CN116207466A - Cross cavity structure, manufacturing method thereof, microwave circuit and electronic equipment - Google Patents
Cross cavity structure, manufacturing method thereof, microwave circuit and electronic equipment Download PDFInfo
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- CN116207466A CN116207466A CN202310122070.3A CN202310122070A CN116207466A CN 116207466 A CN116207466 A CN 116207466A CN 202310122070 A CN202310122070 A CN 202310122070A CN 116207466 A CN116207466 A CN 116207466A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
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Abstract
The invention provides a cross cavity structure, a manufacturing method thereof, a microwave circuit and electronic equipment. The structure comprises: the first cavity, second cavity and apron, first cavity and second cavity intercrosses, are equipped with first recess on the cavity wall of second cavity, are equipped with the diaphragm on the apron, are connected with the baffle on the diaphragm, and the baffle inserts in the first recess. The invention can improve the cross resonance condition of the cavity.
Description
Technical Field
The present invention relates to the field of microwave circuits, and in particular, to a cross cavity structure, a method for manufacturing the cross cavity structure, a microwave circuit, and an electronic device.
Background
Under the information age, the microwave circuit plays a great application value in a plurality of fields and has profound effects on a plurality of industries and fields.
The situation that the cavities are crossed is often involved in the microwave circuit design, and the local widening of the signal transmission cavity is caused at the crossing of the cavities, so that cavity resonance is caused, and the self-excitation risk of components in the circuit is caused. However, conventional structural designs have difficulty ensuring that cavity resonance is not induced when cross cavity conditions are encountered. In addition, existing remedies are also unable to address the problem of cavity resonance.
Therefore, a structure that can meet the cavity intersection and can not cause abrupt changes in the width of the signal transmission cavity is needed.
Disclosure of Invention
The embodiment of the invention provides a cross cavity structure, a manufacturing method thereof, a microwave circuit and electronic equipment, which are used for solving the problem of cavity resonance caused by cavity cross in the prior art.
In a first aspect, an embodiment of the present invention provides a cross cavity structure, including a first cavity, a second cavity, and a cover plate; the first cavity and the second cavity are mutually intersected, and the cover plate is covered on the first cavity and the second cavity;
the cavity wall of the second cavity is provided with a first groove, the cover plate is provided with a separation beam, the separation beam is connected with a separation plate, and the separation plate is inserted into the first groove.
In one possible implementation manner, a second groove and a third groove for placing the strip line are formed in the cavity wall of the second cavity, the second groove is perpendicular to the first groove, and the third groove is perpendicular to the first groove.
In one possible implementation, the second groove is located below the first groove, the third groove is located below the first groove, and the second groove and the third groove are located at the same height.
In one possible implementation manner, a bonding wire is arranged at the intersection of the second groove and the first cavity, and a bonding wire is arranged at the intersection of the third groove and the first cavity.
In one possible implementation, the depth of the first recess is greater than the depth of the first cavity.
In one possible implementation manner, the connection part of the cover plate and the first cavity and the connection part of the cover plate and the second cavity are fixed by screws or seal welding.
In one possible implementation, the spacer, spacer beams and cover plate are all made of metal.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a cross cavity structure, including:
designing a first cavity and a second cavity which are mutually intersected according to a preset circuit, wherein a second groove and a third groove are formed in the second cavity;
processing cover plates corresponding to the first cavity and the second cavity;
two separation beams are processed on the cover plate, and the separation beams are respectively connected with a separation plate;
digging a first groove corresponding to the partition plate on the cavity wall of the second cavity, wherein the second groove is positioned at the lower side of the first groove, and the third groove is positioned at the lower side of the first groove;
after the cover plate is covered on the first cavity and the second cavity, the joint of the cover plate and the first cavity and the joint of the cover plate and the second cavity are fixed through screws or seal welding.
In a third aspect, an embodiment of the present invention provides a microwave circuit, including a cross-cavity structure as described in any one of the first aspects.
In a fourth aspect, an embodiment of the present invention provides an electronic device comprising a microwave circuit as described in the third aspect.
The embodiment of the invention provides a cross cavity structure and a manufacturing method thereof, a microwave circuit and electronic equipment, wherein the cross cavity structure comprises a first cavity, a second cavity and a cover plate, the first cavity and the second cavity are mutually crossed, the cover plate is covered on the first cavity and the second cavity which are mutually crossed, a partition plate on a partition beam can separate the first cavity from the second cavity and can keep the width of a signal transmission cavity, a first groove is formed in the cavity wall of the second cavity, the partition beam is arranged on the cover plate, the partition plate is connected with the partition plate, and the partition plate is inserted into the first groove, so that the crossing part of the first cavity and the second cavity is tightly sealed, and the resonance of the cross cavity is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a first cavity, a second cavity and a cover plate according to an embodiment of the present invention;
FIG. 2 is a schematic view of the overall structure of a cross-cavity provided by an embodiment of the present invention;
fig. 3 is a flowchart of an implementation of a method for determining a cross cavity structure according to an embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the following description will be made by way of specific embodiments with reference to the accompanying drawings.
As described in the related art, the microwave circuit exerts great application value in many fields, and has profound effects on various industries and fields.
In mobile communication network coverage, microwave devices are indispensable. The microwave devices commonly used mainly comprise phase shifters, power splitters, filters, couplers, diplexers and the like. The quality of the performance can affect the quality of the whole network coverage, so the importance of the microwave device in the field of mobile communication is self-evident.
The situation that the cavities are crossed is often involved in the microwave circuit design, and the local widening of the signal transmission cavity is caused at the crossing of the cavities, so that cavity resonance is caused, and the self-excitation risk of components in the circuit is caused. The main problem behind the cavity intersection is that the cavity intersection can lead to the cavity to widen locally, and then leads to the signal transmission chamber to take place resonance, and the resonance point falls in the circuit frequency band of use and can arouse the circuit self-excitation, even fall outside the passband also can take place the out-of-band self-excitation.
The traditional solution is that after the circuit is self-excited, a wave absorbing material is stuck on a cover plate above a cavity component, the resonant frequency of the cavity is changed to move the resonant point out of the working band, which is a remedy measure, and when the working band of the circuit is very wide, the resonant point cannot be moved out of the band. In addition, the wave-absorbing material is generally a nonmetallic material, the firmness of adhesion with the metal cover plate cannot be guaranteed, the characteristics of the wave-absorbing material can be changed along with the time, the stable solution problem cannot be guaranteed, the wave-absorbing material can release some gases, and the performance of components in the airtight cavity can be influenced. Therefore, when the traditional structural design encounters the condition of crossing the cavity, the cavity resonance is difficult to ensure not to be caused, and the problem is solved by adopting remedial measures.
In order to solve the problems in the prior art, the embodiment of the invention provides a cross cavity structure, a manufacturing method thereof, a microwave circuit and electronic equipment. The cross-cavity structure provided by the embodiment of the invention is first described below.
As shown in the schematic structural diagram of the first cavity, the second cavity and the cover plate in fig. 1, the cross cavity structure provided in the embodiment of the present invention includes a first cavity 1, a second cavity 2 and a cover plate 3; the first cavity 1 and the second cavity 2 are mutually intersected, the cover plate 3 is placed on the first cavity 1 and the second cavity 2 in a covering mode, a first groove 21 is formed in the cavity wall of the second cavity 2, a separation beam 31 is arranged on the cover plate 3, a separation plate 32 is connected to the separation beam 31, and the separation plate 32 is inserted into the first groove 21.
Specifically, the cover plate 3 is provided with a separation beam 31, the separation beam 31 is connected with a separation plate 32, and the width of the separation beam 31 is larger than the inner width of the second cavity 2.
In one embodiment, the cavity is a closed metal cavity for a resonant circuit in the microwave band, the cavity having a strip line on which a signal, when propagating on the strip line, emits some electric and magnetic fields between the conductor and its reference plane. As the signal switches between high and low states (digital signal) or oscillates at a certain frequency (analog signal), the signal will generate a wave that propagates away from the strip line, but is confined within the cavity due to the cavity.
Specifically, a first groove 21 is provided in the cavity wall of the second cavity 2, and a partition plate 32 is inserted into the first groove 21. The partition plate 32 better isolates the first cavity 1 and the second cavity 2, and ensures that the width of the signal transmission cavity is not suddenly changed.
As shown in fig. 2, a second groove 22 and a third groove 23 for placing a strip line are arranged on the wall of the cavity of the second cavity 2, the second groove 22 is perpendicular to the first groove 21, and the third groove 23 is perpendicular to the first groove 21.
In some embodiments, the second groove 22 is located below the first groove 21, the third groove 23 is located below the first groove 21, and the second groove 22 is located at the same height as the third groove 23.
Specifically, the second groove 22 and the third groove 23 are used for placing a microstrip line 24, and the microstrip line 24 is a microwave transmission line formed by a single conductor strip supported on a dielectric substrate. The method is suitable for manufacturing the planar structure transmission line of the microwave integrated circuit. Compared with the metal waveguide, the metal waveguide has small volume, light weight, wide use band, high reliability, low manufacturing cost and the like; but with slightly larger losses and less power capacity. Due to the development of microwave low-loss dielectric materials and microwave semiconductor devices, microwave integrated circuits are formed, so that microstrip lines are widely applied, and various types of microstrip lines are sequentially formed. Typically manufactured by thin film processes.
In some embodiments, the second groove 22 and the first cavity 1 intersect with each other and the third groove 23 and the first cavity 1 intersect with each other and each other with a bonding wire 25.
Specifically, the bottom cavity wall of the second cavity 2 at the intersection with the first cavity 1 is not on the same horizontal line as the bottom cavity wall of the first cavity 1, and when the intersection between the first cavity 1 and the second cavity 2 occurs, a signal is transmitted on the bonding wire 25.
In some embodiments, the separate portion of the second cavity 2, i.e. the portion that does not intersect the first cavity 1, may be divided into a first separate portion 26 and a second separate portion 27. The second recess 22 is located on the bottom cavity wall of the first separate portion 26 and the third recess 23 is located on the bottom cavity wall of the second separate portion 27. The signal is transmitted on the bond wire 25 when passing through the junction of the first independent portion 26 with the first cavity 1; the signal is transmitted over the bond wire 25 as it passes through the junction of the second independent portion 27 with the first cavity 1.
Specifically, bond wire 25 is a fine wire inner lead that allows electrical connection between the input/output bond sites of the on-chip circuitry and the inner contact points of the leadframe during assembly of the semiconductor device and integrated circuit. The good or bad bonding effect directly affects the performance of the integrated circuit. Bonding wire 25 is one of five major types of basic materials in the integrated IC package material market, is an inner column wire material with excellent electrical, thermal, mechanical properties and chemical stability, and is a heavy-duty structural material for manufacturing integrated circuits and discrete devices.
In some embodiments, the depth of the first recess 21 is greater than the depth of the first cavity 1.
In some embodiments, the width of the spacer 31 is greater than the internal width of the second cavity 2, and the width of the first groove 21 is slightly greater than the width of the spacer 32, so that the spacer 32 can be smoothly inserted into the first groove 21.
In some embodiments, the connection of the cover plate 3 with the first cavity 1 and the connection of the cover plate 3 with the second cavity 2 are fixed by screws or seal welding.
In the embodiment of the invention, a cross cavity structure is provided, wherein a first cavity, a second cavity and a cover plate are mutually crossed, the cover plate is covered on the first cavity and the second cavity which are mutually crossed, a partition plate on a partition beam can separate the first cavity from the second cavity and can keep the width of a signal transmission cavity, a first groove is arranged on the cavity wall of the second cavity, the cover plate is provided with the partition beam, the partition plate is connected with the partition plate, and the partition plate is inserted into the first groove, so that the crossing part of the first cavity and the second cavity is sealed more tightly, and the resonance of the cross cavity is improved.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present invention.
The following are embodiments of the method of manufacturing the cross-cavity structure of the present invention, and for details not described in detail therein, reference may be made to the corresponding method embodiments described above.
Fig. 3 shows a flowchart of an implementation of a method for manufacturing a cross cavity structure according to an embodiment of the present invention, and for convenience of explanation, only a portion related to the embodiment of the present invention is shown, which is described in detail below:
as shown in fig. 3, the method for manufacturing the cross cavity structure includes the following steps:
s301, designing a first cavity and a second cavity which are mutually intersected according to a preset circuit, wherein a second groove and a third groove are formed in the second cavity.
S302, processing a cover plate corresponding to the first cavity and the second cavity.
S303, processing two separation beams on the cover plate, wherein the separation beams are respectively connected with a separation plate.
S304, digging a first groove corresponding to the partition plate on the cavity wall of the second cavity, wherein the second groove is positioned at the lower side of the first groove, and the third groove is positioned at the lower side of the first groove.
And S305, after the cover plate is covered on the first cavity and the second cavity, the joint of the cover plate and the first cavity and the joint of the cover plate and the second cavity are fixed through screws or seal welding.
In the embodiment of the invention, a manufacturing method of a cross cavity structure is provided, a first cavity and a second cavity which are mutually crossed are designed according to a preset circuit, and a second groove and a third groove are arranged on the second cavity; processing cover plates corresponding to the first cavity and the second cavity; two separation beams are processed on the cover plate, and the separation beams are respectively connected with a separation plate; digging a first groove corresponding to the partition plate on the cavity wall of the second cavity, wherein the second groove is positioned at the lower side of the first groove, and the third groove is positioned at the lower side of the first groove; after the cover plate is covered on the first cavity and the second cavity, the joint of the cover plate and the first cavity and the joint of the cover plate and the second cavity are fixed by screws or seal welding, and the method can ensure that the width of the signal transmission cavity is not suddenly changed.
The embodiment of the invention provides a microwave circuit, which comprises the cross cavity structure of any embodiment. Because the microwave circuit of the present embodiment includes the cross cavity structure of any one of the above embodiments, the microwave circuit of the present embodiment at least includes the beneficial effects corresponding to the cross cavity structure of any one of the above embodiments.
The embodiment of the invention provides electronic equipment, which comprises the microwave circuit of any embodiment. Because the electronic device of the present embodiment includes the microwave circuit of any one of the above embodiments, the electronic device of the present embodiment at least includes the beneficial effects corresponding to the microwave circuit of any one of the above embodiments.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. The cross cavity structure is characterized by comprising a first cavity, a second cavity and a cover plate; the first cavity and the second cavity are mutually intersected, and the cover plate is covered on the first cavity and the second cavity;
the cavity wall of the second cavity is provided with a first groove, the cover plate is provided with a separation beam, the separation beam is connected with a separation plate, and the separation plate is inserted into the first groove.
2. The crossed cavity structure according to claim 1, wherein a second groove and a third groove for placing a strip line are formed in the cavity wall of the second cavity, the second groove is perpendicular to the first groove, and the third groove is perpendicular to the first groove.
3. The cross-cavity structure of claim 2, wherein the second groove is located below the first groove, the third groove is located below the first groove, and the second groove is located at the same height as the third groove.
4. The crossed cavity structure according to claim 1, wherein a bonding wire is arranged at the intersection of the second groove and the first cavity, and a bonding wire is arranged at the intersection of the third groove and the first cavity.
5. The cross-cavity structure of claim 1, wherein the depth of the first groove is greater than the depth of the first cavity.
6. The crossed cavity structure according to claim 1, wherein the connection of the cover plate and the first cavity and the connection of the cover plate and the second cavity are fixed by screws or seal welding.
7. The cross-cavity structure of claim 1, wherein the spacer, spacer beams and cover plates are all made of metal.
8. A method of manufacturing a cross-cavity structure, comprising:
designing a first cavity and a second cavity which are mutually intersected according to a preset circuit, wherein a second groove and a third groove are formed in the second cavity;
processing cover plates corresponding to the first cavity and the second cavity;
two separation beams are processed on the cover plate, and the separation beams are respectively connected with a separation plate;
digging a first groove corresponding to the partition plate on the cavity wall of the second cavity, wherein the second groove is positioned at the lower side of the first groove, and the third groove is positioned at the lower side of the first groove;
after the cover plate is covered on the first cavity and the second cavity, the joint of the cover plate and the first cavity and the joint of the cover plate and the second cavity are fixed through screws or seal welding.
9. A microwave circuit comprising a cross cavity structure according to any of claims 1-7.
10. An electronic device comprising a microwave circuit as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310122070.3A CN116207466A (en) | 2023-02-16 | 2023-02-16 | Cross cavity structure, manufacturing method thereof, microwave circuit and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310122070.3A CN116207466A (en) | 2023-02-16 | 2023-02-16 | Cross cavity structure, manufacturing method thereof, microwave circuit and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN116207466A true CN116207466A (en) | 2023-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310122070.3A Pending CN116207466A (en) | 2023-02-16 | 2023-02-16 | Cross cavity structure, manufacturing method thereof, microwave circuit and electronic equipment |
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| Country | Link |
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| CN (1) | CN116207466A (en) |
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- 2023-02-16 CN CN202310122070.3A patent/CN116207466A/en active Pending
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