element 410 has a first end 411 and a second end 412, which may be located at two ends of the meandering conductor 420, respectively. In terms of element size, the width W1 of the serpentine conductor 420 may be between 2 mils and 10 mils, while the width of the gap G1 of the serpentine conductor 420 may be between 2 mils and 10 mils.

Fig. 4B is a perspective view of an inductance element 450 according to an embodiment of the invention. In the embodiment of fig. 4B, inductive element 450 includes: a first Conductive Pad 461, a second Conductive Pad 462, a third Conductive Pad 463, a fourth Conductive Pad 464, a first connecting through element (Connection Via Element) 481, and a second connecting through element 482. The inductance element 450 has a first end 451 and a second end 452, wherein the first end 451 may be located at the first conductor pad 461, and the second end 452 may be located at the second conductor pad 462. For example, the first conductor pad 461, the second conductor pad 462, the third conductor pad 463, and the fourth conductor pad 464 may each have a circular shape with a radius R1. The first conductor pad 461 and the second conductor pad 462 can be disposed on the first surface E1 of the dielectric substrate 170, and the third conductor pad 463 and the fourth conductor pad 464 can be disposed on the second surface E2 of the dielectric substrate 170, wherein the fourth conductor pad 464 can be further coupled to the third conductor pad 463. For example, the first connection through element 481 and the second connection through element 482 may each take the form of a cylinder having a radius R2. The first connection through-element 481 may penetrate the dielectric substrate 170 and may be coupled between the first conductor pad 461 and the third conductor pad 463. The second connection through-element 482 may penetrate the dielectric substrate 170 and may be coupled between the second conductor pad 462 and the fourth conductor pad 464. In terms of device size, the radius R1 of the circle may be between 4 mils and 12 mils, the radius R1 of the circle may be approximately 2 times the radius R2 of the cylinder (i.e., r1=2·r2), and the distance D2 between the first conductor pad 461 and the second conductor pad 462 may be greater than or equal to 2 mils.

Fig. 5A shows a top view of a capacitive element 510 according to an embodiment of the invention. In the embodiment of fig. 5A, the capacitive element 510 includes a first conductor 520 and a second conductor 530, which may be disposed on the first surface E1 of the dielectric substrate 170. The capacitive element 510 has a first end 511 and a second end 512, wherein the first end 511 may be located at an end of the first conductor 520, and the second end 512 may be located at an end of the second conductor 530. The second conductor 530 is adjacent to the first conductor 520 but completely separated from the first conductor 520, wherein a coupling gap GC1 is formed therebetween. For example, the first conductor 520 and the second conductor 530 may each include a plurality of E-shaped portions coupled to each other. In general, the first conductors 520 and the second conductors 530 are arranged to be staggered with each other. In terms of device dimensions, the width W2 of the first conductor 520 may be between 2 mils and 10 mils, the width W3 of the second conductor 530 may be between 2 mils and 10 mils, and the width of the coupling gap GC1 may be between 2 mils and 10 mils.

Fig. 5B shows a top view of a capacitive element 550 according to an embodiment of the invention. In the embodiment of fig. 5B, the capacitive element 550 includes a first conductor 560 and a second conductor 570, which may be disposed on the first surface E1 of the dielectric substrate 170. The capacitive element 550 has a first end 551 and a second end 552, wherein the first end 551 may be located at an end of the first conductor 560 and the second end 552 may be located at an end of the second conductor 570. The second conductor 570 is adjacent to the first conductor 560 but is completely separated from the first conductor 560, wherein a coupling gap GC2 is formed therebetween. For example, the first conductor 560 and the second conductor 570 may each include a plurality of coupled U-shaped portions. Generally, the first conductor 560 and the second conductor 570 are arranged parallel to each other. In terms of element size, the width W4 of the first conductor 560 may be between 2 mils and 10 mils, the width W5 of the second conductor 570 may be between 2 mils and 10 mils, and the width of the coupling gap GC2 may be between 2 mils and 10 mils.

Fig. 6A shows a top view of a communication device 600 according to an embodiment of the invention. In the embodiment of fig. 6A, a resonant circuit 660 of the communication device 600 includes the aforementioned inductive element 410 and capacitive element 510 coupled in series with each other. In addition, the first grounding element 110 may also have a hollowed-out Region (Hollow Region) 115 to accommodate the resonant circuit 660. Fig. 6B shows an S-parameter diagram of a communication device 600 according to an embodiment of the invention. According to the measurement result of fig. 6B, the isolation of the first signal conductor 140 and the second signal conductor 150 in a target frequency band FB2 can be improved by about 9.4dB by using the resonant circuit 660. For example, the target band FB2 may be between 5150MHz and 5850MHz, but is not limited thereto. The remaining features of the communication device 200 of fig. 6A and 6B are similar to those of the communication device 200 of fig. 2A and 2B, so that similar operational effects can be achieved in both embodiments.

Fig. 7A shows a top view of a communication device 700 according to an embodiment of the invention. In the embodiment of fig. 7A, a resonant circuit 760 of the communication device 700 includes the aforementioned inductive element 450 and capacitive element 510 coupled in series with each other. Fig. 7B shows an S-parameter diagram of a communication device 700 according to an embodiment of the invention. According to the measurement result of fig. 7B, the isolation of the first signal conductor 140 and the second signal conductor 150 in a target frequency band FB3 can be improved by about 10.2dB by using the resonant circuit 760. For example, the target band FB3 may be between 5150MHz and 5850MHz, but is not limited thereto. The remaining features of the communication device 700 of fig. 7A and 7B are similar to those of the communication device 200 of fig. 2A and 2B, so that similar operational effects can be achieved in both embodiments.

Fig. 8A shows a top view of a communication device 800 according to an embodiment of the invention. In the embodiment of fig. 8A, a resonant circuit 860 of the communication device 800 includes the aforementioned inductive element 450 and capacitive element 550, which are coupled in series with each other. Fig. 8B shows an S-parameter diagram of a communication device 800 according to an embodiment of the invention. According to the measurement result of fig. 8B, the isolation of the first signal conductor 140 and the second signal conductor 150 in a target frequency band FB4 can be improved by about 10.4dB by using the resonant circuit 860. For example, the target band FB4 may be between 5150MHz and 5850MHz, but is not limited thereto. The remaining features of the communication device 800 of fig. 8A and 8B are similar to those of the communication device 200 of fig. 2A and 2B, so that similar operational effects can be achieved in both embodiments.

The present invention provides a novel communication device comprising a resonant circuit that is mutually integrated with a dielectric substrate. Compared with the traditional design, the invention has at least the advantages of high isolation, low manufacturing cost and the like, so that the invention is very suitable for being applied to various mobile communication devices.

It should be noted that the device size, device shape, and frequency range are not limitations of the present invention. The designer can adjust these settings according to different needs. The communication device of the present invention is not limited to the state illustrated in fig. 1A to 8B. The present invention may include only any one or more features of any one or more of the embodiments of fig. 1A-8B. In other words, not all of the illustrated features need be implemented in the communication device of the present invention at the same time.

Ordinal numbers such as "first," "second," "third," and the like in the description and in the claims are used for distinguishing between two different elements having the same name and not necessarily for describing a sequential order.

While the invention has been described with reference to the preferred embodiments, it should be understood that the invention is not limited thereto, but rather, it should be apparent to one skilled in the art that various changes and modifications can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (20)

1. A communication device, the communication device comprising:

a first grounding element;

a second grounding element;

a third grounding element;

a first signal conductor disposed between the first ground element and the second ground element;

a second signal conductor disposed between the second ground element and the third ground element;

a resonant circuit, wherein the first signal conductor is coupled to the first ground element through the resonant circuit; and

the dielectric substrate is provided with a first surface and a second surface which are opposite, wherein the first grounding element, the second grounding element, the third grounding element, the first signal conductor and the second signal conductor are all arranged on the first surface of the dielectric substrate;

the resonant circuit is used for improving the isolation degree of the first signal conductor and the second signal conductor in a target frequency band.

2. The communication device of claim 1, wherein the first signal conductor and the resonant circuit are coupled in parallel with the first ground element.

3. The communication device of claim 1, wherein the target frequency band is between 5150MHz and 5850 MHz.

4. The communication device of claim 1, wherein the resonant circuit comprises an inductive element and a capacitive element coupled in series.

5. The communication device of claim 1, wherein the first and second signal conductors are completely separated from the first, second, and third ground elements.

6. The communication device of claim 1, further comprising:

and the system grounding surface is arranged on the second surface of the dielectric substrate.

7. The communication device of claim 6, further comprising:

a first conductive through element penetrating the dielectric substrate, wherein the first ground element is coupled to the system ground plane via the first conductive through element;

a second conductive through element penetrating the dielectric substrate, wherein the second ground element is coupled to the system ground plane via the second conductive through element; and

and a third conductive through element penetrating the dielectric substrate, wherein the third ground element is coupled to the system ground plane via the third conductive through element.

8. The communication device of claim 1, wherein the first signal conductor has a first feed point and the second signal conductor has a second feed point.

9. The communication device of claim 8, wherein the first feed point is further coupled to a first antenna and the second feed point is further coupled to a second antenna.

10. The communication device of claim 8, wherein the resonant circuit has a first connection node coupled to the first signal conductor and a second connection node coupled to the first ground element, the first connection node being adjacent to the first feed point.

11. The communication device of claim 10, wherein a spacing between the first connection node and the first feed-in point is between 0mil and 100 mil.

12. The communication device of claim 4, wherein the inductive element comprises:

and the winding conductor is arranged on the first surface of the dielectric substrate.

13. The communication device of claim 4, wherein the inductive element comprises:

a first conductor pad disposed on the first surface of the dielectric substrate;

a second conductor pad disposed on the first surface of the dielectric substrate;

a third conductor pad disposed on the second surface of the dielectric substrate;

a fourth conductive pad disposed on the second surface of the dielectric substrate and coupled to the third conductive pad;

a first connecting through element penetrating the dielectric substrate and coupled between the first conductor pad and the third conductor pad; and

and a second connection through element penetrating the dielectric substrate and coupled between the second conductor pad and the fourth conductor pad.

14. The communication device of claim 13, wherein the first conductor pad, the second conductor pad, the third conductor pad, and the fourth conductor pad each exhibit a circular shape.

15. The communication device of claim 14, wherein the first connection pass-through member and the second connection pass-through member each exhibit a cylindrical shape.

16. The communication device of claim 15, wherein the radius of the circle is approximately 2 times the radius of the cylinder.

17. The communication device of claim 4, wherein the capacitive element comprises:

a first conductor disposed on the first surface of the dielectric substrate; and

the second conductor is arranged on the first surface of the dielectric substrate and is adjacent to the first conductor.

18. The communication device of claim 17, wherein the first conductors and the second conductors are staggered with respect to each other.

19. The communication device of claim 17, wherein the first conductor and the second conductor are arranged parallel to each other.

20. The communication device of claim 17, wherein a coupling gap is formed between the first conductor and the second conductor, and the coupling gap has a width between 2 mils and 10 mils.

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